Silicon wafer cutting device and method for photovoltaic panel manufacturing

The silicon wafer cutting device addresses the limitation of single-layer processing by cutting multiple grooves on a silicon ingot, allowing simultaneous production of multiple wafers, thereby improving efficiency and facilitating subsequent processing.

CN119189083AInactive Publication Date: 2024-12-27CHINA HEAVY ENERGY (NANTONG) NEW ENERGY CO LTD
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Patent Information

Application Number
CN202411582416.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-07
Publication Date
2024-12-27
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Traditional silicon wafer cutting equipment can only process one layer of silicon wafers at a time, limiting the efficiency of cutting monocrystalline silicon ingots into multiple wafers.

Method used

A silicon wafer cutting device that processes multiple temporary grooves from top to bottom on a single crystal silicon ingot using an inner circular saw, followed by cutting with wire saws to produce multiple silicon wafers simultaneously.

Benefits of technology

Enables efficient cutting of a single crystal silicon ingot into multiple silicon wafers in a single operation, enhancing production efficiency and facilitating further processing steps.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the field of silicon wafer cutting, in particular to a silicon wafer cutting device and method for photovoltaic panel manufacturing. The silicon wafer cutting device for photovoltaic panel manufacturing comprises a disc, an inner circular saw is fixed to the inner ring of the disc, guide rods are fixed to the left end and the right end of the lower side of the inner circular saw, the two guide rods are vertically and slidably connected to a rotating ring, second telescopic rods are fixed to the front end and the rear end of the rotating ring, and the movable ends of the two second telescopic rods are fixed to the lower side of the disc. The silicon wafer cutting method comprises the following steps: S1, clamping and fixing a monocrystalline silicon ingot; s2, the monocrystalline silicon ingot is inserted into an inner ring of an inner circular saw, and a plurality of temporary cutting grooves are machined in the monocrystalline silicon ingot from top to bottom through the inner circular saw; s3, taking down the monocrystalline silicon ingot and fixing the monocrystalline silicon ingot on a cylinder; and S4, sawing the plurality of temporary cutting grooves through a plurality of wire saws, and cutting the monocrystalline silicon ingot into silicon wafers. A plurality of annular cutting grooves can be machined in the monocrystalline silicon ingot from top to bottom through the inner circular saw, and the monocrystalline silicon ingot can be conveniently cut into a plurality of silicon wafers at a time.
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Description

Technical Field

[0001] The present invention relates to the field of silicon wafer cutting, and more specifically to a silicon wafer cutting device and method for photovoltaic panel manufacturing. Background Art

[0002] Wafer cutting is an important step in the semiconductor manufacturing process. It is mainly used to cut large monocrystalline silicon ingots into thin slices, which will be further processed to manufacture various electronic devices, such as integrated circuits and photovoltaic cells. The temperature and cutting speed need to be controlled during the cutting process to ensure the cutting efficiency and the integrity of the silicon wafer. After cutting, the silicon wafer may need further flattening, cleaning and polishing to meet the requirements of subsequent processes. Traditional silicon wafer cutting equipment can only cut one layer of silicon wafers at a time and cannot cut a monocrystalline silicon ingot into multiple silicon wafers at a time. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the present invention provides a silicon wafer cutting device and method for photovoltaic panel manufacturing, which has the beneficial effect of being able to process multiple temporary grooves from top to bottom on a single crystal silicon ingot through an inner circular saw, making it convenient to cut the single crystal silicon ingot into multiple silicon wafers at one time.

[0004] A silicon wafer cutting device for manufacturing photovoltaic panels comprises a disc, an inner circular saw is fixed to the inner ring of the disc, guide rods are fixed to the left and right ends of the lower side of the inner circular saw, the two guide rods are vertically slidably connected to a rotating ring, two telescopic rods are fixed to the front and rear ends of the rotating ring, and the movable ends of the two telescopic rods are fixed to the lower side of the disc.

[0005] The rotating ring is rotatably connected to the outer side of the circular ring, and two limit blocks are fixed on the circular ring. The two limit blocks are respectively located on the upper and lower sides of the rotating ring, and support bars are fixed on both left and right ends of the lower side of the circular ring.

[0006] The two support bars are both fixed on the base, a gear ring is fixed on the outer periphery of the rotating ring, a second motor is fixed on the right part of the base, a gear is fixed on the output shaft of the second motor, and the gear and the gear ring are meshed for transmission.

[0007] A motor 1 is fixed in the middle of the base, a main shaft is fixed on the output shaft of the motor 1, the main shaft is rotatably connected to a portal frame, and the portal frame is fixed on the base.

