Welding layer thickness adjusting method, device and equipment of power module and storage medium

Abstract

The invention discloses a method, device and equipment for adjusting the thickness of a welding layer of a power module and a storage medium, and belongs to the technical field of welding. The method comprises the steps that an insulating substrate and a heat dissipation bottom plate of the power module are obtained, and the thickness of the welding layer of the power module is preset according to the power level of the power module; a metal wire with the corresponding diameter is selected according to the preset welding layer thickness of the power module, and the metal wire is welded to the to-be-welded face of a heat dissipation bottom plate of the power module through ultrasonic welding equipment; arranging welding flux of the welding layer on the to-be-welded surface of the heat dissipation bottom plate, and arranging the insulating substrate on the welding flux layer; and carrying out vacuum reflow soldering on the power module with the solder, and adjusting the thickness of the soldering layer through mutual cooperation of a pressure ejector pin and the metal wire. According to the method for adjusting the thickness of the welding layer of the power module, the thickness of the welding layer of the power module can be effectively adjusted, and the heat dissipation performance and reliability of a power module product are improved.

Description

Technical Field

[0001] The present invention belongs to the field of welding technology, and in particular relates to a method, device, equipment and storage medium for adjusting the thickness of a welding layer of a power module. Background Art

[0002] As power modules develop towards high integration and high density, the reliability requirements for power modules are also getting higher and higher. When the power module is working, the current density is large, the heat is large, and the temperature rises. When it is not working, the temperature drops. Due to the difference in thermal expansion coefficients between the ceramic copper-clad substrate and the heat dissipation base in the power module, during the application of power module products, the welding layer between the ceramic copper-clad substrate and the heat dissipation base needs to withstand the stress caused by temperature cycles and thermal expansion coefficient differences. When the welding layer is too thin, cracks are prone to occur; when the welding layer is too thick, the heat generated during the operation of the power module cannot be effectively conducted away, resulting in the accumulation of heat inside the power module in the thicker parts of the welding layer. The local temperature is too high, which will also shorten the life of the power module and even cause damage to the power module.

[0003] At present, the conventional practice for adjusting the thickness of the welding layer is to add small bosses to the heat dissipation base plate to play a supporting role after the solder melts. However, using this method, the heat dissipation base plate needs to add a small boss milling process, and the position of the small boss is not convenient to flexibly adjust at any time. During the new product verification stage, materials and process parameters are often changed, and the thickness of the welding layer at different positions will also be affected. Another method for adjusting the thickness of the welding layer is to pre-embed metal wires or metal particles to play a supporting role during the production of preformed solder sheets. However, this method has high production costs, complex production processes, technical barriers, and is not universal. In addition, the preformed solder sheets of this special process are expensive and have low yields, which greatly increases the cost of manufacturing power module products.

[0004] Therefore, how to adjust the thickness of the welding layer of the power module is an urgent problem to be solved. Summary of the invention

[0005] In order to solve the above technical problem of how to adjust the thickness of the welding layer of the power module, the present invention provides a method for adjusting the thickness of the welding layer of the power module, comprising:

[0006] Obtaining an insulating substrate and a heat dissipation base plate of a power module, and presetting a welding layer thickness of the power module according to a power level of the power module;

[0007] Selecting a metal wire of a corresponding diameter according to a preset welding layer thickness of the power module, and welding the metal wire to the to-be-welded surface of the heat dissipation bottom plate of the power module using an ultrasonic welding device;

[0008] The solder of the welding layer is arranged on the surface to be welded of the heat dissipation base plate, and the insulating substrate of the power module is arranged on the solder layer;

[0009] The power module after being provided with solder is subjected to vacuum reflow soldering, and the thickness of the soldering layer is adjusted by cooperating with the metal wire through the pressure ejector pin.

[0010] Preferably, the vacuum reflow soldering of the power module after the solder is provided comprises:

[0011] Heating the solder of the welding layer to a melting point to obtain melted liquid solder;

[0012] The melted liquid solder is subjected to vacuum treatment to obtain liquid solder with pores eliminated;

[0013] The liquid solder after the pores are eliminated is cooled and solidified to form a soldered semi-finished power module.

