Matrix circuit suitable for sensor array and sensor array

Abstract

The invention relates to a matrix circuit suitable for a sensor array and the sensor array, and the matrix circuit comprises a plurality of sensors, each sensor comprises a plurality of sensor assemblies, and the sensor assemblies are arranged at different positions of a sensor main body of the sensor and are used for collecting the sensing information of the positions; the wiring module comprises a plurality of row lines and a plurality of column lines, one group of row lines and one group of column lines form a primary matrix, each primary matrix forms a secondary matrix in the matrix circuit, one group of row lines comprises at least one row line, one group of column lines comprises at least one column line, and each sensor and each primary matrix are arranged correspondingly; the wiring terminals of the sensor assemblies of the sensors are connected to the row lines and the column lines of the corresponding first-level matrix. According to the embodiment of the invention, flexible wiring can be realized when the sensor with a plurality of sensor assemblies forms an array, the expandability is relatively high, and the number of leads can be reduced, so that the cost is saved, and the layout is optimized.

Description

Technical Field

[0001] The present disclosure relates to the field of sensor technology, and in particular to a matrix circuit suitable for a sensor array and a sensor array. Background Art

[0002] A three-axis force sensor is a sensor that can measure changes in force in three directions (usually the X-axis, Y-axis, and Z-axis) at the same time. Because it can provide multi-dimensional force information, and this multi-dimensional measurement capability is crucial for application scenarios that require a comprehensive understanding of the force conditions of an object, three-axis force sensors are widely used in many fields, such as robot grasping, medical rehabilitation equipment, etc. In addition, the design of the three-axis force sensor has been carefully optimized to achieve a high degree of integration. For example, by adopting advanced packaging technology and processes, the sensor can be closely integrated with components such as circuit boards and connecting wires to reduce the overall size and weight, so that the three-axis force sensor can be easily integrated into various devices, such as wearable devices, smart robots, etc.

[0003] In practical applications, multiple sensors are often arranged in an array to form a sensor array. Compared with a single sensor, a sensor array has an additional spatial dimension, which helps to estimate more parameters and improve the estimation performance. By utilizing the spatial relationship between sensors, as well as the mutual cooperation and mutual influence between multiple sensors, the sensor array can achieve multi-dimensional perception and processing of signals, thereby more accurately extracting signal features and information and improving signal perception and processing capabilities. In addition to performance improvements, the design of the sensor array enables the entire sensor system to remain in normal operation even when some sensors fail or are damaged, thereby improving the reliability of the entire system. This is especially important for systems that need to operate stably for a long time or work in high-risk environments.

[0004] Although sensor arrays are favored in many fields for their powerful signal sensing capabilities and high reliability, the complexity of their circuit layout has also become prominent, especially in the application of three-axis force sensors. The three-axis force sensor integrates multiple sensor components, which are carefully configured with their own specific directional sensitivity to achieve accurate monitoring of forces in three different directions.

[0005] However, this integrated design also brings great challenges in circuit layout. Each three-axis force sensor needs to lead out multiple wires, and in the array layout, the number of wires increases exponentially, which undoubtedly puts higher requirements on the design and implementation of the circuit layout.

[0006] How to achieve efficient, compact and reliable circuit layout while ensuring sensor performance has become a difficult problem that engineers must face and solve. Summary of the invention

[0007] According to one aspect of the present disclosure, a matrix circuit suitable for a sensor array is provided, the matrix circuit comprising:

[0008] A plurality of sensors, each sensor comprising a plurality of sensor components, each sensor component being arranged at a different position of a sensor body of the sensor for collecting sensing information at the position, wherein each sensor component comprises a group of wiring terminals;

[0009] The wiring module includes a plurality of row lines and a plurality of column lines, wherein a group of row lines and a group of column lines constitute a primary matrix in the matrix circuit, and each primary matrix is ​​arranged in a matrix to constitute a secondary matrix in the matrix circuit, wherein a group of row lines includes at least one row line, and a group of column lines includes at least one column line.

[0010] Among them, each sensor is respectively arranged corresponding to each primary matrix, and the connection terminals of each sensor component of each sensor are connected to the row lines and column lines of the corresponding primary matrix.

[0011] In a possible implementation, the sensor is a three-axis sensor, the sensor component is a resistance strain gauge, and each resistance strain gauge includes two connection terminals.

