Terminal equipment, packaging module and preparation method thereof

Abstract

The invention provides terminal equipment, a packaging module and a preparation method of the packaging module. The packaging module comprises a modified plastic base material, the modified plastic base material comprises an organic metal compound, and the modified plastic base material is provided with a groove part. And the metal bonding pad is arranged in the groove part. And the component is arranged on one side, far away from the bottom wall of the groove part, of the metal bonding pad. And the shielding cover is arranged at the opening of the groove part in a covering manner, and the metal bonding pad and the component are packaged in the groove part by the shielding cover. The groove part is arranged on the modified plastic base material, and the metal bonding pad and the component are packaged in the groove part through the shielding cover, so that an additional built-in soft board or a connector does not need to be added, the product volume can be reduced, the wiring space of PCB layout is saved, the assembly process cost is reduced, and the thin development trend of terminal equipment is met; and the miniaturization design requirement is met.

Description

Technical Field

[0001] The present disclosure relates to the field of packaging technology, and in particular to a terminal device, a packaging module and a preparation method thereof. Background Art

[0002] The trend of thin terminal equipment is usually achieved through packaging using the LDS (laser forming technology) process, which increases the switching space and optimizes the layout, reducing the size of the product. However, wearable products, mobile phones, antennas, lidars and other fields have increasingly stringent requirements on resolution and anti-interference capabilities.

[0003] At present, the packaging solutions for the products in the above fields usually use shell materials to package built-in soft boards or connectors to achieve the welding of components. Built-in soft boards or connectors will take up extra space, which is not conducive to the design requirements of miniaturization. Summary of the invention

[0004] The present disclosure provides a terminal device, a packaging module and a preparation method thereof to solve at least some of the problems in the related art.

[0005] A first aspect of the present disclosure provides a packaging module, comprising:

[0006] A modified plastic substrate, wherein the modified plastic substrate comprises an organic metal complex and the modified plastic substrate is provided with a groove portion;

[0007] A metal pad is disposed in the groove portion;

[0008] Components are arranged on a side of the metal pad away from the bottom wall of the groove;

[0009] A shielding cover is arranged at the opening of the groove portion, and the shielding cover encapsulates the metal pad and the components in the groove portion.

[0010] Optionally, it also includes a circuit wiring layer laid on the bottom wall of the groove portion; the metal pad is connected to the circuit wiring layer.

[0011] Optionally, a gap portion is formed between the metal pad and the side wall of the groove portion; the shielding cover includes a cover body and a connecting portion connected to the side periphery of the cover body, the connecting portion extends into the gap portion and is connected to the bottom wall of the groove portion or the side wall of the metal pad; the cover body is arranged at the opening of the groove portion.

[0012] Optionally, the component includes a chip, and the shielding cover is provided with an avoidance hole at a position corresponding to the chip.

[0013] Optionally, the size of the component is not less than 0.6 mm*0.3 mm; and / or

[0014] The components include a chip, and the distance between different components in the chip is not less than 0.4 mm.

[0015] A second aspect of the present disclosure provides a method for preparing a packaging module, comprising:

[0016] A groove portion is formed on the surface of a modified plastic substrate including an organic metal complex;

[0017] Disposing a metal pad in the groove portion;

[0018] Arrange components on a side of the metal pad away from the bottom wall of the groove portion;

[0019] A shielding cover is arranged at the opening of the groove portion, and the shielding cover encapsulates the metal pad and the components in the groove portion.

[0020] Optionally, a metal pad is provided in the groove portion, comprising:

[0021] Laying a circuit wiring layer on the bottom wall of the groove portion;

[0022] The metal pad is disposed on the circuit wiring layer.

[0023] Optionally, components are arranged on a side of the metal pad away from the bottom wall of the groove portion, including:

[0024] Apply solder paste on a side of the metal pad away from the bottom wall of the groove portion according to the position where the component is to be installed;

[0025] Mounting the components on the solder paste;

[0026] The components are fixedly connected to the solder paste.

[0027] Optionally, applying solder paste according to the position where the component is to be installed includes:

[0028] Holes are opened on the stepped steel mesh corresponding to the installation positions of the components, and solder paste is applied on the holes.

[0029] Optionally, the stepped steel mesh includes a first stepped portion and a second stepped portion, and a height difference between the first stepped portion and the second stepped portion is not greater than 0.3 mm.

[0030] Optionally, the melting temperature of the solder paste is below 200°C.