[0014] Preferably, the thickness of the welding layer is adjusted by cooperating with the metal wire through the pressure ejector pin, including:

[0015] Arranging a pressure ejector pin on the insulating substrate of the power module, and adjusting the position of the metal wire according to the position of the pressure ejector pin;

[0016] The welding layer is pressurized by a pressure pin, and the pressure of the pressure pin and the wire diameter of the metal wire are adjusted in real time according to the thickness of the welding layer.

[0017] Preferably, the real-time adjustment of the pressure of the pressure ejector pin and the wire diameter of the metal wire according to the thickness of the welding layer includes:

[0018] If the thickness of the welding layer corresponding to the pressure ejector pin is greater than the preset thickness of the welding layer, the pressure of the welding layer is increased, and the wire diameter of the metal wire on the surface to be welded of the heat dissipation base plate is reduced;

[0019] If the thickness of the welding layer corresponding to the pressure ejector pin is less than the preset thickness of the welding layer, the pressure of the welding layer is reduced, and the wire diameter of the metal wire on the surface to be welded of the heat dissipation base plate is increased.

[0020] Preferably, the solder of the welding layer is provided on the surface to be welded of the heat dissipation base plate, comprising:

[0021] Solder paste is printed on the surface to be welded of the heat dissipation base plate using solder paste, or a preformed tin sheet is placed on the surface to be welded of the heat dissipation base plate.

[0022] Preferably, selecting a metal wire of a corresponding diameter according to a preset welding layer thickness of the power module includes:

[0023] Select a metal wire with a diameter that is 10 to 100 um smaller than the preset welding layer thickness of the power module.

[0024] Preferably, the thickness of the welding layer of the power module is 100-400 um.

[0025] In a second aspect, the present invention further provides a device for adjusting the thickness of a welding layer of a power module, comprising:

[0026] An acquisition module, used for acquiring an insulating substrate and a heat dissipation base plate of a power module, and presetting a welding layer thickness of the power module according to a power level of the power module;

[0027] A selection module, used to select a metal wire of a corresponding diameter according to a preset welding layer thickness of the power module, and weld the metal wire to a to-be-welded surface of the heat dissipation bottom plate of the power module using an ultrasonic welding device;

[0028] A setting module, used for setting the solder of the welding layer on the to-be-welded surface of the heat dissipation base plate, and setting the insulating substrate of the power module on the solder layer;

[0029] The regulating module is used to perform vacuum reflow soldering on the power module after the solder is set, and to adjust the thickness of the soldering layer by cooperating with the metal wire through the pressure ejector pin.

[0030] In the third aspect, the present invention also provides a device, including a processor and a memory coupled to the processor, the memory storing program instructions executable by the processor; when the processor executes the program instructions stored in the memory, the method for adjusting the welding layer thickness of the power module as described in any one of the first aspects above is implemented.

[0031] In a fourth aspect, the present invention further provides a storage medium, wherein program instructions are stored in the storage medium, and when the program instructions are executed by a processor, a method for adjusting the welding layer thickness of a power module as described in any one of the first aspects above can be implemented.

[0032] Compared with the prior art, the method for adjusting the thickness of the welding layer of the power module provided by the present invention selects a metal wire of a corresponding diameter according to the preset welding layer thickness of the power module, uses an ultrasonic welding device to weld the metal wire to the welding surface of the heat dissipation bottom plate of the power module, and adjusts the thickness of the welding layer by cooperating with the metal wire through a pressure ejector pin. The method for adjusting the thickness of the welding layer of the power module provided by the present invention can effectively adjust the thickness of the welding layer of the power module and improve the heat dissipation performance and reliability of the power module product. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the present invention, rather than all of the embodiments. For ordinary technicians in this field, without paying creative work, other drawings obtained based on these drawings all fall within the scope of protection of the present invention.

