Probe laser micro welding device and method

Abstract

The present invention discloses a probe laser micro-welding device and method, comprising: a probe removal mechanism for capturing a probe on the fixture, obtaining first position data of the probe, and removing the probe based on the first position data; a probe posture acquisition mechanism before welding, obtaining second position data of the probe and comparing the second position data with pre-designed position data; a probe posture correction and solder paste dipping mechanism, correcting the probe posture and dipping the probe into solder paste based on the comparison results; a probe and pad precise alignment mechanism, capturing the probe after dipping into solder paste, obtaining height data and third position data of the probe, comparing the third position data with the pad position data to obtain position deviation data, and precisely aligning the probe and pad based on the position deviation data; a welding mechanism for laser welding; and a control mechanism for controlling each mechanism. The present invention achieves high-precision welding with a probe spacing as small as 60 μm.

Description

Technical Field

[0001] The present invention belongs to the field of probe laser welding, and in particular relates to a probe laser micro-welding device and method. Background Art

[0002] During the wafer test probe card manufacturing process, probes must be welded to the ceramic circuit board according to the designed position. The minimum welding pitch can reach 60μm, the X and Y position deviation is less than 3μm, the end height deviation is less than 8μm, and the minimum probe-to-probe distance can reach 60μm. Due to the high welding precision requirements, existing laser welding methods are difficult to meet. Summary of the Invention

[0003] The purpose of the present invention is to address the problems existing in the prior art and provide a probe laser micro-welding device and method. By removing the probe from the fixture, dipping the probe in solder paste after correcting its posture, and accurately aligning the probe with the pad before welding, high-precision welding with a minimum probe spacing of 60μm can be achieved.

[0004] According to one aspect of the present invention, a probe laser micro welding device is provided, comprising:

[0005] The probe is taken from the fixture by a material taking mechanism, which is used to photograph the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data and move it to the posture correction station;

[0006] The probe pre-welding posture acquisition mechanism is used to photograph the removed probe, obtain the second position data of the probe, and compare the second position data with the pre-designed position data to obtain a comparison result;

[0007] The probe posture correction and solder paste dipping mechanism is used to correct the probe posture according to the comparison result and to dip the probe after posture correction into solder paste;

[0008] The probe and pad precise alignment mechanism is used to photograph the probe after being dipped in solder paste, obtain the probe height data and third position data, compare the third position data with the pad position data, obtain position deviation data, and accurately align the probe and pad according to the position deviation data;

[0009] The welding mechanism is used to move the probe to the designed welding position according to the measured height data after the probe and the pad are accurately aligned for laser welding;

[0010] The control mechanism is respectively connected with the probe material taking mechanism from the fixture, the probe posture obtaining mechanism before welding, the probe posture correction and solder paste dipping mechanism, the probe and pad precise positioning mechanism and the welding mechanism, and is used to control each mechanism.

[0011] As a further technical solution, the device further includes: a probe loading mechanism for placing a jig with the probe implanted therein and driving the jig to move.

[0012] As a further technical solution, the device further includes: a welding effect detection mechanism for photographing and detecting the welded product.

[0013] As a further technical solution, the device further includes: a cooling mechanism for cooling the probe temperature by spraying liquid nitrogen during the welding process.

[0014] According to one aspect of the present invention, a probe laser micro welding method is provided, comprising:

[0015] The probe on the fixture is photographed to obtain the first position data of the probe, and the material removal step of the probe is performed according to the first position data;

[0016] photographing the removed probe to obtain second position data of the probe, comparing the second position data with pre-designed position data to obtain a comparison result, and correcting the probe posture according to the comparison result;

[0017] Dipping the probe after posture correction into solder paste;

[0018] Photograph the probe after dipping in solder paste to obtain the probe height data and third position data, compare the third position data with the pad position data to obtain position deviation data, and calibrate the pad position according to the position deviation data to accurately align the probe with the pad;

[0019] After the probe and the pad are accurately aligned, the probe is moved to the welding design position according to the measured height data to perform the laser welding steps.

[0020] As a further technical solution, the step of accurately aligning the probe with the pad further includes a pad positioning step of locating a marking point of the probe pad to obtain pad position data.

[0021] As a further technical solution, the method further includes: after welding is completed, a welding effect detection step of photographing and detecting the welded product.

