High-temperature CIS probe card preparation device and preparation method

Abstract

The invention discloses a high-temperature CIS probe card preparation device and method, and belongs to the technical field of probe card preparation devices.The preparation device comprises a base, the base is provided with an installation area, and the installation area is suitable for positioning a detection part; the plurality of supporting tables are arranged around at least part of the periphery of the mounting position and are suitable for supporting the connecting parts of the corresponding probes; the positioning disc is arranged above the plurality of supporting tables and is suitable for being bonded with the connecting parts of the plurality of probes, the positioning disc is provided with a first positioning part, the base and / or the supporting tables are / is provided with a second positioning part, and the first positioning part is matched with the second positioning part; a base plate is provided with a fixing part, and the fixing part is matched with a positioning disc to fix the positioning disc on the base plate. According to the preparation device designed by the invention, each probe can be ensured to be quickly and accurately mounted at a preset position, and the production efficiency and the manufacturing precision of the probe card are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of probe card preparation devices, and in particular relates to a high-temperature CIS probe card preparation device and a preparation method. Background Art

[0002] In the related art, the probe card is an important tool for semiconductor testing, which is mainly used to perform electrical performance tests on chips in wafer-level testing. The probe card is usually composed of a substrate and multiple probes. The probes are used to contact test points on the wafer to detect the functions and performance of the chip. In the prior art, after the operator electrically welds the multiple probes to the substrate, the operator needs to manually adjust the position of the detection part of the probe to ensure that the probe card can accurately test the wafer. However, the above method will result in low production efficiency of the probe card and it is difficult to guarantee the production quality of the probe card. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a high-temperature CIS probe card preparation device. The high-temperature CIS probe card preparation device designed according to the present invention can ensure that each probe can be quickly and accurately installed in its predetermined position, thereby improving the production efficiency and manufacturing accuracy of the probe card.

[0004] The present invention also provides a preparation method for the high-temperature CIS probe card preparation device.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] The present invention provides a high-temperature CIS probe card preparation device, comprising: a base, the base is provided with an installation area, the installation area is suitable for positioning the detection parts of multiple probes; multiple support tables, the multiple support tables are arranged around at least part of the periphery of the installation position, one support table corresponds to multiple probes, and the support table is suitable for supporting the connection parts of the corresponding probes; a positioning plate, the positioning plate is arranged above the multiple support tables, the positioning plate is suitable for bonding with the connection parts of the multiple probes, the positioning plate is provided with a first positioning part, the base and / or the support table is provided with a second positioning part, the first positioning part cooperates with the second positioning part to position the positioning plate on the base; wherein the substrate is provided with a fixing part, the fixing part cooperates with the positioning plate to fix the positioning plate to the substrate.

[0007] According to the high-temperature CIS probe card preparation device of the present invention, its installation area can position the detection parts of multiple probes, and the first positioning part cooperates with the second positioning part to position the positioning plate on the base, so that after the positioning plate is bonded to the multiple probes, the detection parts of the multiple probes are accurately positioned relative to the positioning plate. At the same time, the positioning plate cooperates with the fixing part of the substrate, so that the positioning plate can be accurately connected to the substrate. Therefore, the above-mentioned arrangement can make the detection parts of the multiple probes accurately positioned relative to the substrate, that is, the above-mentioned arrangement can ensure that each probe can be accurately installed at its predetermined position, thereby improving the manufacturing accuracy of the probe card and enhancing the structural stability of the probe card. In particular, in a high-temperature environment, the probe can still ensure its position relative to the substrate, avoiding the probe from being offset in the length direction and / or width direction, thereby ensuring the stability and accuracy of the wafer test. Of course, the above-mentioned arrangement can also reduce errors caused by manual operation (during manual operation, the operator needs to adjust the position of the detection part of each probe relative to the substrate, which is inefficient and has large errors), thereby improving the production efficiency and quality of the probe card.