[0031] Optionally, a gap is formed between the metal pad and the side wall of the groove; the shielding cover includes a cover body and a connecting portion connected to the side periphery of the cover body; and a shielding cover is arranged at the opening of the groove, including:

[0032] Apply solder paste on the gap portion;

[0033] The connecting portion is extended into the gap portion and mounted on the solder paste so that the cover body covers the opening of the groove portion;

[0034] The connecting portion is fixedly connected to the solder paste.

[0035] Optionally, applying solder paste on the gap portion includes:

[0036] Opening holes at positions corresponding to the gaps on the stepped steel mesh, and applying solder paste on the openings; or

[0037] The solder paste is applied to the position corresponding to the gap by using the tinning process.

[0038] A third aspect of the present disclosure provides a terminal device, comprising the packaging module as described in the first aspect.

[0039] The technical solution provided by the present disclosure can at least achieve the following beneficial effects:

[0040] The packaging module disclosed in the present invention, by providing a groove portion on a modified plastic substrate, encapsulates metal pads and components in the groove portion through a shielding cover, does not require the addition of an additional built-in flexible board or connector, and can reduce the product volume, save the wiring space of the PCB layout, and reduce the assembly process cost. It meets the development trend of thin terminal equipment and is conducive to miniaturization design requirements.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 is a structural schematic diagram of a packaging module in an exemplary embodiment of the present disclosure;

[0044] Figure 2 is an exploded schematic diagram of a shielding cover and a modified plastic substrate of a packaging module in an exemplary embodiment of the present disclosure;

[0045] Figure 3 is an overall exploded schematic diagram of a packaging module in an exemplary embodiment of the present disclosure;

[0046] Figure 4is a partial schematic diagram of a terminal device after removing a shielding cover in an exemplary embodiment of the present disclosure;

[0047] Figure 5 is a flowchart of a method for preparing a packaging module in an exemplary embodiment of the present disclosure;

[0048] Figure 6 and Figure 7 It is a detailed step flow chart of a method for preparing a packaging module in an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are only examples of devices and methods consistent with some aspects of the present disclosure.

[0050] The terms used in the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate quantity restrictions, but indicate that there is at least one, and will be separately described if only "one" is referred to. "Multiple" or "several" means two and more than two. Unless otherwise specified, similar words such as "front", "rear", "lower" and / or "upper", "top", "bottom" are only for the convenience of explanation, and are not limited to one position or one spatial orientation. Similar words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" cover the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0051] The terminal device, packaging module and preparation method thereof disclosed in the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can be combined with each other.

[0052] See also Figures 1 to 3As shown, the embodiment of the present disclosure proposes a packaging module 100, which can be applied to wearable products, mobile phones, antennas, laser radars and other fields. The packaging module 100 includes a modified plastic substrate 10, a metal pad 20, components 30 and a shielding cover 40. Among them, the modified plastic substrate 10 contains an organic metal composite, so that the modified plastic substrate can have the property of metallic conductivity. The modified plastic substrate 10 is provided with a groove portion 11. In this embodiment, the groove portion 11 is arranged on the upper surface of the modified plastic substrate 10. Optionally, the component printing of the packaging module 100 disclosed in the present disclosure adopts a single PCS operation method 9 (single-piece processing method).

[0053] The metal pad 20 is disposed in the groove 11 of the modified plastic substrate 10. The component 30 is disposed on the side of the metal pad 20 away from the bottom wall of the groove 11. That is, the component 30 is close to the opening of the groove 11. The shielding cover 40 is disposed at the opening of the groove 11, and the shielding cover 40 encapsulates the metal pad 20 and the component 30 in the groove 11.

[0054] The package module 100 disclosed in the present invention, by setting a groove portion 11 on the modified plastic substrate 10, encapsulates the metal pad 20 and the component 30 in the groove portion 11 through the shielding cover 40, does not need to add an additional built-in soft board or connector, and can reduce the product volume, save the wiring space of the PCB layout, reduce the process cost of assembling the connector, conform to the development trend of thin terminal equipment, and is conducive to the design requirements of miniaturization. It can be applied to wearable products, mobile phones, antennas, laser radars and other fields, and can meet the increasingly stringent requirements of the above products on resolution and anti-interference ability, and achieve the purpose of improving reliability and anti-interference, optimizing signal transmission, and protecting devices in scenarios with high reliability requirements, thereby improving the connection reliability and product quality of the product.