[0022] As a further technical solution, the posture correction step further includes:

[0023] The probe is photographed by two mutually perpendicular photographing mechanisms to obtain the XY coordinate data and angle data of the probe;

[0024] Compare the acquired XY coordinate data and angle data with the pre-designed XY coordinate data and angle data to obtain the XY direction deviation and rotation deviation;

[0025] The probe posture correction mechanism is used to correct rotational deviation, the solder paste tray Y-axis is used to correct X-direction deviation, and the lifting axis is used to correct Y-direction deviation.

[0026] As a further technical solution, the solder paste dipping step also includes: setting multiple dipping positions at intervals on the solder paste tray, each dipping position corresponds to one probe dipping into the solder paste, and automatically switching the dipping position when the next probe dips into the solder paste.

[0027] As a further technical solution, the welding step further includes: during the welding process, controlling the probe temperature by combining laser pulse energy control and liquid nitrogen injection.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention removes the probe from the jig by image capture, thereby solving the problem of welding accuracy caused by the poor consistency of the probe in the jig; by correcting the posture of the removed probe, it is ensured that the probe is dipped in solder paste in the same posture, thereby solving the problem of uneven solder paste dipping of the probe before welding; by accurately aligning the probe with the pad, it is ensured that the probe can accurately enter the welding design position, and then through the mutual cooperation of the aforementioned steps, precise alignment of the welding process is achieved, meeting the high-precision requirements of probe welding.

[0030] The present invention not only solves the problem of low welding accuracy caused by incorrect position and inconsistent height during probe welding, but also avoids the problem of adjacent probes being deformed by heat due to heat dissipation during welding by controlling the laser pulse energy and liquid nitrogen spray during the welding process, thereby ensuring the welding effect of a minimum welding probe spacing of 60μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the overall structure of a probe laser micro-welding device provided by an embodiment of the present invention.

[0032] Figure 2 This is a schematic diagram of the structure of the probe material picking mechanism from the fixture provided in an embodiment of the present invention.

[0033] Figure 3 This is a structural diagram of the probe feeding mechanism provided in an embodiment of the present invention.

[0034] Figure 4 Schematic diagram of a probe calibration image acquisition system provided in an embodiment of the present invention.

[0035] Figure 5 This is a structural diagram of the probe posture correction and solder paste dipping mechanism provided in an embodiment of the present invention.

[0036] Figure 6This is a structural schematic diagram of the probe welding clamping mechanism provided in an embodiment of the present invention.

[0037] Figure 7 Schematic diagram of a probe welding height detection system provided in an embodiment of the present invention.

[0038] Figure 8 This is a schematic structural diagram of the probe welding pad fixing and three-dimensional moving platform provided in an embodiment of the present invention.

[0039] Figure 9 This is a structural schematic diagram of the probe welding laser head adjustment mechanism provided in an embodiment of the present invention.

[0040] Figure 10 This is a structural diagram of a probe welding effect detection mechanism provided by an embodiment of the present invention.

[0041] Figure 11 A schematic flow chart of a probe laser micro-welding method provided in an embodiment of the present invention.

[0042] Figure: 10, probe material removal mechanism from fixture; 20, equipment control cabinet; 30, horizontal moving axis of probe gripper for pick-up and placement; 40, probe calibration image acquisition system; 50, probe material loading mechanism; 60, equipment rack; 70, probe posture correction and solder paste dipping mechanism; 80, probe welding plate fixing and three-dimensional moving platform; 90, probe welding effect detection system; 100, probe welding laser head adjustment mechanism; 110, probe welding cooling mechanism; 120, probe welding height detection system; 130, probe welding clamping mechanism;

[0043] 2-1. Lifting axis of the clamping jaw for picking up materials from the material box; 2-2. Camera for obtaining the position of the probe; 2-3. Lens for obtaining the position of the probe; 2-4. Lens mounting base; 2-5. Clamping jaw angle adjustment mechanism; 2-6. Ring light source for obtaining the position of the probe; 2-7. Coaxial point light source for obtaining the position of the probe; 2-8. Clamping jaw drive cylinder; 2-9. Fixed clamping jaw fixing plate; 2-10. Movable clamping jaw fixing plate; 2-11. Probe clamping jaw for picking up materials from the material box;

[0044] 3-1, fixture Y-axis; 3-2, fixture front fixed locking handle; 3-3, fixture middle positioning block; 3-4, fixture fixed side rib; 3-5, fixture side fixed locking handle; 3-6, probe loading fixture, 3-7, fixture support connection base;