[0034] Figure 1 A schematic flow chart of a method for adjusting the thickness of a welding layer of a power module provided by an embodiment of the present invention;

[0035] Figure 2 A schematic diagram of the structure of a power module provided by an embodiment of the present invention;

[0036] Figure 3 A top view of a heat dissipation base plate of a power module provided by an embodiment of the present invention;

[0037] Figure 4 A schematic structural diagram of a welding layer thickness adjustment device for a power module provided by an embodiment of the present invention;

[0038] Figure 5 A schematic diagram of the structure of a device provided by an embodiment of the present invention;

[0039] Figure 6 A schematic diagram of the structure of a storage medium provided by an embodiment of the present invention.

[0040] Among them, 10 is a semi-finished power module, 11 is an insulating substrate, 111 is a circuit layer, 112 is an insulating layer, 113 is a heat dissipation layer, 12 is a heat dissipation base plate, 13 is a welding layer, 14 is a metal wire, and 20 is a pressure ejector pin. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0042] In order to make the description of the content of the present invention more detailed and complete, the following is an illustrative description of the implementation method and specific examples of the present invention; however, this is not the only form of implementing or applying the specific embodiments of the present invention. The implementation method covers the features of multiple specific embodiments and the method steps and their sequence for constructing and operating these specific embodiments. However, other specific embodiments can also be used to achieve the same or equal functions and step sequences. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0044] In the description of the embodiments of the present invention, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present invention, “multiple” means two or more than two, and other quantifiers are similar. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention, and the embodiments of the present invention and the features in the embodiments may be combined with each other without conflict.

[0045] Please refer to Figure 1-2 , Figure 1 A schematic diagram of a flow chart of a method for adjusting the welding layer thickness of a power module provided by an embodiment of the present invention, Figure 2 The schematic diagram of the structure of a power module provided by an embodiment of the present invention is a schematic diagram of the structure of a power module provided by an embodiment of the present invention. The method for adjusting the welding layer thickness of the power module can be executed by software and / or hardware devices. Figure 1 As shown, the method for adjusting the welding layer thickness of the power module may include:

[0046] S101, obtain the insulating substrate 11 and the heat dissipation base plate 12 of the power module, and preset the thickness of the welding layer of the power module according to the power level of the power module. Specifically, in the embodiment of the present invention, first, it is necessary to obtain the insulating substrate 11 of the power module, and the insulating substrate 11 can select a 3-layer copper-clad ceramic substrate, and the 3-layer copper-clad ceramic substrate is a circuit layer 111 made of copper material, an insulating layer 112 made of ceramic material, and a heat dissipation layer 113 made of copper material from top to bottom; secondly, the thickness of the welding layer 13 of the power module is preset according to the power level of the power module, so that the solder of the welding layer 13 can be placed on the heat dissipation base plate 12 later.

[0047] It should be noted that the power level of the power module is related to the heat dissipation performance requirements of the power module and the reliability requirements of the welding layer. If the power level of the power module is higher, the heat generated during operation is greater, and the heat dissipation requirements of the power module are higher, and it is further necessary to preset the welding layer thickness of the power module to be smaller. In addition, if the reliability requirements of the power module are higher, it is further necessary to preset the welding layer thickness of the power module to be larger. Therefore, in the embodiment of the present invention, the welding layer thickness of the power module can be preset according to the heat dissipation performance requirements and reliability requirements of the power module.

[0048] S102. Select a metal wire of corresponding diameter according to the preset thickness of the welding layer 13 of the power module, and use ultrasonic welding equipment to weld the metal wire 14 to the surface to be welded of the heat dissipation base plate 12 of the power module. Specifically, in an embodiment of the present invention, after the thickness of the welding layer of the power module is preset according to the power level of the power module, a metal wire 14 of corresponding diameter can be selected according to the preset thickness of the welding layer 13 of the power module, and the diameter of the metal wire 14 is selected to be smaller than the preset thickness of the welding layer 13, so that the welding layer 13 can cover the metal wire 14, so that the insulating substrate 11 can better conduct heat. Secondly, the metal wire 14 is welded to the surface to be welded of the heat dissipation base plate 12 by ultrasonic welding equipment, and the welding path of the metal wire 14 can be specified by software programming. The metal wire 14 is fixed by ultrasonic welding equipment, and the welding position is flexible and adjustable, and the metal wire 14 will not shift during the reflow soldering process. In addition, the ultrasonic welding equipment is a conventional equipment for welding chip connecting wires during the sample preparation process of the power module product, and no additional investment is required.