[0055] It can be understood that the packaging module disclosed in the present invention adopts an additional shielding cover design, completes the three-dimensional circuit packaging design by modifying the plastic substrate, realizes the effective connection between the component welding end and the metal pad through welding, and from a structural perspective, achieves the purpose of protecting devices, saving device layout, preventing interference, and buffering stress deformation.

[0056] In some optional embodiments, the package module 100 may further include a circuit wiring layer 21, which is laid on the bottom wall of the groove portion 11. The metal pad 20 is connected to the circuit wiring layer 21. It can be understood that the circuit wiring layer 21 can be laid in the groove portion 11 to perform a three-dimensional circuit design, that is, to complete the wiring circuit design inside the modified plastic substrate. It should be noted that the thickness of the modified plastic substrate 10 can be set according to the requirements of the circuit wiring, and it only needs to meet the wiring conditions.

[0057] like Figure 2As shown, in some optional embodiments, a gap portion 12 is formed between the metal pad 20 and the side wall of the groove portion 11. The shielding cover 40 includes a cover body 41 and a connecting portion 42 connected to the side periphery of the cover body 41, wherein the connecting portion 42 extends into the gap portion 12 and is connected to the bottom wall of the groove portion 11 or the side wall of the metal pad 20. The cover body 41 is provided at the opening of the groove portion 11. In this way, the metal pad 20 and the components 30 are encapsulated in the groove portion 11 by the cover body 41, which can improve the sealing of the metal pad 20 and the components 30 and optimize the signal anti-interference ability of the product. By extending the connecting portion 42 into the gap portion 12 and connecting to the bottom wall of the groove portion 11 or the side wall of the metal pad 20, the connection strength between the shielding cover 40 and the modified plastic substrate 10 can be enhanced. Optionally, the cover body 41 and the connecting portion 42 can be an integrally formed structure. The four sides of the metal pad 20 are spaced apart from the sidewalls of the groove portion 11 to form a closed annular gap portion 12, thereby increasing the area of ​​the interconnected portion between the connection portion 42 and the groove portion 11 and improving the connection reliability between the two.

[0058] In some optional embodiments, the components 30 may include chips and other types of electrical devices, and the shielding cover 40 is provided with avoidance holes corresponding to the position of the chip, that is, the shielding cover 40 is subjected to air avoidance treatment at the chip, which can effectively prevent the radiation interference generated by the wireless module from spreading, protect the device from collision during assembly, and at the same time, can apply stress around to buffer the stress concentration in the electronic packaging area, and reduce the deformation of the modified plastic substrate. Optionally, the size of the components 30 is not less than 06.mm*0.3mm. The components 30 include chips, and the distance between different components (transistors, capacitors, etc.) in the chip is not less than 0.4mm. It can be understood that the selection of components: the minimum component requirement is at least 0201 device (size not less than 0.6mm*0.3mm), the chip pitch spacing ≥0.4mm, the selection of components: the minimum component requirement is at least 0201 device (0.6mm*0.3mm), chip pitch (that is, the distance between different components in the chip), and the spacing ≥0.4mm.

[0059] See also Figure 4 As shown, the embodiments of the present disclosure also provide a terminal device, which can be a product in the fields of wearable products, mobile phones, tablet computers, antennas, laser radars, etc. The terminal device may include a housing 90 and a packaging module 100 as described in the above embodiments and implementation methods, and the packaging module 100 is assembled in the housing 90. The structural distribution of the packaging module is shown in the figure, and the modified plastic substrate is used as a three-dimensional design of the pad board design surface. The mounting of components is achieved through a certain printing process. In order to ensure signal shielding and facilitate the repair of components, the shielding cover is used to complete the closure, and the air avoidance treatment is performed above the chip.

[0060] The terminal device disclosed in the present invention, by setting a groove portion on the modified plastic substrate of the packaging module, encapsulating the metal pad and components in the groove portion through a shielding cover, does not need to add an additional built-in soft board or connector, can reduce the product volume, save the wiring space of the PCB layout, reduce the process cost of assembling the connector, conforms to the thin development trend of terminal devices, and is conducive to miniaturization design requirements. It can meet the increasingly stringent requirements of products on resolution and anti-interference capabilities, achieve the purpose of improving reliability and anti-interference, optimizing signal transmission, and protecting devices in scenarios with high reliability requirements, and improve the connection reliability and product quality of the product.