[0012] In a possible implementation, the sensor body of the three-axis sensor is a truncated cone, and eight first resistance strain gauges spaced 45° apart are arranged on the side of the truncated cone, and one second resistance strain gauge is arranged on the top surface of the truncated cone, wherein the second resistance strain gauge is used to correct the reading drift caused by temperature.

[0013] In a possible implementation, the number of each group of row lines and each group of column lines in the primary matrix is ​​3, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

[0014] In a possible implementation, the sensor body of the three-axis sensor is a truncated cone, and three third strain gauges are respectively arranged at 60°, 180° and 270° directions on the side of the truncated cone, and a fourth resistance strain gauge is arranged on the top surface of the truncated cone, wherein the fourth resistance strain gauge is used to correct the reading drift caused by temperature.

[0015] In a possible implementation, the number of each group of row lines and each group of column lines in the primary matrix is ​​2, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

[0016] In a possible implementation manner, the circuit further includes:

[0017] The computing module is connected to each row line and column line in the wiring module and is used for:

[0018] Acquire each sensor information of the sensors connected to each first-level matrix;

[0019] The sensing data of each sensor is determined according to each sensing information corresponding to each sensor.

[0020] In a possible implementation, the calculation module includes:

[0021] The array signal acquisition circuit is used to collect the electrical signals on each row line and column line to obtain the sensing information of each sensor connected to each primary matrix;

[0022] The calculation unit is connected to the array signal acquisition circuit and is used to determine the sensing data of each sensor according to the sensing information corresponding to each sensor.

[0023] In a possible implementation, the sensor is a flexible sensor, and each row line and column line is made of a flexible conductive material.

[0024] According to another aspect of an embodiment of the present disclosure, a sensor array is provided. The sensor array includes the matrix circuit applicable to the sensor array.

[0025] The embodiment of the present disclosure sets a wiring module including a plurality of row lines and a plurality of column lines. A group of row lines and a group of column lines constitute a primary matrix in the matrix circuit. The primary matrices are arranged in a matrix to constitute a secondary matrix in the matrix circuit. The sensors are respectively set corresponding to the primary matrices. The wiring terminals of the sensor components of the sensors are connected to the row lines and column lines of the corresponding primary matrix. This enables flexible wiring when sensors with multiple sensor components form an array. The embodiment has high scalability, can reduce the number of leads, thereby saving costs and optimizing layout. That is, the embodiment of the present disclosure can achieve an efficient, compact and reliable circuit layout while ensuring sensor performance.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and do not limit the present disclosure. Other features and aspects of the present disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and are used to illustrate the technical solutions of the present disclosure together with the specification.

[0028] Figure 1 A schematic diagram of a matrix circuit applicable to a sensor array according to an embodiment of the present disclosure is shown;

[0029] Figure 2 A schematic diagram of a three-axis sensor according to an embodiment of the present disclosure is shown;

[0030] Figure 3 The embodiment of the present disclosure is shown in FIG. Figure 2 Schematic diagram of the matrix layout of each sensor component in the three-axis force sensor;

[0031] Figure 4 A schematic diagram of a two-level matrix circuit layout of a three-axis force sensing array according to an embodiment of the present disclosure is shown;

[0032] Figure 5 A schematic diagram of another three-axis sensor according to an embodiment of the present disclosure is shown;

[0033] Figure 6 A schematic diagram of a two-level matrix circuit layout of a three-axis force sensing array according to an embodiment of the present disclosure is shown;

[0034] Figure 7 A schematic diagram of a matrix circuit suitable for a sensor array according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0035] Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0036] In the description of the present disclosure, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0039] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0040] The term "and / or" herein is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent the three situations that A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C can represent including any one or more elements selected from the set consisting of A, B, and C.

[0041] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present disclosure.

[0042] Currently, circuit layout methods for sensor arrays mainly include distributed circuit layout, modular circuit layout and matrix circuit layout.

[0043] Distributed circuit layout is to disperse the sensors and independently wire each sensor to connect it to the signal acquisition circuit. This layout scheme is the most direct, but it is only suitable for the case of a small number of sensors. As the number of sensors increases, the wiring will become extremely complicated. Each sensor requires an independent lead, which will cause a large number of lines to be intertwined, which not only increases the difficulty of wiring, but also may cause interference between lines and increase the failure rate. When there are a large number of sensors, the density and complexity of the lines will increase dramatically, limiting the density of the sensor array. In addition, for flexible sensors, too many dense wires will affect the flexibility of the substrate, causing the device to easily degrade or be damaged when deformed.

