CMP (chemical mechanical polishing) filter blockage automatic detection regulation and control system

Abstract

The invention provides an automatic blockage detection, regulation and control system for a CMP polishing filter, and relates to the technical field of polishing equipment. Comprising a control unit, a liquid storage device, a pump body and a CMP polishing device, the pump body is suitable for conveying polishing liquid in the liquid storage device into the CMP polishing device, and an automatic regulation and control device, a filtering unit and an automatic blockage detection device are further arranged between the pump body and the CMP polishing device; the system can monitor the flowability of the polishing solution and the pressure difference of the filter, detect the through-flow condition of the filter screen in real time, and automatically regulate and control once detecting that the filtering efficiency is reduced or the flow speed is abnormal, and the possible measures comprise adjusting the flow speed of the polishing solution, increasing the cleaning frequency of the filter screen or giving an alarm to prompt that the filter needs to be replaced. The automatic feedback mechanism ensures stable supply of the polishing solution, so that the controllability and repeatability of the polishing process are greatly improved, and the quality stability of a final product is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, and in particular to an automatic detection and control system for clogging of a CMP polishing filter. Background Art

[0002] In the semiconductor industry, chip performance and reliability are key factors in product competitiveness. The performance advantages of chips can not only improve computing speed and energy efficiency, but also enhance the versatility and response speed of terminal products, making them widely used in smartphones, computers, automotive electronics and various IoT devices. The production basis of chips lies in the preparation of substrates, and the quality of substrates is directly related to the overall performance of chips.

[0003] Among the multiple steps of substrate manufacturing, CMP technology is a key process to achieve high flatness and ultra-fine surface quality. CMP can not only effectively remove surface materials, but also smooth the substrate surface, laying the foundation for subsequent micro-machining. CMP technology combines the two mechanisms of chemical corrosion and physical grinding to achieve high-precision surface processing. The substrate surface first reacts with the chemical reagents in the polishing liquid to form a chemically modified film that is easy to remove mechanically. Then, the abrasive particles on the polishing pad physically remove this film through mechanical movement under the action of external force, thereby achieving the flattening of the substrate surface and the optimization of the microstructure. In this process, the stability of the polishing liquid is crucial. The polishing liquid not only needs to maintain constant chemical properties to promote uniform chemical reactions, but also needs to maintain appropriate fluidity and suspension to ensure that the abrasive particles can act evenly on the substrate surface. However, since the polishing liquid will continuously absorb particles and other impurities from the substrate during the circulation process, the slurry particles of the polishing liquid must be controlled within 0.50m. The accumulation of these impurities to a certain extent will cause blockage of the filtration system; the blockage of the filter in the filtration system not only slows down the flow rate of the polishing liquid, but may also change the chemical and physical properties of the liquid, thereby affecting the stability of the polishing process and the final surface quality. Summary of the invention

[0004] The invention discloses an automatic detection and control system for clogging of a CMP polishing filter, aiming to solve the above-mentioned problem.

[0005] The present invention adopts the following scheme:

[0006] A CMP polishing filter blockage automatic detection and control system comprises a control unit, a liquid storage device, a pump body and a CMP polishing device, wherein the pump body is suitable for conveying the polishing liquid in the liquid storage device to the CMP polishing device, and an automatic control device, a filter unit and an automatic blockage detection device are also arranged between the pump body and the CMP polishing device; wherein the automatic control device connects the pump body and the filter unit to control the input flow rate or input pressure of the CMP polishing liquid; the filter unit comprises a multi-layer filter module for filtering impurities of different particle sizes step by step; the automatic blockage detection device is arranged between the filter unit and the CMP polishing device. The CMP polishing device is used to detect the flow rate of the polishing liquid, and compare the flow rate with the preset flow rate value, so as to determine the blockage condition of the polishing liquid; the control unit is connected to the pump body, the automatic control unit and the automatic blockage detection device, and is configured to receive the flow rate signal of the pump body and the automatic blockage detection device, and process the flow rate signal to determine whether the polishing liquid is blocked, and control the automatic control device to control the flow rate or pressure of the polishing liquid according to the blockage condition; the control unit is connected to an output device, and the output device is connected to the CMP polishing device to send an alarm signal or control the CMP polishing device to respond to the blockage condition of the filter unit

[0007] Furthermore, the filtration unit adopts a multi-stage filtration system, and the filtration unit includes at least five filters, namely 100 mesh, 500 mesh, 1000 mesh, 5000 mesh, and 10000 mesh filters. The filters with different mesh numbers are arranged in a step-by-step manner along the flow direction of the polishing liquid to filter particles of different particle sizes.

