Optical module

By partitioning the light emission and multiplexing units on the PCBA board and using aluminum nitride substrate to dissipate heat, the problems of low space occupation and heat dissipation efficiency of traditional optical modules are solved, and a more efficient layout and heat dissipation effect is achieved.

CN119200113AInactive Publication Date: 2024-12-27WUHAN INPHILIGHT TECH CO LTD
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Patent Information

Application Number
CN202411710553.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2024-12-27
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Because the shell occupies the space of the PCBA, the traditional optical module increases the difficulty of wiring and layout of electronic components, and the shell has a low thermal conductivity, which affects the heat dissipation effect.

Method used

The first and second areas are divided on the PCBA board, the light emitting unit and the optical multiplexing unit are separately arranged, and the influence of position changes on the optical path is solved through the displacement prism. At the same time, the aluminum nitride substrate is used for heat dissipation, which reduces the use of the shell .

Benefits of technology

The opening size of the PCBA board is reduced, the wiring and layout space is increased, the heat dissipation efficiency is improved, and the cost is reduced.

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Abstract

The invention relates to the technical field of optical communication, and provides an optical module, which comprises a PCBA board, the PCBA board is provided with a first mounting area and a second mounting area, a light emitting unit is mounted on the first area, an optical multiplexing unit is mounted on the second area, the PCBA board sinks at the first mounting area to form a groove, and the first mounting area and the second mounting area are arranged on the PCBA board. The light emitting unit is arranged in the groove, and a displacement prism used for lifting light emitted by the light emitting unit into the light multiplexing unit is further arranged in the first area. The PCBA board is divided into the first area and the second area, the light emitting unit and the light multiplexing unit can be arranged separately, the influence of the position change of the light emitting unit and the light multiplexing unit on the light path is solved through the displacement prism, the opening size of the PCBA board is reduced, and the wiring space of the PCBA board and the space for arranging electronic elements are increased.
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Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] The transmitting end of a traditional optical module includes a PCBA, four lasers that emit four different wavelengths, four collimating lenses that collimate the light emitted by the four lasers, an optical multiplexer that combines the four collimated lights into one, an optical isolator, a converging lens that converges the light from the optical multiplexer into the optical transmitter adapter, a crystal head connected to the optical transmitter adapter through an optical fiber, and an optical transmitter adapter. The laser, collimating lens, optical multiplexer, optical isolator, converging lens, and crystal head are all attached to the housing. The housing and PCBA are fixed together with glue, and the housing occupies a large space of the PCBA, which increases the difficulty of PCBA wiring and layout of electronic components. Summary of the invention

[0003] The object of the present invention is to provide an optical module, which can at least solve some of the defects in the prior art.

[0004] To achieve the above-mentioned purpose, an embodiment of the present invention provides the following technical solution: an optical module, including a PCBA board, the PCBA board having a first mounting area and a second mounting area, the first area is mounted with a light emitting unit, the second area is mounted with an optical multiplexing unit, the PCBA board is located at the first mounting area and is sunken to form a groove, the light emitting unit is arranged in the groove, and a displacement prism is also provided in the first area for lifting the light emitted by the light emitting unit to the optical multiplexing unit.

[0005] Furthermore, the groove is a through groove that penetrates the PCBA board, and a first heat dissipation substrate for placing the light emitting unit is provided on the back side of the PCBA board.

[0006] Furthermore, a second heat dissipation substrate is also provided in the through groove, the second heat dissipation substrate is provided on the first heat dissipation substrate, and the light emitting unit is provided on the second heat dissipation substrate.

[0007] Furthermore, a third heat dissipation substrate is provided at the second area of ​​the PCBA board, and the optical multiplexing unit is provided on the third heat dissipation substrate.

[0008] Furthermore, the light emitting unit includes a laser and a collimating lens which are sequentially arranged along the light path direction, and the laser light collimated by the collimating lens is raised to the light multiplexing unit through the displacement prism.

[0009] Furthermore, there are four lasers and four collimating lenses in one-to-one correspondence, and the four lasers emit four laser beams which are collimated into collimated light through the four collimating lenses.

[0010] Furthermore, the optical multiplexing unit includes an optical multiplexer and a converging lens arranged in sequence along the optical path direction, and the optical multiplexer receives the collimated light after the displacement prism is lifted and then injects the collimated light into the optical isolator.

[0011] Furthermore, a converging lens and a crystal head are also provided in the second area, and the light emitted by the optical multiplexing unit is converged by the converging lens and then incident on the crystal head.

