Control device arrangement having heat transfer material arranged in channel system of circuit board unit, and method for producing control device arrangement

Abstract

The invention relates to a control device arrangement (10) having a housing (22) in which at least one printed circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged. The at least one cooling device (26, 28) is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit (12, 14, 16, 18). The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) by means of a heat transfer material. The circuit board unit (12, 14, 16, 18) comprises an outer wall (36) facing the cooling device (26, 28), in which outer wall at least one recess is formed. A heat transfer material is disposed in the at least one recess. The invention further relates to a method for producing such a control device arrangement (10).

Description

Technical Field

[0001] The invention relates to a control device arrangement having a housing in which at least one circuit board unit and at least one cooling device are arranged. The at least one cooling device is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. Furthermore, the invention relates to a method for producing such a control device arrangement. Background Art

[0002] For example, US Pat. No. 7,609,523 B1 discloses the use of a heat transfer material between a circuit board and corresponding heat sinks, which are arranged on mutually opposite sides of the circuit board.

[0003] Furthermore, US 2014 / 0084449 A1 describes a semiconductor package having a structuring on the rear side, which faces the heat sink. This structuring is intended to achieve better distribution of the thermal paste applied to the heat sink when the semiconductor package is screwed to the heat sink. Summary of the invention

[0004] It is an object of the present invention to provide a control device arrangement of the initially mentioned type in which an improved heat dissipation of the circuit board unit can be achieved, and to specify a method for producing such a control device arrangement.

[0005] This object is achieved by a control arrangement having the features of claim 1 and a method having the features of claim 15. Advantageous configurations which are expedient developments of the invention are indicated in the dependent claims and in the following description.

[0006] The control device arrangement according to the invention comprises a housing in which at least one circuit board unit and at least one cooling device are arranged. The at least one cooling device is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit comprises an outer wall facing the cooling device, in which at least one recess is formed. The heat transfer material is arranged in the at least one recess.

[0007] Due to the provision of the heat transfer material, a particularly efficient heat dissipation from the circuit board unit to the cooling device can be achieved, wherein in cooling operation of the cooling device, the heat is again dissipated from the cooling device via the cooling fluid. This is based on the recognition that a less efficient heat transfer from the circuit board unit to the cooling device can be achieved compared to the case where the heat transfer material is provided, in particular when the outer wall of the circuit board unit is formed of metal and the outer wall of the cooling device is formed of metal.

[0008] Furthermore, by providing at least one recess in the outer wall of the circuit board unit, the heat transfer material can be arranged precisely at a position which is particularly advantageous for the heat release of the circuit board unit during its operation. Since the heat transfer material at least largely fills the at least one recess, the correct positioning of the heat transfer material relative to the circuit board unit is additionally ensured. As a result, the formation of undesired hot spots on the circuit board unit during operation of the circuit board unit can be prevented in particular. This contributes to a permanently high functionality of the circuit board unit.

[0009] Effective heat dissipation from the at least one circuit board unit is particularly advantageous if the control device arrangement is used, for example, in a vehicle, wherein the at least one circuit board unit or the plurality of circuit board units are components of one or more electronic control devices or electronic control units of the vehicle.

[0010] Therefore, it is particularly possible to take into account the situation that a plurality of electronic control devices or electronic control units are usually arranged in a vehicle, for example an autonomous vehicle and / or an electrically driven, in particular a purely electrically driven vehicle. Here, the control device can in particular take over the task of at least one driver assistance function of the vehicle. The arrangement of a circuit board unit, which is preferably formed as a component of such a control device for a vehicle, in a housing in which the control device is arranged is advantageous. Because the circuit board unit is then accommodated in the housing in a very compact and installation space-saving and easily accessible manner. This is particularly advantageous when the control device is arranged for use in a vehicle. Therefore, the present invention preferably also relates to a vehicle, in particular a motor vehicle, having a control device arrangement.

[0011] In particular, the outer wall can be part of a housing of the circuit board unit or at least one side, preferably at least the top side and the bottom side, of a cover of the circuit board unit, wherein at least one circuit board of the circuit board unit is received in the housing. In particular, in the case of a housing or a cover of the circuit board unit formed from a metal sheet, the heat transfer material ensures good heat transfer from the circuit board unit to the cooling device. This applies in particular if the corresponding wall of the cooling device is also formed from metal.