[0045] 4-1. Probe front-facing camera; 4-2. Probe front-facing camera lens; 4-3. Probe front-facing camera lens fixing seat; 4-4. Probe front-facing camera coaxial point light source; 4-5. 90° folding mirror; 4-6. Probe front-facing camera XY adjustment mechanism; 4-7. Probe front-facing camera height adjustment mechanism; 4-8. Probe front-facing camera mechanism padding; 4-9. Probe correction image camera mechanism fixing base plate; 4-10. Probe side-facing camera mechanism padding; 4-11. Probe side-facing camera height adjustment mechanism; 4-12. Probe side-facing camera XY adjustment mechanism; 4-13. Probe side-facing camera coaxial point light source; 4-14. Probe side-facing camera lens; 4-15. Probe side-facing camera lens fixing seat; 4-16. Probe side-facing camera;

[0046] 5-1, solder paste injection storage tube; 5-2, solder paste storage tube fixing block; 5-3, solder paste dosing scraper lifting drive mechanism; 5-4, solder paste storage tube lifting drive mechanism; 5-5, lifting mechanism fixing seat; 5-6, solder paste tray Y-axis; 5-7, solder paste loading container fixing frame; 5-8, probe posture correction mechanism; 5-9, solder paste recovery device; 5-10, probe correction clamping mechanism; 5-11, solder paste loading container; 5-12, solder paste dosing scraper;

[0047] 6-1, Gripper lifting shaft; 6-2, Gripper angle adjustment mechanism fixing plate; 6-3, Gripper angle adjustment mechanism; 6-4, Gripper clamping and pushing cylinder; 6-5, Movable gripper fixing plate; 6-6, Fixed gripper fixing plate; 6-7, Probe gripper;

[0048] 7-1. Focus detection lens lifting mechanism; 7-2. Camera mechanism and lifting shaft connection seat; 7-3. Probe focus detection camera; 7-4. Lens fixing seat; 7-5. Probe focus detection lens; 7-6. Lens level adjustment mechanism; 7-7. Coaxial laser point light source; 7-8. Probe focus detection objective lens;

[0049] 8-1. Probe welding chassis; 8-2. Vacuum adsorption table for probe welding chassis; 8-3. Rotation axis of probe welding chassis; 8-4. X-axis movement axis of probe welding chassis; 8-5. Y-axis movement axis of probe welding chassis;

[0050] 9-1. Welding laser head lifting axis; 9-2. XY adjustment mechanism fixing seat; 9-3. Laser welding head XY adjustment mechanism; 9-4. Adjustment mechanism connecting block; 9-5. Laser welding head rotation adjustment mechanism; 9-6. Welding laser head fixing seat; 9-7. Probe welding laser head;

[0051] 10-1. Coaxial point light source for effect detection photography; 10-2. Effect detection photography lens; 10-3. Photography mechanism connecting plate; 10-4. Effect detection photography lens fixing seat; 10-5. Welding effect detection photography camera; 10-6. Effect detection photography XY adjustment mechanism; 10-7. Effect detection photography height adjustment mechanism; 10-8. Adjustment mechanism connecting plate. DETAILED DESCRIPTION

[0052] The following will clearly and completely describe the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0053] When defining directions for the purpose of clearly describing the embodiments of the present invention, the X direction mentioned in the specification may be a direction parallel to the horizontal plane, and the Y direction may be a direction perpendicular to the horizontal plane.

[0054] The embodiment of the present invention provides a probe laser micro welding device, such as Figure 1 As shown, it includes: a probe picking mechanism from a fixture, used to photograph the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data and move it to a posture correction station; a probe posture acquisition mechanism before welding, used to photograph the taken probe, obtain the second position data of the probe, compare the second position data with the pre-designed position data, and obtain a comparison result; a probe posture correction and solder paste dipping mechanism, used to correct the posture of the probe according to the comparison result, and dip the probe after posture correction into solder paste; a probe and pad precise alignment mechanism, used to align the probe with the solder paste. The probe behind the solder paste is photographed to obtain the probe's height data and the third position data, and the third position data is compared with the pad position data to obtain the position deviation data, and the probe and the pad are accurately aligned according to the position deviation data; the welding mechanism is used to move the probe to the welding design position according to the measured height data after the probe and the pad are accurately aligned, and perform laser welding; the control mechanism is respectively connected with the probe's material taking mechanism from the fixture, the probe's posture obtaining mechanism before welding, the probe's posture correction and solder paste dipping mechanism, the probe and pad precise alignment mechanism and the welding mechanism, and is used to control each mechanism.

