Semiconductor test probe card management method and management system

Abstract

The invention discloses a management method and a management system for semiconductor test probe cards. The management method in one embodiment comprises the following steps: creating a second probe card on a second platform according to a first probe card received from a first platform; configuring the second probe card to a preset test port; using the second probe card to test the semiconductor device to be tested according to a preset test process; and taking out the second probe card from the test port, and generating use data of the second probe card according to the test data of the semiconductor device to be tested. According to the management method provided by the invention, the second probe card is created on the second platform according to the first probe card of the first platform, the second probe card is subjected to on-machine, test and off-machine use management through the second platform, and the use data of the second probe card is generated according to the test data of the semiconductor device to be tested, so that the management efficiency of the probe card is effectively improved; the practical application value is realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technology, and in particular to a management method and management system for a semiconductor testing probe card. Background Art

[0002] In the semiconductor and pan-semiconductor industries, probe card process management is a crucial system link. In MES (Manufacturing Execution System), probe cards are often developed as a separate module. The current traditional probe card management solution has formulated the establishment, issuance, use and maintenance operations of probe card information, which can meet the management of probe cards in simple production execution processes, but it is too dependent on the management and maintenance of production personnel. Especially for the semiconductor industry, which requires more sophistication, traditional management solutions lack flexibility and cannot meet the needs of the semiconductor industry with a high degree of customization.

[0003] Therefore, those skilled in the art urgently need to solve the problem of how to efficiently manage probe cards. Summary of the invention

[0004] In order to solve at least one of the above problems, a first embodiment of the present invention provides a management method for a semiconductor test probe card, comprising:

[0005] Creating a second probe card on a second platform based on the received first probe card from the first platform;

[0006] configuring the second probe card to a preset test port;

[0007] Using the second probe card to test the semiconductor device to be tested according to a preset test process;

[0008] The second probe card is taken out from the test port, and usage data of the second probe card is generated according to test data of the semiconductor device to be tested.

[0009] For example, in the management method provided in some embodiments of the present application, before creating the second probe card on the second platform according to the received first probe card from the first platform, the management method further includes:

[0010] Establishing a first probe card on a first platform, wherein the first probe card includes first information, wherein the first information includes a probe card identifier, probe card parameters, and a probe card production specification formed according to the probe card parameters;

[0011] The first probe card is published in response to the received user operation, and the first probe card is sent to the second platform.

[0012] For example, in the management method provided in some embodiments of the present application, the management method further includes:

[0013] Generate upgrade specifications or clone specifications according to the probe card production specifications.

[0014] For example, in the management method provided in some embodiments of the present application, the second probe card includes second information corresponding to the first information one by one, and the second information includes a probe card identifier, probe card parameters, and probe card production specifications;

[0015] After taking out the second probe card from the test port and generating usage data of the second probe card according to the test data of the semiconductor device to be tested, the management method further includes:

[0016] Detecting the test accuracy of the second probe card according to preset detection parameters;

[0017] Maintaining the second probe card according to the test accuracy and a preset probe card maintenance process and generating a maintenance result;

[0018] The probe card parameters of the second information are updated according to the usage data and the maintenance result.

[0019] For example, in the management method provided in some embodiments of the present application, the probe card parameters of the second information include usage duration, number of uses, and usage status;

[0020] After updating the probe card parameters of the second information according to the usage data and the maintenance result, the management method further includes:

[0021] When the usage time of the second probe card is greater than a preset probe card usage time threshold and the number of times the second probe card is used is greater than a preset probe card usage number threshold, the usage status is updated in response to a received user operation.

[0022] For example, in the management method provided in some embodiments of the present application, the management method further includes: when the usage status is normal use, returning the second probe card to a preset storage area.

[0023] For example, in the management method provided in some embodiments of the present application, the management method further includes: when the usage status is scrapped, configuring the second probe card to a preset scrap area.

[0024] For example, in the management method provided in some embodiments of the present application, when the usage time of the second probe card is greater than a preset probe card usage time threshold and the number of times the second probe card is used is greater than a preset probe card usage number threshold, after updating the usage status in response to a received user operation, the management method further includes:

[0025] The first information is updated according to the second information.