[0008] Furthermore, the automatic blockage detection device adopts an ultrasonic flow meter, which sends and receives ultrasonic signals through ultrasonic sensors, and calculates the flow rate and volume flow of the fluid by measuring the propagation time and frequency of the signals. The output end of the automatic blockage detection device is connected to the input module of the control unit, and the flow size data of the polishing liquid is transmitted to the control unit in real time, which is convenient for monitoring and control.

[0009] Furthermore, the automatic control device is an electric actuator valve, including a control circuit, a motor, a valve and a feedback device; an output interface of the control unit is connected to the input end of the control circuit of the automatic control device to receive valve opening information, and control the motor to rotate a corresponding angle to control the valve opening, so as to adjust the flow rate of the polishing liquid, thereby maintaining the normal working state of the filter unit.

[0010] Furthermore, the control unit is suitable for comparing the detected flow value with a preset value to determine the blockage state of the filter unit. If the filter unit is in a blocked state, the control unit controls the automatic control device and the output device to perform corresponding actions through a control algorithm; the control algorithm is a PID algorithm based on particle swarm optimization, which comprehensively utilizes proportion (P), integration (I) and differentiation (D) to control the output signal. Based on the particle swarm optimization algorithm, the PID parameters can be automatically adjusted during operation to adapt to changes in system working conditions to adjust the opening of the valve.

[0011] Furthermore, the PID algorithm based on particle swarm optimization includes the following steps:

[0012] S41, Initialize particle swarm: randomly generate a group of particles, each particle has a position corresponding to the PID parameter; the initialization positions of these particles can be randomly selected in the parameter space;

[0013] S42, evaluate fitness: use the objective function to evaluate the fitness of each particle, that is, the objective function value, which reflects the impact of the PID parameter combination on the system performance;

[0014] S43, particle optimal value: compare the current fitness of each particle with the fitness of the historical optimal position, and select the position information of the optimal fitness value for update;

[0015] S44, global optimal value: compare the fitness values ​​of all particles and select the optimal particle position information for update;

[0016] S45, updating speed and position: according to the principle of particle swarm algorithm, updating the speed and position of each particle;

[0017] S46, Iteration condition: When the current number of iterations is less than the maximum number of iterations, the iteration cycle is entered. Through multiple iterations, the particle swarm gradually converges to a better solution, that is, a PID parameter combination with better fitness. When the maximum number of iterations is reached, the iteration is stopped.

[0018] S47, output optimal parameters: use the optimal PID parameter combination finally obtained to configure the actual control system.

[0019] Furthermore, the output device includes two functions: alarm and emergency stop. When the valve opening reaches the maximum and the polishing liquid flow is less than the preset value and greater than 2 / 3 of the preset value, the output device sends out an alarm signal; if the current sensor detects that the pump body is at the maximum working load or the valve opening reaches the maximum, and the polishing liquid flow is still less than 2 / 3 of the preset value of the flow, the output device stops the operation of the CMP polishing device while sending out an alarm signal.

[0020] Furthermore, the pump body is provided with a current sensor, which is used to detect the working state of the corresponding drive motor in the pump body, and when the drive motor is in the maximum load state, the current sensor is fed back to the control unit, and the CMP polishing device is controlled by the control unit to perform corresponding actions.

[0021] Beneficial effects:

[0022] The scheme of the present invention adopts an ultrasonic flowmeter to detect the liquid flow rate, and calculates the liquid flow rate by using the propagation time and frequency of ultrasonic waves in the liquid; at the same time, the detected flow rate signal is transmitted to the control unit, and the control unit automatically adjusts the control parameters based on the PID operation of the particle swarm optimization algorithm, outputs the electrical signal of the control valve, and controls the opening and closing degree of the valve. When the filter unit is in a slightly blocked state, the opening of the valve becomes larger, so that the flow rate of the polishing liquid remains stable, and a part of the flocculent particles are dispersed under the impact of the flow rate and filtered again by filters of different mesh numbers; when the valve opening reaches the maximum, the polishing liquid flow rate is less than the preset value and greater than 2 / 3 of the preset flow value, the output device sends an alarm signal; when the current sensor detects that the pump body is at the maximum working load or the valve opening reaches the maximum polishing liquid flow rate less than 2 / 3 of the flow preset value, the output device sends an alarm signal and urgently stops the operation of the CMP polishing device, notifying the staff that the filter needs to be manually cleaned.