[0044] Modular circuit layout is to design multiple sensors as independent modules, each module has independent signal conditioning and communication functions, and these modules can communicate by wire or wireless means to form an expandable sensor network. This layout can improve the flexibility and scalability of the system and facilitate maintenance and upgrading. However, modular circuit layout may greatly increase the difficulty and cost of design and manufacturing. Specifically, each module needs to contain sensors, signal processing circuits and other necessary components, which determines the minimum size of the module. Therefore, when trying to arrange multiple modules closely to form a high-density array, the physical limitations between modules may make it difficult to further reduce the module spacing. In addition, modules in high-density arrays generate a lot of heat. If the heat dissipation design is not appropriate, it may cause the module to overheat, affecting the performance and life of the sensor. Due to the small spacing between modules in the modular layout, heat dissipation design becomes more difficult.

[0045] The matrix layout can overcome the defects of the modular layout. However, the conventional matrix layout cannot flexibly route sensors with multiple sensor components and has poor scalability.

[0046] See also Figure 1 , Figure 1 A schematic diagram of a matrix circuit suitable for a sensor array according to an embodiment of the present disclosure is shown.

[0047] like Figure 1 As shown, the matrix circuit includes:

[0048] A plurality of sensors S100, each sensor S100 comprises a plurality of sensor components, each sensor component is arranged at a different position of a sensor body of the sensor S100, and is used to collect sensor information at the position, wherein each sensor component comprises a group of wiring terminals;

[0049] The wiring module 10 includes a plurality of row lines (row lines A, B, C, D, etc.) and a plurality of column lines (column lines 1, 2, 3, etc.), a group of row lines and a group of column lines constitute a primary matrix 110 in the matrix circuit, and each primary matrix 110 is arranged in a matrix to constitute a secondary matrix 120 in the matrix circuit, wherein a group of row lines includes at least one row line, and a group of column lines includes at least one column line.

[0050] Among them, each sensor S100 is respectively arranged corresponding to each primary matrix, and the connection terminals of each sensor component of each sensor S100 are connected to the row lines and column lines of the corresponding primary matrix 110.

[0051] In the embodiment of the present disclosure, a wiring module 10 is provided to include a plurality of row lines and a plurality of column lines. A group of row lines and a group of column lines constitute a primary matrix 110 in the matrix circuit. The primary matrices 110 are arranged in a matrix to constitute a secondary matrix 120 in the matrix circuit. The sensors S100 are respectively provided corresponding to the primary matrices. The wiring terminals of the sensor components of the sensors S100 are connected to the row lines and column lines of the corresponding primary matrix 110. This enables flexible wiring of the sensors S100 having a plurality of sensor components to form an array. The arrangement has high scalability, can reduce the number of leads, thereby saving costs and optimizing the layout.

[0052] The embodiment of the present disclosure, from the sensor component to the sensor S100, and then to the arrayed hierarchical wiring structure, can efficiently and reasonably meet the wiring requirements of the sensor S100 having multiple sensor components, and at the same time perfectly integrate with the configuration of the sensor S100 having multiple sensor components, providing a more flexible and adaptable circuit layout option for the array of the sensor S100 having multiple sensor components. It can be seen that the embodiment of the present disclosure can achieve an efficient, compact and reliable circuit layout while ensuring the sensor performance.

[0053] The wiring module 10 of the disclosed embodiment adopts a matrix circuit layout, arranging the sensors S100 and the wiring (row lines, column lines) in rows and columns to form a structure similar to a matrix, and the wiring between the sensors S100 is arranged according to the connection relationship between the rows and columns. The matrix circuit layout can effectively reduce the number of leads required, because the signals of each sensor unit (sensor S100 or each sensor component of the sensor S100) can be read by the method of row and column selection without the need for a separate lead for each sensor unit. In addition, regardless of the number of sensors S100, the matrix layout can provide a clear and orderly layout solution, and therefore has good scalability.

