Parameter correction method, device and equipment of mold temperature controller and medium

Abstract

The invention discloses a parameter correction method, device and equipment of a mold temperature controller and a medium, and relates to the technical field of mold temperature controller control, and the method comprises the steps: obtaining the correction interval duration, the heating proportional gain coefficient, the heating integral gain coefficient and the default maximum temperature rise speed of the mold temperature controller; according to the heating proportional gain coefficient and the heating integral gain coefficient, the mold is continuously heated, and the temperature change state of the mold is detected; and if the temperature change state is a temperature rising state, the heating proportional gain coefficient is corrected according to the real-time temperature rising rate of a mold in the mold temperature controller, the default highest temperature rising rate and the correction interval duration. According to the technical scheme, in the heating process of the mold temperature controller, the heating proportional gain coefficient of the mold temperature controller is continuously corrected, the situation that due to the fact that the initial heating proportional gain coefficient is not matched with the mold temperature controller, correction of the heating proportional gain coefficient fails can be avoided, and therefore the optimal heating proportional gain parameter is obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of mold temperature controller control, and in particular to a parameter correction method, device, equipment and medium of a mold temperature controller. Background Art

[0002] PI (Proportional Integral) control system is widely used in mold temperature controller (mold temperature controller for short). The parameters of the mold temperature controller, such as mold power, mold spacing and heat dissipation efficiency, will affect the temperature control effect of the mold temperature controller, and then affect the process level and production efficiency of plastic mold processing. Therefore, it is necessary to adjust the PI controller parameters of the mold temperature controller to achieve the best control effect.

[0003] In the prior art, the relay feedback self-tuning method is usually used to temporarily replace the PI controller in the mold temperature controller through the relay link, and determine the optimal gain coefficient according to the preset initial gain parameter. The preset initial gain parameter in the prior art usually adopts a fixed value, and the parameters and configurations of each mold temperature controller are different; if the prior art is used, when the preset initial gain parameter is not suitable for the mold temperature controller with the parameters to be corrected, the optimal gain coefficient of the mold temperature controller cannot be obtained, thereby affecting the control effect of the mold temperature controller. Summary of the invention

[0004] The present invention provides a parameter correction method, device, equipment and medium for a mold temperature controller to determine an optimal heating proportional gain coefficient of the mold temperature controller, thereby improving the control effect of the mold temperature controller.

[0005] In a first aspect, the present invention provides a method for correcting parameters of a mold temperature controller, comprising:

[0006] Get the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller;

[0007] According to the heating proportional gain coefficient and the heating integral gain coefficient, the mold is continuously heated and the temperature change state of the mold is detected;

[0008] If the temperature change state is a temperature rising state, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval.

[0009] In a second aspect, the present invention further provides a parameter correction device for a mold temperature controller, comprising:

[0010] The coefficient acquisition module is used to obtain the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and the default maximum heating rate of the mold temperature controller;

[0011] The heating module is used to continuously heat the mold in the mold temperature controller according to the heating proportional gain coefficient and the heating integral gain coefficient, and detect the temperature change state of the mold;

[0012] The first correction module is used to correct the heating proportional gain coefficient according to the real-time heating rate of the mold, the default maximum heating rate and the correction interval time if the temperature change state is a temperature rising state.

[0013] In a third aspect, an embodiment of the present invention further provides an electronic device, including:

[0014] at least one processor; and

[0015] a memory communicatively coupled to at least one processor; wherein

[0016] The memory stores instructions that can be executed by at least one processor, and the instructions are executed by at least one processor so that the at least one processor can execute the parameter correction method of the mold temperature controller provided by any embodiment of the present invention.

[0017] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to implement the parameter correction method of the mold temperature controller of any embodiment of the present invention when executed by a processor.

[0018] The technical solution of the embodiment of the present invention obtains the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller; according to the heating proportional gain coefficient and heating integral gain coefficient, the mold is continuously heated, and the temperature change state of the mold is detected; if the temperature change state is a temperature rise state, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval duration. The technical solution of the embodiment of the present invention can avoid the failure of the heating proportional gain coefficient correction due to the incompatibility of the initial heating proportional gain coefficient with the mold temperature controller by continuously correcting the heating proportional gain coefficient of the mold temperature controller during the heating process of the mold temperature controller, thereby ensuring that the optimal heating proportional gain parameter is obtained, thereby achieving the optimal control effect of the mold temperature controller.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1A is a flow chart of a parameter correction method of a mold temperature controller provided according to the first embodiment of the present invention;

[0022] Figure 1B is a structural schematic diagram of a heating PI controller provided according to Embodiment 1 of the present invention;

[0023] Figure 2A is a flow chart of a method for correcting parameters of a mold temperature controller provided according to a second embodiment of the present invention;

[0024] Figure 2B is a structural schematic diagram of a mold temperature controller provided according to Embodiment 2 of the present invention;

[0025] Figure 2C is a schematic diagram of temperature change of a mold provided according to the second embodiment of the present invention;

[0026] Figure 3 2 is a schematic structural diagram of a parameter correction device for a mold temperature controller provided according to a third embodiment of the present invention;

[0027] Figure 4 It is a structural schematic diagram of an electronic device for implementing the parameter correction method of the mold temperature controller according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first" and "second" and the like in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] In the technical solution of the embodiment of the present invention, the acquisition, storage and application of the correction interval duration, etc. are in compliance with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0031] Embodiment 1

[0032] Figure 1A A flow chart of a method for correcting parameters of a mold temperature controller provided in Embodiment 1 of the present invention. This embodiment is applicable to the case of correcting the heating proportional gain coefficient of the mold temperature controller. The method can be executed by a parameter correction device for a mold temperature controller. The parameter correction device for the mold temperature controller can be implemented in the form of hardware and / or software and specifically configured in an electronic device, such as a server.