[0049] S103, setting the solder of the welding layer 13 on the surface to be welded of the heat dissipation base plate 12, and setting the insulating substrate 11 of the power module on the solder layer 13. Specifically, in the embodiment of the present invention, after the metal wire 14 is welded to the surface to be welded of the heat dissipation base plate 12 of the power module by using ultrasonic welding equipment, a solder made of tin material can be set on the surface to be welded of the heat dissipation base plate 12, and the assembled insulating substrate 11 can be set on the solder layer 13.

[0050] S104, vacuum reflow soldering is performed on the power module after the solder is set, and the thickness of the solder layer 13 is adjusted by the cooperation of the pressure ejector 20 and the metal wire 14. Specifically, in the embodiment of the present invention, after the solder of the solder layer 13 is set on the surface to be soldered of the heat dissipation base plate 12, vacuum reflow soldering can be performed on the power module after the solder is set, and during the soldering process, the selected metal wire 14 is used as a support point of the solder layer 13, and cooperates with the pressure ejector 20 applied to the insulating substrate during welding to achieve the effect of adjusting the thickness of the solder layer, wherein the soldering position, length, and number of the metal wire 14 can be flexibly adjusted according to the actual performance of the thickness of the solder layer and the actual pressure point.

[0051] As an implementation mode, the power module after setting the solder is subjected to vacuum reflow soldering, including: heating the solder of the soldering layer 13 to the melting point temperature to obtain melted liquid solder; vacuumizing the melted liquid solder to obtain liquid solder after eliminating pores; cooling and solidifying the liquid solder after eliminating pores to form a welded power module. Specifically, in the embodiment of the present invention, the solder can be first melted into liquid solder, and after vacuuming, the liquid solder is cooled to below the melting point, and the solidified solder layer can weld the insulating substrate 11 and the heat dissipation base plate 12 together to form a welded semi-finished power module 10.

[0052] As an implementation mode, the thickness of the welding layer 13 is adjusted by the cooperation between the pressure ejector pin 20 and the metal wire 14, including: setting a pressure ejector pin 20 on the insulating substrate 11 of the power module, and adjusting the position of the metal wire 14 according to the position of the pressure ejector pin 20; pressurizing the welding layer by the pressure ejector pin 20, and adjusting the pressure of the pressure ejector pin 20 and the wire diameter of the metal wire 14 in real time according to the thickness of the welding layer 13. Specifically, in the embodiment of the present invention, it is necessary to set the position of the pressure ejector pin 20 on the surface of the insulating substrate avoiding the circuit layout position, and the metal wire 14 can be set at a position in the vertical direction of the pressure ejector pin as a support point for the pressure of the ejector pin to ensure that the desired welding layer thickness is achieved. For example, please refer to Figure 3 , Figure 3 A top view of a heat dissipation base plate of a power module provided in an embodiment of the present invention can flexibly arrange the position, length and quantity of metal wires 14 according to actual needs.

[0053] As an implementation mode, the real-time adjustment of the pressure of the pressure ejector 20 and the wire diameter of the metal wire according to the thickness of the welding layer 13 includes: if the welding layer thickness corresponding to the pressure ejector 20 is greater than the preset welding layer thickness, then the pressure of the welding layer 13 is increased, and the wire diameter of the metal wire 14 on the welding surface of the heat dissipation base plate 12 is reduced; if the welding layer thickness corresponding to the pressure ejector 20 is less than the preset welding layer thickness, then the pressure of the welding layer 13 is reduced, and the wire diameter of the metal wire 14 on the welding surface of the heat dissipation base plate 12 is increased. In the embodiment of the present invention, only one material of the heat dissipation base plate 12 is needed, and by welding metal wires at different positions on its surface, the compatibility requirements of different support positions can be achieved, and there is no need to purchase multiple heat dissipation base plate materials, which facilitates the management of material inventory and cost control.