[0055] Reference Figure 1 The probe can be moved horizontally along the horizontal axis of the probe clamping claw. In practical applications, the device can also be configured with an equipment control cabinet and an equipment rack.

[0056] like Figure 2As shown, the probe removal mechanism from the jig includes a magazine retrieving jaw lift shaft, a first camera assembly and a jaw assembly mounted on the magazine retrieving jaw lift shaft and capable of rising and falling with it. In actual applications, the probe's positional consistency within the jig is not always perfect, requiring secondary calibration to achieve the required welding accuracy. Therefore, embodiments of the present invention utilize image capture to clamp the probe and perform calibration to ensure welding accuracy even when the probe spacing is very small.

[0057] The lifting shaft of the material box picking clamp is used to drive the clamp to move up and down to facilitate material picking; at the same time, it is also used to compensate for the deviation of the probe in the Y direction by lifting and lowering when the probe posture is calibrated.

[0058] The first shooting component includes a probe position acquisition camera, and a probe position acquisition camera lens, a probe position acquisition camera ring light source, and a probe position acquisition camera coaxial point light source configured to facilitate shooting with the probe position acquisition camera. The probe position acquisition camera lens is arranged on the connecting plate of the lifting shaft of the material box picking clamp through a lens fixing seat. In an embodiment of the present invention, the probe position acquisition camera searches for the probe on the fixture by taking a picture and uploads the probe position data. The material box picking probe clamp takes out the probe according to the position data and places it into the probe posture correction station. It should be noted that the search here means that some tunnels in the fixture may not have products, and they need to be pre-determined before identifying their clamping positions.

[0059] The jaw assembly is mounted on the magazine picking jaw lifting shaft via a connector and includes a jaw angle adjustment mechanism for adjusting the jaw angle, a jaw gripping drive cylinder for actuating the jaw, and a magazine picking probe jaw for performing the picking action. The magazine picking probe jaw includes a fixed jaw and a movable jaw for coordinating the gripping action, as well as a fixed jaw fixing plate and a movable jaw fixing plate connected thereto, respectively.

[0060] The probe is taken out from the jig by the jig taking mechanism, and the jig is fixed on the feeding mechanism and can move along the Y direction on the feeding mechanism. Figure 3 As shown, the feeding mechanism includes a jig fixing assembly, a jig moving assembly, a jig connecting assembly and a jig located on the jig connecting assembly. The jig fixing assembly includes a jig front fixed locking handle, a jig middle positioning block, a jig fixed side rib and a jig side fixed locking handle. Before the probe is taken out of the material, the probe loading jig with the probe implanted is placed on the jig connecting assembly, and the handles on both sides are locked to facilitate the capture of the probe position on the jig and the removal of the material. The jig connecting assembly is as shown in FIG. Figure 3 Considering the convenience of taking probe images, the probe loading fixture is set on the fixture Y-axis, which can be driven to move the fixture in the Y direction.

[0061] In an embodiment of the present invention, the probe is taken out and placed in the probe posture correction station, and the probe correction image acquisition system takes a picture, and the photographed position data is compared with the design position and the deviation value is uploaded. The probe posture correction and solder paste dipping mechanism corrects and moves its position. After completion, the probe correction image acquisition system takes a picture and compares it to see whether the design position requirement is met. If not, the correction is repeated until the designed posture requirement is met.

[0062] The probe calibration image acquisition system, such as Figure 4 As shown, the system comprises two perpendicularly positioned camera assemblies: one for the front of the probe and its associated auxiliary equipment, and the other for the side of the probe and its associated auxiliary equipment. Both camera assemblies are mounted on a fixed baseplate for the probe calibration image capture mechanism. The two perpendicular cameras capture the probe's position, which is then calibrated by the probe's posture correction and solder paste dipping mechanisms. After calibration, the probe is removed by the probe welding clamping mechanism and moved to the solder paste dipping station.

[0063] Reference Figure 4 The auxiliary shooting equipment for the probe front camera includes: a probe front camera lens for shooting, a probe front camera coaxial point light source for providing shooting light source, a 90° folding mirror for optical path deflection, a probe front camera XY adjustment mechanism for XY direction adjustment, a probe front camera height adjustment mechanism for height direction adjustment, and a probe front camera mechanism padding block for auxiliary padding. The auxiliary shooting equipment for the probe side camera includes: a probe side camera mechanism padding block for auxiliary padding, a probe side camera height adjustment mechanism for height direction adjustment, a probe side camera XY adjustment mechanism for XY direction adjustment, a probe side camera coaxial point light source for providing shooting light source, and a probe side camera lens for shooting. Wherein, the probe front camera lens and the probe side camera lens are respectively equipped with lens fixing seats.