[0033] See also Figure 1A The parameter correction method of the mold temperature controller shown includes:

[0034] S101, obtaining a correction interval duration, a heating proportional gain coefficient, a heating integral gain coefficient, and a default maximum heating rate of a mold temperature controller.

[0035] S102, continuously heating the mold according to the heating proportional gain coefficient and the heating integral gain coefficient, and detecting the temperature change state of the mold.

[0036] S103, if the temperature change state is a temperature rising state, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval.

[0037] In this embodiment, the correction interval duration may be the shortest interval duration for correcting the heating proportional gain coefficient, that is, the duration between two adjacent correction operations of the heating proportional gain coefficient is at least the correction interval duration. The temperature change state may include, but is not limited to, a temperature rising state and a temperature stable state. Among them, the temperature rising state may indicate that the temperature of the mold continues to rise; the temperature stable state may indicate that the temperature of the mold remains stable. The real-time heating rate may be the temperature rising rate of the mold detected in real time; the default maximum heating rate may be the maximum heating rate that the mold temperature controller can achieve during the heating process, and the default maximum heating rate may be set independently by the technician according to actual needs or practical experience.

[0038] In this embodiment, the mold temperature controller includes a heating PI controller, which can be used to determine the heating power for heating the mold. The heating proportional gain coefficient can be a proportional gain coefficient of the heating PI controller; the heating integral gain coefficient can be an integral gain coefficient of the heating PI controller. It should be noted that the heating proportional gain coefficient and the heating integral gain coefficient can be preset initial values, and the initial values ​​can be independently set by technicians according to actual needs or practical experience, and the present invention does not limit this. In a specific embodiment, the initial value of the heating integral gain coefficient is set to 0.

[0039] Optionally, the transfer function of the heating temperature rise link of the heating PI controller of the mold temperature controller can be expressed by the following formula:

[0040]

[0041] Among them, G h (s) represents the transfer function of the heating temperature rising link; A h Indicates the heating parameters of the heating process; B h represents the heat dissipation parameter of the heating and temperature rising link; s represents the Laplace variable.

[0042] Optionally, the transfer function of the control delay link of the mold temperature controller can be expressed by the following formula:

[0043]

[0044] Among them, G ds (s) represents the transfer function of the control delay link; τ ds Indicates the delay time constant.

[0045] Alternatively, the transfer function of the heating PI controller of the mold temperature controller can be expressed as:

[0046]

[0047] Among them, G hPI(s) represents the transfer function of the heating PI controller.

[0048] Specifically, a certain algorithm can be used to determine the heating power of the mold according to the heating proportional gain coefficient and the heating integral gain coefficient; and the mold is continuously heated by the determined heating power, and the temperature change state of the mold is detected; if the temperature change state is a temperature rising state, a certain algorithm is used to correct the heating proportional gain coefficient according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval.

[0049] In an optional embodiment, the heating proportional gain coefficient can be periodically corrected according to the heating control cycle of the heating PI controller; the duration of the control cycle can be the correction interval duration. Specifically, for each heating control cycle, the real-time heating power in the heating control cycle is determined according to the heating proportional gain coefficient and the heating integral gain coefficient; and according to the real-time heating power in the control cycle, the mold is continuously heated in the heating control cycle, and the temperature change state of the mold is detected; if the temperature change state is a temperature rise state, a certain algorithm is used to correct the heating proportional gain coefficient in the heating control cycle according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval duration, so that in the next heating control cycle of the heating control cycle, the mold is continuously heated according to the corrected heating proportional gain coefficient and the heating integral gain coefficient.

[0050] It should be noted that the duration of the heating control cycle can be independently set by technicians according to actual needs or practical experience, and the present invention does not limit this.

[0051] Optionally, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the preset maximum heating rate and the correction interval, including: comparing the real-time heating rate and the default maximum heating rate; if the real-time heating rate is greater than the default maximum heating rate, then the heating proportional gain coefficient is corrected according to the real-time heating rate and the correction interval.

[0052] Specifically, if the real-time heating rate is greater than the default maximum heating rate, a certain algorithm is used to correct the heating proportional gain coefficient according to the real-time heating rate and the correction interval; if the real-time heating rate is less than or equal to the default maximum heating rate, the heating proportional gain coefficient is not corrected.

[0053] It can be understood that, by adopting the above technical solution, when the real-time heating rate is greater than the default maximum heating rate, the heating proportional gain coefficient is corrected according to the larger real-time heating rate and the correction interval duration, so that the corrected heating proportional gain coefficient can shorten the heating time required for the mold to reach a temperature stable state as much as possible, thereby improving the heating efficiency of the mold temperature controller.

[0054] Optionally, the heating proportional gain coefficient is corrected according to the real-time heating rate and the correction interval duration, including: calculating the corrected heating proportional gain coefficient according to the real-time heating rate and the correction interval duration; and updating the heating proportional gain coefficient to the corrected heating proportional gain coefficient.

