Ceramic plate cutting method and cutting device

Abstract

The invention provides a ceramic plate cutting method and device, and relates to the technical field of ceramic plate cutting process.The ceramic plate cutting method comprises the steps that the actual contour form and the preset contour form of a to-be-cut ceramic plate are obtained; comparing the actual contour form with a preset contour form; dividing the actual contour form into a plurality of cutting areas according to a preset contour form; cutting the plurality of cutting areas in sequence until the actual contour form meets the standard of the preset contour form; any cutting depth is not greater than one third of the thickness of the ceramic plate until the ceramic plate is cut through. The cutting method can be used for cutting the ceramic plate, the ceramic plate is divided into a plurality of cutting areas, then cutting is conducted, the purpose of planning the cutting areas is achieved, internal stress of the ceramic plate is released, and the situation that the ceramic plate is broken in the cutting process is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic plate cutting technology, and in particular to a ceramic plate cutting method and a cutting device. Background Art

[0002] Ceramic plates have the characteristics of high hardness, good flame retardancy and insulation, and strong corrosion resistance, and are often used to make laboratory countertops. Ceramic plates need to be cut according to the design size specifications. Ceramic plates are prone to plate cracking during the cutting process, resulting in a high breakage rate of ceramic plates, which affects the cutting yield rate of ceramic plates. Summary of the invention

[0003] The purpose of the present invention is to provide a cutting method and a cutting device, which gradually cut the edge position, and the cutting direction remains parallel to the edge position of the preset contour shape, so as to gradually change the actual contour shape of the ceramic plate, release the internal stress of the ceramic plate, reduce the occurrence of fragmentation during the cutting process, and improve the cutting effect.

[0004] A first aspect of the present invention provides a method for cutting a ceramic plate, comprising:

[0005] Obtaining the actual contour shape and the preset contour shape of the ceramic plate to be cut;

[0006] Comparing the actual contour morphology with the preset contour morphology;

[0007] Dividing the actual contour into a plurality of cutting areas according to the preset contour;

[0008] Cutting a plurality of the cutting areas in sequence until the actual contour conforms to the standard of the preset contour;

[0009] The cutting depth at any one time is no more than one third of the thickness of the ceramic plate until the ceramic plate is cut through.

[0010] In a possible embodiment of the present invention, the step of sequentially cutting a plurality of the cutting areas comprises:

[0011] Dividing the outer circle of the ceramic plate into a plurality of cutting areas along the edge position of the actual contour shape;

[0012] The plurality of cutting areas are cut in sequence until the actual contour conforms to the standard of the preset contour, and the cutting direction of the ceramic plate is parallel to the edge position of the preset contour.

[0013] In a possible embodiment of the present invention, a first cutting is performed around the outer circle of the ceramic plate from the edge position of the actual contour to the preset contour, and an nth cutting is performed by moving a preset distance toward the inner side of the ceramic plate.

[0014] In a possible embodiment of the present invention, the four edges of the ceramic plate include a first edge, a second edge, a third edge and a fourth edge, and cutting is performed in sequence along the first edge, the second edge, the third edge and the fourth edge, and the four edges are cut in a cycle for several circles until the actual contour meets the standard of the preset contour.

[0015] In a possible embodiment of the present invention, a second opening is opened for the actual contour form according to the first opening of the preset contour form;

[0016] The size of the first opening is obtained by cutting around the edge of the second opening.

[0017] In a possible embodiment of the present invention, an opening area of ​​the first opening is Q1, and an opening area of ​​the second opening is Q2, satisfying: Q2<Q1.

[0018] In a possible embodiment of the present invention, the depth of the cutting groove of the ceramic plate at any time is H, and the thickness of the ceramic plate is D, which satisfies: 3H=D.

[0019] In a possible embodiment of the present invention, before any cutting through the ceramic plate, the width of the nth cutting is L1, and the width of the n+1th cutting is L2, satisfying: L1<L2.

[0020] In a possible embodiment of the present invention, a saw blade is used to cut the ceramic plate, and the cutting speed of the saw blade is 6000 RPM.