[0064] The probe calibration image acquisition system identifies the captured probe image, obtains its XY coordinate data and rotation data (i.e., angle data), and compares the identified XY coordinate data and rotation data with the corresponding data of the designed position to obtain deviation data. The deviation data includes XY coordinate deviation and rotation deviation.

[0065] The probe posture correction and solder paste dipping mechanism are corrected according to the deviation data, wherein the rotation deviation data is obtained from Figure 5 The probe posture correction mechanism is executed, and the X-direction deviation data is Figure 5 The Y-axis movement of the solder paste tray is executed, and the Y-direction deviation data is calculated by Figure 2The height compensation for the material picking gripper's lifting axis is calculated by adding or subtracting the deviation data from the standard picking height. This can be considered as using the compensated height to move the probe when moving from the posture correction station to the solder paste dipping station. It should be noted that the coordinates described in this embodiment of the present invention are based on the probe as a reference. The probe's plane is placed perpendicular to the device itself, so the probe's X-axis deviation can be implemented using the solder paste tray's Y-axis movement.

[0066] It should be noted that the probe posture correction mechanism in the embodiment of the present invention can be regarded as an angle adjustment mechanism (such as a turntable, etc.), which can change the angle of the probe to keep it consistent with the angle data of the designed position through its angle rotation.

[0067] Reference Figure 5 A probe correction clamping mechanism is connected above the probe posture correction mechanism to clamp and fix the probe for posture shooting and correction.

[0068] like Figure 6 As shown, the probe welding clamping mechanism includes a jaw lifting shaft, on which is mounted a jaw angle adjustment mechanism fixing plate for securing the jaw angle adjustment mechanism. The jaw angle adjustment mechanism is connected to a jaw assembly via a connector. The jaw assembly includes a jaw clamping and pushing cylinder for actuating the jaws, and a probe jaw. The probe jaw is equipped with a movable jaw and a fixed jaw, as well as a movable jaw fixing plate and a fixed jaw fixing plate for securing the movable jaw and the fixed jaw, respectively.

[0069] Reference Figure 5 The solder paste dipping mechanism includes: a solder paste injection storage tube for injecting solder paste, a driving mechanism and a scraper for quantitatively scraping solder paste, a solder paste loading container for loading solder paste, a solder paste recovery device for recovering the scraped solder paste, and an adjustment component for driving the solder paste loading container to move. The solder paste injection storage tube is connected to the solder paste storage tube lifting drive mechanism through a fixed block. The solder paste storage tube lifting drive mechanism and the solder paste quantitative scraper lifting drive mechanism are arranged on the lifting mechanism fixing seat together. The solder paste quantitative scraper lifting drive mechanism drives the solder paste quantitative scraper to move and scrape the excess solder paste into the solder paste recovery device. The adjustment component includes a solder paste tray Y-axis that drives the solder paste tray to move in the Y direction, for example, it can drive the solder paste tray closer to or away from the solder paste quantitative scraper. The solder paste loading container is supported and fixed by a container fixing frame.

[0070] The solder paste loading container is provided with multiple dipping positions at intervals. After the current probe dips the glue, the next probe switches to the next position for dipping. The position switching here is Figure 1 The horizontal moving axis of the pick-and-place probe gripper performs X-direction movement, which is Figure 5 The solder paste tray moves in the Y direction along the moving axis, thus completing the dipping position switch.

[0071] In an embodiment of the present invention, before dipping, the solder paste is first injected into the solder paste loading container through the solder paste injection storage tube, and the injected amount must be higher than the container mouth. Then the solder paste quantitative scraper will scrape the excess solder paste into the solder paste recovery device. At this time, the solder paste capacity in each container is basically the same, and the cutting height is also basically the same. The height of the container is pre-adjusted and parallel to the Y-axis moving mechanism.

[0072] After completing the posture calibration, the probe is clamped to the solder paste dipping station. The probe welding clamping mechanism drives the clamping jaws down to the preset position to ensure that the amount of glue dipped is the set amount. The depth of the clamping jaws at this time determines the amount of glue dipped. The posture calibration before dipping ensures that the probe is lowered in the same posture to dip the solder paste. After the probe is dipped in the solder paste, the clamping mechanism will move to the welding position, completing the probe's solder paste dipping function before welding.

