Manufacturing method of radar plate

Abstract

The invention discloses a manufacturing method of a radar board, which comprises the following steps: electroplating metal copper on a substrate to generate an electroplated layer, the electroplated layer has a first thickness relative to the surface of the substrate, and the electroplated layer has a first area, a second area and a third area; laying a first dry film on the first area and the third area so that the second area is not covered by the first dry film; reducing the metallic copper in the second region, the first region and the third region having a first thickness, and the second region having a second thickness; the first dry film is removed, the second dry film is laid in the first area, the second area and the third area, and the second dry film located in the first area and the second area is exposed to generate an antenna pattern; and etching the first region and the second region according to the antenna pattern to generate an electroplated antenna layer. The electroplated antenna layer located in the second area has a thin electroplated layer thickness and has a good signal receiving and transmitting function when an antenna circuit is generated.

Description

Technical Field

[0001] The invention relates to a radar board, and in particular to a method for manufacturing the radar board. Background Art

[0002] In order to make the antenna circuit have good signal transmission and reception functions, the existing radar board manufacturing method often requires repeated electroplating and etching and other cumbersome processes to control the thickness of the electroplating layer (such as copper layer) at the location where the antenna circuit is generated. However, the above cumbersome process not only leads to poor production efficiency, but also leads to low product yield.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for manufacturing a radar board in view of the deficiencies in the prior art.

[0005] The embodiment of the present invention discloses a method for manufacturing a radar board, characterized in that the method comprises: an electroplating step: electroplating a metal copper on the substrate to generate an electroplating layer, and the electroplating layer has a first thickness relative to a surface of the substrate; wherein the electroplating layer has a first area, a second area surrounding the outside of the first area, and a third area surrounding the outside of the second area; a first dry film laying step: providing a first dry film, laying the first dry film on the first area and the third area, so that the second area is not covered by the first dry film; a copper reduction step: reducing the metal copper in the second area, so that the first area and the third area have the first thickness, and the second area has a second thickness; a second dry film laying step: removing the first dry film, laying a second dry film on the first area, the second area, and the third area, and exposing the second dry film located in the first area and the second area to generate an antenna pattern; and an etching step: etching the first area and the second area according to the antenna pattern to generate an electroplated antenna layer; wherein the electroplated antenna layer located in the second area can be used to generate an antenna line.

[0006] Preferably, the electroplated antenna layer includes: a plurality of first circuit patterns generated in the first area, and the plurality of first circuit patterns have the first thickness relative to the surface of the substrate; and a plurality of second circuit patterns generated in the second area, and the plurality of second circuit patterns have the second thickness relative to the surface of the substrate; wherein the plurality of second circuit patterns are respectively generated by extending from the plurality of first circuit patterns; wherein the plurality of second circuit patterns can be used to generate the antenna circuit.

[0007] Preferably, a ratio between the first thickness and the second thickness ranges from 1:0.32 to 1:0.53.

[0008] Preferably, the first thickness is between 2010 microinches and 2310 microinches, and the second thickness is between 750 microinches and 1050 microinches.

[0009] Preferably, the first dry film is formed by 5 Pa to 5×10 5 A pressure between 100° C. and 120° C. is applied to the first region and the third region.

[0010] Preferably, the second dry film laying step further comprises: after laying the second dry film on the first area, the second area, and the third area, vacuum extraction is performed between the second dry film and the first area, the second area, and the third area for a predetermined time, and the predetermined time is between 20 seconds and 40 seconds, so that the second dry film is attached to the first area, the second area, and the third area without gaps, and then the second dry film is pressed to the first area, the second area, and the third area.

[0011] Preferably, the second dry film is formed by passing between 4×10 5 Pa to 5×10 5 A pressure between 100 Pa and a temperature between 50° C. and 60° C. are pressed onto the first region, the second region, and the third region, and the predetermined time is between 35 seconds and 45 seconds.

[0012] Preferably, the second dry film laying step further comprises: wetting the first area, the second area, and the third area with water so that the second dry film is attached to the first area, the second area, and the third area without gaps, and then pressing the second dry film to the first area, the second area, and the third area.

[0013] Preferably, in the copper reduction step, the metal copper in the second region is etched with an etching solution so that the second region has the second thickness; based on the total content of the etching solution being 100 wt %, the etching solution comprises sulfuric acid with a content ranging from 1.71 wt % to 1.89 wt %, and hydrogen peroxide with a content ranging from 1.9 wt % to 2.1 wt %.

[0014] Preferably, in the etching step, the electroplated antenna layer is etched out with an etching solution, and the etching solution contains sodium chlorate, hydrogen chloride, and cupric chloride.