[0012] Preferably, the heat transfer material is introduced into the at least one recess via an inlet opening, which is accessible from the narrow side of the circuit board unit in the installed position of the circuit board unit in the housing. Thus, even under confined space conditions and in a procedurally simple manner, at least a large filling of the at least one recess with the heat transfer material can be achieved. Furthermore, it is feasible to introduce the heat transfer material into the at least one recess via the inlet opening when both the circuit board unit and the cooling device are already arranged in the housing. This can be achieved particularly simply in terms of manufacturing, in particular if the heat transfer material is in the form of a heat-conducting paste. This is because such a heat-conducting paste has sufficient fluidity to be introduced into the at least one recess from the narrow side of the circuit board unit via the inlet opening.

[0013] Preferably, the at least one recess is formed as a channel system, which comprises at least one channel section, which is connected to at least one basin area of ​​the channel system. Here, the width of the at least one basin area is greater than the width of the at least one channel section of the channel system. By forming the at least one recess as such a channel system, it can be ensured very efficiently that during operation of the circuit board unit and the cooling device, heat is dissipated from the circuit board unit, which helps to prevent the occurrence of hot spots. Thus, in particular, an operation of the control device arrangement can be ensured, in which overheating of the circuit board unit is permanently avoided.

[0014] Preferably, the channel system comprises a plurality of basin areas, wherein the basin areas are connected to each other via corresponding channel sections. Thus, for example, when arranging the production control device, a purposeful positioning of the heat transfer material in the basin area can be achieved, which is beneficial for improving the heat dissipation of the circuit board unit.

[0015] The basin region can have a greater depth than the at least one channel section. In this way, it can be achieved that a particularly large amount of heat transfer material is available in the basin region for dissipating heat toward the cooling device.

[0016] Additionally or alternatively, the individual basin regions can have different depths from one another. The depths of the corresponding basin regions can ensure, in particular, that a particularly good thermal connection with the cooling device is achieved via the heat transfer material at a predetermined location of the circuit board unit. This helps to improve the heat dissipation of the circuit board unit.

[0017] Preferably, the basin area is formed in such sections of the circuit board unit that, during operation of the circuit board unit, more heat is released in these sections than in the regions of the circuit board unit adjacent to these sections. In this way, it is ensured that no undesired overheating occurs in these sections of the circuit board unit, and more heat is released during operation of the circuit board unit. This is advantageous for a robust operation of the circuit board unit.

[0018] Preferably, the channel system comprises at least one air outlet opening. Here, in a state where the at least one circuit board unit and the at least one cooling device are arranged in a housing in which the control device is arranged, it is possible to discharge air from the channel system via the at least one air outlet opening due to the introduction of heat transfer material into the channel system. In this way, a very large filling of the channel system with heat transfer material can be achieved.

[0019] Preferably, the at least one air outlet opening opens into the narrow side of the circuit board unit, because the air removed or exhausted from the channel system can be discharged particularly easily from the narrow side of the circuit board unit into the environment of the circuit board unit while heat transfer material is introduced into the channel system.

[0020] The circuit board unit may include a first region having a first thickness and a second region having a second thickness, wherein the second thickness is greater than the first thickness. Here, the at least one recess is formed in the first region. Due to the lower thickness of the circuit board unit in the first region, the heat released during operation of the circuit board unit can be moved to the outer wall in a particularly fast and unhindered manner, in which at least one recess is formed. In particular, if components of the circuit board unit that release relatively much heat during operation are arranged in the first region of the circuit board unit, by providing the at least one recess in the first region, particularly good heat dissipation from these components via the heat transfer material toward the cooling device can be ensured. This is also conducive to the durable and robust operation of the circuit board unit.

[0021] In particular, it can be provided that the at least one recess is formed only in the first region and that the second region has no such recess. In this context, it can be provided that components of the circuit board unit that release relatively more heat during operation are not arranged in the second region having a greater thickness than the first region, or are arranged less in the second region.

[0022] In contrast, particularly good accessibility of the circuit board unit, in particular the connecting elements of the circuit board unit, can be ensured in the second region. In particular, the end side of the second region facing away from the cooling device can be accessed for this purpose via an access opening formed in the housing of the control device arrangement.

[0023] Preferably, the end side of the second region adjacent to the first region faces the narrow side of the cooling device. Thus, the circuit board unit with an L-shaped cross section surrounds the cooling device to a particularly large extent. This is beneficial for effectively dissipating heat from the circuit board unit through the cooling device.