[0012] Furthermore, the crystal head is connected to the optical transmission adapter through an optical fiber.

[0013] Furthermore, when there are a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate, the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate are all aluminum nitride substrates.

[0014] Compared with the prior art, the present invention has the following beneficial effects: By dividing the PCBA board into the first area and the second area, the light emitting unit and the light multiplexing unit can be set separately, and the influence of the position change of the former on the light path can be solved by a displacement prism, thereby reducing the opening size of the PCBA board and increasing the wiring of the PCBA board and the space for layout of electronic components.

[0015] The traditional solution dissipates heat through the shell, and the thermal conductivity of the shell material is low, while the laser of the present invention dissipates heat directly through the aluminum nitride substrate, and the heat dissipation effect is better.

[0016] The traditional solution requires an additional shell to bond components such as lasers, while the present invention only requires the addition of an aluminum nitride substrate, which is less costly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a top view of an optical module provided by an embodiment of the present invention; Figure 2 A vertical cross-sectional schematic diagram of an optical module provided by an embodiment of the present invention; Figure 3 A schematic diagram of an optical path of an optical module provided by an embodiment of the present invention; In the accompanying drawings: 1-PCBA board; 2-laser; 3-collimating lens; 4-displacement prism; 5-optical multiplexer; 6-optical isolator; 7-converging lens; 8-crystal head; 9-optical fiber; 10-light emission adapter; 11-first heat dissipation substrate; 12-second heat dissipation substrate; 13-third heat dissipation substrate; 14-through groove; A-first area; B-second area. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1 , Figure 2 and Figure 3 , an embodiment of the present invention provides an optical module, including a PCBA board 1, the PCBA board 1 having a first mounting area and a second mounting area, the first area A mounting a light emitting unit, the second area B mounting a light multiplexing unit, the PCBA board 1 being located at the first mounting area and sinking to form a groove, the light emitting unit being arranged in the groove, and the first area A also being provided with a displacement prism 4 for lifting the light emitted by the light emitting unit to the light multiplexing unit. In this embodiment, by dividing the first area A and the second area B on the PCBA board 1, the light emitting unit and the light multiplexing unit can be separately arranged, and the displacement prism 4 is used to solve the influence of the position change of the former on the optical path, thereby reducing the opening size of the PCBA board 1 and increasing the space for wiring and layout of electronic components of the PCBA board 1. Specifically, compared with the traditional optical module, the embodiment improves the way of concentrating all components in the housing by separately arranging the light emitting unit and the light multiplexing unit in the first area A and the second area B, thereby avoiding that the large housing occupies too much space of the PCBA board 1, and the arranged groove can also be small in volume, thereby increasing the effective use area on the PCBA board 1.

[0020] See also Figure 1 , Figure 2 and Figure 3 , the groove is a through groove 14 that passes through the PCBA board 1, and the back of the PCBA board 1 is provided with a first heat dissipation substrate 11 for placing the light emitting unit. In this embodiment, the groove is a through groove 14, so that heat is dissipated through the first heat dissipation substrate 11, which improves the heat dissipation efficiency compared with the traditional optical module heat dissipation through the shell. Preferably, a second heat dissipation substrate 12 is also provided in the through groove 14, and the second heat dissipation substrate 12 is arranged on the first heat dissipation substrate 11, and the light emitting unit is arranged on the second heat dissipation substrate 12. A second heat dissipation substrate 12 can also be provided to cooperate with the first heat dissipation substrate 11 to dissipate heat and improve the heat dissipation efficiency. At the same time, the second heat dissipation substrate 12 can also lift the optical path to facilitate the light output by the emitting light unit to enter the optical multiplexing unit. Preferably, the first heat dissipation substrate 11 and the second heat dissipation substrate 12 are both made of aluminum nitride substrates, which can have a good heat dissipation effect.

[0021] See also Figure 1 , Figure 2 and Figure 3 A third heat dissipation substrate 13 is provided at the second region B of the PCBA board 1, and the optical multiplexing unit is provided on the third heat dissipation substrate 13. In this embodiment, the third heat dissipation substrate 13 can also dissipate heat for the optical multiplexing unit and other components. Preferably, the third heat dissipation substrate 13 can also be an aluminum nitride substrate.

