Packaging method of multi-layer cascaded lightning protection filtering connector

Abstract

The invention discloses a packaging method of a multi-layer cascaded lightning protection filtering connector. The packaging method comprises the following steps: bonding functional modules on a plurality of substrates; the multiple substrates are stacked into a whole in the vertical direction, and the metal bonding pads of every two adjacent substrates are connected through contact pins; activating the functional module and a metal bonding pad of the substrate by adopting a plasma activation technology; bonding and connecting the functional module and a metal bonding pad of the substrate by adopting a thick wire lead to obtain a laminated substrate; performing plastic packaging on the laminated substrate; cutting the laminated substrate after plastic packaging according to a preset requirement to obtain a plurality of independent modules; a plurality of independent modules are assembled within the connector. The invention has the advantages of miniaturization, low cost, low weight and integration.

Description

Technical Field

[0001] The invention belongs to the technical field of multi-layer cascade lightning protection filter connectors, and in particular relates to a packaging method of a multi-layer cascade lightning protection filter connector. Background Art

[0002] As the system develops towards miniaturization and intelligent integration, in order to ensure the high reliability of the system, the corresponding auxiliary modules (sensors, filters, electric energy sources, etc.) will also increase. However, the space and load weight inside the whole machine are limited, but the auxiliary modules occupy a large space and weight. It is reported that for every 1kg increase in the weight of the launched spacecraft, the corresponding cost will also increase by 250,000 yuan. Therefore, it is necessary to use new processes to highly integrate the auxiliary modules into the essential basic component connectors to save the separate design of the auxiliary module space, reduce weight, reduce costs, and increase the payload of the body. Summary of the invention

[0003] The technical problem solved by the present invention is to overcome the deficiencies of the prior art and provide a packaging method for a multi-layer cascade lightning protection filter connector, which has the advantages of miniaturization, low cost, low weight and integration.

[0004] The objective of the present invention is achieved through the following technical scheme: A packaging method for a multi-layer cascade lightning protection filter connector, comprising: bonding a functional module to a plurality of substrates; stacking the plurality of substrates in a vertical direction into a whole, wherein the metal pads of two adjacent substrates are connected by pins; activating the metal pads of the functional module and the substrate by plasma activation technology; connecting the metal pads of the functional module and the substrate by thick wire bonding to obtain a laminated substrate; plastic sealing the laminated substrate; cutting the laminated substrate after plastic sealing according to preset requirements to obtain a plurality of independent modules; assembling the plurality of independent modules in a connector.

[0005] In the packaging method of the multi-layer cascade lightning protection filter connector, the functional module is a surge protection device.

[0006] In the packaging method of the multi-layer cascade lightning protection filter connector, the substrate is an organic substrate or a ceramic substrate.

[0007] In the packaging method of the multi-layer cascade lightning protection filter connector, the adhesive is epoxy glue followed by conductive silver paste, and the curing temperature does not exceed 120°C.

[0008] In the packaging method of the multi-layer cascade lightning protection filter connector, pins are used as the intermediate dielectric layer to connect two adjacent substrates, and it is necessary to ensure that the parallelism of the two substrates after stacking is within a preset range.

[0009] In the packaging method of the multi-layer cascade lightning protection filter connector, the plasma is oxygen, argon or nitrogen.

[0010] In the packaging method of the multi-layer cascade lightning protection filter connector, the plastic packaging material is selected to be high-voltage resistant material, the baking temperature does not exceed 110° C., and the gap between two adjacent substrates is filled with plastic packaging material to achieve the preset void ratio and stratification requirements.

[0011] In the packaging method of the multi-layer cascade lightning protection filter connector, the laminated substrate after plastic sealing is cut by a grinding wheel cutter or laser cutting.

[0012] In the packaging method of the multi-layer cascade lightning protection filter connector, the surge protection device includes a gas discharge tube, a varistor, a voltage regulator diode, and a transient voltage suppression diode.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) The present invention utilizes the internal space advantage of the connector to integrate the functional module inside the connector, giving it a lightning protection and filtering function. Compared with traditional connectors, it adds specific functions and saves space;

[0015] (2) The present invention uses a 3D stacking method to vertically integrate the substrates and then performs plastic encapsulation, which can greatly reduce the lateral area of ​​the plastic encapsulated device;

[0016] (3) The present invention uses pins as the medium between the two substrates. The pins occupy a small space and are flexible to assemble. During plastic sealing, the plastic sealing material can easily fill the gap between the substrates.