[0024] Preferably, the control device arrangement comprises at least two circuit board units which are arranged in a mirror image of one another in the housing. Here, the respective outer walls of the mirror image arranged circuit board units comprising the at least one recess face the same cooling device. Thus, heat can even be dissipated particularly effectively from both circuit board units by means of the cooling device arranged between the outer walls of the circuit board units. This contributes to a compact construction of the control device arrangement.

[0025] Preferably, at least two cooling devices are arranged in the housing, which are formed as cooling plates. Here, the respective cooling plate is received between two circuit board units in a sandwich-like configuration. In this way, at least three, preferably four circuit board units of the control arrangement can be cooled very effectively by two cooling plates.

[0026] Preferably, in a cooling operation of the cooling device, a cooling fluid passes through the at least one cooling device. Thus, the cooling fluid can ensure a particularly effective heat dissipation from the cooling device. For example, the cooling device can comprise a coolant inlet and a coolant outlet. By introducing a cooling fluid, preferably in the form of a liquid coolant, into the cooling device via the coolant inlet and discharging the cooling fluid or coolant from the cooling device via the coolant outlet, cooling of the at least one circuit board unit can be achieved in a cooling operation. Due to the cooling fluid, in particular the liquid coolant, passing through the cooling device, a very good heat absorption of the at least one cooling device can be achieved.

[0027] In the housing, a plurality of circuit board units can be arranged one above the other in the vertical direction of the housing. Here, the circuit board units arranged one above the other in the vertical direction are connected to another circuit board via corresponding connecting elements. The other circuit board is arranged on the rear side of the housing, wherein the rear side is opposite to the front access opening of the housing. In this way, by introducing the circuit board unit into the housing, the connection of the circuit board unit to the other circuit board can be achieved at the same time. This is advantageous for a simplified installation of the control device arrangement. In particular, the other circuit board can be formed as a main circuit board of the control device arrangement.

[0028] Preferably, a pressure force is exerted on the circuit board unit in the direction of the cooling device by at least one spring element. Thus, a particularly close abutment of the circuit board unit on the heat transfer material can be achieved.

[0029] This applies in particular when the pressure acts in the region of the heat transfer material. Because by deliberately applying pressure to the circuit board unit in the region of the heat transfer material, a very good thermal connection of the circuit board unit to the cooling device via the heat transfer material can be achieved. Furthermore, by applying pressure to the circuit board unit in the region of the heat transfer material, irregularities, for example with regard to the flatness of the support surface and the surface roughness and also irregularities caused by manufacturing tolerances, can be compensated very well.

[0030] The heat transfer material, which is pressed by means of the spring element, can be formed in particular as a heat conducting pad. The heat transfer material can then be handled particularly well, in particular during the manufacture or production of the control arrangement. During the manufacture of the control arrangement, such a heat conducting pad can be arranged in the region of the at least one recess in order to achieve a targeted heat dissipation from a predetermined region of the circuit board unit.

[0031] Preferably, the circuit board unit comprises at least one column element, which cooperates with a guide rail arranged on the side of the housing. Here, when the circuit board unit is introduced into the housing, the at least one column element is guided along the guide rail. As a result, the installation and therefore the introduction of the circuit board unit into the housing proves to be particularly simple and process-reliable.

[0032] The column element can rest on a rod-shaped guide rail or engage with a guide rail formed in a grooved cross section to cooperate with the guide rail. Thus, when the column element engages with the guide rail, a particularly precise guidance of the at least one circuit board unit when introduced into the housing of the control device arrangement can be achieved.

[0033] Preferably, the column element is pressed by a spring element. Thus, the pressure can be exerted on the circuit board unit in a very targeted manner.

[0034] Preferably, the guide rail comprises a recess formed in the region of the target position of the column element towards the cooling device. Here, the column element is received in the recess. Due to the provision of a recess, for example formed in the manner of a locking recess, in the guide rail, a particularly large movement or displacement of the circuit board unit towards the cooling device can be achieved when pressure is applied to the column element. This facilitates a good heat transfer from the circuit board unit to the cooling device, which is achieved by the heat transfer material.

[0035] Preferably, the at least one spring element is fixed to the housing, wherein the at least one spring element comprises a leg portion which applies a pressure to the column element acting toward the cooling device due to the introduction of the circuit board unit into the housing along the guide rail. Thus, a targeted application of pressure to the column element can be achieved by a simple construction and a simple arrangement of the spring element.