[0015] In summary, the manufacturing method of the radar board disclosed in the embodiment of the present invention can simplify the process of controlling the thickness of the electroplating layer at the generation position of the antenna line through the combination of "an electroplating step: electroplating a metal copper on the substrate to generate an electroplating layer" and "a copper reduction step: reducing the metal copper in the second area", that is, the electroplated antenna layer located in the second area can have a thinner electroplating layer thickness (that is, the second thickness) and have a better signal receiving and transmitting function when the antenna line is generated, thereby effectively avoiding the problem of low product yield caused by cumbersome processes and improving the efficiency of manufacturing the radar board.

[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The figure is a flow chart of a method for manufacturing a radar board in an embodiment of the present invention.

[0018] Figure 2 and Figure 3 Schematic diagram of step S100 in an embodiment of the present invention.

[0019] Figure 4 Schematic diagram of step S110 in an embodiment of the present invention.

[0020] Figure 5 Schematic diagram of step S120 in an embodiment of the present invention.

[0021] Figure 6 for Figure 5 Schematic cross-sectional view along section line VI-VI.

[0022] Figures 7 to 9 Schematic diagram of step S130 in an embodiment of the present invention.

[0023] Fig.10FIG. 4 is a schematic diagram of a radar board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation method of the "method for manufacturing a radar panel" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] [Method for manufacturing radar board]

[0027] In the technical field of manufacturing radar boards, the thinner the thickness of the electroplating layer (such as the copper layer) at the location where the antenna line is generated, the better the antenna's signal receiving and transmitting function. However, the existing radar board manufacturing method often generates a thinner electroplating layer (such as the copper layer) at the location where the antenna line is generated in advance, etches out the antenna line and uses dry film protection, and then completes the cumbersome steps of via electroplating and etching out other transmission lines to control the thickness of the electroplating layer (such as the copper layer) at the location where the antenna line is generated. However, the above-mentioned cumbersome processes such as repeated electroplating and etching not only result in low production efficiency, but also lead to the problem of low product yield.

[0028] To solve the above technical problems, please refer to Figures 1 to 10 As shown, this embodiment discloses a method for manufacturing a radar board to manufacture a radar board 100, and the radar board 100 is a 77 GHz radar board, but the present invention is not limited thereto. The method for manufacturing the radar board includes steps S100 to S140: an electroplating step S100, a first dry film laying step S110, a copper reduction step S120, a second dry film laying step S130, and an etching step S140.

[0029] It should be noted that the manufacturing method of the radar board in this embodiment is used to manufacture a single radar board 100, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the manufacturing method of the radar board can also be used to manufacture multiple radar boards 100 at the same time.

[0030] like Figure 2 and Figure 3 As shown, the electroplating step S100 includes: electroplating a metal copper on a substrate 1 to generate an electroplating layer 2 (ie, a copper layer), and the electroplating layer 2 has a first thickness H1 relative to a surface of the substrate 1. Figure 3 As shown, the electroplating layer 2 has a first region 21 , a second region 22 surrounding the first region 21 , and a third region 23 surrounding the second region 22 .

[0031] It should be additionally noted that in other embodiments not shown in the present invention, a guide hole generation step is further included before the electroplating step S100, but the present invention is not limited thereto. The guide hole generation step includes: generating a plurality of guide holes (not shown) on the substrate 1, but the positions of the plurality of guide holes can be adjusted and changed according to design requirements, and the present invention is not limited thereto.

[0032] Further, the electroplating step S100 is to electroplate the metal copper to the substrate 1 and the plurality of the guide holes to generate the electroplated layer 2 having the first thickness H1. More specifically, the first thickness H1 in this embodiment can be selected to be between 2010 micro-inches (µin) and 2310 micro-inches, so that the plurality of the guide holes can have a sufficient electroplated layer thickness (that is, copper layer thickness), but the present invention is not limited thereto.

[0033] It is worth mentioning that Figure 2 As shown, the surface of the substrate 1 is defined with a center point A, a longitudinal center axis R1, and a transverse center axis R2 perpendicular to the longitudinal center axis R1, and the longitudinal center axis R1 and the transverse center axis R2 intersect at the center point A. Specifically, the longitudinal center axis R1 and the transverse center axis R2 can divide the substrate 1 into four quadrants, and the first region 21 can be located in any of the quadrants, which is not limited in the present invention.

[0034] Then, if Figure 4 As shown, the first dry film laying step S110 includes: providing a first dry film 3 , laying the first dry film 3 on the first area 21 and the third area 23 , so that the second area 22 is not covered by the first dry film 3 .