[0073] It should be noted that the preset position is the control position for the amount of glue the probe dips into. That is, the deeper the probe is lowered, the greater the amount of glue. The preset position is adjusted according to the welding state. The control condition of the amount is: it can weld firmly, but it does not overflow the pad area due to excessive glue.

[0074] After dipping in solder paste, the probe is clamped to the welding station, where it is precisely aligned with the pad before laser welding.

[0075] like Figure 7 As shown, the probe welding height detection system includes a probe focus detection camera, which is equipped with a probe focus detection lens, a coaxial laser point light source, and a probe focus detection objective lens. The probe focus detection lens is also connected to a focus detection lens lifting mechanism via a connecting seat, which is used to drive the camera mechanism to rise and fall. The probe focus detection lens is fixed to the connecting seat via a fixing seat. The probe focus detection lens is also equipped with a lens level adjustment mechanism to achieve lens level adjustment.

[0076] When the probe welding height detection system detects the probe end face height, its detection method is the same as the height detection method disclosed in the probe welding height alignment detection method, equipment and system, specifically: starting from a preset image capture initial position, the image capture device is moved along the probe height direction, and each time it moves a preset capture interval, the image capture device is triggered to capture a probe image and the area of ​​the captured probe image is calculated; after the image capture device moves a preset number of times, the position corresponding to the area of ​​the minimum probe image is determined based on the areas of all captured probe images; based on the image capture initial position and the position corresponding to the area of ​​the minimum probe image, the current probe height detection value is obtained.

[0077] Before accurately aligning the probe and the pad, the probe bonding height detection system also locates the Mark point of the probe bonding pad to obtain pad position data.

[0078] like Figure 8 As shown, the probe welding plate fixing and three-dimensional moving platform includes a probe welding chassis, a vacuum adsorption platform is connected below the probe welding chassis, the probe welding chassis is also connected to a probe welding chassis rotating shaft, used to drive the welding chassis to rotate, and the probe welding chassis is also connected below the probe welding chassis to a probe welding chassis X-direction moving axis and a probe welding chassis Y-direction moving axis, used to drive the probe welding chassis to move along the X direction or Y direction. Figure 8 The structure shown can realize the XYθ three-dimensional movement of the probe welding chassis.

[0079] After dipping in solder paste, the probe welding clamping mechanism moves the probe to the welding position. The probe welding height detection system detects the height of the probe end face, obtains the probe height data, and then obtains the probe XY position data, which is then compared with the position data of the pad. After obtaining the XYθ position data, it is uploaded to the control mechanism. The control mechanism fixes the probe welding pad and the three-dimensional moving platform and corrects it according to the deviation data. After the correction is completed, photos are taken to compare whether it meets the design requirements. If there is still deviation, it is corrected again. After the correction is completed, the probe welding clamping mechanism descends to the welding design position according to the measured height, and laser welding is performed.

[0080] During laser welding, a cooling mechanism discharges liquid nitrogen to cool the probe, physically cooling it to prevent heat deformation and oxidation during the welding process. Probe temperature control is also achieved through laser pulse energy control. This utilizes a picosecond pulse cycle and controls the energy of a single pulse by controlling the pulse width. This ensures high output energy and a very short execution time, at the picosecond level, resulting in a more concentrated heat source.

[0081] like Figure 9 As shown, the probe welding laser head adjustment mechanism includes a welding laser head lifting axis, which is connected to the laser welding head XY adjustment mechanism via a fixed base. The laser welding head XY adjustment mechanism is connected to a laser welding head rotation adjustment mechanism via a connecting block. The laser welding head rotation adjustment mechanism secures the probe welding laser head via a fixed base. This embodiment of the present invention uses the probe welding laser head adjustment mechanism to adjust the laser head so that its light output position and angle better meet welding requirements.

[0082] After welding is completed, the probe welding effect detection system takes pictures to detect the welding effect, checking whether the solder paste is completely melted, whether the weld is well filled, whether the solder paste overflows the pad and other defects. If the inspection fails, it will be marked red on the welding mapping diagram. If three consecutive failures occur, an alarm will be issued and the machine will be shut down.