[0036] Preferably, the circuit board unit comprises a plurality of column elements, wherein each column element is pressed against the cooling device by a spring element acting thereon. Thus, an advantageous distribution of the contact pressure can be achieved, which ensures a close contact of the circuit board unit and the cooling device with the heat transfer material. Furthermore, the spring force of the respective spring element can thus be utilized to the greatest extent.

[0037] In a method for manufacturing a control device arrangement according to the present invention, at least one circuit board unit and at least one cooling device are arranged in a housing of the control device arrangement. The at least one cooling device is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit comprises an outer wall facing the cooling device, in which at least one recess is formed. The heat transfer material is arranged in the at least one recess. By thermally coupling the circuit board unit to the cooling device via the heat transfer material, improved heat dissipation from the circuit board unit can be achieved.

[0038] In particular, the heat transfer material can be arranged in the at least one recess, while the at least one circuit board unit and the at least one cooling device are already arranged in the housing. This is advantageous for a simple and low-cost production of the control device arrangement. In this way, it can be ensured in particular that at least a large part of the heat transfer material remains in the at least one recess and is not moved out of the predetermined position due to a movement of the circuit board unit relative to the cooling device.

[0039] The advantages and preferred embodiments described for the control arrangement according to the invention also apply to the method according to the invention, and vice versa. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The features and feature combinations mentioned above in the description and the features and feature combinations mentioned below in the description of the figures and / or the features and feature combinations shown only in the figures may be used not only in the respectively specified combination but also in other combinations or alone without departing from the scope of the invention. Therefore, embodiments are also to be considered as being included and disclosed by the invention, which are not explicitly shown and described in the figures but emerge and result from feature combinations separate from the described embodiments. Embodiments and feature combinations are also to be considered as disclosed and therefore do not have all the features of the originally formulated independent claims. Furthermore, embodiments and feature combinations are to be considered as disclosed, in particular by the embodiments described above, which exceed or deviate from the feature combinations described in the context of the claims.

[0041] Other features of the present invention are apparent from the claims, the drawings and the description of the drawings. In the drawings:

[0042] Figure 1 A schematic perspective view shows a control device arrangement with a housing in which two cooling devices in the form of cooling plates are arranged and through which a coolant passes during cooling operation, wherein four circuit board units are additionally shown before they are installed in the housing;

[0043] Figure 2One of the circuit board units is schematically shown, which has an L-shaped cross section and comprises an outer wall facing the cooling device, wherein the outer wall is a component of the outer shell of the circuit board unit or the circuit board housing;

[0044] Figure 3 The schematic diagram shows two Figure 2 The circuit board unit shown has an L-shaped cross section and its arrangement relative to one of the two cooling devices, which are formed as cooling plates of the control device arranged in the housing;

[0045] Figure 4 Schematically illustrating the application of a spring force to a column element of one of the circuit board units, wherein the spring force ensures that the circuit board unit is pressed onto a heat transfer material which is arranged between the circuit board unit and a cooling plate;

[0046] Figure 5 schematically shows a possible configuration of a compression spring applying a spring force to the column element; and

[0047] Figure 6 is based on Figure 5 A perspective view of one of the compression springs. DETAILED DESCRIPTION

[0048] In the figures, identical or functionally identical elements are provided with the same reference symbols.

[0049] Figure 1 Components of a control device arrangement 10 are schematically shown in an unassembled state. The control device arrangement 10 comprises a plurality of circuit board units 12, 14, 16, 18. The individual circuit board units 12, 14, 16, 18 can be introduced or installed in a housing 22 of the control device arrangement 10 along an installation direction 20, which is in the direction of the housing 22. Figure 1 Indicated by arrows.

[0050] In the housing, a cooling system 24 is arranged, which currently comprises a first cooling device 26 and a second cooling device 28. The first cooling device 26 and the second cooling device 28 are formed, for example, as cooling plates, in particular of metal, through which a cooling fluid, preferably in the form of a liquid coolant, passes during cooling operation. To this end, the cooling system 24 comprises a coolant inlet 30 and a coolant outlet 32.

[0051] The respective circuit board unit 12, 14, 16, 18 comprises a housing or circuit board housing, which is currently formed from a metal sheet. The outer wall of the respective circuit board unit 12, 14, 16, 18 is formed by the housing or the circuit board housing.

[0052] exist Figure 2 In the figure, the circuit board unit 12 is shown exemplarily and schematically, which is based on Figure 1However, for Figure 2 The explanations of the circuit board unit 12 shown in FIG. 1 apply in an analogous manner to the other circuit board units 14 , 16 , 18 .