[0023] The automatic blockage detection and control system of the present invention can automatically adjust the state of the channel according to the blockage degree and other indicators, can effectively overcome the pipeline blockage problem, and provide a timely early warning mechanism to help operators better deal with the blockage problem and improve the performance and reliability of pipelines and equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a structural principle diagram of an automatic detection and control system for CMP polishing filter blockage according to an embodiment of the present invention;

[0025] Figure 2 The present invention is a schematic diagram of an automatic detection and blockage device of an automatic detection and control system for CMP polishing filter blockage according to an embodiment of the present invention.

[0026] Figure 3 The present invention is a schematic diagram of a control algorithm of a CMP polishing filter clogging automatic detection and control system according to an embodiment of the present invention.

[0027] Figure 4 The present invention discloses a flow chart of PID parameters based on particle swarm optimization in a CMP polishing filter clogging automatic detection and control system according to an embodiment of the present invention.

[0028] Figure 5 The present invention is a schematic structural diagram of an automatic control device of an automatic detection and control system for CMP polishing filter clogging according to an embodiment of the present invention.

[0029] Reference numerals: 21 - ultrasonic flow meter; 22 - transmitter; 23 - receiver; 24 - pipeline. DETAILED DESCRIPTION

[0030] Combination Figures 1 to 5 As shown, this embodiment provides a CMP polishing filter blockage automatic detection and control system, including a control unit, a liquid storage device, a pump body and a CMP polishing device, the pump body is suitable for conveying the polishing liquid in the liquid storage device to the CMP polishing device, and an automatic control device, a filter unit, and an automatic blockage detection device are also arranged between the pump body and the CMP polishing device; wherein the automatic control device connects the pump body and the filter unit to control the input flow rate or input pressure of the CMP polishing liquid; the filter unit includes a multi-layer filter module for filtering impurities of different particle sizes step by step; the automatic blockage detection device is arranged on the filter The unit is used to detect the flow rate of the polishing liquid and compare the flow rate with a preset flow value to determine the blockage condition of the polishing liquid; the control unit is connected to the pump body, the automatic control unit and the automatic blockage detection device, and is configured to receive flow signals from the pump body and the automatic blockage detection device, and process the flow signals to determine whether the polishing liquid is blocked, and control the automatic control device to control the flow rate or pressure of the polishing liquid according to the blockage condition; the control unit is connected to an output device, and the output device is connected to the CMP polishing device to send an alarm signal or control the CMP polishing device to respond to the blockage condition of the filter unit.

[0031] In this embodiment, the filtration unit adopts a multi-stage filtration system, and the filtration unit includes at least five filters, namely 100 mesh, 500 mesh, 1000 mesh, 5000 mesh, and 10000 mesh filters. The filters with different mesh numbers are arranged in a step-by-step manner along the flow direction of the polishing liquid to filter particles of different particle sizes. The polishing liquid first passes through a filter with a larger pore size to remove large particles of impurities, and then passes through a filter with a smaller pore size to further remove pollutants of smaller particles, thereby avoiding the one-time accumulation of impurity particles that do not meet the standards and achieving multi-stage filtration. This helps to improve the efficiency of the entire filtration system, reduce the risk of a filter being completely blocked, extend the service life of the filter, and ensure that the quality of the polishing liquid in the pipeline is effectively controlled and managed. The filtration unit here is replaceable, and the number of filters is not limited to 5, and the mesh number of each filter is not limited to the above-mentioned values.

[0032] Combination Figure 2As shown, the automatic blockage detection device uses an ultrasonic flowmeter 21, which is a non-invasive measuring device that can prevent blockage from affecting the flow detection result. Specifically, the ultrasonic flowmeter 21 uses a transmitter 22 and a receiver 23 of an ultrasonic sensor to send and receive ultrasonic signals respectively. The ultrasonic sensor is arranged on a transmission pipe 24 of the polishing liquid, and measures the propagation time and frequency of the signal in the transmission pipe 24 to calculate the flow rate and volume flow of the fluid. The output end of the ultrasonic sensor is connected to the input module of the control unit, and the flow size data of the polishing liquid is transmitted to the control unit in real time, which is convenient for monitoring and control. The specific structure of the ultrasonic flowmeter is an existing design and will not be repeated here.