[0054] Furthermore, the embodiment of the present disclosure can be adapted to a sensor S100 having multiple sensor components including a three-axis force sensor by configuring the wiring module 10 to be in the form of a primary matrix 110 and a secondary matrix 120. In this way, each sensor component can output force information in different directions through the row lines and column lines of the corresponding primary matrix 110.

[0055] The embodiments of the present disclosure do not limit the specific number of lead lines in each group of row lines and each group of column lines. The number of lead lines in each group of row lines and each group of column lines may be the same or different. Those skilled in the art may set the number according to actual conditions and needs. For example, the number of lead lines in each group of row lines and each group of column lines may be N, where N is a positive integer.

[0056] The present application does not limit the specific arrangement of row lines, column lines, and sensors. For example, row lines and column lines can be located in their respective layers, and the layers are insulated from each other, so that the row lines and column lines intersect each other in space, but are electrically insulated from each other. The area where a group of row lines and a group of column lines intersect constitutes a primary matrix. Each sensor can be set in another layer that is insulated from the layer where the row lines and column lines are located, and the spatial position corresponds to the primary matrix. The sensor can be connected to the corresponding row line or column line in the primary matrix by means of through holes or the like.

[0057] Of course, the disclosed embodiment does not limit the specific type of the sensor S100 having multiple sensor components, and those skilled in the art can set it according to actual conditions and needs. For example, in one possible implementation, the sensor S100 is a three-axis sensor (for example, a three-axis force sensor), and the sensor component is a resistance strain gauge (also referred to as a strain gauge or a strain gauge), each of which includes two terminals, wherein the resistance strain gauge is an element for measuring strain, which can convert the change of strain on a mechanical component into a change of resistance. The disclosed embodiment does not limit the form of the resistance strain gauge, and those skilled in the art can set it according to actual conditions and needs. For example, a wire type and a foil type can be selected as needed.

[0058] The disclosed embodiment fully considers the characteristics that the sensor S100 including multiple sensor components, such as (three-axis force sensor), requires multiple sensor components to work together and requires multi-line connection. The disclosed embodiment adopts a hierarchical wiring structure from sensor components to three-axis force sensors and then to arrays, which can efficiently and reasonably meet the wiring requirements of three-axis force sensors and perfectly integrate with the configuration of three-dimensional force sensor S100. This innovative layout method provides a more flexible and adaptable circuit layout option for the array of three-axis force sensors, surpassing the limitations of traditional simple matrix circuit layout.

[0059] It should be noted that Figure 1An example is shown in which the number of leads of the row lines and column lines is N and N is 3, but the embodiments of the present disclosure are not limited thereto, and those skilled in the art may set the number of leads of the row lines and column lines or the size of N according to actual conditions and needs.

[0060] For example, Figure 1 As shown, three row lines and three column lines form a group, and each group of row lines and column lines constitutes a primary matrix 110 in the circuit. All primary matrices 110 further constitute a secondary matrix 120.

[0061] See also Figure 2 , Figure 2 A schematic diagram of a three-axis sensor according to an embodiment of the present disclosure is shown.

[0062] In a possible implementation, Figure 2 As shown, the sensor body of the three-axis sensor is a truncated cone, and 8 first resistance strain gauges arranged at intervals of 45° are arranged on the side of the truncated cone, and 1 second resistance strain gauge is arranged on the top surface of the truncated cone, wherein the second resistance strain gauge is used to correct the reading drift caused by temperature.

[0063] Illustratively, the embodiments of the present disclosure can measure the axial strain of the side wall of the measured structure through each first resistance strain gauge. By analyzing the readings of these eight first resistance strain gauges, the distribution of the axial strain of the measured structure along the circumferential direction can be obtained, and the second resistance strain gauge can be used to correct the reading drift caused by temperature. Of course, the embodiments of the present disclosure do not limit the specific implementation method of using a three-axis sensor to perform force detection on the measured structure, and those skilled in the art can refer to relevant technical implementations according to actual conditions and needs.

[0064] For example, the distribution of the axial strain of the measured structure along the circumferential direction reflects the force deformation of the measured structure. By collecting the common mode signals of the eight first resistance strain gauges on the Z axis and their differential mode signals on the X axis and the Y axis, the forces in three directions on the measured structure can be obtained. Because the side wall of the three-axis sensor includes a total of eight first resistance strain gauges, and the eight first resistance strain gauges are arranged at intervals of 45° on the side of the truncated cone, the embodiment of the present disclosure can effectively reduce the error. Therefore, the three-axis sensor proposed in the embodiment of the present disclosure has a high accuracy in the magnitude and direction of the shear force.