[0008] A method for cutting silicon wafers for manufacturing photovoltaic panels, comprising the following steps:

[0009] S1: clamping and fixing the single crystal silicon ingot;

[0010] S2: inserting the single crystal silicon ingot into the inner circle of the inner circular saw, and processing a plurality of temporary grooves from top to bottom on the single crystal silicon ingot by the inner circular saw;

[0011] S3: taking down the single crystal silicon ingot and fixing it on the cylinder;

[0012] S4: Cutting a plurality of temporary grooves by a plurality of wire saws to cut the single crystal silicon ingot into silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0014] Figure 1 A schematic diagram of the structure of a silicon wafer cutting device for photovoltaic panel manufacturing Figure 1 ;

[0015] Figure 2 A schematic diagram of the structure of a silicon wafer cutting device for photovoltaic panel manufacturing Figure 2 ;

[0016] Figure 3 A schematic diagram of the structure of a silicon wafer cutting device for photovoltaic panel manufacturing Figure 3 ;

[0017] Figure 4 A schematic diagram of the structure of a silicon wafer cutting device for photovoltaic panel manufacturing Figure 4 ;

[0018] Figure 5 Schematic diagram of the base and L-shaped frame structure Figure 1 ;

[0019] Figure 6 Schematic diagram of the base and L-shaped frame structure Figure 2 ;

[0020] Figure 7 The structure of the swivel is shown in Figure 1. Figure 1 ;

[0021] Figure 8 The structure of the swivel is shown in Figure 1. Figure 2 ;

[0022] Fig. 9 Schematic diagram of the structure of the half tube and the bottom plate Figure 1 ;

[0023] Fig.10 Schematic diagram of the structure of the half tube and the bottom plate Figure 2 .

[0024] In the figure: base 101; motor 1 102; gantry 103; motor 2 104; gear 105; spindle 106;

[0025] L-shaped frame 201; telescopic rod 202; sliding column 203; horizontal column 204; clip 205; side piece 206; pressing screw 207;

[0026] Rotating ring 301; supporting bar 302; gear ring 303; guide rod 304; disc 305; inner circular saw 306; ring 307; telescopic rod 2 308; limit block 309;

[0027] Half cylinder 401; cut-in groove 402; fastening screw 403; cylinder 404;

[0028] Bottom plate 501; telescopic rod 502; bracket 503; push-pull rod 504; stopper 505; round rod 506; wire saw 507. DETAILED DESCRIPTION

[0029] like Figure 7-8 As shown, this example can achieve the effect of conveniently cutting a single crystal silicon ingot into multiple silicon wafers.

[0030] The silicon wafer cutting device for manufacturing photovoltaic panels includes a disc 305, an inner ring of the disc 305 is welded with an inner circular saw 306, and guide rods 304 are welded to the left and right ends of the lower side of the inner circular saw 306, and the two guide rods 304 are vertically slidably connected to the rotating ring 301, and the front and rear ends of the rotating ring 301 are connected with telescopic rods 308 by screws, and the movable ends of the two telescopic rods 308 are connected to the lower side of the disc 305 by screws. The silicon ingot can be inserted into the inner ring of the inner circular saw 306, and then the disc 305 and the two guide rods 304 are driven to rise and fall by the two telescopic rods 308, thereby driving the inner circular saw 306 to rise and fall to different heights of the silicon ingot, and then the inner circular saw 306 contacts the silicon ingot, and processes a plurality of temporary cutting grooves on the silicon ingot from top to bottom, so as to facilitate the next step of cutting the single crystal silicon ingot into multiple silicon wafers at one time.

[0031] like Figure 7-8 As shown, this example can achieve the effect of driving the inner circular saw 306 to rotate and cut grooves on the silicon ingot inside thereof.

[0032] Since the rotating ring 301 is rotatably connected to the outer side of the circular ring 307, two limit blocks 309 are welded on the circular ring 307, and the two limit blocks 309 are respectively located on the upper and lower sides of the rotating ring 301. The left and right ends of the lower side of the circular ring 307 are welded with support bars 302. The two support bars 302 can support the circular ring 307. The rotating ring 301 can rotate on the circular ring 307 with its own axis as the axis, thereby driving the two guide rods 304, the disc 305 and the inner circular saw 306 to rotate with the axis of the circular ring 307 as the axis, thereby driving the inner circular saw 306 to rotate and cut the silicon ingot inside. The two limit blocks 309 can prevent the rotating ring 301 from moving vertically relative to the circular ring 307.

[0033] like Figure 5-8 As shown, this example can achieve the effect of driving the inner circular saw 306 to rotate.