[0008] Further, the base includes: a plate body, on which the installation area is provided, and a receiving groove is provided in the installation area; a fixing plate, which covers the installation area and is provided with a plurality of limiting holes, and the projections of the plurality of limiting holes in the height direction are located in the receiving groove, and the plurality of limiting holes are respectively suitable for cooperating with the detection part of the corresponding probe to position the detection part.

[0009] Furthermore, a first positioning groove is provided in the installation area, and the fixing plate is provided with a second positioning groove corresponding to the first positioning groove; wherein the preparation device also includes: a positioning member, the positioning member passes through the second positioning groove and cooperates with the first positioning groove to position the fixing plate in the installation area.

[0010] Further, one of the first positioning portion and the second positioning portion is configured as a first positioning hole, and the other of the first positioning portion and the second positioning portion is configured as a first positioning pin.

[0011] Furthermore, the support platform is provided with a support surface for supporting the connection part, and at least a part of the support surface is suitable for coating with resin, and the resin is suitable for bonding the connection parts of the plurality of probes.

[0012] Furthermore, it also includes: a tape layer, wherein the tape layer is arranged between the support surface and the plurality of probes, and the side of the tape layer facing the probes is suitable for coating with resin.

[0013] Furthermore, the base is provided with a plurality of installation areas, and the plurality of installation areas are arranged at intervals in the length direction and / or the width direction, and each of the installation areas corresponds to one positioning plate and a plurality of the support platforms.

[0014] Furthermore, the base is provided with a plurality of second positioning pins, which are spaced apart along the outer periphery of the base, and the substrate is provided with second positioning holes corresponding to the plurality of second positioning pins one by one, and the second positioning pins are received in the second positioning holes to position the substrate and the base.

[0015] The following briefly describes the method for preparing a CIS probe card according to the present invention.

[0016] The preparation method according to the present invention is applied to a preparation device of any one of the above embodiments, and the preparation method includes: positioning the detection parts of multiple probes in the installation area, and supporting the connecting parts of the multiple probes on the support table; applying resin on at least a portion of the support table to bond the connecting parts of the multiple probes; arranging a positioning plate above the multiple probes, and applying resin for a second time to bond the multiple probes to the positioning plate; positioning the plate and the fixing part to fix the positioning plate to the substrate.

[0017] Other advantages, objectives and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art may be taught from the practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration:

[0019] Figure 1 A top view of the preparation device of the present invention;

[0020] Figure 2 It is a partial structural schematic diagram of the preparation device of the present invention;

[0021] Figure 3 It is an exploded view of the cooperation between the preparation device of the present invention and the probe card.

[0022] The following are marked in the accompanying drawings:

[0023] 1. Preparation device; 2. Substrate;

[0024] 10. base; 11. plate; 111. receiving groove; 112. first positioning groove; 12. fixing plate; 121. limiting hole; 122. second positioning groove; 13. second positioning pin;

[0025] 20. support platform; 21. tape layer;

[0026] 30. Positioning plate; 40. Fixing hole. DETAILED DESCRIPTION

[0027] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0028] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to one of ordinary skill in the art that these specific details are not necessarily employed to practice the present invention. In other instances, well-known structures, circuits, materials, or methods are not specifically described in order to avoid obscuring the present invention.

[0029] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. In addition, it will be appreciated by those of ordinary skill in the art that the figures provided herein are for illustrative purposes and that the figures are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] In the description of the present invention, it should be understood that the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the scope of protection of the present invention.

[0031] Embodiment 1:

[0032] like Figure 1-Figure 3As shown, the present invention provides a high-temperature CIS probe card preparation device 1, including: a base 10, a plurality of support platforms 20 and a positioning plate 30, the base 10 is provided with an installation area, the installation area is suitable for positioning the detection parts of a plurality of probes, a plurality of support platforms 20 are arranged around at least part of the periphery of the installation position, one support platform 20 corresponds to a plurality of probes, the support platform 20 is suitable for supporting the connection parts of the corresponding probes, the positioning plate 30 is arranged above the plurality of support platforms 20, the positioning plate 30 is suitable for bonding with the connection parts of the plurality of probes, the positioning plate 30 is provided with a first positioning part, the base 10 and / or the support platform 20 is provided with a second positioning part, the first positioning part cooperates with the second positioning part to position the positioning plate 30 on the base 10; wherein the substrate 2 is provided with a fixing part, the fixing part cooperates with the positioning plate 30 to fix the positioning plate 30 to the substrate 2.