[0065] Since the measurement results of the resistance strain gauge will be affected by temperature, a second resistance strain gauge is additionally provided at the center of the upper surface where the measured structure does not deform as a temperature compensation gauge to correct the reading drift caused by temperature. In this way, the three-axis sensor of the embodiment of the present disclosure can further improve the accuracy of force magnitude and direction detection.

[0066] It should be understood that in the embodiments of the present disclosure, the sensor body of the three-axis sensor is preferably in the shape of a truncated cone. However, the embodiments of the present disclosure do not limit the specific shape of the three-axis sensor, and those skilled in the art can set it according to actual conditions and needs.

[0067] In a possible implementation, the number of each group of row lines and each group of column lines in the primary matrix 110 is 3, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

[0068] See also Figure 3 , Figure 3 The embodiment of the present disclosure is shown in FIG. Figure 2 Schematic diagram of the matrix layout of the various sensor components in the three-axis force sensor.

[0069] For example, Figure 3 As shown in FIG. 1 , the nine resistance strain gauges (including eight first resistance strain gauges and one second resistance strain gauge) in the three-axis force sensor are connected in a 3×3 matrix layout. The nine resistance strain gauges are connected between three row lines numbered A, B, and C and three column lines numbered 1, 2, and 3, respectively.

[0070] In one example, if Figure 3 As shown, in the embodiment of the present disclosure, one terminal of the top three first resistance strain gauges is connected to the row line A, and the other terminal is connected to the column line 1, column line 2, and column line 3 respectively. Therefore, the top three first resistance strain gauges correspond to addresses A1, A2, and A3 in the addressing space, that is, the top three first resistance strain gauges can be uniquely identified through A1, A2, and A3, and the corresponding sensing parameters can be obtained.

[0071] In one example, if Figure 3 As shown, in the embodiment of the present disclosure, one terminal of the two first resistance strain gauges (the first resistance strain gauge and the third resistance strain gauge on the row line B) is connected to the row line B, and the other terminal is connected to the column line 1 and the column line 3 respectively. Therefore, the two first resistance strain gauges in the middle have corresponding addresses B1 and B3 in the addressing space, that is, the two first resistance strain gauges in the middle can be uniquely identified through B1 and B3, and the corresponding sensing parameters can be obtained.

[0072] In one example, if Figure 3As shown, in the embodiment of the present disclosure, one terminal of the bottom three first resistance strain gauges is connected to the row line C, and the other terminal is connected to the column line 1, column line 2, and column line 3 respectively. Therefore, the bottom three first resistance strain gauges correspond to addresses C1, C2, and C3 in the addressing space, that is, the bottom three first resistance strain gauges can be uniquely identified through C1, C2, and C3, and the corresponding sensing parameters can be obtained.

[0073] In one example, if Figure 3 As shown, in the embodiment of the present disclosure, one terminal of the second resistance strain gauge (the middle resistance strain gauge on the row line B) is connected to the row line B, and the other terminal is respectively connected to the column line 2. Therefore, the second resistance strain gauge corresponds to address B2 in the addressing space, that is, the second resistance strain gauge can be uniquely identified through B2, and the corresponding sensing parameters can be obtained.

[0074] It can be seen that for Figure 3 The three-axis force sensor shown has an addressing space size of 9 rows and columns, where addresses A1, A2, A3, B1, B3, C1, C2, and C3 correspond to the eight strain gauges on the eight-arm structure, respectively, and address B2 corresponds to the second resistance strain gauge (temperature compensation gauge). Through this matrix layout, the embodiment of the present disclosure improves the adaptability of the wiring module 10 and each sensor component in the three-axis force sensor, realizes flexible wiring, and optimizes the layout.

[0075] Figure 3 The 3×3 matrix layout shown is suitable for connecting a single three-axis force sensor. For a sensor array composed of multiple force sensors S100, it is only necessary to use the 3×3 matrix as the first-level layout and expand the second-level layout on this basis to realize arraying.

[0076] See also Figure 4 , Figure 4 A schematic diagram of a two-stage matrix 120 circuit layout of a three-axis force sensing array according to an embodiment of the present disclosure is shown.