[0055] Specifically, when the real-time heating rate is greater than the default maximum heating rate, the real-time heating rate is the maximum heating rate of the mold; the corrected heating proportional gain coefficient is calculated based on the maximum heating rate and the correction interval duration; the heating proportional gain coefficient is updated to the corrected heating proportional gain coefficient.

[0056] Exemplarily, the modified heating proportional gain coefficient may be calculated by the following formula:

[0057]

[0058] Among them, K hp Indicates the modified heating proportional gain coefficient; Indicates the maximum heating rate, that is, the real-time heating rate when the real-time heating rate is greater than the default maximum heating rate; R s Indicates the correction interval duration.

[0059] Among them, the modified heating proportional gain coefficient can be determined in the following way: when the mold of the mold temperature controller starts to heat, the real-time temperature of the mold is the initial temperature. Therefore, the mold temperature controller does not need to output power at the initial temperature to maintain the temperature of the mold at the real-time temperature, that is, the power output for maintaining the temperature of the mold at the real-time temperature is approximately zero, which can be expressed by the following formula:

[0060] B h (T n -T d )≈0;

[0061] Among them, T n Indicates the real-time temperature, T d represents the initial temperature; B h (T k -T d ) represents the power required to maintain the mold temperature at the real-time temperature.

[0062] Since the mold temperature controller is set with an initial heating proportional gain coefficient, when the mold of the mold temperature controller starts to heat, the actual output heating power is the rated power, that is, the per-unit output power is 1; the actual output heating power includes the heating power required to maintain the temperature rise and the power required to maintain the temperature of the mold at the real-time temperature. The actual output heating power is the rated power, which can be expressed by the following formula:

[0063]

[0064] in, Indicates the rate of temperature rise; Indicates the heating power required to maintain the temperature rising at a rate; P e Indicates rated power.

[0065] By deriving the formula for the actual output heating power to be the rated power, we can obtain:

[0066]

[0067] Since the power required to maintain the temperature of the mold at the real-time temperature is zero when the mold of the mold temperature controller starts to heat, the theoretical maximum value of the heating rate can be expressed by the following formula:

[0068]

[0069] in, Indicates the theoretical maximum value of the heating rate;

[0070] Then A h The heating parameters of the heating process can be expressed by the following formula:

[0071]

[0072] The heating integral gain coefficient can be expressed by the following formula:

[0073]

[0074] Among them, K hi Represents the heating integral gain coefficient; R hi represents the integration constant;

[0075] The heating integral gain coefficient can be expressed by the following formula:

[0076]

[0077] Then the heating control open-loop transfer function can be expressed by the following formula:

[0078]

[0079] Among them, G ho (s) represents the heating control open-loop transfer function; is the transfer function of the heating PI controller;

[0080] The heating control closed-loop transfer function can be organized into a second-order system, expressed by the following formula:

[0081]

[0082] Among them, the closed loop transfer function of the heating control is in the form of a second-order system;

[0083] The general expression of a second-order system can be expressed as:

[0084]

[0085] Among them, ω n represents the undamped oscillation frequency of the second-order system; ξ represents the damping ratio of the second-order system;

[0086] Then we can get:

[0087]

[0088] To ensure no overshoot, let the damping ratio of the second-order system be 1, and the delay time constant be the correction interval length. Then the calculation formula of the heating proportional gain coefficient can be expressed as:

[0089]

[0090] It can be understood that by adopting the above technical solution, the corrected heating proportional gain coefficient is calculated according to the real-time heating rate and the correction interval duration; the heating proportional gain coefficient is updated to the corrected heating proportional gain coefficient. In the process of correcting the heating proportional gain coefficient, it is possible to prevent the temperature of the mold from overshooting or even oscillating significantly, thereby preventing damage to the mold temperature controller, thereby improving the safety of the correction process of the heating proportional gain coefficient.

[0091] In an optional embodiment, before the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval, the real-time temperature and the historical temperature can also be obtained; wherein the collection time of the historical temperature is adjacent to the collection time of the real-time temperature, and the collection time of the historical temperature is before the collection time of the real-time temperature; the real-time heating rate of the mold is determined according to the real-time temperature, the historical temperature and the correction interval; illustratively, the real-time heating rate can be determined as follows:

[0092]

[0093] in, Indicates the real-time heating rate; T n Indicates real-time temperature; T n-1 Indicates historical temperature.

[0094] Optionally, while obtaining the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller, the set maximum working temperature can also be obtained; the heating power can be determined according to the set maximum working temperature, the real-time temperature, the heating proportional gain coefficient and the heating integral gain coefficient; illustratively, the heating power can be determined by the following formula:

[0095] P h (t) = K hp [e(t)+K hi ∫e(t)dt];

[0096] Among them, P h (t) represents the heating power at time t; e(t) represents the difference between the set maximum operating temperature and the real-time temperature.

[0097] Optional, Figure 1B This is a schematic diagram of the structure of a heating PI controller. Figure 1B As shown, the heating PI controller is an anti-integral saturation PI controller; the heating PI controller determines the heating power according to the difference between the set maximum operating temperature and the real-time temperature, the heating proportional gain coefficient and the heating integral gain coefficient; judges whether the determined heating power is less than or equal to the constraint value; if satisfied, outputs the heating power; if not satisfied, determines the difference between the constraint value and the output heating power value, and corrects the integral term by the determined difference, so as to prevent the integral accumulation from being too large.