[0033] In some embodiments, the base 10 is provided with a mounting surface, a mounting area is provided in the mounting surface, and a plurality of support platforms 20 are provided at intervals on the periphery of the mounting area. It should be noted that the shape of the mounting area can be square, circular, triangular or other geometric shapes, which is not limited here. Of course, the number of support platforms 20 can be 2, 3, 4 or more, which is also not limited here.

[0034] When the shape of the mounting area is square and there are two support platforms 20, the two support platforms 20 are respectively arranged at both ends of the mounting area in the length direction or the width direction, and the multiple probes are divided into two parts, and the two parts of the probes correspond to the two support platforms 20 respectively.

[0035] Therefore, the base 10 is the basic component of the entire device. An installation area is set on the base 10, and the installation area is used to position the detection parts of multiple probes to achieve precise control of the positions of the multiple probes and ensure the accuracy of the multiple probes in subsequent operations; each support platform 20 is responsible for supporting the corresponding connecting parts of the multiple probes to ensure that the multiple probes will not shift during the installation process, thereby ensuring the stability of the probes; the positioning plate 30 is located above the support platform 20 and is bonded to the connecting part of the probe.

[0036] A first positioning portion is provided on the positioning disk 30, and a second positioning portion is provided on the base 10 and / or the support platform 20. The cooperation between the first positioning portion and the second positioning portion enables the positioning disk 30 to be accurately positioned on the base 10, thereby further ensuring the accuracy of the probe position; a fixing portion is provided on the substrate 2, and this fixing portion cooperates with the positioning disk 30 to finally fix the positioning disk 30 on the substrate 2.

[0037] It can be understood that, during installation, the detection parts of the multiple probes are first fixed to the installation area respectively, and the connection parts of the multiple probes are supported on the corresponding support platforms 20 respectively. Then, the operator can cooperate the first positioning part of the positioning plate 30 with the second positioning part on the base 10 and / or the support platform 20 to position the positioning plate 30 on the base 10. At this time, the positioning plate 30 is located above the two support platforms 20 and contacts with the multiple probes. Then, the operator can apply resin to make the positioning plate 30 bond with the multiple probes. At this time, the operator can make the positioning plate 30 cooperate with the fixing part on the substrate 2 to position the positioning plate 30 on the substrate 2.

[0038] It should be noted that the detection parts of the multiple probes are positioned at preset positions by the mounting area, and the first positioning part cooperates with the second positioning part to position the positioning plate 30 on the base 10. Therefore, after the multiple probes are bonded to the positioning plate 30, the detection parts of the multiple probes are accurately positioned relative to the positioning plate 30. Moreover, since the positioning plate 30 cooperates with the fixing part to position the positioning plate 30 on the substrate 2, the detection parts of the multiple probes are accurately positioned relative to the substrate 2.

[0039] It is worth noting that after the positioning plate 30 is matched with the fixing part of the substrate 2, the operator needs to operate each probe, that is, the operator will weld the end of the connecting part of the probe away from the detection part to the installation point on the substrate 2 to achieve electrical connection between multiple probes and the substrate 2 respectively.

[0040] Preferably, after the positioning plate 30 and the plurality of probes are bonded, the operator can bake the positioning plate 30 and the plurality of probes at high temperature to improve the connection stability between the positioning plate 30 and the plurality of probes. Of course, the fixing portion can be configured as a fixing hole 40. After the positioning plate 30 is received in the fixing hole 40, the operator can apply resin again to bond the outer peripheral wall of the positioning plate 30 to the inner peripheral wall of the fixing hole 40.