[0026] For example, in the management method provided in some embodiments of the present application, after creating a second probe card on the second platform according to the first probe card received from the first platform, and before configuring the second probe card to a preset test port, the management method further includes:

[0027] The second probe card is taken out from a preset storage area.

[0028] A second embodiment of the present invention provides a semiconductor device management system, including a first platform and a second platform, wherein the second platform includes a creation unit, a loading unit, a testing unit and a unloading unit, wherein

[0029] The creation unit is configured to create a second probe card on the second platform according to the first probe card received from the first platform;

[0030] The on-board unit is configured to configure the second probe card to a preset test port;

[0031] The testing unit is configured to use the second probe card to test the semiconductor device to be tested according to a preset testing process;

[0032] The unloading unit is configured to take out the second probe card from the test port and generate usage data of the second probe card according to test data of the semiconductor device to be tested.

[0033] A third embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon. When the program is executed by a processor, the method described in the first embodiment is implemented.

[0034] A fourth embodiment of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method described in the first embodiment when executing the program.

[0035] The beneficial effects of the present invention are as follows:

[0036] In view of the existing problems, the present invention develops a management method and management system for semiconductor test probe cards, by creating a second probe card on a second platform based on a first probe card on a first platform, managing the use of the second probe card during loading, testing and unloading through the second platform, and generating usage data of the second probe card based on test data of the semiconductor device to be tested during the test process. In particular, the first probe card is updated based on the usage data of the second probe card, thereby utilizing the production data of the second platform as the basis for probe card management, thereby realizing closed-loop management of the entire life cycle of the probe card by the first platform, effectively improving the management efficiency of the probe card, thereby making up for the problems existing in the prior art and having practical application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 A flowchart showing a method for managing a semiconductor test probe card according to an embodiment of the present invention;

[0039] Figure 2 A schematic diagram showing the structure of a semiconductor device management system according to an embodiment of the present invention is shown;

[0040] Figure 3 A swim lane diagram showing the interaction between the first platform and the second platform according to an embodiment of the present invention;

[0041] Figure 4 A schematic structural diagram of a computer device according to another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0042] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0043] In view of the above situation, if Figure 1 As shown, one embodiment of the present invention provides a method for managing a semiconductor test probe card, comprising:

[0044] Creating a second probe card on a second platform based on the received first probe card from the first platform;

[0045] configuring the second probe card to a preset test port;

[0046] Using the second probe card to test the semiconductor device to be tested according to a preset test process;

[0047] The second probe card is taken out from the test port, and usage data of the second probe card is generated according to test data of the semiconductor device to be tested.

[0048] In this embodiment, efficient management of the probe card is achieved through the first platform and the second platform, wherein the first platform is a management platform for managing the probe card, managing the entire life cycle of the probe card, including the entire process of creating, using and scrapping the probe card; the probe card includes its own information, such as a probe card identifier that can uniquely identify the probe card, probe card parameters including information such as probe card type, needle length, needle diameter, and production specifications that can be performed according to the probe card parameters, such as test scenarios and test items that can be performed by the probe card, etc. The second platform of this embodiment is a production operation platform for semiconductor products, which is used to manage the entire production process of semiconductor products, such as production step management of semiconductor products, test management during the production process, etc. For example, by receiving the first probe card of the first platform, a second probe card for testing is created on the second platform, and the second probe card is controlled to perform various tests on the intermediate stage of the semiconductor product during the production process to achieve test management of the second probe card.

[0049] In this embodiment, the first probe card of the first platform is first used to create the second probe card on the second platform, for example, the first probe card is imported into the second platform to complete the creation of the second probe card, and then the second platform is used to control the on-board operation, test operation and off-board operation of the second probe card during the test process, for example, the second probe card is placed on the corresponding test port by the mechanical arm of the second platform, the semiconductor product intermediate stage is tested according to the preset test process, and the second probe card is taken out by the mechanical arm after the test to complete the off-board operation, and finally the use data of the second probe card is generated using the test data of the second platform. That is, this embodiment distinguishes the management and use of the probe card through the first platform and the second platform, and on the basis of ensuring the management of the probe card life cycle by the first platform and the management of the semiconductor product production process by the second platform, the effective management of the probe card is achieved through the data coupling of the first platform and the second platform. In other words, this embodiment creates a second probe card on the second platform based on the first probe card on the first platform, controls the second probe card for testing during the production process through the second platform, and then generates usage data of the second probe card based on the test data of the semiconductor device to be tested, thereby avoiding the problem of excessive reliance on production personnel in the traditional management process of probe cards, effectively reducing labor costs, and avoiding the impact of human errors on the production of semiconductor products, thereby improving the management efficiency of probe cards and improving the production efficiency and production yield of semiconductor products.