[0034] Since the two support bars 302 are connected to the base 101 by screws, a gear ring 303 is welded on the outer periphery of the swivel 301, and the right part of the base 101 is connected to the motor 2 104 by screws, and the output shaft of the motor 2 104 is connected to the gear 105, and the gear 105 is meshed with the gear ring 303 for transmission. The motor 2 104 drives the gear 105 to rotate, thereby driving the gear ring 303 and the swivel 301 to rotate, and then driving the inner circular saw 306 to rotate.

[0035] like Figure 5-6 As shown, this example can achieve the effect of driving the sliding column 203 to slide on the L-shaped frame 201.

[0036] Since the middle part of the base 101 is connected to the motor 102 by screws, the output shaft of the motor 102 is connected to the main shaft 106, the main shaft 106 is rotatably connected to the portal frame 103, the portal frame 103 is welded to the base 101, the upper part of the main shaft 106 is connected to the L-shaped frame 201 by screws, the L-shaped frame 201 is horizontally slidably connected with the sliding column 203, the L-shaped frame 201 is connected to the telescopic rod 202 by screws, the movable end of the telescopic rod 202 is connected to the end of the sliding column 203, the rotation of the main shaft 106 can be effectively supported by the portal frame 103, when the motor 102 rotates, the L-shaped frame 201 and the sliding column 203 are driven to rotate with the output shaft of the motor 102 as the axis, and when the telescopic rod 202 is extended or retracted, the sliding column 203 is driven to slide on the L-shaped frame 201.

[0037] like Figure 5-6 As shown, this example can achieve the effect of quickly cutting a temporary groove on a silicon ingot.

[0038] Since the end of the sliding column 203 is welded to the middle of the horizontal column 204, the left and right ends of the horizontal column 204 are slidably connected with clips 205, and the left and right ends of the horizontal column 204 are welded with side pieces 206, and the side pieces 206 are threadedly connected with pressure screws 207. The two pressure screws 207 are respectively pressed on the outside of the two clips 205, and the two clips 205 can be clamped at the bottom of the silicon ingot. The two pressure screws 207 are rotated to press the two clips 205 respectively, so that the two clips 205 The silicon ingot is clamped, and then the L-shaped frame 201 and the sliding column 203 are driven to rotate around the output shaft of the motor 102, thereby driving the two clamps 205 and the silicon ingot to rotate around the output shaft of the motor 102, and then the sliding column 203 slides on the L-shaped frame 201 to press the cross column 204, the two clamps 205 and the silicon ingot toward the inner circular saw 306, thereby driving the continuously rotating silicon ingot and the continuously rotating inner circular saw 306 to contact each other, and then quickly cutting a temporary groove on the silicon ingot.

[0039] like Figure 9-10 As shown, this example can achieve the effect of fixing the silicon ingot on the cylinder 404.

[0040] A plurality of temporary grooves are machined from top to bottom on the single crystal silicon ingot by an inner circular saw 306 , and then the single crystal silicon ingot is removed and inserted into the cylinder 404 , and the lower part of the silicon ingot is pressed by tightening screws 403 , thereby fixing the silicon ingot on the cylinder 404 .

[0041] like Figure 9-10 As shown, this example can achieve the effect of cutting a single crystal silicon ingot into multiple silicon wafers at one time.

[0042] Since brackets 503 are welded at both left and right ends of the bottom plate 501, each bracket 503 is slidably connected to a push-pull rod 504 in the front-back direction, telescopic rods 3 502 are connected to the two brackets 503 by screws, and the movable ends of the two telescopic rods 3 502 are respectively connected to the ends of the two push-pull rods 504 by screws, and round rods 506 are welded to the rear of the two push-pull rods 504. Multiple wire saws 507 are arranged from top to bottom, and the two ends of each wire saw 507 are respectively inserted into the two round rods 506. Stop heads 505 are welded at both ends of the wire saw 507, which can prevent the wire saw 507 from falling off the round rod 506. Then, the two push-pull rods 504 and the two round rods 506 are driven to move forward and backward respectively through the two telescopic rods 502, so that multiple wire saws 507 are inserted into multiple temporary grooves on the silicon ingot, and then the two push-pull rods 504 are driven to move forward and backward one after another, so that multiple wire saws 507 continuously saw towards the silicon ingot in the multiple temporary grooves, thereby cutting the single crystal silicon ingot into multiple silicon wafers at one time.

[0043] like Figure 1-10 As shown, this example can achieve the effect of making it easier for multiple wire saws 507 to completely cut the silicon ingot.