[0041] According to the high-temperature CIS probe card preparation device 1 of the present invention, its installation area can position the detection parts of multiple probes, and the first positioning part cooperates with the second positioning part to position the positioning plate 30 on the base 10, so that after the positioning plate 30 is bonded to the multiple probes, the detection parts of the multiple probes are accurately positioned relative to the positioning plate 30. At the same time, the positioning plate 30 cooperates with the fixing part of the substrate 2, so that the positioning plate 30 can be accurately connected to the substrate 2. Therefore, through the above-mentioned arrangement, the detection parts of the multiple probes can be accurately positioned relative to the substrate 2, that is, through the above-mentioned arrangement, it can be ensured that each probe can be accurately installed in its predetermined position, thereby improving the manufacturing accuracy of the probe card and enhancing the structural stability of the probe card. In particular, in a high-temperature environment, the probe can still ensure its own position relative to the substrate 2, avoiding the probe from being offset in the length direction and / or width direction, thereby ensuring the stability and accuracy of the wafer test. Of course, through the above-mentioned arrangement, the error caused by manual operation can also be reduced (during manual operation, the operator needs to adjust the position of the detection part of each probe relative to the substrate 2, which is inefficient and has large errors), thereby improving the production efficiency and quality of the probe card.

[0042] Embodiment 2:

[0043] In this embodiment, based on the first embodiment, the base 10 includes: a plate body 11 and a fixing plate 12, the plate body 11 is provided with an installation area, the installation area is provided with a receiving groove 111, the fixing plate 12 covers the installation area, a plurality of limiting holes 121 are provided on the fixing plate 12, the projections of the plurality of limiting holes 121 in the height direction are located in the receiving groove 111, and the plurality of limiting holes 121 are respectively suitable for cooperating with the detection part of the corresponding probe to position the detection part.

[0044] In some embodiments, an installation area is provided on the plate body 11, and a receiving groove 111 is provided in the installation area. The receiving groove 111 is used to accommodate the detection part of the probe, that is, the receiving groove 111 helps to provide a certain space during the positioning process; the fixing plate 12 covers the installation area, and a plurality of limiting holes 121 are provided on the fixing plate 12, and the projections of the plurality of limiting holes 121 in the height direction are located in the receiving groove 111, that is, the positions of these positioning holes match the detection part of the probe in the receiving groove 111, and each limiting hole 121 is suitable for cooperating with the detection part of the corresponding probe to achieve precise positioning of the detection part.

[0045] It can be understood that the inner wall of the limiting hole 121 is suitable for limiting the outer wall of the detection part so as to fix the position of the detection part in the horizontal direction. Of course, the surface of the fixing plate 12 can contact with at least part of the connecting part to further limit the vertical position of the detection part. In this way, it can be ensured that the detection part of each probe can be accurately placed in the predetermined position.

[0046] Therefore, through the combination of the receiving groove 111 and the positioning hole on the fixing plate 12, high-precision positioning of the probe detection part can be achieved, ensuring that the position of each probe is very accurate; and the fixing plate 12 not only helps with positioning, but also increases the stability of the probe during installation and reduces displacement caused by external factors; of course, through the pre-set receiving groove 111 and positioning hole, the time and complexity of manual adjustment are reduced, and the production efficiency of the probe card is improved; at the same time, because the position of each probe is strictly controlled, the quality consistency of the produced probe cards is higher, and the defective rate of the probe cards is reduced.

[0047] It is worth mentioning that different types of probe cards have different numbers and arrangements of probes. Therefore, the present application can produce a variety of different types of fixing plates 12, and by replacing the fixing plates 12 to achieve the production of different types of probe cards, the applicability of the preparation device 1 of the present application is improved.

[0048] According to some embodiments of the present invention, a first positioning groove 112 is further provided in the installation area, and the fixing plate 12 is provided with a second positioning groove 122 corresponding to the first positioning groove 112; wherein the preparation device 1 also includes: a positioning member, the positioning member passes through the second positioning groove 122 and cooperates with the first positioning groove 112 to position the fixing plate 12 in the installation area.