[0050] To further illustrate the specific management method of this embodiment, the life cycle management of a probe card is taken as an example. Figure 2 The semiconductor device management system shown in the figure includes a first platform and a second platform, wherein the first platform is a management platform for managing probe cards, managing the entire life cycle of the probe cards; the second platform is a production operation platform for semiconductor products, used to manage the entire production process of semiconductor products. Figure 3 As shown, the specific steps include:

[0051] S1. Create and publish the first probe card on the first platform.

[0052] In this embodiment, firstly, a first probe card is created on a first platform as a management platform for managing probe cards. The first probe card is an electronic probe card and includes first information, which is convenient for synchronous management on the management platform. Each electronic probe card corresponds to a physical probe card. The first information includes a probe card identifier of the physical probe card, probe card parameters, and probe card production specifications formed according to the probe card parameters. Among them, the probe card identifier uniquely represents a physical probe card, the probe card parameters include physical information such as the type, needle length, needle diameter, and service life of the physical probe card, and the probe card production specifications include the test scenarios and test items of different semiconductor devices that can be tested by the physical probe card. For example, a vertical probe card of the type of MEMS sensor, with a needle length of 5-6mm and a needle diameter of 45-60μm, can be widely used in test scenarios for testing semiconductor devices such as mobile phone application processors and vehicle-mounted RF front-end chips. The production specifications of the probe card are formed according to the probe card parameters, such as current carrying capacity and minimum spacing indicators, which are respectively for high and low temperature test items and high-precision test items. For example, when the semiconductor device to be tested needs to be tested for its stability in a high temperature environment for a long time, it is necessary to use a probe card with a higher current carrying capacity production specification to test the semiconductor device middleware that has been formed, so as to determine whether the semiconductor device to be tested meets the production requirements and is a good product. At this time, a probe card suitable for testing can be selected based on the probe card parameters and probe card production specifications of the probe card, so as to achieve the purpose of testing the semiconductor device middleware using a probe card suitable for the test scenario and test items, thereby improving production efficiency and improving the yield rate of semiconductor device production.

[0053] Specifically, when creating the first probe card, the user can choose to create it by manual import, such as importing the edited probe card parameters into the first platform to generate first information with a unique probe card identifier and corresponding probe card production specifications; considering that a large number of identical probe cards are used for testing during the production process, the user can choose to create it by batch creation, such as manually entering various parameters of the same batch of probe cards on the first platform to batch generate first information with different probe card identifiers that correspond one-to-one to the physical probe cards.

[0054] Considering that there may be erroneous operations in the process of creating the probe card, in order to prevent erroneous probe card information from affecting the production process of semiconductor devices, in an optional embodiment, a first probe card is released in response to a received user operation.

[0055] In this embodiment, after the electronic first probe card is created on the first platform, in order to avoid errors caused by misoperation, the user is required to check the first information and release it to the production environment after manual review and confirmation, for example, setting the usage status of the first probe card to be usable.

[0056] It should be noted that when a user finds that there is a problem with the first information and needs to edit it, in order to avoid multiple users operating on the first information of a probe card at the same time, when a user edits a first probe card, the state of the first probe card is set to the editing state, thereby avoiding erroneous operations caused by multiple people editing at the same time. At the same time, after the first probe card is released, the first probe card enters a frozen state. In the frozen state, the first probe card cannot be modified or deleted, nor can the first information of the first probe card be modified or deleted, thereby avoiding the tampering and deletion of the released first probe card. That is, by creating and managing the first probe card on the first platform, this implementation can avoid production losses caused by incorrect probe card information.

[0057] Considering different testing requirements of different customers for semiconductor devices, in an optional embodiment, the management method further includes:

[0058] Generate upgrade specifications or clone specifications according to the probe card production specifications.