[0061] See also Figure 5 , and combined with Figures 1 to 3 As shown, the embodiment of the present disclosure also provides a method for preparing a packaging module, which may include steps S11-S14:

[0062] Step S11 , a groove portion 11 is formed on the surface of the modified plastic substrate 10 containing the organic metal complex to form a receiving space for receiving the metal pad and components.

[0063] Step S12, a metal pad 20 is provided in the groove 11. Optionally, a circuit wiring layer 21 may be laid on the bottom wall of the groove 11, and then the metal pad design may be performed. Furthermore, the metal pad on the modified plastic substrate on which the wiring circuit design has been completed may be plasma and physically cleaned to ensure the smooth progress of the subsequent tinning operation.

[0064] Step S13, components 30 are arranged on the side of the metal pad 20 away from the bottom wall of the groove 11. Optionally, a single pcs operation mode can be adopted to arrange components such as resistors, capacitors, and inductors according to a modular design to complete the assembly of components 30.

[0065] In step S14, a shielding cover 40 is provided at the opening of the groove portion 11. The shielding cover 40 encapsulates the metal pad 20 and the component 30 in the groove portion 11, thereby completing the preparation of the packaging module.

[0066] The preparation method of the package module disclosed in the present invention, by setting a groove portion 11 on the modified plastic substrate 10, encapsulating the metal pad 20 and the component 30 in the groove portion 11 through the shielding cover 40, does not need to add additional built-in soft boards or connectors, can reduce the product volume, save the wiring space of the PCB layout, reduce the process cost of assembling the connector, conform to the development trend of thin terminal equipment, and is conducive to the design requirements of miniaturization. It can be applied to wearable products, mobile phones, antennas, laser radars and other fields, can meet the increasingly stringent requirements of the above products for resolution and anti-interference ability, achieve the purpose of improving reliability and anti-interference, optimizing signal transmission, and protecting devices in scenarios with high reliability requirements, and improve the connection reliability and product quality of the product.

[0067] In some optional embodiments, in the above step S12, a metal pad 20 is set in the groove portion 11. The circuit wiring layer 21 can be first laid on the bottom wall of the groove portion 11, and then the metal pad 20 is set on the circuit wiring layer 21, thereby completing the wiring and metal pad assembly design.

[0068] See also Figure 6 As shown, in some optional implementations, the above step S13, disposing the component 30 on the side of the metal pad 20 away from the bottom wall of the groove portion 11, may include the following steps S131-S133:

[0069] S131, solder paste may be applied first on the side of the metal pad 20 away from the bottom wall of the groove 11 according to the position where the component is to be installed, that is, the assembly between the component and the metal pad is achieved through the solder paste.

[0070] S132, mounting the components on the solder paste. Optionally, a chip mounter can be used to accurately mount the components on the predetermined positions of the components on the metal pads by position picking.

[0071] S133, the components are fixedly connected to the solder paste. Optionally, a reflow soldering process may be used to fix the components to the solder paste.

[0072] In some optional implementations, the above step S131, according to the solder paste on the position where the component is to be installed, may include the following two methods:

[0073] (1) A hole is opened on the stepped steel mesh corresponding to the installation position of the component, and solder paste is applied to the hole for soldering connection with the component. In this way, the component and the modified plastic substrate are connected to each other through the solder paste. Optionally, the melting temperature of the solder paste is below 200°C, that is, the solder paste is selected to be medium-low temperature solder paste, which is conducive to process processing. Optionally, the tinning operation can be realized by tinning on a printing machine.

[0074] Furthermore, the step steel mesh may include a first step portion and a second step portion, and the height difference between the first step portion and the second step portion is not greater than 0.3mm. It can be understood that, assuming that the first step portion is a recessed portion, and the second step portion is higher than the first step portion, if a step steel mesh printing process is adopted, the depth of the two concave sides (that is, a step portion) of the step steel mesh, that is, the height difference between the first step portion and the second step portion is ≤0.3mm (considering the component mounting printing process). When the height difference between the two parts of the step steel mesh is greater than 0.3mm, the tinning effect is poor and the steel mesh demolding effect is poor. Optionally, in addition to using a step steel mesh, other carriers can also be used to position the solder paste.

[0075] (2) Using the tinning process, solder paste is applied to the installation position corresponding to the component 30. If the tinning process is used to implement component mounting, there is no depth limit on the side of the modified plastic substrate.

[0076] In some optional embodiments, after applying solder paste according to the position where the component 30 is to be installed, before mounting the component 30 on the solder paste, the method may further include: detecting the actual tinning position of the solder paste. Optionally, the printed form of the solder paste on the component part may be detected by SPI solder paste detection equipment to detect the position, amount and form of the solder paste to ensure the quality of tinning.