[0049] It can be understood that the first positioning groove 112 is located in the installation area, the second positioning groove 122 is located on the fixing plate 12, and the positioning member passes through the second positioning groove 122 on the fixing plate 12 and cooperates with the first positioning groove 112 in the installation area, so that the fixing plate 12 can be firmly positioned on the installation area, thereby ensuring that the limiting hole 121 on the fixing plate 12 can be accurately positioned on the base 10, thereby ensuring that the detection part of the probe can be accurately positioned on the base.

[0050] According to some embodiments of the present invention, one of the first positioning portion and the second positioning portion is configured as a first positioning hole, and the other of the first positioning portion and the second positioning portion is configured as a first positioning pin.

[0051] In some embodiments, the first positioning portion is configured as a first positioning hole. In this case, a first positioning hole is provided on the positioning plate 30, and a first positioning pin is provided on the base 10 and / or the support platform 20. The first positioning pin is received in the first positioning hole to position the positioning plate 30 on the base 10; in other embodiments, the first positioning portion is configured as a first positioning pin. In this case, a first positioning pin is provided on the positioning plate 30, and a first positioning hole is provided on the base 10 and / or the support platform 20. The first positioning pin is received in the first positioning hole to position the positioning plate 30 on the base 10.

[0052] Embodiment three:

[0053] In this embodiment, based on the second embodiment, the support platform 20 is provided with a support surface for supporting the connection part, and at least a part of the support surface is suitable for coating with resin, and the resin is suitable for bonding the connection parts of the plurality of probes.

[0054] It is understandable that the design of the support surface is to ensure that the connection parts of the probes can be stably supported during the installation process to avoid the probes from being deflected due to gravity or other external forces. The resin is applied to the support surface so that the connection parts of the probes can be bonded together. After the resin is cured, the connection parts of multiple probes can be fixed on a plane, so that the multiple probes form a whole, which enhances the structural stability of the multiple probes.

[0055] Therefore, the present application provides stable support through the supporting surface, ensuring that the probe connecting part will not be displaced during the installation process, thereby improving the stability of the entire probe card; the use of resin enables the connecting parts of multiple probes to be firmly bonded together to form an integral structure, thereby enhancing the structural strength of multiple probes, especially in a high temperature environment, the bonding force of the resin can ensure that the multiple probes will not be displaced relative to the substrate 2, thereby maintaining the integrity of the probe card.

[0056] At the same time, the resin coating process is relatively simple. In this way, the bonding of the probe connection part can be quickly achieved, which reduces complicated operation steps and improves the production efficiency of the probe card. Of course, through resin bonding, the quality consistency of the probe card in the manufacturing process can be ensured, reducing the failure rate caused by weak bonding.

[0057] Preferably, after the operator applies the resin to bond the connection parts of the plurality of probes, the operator may use high-temperature baking to accelerate the curing of the resin, so as to improve the production efficiency of the probe card.

[0058] According to some embodiments of the present invention, the preparation device 1 further comprises: a tape layer 21, the tape layer 21 is disposed between the support surface and the plurality of probes, and the side of the tape layer 21 facing the probes is suitable for coating with resin.

[0059] It can be understood that the tape layer 21 is located between the support surface of the support surface and the probe, and plays the role of isolation and auxiliary bonding; of course, the side of the tape layer 21 facing the probe is suitable for coating with resin, so as to ensure that the resin is evenly distributed between the probe connecting part and the support surface, thereby enhancing the bonding effect; moreover, the tape layer 21 can avoid direct contact between the resin and the support surface, and the tearable nature of the tape layer 21 can avoid the resin from firmly bonding the probe to the support table 20, that is, the tape layer 21 can facilitate the probe to be separated from the preparation device 1, thereby improving the production efficiency of the probe card; at the same time, the tape layer 21 can also protect the support surface from resin contamination or other damage, thereby extending the service life of the support table 20.