[0059] In this embodiment, based on the first probe card that has been created and reviewed, an upgrade operation is performed based on the existing first probe card according to different test requirements. For example, on the basis of the first probe card, probe card parameters are copied and edited, and probe card parameters are configured more flexibly to form different probe card parameters and probe card production specifications. For example, a first probe card with upgraded specifications is formed for different semiconductor device test requirements. Specifically, for example, when the test requirements of a certain semiconductor device are increased, the production specifications of the original are copied and increased on this basis. After the increase, it is manually reviewed and confirmed to be correct and then released to the production environment, which is the upgraded specification. At the same time, the original production specification is withdrawn from the production environment; or a new version of the first probe card is copied based on the first probe card that has been created and reviewed, that is, a first probe card with a cloned specification is formed, thereby further forming a first probe card with a wider range of applications. Specifically, for example, when the test requirements of a newly added customer are consistent with the test requirements of an existing semiconductor device, cloned specifications are formed by copying for the testing of the semiconductor device of the newly added customer. Furthermore, during the upgrade operation and the cloning operation, those skilled in the art should understand that the use of the first probe card with different version specifications can be achieved by setting the use status of the first probe card and through manual review by the user.

[0060] S2. Sending the first probe card to the second platform.

[0061] S3. Create a second probe card based on the first probe card.

[0062] In this embodiment, in response to a received user operation, such as triggering a creation operation according to a user operation, or triggering a creation operation when a trigger condition set by a program is satisfied, a second probe card is created on a second platform according to a first probe card received from a first platform, and the second probe card is used by a production operation platform to control and manage the production and testing process of semiconductor devices, so as to realize automated management in the production process. The creation of the second probe card can be realized by importing the first probe card, for example, the user completes the creation by manually adding the first probe card or batch importing the first probe card on the second platform. Specifically, the second probe card includes second information corresponding to the first information one by one, and the second information includes a probe card identifier, probe card parameters, and probe card production specifications, that is, the first information of the first probe card is copied to the second information of the second probe card.

[0063] S4. Take out the second probe card and configure it to the preset test port.

[0064] In this embodiment, the storage position and test position of the physical probe card corresponding to the second probe card are configured to facilitate the completion of the test preparation. For example, the second probe card is first taken out from the pre-set storage area. Taking into account the storage limitations of the probe card, the physical probe card is usually stored in a nitrogen cabinet under specified humidity conditions. For example, the second information stores a specific storage area and storage position. The physical probe card is taken out according to the user's operation, and the physical probe card is taken out and configured to the test port pre-set in the test step of the production operation platform by means of, for example, a robotic arm, to complete the on-machine operation before the test. When the physical probe card is taken out, the state of the second probe card on the second platform also changes immediately, and the removal record of the second probe card is also immediately recorded on the second platform, such as the tester who took it out, so as to facilitate the use of the second probe card.

[0065] It is worth noting that the second information can be further set to limit the rules and permissions for obtaining the physical probe card, for example, different physical probe cards correspond to different testers, etc., to further facilitate the management of different physical probe cards.

[0066] S5. Use the second probe card to test the semiconductor device to be tested according to a preset test process.

[0067] In this embodiment, for example, the production operation platform controls the semiconductor devices and various testing tools, performs test operations on the intermediate stages of the production of semiconductor devices, such as transferring the semi-finished semiconductor devices to the test port, controlling the physical probe card to perform tests on the semi-finished semiconductor devices, such as testing wafers, and storing the test data on the second platform.

[0068] S6. Taking out the second probe card from the test port, and generating usage data of the second probe card according to the test data of the semiconductor device to be tested.

[0069] In this embodiment, after the test is completed, according to the control of the second platform, for example, the robot arm is controlled to take out the second probe card from the test port, that is, the decommissioning operation after the test is completed. Part of the test data stored on the second platform, for example, the test data related to the second probe card is used as the usage data of the second probe card, such as what type of wafer is tested, the test duration and the number of tests, such as the number of times the second probe card contacts the wafer, etc., are all used as the usage data of the second probe card.

[0070] It is worth noting that after the second probe card of this embodiment is taken out from the test port, it is necessary to put the second probe card back into a preset storage area, such as returning the second probe card to a nitrogen cabinet under specified humidity conditions. When the physical probe card is returned, the state of the second probe card on the second platform also changes immediately, and the return record of the second probe card is also recorded on the second platform, such as the tester who returned it, so as to facilitate the use of the second probe card.