[0021] A second aspect of the present invention provides a cutting device, which includes a cutting machine and a saw blade, wherein the saw blade is mounted on the cutting machine, and the cutting device uses the cutting method described in any one of the above embodiments to cut the ceramic plate.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: a cutting method and a cutting device provided by the present invention, the cutting method of a ceramic plate can be used to cut a ceramic plate, the ceramic plate to be cut is cut according to a preset contour shape, the actual contour shape of the ceramic plate is cut to make it conform to the shape and size of the preset contour shape, the actual contour shape is divided into several cutting areas and then cut, so as to achieve the purpose of planning the cutting area, the ceramic plate is gradually cut according to the preset contour shape, so that the actual contour shape of the ceramic plate is gradually changed, the depth of each cutting of the ceramic plate is not more than one third of the thickness of the ceramic plate, so as to release the internal stress of the ceramic plate, reduce the breakage of the ceramic plate during the cutting process, prevent damage to the ceramic plate product, reduce the product scrap rate, and improve the cutting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic flow chart of a method for cutting a ceramic plate provided in some embodiments of the present invention;

[0025] Figure 2 It is a schematic diagram of a top view of a ceramic plate provided in some embodiments of the present invention;

[0026] Figure 3 It is a schematic diagram of the cross-sectional structure of a ceramic plate provided in some embodiments of the present invention.

[0027] Description of main component symbols;

[0028] 100-actual contour shape; 110-glaze layer; 120-base layer; 200-preset contour shape. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] Example 1

[0037] In the related art, the ceramic plates need to be cut according to the designed size specifications. The ceramic plates are prone to plate cracking during the cutting process, resulting in a high breakage rate of the ceramic plates, which affects the cutting yield of the ceramic plates.

[0038] To solve the above problems, refer to Figure 1 As shown, an embodiment of the present application provides a method for cutting a ceramic plate, comprising:

[0039] S100: Acquire the actual contour 100 and the preset contour 200 of the ceramic plate to be cut;

[0040] S200: comparing the actual contour morphology 100 with the preset contour morphology 200;

[0041] S300: Dividing the actual contour into a plurality of cutting areas according to the preset contour;

[0042] S300: Cutting a plurality of cutting areas in sequence until the actual contour conforms to the standard of the preset contour;

[0043] S500: The cutting depth at any one time is not greater than one third of the thickness of the ceramic plate until the ceramic plate is cut through.

[0044] Specifically, combined Figure 1 and Figure 2 As shown, firstly, the actual contour 100 and the preset contour 200 of the ceramic plate to be cut are obtained, and then the actual contour 100 is compared with the preset contour 200, and the actual contour is divided into a plurality of cutting areas according to the preset contour, and the plurality of cutting areas are cut in sequence, until the actual contour 100 meets the standard of the preset contour 200, and the cutting depth at any one time is not greater than one third of the thickness of the ceramic plate, that is, the cutting depth when the ceramic plate is cut is less than or equal to one third of the thickness of the ceramic plate, until the ceramic plate is cut through, and then the above-mentioned cutting method is used for the next part of the ceramic plate. The cutting depth is cut repeatedly, and the ceramic plate to be cut is cut according to the preset contour 200. The actual contour 100 of the ceramic plate is cut to make it conform to the shape and size of the preset contour 200. The actual contour is divided into several cutting areas and then cut to achieve the purpose of planning the cutting area. The ceramic plate is gradually cut according to the preset contour so that the actual contour of the ceramic plate is gradually changed. The depth of each cutting of the ceramic plate is not more than one third of the thickness of the ceramic plate to release the internal stress of the ceramic plate, reduce the breakage of the ceramic plate during the cutting process, prevent damage to the ceramic plate product, and reduce the product scrap rate.

[0045] It can be understood that the actual contour shape 100 of the ceramic plate refers to the actual size and shape of the ceramic plate, and the preset contour shape 200 refers to the designed size and shape of the ceramic plate after cutting.