[0098] In a specific embodiment, periodic correction is performed according to the heating control cycle of the heating PI controller. For each heating control cycle, the real-time temperature of the mold in the heating control cycle and the historical temperature in the historical heating control cycle adjacent to and before the heating control cycle are collected; the real-time heating rate of the mold is determined according to the real-time temperature and the historical temperature; the real-time heating rate and the default maximum heating rate are compared; if the real-time heating rate is greater than the default maximum heating rate, the heating proportional gain coefficient in the heating control cycle is corrected according to the real-time heating rate and the correction interval, so that in the next heating control cycle of the heating control cycle, the mold is continuously heated according to the corrected heating proportional gain coefficient and the heating integral gain coefficient.

[0099] The technical solution of the embodiment of the present invention obtains the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller; according to the heating proportional gain coefficient and heating integral gain coefficient, the mold is continuously heated, and the temperature change state of the mold is detected; if the temperature change state is a temperature rise state, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval duration. The technical solution of the embodiment of the present invention can avoid the failure of the heating proportional gain coefficient correction due to the incompatibility of the initial heating proportional gain coefficient with the mold temperature controller by continuously correcting the heating proportional gain coefficient of the mold temperature controller during the heating process of the mold temperature controller, thereby ensuring that the optimal heating proportional gain parameter is obtained, thereby achieving the optimal control effect of the mold temperature controller.

[0100] Embodiment 2

[0101] Figure 2A This is a flow chart of a parameter correction method for a mold temperature controller provided in the second embodiment of the present invention. The embodiment of the present invention is additionally optimized based on the technical solutions of the above embodiments.

[0102] Furthermore, while "continuously heating the mold according to the heating proportional gain coefficient and the heating integral gain coefficient, and detecting the temperature change state of the mold", it is added that "the initial temperature of the mold is obtained and the maximum working temperature is set; when the heating power of the mold temperature controller is desaturated, the first temperature and the first processing time of the mold are obtained; wherein, the starting time of the first processing time is the time when heating of the mold starts; the ending time of the first processing time is the time when the heating power of the mold temperature controller is desaturated"; and it is added that "if the temperature change state is a temperature stable state, the second temperature of the mold in the temperature stable state is obtained; based on the second temperature and the first temperature, the first response time of the temperature step increase of the mold is determined; based on the first processing time, the heating integral gain coefficient is corrected" to realize the correction of the heating integral gain coefficient.

[0103] It should be noted that, for the parts not described in detail in the embodiments of the present invention, reference may be made to the descriptions in the aforementioned embodiments.

[0104] See also Figure 2A The parameter correction method of the mold temperature controller shown includes:

[0105] S201, obtaining a correction interval duration, a heating proportional gain coefficient, and a heating integral gain coefficient of a mold temperature controller.

[0106] S202 , continuously heating the mold according to the heating proportional gain coefficient and the heating integral gain coefficient, and detecting the temperature change state of the mold.

[0107] S203, obtaining the initial temperature of the mold and setting the maximum working temperature.

[0108] In this embodiment, the initial temperature may be the temperature of the mold before the mold is heated; the set maximum working temperature may be the working temperature to which the mold needs to be heated set by the technician, which may be set independently by the technician based on actual needs or practical experience, and the present invention does not limit this.

[0109] S204. When the heating power of the mold temperature controller is desaturated, obtain the first temperature and the first processing time of the mold; wherein the starting time of the first processing time is the time when the mold heating starts; and the ending time of the first processing time is the time when the heating power of the mold temperature controller is desaturated.

[0110] In this embodiment, the moment when the heating power is desaturated may be the moment when the heating power exits the rated power after reaching the rated power, that is, the moment when the heating power changes to less than the rated power after reaching the rated power. The first temperature may be the temperature of the mold when the heating power of the mold temperature controller is desaturated.

[0111] S205: If the temperature change state is a temperature rise state, the heating proportional gain coefficient is corrected according to the real-time temperature information of the mold in the mold temperature controller and the correction interval time.

[0112] S206: If the temperature change state is a temperature stable state, obtain a second temperature of the mold in the temperature stable state.

[0113] In this embodiment, after the mold is continuously heated, the temperature of the mold will remain stable, and the second temperature is the temperature when the temperature of the mold remains stable. Specifically, the temperature of the mold can be detected in real time; if it is detected that the temperature of the mold remains stable, the temperature change state is determined to be a temperature stable state, and the second temperature is obtained.

[0114] S207 , determining a first response time of a temperature step increase of the mold according to the second temperature and the first temperature.

[0115] Specifically, the temperature value of the mold after the temperature step-up is determined based on the second temperature and the first temperature; and the time taken to heat the mold to the temperature value after the temperature step-up is determined as the first response time of the mold temperature step-up. Exemplarily, the temperature value of the mold after the temperature step-up can be determined by the following formula:

[0116] T h0.632 =T0+0.632(T h -T0);

[0117] Among them, T h0.632 Indicates the temperature value of the mold after the temperature step increases; Th represents the second temperature; T0 represents the first temperature; 0.632 represents the temperature step change constant;

[0118] Optionally, the temperature step change constant can be determined by performing an inverse Laplace transform on the first-order heating temperature response, and the expression of the temperature change with respect to time can be expressed by the following formula:

[0119]

[0120] Where c(t) represents the temperature change at time t; T represents the time constant.