[0071] S7. Maintain the second probe card.

[0072] In this embodiment, after the second probe card completes the test, considering that the second probe card may be damaged during the test, in an optional embodiment, the second probe card is maintained. Specifically, the maintenance includes:

[0073] First, the test accuracy of the second probe card is detected according to preset detection parameters.

[0074] In this embodiment, the tester maintains the returned probe card. Specifically, the tester adjusts the second information of the second probe card, such as the needle length, needle diameter, level and Dut quantity, according to the usage data of the test process to detect the test accuracy of the probe card.

[0075] Secondly, the second probe card is maintained according to the test accuracy and a preset probe card maintenance process, and a maintenance result is generated.

[0076] In the present embodiment, the maintenance process mainly includes inspecting and cleaning the second probe card. Specifically, a corresponding probe card maintenance process is selected for the second probe card according to the test accuracy. For example, when the test accuracy of the second probe card meets the test level, the corresponding in-factory maintenance is selected, the probe card is cleaned to restore the state of the probe card, and a maintenance result is generated, and the probe card is returned to the corresponding storage location, and the probe card parameters before and after maintenance are stored as part of the maintenance result; for example, when the test accuracy of the second probe card does not meet the test level, the corresponding out-of-factory maintenance is selected, and a specific maintenance operation is performed on the probe card to restore the state of the probe card and a maintenance result is generated. After maintenance, the probe card is returned to the corresponding storage location, and the probe card parameters before and after maintenance are stored as part of the maintenance result.

[0077] Next, the probe card parameters of the second information of the second probe card are updated according to the usage data and the maintenance result.

[0078] In this embodiment, the data related to the second probe card generated during the testing process and the maintenance process are updated into the second information, so as to trace back the use process of the second probe card.

[0079] S8. Determine whether the second probe card needs to be scrapped.

[0080] In this embodiment, after the second probe card completes the production test process, or after the second probe card completes the production test process and the maintenance process, it is determined whether the second probe card meets the performance requirements for continued testing, that is, whether the second probe card needs to be scrapped, so as to avoid using a probe card that should be scrapped for testing, thereby affecting the production of semiconductor devices.

[0081] In an optional embodiment, the probe card parameters include usage duration, usage times and usage status;

[0082] After updating the probe card parameters of the second information according to the usage data and the maintenance result, the management method further includes:

[0083] When the usage time of the second probe card is greater than a preset probe card usage time threshold and the number of times the second probe card is used is greater than a preset probe card usage number threshold, the usage status is updated in response to a received user operation.

[0084] This embodiment determines whether the second probe card needs to be scrapped based on at least one of the usage time and the number of times the probe card is used, and confirms the usage status of the second probe card under manual review. Specifically, when the usage time recorded in the second information of the second probe card exceeds the probe card usage time threshold, or the number of times the second information is used exceeds the probe card usage time threshold, or the usage time in the second information exceeds the probe card usage time threshold and the number of times the probe card is used exceeds the probe card usage time threshold, the tester conducts manual review and determines the usage status of the second probe card. For example, if the usage time or the number of times the second probe card is used exceeds a preset threshold, but the actual state of the second probe card meets the test requirements, the usage state is set to normal use and returned to the preset storage area, and the second information is synchronously updated for subsequent use; it is worth noting that the usage time and the number of times the second probe card is used are still continuously recorded; for example, if the usage time or the number of times the second probe card is used exceeds a preset threshold, and the actual state of the second probe card does not meet the test requirements, the usage state is set to scrap, and the second probe card is configured to the scrap area, which is a pre-set area for centralized processing of scrapped test devices, and the second information is synchronously updated.

[0085] S9. Send the second probe card to the first platform.

[0086] S10. Update the first probe card according to the second probe card on the first platform.

[0087] In this embodiment, based on the test use, maintenance and scrapping judgment of the second probe card on the second platform, the updated second probe card is sent to the first platform, and the first information of the first probe card on the first platform is updated with the second information of the second probe card, thereby updating the data generated by the probe card during the actual application process to the corresponding first probe card, that is, updating the first information according to the second information, so that the electronic first probe card corresponding to the physical probe card established in the first platform obtains the complete use, maintenance and scrapping judgment information of the physical probe card, so as to realize the management of the entire life cycle of the first probe card in the first platform.

