Plating treatment method for improving packaging quality of microwave part

Abstract

The invention relates to the technical field of microwave part plating, and particularly discloses a plating treatment method for improving the packaging quality of a microwave part, and the plating treatment method specifically comprises the following steps: carrying out modulation by adopting a weakly alkaline treatment agent to form a treatment solution; heating and preserving heat of the treatment solution; the product obtained after chemical nickel plating is soaked in the heated treatment solution; and baking the microwave component at high temperature, and curing the treatment solution on the surface of the microwave component to form a film. On the premise of not changing a medium phosphorus nickel plating solution system and not changing an existing chemical nickel plating process, the service life of the plating solution is prolonged, and the scrapping cost of the plating solution is reduced; meanwhile, the phenomena of gold brittleness and gold layer solder flowing are avoided, partial local gold plating requirements are replaced, and the gold plating cost is reduced; the welding performance can be improved, welding flux on the surface of a nickel plating layer and an insulator hole is evenly and smoothly spread, and the one-time welding qualification rate is obviously increased; the product prepared by the method is well compatible with the micro-assembly process of other devices of the microwave cavity, and has no side effect on conductive adhesive flow cloth and solder flow cloth.

Description

Technical Field

[0001] The invention relates to the technical field of microwave component plating, and more particularly to a plating treatment method for improving the packaging quality of microwave components. Background Art

[0002] Microwave components are increasingly adopting secondary integration technology to meet the increasingly high requirements for miniaturization, lightweight and integration. More chips and devices are integrated in the microwave cavity, which involves complex micro-assembly processes such as soft soldering, conductive adhesive bonding, laser sealing, etc. These assemblies must be achieved on the coating.

[0003] Usually, the microwave cavity adopts the chemical nickel plating process, and welding and pasting are performed on the surface of the 8-10 micron nickel layer. Because the three-proof reliability of the chemical nickel plating layer must be taken into account, the industry basically chooses medium-phosphorus nickel (nickel content 6-9%). Although a certain content of phosphorus can effectively improve the corrosion resistance of the plating layer, it reduces the surface resistance of the plating layer and becomes a solder resistance factor, resulting in welding failure, rework and scrapping for a long time. The solderability problem of chemical nickel plating has become a major problem that troubles people in the industry;

[0004] The industry widely uses medium-phosphorus chemical nickel system because of its moderate wear resistance, corrosion resistance, hardness and magnetism. It cannot be replaced by low-phosphorus nickel in many applications, but the phosphorus content limits its weldability. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a plating treatment method for improving the packaging quality of microwave components;

[0006] The solution adopted by the present invention to solve the technical problem is:

[0007] A plating treatment method for improving the packaging quality of microwave components, specifically comprising the following steps:

[0008] A weak alkaline treatment agent is used for preparation to form a treatment solution;

[0009] Heating and keeping the processing solution warm;

[0010] The chemically nickel plated product is immersed in a heated treatment solution;

[0011] The microwave component is baked at high temperature, and the treatment solution is solidified into a film on the surface of the microwave component.

[0012] In some possible implementations, the weakly alkaline treatment agent is NI 315 water-based sealing agent.

[0013] In some possible implementations, the treatment solution includes water and a weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 4%-7%.

[0014] In some possible implementations, the insulation temperature is 45°C-55°C.

[0015] In some possible implementations, before the product is immersed in the heated treatment solution, the product is subjected to chemical nickel plating and water washing.

[0016] In some possible implementations, the product after chemical nickel plating is immersed in the heated treatment solution for 1 min to 5 min.

[0017] In some possible implementations, after the chemical nickel plating product is immersed, it is washed with deionized water; wherein the water conductivity is 0.5-10 μS / cm.

[0018] In some possible implementations, the high temperature baking temperature is 100±5° C., and the baking time is 10±1 min.

[0019] In some possible implementations, further baking, hydrogen removal or partial gold plating is performed after the film is solidified.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention prolongs the service life of the plating solution and reduces the scrapping cost of the plating solution without changing the medium-phosphorus nickel plating solution system or the existing chemical nickel plating process; at the same time, it avoids the phenomenon of gold brittleness and gold layer solder flow, replaces part of the local gold plating demand, and reduces the gold plating cost;

[0022] The present invention can improve welding performance, the solder on the surface of the nickel-plated layer and the insulator hole is spread evenly and smoothly, and the one-time welding pass rate is significantly improved;

[0023] The product prepared by the present invention is well compatible with the micro-assembly process of other components of the microwave cavity, and has no side effects on the conductive adhesive flow and solder flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a welding effect diagram after the microwave cavity is plated using the method of Example 2;

[0025] Figure 2 This is a diagram showing the welding effect of a microwave cavity after plating using the existing technology. DETAILED DESCRIPTION

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "one" and other similar words do not indicate a quantity restriction, but indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more. For example, multiple positioning columns refer to two or more positioning columns. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The present invention is described in detail below.