[0077] For example, Figure 4 As shown, the layout can arrange L×M triaxial force sensors in the row and column directions, where L and M are both positive integers. For this array, only 3L row lines and 3M column lines need to be set to read the resistance value of each resistance strain gauge on each triaxial sensor.

[0078] Of course, the three-axis sensor may also be implemented in other ways, and the corresponding wiring module 10 may also be adjusted according to actual conditions.

[0079] See also Figure 5 , Figure 5 A schematic diagram of another three-axis sensor according to an embodiment of the present disclosure is shown.

[0080] In a possible implementation, Figure 5 As shown, the sensor body of the three-axis sensor is a truncated cone, and three third strain gauges are respectively arranged at 60°, 180° and 270° directions on the side of the truncated cone, and a fourth resistance strain gauge is arranged on the top surface of the truncated cone, wherein the fourth resistance strain gauge is used to correct the reading drift caused by temperature.

[0081] Illustratively, the embodiments of the present disclosure can measure the axial strain of the side wall of the measured structure through each third resistance strain gauge. By analyzing the readings of these three third resistance strain gauges, the distribution of the axial strain of the measured structure along the circumferential direction can be obtained, and the fourth resistance strain gauge can be used to correct the reading drift caused by temperature. Of course, the embodiments of the present disclosure do not limit the specific implementation method of using a three-axis sensor to perform force detection on the measured structure, and those skilled in the art can refer to relevant technical implementations according to actual conditions and needs.

[0082] Since the measurement results of the resistance strain gauge will be affected by temperature, a fourth resistance strain gauge is additionally provided at the center of the upper surface where the measured structure does not deform as a temperature compensation gauge to correct the reading drift caused by temperature. In this way, the three-axis sensor of the embodiment of the present disclosure can further improve the accuracy of force magnitude and direction detection.

[0083] See also Figure 6 , Figure 6 A schematic diagram of a two-stage matrix 120 circuit layout of a three-axis force sensing array according to an embodiment of the present disclosure is shown.

[0084] In a possible implementation, the number of each group of row lines and each group of column lines in the primary matrix 110 is 2, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

[0085] For example, Figure 6 As shown, the four resistance strain gauges (including three third resistance strain gauges and one fourth resistance strain gauge) in the three-axis force sensor are connected in a 2×2 matrix layout. The four resistance strain gauges are connected between the three row lines numbered A and B and the three column lines numbered 1 and 2, respectively.

[0086] for Figure 6 The specific connection relationship between the three-axis force sensor and the row and column lines is not described in detail here, and those skilled in the art can set it according to actual conditions and needs.

[0087] It can be seen that for Figure 6The three-axis force sensor shown has a row and column addressing space size of 4, which may include addresses A1, A2, B1, and B2. The specific correspondence between each address and three third resistance strain gauges and one fourth resistance strain gauge is not limited here, and those skilled in the art may set it according to actual conditions and needs. Through this matrix layout, the embodiment of the present disclosure improves the adaptability of the wiring module 10 and each sensor component in the three-axis force sensor, realizes flexible wiring, and optimizes the layout.

[0088] See also Figure 7 , Figure 7 A schematic diagram of a matrix circuit suitable for a sensor array according to an embodiment of the present disclosure is shown.

[0089] In a possible implementation, Figure 7 As shown, the circuit may further include:

[0090] The calculation module 20 is connected to each row line and column line in the wiring module 10 and is used for:

[0091] Acquire each sensing information of the sensors S100 connected to each primary matrix 110;

[0092] The sensing data of each sensor S100 is determined according to each sensing information corresponding to each sensor S100.

[0093] The disclosed embodiment obtains the sensing information of each sensor S100 connected to each primary matrix 110 through the computing module 20, and determines the sensing data of each sensor S100 according to the sensing information corresponding to each sensor S100, so as to realize accurate and rapid determination of the force magnitude and direction of the measured structure.

[0094] Of course, the embodiment of the present disclosure does not limit the specific implementation of the calculation module 20, and those skilled in the art can set it according to actual conditions and needs. For example, in a possible implementation, the calculation module 20 may include:

[0095] An array signal acquisition circuit is used to collect electrical signals on each row line and column line to obtain sensing information of each sensor S100 connected to each primary matrix 110;

[0096] The calculation unit is connected to the array signal acquisition circuit and is used to determine the sensing data of each sensor S100 according to each sensing information corresponding to each sensor S100.