[0121] Let t = T, then the temperature step change constant is 0.632.

[0122] S208, correcting the heating integral gain coefficient according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature.

[0123] Specifically, a certain algorithm is used to correct the heating integral gain coefficient according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature.

[0124] Optionally, the heating integral gain coefficient is corrected according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature, including: determining the time difference between the first response time and the first processing time; determining the first temperature difference between the set maximum working temperature and the initial temperature, and the second temperature difference between the set maximum working temperature and the second temperature; determining the optimal heating integral gain coefficient according to the time difference, the first temperature difference and the second temperature difference; and updating the heating integral gain coefficient to the optimal heating integral gain coefficient.

[0125] Exemplarily, the optimal heating integral gain coefficient may be determined using the following formula:

[0126]

[0127] Among them, K y_hi represents the optimal heating integral gain coefficient; T ref Indicates the set maximum working temperature; R1 indicates the first processing time; X1 indicates the first response time.

[0128] Optionally, the derivation process of the determination formula of the optimal heating integral gain coefficient is as follows: let the derivation conditions be: the initial heating integral gain coefficient is zero; the initial heating proportional gain coefficient is the ratio between the integer and the first temperature difference, then under the derivation conditions, the heating control open-loop transfer function can be expressed by the following formula:

[0129]

[0130] Among them, G ho (s)' represents the open-loop transfer function of heating control under the derived conditions;

[0131] When the initial heating integral gain coefficient is zero, the integral constant is approximately infinite, that is, the delay time constant is much smaller than the integral constant. Then the heating control open-loop transfer function under the derivation condition can be expressed as:

[0132]

[0133] Then the heating control closed-loop transfer function under the derivation conditions can be expressed as:

[0134]

[0135] According to the heating control closed-loop transfer function under the derivation conditions, the optimal theoretical value of the closed-loop gain coefficient and the optimal theoretical value of the time constant can be obtained; then in the parameter correction process, the actual value of the closed-loop gain coefficient should be the corresponding optimal theoretical value, and the actual value of the time constant should be the corresponding optimal theoretical value, which can be expressed by the following formula combination:

[0136]

[0137] in, Indicates the actual value of the closed-loop gain coefficient; It represents the theoretical value of the closed-loop gain coefficient; t1'-t2' represents the actual value of the time constant; Indicates the theoretical value of the time constant; T h '、T d '、T ref ', R1' and R2' respectively represent the actual temperature of the mold in a stable temperature state, the actual initial temperature of the mold, the actual maximum set working temperature of the mold temperature controller, the actual desaturation moment of the heating power and the actual temperature of the mold after a step increase in temperature during the parameter correction process;

[0138] The formula combination is sorted out, and according to the zero-pole cancellation principle, the formula for determining the optimal heating integral gain coefficient can be calculated.

[0139]

[0140] It can be understood that, by adopting the above technical scheme, by determining the time difference between the first response time and the first processing time; determining the first temperature difference between the set maximum working temperature and the initial temperature, and the second temperature difference between the set maximum working temperature and the second temperature; determining the optimal heating integral gain coefficient according to the time difference, the first temperature difference and the second temperature difference; updating the heating integral gain coefficient to the optimal heating integral gain coefficient, the time required for parameter correction of the mold temperature controller using a large inertia system is shortened, and the efficiency of parameter correction is improved.

[0141] Optionally, if the temperature change state is a temperature stable state, the maximum cooling power is used to continuously cool the mold, and the second processing time when the mold starts to be cooled is obtained; wherein, the start time of the second processing time is the time when the mold starts to be heated, and the end time of the second processing time is the time when the mold starts to be cooled; according to the initial temperature and the second temperature, the second response time of the temperature step reduction of the mold is determined; according to the second processing time and the second response time, the optimal cooling integral gain coefficient is determined; according to the correction interval time, the second processing time and the second response time, the optimal cooling proportional gain coefficient is determined.

[0142] The mold temperature controller further includes a cooling PI controller, which can be used to determine the cooling power for cooling the mold. The cooling proportional gain coefficient can be a proportional gain coefficient of the cooling PI controller; and the cooling integral gain coefficient can be an integral gain coefficient of the heating PI controller.

[0143] Specifically, according to the initial temperature and the second temperature, the temperature value of the mold after the temperature step is reduced is determined; illustratively, the temperature value of the mold after the temperature step is reduced can be determined by the following formula:

[0144] T c0.632 =T h -0.632(T h -T d );

[0145] Among them, T c0.632 Indicates the temperature value of the mold after the temperature step is reduced;

[0146] The duration of the time period from the moment when the mold starts to be heated to the moment when the mold is cooled to the temperature value after the temperature step is reduced is determined as the second response duration; the optimal cooling integral gain coefficient is determined based on the second processing duration and the second response duration; the optimal cooling proportional gain coefficient is determined based on the correction interval duration, the second processing duration and the second response duration.

[0147] Exemplarily, the optimal cooling integral gain coefficient may be determined by the following formula:

[0148]

[0149] Among them, K ci represents the optimal cooling integral gain coefficient; X2 represents the second response time; R2 represents the second processing time;

[0150] Exemplarily, the optimal cooling proportional gain coefficient may be determined by the following formula:

[0151]

[0152] Among them, K cp Represents the optimal cooling proportional gain coefficient.