[0033] Combination Figure 5 As shown, the automatic control device is an electric actuator valve, including a control circuit, a motor, a valve and a feedback device; an output interface of the control unit is connected to the input end of the control circuit of the automatic control device to receive valve opening information, and control the motor to rotate the corresponding angle to control the valve opening, so as to adjust the flow of the polishing liquid, thereby maintaining the normal working state of the filter unit. When the control circuit of the automatic control device receives the signal instruction from the control unit, it will generate a corresponding control signal according to the requirements of the instruction. After receiving the control signal, the motor, as an actuator, rotates the corresponding angle according to the instruction of the signal. The motor output shaft is connected to the valve. When the motor rotates, the rotation of the output shaft controls the valve core of the valve, thereby accurately controlling the opening of the valve. Through the cooperation of the control circuit and the motor, the instruction of the control signal can be accurately converted into the operation of the valve opening, so as to achieve accurate control of the valve, thereby achieving accurate regulation and control of the flow and flow rate of the CMP polishing liquid. At the same time, in order to ensure that the valve reaches the corresponding opening, a position sensor is installed to measure and feedback the actual position information of the valve to the control unit to ensure that the valve can accurately reach the required opening. The position sensor is installed on the valve actuator and feeds back the measured position information to the control circuit in the form of electrical signals. After receiving these feedback signals, the control circuit compares them with the preset target position and makes adjustments and controls as needed.

[0034] The pump body is provided with a driving motor, and a current sensor is installed at the outlet of the driving motor. The information of the current sensor is output to the control unit in real time. The control unit monitors the current of the driving motor in real time to realize overload protection of the driving motor. When the load of the driving motor exceeds the rated capacity, the current exceeds the normal range, and the control unit triggers the protection mechanism to prevent the driving motor from being damaged due to overload.

[0035] The output device includes two functions: alarm and emergency stop. When the valve opening reaches the maximum and the polishing liquid flow is less than the preset value and greater than 2 / 3 of the preset value, the output device sends out an alarm signal; if the current sensor detects that the pump body is at the maximum working load or the valve opening reaches the maximum and the polishing liquid flow is still less than 2 / 3 of the preset value, the output device stops the operation of the CMP polishing device while sending out an alarm signal.

[0036] Combination Figure 3 , Figure 4 As shown, in this embodiment, the control unit is suitable for comparing the detected flow value with the preset value, combining the pump body and the valve opening of the automatic control device to determine the blockage state of the filter unit. For example, when the opening of the valve reaches the maximum, when the polishing liquid flow is less than the preset value and greater than 2 / 3 of the preset value, it can be determined as a slight blockage state. If the current sensor detects that the pump body is at the maximum working load or the valve opening reaches the maximum, and the polishing liquid flow is still less than 2 / 3 of the preset flow value, it can be determined as a serious blockage state.

[0037] When the filter unit is in a blocked state, the control unit controls the automatic control device and the output device to perform corresponding actions through the control algorithm; the control algorithm is a PID algorithm based on particle swarm optimization, which comprehensively utilizes the proportion (P), integral (I) and differential (D) to control the output signal, wherein the proportional control is to generate an output signal proportional to the error according to the error between the set value and the actual value, which can quickly produce a large control effect. The integral control is to multiply the error by an integral time and then output the accumulated error, which can eliminate the steady-state error and ensure the stability and accuracy of the system. The differential control produces a control effect according to the rate of change of the error to predict the future behavior of the system and reduce overshoot and oscillation. The PID controller calculates a comprehensive control output signal according to the size, accumulation and change rate of the error. By adjusting the size of the proportional coefficient Kp, the integral coefficient Ki and the differential coefficient Kd, the response performance of the PID controller can be adjusted to achieve system stability, fast response and precise control.