[0088] At this point, efficient management of the probe card is achieved through the first platform and the second platform. An electronic first probe card corresponding to the physical probe card is created on the first platform, and a corresponding second probe card is created based on the second platform. The test data generated during the test operation is stored in the second information of the second probe card, and is updated to the first information of the first probe card on the first platform, thereby achieving management of the entire life cycle of the probe card by the first platform.

[0089] It is worth noting that those skilled in the art should understand that multiple steps in the above management method may all be user-triggered operations, or some steps may be user-triggered operations and some steps may be automatically triggered operations set by the program, or all steps may be automatically triggered operations set by the program. The present application does not make specific limitations on this. Those skilled in the art should make appropriate settings based on actual application requirements to achieve the management of probe cards as a design criterion, and will not go into details again.

[0090] Based on the above management method of semiconductor test probe card, Figure 2 As shown, the present application also provides a semiconductor device management system, including a first platform and a second platform, wherein the second platform includes a creation unit, a loading unit, a testing unit and a loading unit, wherein

[0091] The creation unit is configured to create a second probe card on the second platform according to the first probe card received from the first platform;

[0092] The on-board unit is configured to configure the second probe card to a preset test port;

[0093] The testing unit is configured to use the second probe card to test the semiconductor device to be tested according to a preset testing process;

[0094] The unloading unit is configured to take out the second probe card from the test port and generate usage data of the second probe card according to test data of the semiconductor device to be tested.

[0095] This embodiment creates a second probe card on the second platform based on the first probe card of the first platform, controls the second probe card to perform testing during the production process through the second platform, and then generates usage data of the second probe card based on the test data of the semiconductor device to be tested, thereby avoiding the problem of excessive reliance on production personnel in the traditional management process of probe cards, reducing labor costs, avoiding the impact of manual errors on the production of semiconductor products, improving the management efficiency of probe cards, and improving the production efficiency and production yield of semiconductor products. The specific implementation of this embodiment refers to the aforementioned embodiment and will not be repeated here.

[0096] It is worth noting that those skilled in the art should understand that the second platform as a semiconductor product production operation platform is used to manage the entire production process of semiconductor products, including not only the test management of probe cards, but also other test devices and production products, which will not be repeated here. In this embodiment, based on the management of the probe card by the first platform as a probe card management platform, the use data of the probe card is obtained through the second platform and updated to the first platform, so as to realize the management of the entire life cycle of the probe card by the first platform.

[0097] Another embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements: creating a second probe card on a second platform based on a first probe card received from a first platform; configuring the second probe card to a preset test port; using the second probe card to test a semiconductor device to be tested according to a preset test process; taking the second probe card out of the test port, and generating usage data of the second probe card based on the test data of the semiconductor device to be tested.

[0098] In practical applications, the computer-readable storage medium can adopt any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present embodiment, the computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0099] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, which carry computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0100] The program code embodied on the computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0101] Computer program code for performing the operations of the present invention may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0102] like Figure 4 As shown, a structural schematic diagram of a computer device provided by another embodiment of the present invention. Figure 4 The computer device T12 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0103] like Figure 4 As shown, the computer device T12 is in the form of a general-purpose computing device. The components of the computer device T12 may include, but are not limited to: one or more processors or processing units T16, a system memory T28, and a bus T18 connecting different system components (including the system memory T28 and the processing unit T16).

[0104] Bus T18 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of a variety of bus structures. For example, these architectures include but are not limited to an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MAC) bus, an Enhanced ISA bus, a Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus.

[0105] The computer device T12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by the computer device T12, including volatile and non-volatile media, removable and non-removable media.

[0106] The system memory T28 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) T30 and / or cache memory T32. The computer device T12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, the storage system T34 may be used to read and write non-removable, non-volatile magnetic media ( Figure 4 not shown, usually called a "hard drive"). Although Figure 4 Not shown in the figure, a disk drive for reading and writing a removable non-volatile disk (e.g., a "floppy disk"), and an optical disk drive for reading and writing a removable non-volatile optical disk (e.g., a CD-ROM, a DVD-ROM, or other optical medium) may be provided. In these cases, each drive may be connected to the bus T18 via one or more data medium interfaces. The memory T28 may include at least one program product having a set (e.g., at least one) of program modules that are configured to perform the functions of the various embodiments of the present invention.