[0046] In the present embodiment, experimental examples 1, 2, 3, 4 and comparative examples are disclosed for cutting ceramic plates. The difference between the cutting methods of experimental examples 1 and 2 and the cutting method of ceramic plates of the present application is that the depth of each cutting of the ceramic plates is less than one third of the thickness of the ceramic plates. Experimental examples 3 and 4 are cut using the cutting method of ceramic plates of the present application, and the comparative example is cut by directly cutting through the ceramic plates. As shown in Table 1, other performance test parameters in the cutting process of ceramic plates in the above experimental examples and comparative examples are the same. For example, the thickness of the ceramic plates is 25 mm, and the number of pieces for the test experiment is 1000.

[0047] Table 1 Performance test parameters

[0048] Test items Test value Inspection basis Water absorption <0.1％ Refer to DIN 51056 Wear resistance 2100 rpm / level 4 Refer to GB / T 4100-2006 Coefficient of thermal expansion <![CDATA[5.5×10 -5 ℃ -1 ]]> Refer to GB / T 4100-2006 Weight loss in acid 0.69％ Refer to DIN 51102 Weight loss in alkali 4.19％ Refer to DIN 51103 Thermal shock resistance No visible defects Refer to GB / T 4100-2006 Bending strength 42.8MPa Refer to GB / T 4100-2006 Compressive strength <![CDATA[400N / mm 2 ]]> Refer to VDE 0335 Rockwell hardness 110HRM Refer to GB / T 230-2002 Elastic modulus 0.8 Refer to GB / T4100-2006

[0049] The difference between Experimental Example 1 and the comparative example is that in Experimental Example 1, when cutting the ceramic plate, the cutting depth of each cutting of the ceramic plate is one fifth of the thickness of the ceramic plate until the thickness of the ceramic plate is cut through.

[0050] The difference between Experimental Example 2 and the comparative example is that in Experimental Example 2, when cutting the ceramic plate, the cutting depth of each cutting of the ceramic plate is one quarter of the thickness of the ceramic plate until the thickness of the ceramic plate is cut through.

[0051] The difference between Experimental Example 3 and the comparative example is that in Experimental Example 3, when cutting the ceramic plate, the cutting depth of each cutting of the ceramic plate is one third of the thickness of the ceramic plate until the thickness of the ceramic plate is cut through.

[0052] The difference between Experimental Example 4 and the comparative example is that in Experimental Example 4, when cutting the ceramic plate, the cutting depth of each cutting of the ceramic plate is half of the thickness of the ceramic plate until the thickness of the ceramic plate is cut through.

[0053] Table 2 Performance test results

[0054]

[0055] It can be seen from Table 2 above that, in the cutting process of the ceramic plates in Experimental Example 3, on the one hand, the number of breakages is 10 and the breakage rate is 1%. The breakage rate of Experimental Example 3 is greater than 0.7% of Experimental Example 1 and 0.5% of Experimental Example 2, and is less than 10% of Experimental Example 3 and 20% of Experimental Example 4. The breakage rate of Experimental Example 3 is relatively low. On the other hand, the cutting time of the ceramic plates in Experimental Example 3 is 400h. The cutting time of Experimental Example 3 is greater than 320h of Experimental Example 3 and 270h of Experimental Example 4, and is less than 800h of Experimental Example 1 and 540h of Experimental Example 2. Experimental Example 3 adopts a solution in which the cutting depth of each cutting of the ceramic plate is one-third of the thickness of the ceramic plate to achieve a balance between the breakage rate and cutting time of the ceramic plate, and has better technical effects when the ceramic plates are actually cut.

[0056] In one embodiment, optionally, the step of sequentially cutting a plurality of the cutting areas comprises: Step S310: dividing the outer circle of the ceramic plate into a plurality of cutting areas along the edge position of the actual contour shape, and correspondingly, Figure 2 As shown, the ceramic plate is divided into multiple cutting areas around the outer circle along the edge position of the actual contour of the ceramic plate, so that the cutting path and cutting trajectory can be planned according to each cutting area later, so as to improve the cutting efficiency and reduce the fragmentation of the ceramic plate during the cutting process. Step S320: Cut the multiple cutting areas in sequence until the actual contour meets the standard of the preset contour, and the cutting direction of the ceramic plate is parallel to the edge position of the preset contour. In other words, cut the multiple cutting areas in sequence according to the cutting trajectory of the ceramic plate until the contour of the ceramic plate is cut to the standard of the preset contour, and complete the cutting operation of the ceramic plate according to the size and shape of the drawing.