[0077] In some optional embodiments, after mounting the component 30 on the solder paste and before fixing the component 30 to the solder paste, the process may further include: detecting the actual mounting position of the component 30. Optionally, AOI (Automated Optical Inspection) may be used to detect the component mounting to ensure the mounting quality of the component.

[0078] In some optional embodiments, after the component 30 is fixedly connected to the solder paste, the process may further include: inspecting the soldering condition of the component 30 and the solder paste, that is, inspecting the component soldering again through AOI automatic optical inspection to ensure the assembly quality of the component.

[0079] See also Figure 7 , and combined with Figures 1 to 3 As shown, in some optional embodiments, a gap portion 12 is formed between the metal pad 20 and the side wall of the groove portion 11. The shielding cover 40 includes a cover body 41 and a connecting portion 42 connected to the side periphery of the cover body 41. The above step S14, arranging the shielding cover 40 at the opening of the groove portion 11, may include the following steps S141-S143:

[0080] Step S141 , solder paste is applied to the gap portion 12 . That is, the shielding cover and the modified plastic substrate are assembled by solder paste. Optionally, solder paste can be applied to the bottom wall of the groove portion 11 or the side wall of the metal pad 20 .

[0081] Step S142, extending the connecting portion 42 into the gap portion 12 and mounting it on the solder paste, so that the cover body 41 covers the opening of the groove portion 11. Optionally, a chip mounter for mounting special-shaped components can be used to complete the attachment of the shielding cover.

[0082] Step S143, the connecting portion 42 is fixedly connected to the solder paste. Optionally, a reflow soldering process may be used to fix the shielding cover to the solder paste.

[0083] Optionally, the design of the shielding cover can also adopt air avoidance treatment for the chip area. For example, an avoidance hole is opened at the position of the shielding cover 40 corresponding to the chip to achieve air avoidance treatment at the position of the shielding cover 40 corresponding to the chip, which can effectively prevent the radiation interference generated by the wireless module from spreading, protect the device from collision during assembly, and at the same time, apply stress around to buffer the stress concentration in the electronic packaging area, reducing the deformation of the modified plastic substrate.

[0084] In some optional implementations, the above step S141, applying solder paste on the gap portion 12, may include the following two methods:

[0085] (1) A hole is opened on the stepped steel mesh at a position corresponding to the gap portion 12, and solder paste is applied to the hole.

[0086] (2) Using the tinning process, solder paste is applied to the position corresponding to the gap 12. It should be noted that using a tinning machine to spray solder paste in the gap using the tinning process is more conducive to coating and has better effect than the steel screen printing method.

[0087] It should be noted that the components and shielding cover can be tinned with solder paste in the same step and in the same way. That is, the step steel mesh process can be used to simultaneously tin the components and shielding cover with solder paste. Alternatively, the spot tinning process can be used to simultaneously tin the components and shielding cover with solder paste.

[0088] In some optional embodiments, after solder paste is applied to the gap portion 12 and before the connecting portion 42 is extended into the gap portion 12 and mounted on the solder paste, the actual tinning position of the solder paste may be detected. In this way, the printed form of the solder paste on the shielding cover is detected, and the position, amount, and form of the solder paste are detected to ensure the quality of tinning.

[0089] In some optional embodiments, after the connecting portion 42 is extended into the gap portion 12 and mounted on the solder paste, before the connecting portion 42 is fixedly connected to the solder paste, the method may further include: detecting the actual mounting position of the connecting portion 42. Optionally, AOI automatic optical inspection may be used to inspect the shielding cover patch to ensure the patch quality of the shielding cover.

[0090] In some optional embodiments, after the connection portion 42 is fixedly connected to the solder paste, the method may further include: inspecting the welding condition of the connection portion 42 and the solder paste, that is, inspecting the shielding cover welding again through AOI automatic optical inspection to ensure the assembly quality of the shielding cover.

[0091] The following is a detailed introduction to the assembly process of components and shielding covers (i.e., steps S13 and S14), which may include the following steps:

[0092] 1. Perform plasma and physical cleaning on the metal pads on the modified plastic substrate with completed routing circuit design.

[0093] 2. For single pcs operation, you can use the step steel mesh process. According to the metal pad design and component type, make regular holes in the step steel mesh and tin it with a printer. Alternatively, you can use a tinning machine to tin it with a tinning process.