[0153] It can be understood that by adopting the above technical scheme, the optimal cooling proportional gain coefficient and the optimal cooling integral gain coefficient can be determined after a cooling process, thereby improving the efficiency of parameter determination; the difference between the second response time and the second processing time is the response time of the temperature step reduction of the mold; the optimal cooling proportional gain coefficient and the optimal cooling integral gain coefficient are determined through the response time of the temperature step reduction of the mold, thereby improving the cooling effect of the mold temperature controller.

[0154] Optionally, collect the real-time temperature of the mold; determine a third temperature difference based on the real-time temperature and the set maximum working temperature; determine a fourth temperature difference based on the real-time temperature and the initial temperature; continuously cool the mold based on the cooling proportional gain coefficient and the cooling integral gain coefficient, including: determining the real-time cooling power based on the third temperature difference, the fourth temperature difference, the cooling proportional gain coefficient and the cooling integral gain coefficient; stop using the maximum cooling power to cool the mold, and use the real-time cooling power to cool the mold.

[0155] Exemplarily, the real-time cooling power can be determined by the following formula:

[0156]

[0157] Among them, P c (t) represents the real-time cooling power at time t.

[0158] It can be understood that the process of cooling the mold using the real-time cooling power determined by the above technical solution can be equivalent to the process of natural cooling of the mold, that is, the natural cooling process when the equivalent heating power is zero, thereby improving the cooling efficiency of the mold, and then improving the cooling control effect of the mold temperature controller on the mold.

[0159] Optional, Figure 2B This is a schematic diagram of the structure of a mold temperature controller. Figure 2BAs shown, the mold temperature controller includes a module for heating / cooling judgment, a cooling PI controller, a cooling device, a heating PI controller, a heating device, a mold and a temperature sensor; wherein the temperature sensor can continuously collect the real-time temperature of the mold, and collect the initial temperature of the mold before the parameter correction; the heating / cooling judgment module can judge the temperature change state of the mold according to the received real-time temperature, and determine whether to heat or cool the mold according to the temperature change state of the mold; if the temperature change state is a temperature rising state, it is determined to heat; the heating PI controller determines the heating power according to the set maximum working temperature, the real-time temperature, the heating proportional gain coefficient and the heating integral gain coefficient, and controls the heating device to heat the mold according to the determined heating power; if the temperature change state is a temperature stable state, the maximum cooling power is used for cooling, and the cooling proportional gain coefficient and the cooling integral gain coefficient are further determined; the cooling PI controller determines the cooling power according to the third temperature difference, the fourth temperature difference, the cooling proportional gain coefficient and the cooling integral gain coefficient, and controls the cooling device according to the determined cooling power to cool the mold.

[0160] Optional, Figure 2C This is a schematic diagram of the temperature change of a mold. Figure 2C As shown, at the start time, the mold changes from the initial temperature T d Start heating; at the time corresponding to R1, the heating power of the mold temperature controller is desaturated, and the temperature of the mold rises to T0; at the time corresponding to X1, the mold reaches the temperature T after the temperature step is increased. h0.632 At the time corresponding to R2, the mold is in a temperature stable state, and the temperature of the mold is T h ; and at the time corresponding to R2, stop heating the mold and start cooling the mold; at the time corresponding to X2 in the cooling process, the mold reaches the temperature T after the temperature step is reduced c0.632 .

[0161] The embodiment of the present invention obtains the initial temperature of the mold and sets the maximum working temperature; when the heating power of the mold temperature controller is desaturated, obtains the first temperature and the first processing time of the mold; wherein, the starting time of the first processing time is the time when the heating of the mold starts; the ending time of the first processing time is the time when the heating power of the mold temperature controller is desaturated; if the temperature change state is a temperature stable state, obtain the second temperature of the mold in the temperature stable state; according to the second temperature and the first temperature, determine the first response time of the temperature step increase of the mold; according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature, correct the heating integral gain coefficient, and the optimal heating proportional gain coefficient and the optimal heating integral gain coefficient can be determined through a heating process of the mold, thereby improving the efficiency of parameter correction, and before determining the optimal heating integral gain coefficient, the heating proportional gain coefficient is continuously corrected during the temperature rise process of the mold, so as to obtain the optimal heating proportional gain coefficient in advance, and then obtain the optimal heating integral gain coefficient, thereby improving the accuracy of the optimal heating integral gain coefficient and improving the heating control effect of the mold temperature controller.

[0162] Embodiment 3

[0163] Figure 3 This is a schematic diagram of the structure of a parameter correction device for a mold temperature controller provided in Embodiment 3 of the present invention. This embodiment can be applied to the case where the heating proportional gain coefficient of the mold temperature controller is corrected. The device can execute the parameter correction method of the mold temperature controller. The parameter correction device of the mold temperature controller can be implemented in the form of hardware and / or software, and the device can be configured in an electronic device.