[0054] As an embodiment, the solder of the welding layer 13 is provided on the surface to be welded of the heat dissipation base plate 12, including: printing solder paste on the surface to be welded of the heat dissipation base plate 12 using solder paste, or placing a preformed tin sheet on the surface to be welded of the heat dissipation base plate 12. Specifically, in the embodiment of the present invention, solder can be applied by solder paste printing, or a preformed solder sheet can be placed.

[0055] As an implementation mode, selecting a metal wire 14 of a corresponding diameter according to the preset thickness of the welding layer 13 of the power module includes: selecting a metal wire 14 having a diameter less than 10 to 100 um of the preset welding layer thickness of the power module. Specifically, in the embodiment of the present invention, a metal wire having a diameter less than 50 um of the preset welding layer thickness of the power module can be further preferred. In addition, metal wires of different materials that match the welding performance of the required welding layer material can be flexibly selected to improve the welding yield; selecting a metal wire with high thermal conductivity as a supporting component of the welding layer can improve the thermal conductivity efficiency of the welding layer and further improve the reliability and life of the product.

[0056] As an implementation mode, the thickness of the welding layer 13 of the power module is 100 to 400 um. Specifically, in the embodiment of the present invention, the thickness of the welding layer 13 of the power module can be preset according to the power level of the power module, and the thickness of the welding layer 13 can be adjusted in real time during the welding process, and the thickness of the welding layer 13 can be evenly adjusted between 100 and 400 um according to actual needs.

[0057] On the other hand, the present invention also provides a device for adjusting the thickness of a welding layer of a power module, please refer to Figure 4, is a structural schematic diagram of a device for adjusting the welding layer thickness of a power module provided in an embodiment of the present invention, the device comprising: an acquisition module 41, used for acquiring an insulating substrate and a heat dissipation base plate of the power module, and presetting the welding layer thickness of the power module according to the power level of the power module; a selection module 42, used for selecting a metal wire of a corresponding diameter according to the preset welding layer thickness of the power module, and welding the metal wire to the to-be-welded surface of the heat dissipation base plate of the power module by using an ultrasonic welding device; a setting module 43, setting the solder of the welding layer on the to-be-welded surface of the heat dissipation base plate, and setting the insulating substrate of the power module on the solder layer; an adjustment module 44, used for performing vacuum reflow soldering on the power module after the solder is set, and adjusting the thickness of the welding layer by cooperating with the metal wire through a pressure ejector pin.

[0058] The welding layer thickness adjustment device 40 for a power module provided in an embodiment of the present invention can execute the technical solution of the welding layer thickness adjustment method for a power module in any of the above-mentioned embodiments. Its implementation principle and beneficial effects are similar to the implementation principle and beneficial effects of the welding layer thickness adjustment method for a power module. Please refer to the implementation principle and beneficial effects of the welding layer thickness adjustment method for a power module, which will not be repeated here.

[0059] Please refer to Figure 5 , is a structural schematic diagram of a device provided in an embodiment of the present invention, comprising a memory 51 and a processor 52, wherein: the memory 51 is used to store a computer program; the processor 52 is used to read the computer program in the memory and execute the above-mentioned method for adjusting the welding layer thickness of the power module.

[0060] The processor 52 may also be referred to as a CPU (Central Processing Unit). The processor 52 may be an integrated circuit chip having signal processing capabilities. The processor 52 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0061] Please refer to Figure 6, a schematic diagram of the structure of a storage medium provided in an embodiment of the present invention. The storage medium 60 of the embodiment of the present invention stores program instructions 61 capable of implementing the welding layer thickness adjustment of the power module described above, wherein the program instructions 61 can be stored in the above storage medium in the form of a software product, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, or terminal devices such as a computer, a server, a mobile phone, and a tablet.