[0060] Preferably, a painting area is provided on the support surface, the painting area is provided close to the installation area, and a tape layer 21 is provided between the painting area and the probe. Thus, through the above arrangement, the end of the connecting part of the probe away from the detection part can be prevented from being fixed by resin, and the operator can avoid the difficulty of welding the connecting part and the installation point due to the end of the connecting part away from the detection part being unable to move when welding the connecting part to the installation point on the substrate 2.

[0061] Embodiment 4:

[0062] In this embodiment, based on the first embodiment, the base 10 is provided with a plurality of installation areas, and the plurality of installation areas are arranged at intervals in the length direction and / or the width direction, and each installation area corresponds to a positioning plate 30 and a plurality of support platforms 20 .

[0063] It can be understood that a positioning plate 30 and the corresponding multiple probes are together constructed as a probe assembly. Therefore, through the above-mentioned setting, the preparation device 1 of the present application can simultaneously position and prepare multiple probe assemblies, and the multiple fixing parts on the substrate 2 can cooperate with the multiple probe assemblies at the same time, so as to realize the simultaneous fixing of multiple probe assemblies to the substrate 2, thereby improving the production efficiency of the probe card.

[0064] According to some embodiments of the present invention, the base 10 is provided with a plurality of second positioning pins 13, and the plurality of second positioning pins 13 are distributed at intervals along the outer periphery of the base 10, and the substrate 2 is provided with second positioning holes corresponding one by one to the plurality of second positioning pins 13, and the second positioning pins 13 are received in the second positioning holes to position the substrate 2 and the base 10.

[0065] It can be understood that the multiple second positioning pins 13 are respectively received in the corresponding second positioning holes to realize the positioning of the substrate 2 relative to the base 10. At this time, sliding the substrate 2 in the height direction can make the multiple positioning plates 30 respectively received in the corresponding fixing holes 40. Then, the operator applies resin to fix the multiple positioning plates 30 to the substrate 2. Therefore, through the above-mentioned arrangement, the multiple probe assemblies can be quickly fixed to the substrate 2, and the multiple probe assemblies can be ensured to be positioned at the position of the substrate 2, thereby improving the production efficiency of the probe card.

[0066] In some embodiments, the base 10 is provided with a plurality of through holes penetrating in the thickness direction (the thickness direction is parallel to the height direction), and the preparation device 1 also includes a separation rod, which can be inserted into the through hole. Thus, after the plurality of positioning plates 30 are fixed to the substrate 2, the operator can insert the separation rod into the through hole and stop it with the substrate 2. Then the operator can control the separation rod to move toward the substrate 2 to move the substrate 2 away from the base 10 until the tape layer 21 is detached. At this time, the probe card is detached from the preparation device 1.

[0067] Embodiment five:

[0068] The present invention provides a method for preparing a CIS probe card, which is applied to the preparation device 1 described in any one of the above embodiments, and the preparation method includes: positioning the detection parts of multiple probes in the installation area, and supporting the connecting parts of the multiple probes on the support platform 20; applying resin on at least a portion of the support platform 20 to bond the connecting parts of the multiple probes; arranging a positioning plate 30 above the multiple probes, and applying resin for a second time to bond the multiple probes to the positioning plate 30; positioning the plate 30 and the fixing part to fix the positioning plate 30 to the substrate 2.

[0069] It can be understood that after the detection parts of the multiple probes are positioned in the installation area, the connection parts of the multiple probes are supported on the corresponding support platform 20 respectively, and then, resin is applied to at least part of the support platform 20, and the resin can connect the connection parts of the multiple probes on the support platform 20. Then, the positioning plate 30 is placed above the multiple probes, and the resin is continued to be applied, and the resin can bond the positioning plate 30 with the probes on the multiple support platforms 20. At this time, the substrate 2 is set above the positioning plate 30, and the positioning plate 30 is matched with the fixing part of the substrate 2. Therefore, through the above arrangement, multiple probes can be quickly and accurately installed on the substrate 2, which improves the production efficiency and production quality of the probe card.