[0028] A plating treatment method for improving the packaging quality of microwave components, specifically comprising the following steps:

[0029] A weak alkaline treatment agent is used for modulation to form a treatment solution; the weak alkaline treatment agent is NI 315 water-based sealing agent; the treatment solution comprises water and the weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 4%-7%;

[0030] The present invention adopts NI 315 water-based sealant, which is mainly compatible with and non-corrosive to the substrate, chip and other devices of the microwave component, and can improve the welding performance of the nickel plating layer; at the same time, it does not contain strong corrosive chemicals such as strong acids and alkalis, cyanide, hydrofluoric acid, etc., and is mild to the environment and human body.

[0031] The treatment solution is heated and kept warm; the temperature of the warming is 45°C-55°C; thereby effectively improving the reaction activity so as to react quickly on the surface of the nickel layer and form a film layer;

[0032] The product is subjected to chemical nickel plating and water washing;

[0033] The chemically nickel-plated product is immersed in a heated treatment solution; the time for immersing the chemically nickel-plated product in the heated treatment solution is 1 min to 5 min;

[0034] The chemical nickel-plated product is immersed in a heated treatment solution to ensure that the molecular thickness of the film layer is 0.1 micron-0.3 micron, and is firmly laminated and bonded to the surface of the nickel layer. Since the chemical nickel layer has a higher porosity than other plating layers such as gold, silver, and chromate oxide films, this process also promotes the coverage and protection of the film layer on the pores of the nickel layer; deionized water is used for cleaning to avoid the deposition of magnesium ions and calcium ions in tap water that may cause discoloration of the product;

[0035] The microwave parts are baked at high temperature, and the treatment solution is solidified into a film on the surface of the chemically nickel-plated product; wherein, after the chemically nickel-plated product is impregnated, it is washed with deionized water; wherein the water conductivity is 0.5-10μS / cm; wherein the high temperature baking temperature is 100±5°C, and the baking time is 10±1min;

[0036] By adopting the high temperature baking, the formed film layer is dehydrated and polymerized on the surface of the nickel layer to generate macromolecular chains and stable groups, the chemical stability is further improved, and the damage to the nickel layer by moisture and oxidizing atmosphere is effectively prevented.

[0037] In some possible implementations, further baking, hydrogen removal or partial gold plating is performed after the film is solidified.

[0038] Embodiment 1:

[0039] A plating treatment method for improving the packaging quality of microwave components is applied to a microwave cavity and specifically comprises the following steps:

[0040] The treatment solution is prepared, wherein the treatment solution includes water and a weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 4%; after the preparation is completed, the treatment solution is kept warm at a temperature of 45°C.

[0041] The product is subjected to chemical nickel plating according to the chemical nickel plating process. The obtained chemical nickel-plated product is thoroughly washed with water and then immersed in the prepared treatment solution for 1 minute.

[0042] After impregnation, a protective film is formed on the surface of the chemical nickel layer; deionized water is used to wash away the reaction byproducts during the impregnation, wherein the conductivity of the deionized water is 5 μS / cm.

[0043] After washing with water, high-temperature baking is carried out at a temperature of 95° C. for 10 minutes to form a film.

[0044] After the post-processing is completed, baking, dehydrogenation or partial gold plating can be continued according to the original process requirements.

[0045] Embodiment 2:

[0046] A plating treatment method for improving the packaging quality of microwave components is applied to a microwave cavity and specifically comprises the following steps:

[0047] The treatment solution is prepared, wherein the treatment solution includes water and a weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 5%; after the preparation is completed, the treatment solution is kept warm at a temperature of 50°C.

[0048] The product is subjected to chemical nickel plating according to the chemical nickel plating process. The obtained chemical nickel plated product is fully washed with water and then immersed in the prepared treatment solution for 5 minutes to 5.5 minutes.