[0038] The traditional PID algorithm requires manual parameter adjustment, which is limited by the experience and trial and error process of manual adjustment, and may not necessarily find the optimal solution. Therefore, a PID parameter based on the particle swarm optimization algorithm (PSO) is proposed here to achieve automatic parameter adjustment. The basic idea of ​​the PSO algorithm is to adjust the position and speed of individuals in the group so that it can iteratively search for the optimal solution in the search space. Each individual (particle) has a position in the search space, representing a possible solution, and a speed, which determines the direction and speed of movement of the particle in the search space. The particle swarm optimization algorithm can automatically adjust the PID parameters at runtime to adapt to changes in system working conditions to adjust the opening of the valve. Specifically, the PID algorithm based on particle swarm optimization includes the following steps:

[0039] S41, Initialize particle swarm: randomly generate a group of particles, each particle has a position corresponding to the PID parameter; the initialization positions of these particles can be randomly selected in the parameter space;

[0040] S42, evaluate fitness: use the objective function to evaluate the fitness of each particle, that is, the objective function value, which reflects the impact of the PID parameter combination on the system performance;

[0041] S43, particle optimal value: compare the current fitness of each particle with the fitness of the historical optimal position, and select the position information of the optimal fitness value for update;

[0042] S44, global optimal value: compare the fitness values ​​of all particles and select the optimal particle position information for update;

[0043] S45, updating speed and position: according to the principle of particle swarm algorithm, updating the speed and position of each particle;

[0044] S46, Iteration condition: When the current number of iterations is less than the maximum number of iterations, the iteration cycle is entered. Through multiple iterations, the particle swarm gradually converges to a better solution, that is, a PID parameter combination with better fitness. When the maximum number of iterations is reached, the iteration is stopped.

[0045] S47, output optimal parameters: use the optimal PID parameter combination finally obtained to configure the actual control system.

[0046] According to the scheme of this embodiment, when the CMP device is working, when the CMP polishing liquid enters the pipeline through the liquid under the action of the pump body, flows through the valve with a preset opening, and then filters out large particles that do not meet the standards through the filter element of the filter unit, the filtered polishing liquid flows out from the outlet end of the filter unit; at this time, if the valve core of the filter unit is not blocked at all, the detected flow rate is the same as the set value; when the filter element is slightly blocked, the flow value detected by the ultrasonic flowmeter is lower than the preset value, and the control unit will output a corresponding signal through the PID operation based on the particle swarm optimization algorithm to adjust the opening of the automatic control device so that the actual flow value is the same as the set value; at this time, if the valve opening has reached the maximum, and the polishing liquid flow rate is less than the preset value and greater than 2 / 3 of the preset value, the output device sends an alarm signal; when the current sensor detects that the pump is at the maximum workload or the valve opening reaches the maximum, and the polishing liquid flow rate is less than 2 / 3 of the flow rate value, it is determined to be seriously blocked, and continuing to work will affect the polishing quality of the equipment. At this time, the control unit sends an alarm signal through the output device and urgently stops the operation of the CMP polishing device.

[0047] Through the scheme of this embodiment, the system can monitor the fluidity of the polishing liquid and the pressure difference of the filter, and detect the circulation of the filter in real time; once the filtration efficiency is detected to be reduced or the flow rate is abnormal, the system will automatically adjust and control. Possible measures include adjusting the flow rate of the polishing liquid, increasing the frequency of cleaning the filter, or alarming to prompt the need to replace the filter. This automated feedback mechanism ensures a stable supply of polishing liquid, thereby greatly improving the controllability and repeatability of the polishing process and ensuring the quality stability of the final product. Therefore, by introducing an automatic detection and control system for polishing liquid blockage, the stability and reliability of the CMP process can be significantly improved, ensuring high efficiency and high-quality output of substrate production.

[0048] It should be understood that the above are only preferred implementations of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention.

[0049] The above description of the drawings used in the implementation manner only illustrates certain embodiments of the present invention and should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

Claims

1. A CMP polishing filter blockage automatic detection and control system, comprising a control unit, a liquid storage device, a pump body and a CMP polishing device, wherein the pump body is suitable for transporting the polishing liquid in the liquid storage device to the CMP polishing device, characterized in that: An automatic control device, a filtering unit, and an automatic blockage detection device are also provided between the pump body and the CMP polishing device; wherein, The automatic control device is connected to the pump body and the filter unit to control the input flow rate or input pressure of the CMP polishing liquid; The filtering unit includes a multi-layer filtering module for filtering impurities of different particle sizes step by step; The automatic blockage detection device is arranged between the filter unit and the CMP polishing device to detect the flow rate of the polishing liquid, and compare the flow rate with a preset flow rate value to determine the blockage condition of the polishing liquid; The control unit is connected to the pump body, the automatic control unit and the automatic blockage detection device, and is configured to receive flow signals from the pump body and the automatic blockage detection device, and process the flow signals to determine whether the polishing liquid is blocked, and control the automatic control device to control the flow or pressure of the polishing liquid according to the blockage situation; The control unit is connected to an output device, and the output device is connected to the CMP polishing device for issuing an alarm signal or controlling the CMP polishing device to respond to the clogging state of the filter unit.