[0070] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A high-temperature CIS probe card preparation device, the CIS probe card comprising a substrate (2) and a plurality of probes, each probe comprising a detection portion and a connection portion, wherein an angle is formed between the detection portion and the connection portion, wherein: The preparation device comprises: A base (10), the base (10) being provided with a mounting area, the mounting area being suitable for positioning detection parts of a plurality of the probes; A plurality of support platforms (20), wherein the plurality of support platforms (20) are arranged around at least a portion of the periphery of the mounting position, one support platform (20) corresponds to a plurality of probes, and the support platform (20) is suitable for supporting the connection parts of the corresponding probes; A positioning plate (30), the positioning plate (30) is arranged above the plurality of support platforms (20), the positioning plate (30) is suitable for bonding with the connecting parts of the plurality of probes, the positioning plate (30) is provided with a first positioning part, the base (10) and / or the support platform (20) is provided with a second positioning part, the first positioning part cooperates with the second positioning part to position the positioning plate (30) on the base (10); wherein The base plate (2) is provided with a fixing portion, and the fixing portion cooperates with the positioning plate (30) to fix the positioning plate (30) to the base plate (2).

2. The high temperature CIS probe card preparation device according to claim 1, characterized in that: The base (10) comprises: A plate body (11), wherein the plate body (11) is provided with the installation area, and a receiving groove (111) is provided in the installation area; A fixing plate (12), the fixing plate (12) covers the installation area, a plurality of limiting holes (121) are provided on the fixing plate (12), the projections of the plurality of limiting holes (121) in the height direction are located in the receiving groove (111), and the plurality of limiting holes (121) are respectively suitable for cooperating with the detection parts of the corresponding probes to position the detection parts.

3. The high temperature CIS probe card preparation device according to claim 2, characterized in that: A first positioning groove (112) is also provided in the installation area, and the fixing plate (12) is provided with a second positioning groove (122) corresponding to the first positioning groove (112); in The preparation device further comprises: a positioning member, which passes through the second positioning groove (122) and cooperates with the first positioning groove (112) to position the fixing plate (12) in the installation area.

4. The high temperature CIS probe card preparation device according to claim 3, characterized in that: One of the first positioning portion and the second positioning portion is configured as a first positioning hole, and the other of the first positioning portion and the second positioning portion is configured as a first positioning pin.

5. The high temperature CIS probe card preparation device according to claim 4, characterized in that: The support platform (20) is provided with a support surface for supporting the connection part, and at least a part of the support surface is suitable for coating with resin, and the resin is suitable for bonding the connection parts of a plurality of probes.

6. The high temperature CIS probe card preparation device according to claim 5, characterized in that: Also includes: An adhesive tape layer (21), the adhesive tape layer (21) being arranged between the support surface and the plurality of probes, and the side of the adhesive tape layer (21) facing the probes being suitable for being coated with resin.

7. The high temperature CIS probe card preparation device according to claim 1, characterized in that: The base (10) is provided with a plurality of installation areas, the plurality of installation areas are arranged at intervals in the length direction and / or the width direction, and each of the installation areas corresponds to a positioning plate (30) and a plurality of support platforms (20).

8. The high temperature CIS probe card preparation device according to claim 7, characterized in that: The base (10) is provided with a plurality of second positioning pins (13), and the plurality of second positioning pins (13) are spaced apart along the outer periphery of the base (10); the substrate (2) is provided with second positioning holes corresponding to the plurality of second positioning pins (13) one by one; the second positioning pins (13) are received in the second positioning holes to position the substrate (2) and the base (10).

9. A method for preparing a CIS probe card, the method being applied to the preparation device according to any one of claims 1 to 8, characterized in that: include: The installation area positions the detection parts of the plurality of probes, and supports the connection parts of the plurality of probes on the support platform (20); Applying resin to at least a portion of the support platform (20) to bond the connection parts of the plurality of probes; The positioning plate (30) is arranged above the plurality of probes, and resin is applied for a second time to allow the plurality of probes to be bonded to the positioning plate (30); The positioning plate (30) and the fixing portion are used to fix the positioning plate (30) to the substrate (2).

Images