[0083] like Figure 10 As shown, the probe welding effect detection system includes a welding effect detection camera equipped with a coaxial point light source and a camera lens. The camera lens is fixed to a mounting member via a fixing base. The camera assembly, consisting of the welding effect detection camera and its supporting equipment, is connected to an XY adjustment mechanism for detecting the effect of the camera. The XY adjustment mechanism is connected to a height adjustment mechanism for detecting the effect of the camera. The height adjustment mechanism is provided on a connecting plate of the adjustment mechanism.

[0084] Based on the same technical concept as the above embodiment, the embodiment of the present invention also provides a probe laser micro welding method, such as Figure 11 As shown, including:

[0085] Step S1, photographing the probe on the fixture to obtain first position data of the probe, and taking out the probe according to the first position data;

[0086] Step S2, photographing the removed probe to obtain second position data of the probe, comparing the second position data with pre-designed position data to obtain a comparison result, and correcting the probe posture according to the comparison result;

[0087] Step S3, dipping the probe after posture correction into solder paste;

[0088] Step S4, photographing the probe after being dipped in solder paste, obtaining height data and third position data of the probe, comparing the third position data with the pad position data to obtain position deviation data, and correcting the pad position according to the position deviation data to accurately align the probe with the pad;

[0089] Step S5: After the probe and the pad are precisely aligned, the probe is moved to the designed welding position according to the measured height data, and the laser welding step is performed.

[0090] In step S1, the probe position acquisition camera takes a photo of the probe on the fixture and searches for it. The probe position data is then transmitted to the control mechanism, which then controls the magazine retrieving probe gripper to remove the probe based on the position data and place it in the probe posture calibration station. It should be noted that this search refers to the fact that some channels within the fixture may not contain product, requiring pre-determination before identifying their gripping positions.

[0091] In step S2, after the probe is taken out and placed in the probe posture correction station, the probe correction image acquisition system takes a photo, compares the photographed position data with the design position and uploads the deviation value, and the probe posture correction and solder paste dipping mechanism corrects and moves its position. After completion, the probe correction image acquisition system takes a photo and compares it to see whether it meets the design position requirements. If not, the correction is repeated until the designed posture is achieved.

[0092] In step S3, before dipping, the solder paste is injected into the solder paste loading container through the solder paste injection storage tube. The amount injected should be higher than the container mouth. Then the solder paste quantitative scraper will scrape the excess solder paste into the solder paste recovery device. At this time, the solder paste capacity in each container is basically the same, and the cutting height is also basically the same. The height of the container is pre-adjusted and parallel to the Y-axis moving mechanism.

[0093] During the dipping process, the probe welding clamping mechanism drives the clamping jaws down to the preset position to ensure that the amount of glue dipped is the set amount. The depth of the clamping jaws' descent at this time determines the amount of glue dipped. Posture correction before dipping ensures that the probe descends in the same posture to dip in solder paste. After the probe is dipped in solder paste, the clamping mechanism will move to the welding position, completing the probe's solder paste dipping function before welding. It should be noted that the above-mentioned preset position is the control position for the probe's glue dipping amount, that is, the deeper the probe descends, the greater the amount. The preset position is debugged according to the welding status, and the quantity control condition is: the welding can be reliable, but it cannot overflow the pad area due to excessive quantity.

[0094] In step S4, the probe welding clamping mechanism moves the probe to the welding position, and the probe welding height detection system detects the probe end face height, obtains the probe height data, and then obtains the probe XY position data, which is then compared with the position data of the pad. After obtaining the XYθ position data, it is uploaded to the control mechanism, and the control mechanism fixes the probe welding pad and the three-dimensional moving platform and corrects it according to the deviation data. After the correction is completed, it takes a photo to compare whether it meets the design requirements. If there is still a deviation, it is corrected again. After the correction is completed, the probe welding clamping mechanism descends to the welding design position according to the measured height, and the laser performs welding.

[0095] During laser welding in step S5, the cooling mechanism discharges liquid nitrogen to cool the probe. This physical cooling prevents the probe from thermal deformation and oxidation during the welding process. Probe temperature control is also achieved through laser pulse energy control. This utilizes a picosecond pulse period and controls the energy of a single pulse by controlling the pulse width. This ensures high output energy and a very short execution time, at the picosecond level, which results in a more concentrated heat flow.

[0096] After welding is completed, the probe welding effect detection system takes pictures to detect the welding effect, checking whether the solder paste is completely melted, whether the weld is well filled, whether the solder paste overflows the pad and other defects. If the inspection fails, it will be marked red on the welding mapping diagram. If three consecutive failures occur, an alarm will be issued and the machine will be shut down.