[0035] Specifically, after the first dry film 3 is laid on the first area 21 and the third area 23, the first dry film 3 may be formed by a process between 4×10 5 Pa (Pa) to 5×10 5 The first region 21 and the third region 23 are pressed at a pressure between 100° C. and 120° C., but the present invention is not limited thereto.

[0036] like Figure 5 and Figure 6 As shown, the copper reduction step S120 includes: reducing the metal copper in the second region 22, so that the first region 21 and the third region 23 have the first thickness H1, and the second region 22 has a second thickness H2. In other words, the electroplating thickness of the second region 22 (that is, the second thickness H2) is less than the electroplating thickness of the first region 21 and the third region 23 (that is, the first thickness H1).

[0037] In order to understand this embodiment more clearly, Figure 6 The first dry film 3 is not shown in the figure, and there is a difference between the first thickness H1 and the second thickness H2, and the difference can be selected between 960 micro inches and 1560 micro inches, but the present invention is not limited thereto. In more detail, a ratio range between the first thickness H1 and the second thickness H2 can be selected between 1:0.32 and 1:0.53.

[0038] Specifically, the copper reduction step S120 in this embodiment is to etch the second region 22 with an etching solution to reduce the metal copper in the second region 22, and reduce the second region 22 from the first thickness H1 to the second thickness H2, but the present invention is not limited thereto. Wherein, based on the total content of the etching solution being 100 wt%, the etching solution in this embodiment includes sulfuric acid with a content ranging from 1.71 wt% to 1.89 wt%, and hydrogen peroxide with a content ranging from 1.9 wt% to 2.1 wt%. The etching solution may, for example, include a residual amount of water or other solvents, but the present invention is not limited thereto.

[0039] It should be additionally explained that the copper reduction step S120 in this embodiment is to reduce the metal copper in the second region 22 by passing the etching solution through multiple (e.g., four) etching processes, and each etching process can optionally reduce a thickness between 240 micro-inches and 390 micro-inches, but the present invention is not limited thereto.

[0040] Specifically, the second region 22 is the location where the antenna line is generated, and the second thickness H2 can be selected to be between 750 micro inches and 1050 micro inches. Thus, after the antenna line is generated in the second region 22, it can have good signal transmission and reception functions, but the present invention is not limited thereto.

[0041] Through the combination of the electroplating step S100, the first dry film laying step S110, and the copper reduction step S120, the manufacturing method of the radar board provided by the embodiment of the present invention can effectively simplify the complicated process in the prior art, while ensuring that the plurality of guide holes have a sufficient electroplating layer thickness, and the generation position of the antenna line (that is, the second area 22) can also have a thinner electroplating layer thickness (that is, the second thickness H2).

[0042] like Figures 7 to 9 As shown, the second dry film laying step S130 includes: removing the first dry film 3, laying a second dry film 4 on the first area 21, the second area 22, and the third area 23, and exposing the second dry film 4 located in the first area 21 and the second area 22 to generate an antenna pattern 41.

[0043] It should be noted that in one embodiment, the second dry film laying step S130 may further include: after laying the second dry film 4 to the first area 21, the second area 22, and the third area 23, vacuum extraction is performed between the second dry film 4 and the first area 21, the second area 22, and the third area 23 within a predetermined time, and the predetermined time may be between 20 seconds and 40 seconds, so that the second dry film 4 is attached to the first area 21, the second area 22, and the third area 23 without gaps, and then the second dry film 4 is pressed to the first area 21, the second area 22, and the third area 23, but the present invention is not limited thereto.

[0044] For example, in other embodiments of the present invention, the second dry film 4 may also be wetted with water (e.g., deionized water) on the first region 21, the second region 22, and the third region 23, so that the second dry film 4 can be attached to the first region 21, the second region 22, and the third region 23 without gaps, and then the second dry film 4 is pressed to the first region 21, the second region 22, and the third region 23. Thus, the second dry film 4 can be more closely attached to the first region 21, the second region 22, and the third region 23.

[0045] Furthermore, the second dry film 4 in this embodiment is formed by passing through a range of 4×10 5 Pa (Pa) to 5×10 5 The first region 21, the second region 22, and the third region 23 are pressed at a pressure between 1000 Pa and 2000 ℃ and a temperature between 50 ℃ and 60 ℃, and the predetermined time can be optionally between 35 seconds and 45 seconds, but the present invention is not limited thereto.