[0097] The embodiments of the present disclosure do not limit the specific type and implementation method of the array signal acquisition circuit. Those skilled in the art can set it according to actual conditions and needs. For example, the array signal acquisition circuit can adopt a circuit that can eliminate crosstalk, such as a zero potential method ZPM circuit. In this way, the embodiments of the present disclosure can use the array signal acquisition circuit to read the resistance value of each resistance strain gauge, and then calculate the force in the three-axis directions exerted on the measured structure.

[0098] Of course, the specific implementation of the computing unit is not limited in the embodiments of the present disclosure, and those skilled in the art can adopt relevant technologies to implement it according to actual conditions and needs. For example, the computing unit may include a processing component, wherein the processing component includes but is not limited to a separate processor, or a discrete component, or a combination of a processor and a discrete component. The processor may include a controller having an execution instruction function in an electronic device, and the processor may be implemented in any appropriate manner, for example, by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components. Inside the processor, the executable instructions may be executed by hardware circuits such as logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers.

[0099] The embodiment of the present disclosure does not limit the specific implementation method of determining the sensing data of each sensor S100 according to each sensing information corresponding to each sensor S100. Those skilled in the art may refer to relevant technical implementations according to actual conditions and needs.

[0100] In a possible implementation manner, the sensor S100 is a flexible sensor S100, and each row line and column line is made of a flexible conductive material.

[0101] Among them, the flexible sensor S100 can be made of flexible materials, which is not limited in the embodiments of the present disclosure. The flexible conductive materials can include metal-based flexible conductive materials, polymer-based flexible conductive materials, nano-composite flexible conductive materials, etc. Those skilled in the art can choose according to actual conditions and needs.

[0102] The method is not limited to the two specific cases mentioned. For other arrays of sensors S100 including multiple sensor components, the layout method can be easily applied thereto with only slight adjustments.

[0103] If the number of sensor components included in the force sensor S100 does not fill up the addressing space, a portion of the addressing space may be selectively discarded.

[0104] The advantages and effects of the sensor assembly of the embodiment of the present disclosure compared to the prior art are explained from the technical level and the application level respectively.

[0105] (1) Technical level:

[0106] The traditional matrix circuit layout method is only applicable to simple sensor arrays, and is not applicable to arrays of complex sensors such as the three-axis force sensor S100 that include multiple sensor components.

[0107] The disclosed embodiment expands the traditional matrix circuit layout method into a matrix circuit layout with a secondary structure, which can not only seamlessly integrate with the configuration of the complex sensor S100, but also provide a more flexible and adaptable circuit layout option for the array of three-axis force sensing, surpassing the traditional simple matrix circuit layout.

[0108] (2) Application level:

[0109] The disclosed embodiments provide a more flexible and adaptable layout method for a three-axis force sensor array circuit.

[0110] This innovative design can be applied to the field of flexible electronics, enabling it to have a higher array density while ensuring flexibility, thereby having a better spatial resolution and being able to more accurately capture subtle changes in the surrounding environment. Therefore, the disclosed embodiments will promote the application and development of three-axis force sensing arrays in cutting-edge fields such as human-computer interaction and soft robots.

[0111] Of course, the application scenarios of the matrix circuit and sensor array for sensor array of the embodiment of the present disclosure include but are not limited to aerospace, robots, automobiles, medicine, smart phones and mobile devices, industrial automation, logistics systems, etc. For example, in aerospace, in the inertial measurement system of a spacecraft, the matrix circuit and sensor array for sensor array of the embodiment of the present disclosure can be used to measure the tilt angle of an object; in the balance posture detection of a robot, the matrix circuit and sensor array for sensor array of the embodiment of the present disclosure can detect comprehensive motion information, help the robot maintain stability and perform precise movements; the matrix circuit and sensor array for sensor array of the embodiment of the present disclosure can be used in body safety systems (such as airbags, ABS anti-lock braking systems, electronic stability programs, etc.), vehicle stability control systems, and navigation systems, for detecting various types of data. The matrix circuit and sensor array for sensor array of the embodiment of the present disclosure can also be used to monitor human body movement and fitness activities, such as the three-axis acceleration sensor S100 in sports bracelets and smart watches can record steps, calculate calorie consumption, etc. The matrix circuit for sensor array and sensor array of the embodiment of the present disclosure can also be used in smart phones and mobile devices for functions such as automatic horizontal screen switching, shaking gesture control, motion detection, etc., to provide an intelligent user experience; the matrix circuit for sensor array and sensor array of the embodiment of the present disclosure can also be used in industrial automation and logistics systems to predict equipment failures and repair needs by monitoring the vibration and acceleration changes of machinery and equipment, thereby achieving more efficient equipment operation and maintenance.