[0164] See also Figure 3 The parameter correction device of the mold temperature controller shown includes a coefficient acquisition module 301, a heating module 302 and a first correction module 303, wherein:

[0165] The coefficient acquisition module 301 is used to obtain the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller;

[0166] The heating module 302 is used to continuously heat the mold in the mold temperature controller according to the heating proportional gain coefficient and the heating integral gain coefficient, and detect the temperature change state of the mold;

[0167] The first correction module 303 is used to correct the heating proportional gain coefficient according to the real-time heating rate of the mold, the default maximum heating rate and the correction interval time if the temperature change state is a temperature rising state.

[0168] The embodiment of the present invention obtains the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller through a coefficient acquisition module; the heating module continuously heats the mold in the mold temperature controller according to the heating proportional gain coefficient and the heating integral gain coefficient, and detects the temperature change state of the mold; the first correction module corrects the heating proportional gain coefficient according to the real-time heating rate of the mold, the default maximum heating rate and the correction interval duration if the temperature change state is a temperature rise state. The technical solution of the embodiment of the present invention can avoid the failure of the correction of the heating proportional gain coefficient due to the incompatibility of the initial heating proportional gain coefficient with the mold temperature controller by continuously correcting the heating proportional gain coefficient of the mold temperature controller during the heating process of the mold temperature controller, thereby ensuring that the optimal heating proportional gain parameter is obtained, thereby achieving the optimal control effect of the mold temperature controller.

[0169] Optionally, the first correction module 303 includes:

[0170] Comparison unit, used to compare the real-time heating rate and the default maximum heating rate;

[0171] The correction unit is used to correct the heating proportional gain coefficient according to the real-time heating rate and the correction interval if the real-time heating rate is greater than the default maximum heating rate.

[0172] Optional, revision unit, including:

[0173] A calculation subunit, used for calculating a correction heating proportional gain coefficient according to the real-time heating rate and the correction interval duration;

[0174] The updating subunit is used to update the heating proportional gain coefficient to a modified heating proportional gain coefficient.

[0175] Optionally, the device further includes:

[0176] The initial temperature acquisition module is used to obtain the initial temperature of the mold and set the maximum working temperature;

[0177] A first temperature acquisition module is used to acquire a first temperature and a first processing time of the mold when the heating power of the mold temperature controller is desaturated; wherein the start time of the first processing time is the time when the mold heating starts; and the end time of the first processing time is the time when the heating power of the mold temperature controller is desaturated;

[0178] The device also includes:

[0179] A second temperature acquisition module, used for acquiring a second temperature of the mold in the temperature stable state if the temperature change state is the temperature stable state;

[0180] A first duration determination module, used to determine a first response duration of a temperature step increase of the mold according to the second temperature and the first temperature;

[0181] The second correction module is used to correct the heating integral gain coefficient according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature.

[0182] Optionally, the second revision module includes:

[0183] A duration difference determination unit, used to determine a duration difference between a first response duration and a first processing duration;

[0184] a first difference determination unit, configured to determine a first temperature difference between the set maximum operating temperature and the initial temperature, and a second temperature difference between the set maximum operating temperature and the second temperature;

[0185] An optimal coefficient determination unit, used to determine an optimal heating integral gain coefficient according to the time difference, the first temperature difference, and the second temperature difference;

[0186] The updating unit is used to update the heating integral gain coefficient to an optimal heating integral gain coefficient.

[0187] Optionally, the device further comprises:

[0188] The first cooling module is used for continuously cooling the mold with the maximum cooling power if the temperature change state is a temperature stable state, and obtaining a second processing time when cooling the mold is started; wherein the start time of the second processing time is the time when heating the mold is started, and the end time of the second processing time is the time when cooling the mold is started;

[0189] A second time determination module, used to determine a second response time of a step-down in the temperature of the mold according to the initial temperature and the second temperature;

[0190] A first coefficient determination module, used for determining an optimal cooling integral gain coefficient according to a second processing time and a second response time;

[0191] The second coefficient determination module is used to determine the optimal cooling proportional gain coefficient according to the correction interval duration, the second processing duration and the second response duration.

[0192] Optionally, the device further comprises:

[0193] Temperature acquisition module, used to collect the real-time temperature of the mold;

[0194] A third difference determination module, used for determining a third temperature difference according to the real-time temperature and the set maximum operating temperature;

[0195] A fourth difference determination module, used for determining a fourth temperature difference according to the real-time temperature and the initial temperature;

[0196] A cooling power determination module, a cooling power determination unit, for determining the real-time cooling power according to the third temperature difference, the fourth temperature difference, the cooling proportional gain coefficient and the cooling integral gain coefficient;

[0197] The second cooling module is used to stop using the maximum cooling power to cool the mold and use the real-time cooling power to cool the mold.

[0198] The parameter correction device of the mold temperature controller provided in the embodiment of the present invention can execute the parameter correction method of the mold temperature controller provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the parameter correction method of the mold temperature controller.

[0199] Embodiment 4

[0200] Figure 4 A schematic diagram of the structure of an electronic device 400 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0201] like Figure 4 As shown, the electronic device 400 includes at least one processor 401, and a memory connected to the at least one processor 401 in communication, such as a read-only memory (ROM) 402, a random access memory (RAM) 403, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 401 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 402 or the computer program loaded from the storage unit 408 to the random access memory (RAM) 403. In the RAM 403, various programs and data required for the operation of the electronic device 400 can also be stored. The processor 401, the ROM 402, and the RAM 403 are connected to each other via a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0202] Multiple components in the electronic device 400 are connected to the I / O interface 405, including: an input unit 406, such as a keyboard, a mouse, etc.; an output unit 407, such as various types of displays, speakers, etc.; a storage unit 408, such as a disk, an optical disk, etc.; and a communication unit 409, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 409 allows the electronic device 400 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0203] The processor 401 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 401 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 401 executes the various methods and processes described above, such as a parameter correction method for a mold temperature controller.