[0053] In the housing, the circuit board unit 12 comprises at least one circuit board (not shown at present for the sake of simplicity), by means of which a control device can be provided or which can be part of a control device. Since a plurality of circuit board units 12, 14, 16, 18 are accommodated in the housing 22, the control device arrangement 10 can provide a plurality of control devices, wherein the respective control devices or electronic control units can, for example, be formed for carrying out control tasks of a driver assistance system of the vehicle.

[0054] It is important to dissipate the heat generated during the operation of the circuit board units 12, 14, 16, 18 from the circuit board units 12, 14, 16, 18. For this purpose, the corresponding circuit board unit 12, 14, 16, 18 is thermally connected to one of the two cooling devices 26, 28 via a heat transfer material 34 (see Figure 4 ).exist Figure 2 , the heat transfer material 34 is schematically shown before the heat transfer material 34 is located at one or more desired locations.

[0055] The process of placing the heat transfer material 34 (particularly in the form of a heat conductive paste) between the respective circuit board unit 12, 14, 16, 18 and one of the two cooling devices 26, 28 at the desired location for the heat transfer material 34 will be described with reference to Figure 2 Provide explanation.

[0056] exist Figure 2 In the Figure 2 The outer wall 36 of the housing or circuit board housing of the circuit board unit 12 shown in FIG. 1 , wherein the outer wall 36 faces one of the cooling devices 26 , 28 , for example the cooling device 26 , which is according to Figure 1 The vertical direction z, the lateral direction y and the depth direction x of the shell 22 are defined by Figure 1 The coordinate system is shown in . Figure 3 FIG. 2 also schematically shows the arrangement of the circuit board unit 12 in the housing 22 relative to the cooling device 26 .

[0057] from Figure 3 It is particularly obvious from the view that Figure 22 and 3. It can be seen how the outer wall 36 faces the top side 38 of the cooling device 26. In this outer wall 36 of the circuit board unit 12 facing the cooling device 26, at least one recess is formed, in which the heat transfer material 34 is arranged when the circuit board unit 12 and the cooling device 26 associated with the circuit board unit 12 are arranged in the housing 22.

[0058] according to Figure 2 , the at least one recess is formed as a channel system 40, which includes a plurality of channel segments 42 and a plurality of basin areas 44. The basin areas 44 of the channel system 40 are connected to each other via the channel segments 42. Here, each basin area 44 has a greater width than the channel segment 42.

[0059] Figure 2 The arrangement of the basin area 44 and the channel section 42 shown in the figure is only schematic and exemplary. Therefore, the network of the channel section 42 and the basin area 44 can also be arranged in a different manner. Figure 2 In the manner shown in the example in FIG. 1 , the basin area 44 is formed in the outer wall 36 facing the cooling device 26. In a variant of the circuit board unit 12, the shape of the basin area 44 can also deviate from the substantially square or rectangular shape shown in the example so far. Preferably, the basin area 44 is formed at such a position that, during the operation of the circuit board unit 12, particularly much heat is released from the electronic parts or the like arranged on the circuit board.

[0060] In variants of the respective circuit board units 12 , 14 , 16 , 18 , the depth of the channel section 42 and / or the basin region 44 may deviate from Figure 2 The depths of these components of the channel system 40 shown by way of example in FIG. Furthermore, channel sections 42 that differ from one another and / or basin regions 44 that differ from one another can also each have a different depth or have different depths from one another.

[0061] according to Figure 2 , an inlet opening 48 is formed on a narrow side 46 of the circuit board unit 12, which is accessible when the circuit board unit 12 is installed in the housing 22 of the control device arrangement 10, wherein the outer wall 36 faces the top side 38 of the cooling device 26 in this installed position of the circuit board unit 12 (see Figure 3 Thus, in this state of the control arrangement 10, in which the at least one circuit board unit 12, 14, 16, 18 and the at least one cooling device 26, 28 are arranged in the housing 22 of the control arrangement 10, the heat transfer material 34 can be introduced into the at least one recess, now in the form of the channel system 40, via the inlet opening 48.

[0062] For this purpose, the heat transfer material 34 is preferably formed as a flowable heat conductive paste, which moves in the channel section 42 and at least largely fills or fills up the channel section 42 and the basin area 44 on the way to the air outlet opening 50. Air can be discharged from the channel system 40 via the air outlet opening 50 while the heat transfer material 34 is introduced into the channel system 40.