[0112] Of course, the above introduction is not restrictive. In fact, the matrix circuit and sensor array for the sensor array of the embodiment of the present disclosure can be applied to various scenarios that require sensors S100 (such as three-axis sensors) that include multiple sensor components. Those skilled in the art can set them according to actual conditions and needs.

[0113] The two-level matrix 120 circuit layout method proposed in the embodiment of the present disclosure expands the traditional matrix circuit layout so that it can be applied to a sensor array composed of a sensor S100 including a plurality of sensor components.

[0114] This layout method has good scalability, and no matter how many sensor components the sensor S100 includes, a matrix layout can be achieved through this method.

[0115] This approach minimizes the number of wires required for the sensor array, maximizing the density of the sensor array.

[0116] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A matrix circuit suitable for a sensor array, characterized in that: The matrix circuit comprises: A plurality of sensors, each sensor comprising a plurality of sensor components, each sensor component being arranged at a different position of a sensor body of the sensor for collecting sensing information at the position, wherein each sensor component comprises a group of wiring terminals; The wiring module includes a plurality of row lines and a plurality of column lines, wherein a group of row lines and a group of column lines constitute a primary matrix in the matrix circuit, and each primary matrix is ​​arranged in a matrix to constitute a secondary matrix in the matrix circuit, wherein a group of row lines includes at least one row line, and a group of column lines includes at least one column line, Among them, each sensor is respectively arranged corresponding to each primary matrix, and the connection terminals of each sensor component of each sensor are connected to the row lines and column lines of the corresponding primary matrix.

2. The circuit according to claim 1, characterized in that The sensor is a three-axis sensor, the sensor component is a resistance strain gauge, and each resistance strain gauge includes two wiring terminals.

3. The circuit according to claim 2, characterized in that The sensor body of the three-axis sensor is a truncated cone, and 8 first resistance strain gauges arranged at intervals of 45° are arranged on the side of the truncated cone, and 1 second resistance strain gauge is arranged on the top surface of the truncated cone, wherein the second resistance strain gauge is used to correct the reading drift caused by temperature.

4. The circuit according to claim 3, characterized in that The number of each group of row lines and each group of column lines in the primary matrix is ​​3, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

5. The circuit according to claim 2, characterized in that The sensor body of the three-axis sensor is a truncated cone, and three third strain gauges are respectively arranged at 60°, 180° and 270° directions on the side of the truncated cone, and a fourth resistance strain gauge is arranged on the top surface of the truncated cone, wherein the fourth resistance strain gauge is used to correct the reading drift caused by temperature.

6. The circuit according to claim 5, characterized in that The number of each group of row lines and each group of column lines in the primary matrix is ​​2, the first terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the row lines in the group, the second terminal of each resistance strain gauge in the three-axis sensor is connected to any one of the column lines in the group, and the row and column line combinations connected to each resistance strain gauge are different.

7. The circuit according to claim 1, characterized in that The circuit further comprises: The computing module is connected to each row line and column line in the wiring module and is used for: Acquire each sensor information of the sensors connected to each first-level matrix; The sensing data of each sensor is determined according to each sensing information corresponding to each sensor.

8. The circuit according to claim 7, characterized in that The calculation module comprises: The array signal acquisition circuit is used to collect the electrical signals on each row line and column line to obtain the sensing information of each sensor connected to each primary matrix; The calculation unit is connected to the array signal acquisition circuit and is used to determine the sensing data of each sensor according to the sensing information corresponding to each sensor.

9. The circuit according to claim 1, characterized in that The sensor is a flexible sensor, and each row line and column line is made of a flexible conductive material.

10. A sensor array, characterized in that: The sensor array comprises a matrix circuit suitable for a sensor array as claimed in any one of claims 1 to 9.

Images