[0107] A program / utility T40 having a set (at least one) of program modules T42 may be stored in, for example, memory T28, such program modules T42 including, but not limited to, an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment. The program modules T42 typically perform the functions and / or methods of the embodiments described herein.

[0108] The computer device T12 may also communicate with one or more external devices T14 (e.g., keyboard, pointing device, display T24, etc.), one or more devices that enable a user to interact with the computer device T12, and / or any device that enables the computer device T12 to communicate with one or more other computing devices (e.g., network card, modem, etc.). Such communication may be performed via an input / output (I / O) interface T22. Furthermore, the computer device T12 may also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN) and / or public network, such as the Internet) via a network adapter T20. Figure 4 As shown, the network adapter T20 communicates with other modules of the computer device T12 via the bus T18. Figure 4 Not shown, other hardware and / or software modules may be used in conjunction with computer device T12, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0109] The processor unit T16 executes various functional applications and data processing by running programs stored in the system memory T28, for example, implementing a management method for a semiconductor test probe card provided by an embodiment of the present invention.

[0110] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A method for managing a semiconductor test probe card, characterized in that: include: Creating a second probe card on a second platform based on the received first probe card from the first platform; configuring the second probe card to a preset test port; Using the second probe card to test the semiconductor device to be tested according to a preset test process; The second probe card is taken out from the test port, and usage data of the second probe card is generated according to test data of the semiconductor device to be tested.

2. The management method according to claim 1, characterized in that: Before creating the second probe card on the second platform according to the received first probe card from the first platform, the management method further includes: Establishing a first probe card on a first platform, wherein the first probe card includes first information, wherein the first information includes a probe card identifier, probe card parameters, and a probe card production specification formed according to the probe card parameters; The first probe card is published in response to the received user operation, and the first probe card is sent to the second platform.

3. The management method according to claim 2, characterized in that: The management method also includes: Generate upgrade specifications or clone specifications according to the probe card production specifications.

4. The management method according to claim 2, characterized in that: The second probe card includes second information corresponding to the first information one by one, and the second information includes a probe card identification, probe card parameters, and probe card production specifications; After taking out the second probe card from the test port and generating usage data of the second probe card according to the test data of the semiconductor device to be tested, the management method further includes: Detecting the test accuracy of the second probe card according to preset detection parameters; Maintaining the second probe card according to the test accuracy and a preset probe card maintenance process and generating a maintenance result; The probe card parameters of the second information are updated according to the usage data and the maintenance result.

5. The management method according to claim 4, characterized in that: The probe card parameters of the second information include usage duration, usage times and usage status; After updating the probe card parameters of the second information according to the usage data and the maintenance result, the management method further includes: When the usage time of the second probe card is greater than a preset probe card usage time threshold and the number of times the second probe card is used is greater than a preset probe card usage number threshold, the usage status is updated in response to a received user operation.

6. The management method according to claim 5, characterized in that: The management method also includes: When the usage state is normal use, returning the second probe card to a preset storage area; or When the use status is scrapped, the second probe card is configured to a preset scrap area.

7. The management method according to claim 5, characterized in that: When the usage time of the second probe card is greater than a preset probe card usage time threshold and the number of times the second probe card is used is greater than a preset probe card usage number threshold, after updating the usage status in response to a received user operation, the management method further includes: The first information is updated according to the second information.

8. The management method according to claim 6, characterized in that: After creating the second probe card on the second platform according to the received first probe card from the first platform and before configuring the second probe card to the preset test port, the management method further includes: The second probe card is taken out from a preset storage area.

9. A semiconductor device management system, characterized in that: The system comprises a first platform and a second platform, wherein the second platform comprises a creation unit, an on-board unit, a test unit and an off-board unit, wherein The creation unit is configured to create a second probe card on the second platform according to the first probe card received from the first platform; The on-board unit is configured to configure the second probe card to a preset test port; The testing unit is configured to use the second probe card to test the semiconductor device to be tested according to a preset testing process; The unloading unit is configured to take out the second probe card from the test port and generate usage data of the second probe card according to test data of the semiconductor device to be tested.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

11. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 8 is implemented.

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