[0204] In some embodiments, the parameter correction method of the mold temperature machine can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 408. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 400 via the ROM 402 and / or the communication unit 409. When the computer program is loaded into the RAM 403 and executed by the processor 401, one or more steps of the parameter correction method of the mold temperature machine described above can be executed. Alternatively, in other embodiments, the processor 401 can be configured to execute the parameter correction method of the mold temperature machine in any other appropriate manner (for example, by means of firmware).

[0205] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0206] The computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable mold temperature controller parameter correction device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program can be executed completely on the machine, partially on the machine, as an independent software package, partially on the machine and partially on a remote machine, or completely on a remote machine or server.

[0207] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0208] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0209] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0210] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS (Virtual Private Server) services.

[0211] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0212] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for correcting parameters of a mold temperature controller, characterized in that: The method comprises: Get the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller; Continuously heating the mold according to the heating proportional gain coefficient and the heating integral gain coefficient, and detecting a temperature change state of the mold; If the temperature change state is a temperature rising state, the heating proportional gain coefficient is corrected according to the real-time heating rate of the mold in the mold temperature controller, the default maximum heating rate and the correction interval duration.

2. The method according to claim 1, characterized in that The step of correcting the heating proportional gain coefficient according to the real-time heating rate of the mold in the mold temperature controller, the preset maximum heating rate and the correction interval duration includes: Comparing the real-time heating rate with the default maximum heating rate; If the real-time heating rate is greater than the default maximum heating rate, the heating proportional gain coefficient is corrected according to the real-time heating rate and the correction interval duration.

3. The method according to claim 2, characterized in that The step of correcting the heating proportional gain coefficient according to the real-time heating rate and the correction interval duration includes: Calculating a corrected heating proportional gain coefficient according to the real-time heating rate and the correction interval duration; The heating proportional gain coefficient is updated to the corrected heating proportional gain coefficient.

4. The method according to any one of claims 1 to 3, characterized in that While continuously heating the mold according to the heating proportional gain coefficient and the heating integral gain coefficient and detecting the temperature change state of the mold, the method further includes: Obtaining the initial temperature of the mold and setting the maximum operating temperature; When the heating power of the mold temperature controller is desaturated, a first temperature and a first processing time of the mold are obtained; wherein the starting time of the first processing time is the time when the heating of the mold starts; and the ending time of the first processing time is the time when the heating power of the mold temperature controller is desaturated; The method further comprises: If the temperature change state is a temperature stable state, obtaining a second temperature of the mold in the temperature stable state; Determining a first response time of a temperature step increase of the mold according to the second temperature and the first temperature; The heating integral gain coefficient is corrected according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature.

5. The method according to claim 4, characterized in that The step of correcting the heating integral gain coefficient according to the first processing time, the second temperature, the first response time, the initial temperature and the set maximum working temperature includes: Determining a time difference between the first response time and the first processing time; determining a first temperature difference between the set maximum operating temperature and the initial temperature, and a second temperature difference between the set maximum operating temperature and the second temperature; Determining an optimal heating integral gain coefficient according to the time difference, the first temperature difference and the second temperature difference; The heating integral gain coefficient is updated to the optimal heating integral gain coefficient.

6. The method according to claim 4, characterized in that The method further comprises: If the temperature change state is a temperature stable state, the mold is continuously cooled using the maximum cooling power, and a second processing time length when the mold is started to be cooled is obtained; wherein the start time of the second processing time length is the time when the mold is started to be heated, and the end time of the second processing time length is the time when the mold is started to be cooled; Determining a second response time of a step-down temperature drop of the mold according to the initial temperature and the second temperature; determining an optimal cooling integral gain coefficient according to the second processing time and the second response time; An optimal cooling proportional gain coefficient is determined according to the correction interval duration, the second processing duration, and the second response duration.

7. The method according to claim 6, characterized in that The method further comprises: Collecting the real-time temperature of the mold; Determining a third temperature difference according to the real-time temperature and the set maximum operating temperature; Determining a fourth temperature difference according to the real-time temperature and the initial temperature; Determining a real-time cooling power according to the third temperature difference, the fourth temperature difference, the cooling proportional gain coefficient, and the cooling integral gain coefficient; Stop using the maximum cooling power to cool the mold, and use the real-time cooling power to cool the mold.

8. A parameter correction device for a mold temperature controller, characterized in that: The device comprises: The coefficient acquisition module is used to obtain the correction interval duration, heating proportional gain coefficient, heating integral gain coefficient and default maximum heating rate of the mold temperature controller; A heating module, used for continuously heating the mold in the mold temperature controller according to the heating proportional gain coefficient and the heating integral gain coefficient, and detecting the temperature change state of the mold; The first correction module is used to correct the heating proportional gain coefficient according to the real-time heating rate of the mold, the default maximum heating rate and the correction interval if the temperature change state is a temperature rising state.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the parameter correction method of the mold temperature controller according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the parameter correction method of the mold temperature controller according to any one of claims 1 to 7 when executed.

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