[0044] Since the upper side of the cylinder 404 is welded with a half cylinder 401, a plurality of cutting grooves 402 are arranged on the half cylinder 401 from top to bottom. The plurality of cutting grooves 402 allow the plurality of wire saws 507 to enter the plurality of cutting grooves 402 when cutting to the end, so that the plurality of wire saws 507 can easily cut the silicon ingot completely.

[0045] A method for cutting silicon wafers for manufacturing photovoltaic panels, comprising the following steps:

[0046] S1: clamping and fixing the single crystal silicon ingot;

[0047] S2: inserting the single crystal silicon ingot into the inner circle of the inner circular saw 306, and processing a plurality of temporary grooves from top to bottom on the single crystal silicon ingot by the inner circular saw 306;

[0048] S3: removing the single crystal silicon ingot and fixing it on the cylinder 404;

[0049] S4: multiple temporary cut grooves are cut by multiple wire saws 507 to cut the single crystal silicon ingot into silicon wafers.

Claims

1. A silicon wafer cutting device for photovoltaic panel manufacturing, comprising a disc (305), characterized in that: An inner circular saw (306) is fixed to the inner ring of the circular disc (305), and guide rods (304) are fixed to the left and right ends of the lower side of the inner circular saw (306), and the two guide rods (304) are vertically slidably connected to the rotating ring (301), and telescopic rods (308) are fixed to the front and rear ends of the rotating ring (301), and the movable ends of the two telescopic rods (308) are fixed to the lower side of the circular disc (305).

2. A silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: The rotating ring (301) is rotatably connected to the outer side of the circular ring (307). Two limit blocks (309) are fixed on the circular ring (307). The two limit blocks (309) are respectively located on the upper and lower sides of the rotating ring (301). Support bars (302) are fixed on both left and right ends of the lower side of the circular ring (307).

3. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 2, characterized in that: The two support bars (302) are both fixed on the base (101), a gear ring (303) is fixed on the outer periphery of the rotating ring (301), a second motor (104) is fixed on the right part of the base (101), a gear (105) is fixed on the output shaft of the second motor (104), and the gear (105) is meshed with the gear ring (303) for transmission.

4. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 3, characterized in that: A motor 1 (102) is fixed in the middle of the base (101), a main shaft (106) is fixed on the output shaft of the motor 1 (102), the main shaft (106) is rotatably connected to a gantry (103), and the gantry (103) is fixed on the base (101).

5. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 4, characterized in that: An L-shaped frame (201) is fixed on the upper part of the main shaft (106), a sliding column (203) is slidably connected to the L-shaped frame (201) in the horizontal direction, a telescopic rod (202) is fixed on the L-shaped frame (201), and the movable end of the telescopic rod (202) is fixed to the end of the sliding column (203).

6. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 5, characterized in that: The end of the sliding column (203) is fixed to the middle of the horizontal column (204), the left and right ends of the horizontal column (204) are slidably connected with clamping pieces (205), the left and right ends of the horizontal column (204) are fixed with side pieces (206), the side pieces (206) are threadedly connected with pressing screws (207), and the two pressing screws (207) are respectively pressed on the outer sides of the two clamping pieces (205).

7. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 6, characterized in that: A bottom plate (501) is fixed to the left portion of the base (101), a cylinder (404) is fixed on the bottom plate (501), and a fastening screw (403) is threadedly connected to the cylinder (404).

8. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 7, characterized in that: The left and right ends of the bottom plate (501) are both fixed with brackets (503), each bracket (503) is slidably connected with a push-pull rod (504) in the front-back direction, the two brackets (503) are both fixed with telescopic rods (502), the movable ends of the two telescopic rods (502) are respectively fixed to the ends of the two push-pull rods (504), the rear parts of the two push-pull rods (504) are both fixed with round rods (506), a plurality of wire saws (507) are arranged from top to bottom, the two ends of each wire saw (507) are respectively inserted into the two round rods (506), and the two ends of each wire saw (507) are fixed with a stopper (505).

9. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 8, characterized in that: A half cylinder (401) is fixed on the upper side of the cylinder (404), and a plurality of cut-in grooves (402) are arranged on the half cylinder (401) from top to bottom.

10. A method for cutting silicon wafers for manufacturing photovoltaic panels, characterized in that: The following steps are involved: S1: clamping and fixing the single crystal silicon ingot; S2: inserting the single crystal silicon ingot into the inner circle of the inner circular saw (306), and processing a plurality of temporary grooves from top to bottom on the single crystal silicon ingot by the inner circular saw (306); S3: removing the single crystal silicon ingot and fixing it on the cylinder (404); S4: cutting a plurality of temporary grooves by using a plurality of wire saws (507) to cut the single crystal silicon ingot into silicon wafers.