[0063] exist Figure 2 In the variation of the circuit board unit 12 exemplarily shown in FIG. 1 , the circuit board unit 12 has an L-shaped cross section. Figure 3 Here, the circuit board unit 12 includes a first region 52 having a first thickness 54 and a second region 56 having a second thickness 58. Here, the second thickness 58 is greater than the first thickness 54. Figure 2 , the channel system 40 is formed only in a first region 52 having a lower thickness 54 .

[0064] Due to the stepped configuration of the circuit board unit 12, the second region 56 includes an end side 60 formed in the region of the step or in the transition to the first region 52 (see Figure 3 ), when the circuit board unit 12 is installed in the housing 22 of the control device arrangement 10, the end side 60 faces the narrow side 62 of the cooling device 26 (see Figure 3 ). Therefore, the heat can also be dissipated well toward the cooling device 26 via the end side 60 of the circuit board unit 12 .

[0065] Preferably, no or fewer circuit board components which provide a significant heat release during operation of the circuit board are arranged in the second region 56 having the greater second thickness 58. It is then particularly sufficient to provide the at least one recess which is currently provided by the channel system 40 in the outer wall 36 only in the first region 52 of the circuit board unit 12.

[0066] exist Figure 3 , schematically shows how another of the circuit board units 12, 14, 16, 18, for example the second circuit board unit 14, can be cooled by the same cooling device 26. For example, the second circuit board unit 14 can be arranged in a mirror image with the first circuit board unit 12 in the housing 22. For the sake of clarity, Figure 3 The second circuit board unit 14 also has an L-shaped cross section and therefore has a first region 64 with a smaller first thickness 54 and a second region 66 with a larger second thickness 58. Here, the outer wall 36 of the second circuit board unit 14 faces the bottom side 68 of the cooling device 26.

[0067] In a manner similar to that explained for first circuit board unit 12 , in the mirror-image arrangement of circuit board units 12 , 14 in housing 22 , an end side 70 of second region 66 of second circuit board unit 14 that adjoins first region 64 of second circuit board unit 14 faces narrow side 62 of cooling device 26 .

[0068] With and for Figure 3 In a similar manner to the circuit board units 12, 14 shown in FIG. 1 , two further circuit board units 16, 18 can be arranged in a mirror image of each other in the housing 22, so that the cooling device 28 (according to Figure 1 The cooling device (which is the lower cooling device) is received between the two further circuit board units 16 , 18 in a sandwich-like configuration.

[0069] The outer end sides 96, 98 of the second regions 56, 66 of the circuit board units 12, 14, which are remote from the respective first regions 52, 64, are accessible from the front side of the housing 22 to the opening 72 (see FIG. Figure 1 The same applies to the end faces of the further circuit board units 16, 18 which are accessible via the access opening 72. This is advantageous, for example, in order to gain access to the connecting elements (not shown in detail at present) of the respective circuit board units 12, 14, 16, 18.

[0070] exist Figure 1 and Figure 4 , it is schematically shown how the respective circuit board unit 12 is introduced into the housing 22 in the installation direction 20, which can correspond, for example, to the depth direction x of the housing 22. In the region of the rear side of the housing 22, which is opposite to the front access opening 72, the respective circuit board unit 12, 14, 16, 18 can be connected to another circuit board 74, which is located at Figure 4 In order to connect to the other circuit board 74, the corresponding circuit board unit 12, 14, 16, 18 may include a rear connection element 76, which is Figure 4 It is also only shown schematically.

[0071] In order to facilitate the introduction of the corresponding circuit board units 12, 14, 16, 18 into the housing 22 ( Figure 4 ), the guide rail 78 may be disposed on the side of the housing 22 (see Figure 4 For example, the guide rails 78 may be formed on side walls of the housing 22 that are opposite to each other in the transverse direction y of the housing 22 (see FIG. Figure 1 ).

[0072] according to Figure 4, a corresponding column element 80 can protrude from the corresponding circuit board unit 12 in the transverse direction y, the column element 80 being formed in the manner of a guide column and being moved along the guide rail 78 in the mounting direction 20 to bring the circuit board unit 12 into its mounting position or resting position in the housing 22. Figure 4 As can be clearly seen in FIG. 8 , these column elements 80 are now engaged with the corresponding guide rails 78 .