2. The CMP polishing filter clogging automatic detection and control system according to claim 1, characterized in that: The filtering unit adopts a multi-stage filtering system, and the filtering unit includes at least five filters, namely 100 mesh, 500 mesh, 1000 mesh, 5000 mesh, and 10000 mesh filters. The filters with different mesh numbers are arranged in a step-by-step manner along the flow direction of the polishing liquid to filter particles of different particle sizes.

3. The CMP polishing filter clogging automatic detection and control system according to claim 1, characterized in that: The automatic blockage detection device adopts an ultrasonic flow meter, which sends and receives ultrasonic signals through ultrasonic sensors, and calculates the flow rate and volume flow of the fluid by measuring the propagation time and frequency of the signals. The output end of the automatic blockage detection device is connected to the input module of the control unit, and the flow size data of the polishing liquid is transmitted to the control unit in real time, which is convenient for monitoring and control.

4. The CMP polishing filter clogging automatic detection and control system according to claim 1, characterized in that: The automatic control device is an electric actuator valve, including a control circuit, a motor, a valve and a feedback device; an output interface of the control unit is connected to the input end of the control circuit of the automatic control device to receive valve opening information, and control the motor to rotate the corresponding angle to control the valve opening, so as to adjust the flow of the polishing liquid, thereby maintaining the normal working state of the filter unit.

5. The CMP polishing filter clogging automatic detection and control system according to claim 4, characterized in that: The control unit is suitable for comparing the detected flow value with a preset value to determine the blockage state of the filter unit. If the filter unit is in a blocked state, the control unit controls the automatic control device and the output device to perform corresponding actions through a control algorithm; the control algorithm is a PID algorithm based on particle swarm optimization, which comprehensively utilizes proportion (P), integration (I) and differentiation (D) to control the output signal. Based on the particle swarm optimization algorithm, the PID parameters can be automatically adjusted during operation to adapt to changes in system working conditions to adjust the opening of the valve.

6. The CMP polishing filter clogging automatic detection and control system according to claim 5, characterized in that: The PID algorithm based on particle swarm optimization includes the following steps: S41, Initialize particle swarm: randomly generate a group of particles, each particle has a position corresponding to the PID parameter; the initialization positions of these particles can be randomly selected in the parameter space; S42, evaluate fitness: use the objective function to evaluate the fitness of each particle, that is, the objective function value, which reflects the impact of the PID parameter combination on the system performance; S43, particle optimal value: compare the current fitness of each particle with the fitness of the historical optimal position, and select the position information of the optimal fitness value for update; S44, global optimal value: compare the fitness values ​​of all particles and select the optimal particle position information for update; S45, updating speed and position: according to the principle of particle swarm algorithm, updating the speed and position of each particle; S46, Iteration condition: The current number of iterations is less than the maximum number of iterations, and the iteration cycle is entered. Through multiple iterations, the particle swarm gradually converges to a better solution, that is, a PID parameter combination with better fitness; When the maximum number of iterations is reached, stop the iteration; S47, output optimal parameters: use the optimal PID parameter combination finally obtained to configure the actual control system.

7. The CMP polishing filter clogging automatic detection and control system according to claim 4, characterized in that: The output device includes two functions: alarm and emergency stop. When the valve opening reaches the maximum and the polishing liquid flow is less than the preset value and greater than 2 / 3 of the preset value, the output device sends out an alarm signal; if the current sensor detects that the pump body is at the maximum working load or the valve opening reaches the maximum, and the polishing liquid flow is still less than 2 / 3 of the preset value of the flow, the output device stops the operation of the CMP polishing device while sending out an alarm signal.

8. The CMP polishing filter clogging automatic detection and control system according to claim 1, characterized in that: The pump body is provided with a current sensor, which is used to detect the working state of the corresponding driving motor in the pump body. When the driving motor is in the maximum load state, the current sensor is fed back to the control unit, and the CMP polishing device is controlled by the control unit to perform corresponding actions.

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