[0057] In one embodiment, optionally, Figure 2 As shown, from the edge position of the actual contour 100 to the preset contour 200, wherein Figure 2The dotted line in the figure represents the cutting trajectory. The first circle of cutting is performed around the outer circle of the ceramic plate, and the nth circle of cutting is performed by moving a preset distance toward the inner side of the ceramic plate. Accordingly, the ceramic plate is cut from the edge position of the actual contour 100, so that the edge position of the actual contour 100 is processed into the size and shape of the preset contour 200. In this cutting process, the first circle of cutting is performed around the outer circle of the ceramic plate, and then the second circle of cutting is performed by moving a short distance toward the inner side of the ceramic plate. The cycle is repeated for the nth circle of cutting on the ceramic plate until the ceramic plate is processed and cut to the preset contour 200 of the ceramic plate. A step-by-step multi-circle cutting method is adopted to release the stress inside the ceramic plate and reduce the situation where cutting cracks are formed on the ceramic plate during the cutting force process, which has a better technical effect.

[0058] Optionally, refer to Figure 1 and Figure 2 As shown, the four edges of the ceramic plate include a first edge, a second edge, a third edge and a fourth edge, and cutting is performed in sequence along the first edge, the second edge, the third edge and the fourth edge, and the four edges are cut in a cycle for several circles until the actual contour 100 meets the standard of the preset contour 200. The four edges of the ceramic plate are cut in sequence, so that the size and shape of the ceramic plate are gradually reduced, and finally the purpose of processing the ceramic plate into the preset contour 200 is achieved, and in the cutting process, the occurrence of damage or breakage of the ceramic plate is reduced, thereby improving the yield rate.

[0059] In one embodiment, optionally, a second opening is opened in the actual contour form 100 according to the first opening of the preset contour form 200; and the size of the first opening is obtained by cutting around the edge position of the second opening. In other words, when opening the second opening in the ceramic plate, the first opening can be opened in the ceramic plate first, and then the first opening can be cut around the edge position of the side wall of the first opening, so that the size specification of the first opening is obtained through processing.

[0060] Optionally, the opening area of ​​the first opening is Q1, and the opening area of ​​the second opening is Q2, satisfying: Q2<Q1, that is, when cutting is required to form a first opening of a preset size, the second opening is first opened in the ceramic plate so that the area Q2 of the second opening of the ceramic plate is smaller than the area Q1 of the first opening, and then the side wall edge of the second opening is cut to gradually obtain the area Q1 of the first opening, thereby avoiding the situation where other positions of the ceramic plate may be broken or cracked when the opening area of ​​the first opening is obtained by direct cutting, and having a better technical effect.

[0061] In one embodiment, optionally, Figure 3 As shown, the depth of the cutting groove of the ceramic plate at any time is H, and the thickness of the ceramic plate is D, which satisfies: 3H=D, that is, the cutting depth H of the ceramic plate each time the cutting process is performed is one third of the thickness D of the ceramic plate. Figure 3 The dotted line in the figure represents the position of the cutting depth. Accordingly, on the one hand, the cutting time of the ceramic plate is balanced to prevent the cutting time of the ceramic plate from being too long and affecting the cutting efficiency. On the other hand, it can reduce the damage or breakage of the ceramic plate during the cutting process and improve the cutting yield of the ceramic plate.

[0062] Optionally, the thickness D of the ceramic plate satisfies: 15mm≤D≤30mm, that is, the thickness D of the ceramic plate can be any value between 15mm and 30mm, so that when the ceramic plate is cut with a size specification of thickness D, the internal stress of the ceramic plate can be released. Exemplarily, the thickness D of the ceramic plate can also be 16mm, 18mm, 20mm or 25mm.