[0046] It is worth mentioning that the second dry film 4 is attached to the first region 21 , the second region 22 , and the third region 23 by vacuum attachment or wet attachment, so that the second dry film 4 can fill the difference between the first thickness H1 and the second thickness H2 .

[0047] Therefore, after the second dry film 4 is pressed onto the electroplating layer 2 (i.e., the first region 21, the second region 22, and the third region 23), gaps or bubbles between the second dry film 4 and the electroplating layer 2 can be avoided, thereby ensuring that the antenna pattern 41 on the second dry film 4 can be accurately etched subsequently.

[0048] Next, the etching step S140 includes: etching the first region 21 and the second region 22 according to the antenna pattern 41 to generate an electroplated antenna layer 2a (eg Fig.10 Specifically, the electroplated antenna layer 2a located in the second area 22 can be used to generate the antenna line.

[0049] Specifically, in the etching step S140, the first region 21 and the second region 22 are etched with an etching solution, and the etching solution in this embodiment may optionally include sodium chlorate (NaClO3), hydrogen chloride (HCl), and cupric chloride (CuCl2), but the present invention is not limited thereto.

[0050] More specifically, the hydrogen chloride in this embodiment has an acidity value that can be selected from 1.5 N (normality) to 2.5 N, and the copper ion content of the cupric chloride in this embodiment can be selected from 120 g / l to 160 g / l, but the present invention is not limited thereto.

[0051] Specifically, the electroplated antenna layer 2a includes a plurality of first line patterns 21a, and a plurality of second line patterns 22a respectively generated by extending from the plurality of first line patterns 21a, and the plurality of second line patterns 22a can be used to generate the antenna line. Further, the plurality of first line patterns 21a are located in the first area 21, and the plurality of first line patterns 21a have the first thickness H1 relative to the surface of the substrate 1. In addition, the plurality of first line patterns 21a can be applied to a ball grid array package (BGA), but the present invention is not limited thereto.

[0052] Furthermore, the plurality of second line patterns 22a are located in the second area 22, and the plurality of second line patterns 22a have the second thickness H2 relative to the surface of the substrate 1. Thus, after the antenna line is generated in the second line pattern 22a, it can have an optional signal receiving and transmitting function.

[0053] It should be noted that if Fig.10 As shown, after the etching step S140, the second dry film 4 can be removed to obtain the radar board 100. In addition, the radar board 100 obtained by the radar board manufacturing method can be further ensured by automatic optical inspection (AOI, Automated Optical Inspection) to ensure the quality of the radar board 100.

[0054] [Radar Board]

[0055] See also Fig.10 As shown, this embodiment discloses a radar board 100, which can be manufactured by steps S100 to S140 in the manufacturing method of the radar board provided in the above embodiment. The radar board 100 includes a substrate 1 and an electroplated antenna layer 2a formed on a surface of the substrate 1. It should be additionally explained that the substrate 1 can be formed with a plurality of guide holes (not shown in the figure), but the positions of the plurality of guide holes can be adjusted and changed according to design requirements, and the present invention is not limited here.

[0056] Specifically, the substrate 1 has a working area 11, an antenna area 12 surrounding the working area 11, and a peripheral area 13 surrounding the antenna area 12. In this embodiment, the peripheral area 13 includes an electroplating layer (e.g., a copper layer) and has a first thickness H1, and the first thickness H1 in this embodiment can be selected to be between 2010 micro-inches (µin) and 2310 micro-inches, but the present invention is not limited thereto.

[0057] The electroplated antenna layer 2a is a copper layer, and the electroplated antenna layer 2a is generated in the working block 11 and the antenna block 12. The electroplated antenna layer 2a includes a plurality of first circuit patterns 21a and a plurality of second circuit patterns 22a respectively extending from the plurality of first circuit patterns 21a.

[0058] Specifically, the plurality of first line patterns 21a are located in the working area 11, and the plurality of second line patterns 22a are located in the antenna area 12. Specifically, the plurality of first line patterns 21a have the first thickness H1 relative to the surface of the substrate 1, and the plurality of second line patterns 22a have a second thickness H2 relative to the surface of the substrate 1.

[0059] In more detail, a ratio range between the first thickness H1 and the second thickness H2 can be optionally between 1:0.32 and 1:0.53, a difference between the first thickness H1 and the second thickness H2 can be optionally between 960 microinches and 1560 microinches, and the second thickness H2 can be between 750 microinches and 1050 microinches, but the present invention is not limited thereto.