[0097] In summary, the present invention has the following advantages:

[0098] The present invention solves the problem of low welding precision caused by incorrect position and inconsistent height during probe welding, and realizes high-precision welding with a minimum welding probe spacing of 60 μm.

[0099] The present invention solves the problem of uneven solder paste dipping of the probe before welding, avoids the problem of inability to accurately control the amount of solder paste dipping due to a fixed solder paste dipping position or changes in the solder paste dipping depth during the solder paste dipping process, and ensures the quality of the probe during the welding process.

[0100] The present invention controls laser pulse energy and liquid nitrogen spraying during the welding process, thereby avoiding the problem of heat deformation of adjacent probes due to heat dissipation during welding and ensuring the welding effect.

[0101] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A probe laser micro welding device, characterized in that: include: The probe is taken from the fixture by a material taking mechanism, which is used to photograph the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data and move it to the posture correction station; The probe pre-welding posture acquisition mechanism is used to photograph the removed probe, obtain the second position data of the probe, and compare the second position data with the pre-designed position data to obtain a comparison result; The probe posture correction and solder paste dipping mechanism is used to correct the probe posture according to the comparison result and to dip the probe after posture correction into solder paste; The probe and pad precise alignment mechanism is used to photograph the probe after being dipped in solder paste, obtain the probe height data and third position data, compare the third position data with the pad position data, obtain position deviation data, and accurately align the probe and pad according to the position deviation data; The welding mechanism is used to move the probe to the designed welding position according to the measured height data after the probe and the pad are accurately aligned for laser welding; The control mechanism is respectively connected with the probe material taking mechanism from the fixture, the probe posture obtaining mechanism before welding, the probe posture correction and solder paste dipping mechanism, the probe and pad precise positioning mechanism and the welding mechanism, and is used to control each mechanism.

2. A probe laser micro welding device according to claim 1, characterized in that: The device further comprises: a probe loading mechanism for placing a jig with the probe implanted therein and driving the jig to move.

3. The probe laser micro welding device according to claim 1, characterized in that: The device also includes a welding effect detection mechanism for photographing and detecting the welded product.

4. The probe laser micro welding device according to claim 1, characterized in that: The device further comprises a cooling mechanism for cooling the probe temperature by spraying liquid nitrogen during the welding process.

5. A probe laser micro welding method, characterized in that: include: The probe on the fixture is photographed to obtain the first position data of the probe, and the material removal step of the probe is performed according to the first position data; photographing the removed probe to obtain second position data of the probe, comparing the second position data with pre-designed position data to obtain a comparison result, and correcting the probe posture according to the comparison result; Dipping the probe after posture correction into solder paste; Photograph the probe after dipping in solder paste to obtain the probe height data and third position data, compare the third position data with the pad position data to obtain position deviation data, and calibrate the pad position according to the position deviation data to accurately align the probe with the pad; After the probe and the pad are accurately aligned, the probe is moved to the welding design position according to the measured height data to perform the laser welding steps.

6. The probe laser micro welding method according to claim 5, characterized in that: The step of accurately aligning the probe with the pad also includes a pad positioning step of positioning a mark point of the probe pad to obtain pad position data.

7. The probe laser micro welding method according to claim 5, characterized in that: The method further comprises: after welding is completed, a welding effect detection step of photographing and detecting the welded product.

8. The probe laser micro welding method according to claim 5, characterized in that: The posture correction step further comprises: The probe is photographed by two mutually perpendicular photographing mechanisms to obtain the XY coordinate data and angle data of the probe; Compare the acquired XY coordinate data and angle data with the pre-designed XY coordinate data and angle data to obtain the XY direction deviation and rotation deviation; The probe posture correction mechanism is used to correct rotational deviation, the solder paste tray Y-axis is used to correct X-direction deviation, and the lifting axis is used to correct Y-direction deviation.

9. The probe laser micro welding method according to claim 5, characterized in that: The solder paste dipping step further includes: arranging a plurality of dipping positions at intervals on the solder paste tray, each dipping position corresponding to one probe dipping into the solder paste, and automatically switching the dipping position when the next probe dips into the solder paste.

10. The probe laser micro welding method according to claim 5, characterized in that: The welding step further includes: during the welding process, controlling the probe temperature by combining laser pulse energy control and liquid nitrogen injection.

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