[0017] (4) The present invention reserves plug-in pins when the functional module is plastic-sealed, and can also realize electrical connection of multiple functional modules through the plug-in pin method. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0019] Figure 1 is a schematic diagram of a multi-layer cascade lightning protection filter connector provided by an embodiment of the present invention;

[0020] FIG. 2( a ) is a schematic diagram of a substrate provided in an embodiment of the present invention;

[0021] FIG2( b ) is another schematic diagram of a substrate provided by an embodiment of the present invention;

[0022] Figure 3 Schematic diagram of a laminated substrate provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to be able to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] Figure 1 2( a ) is a schematic diagram of a multi-layer cascade lightning protection filter connector provided in an embodiment of the present invention, FIG. 2( b ) is another schematic diagram of a substrate provided in an embodiment of the present invention, Figure 3 Schematic diagram of a laminated substrate provided by an embodiment of the present invention. Figure 1 , Figure 2(a), Figure 2(b) and Figure 3 This embodiment provides a packaging method for a multi-layer cascade lightning protection filter connector, the method comprising:

[0025] Bonding functional modules to multiple substrates;

[0026] Stacking a plurality of substrates into a whole in a vertical direction, wherein metal pads of two adjacent substrates are connected by pins;

[0027] Use plasma activation technology to activate the metal pads of functional modules and substrates;

[0028] The functional module and the metal pad of the substrate are connected by thick wire bonding to obtain a laminated substrate;

[0029] Plastic encapsulating the laminated substrate;

[0030] Cutting the laminated substrate after plastic sealing according to preset requirements to obtain multiple independent modules;

[0031] Multiple individual modules are assembled within the connector.

[0032] The functional module is a surge protection device. The surge protection device includes a gas discharge tube, a varistor, a voltage regulator diode, and a transient voltage suppression diode. The substrate is an organic substrate or a ceramic substrate.

[0033] The adhesive is epoxy glue followed by conductive silver paste, and the curing temperature does not exceed 120°C.

[0034] When two adjacent substrates are connected using pins as an intermediate dielectric layer, it is necessary to ensure that the parallelism of the two substrates after stacking is within a preset range.

[0035] The plasma is oxygen, argon or nitrogen.

[0036] The plastic encapsulation material is made of high pressure resistant material, the baking temperature does not exceed 110°C, and the gap between two adjacent substrates is filled with plastic encapsulation material to achieve the preset void ratio and delamination requirements.

[0037] The laminated substrate after plastic sealing is cut by a grinding wheel knife or laser cutting.

[0038] Specifically, 1) the functional module packaging uses high-precision chip bonding technology to bond the chip, resistor, capacitor and inductor to the organic substrate or ceramic substrate. The bonding glue can be epoxy glue, conductive silver paste, etc., and the curing temperature does not exceed 120°C. Then the organic substrate or ceramic substrate is stacked and packaged using 3D stacking technology. When stacking, pins can be used as the intermediate dielectric layer to combine the two substrates. It is necessary to ensure that the parallelism of the two substrates after stacking is within a certain range.

[0039] 2) Use plasma activation technology to activate the chip and substrate metal pads with oxygen, argon or nitrogen plasma.

[0040] 3) Use thick wire bonding technology to achieve electrical interconnection between multi-layer substrates, control the bonding point morphology and wire arc height, and ensure bonding reliability.

[0041] 4) Use high-pressure plastic encapsulation technology to complete the functional module packaging. The plastic encapsulation mold reserves the signal pin position. The plastic encapsulation material is selected to be high-pressure resistant material. The baking temperature does not exceed 110°C. The plastic encapsulation pressure and flow rate are controlled to ensure that the gaps between the laminated substrates are filled with plastic encapsulation material to meet the void rate and delamination requirements.

[0042] 5) The plastic-sealed substrate is cut with a grinding wheel or laser, cleaned after cutting, and finally debonded and sorted to form independent modules with the same or different functions. The modules are put into use after passing the screening test.

[0043] 6) Finally, the functional module is assembled in the connector, and the electrical signal is led out through the pin. The functional module can be assembled independently or 3D stacked with other functional modules to realize the packaging of multi-layer cascade lightning protection filter connector.

[0044] The main functional modules of the lightning protection filter connector are surge protection devices, including gas discharge tubes, varistors, voltage regulator diodes, transient voltage suppression diodes (TVS), etc. Taking TVS as an example, the functional module usually integrates N TVS devices. Compared with the standard packaging process, the invention can greatly save space size.

[0045] The volume of the functional module in the traditional packaging method is NV1≈N×V(bare die+substrate+bonding wire+molding body), while the volume of the packaging method of the present invention is V2≈NV(bare die)+NV(substrate)+NV(bonding wire)+V(molding body)

[0046] Among them, NV1 represents the packaging volume of the traditional packaging method, N represents the number of packaged tube cores, V2 represents the packaging volume of the present invention, and N represents the number of bare tube cores.