[0060] As described above, the surrounding area 13 and the locations where the plurality of first line patterns 21a are generated have a copper layer thickness of the first thickness H1, so that the plurality of guide holes that may be located thereon have a sufficient copper layer thickness. Furthermore, the plurality of second line patterns 22a can be used to generate antenna lines. Thus, after the antenna line is generated on the second line pattern 22a, it can have an optional signal transmission and reception function.

[0061] [Technical Effects of Embodiments of the Invention]

[0062] In summary, the manufacturing method of the radar board disclosed in the embodiment of the present invention can simplify the process of controlling the thickness of the electroplating layer at the generation position of the antenna line through the combination of "an electroplating step: electroplating a metal copper on the substrate to generate an electroplating layer" and "a copper reduction step: reducing the metal copper in the second area", that is, the electroplated antenna layer located in the second area can have a thinner electroplating layer thickness (that is, the second thickness) and have a better signal receiving and transmitting function when the antenna line is generated, thereby effectively avoiding the problem of low product yield caused by cumbersome processes and improving the efficiency of manufacturing the radar board.

[0063] The contents disclosed above are only optional feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A method for manufacturing a radar panel, characterized in that: The manufacturing method of the radar board comprises: An electroplating step: electroplating a metal copper on a substrate to generate an electroplating layer, and the electroplating layer has a first thickness relative to a surface of the substrate; wherein the electroplating layer has a first area, a second area surrounding the first area, and a third area surrounding the second area; a first dry film laying step: providing a first dry film, laying the first dry film on the first area and the third area, so that the second area is not covered by the first dry film; a copper reduction step: reducing the metal copper in the second region so that the first region and the third region have the first thickness, and the second region has a second thickness; a second dry film laying step: removing the first dry film, laying a second dry film on the first area, the second area, and the third area, and exposing the second dry film located in the first area and the second area to generate an antenna pattern; and An etching step: etching the first area and the second area according to the antenna pattern to generate an electroplated antenna layer; wherein the electroplated antenna layer located in the second area can be used to generate an antenna circuit.

2. The method for manufacturing a radar board according to claim 1, characterized in that: The electroplated antenna layer comprises: A plurality of first circuit patterns are generated in the first area, and the plurality of first circuit patterns have the first thickness relative to the surface of the substrate; and A plurality of second line patterns are generated in the second area, and the plurality of second line patterns have the second thickness relative to the surface of the substrate; wherein the plurality of second line patterns are respectively generated by extending from the plurality of first line patterns; wherein the plurality of second line patterns can be used to generate the antenna line.

3. The method for manufacturing a radar board according to claim 1, characterized in that: A ratio between the first thickness and the second thickness ranges from 1:0.32 to 1:0.

53.

4. The method for manufacturing a radar board according to claim 3, characterized in that: The first thickness is between 2010 microinches and 2310 microinches, and the second thickness is between 750 microinches and 1050 microinches.

5. The method for manufacturing a radar board according to claim 1, characterized in that: The first dry film is between 4×10 5 Pa to 5×10 5 A pressure between 100° C. and 120° C. is applied to the first region and the third region.

6. The method for manufacturing a radar board according to claim 1, characterized in that: The second dry film laying step further comprises: after laying the second dry film on the first area, the second area, and the third area, vacuum extraction is performed between the second dry film and the first area, the second area, and the third area for a predetermined time, and the predetermined time is between 20 seconds and 40 seconds, so that the second dry film is attached to the first area, the second area, and the third area without gaps, and then the second dry film is pressed to the first area, the second area, and the third area.

7. The method for manufacturing a radar board according to claim 6, characterized in that: The second dry film is formed by passing between 4×10 5 Pa to 5×10 5 A pressure between 100 Pa and a temperature between 50° C. and 60° C. are pressed onto the first region, the second region, and the third region, and the predetermined time is between 35 seconds and 45 seconds.

8. The method for manufacturing a radar board according to claim 1, characterized in that: The second dry film laying step further includes: wetting the first area, the second area, and the third area with water so that the second dry film is attached to the first area, the second area, and the third area without gaps, and then pressing the second dry film to the first area, the second area, and the third area.

9. The method for manufacturing a radar board according to claim 1, characterized in that: In the copper reduction step, the metal copper in the second region is etched with an etching solution so that the second region has the second thickness; based on the total content of the etching solution being 100 wt %, the etching solution comprises sulfuric acid with a content ranging from 1.71 wt % to 1.89 wt %, and hydrogen peroxide with a content ranging from 1.9 wt % to 2.1 wt %.

10. The method for manufacturing a radar board according to claim 1, characterized in that: In the etching step, an etching solution is used to etch out the electroplated antenna layer, and the etching solution contains sodium chlorate, hydrogen chloride, and cupric chloride.

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