[0073] Therefore, when the circuit board unit 12 and the column element 80 together therewith reach their target position or intended installation position in the housing 22, the column element 80 is located in the region of the recess 82 formed in the guide rail 78. In addition, the corresponding portion of the heat transfer material 34 is schematically shown in Figure 4 As shown in FIG. 1 , it ensures the thermal connection between the circuit board unit 12 and the cooling device 26. Figure 4 The corresponding areas of the heat transfer material 34 can be formed as thermally conductive pads, in particular thermally conductive pads that are separated from each other or connected to each other.

[0074] Preferably, the spring element 84 (at Figure 4 Only their positions on the housing 22 are shown) apply pressure to the corresponding column element 80, which is directed toward the cooling device 26 and Figure 4 8 is indicated by corresponding arrows 86. Thus, pressure is preferably exerted on the pillar elements 80, which act in particular in the region of the corresponding heat transfer material 34 or heat conducting pad.

[0075] Due to the recesses 82 provided in the respective guide rails 78 , the column element 80 can be moved relatively far toward the cooling device 26 together with the entire circuit board unit 12 when the spring element 84 applies a pressure indicated by arrow 86 to the column element 80 .

[0076] Therefore, when the column element 80 is received in the recess 82 formed in the manner of a locking recess, the connection of the corresponding circuit board unit 12, 14, 16, 18 to the rear circuit board 74 via the corresponding connecting element 76 is preferably also established. Figure 4 ), the circuit board unit 12 can be cooled by a cooling device 26, through which a cooling fluid, preferably in the form of a liquid coolant, flows. Here, the heat transfer material 34 ensures a good thermal connection of the respective circuit board unit 12 to the cooling device 26.

[0077] exist Figure 5, it is shown how the spring element 84, which is preferably fixed to the housing 22, applies a pressure indicated by the arrow 86 to the column element 80. Therefore, the respective spring element 84 can include a leg 88 which is oriented obliquely in the installation position of the respective spring element 84. When the circuit board unit 12 is introduced into the housing 22 along the guide rail 78 in the installation direction 20, the respective column element 80 abuts against the leg 88. As the circuit board unit 12 is introduced into the housing 22 along the guide rail 78, the first leg 88 applies a pressure to the respective column element 80 which acts toward the cooling device 26.

[0078] In particular, the pressure can achieve compression of the heat transfer material 34, which is Figure 4 and Figure 5 Arranged between the top side 38 of the cooling device 26 and the outer wall 36 of the circuit board unit 12. Preferably, the heat transfer material 34 is therefore at least slightly compressible in order to achieve a particularly good thermal coupling of the circuit board unit 12 to the cooling device 26.

[0079] exist Figure 5 In the arrangement shown exemplarily and schematically in FIG, each column element 80 is pressed toward the cooling device 26 by a spring element 84 acting on the column element 80. Therefore, the number of spring elements 84 can specifically correspond to the number of column elements 80 that the corresponding circuit board unit 12 comprises.

[0080] according to Figure 6 , the respective spring elements 84 can each comprise a further leg 92, for example forming a step 90. By means of this further or second leg 92, the respective spring element 84 can be fixed to the housing 22 in a manner not shown in detail at present.

[0081] For example, in an arrangement on or in the housing 22, the leg 92 including the step 90 can extend substantially parallel to the vertical direction z of the housing 22. In the lower end region of the second leg 92 in the vertical direction z of the spring element 84, the second leg 92 can transition into the first leg 88, for example in the region of a bend 94 of the spring element 84, with a U-shaped cross section, wherein the first leg 88 exerts pressure on the column element 80.

[0082] However, the corresponding spring element 84 may also have a different Figure 5 and Figure 6 The shapes shown as examples in FIG.

Claims

1. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, wherein: The at least one cooling device (26, 28) is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit (12, 14, 16, 18), and wherein the at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34), It is characterized in that The circuit board unit (12, 14, 16, 18) comprises an outer wall (36) facing the cooling device (26, 28), at least one recess being formed in the outer wall, wherein the heat transfer material (34) is arranged in the at least one recess.

2. The control arrangement (10) according to claim 1, It is characterized in that A heat transfer material (34) is introduced into the at least one recess via an inlet opening (48) which is accessible from a narrow side (46) of the circuit board unit (12) at the installation position of the circuit board unit (12) in the housing (22), the heat transfer material being in particular in the form of a heat conducting paste.

3. A control arrangement (10) according to any one of the preceding claims, It is characterized in that The at least one recess is formed as a channel system (40), which includes at least one channel segment (42), which is connected to at least one basin area (44) of the channel system (40), wherein the at least one basin area (44) has a larger width than the at least one channel segment (42) of the channel system (40).