[0047] Effect: The size of the functional module is greatly reduced through this formula.

[0048] Metal materials with excellent conductivity and shielding properties, such as copper and aluminum, are selected to manufacture connector housings and shielding covers to form an effective electromagnetic shielding structure. Functional modules such as overvoltage protection and filters are integrated inside the connector to improve the overall performance of the connector. The advantages of ceramic copper-clad circuit boards, such as good heat dissipation coefficient and thermal matching with chips, are used to integrate bare chips, electronic components, metal connections, through-holes and external connections, and then the whole is plastic-sealed. After plastic sealing, it can be used as a single device, or it can be stacked in the connector and then plastic-sealed. Finally, the electrical signal of the electrical connection is exported by means of pins.

[0049] Through in-depth analysis of the characteristics and impact mechanisms of lightning surges, the key parts of the connector that are most vulnerable to damage under lightning surges are identified; a new connector structure is designed to increase the buffer zone for lightning surge protection, and high-voltage materials and isolation structures are used to improve the connector's ability to resist lightning surges. Overvoltage protection components such as gas discharge tubes and TVS diodes are introduced to absorb and release overvoltages, protecting connectors and electronic equipment from lightning surges.

[0050] Faced with the serious hazards of lightning surges faced by airborne equipment, and the current situation that there are few types and specifications of lightning protection and filtering connectors developed in China, a packaging method for a multi-layer cascade lightning protection and filtering connector based on 3D stacking technology and lightning protection and filtering technology is proposed to solve the problems of miniaturization, integration, lightweight and high integration of lightning protection and filtering connectors. This method breaks through the 3D multi-layer stacking, lightning surge resistance and SiP integrated packaging technology to realize a miniaturized and lightweight lightning protection and filtering connector.

[0051] The present invention utilizes the internal space advantage of the connector to integrate the functional module inside the connector, giving it a lightning protection and filtering function, adding specific functions compared to traditional connectors and saving space. If the side length of existing plastic-encapsulated devices exceeds 25 mm, there will be a more serious warping problem, affecting the solderability and reliability of the device. The present invention uses a 3D stacking method to vertically integrate the substrates before plastic encapsulation, which can greatly reduce the lateral area of ​​the plastic-encapsulated device. When traditional substrates are stacked in 3D, transition sheets are often used as the medium between substrates. This method tests the thinning ability and thin sheet mounting ability of the transition sheet, and the space of the transition sheet will also be wasted. The present invention uses pins as the medium between the two layers of substrates. The pins take up little space and are flexible to assemble. During plastic encapsulation, the plastic encapsulation material can easily fill the gap between the substrates. The present invention reserves pins when the functional module is plastic encapsulated, and can also realize the electrical connection of multiple functional modules through pins.

[0052] The present invention makes up for the deficiency of single function of existing connectors and increases the added value of connectors. The 3D stacking method can effectively utilize the internal space of the connector, greatly reduce the module size and weight. The SiP integrated packaging technology is adopted, which can be achieved under existing industrial conditions, with low development cost, and can be extended to develop and manufacture other functional connector modules.

[0053] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A packaging method for a multi-layer cascade lightning protection filter connector, characterized in that include: Bonding functional modules to multiple substrates; Stacking a plurality of substrates into a whole in a vertical direction, wherein metal pads of two adjacent substrates are connected by pins; Use plasma activation technology to activate the metal pads of functional modules and substrates; The functional module and the metal pad of the substrate are connected by thick wire bonding to obtain a laminated substrate; Plastic encapsulating the laminated substrate; Cutting the laminated substrate after plastic sealing according to preset requirements to obtain multiple independent modules; Multiple individual modules are assembled within the connector.

2. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The functional module includes a surge protection device.

3. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The substrate is an organic substrate or a ceramic substrate.

4. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The adhesive is epoxy adhesive or conductive silver paste, and the curing temperature does not exceed 120°C.

5. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 4, characterized in that: The curing temperature of the adhesive shall not exceed 120°C.

6. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: When two adjacent substrates are connected using pins as an intermediate dielectric layer, it is necessary to ensure that the parallelism of the two substrates after stacking is within a preset range.

7. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The plasma is oxygen, argon or nitrogen.

8. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The plastic encapsulation material is made of high pressure resistant material, the baking temperature does not exceed 110°C, and the gap between two adjacent substrates is filled with plastic encapsulation material to achieve the preset void ratio and delamination requirements.

9. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 1, characterized in that: The laminated substrate after plastic sealing is cut by a grinding wheel knife or laser cutting.

10. The packaging method of the multi-layer cascade lightning protection filter connector according to claim 2, characterized in that: The surge protection device includes a gas discharge tube, a varistor, a voltage regulator diode, and a transient voltage suppression diode.

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