[0049] After impregnation, a protective film is formed on the surface of the chemical nickel layer; deionized water is used to wash away the reaction byproducts during the impregnation, wherein the conductivity of the deionized water is 7 μS / cm.

[0050] After washing with water, high-temperature baking is carried out at a temperature of 100° C. for 9 minutes to form a film.

[0051] After the post-processing is completed, baking, dehydrogenation or partial gold plating can be continued according to the original process requirements.

[0052] Embodiment 3:

[0053] A plating treatment method for improving the packaging quality of microwave components, specifically comprising the following steps:

[0054] The treatment solution is prepared, wherein the treatment solution includes water and a weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 7%; after the preparation is completed, the treatment solution is kept warm at a temperature of 52°C.

[0055] The product is subjected to chemical nickel plating according to the chemical nickel plating process. The obtained chemical nickel plated product is fully washed with water and then immersed in the prepared treatment solution for 5 minutes to 5.5 minutes.

[0056] After impregnation, a protective film is formed on the surface of the chemical nickel layer; deionized water is used to wash away the reaction byproducts during the impregnation, wherein the conductivity of the deionized water is 10 μS / cm.

[0057] After washing with water, high-temperature baking is carried out at a temperature of 105°C for 11 minutes to cure into a film.

[0058] After the post-processing is completed, baking, dehydrogenation or partial gold plating can be continued according to the original process requirements.

[0059] The microwave cavity of the product was processed by the prior art, Example 1, Example 2, and Example 3 respectively, and the results were as follows:

[0060]

[0061] Table 1

[0062] It can be seen from Table 1 that there is no difference in the results of the 96H neutral salt spray test and the 10-cycle alternating damp heat test. There is no difference in the results of the salt spray test and the damp heat test, which shows that the immersion treatment has no adverse effect on the three-proof performance of the chemical nickel layer; but the welding effect is better.

[0063] Products plated by the present invention can improve the solderability of Sn63Pb37 solder wire and medium-phosphorus chemical nickel layer, and are compatible with assembly processes such as soft soldering, conductive adhesive bonding, laser sealing, etc., such as controllable solder flow and conductive adhesive flow.

[0064] The present invention prolongs the service life of the plating solution from 7 days to 14 days without changing the medium-phosphorus nickel (nickel content 6-9%) plating solution system or the existing chemical nickel plating process, thereby reducing the cost of scrapping the plating solution; at the same time, the present invention avoids the gold brittleness and gold layer solder flow phenomena, replaces part of the local gold plating demand, and reduces the gold plating cost.

[0065] Combination Figure 1 , Figure 2 ,in Figure 1 This is a welding effect diagram after the microwave cavity is plated using the method of Example 2. Figure 1 The solder can wet well in all four insulator holes at one time; Figure 2 This is a diagram of the welding effect of a microwave cavity after plating using the existing technology; the solder does not wet in the four insulator holes, and there is no improvement after adding flux again.

[0066] The present invention is not limited to the above-mentioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A plating treatment method for improving the packaging quality of microwave components, characterized in that: The specific steps include: A weak alkaline treatment agent is used for preparation to form a treatment solution; Heating and keeping the processing solution warm; The chemically nickel plated product is immersed in a heated treatment solution; The microwave component is baked at high temperature, and the treatment solution is solidified into a film on the surface of the microwave component.

2. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: The weak alkaline treatment agent is NI 315 water-based sealing agent.

3. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: The treatment solution comprises water and a weak alkaline treatment agent, wherein the volume percentage of the weak alkaline treatment agent in the water is 4%-7%.

4. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: The insulation temperature is 45°C-55°C.

5. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: The product will also be electrolessly nickel plated and rinsed before being immersed in the heated treatment solution.

6. A plating treatment method for improving the packaging quality of microwave components according to claim 5, characterized in that: The product after chemical nickel plating is immersed in the heated treatment solution for 1 min to 5 min.

7. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: After the chemical nickel plating product is immersed, it is washed with deionized water; wherein the water conductivity is 0.5-10 μS / cm.

8. A plating treatment method for improving the packaging quality of microwave components according to claim 1, characterized in that: The high temperature baking temperature is 100±5℃ and the baking time is 10±1min.

9. A plating treatment method for improving the packaging quality of microwave components according to any one of claims 1 to 8, characterized in that: It also includes continued baking, dehydrogenation or partial gold plating after the film is solidified.

Images