4. The control arrangement (10) according to claim 3, It is characterized in that The channel system (40) comprises a plurality of basin areas (44), which in particular have a greater depth than the at least one channel section (42) and / or have depths that differ from one another, wherein the basin areas (44) are connected to one another via the respective channel sections (42).

5. The control arrangement (10) according to claim 4, It is characterized in that The basin region (44) is formed in a section of the circuit board unit (12) in which more heat is released during operation of the circuit board unit (12) than in a region of the circuit board unit (12) adjacent to the section.

6. A control device arrangement (10) according to any one of claims 3 to 5, It is characterized in that The channel system (40) comprises at least one air outlet opening (50), which in particular leads to the narrow side of the circuit board unit (12), wherein, when the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) are arranged in the housing (22) of the control device arrangement (10), air can be discharged from the channel system (40) via the at least one air outlet opening (50) due to the heat transfer material (34) being introduced into the channel system (40).

7. A control arrangement (10) according to any one of the preceding claims, It is characterized in that The circuit board unit (12) comprises a first region (52) having a first thickness (54) and a second region (56) having a second thickness (58), wherein the second thickness (58) is greater than the first thickness (54), wherein the at least one recess is formed in the first region (52), and wherein an end side (60) of the second region (56) adjacent to the first region (52) faces a narrow side (62) of the cooling device (26).

8. A control arrangement (10) according to any one of the preceding claims, It is characterized in that The control device arrangement (10) comprises at least two circuit board units (12, 14), which are arranged in a mirror-image manner to each other in the housing (22), wherein the corresponding outer walls (36) of the mirror-image-arranged circuit board units (12, 14) including the at least one recess face the same cooling device (26).

9. A control arrangement (10) according to any one of the preceding claims, It is characterized in that At least two cooling devices (26, 28) are arranged in the housing (22), through which a cooling fluid flows, in particular during cooling operation, and are formed as cooling plates, wherein the respective cooling plate (26, 28) is received between two circuit board units (12, 14, 16, 18) in a sandwich-like configuration.

10. A control arrangement (10) according to any one of the preceding claims, It is characterized in that The circuit board units (12, 14, 16, 18) arranged one above the other in the vertical direction (z) of the housing (22) are connected to another circuit board (74) arranged on the rear side of the housing (22) via corresponding connecting elements (76), wherein the rear side is opposite to the front side access opening (72) of the housing (22).

11. A control arrangement (10) according to any one of the preceding claims, It is characterized in that A pressure force is applied to the circuit board unit (12) in the direction of the cooling device (26) by means of at least one spring element (84), wherein the pressure force acts in the region of the heat transfer material (34), which is in particular formed as a heat conducting pad.

12. A control arrangement (10) according to any one of the preceding claims, It is characterized in that The circuit board unit (12) includes at least one column element (80), which cooperates with a guide rail (78) arranged on a side of the housing (22), wherein when the circuit board unit (12) is introduced into the housing (22), the at least one column element (80) is guided along the guide rail (78).

13. A control arrangement (10) according to claims 11 and 12, It is characterized in that The column element (80) is subjected to pressure by the spring element (84), wherein the guide rail (78) includes a recess (82) formed in the area of ​​a target position of the column element (80) toward the cooling device (26), and wherein the column element (80) is received in the recess (82).

14. The control arrangement (10) according to claim 13, It is characterized in that The at least one spring element (84) is fixed to the housing (22) and includes a leg (88), and as the circuit board unit (12) is introduced into the housing (22) along the guide rail (78), the leg (88) applies pressure to the column element (80) acting toward the cooling device (26), and / or the circuit board unit (12) includes a plurality of column elements (80), wherein each column element (80) is subjected to pressure acting toward the cooling device (26) by the spring element (88) acting thereon.

15. A method of manufacturing a control device arrangement (10), wherein: At least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged in a housing (22) of the control device arrangement (10), wherein the at least one cooling device (26, 28) is supplied with a cooling fluid in a cooling operation and is formed for dissipating heat from the at least one circuit board unit (12, 14, 16, 18), and wherein the at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34), It is characterized in that The circuit board unit (12, 14, 16, 18) comprises an outer wall (36) facing the cooling device (26, 28), and at least one recess is formed in the outer wall, wherein the heat transfer material (34) is arranged in the at least one recess, in particular, the heat transfer material (34) is arranged in the at least one recess when the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) are arranged in the housing (22).

Images