[0022] See also Figure 1 , Figure 2 and Figure 3 , the light emitting unit includes a laser 2 and a collimating lens 3 arranged in sequence along the optical path direction, and the laser light collimated by the collimating lens 3 is raised to the optical multiplexing unit through the displacement prism 4. In this embodiment, the refined light emitting unit is a laser 2 and a collimating lens 3. Preferably, there are four lasers 2 and four collimating lenses 3 and they correspond one to one. The four lasers 2 emit four lasers that are collimated into collimated light through the four collimating lenses 3. Figure 3 As shown, the light emitted from the laser 2 is collimated by the collimating lens 3 and then enters the optical multiplexing unit through the displacement prism 4.

[0023] See also Figure 1 , Figure 2 and Figure 3 , the optical multiplexing unit includes an optical multiplexer 5 and a converging lens arranged in sequence along the optical path direction, and the optical multiplexer 5 receives the collimated light after the displacement prism 4 is lifted and then incident on the optical isolator 6. In this embodiment, the optical multiplexing unit is refined to be a multiplexer and a converging lens. Preferably, a converging lens 7 and a crystal head 8 are also provided in the second area B, and the light emitted by the optical multiplexing unit is converged by the converging lens 7 and then incident on the crystal head 8. The crystal head 8 is connected to the optical transmission adapter 10 through the optical fiber 9. Figure 3 As shown, the light emitted from the laser 2 is collimated by the collimating lens 3, and then enters the optical multiplexer 5 through the displacement prism 4. Then the light coming out of the optical multiplexer 5 is converged into the optical fiber 9 inside the crystal head 8 after passing through the optical isolator 6 and the converging lens 7, and then reaches the optical transmission adapter 10 through the optical fiber 9.

[0024] The following are the steps to make this optical module: Use glue to stick the first aluminum nitride substrate to the notch of PCBA ( Figure 2 As shown in the figure), the third aluminum nitride substrate is attached to the PCBA board 1 with glue, and then the glue is baked to cure; Using glue to stick the second aluminum nitride substrate on the first aluminum nitride substrate and bake and cure; Glue the laser 2 and the displacement prism 4 onto the second aluminum nitride substrate, glue the MUX, the optical isolator 6, and the crystal head 8 onto the third aluminum nitride substrate, and then bake and cure the glue; The collimating lens 3 and the converging lens 7 are fixed respectively by active coupling; The production of the optical transmitter is completed.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical module, comprising a PCBA board, characterized in that: The PCBA board has a first mounting area and a second mounting area, the first area is mounted with a light emitting unit, the second area is mounted with an optical multiplexing unit, the PCBA board is located at the first mounting area and is sunken to form a groove, the light emitting unit is arranged in the groove, and a displacement prism for lifting the light emitted by the light emitting unit to the optical multiplexing unit is also arranged in the first area.

2. An optical module according to claim 1, characterized in that: The groove is a through groove that penetrates the PCBA board, and a first heat dissipation substrate for placing the light emitting unit is provided on the back of the PCBA board.

3. An optical module as claimed in claim 2, characterized in that: A second heat dissipation substrate is also provided in the through groove, the second heat dissipation substrate is provided on the first heat dissipation substrate, and the light emitting unit is provided on the second heat dissipation substrate.

4. An optical module according to claim 1, characterized in that: A third heat dissipation substrate is provided at the second area of ​​the PCBA board, and the optical multiplexing unit is provided on the third heat dissipation substrate.

5. The optical module according to claim 1, characterized in that: The light emitting unit comprises a laser and a collimating lens arranged in sequence along the light path direction. The laser light collimated by the collimating lens is raised to the light multiplexing unit through the displacement prism.

6. An optical module as claimed in claim 5, characterized in that: There are four lasers and four collimating lenses in one-to-one correspondence. The four lasers emit four laser beams which are collimated into collimated light through the four collimating lenses.

7. An optical module according to claim 1, characterized in that: The optical multiplexing unit comprises an optical multiplexer and a converging lens which are sequentially arranged along the optical path direction. The optical multiplexer receives the collimated light after the displacement prism is lifted and then injects the collimated light into the optical isolator.

8. An optical module as claimed in claim 1, characterized in that: A converging lens and a crystal head are also provided in the second area. The light emitted by the optical multiplexing unit is converging through the converging lens and then incident on the crystal head.

9. An optical module as claimed in claim 8, characterized in that: The crystal head is connected to the light transmitting adapter through an optical fiber.

10. An optical module according to any one of claims 1, 2 or 4, characterized in that: When there are a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate, the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate are all aluminum nitride substrates.

Citation Information

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