[0094] 3. Use SPI solder paste testing equipment to test the printing form of solder paste and check the requirements of solder paste position, amount and form.

[0095] 4. Use the placement machine to accurately place the components at the predetermined positions of the tinned components on the metal pads by position picking.

[0096] 5. Use AOI automatic optical inspection to inspect component placement and check the placement of components.

[0097] 6. Use a placement machine for mounting special-shaped components to attach the shielding cover. When designing the shielding cover, pay attention to the air-avoidance treatment for the chip area.

[0098] 7. Use the reflow soldering process to form the welding of components and shielding covers, and realize the mechanical and electrical connection between the soldering ends of surface mounted components and shielding covers and the metal pads. During the reflow soldering process, it is recommended to use medium and low temperature solder paste to reduce the thermal deformation of the modified plastic substrate during the welding process.

[0099] 8. Use AOI automatic optical inspection to inspect the welding of components again, and use X-Ray to re-evaluate the welding status of components in the shielding cover to improve welding quality, welding reliability and product quality.

[0100] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. A packaging module, characterized in that: include: A modified plastic substrate, wherein the modified plastic substrate comprises an organic metal complex and the modified plastic substrate is provided with a groove portion; A metal pad is disposed in the groove portion; Components are arranged on a side of the metal pad away from the bottom wall of the groove; A shielding cover is arranged at the opening of the groove portion, and the shielding cover encapsulates the metal pad and the components in the groove portion.

2. The packaging module according to claim 1, characterized in that: It also includes a circuit wiring layer, which is laid on the bottom wall of the groove portion; the metal pad is connected to the circuit wiring layer.

3. The packaging module according to claim 1, characterized in that: A gap is formed between the metal pad and the side wall of the groove; the shielding cover includes a cover body and a connecting portion connected to the side periphery of the cover body, the connecting portion extends into the gap and is connected to the bottom wall of the groove or the side wall of the metal pad; the cover body is arranged at the opening of the groove.

4. The packaging module according to claim 1, characterized in that: The component comprises a chip, and the shielding cover is provided with an avoidance hole at a position corresponding to the chip.

5. The packaging module according to claim 1, characterized in that: The size of the components is not less than 06.mm*0.3mm; and / or The components include a chip, and the distance between different components in the chip is not less than 0.4 mm.

6. A method for preparing a packaging module, characterized in that: include: A groove portion is formed on the surface of a modified plastic substrate including an organic metal complex; Disposing a metal pad in the groove portion; Arrange components on a side of the metal pad away from the bottom wall of the groove portion; A shielding cover is arranged at the opening of the groove portion, and the shielding cover encapsulates the metal pad and the components in the groove portion.

7. The method according to claim 6, characterized in that A metal pad is arranged in the groove portion, comprising: Laying a circuit wiring layer on the bottom wall of the groove portion; The metal pad is disposed on the circuit wiring layer.

8. The method according to claim 6, characterized in that Components are arranged on a side of the metal pad away from the bottom wall of the groove portion, including: Apply solder paste according to the position where the components are to be installed; Mounting the components on the solder paste; The components are fixedly connected to the solder paste.

9. The method according to claim 8, characterized in that Apply solder paste according to the position where the components are to be installed, including: Holes are opened on the stepped steel mesh corresponding to the installation positions of the components, and solder paste is applied on the holes.

10. The method according to claim 9, characterized in that The stepped steel mesh includes a first stepped portion and a second stepped portion, and a height difference between the first stepped portion and the second stepped portion is no more than 0.3 mm.

11. The method according to claim 8, characterized in that The melting temperature of the solder paste is below 200°C.

12. The method according to claim 6, characterized in that A gap is formed between the metal pad and the side wall of the groove; the shielding cover comprises a cover body and a connecting portion connected to the side periphery of the cover body; a shielding cover is arranged at the opening of the groove, comprising: Apply solder paste on the gap portion; The connecting portion is extended into the gap portion and mounted on the solder paste so that the cover body covers the opening of the groove portion; The connecting portion is fixedly connected to the solder paste.

13. The method according to claim 12, characterized in that Applying solder paste on the gap portion includes: Opening holes at positions corresponding to the gaps on the stepped steel mesh, and applying solder paste on the openings; or The solder paste is applied to the position corresponding to the gap by using the tinning process.

14. A terminal device, characterized in that: It comprises a packaging module as described in any one of claims 1-5.

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