[0062] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0063] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above integrated unit may be implemented in the form of hardware or in the form of software functional units. The above is only an implementation mode of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

[0064] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as above in the form of preferred embodiments, it is not intended to limit the present invention. Any technical personnel in the field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for adjusting the thickness of a welding layer of a power module, characterized in that: include: Obtaining an insulating substrate and a heat dissipation base plate of a power module, and presetting a welding layer thickness of the power module according to a power level of the power module; Selecting a metal wire of a corresponding diameter according to a preset welding layer thickness of the power module, and welding the metal wire to the to-be-welded surface of the heat dissipation bottom plate of the power module using an ultrasonic welding device; The solder of the welding layer is arranged on the surface to be welded of the heat dissipation base plate, and the insulating substrate of the power module is arranged on the solder layer; The power module after being provided with solder is subjected to vacuum reflow soldering, and the thickness of the soldering layer is adjusted by cooperating with the metal wire through the pressure ejector pin.

2. The method for adjusting the welding layer thickness of a power module according to claim 1, characterized in that: The method of performing vacuum reflow soldering on the power module after the solder is provided comprises: Heating the solder of the welding layer to a melting point to obtain melted liquid solder; The melted liquid solder is subjected to vacuum treatment to obtain liquid solder with pores eliminated; The liquid solder after the pores are eliminated is cooled and solidified to form a soldered semi-finished power module.

3. The method for adjusting the welding layer thickness of a power module according to claim 2, characterized in that: The thickness of the welding layer is adjusted by the cooperation between the pressure ejector pin and the metal wire, including: Arranging a pressure ejector pin on the insulating substrate of the power module, and adjusting the position of the metal wire according to the position of the pressure ejector pin; The welding layer is pressurized by a pressure pin, and the pressure of the pressure pin and the wire diameter of the metal wire are adjusted in real time according to the thickness of the welding layer.

4. The method for adjusting the welding layer thickness of a power module according to claim 3, characterized in that: The method of adjusting the pressure of the pressure ejector pin and the wire diameter of the metal wire in real time according to the thickness of the welding layer comprises: If the thickness of the welding layer corresponding to the pressure ejector pin is greater than the preset thickness of the welding layer, the pressure of the welding layer is increased, and the wire diameter of the metal wire on the surface to be welded of the heat dissipation base plate is reduced; If the thickness of the welding layer corresponding to the pressure ejector pin is less than the preset thickness of the welding layer, the pressure of the welding layer is reduced, and the wire diameter of the metal wire on the surface to be welded of the heat dissipation base plate is increased.

5. The method for adjusting the welding layer thickness of a power module according to claim 4, characterized in that: The solder of the welding layer is arranged on the surface to be welded of the heat dissipation base plate, comprising: Solder paste is printed on the surface to be welded of the heat dissipation base plate using solder paste, or a preformed tin sheet is placed on the surface to be welded of the heat dissipation base plate.

6. The method for adjusting the welding layer thickness of a power module according to claim 5, characterized in that: Select metal wires of corresponding diameters according to the preset welding layer thickness of the power module, including: Select a metal wire with a diameter that is 10 to 100 um smaller than the preset welding layer thickness of the power module.

7. The method for adjusting the welding layer thickness of a power module according to claim 6, characterized in that: The thickness of the welding layer of the power module is 100-400 um.

8. A device for adjusting the thickness of a welding layer of a power module, characterized in that: include: An acquisition module, used for acquiring an insulating substrate and a heat dissipation base plate of a power module, and presetting a welding layer thickness of the power module according to a power level of the power module; A selection module, used to select a metal wire of a corresponding diameter according to a preset welding layer thickness of the power module, and weld the metal wire to a to-be-welded surface of the heat dissipation bottom plate of the power module using an ultrasonic welding device; A setting module, used for setting the solder of the welding layer on the to-be-welded surface of the heat dissipation base plate, and setting the insulating substrate of the power module on the solder layer; The regulating module is used to perform vacuum reflow soldering on the power module after the solder is set, and to adjust the thickness of the soldering layer by cooperating with the metal wire through the pressure ejector pin.

9. A device, characterized in that: It includes a processor and a memory coupled to the processor, the memory storing program instructions executable by the processor; when the processor executes the program instructions stored in the memory, the method for adjusting the welding layer thickness of the power module as described in any one of claims 1 to 7 is implemented.

10. A storage medium, characterized in that: The storage medium stores program instructions, and when the program instructions are executed by the processor, the method for adjusting the welding layer thickness of the power module according to any one of claims 1 to 7 can be implemented.

Images