[0063] It is understandable that, combined with Figure 2 and Figure 3 As shown, the ceramic plate includes a glaze layer 110 and a base layer 120. The glaze layer 110 is located on the base layer 120. The base layer 120 is the main structural part of the ceramic, also known as the body, which is formed by mixing and molding ceramic raw materials (such as clay, feldspar, quartz, etc.) and then firing. The glaze layer 110 is coated on one side of the base layer 120. The glaze layer 110 is a layer of glass material coated on the surface of the ceramic base. The glaze melts at high temperature and forms a smooth, transparent or translucent protective layer during the cooling process. In this process, the glaze layer 110 and the base layer 120 are ensured to have similar thermal expansion coefficients, reducing the cracking or fragmentation of the ceramic plate due to temperature changes. When cutting the ceramic plate, the glaze layer 110 of the ceramic plate can be cut through first to reach the position of the base layer 120 of the ceramic plate.

[0064] In one embodiment, optionally, before any cutting through the ceramic plate, the nth cutting width is L1, and the n+1th cutting width is L2, satisfying: L1<L2, that is, the nth cutting width L1 is smaller than the n+1th cutting width L2, wherein n is a natural number not less than 1. The cutting width of the cutting position can be widened so that the n+1th cutting width can completely cover the nth cutting width. For example, a first cut can be made on the ceramic plate, and then a second cut can be made on the ceramic plate based on the first cut, so that the cutting width of the second cut is larger than the cutting width of the first cut, and the stress distribution during the cutting process is controlled to release the stress around the cutting position, and it can also facilitate heat dispersion during the cutting process, reduce the concentration of thermal stress, and prevent the ceramic plate from cracking due to local overheating, thereby achieving the purpose of improving cutting accuracy and cutting quality. In addition, the thickness of the nth cutting saw blade is smaller than the thickness of the n+1th cutting saw blade, thereby reducing the deformation or deformation of the cutting saw blade due to its thin thickness during cutting, resulting in breakage at the cutting position, thereby improving the stability of the cutting saw blade during the n+1th cutting.

[0065] In one embodiment, optionally, the thermal expansion coefficient of the ceramic plate is 5.5×10 -5 ℃ -1 , that is, the thermal expansion coefficient of the ceramic plate refers to the rate of change of the length or volume of the ceramic plate material when the temperature changes, usually expressed as the rate of change of the linear dimension per degree of temperature change. Different ceramic plate materials have different thermal expansion coefficients, which affect the thermal stress of the ceramic plate. Thermal stress can cause the ceramic plate to break or crack, causing the ceramic plate to be damaged during cutting. The thermal expansion coefficient of the ceramic plate used in this application is 5.5×10 -5 ℃ -1 When the thermal expansion coefficient is too large during cutting, it is easy to cause the ceramic plate to expand thermally and break due to stress. Keeping the ceramic plate with a small breakage rate and fragmentation during the processing and cutting process has better technical effects.

[0066] Optionally, a saw blade is used to cut the ceramic plate, and the cutting speed of the saw blade is 6000RPM. Since the cutting speed of the saw blade is different when processing and cutting different materials, the cutting speed of the saw blade for cutting the ceramic plate is 6000RPM, that is, the saw blade rotates 6000 times per minute, ensuring sufficient cutting force during cutting, and processing and cutting the ceramic plate to prevent the ceramic plate from breaking or cracking.

[0067] In summary, the cutting method of the ceramic plate can be used to cut the ceramic plate. The ceramic plate to be cut is cut according to the preset contour shape 200, and the actual contour shape 100 of the ceramic plate is cut to make it conform to the shape and size of the preset contour shape 200. The edge position is gradually cut by cutting around the edge position of the actual contour shape 100, and the cutting direction is kept parallel to the edge position of the preset contour shape 200 so that the actual contour shape 100 of the ceramic plate is gradually changed. The depth of each cutting of the ceramic plate is not less than one third of the thickness of the ceramic plate so as to release the internal stress of the ceramic plate, reduce the breakage of the ceramic plate during the cutting process, cause damage to the ceramic plate product, reduce the product scrap rate, and improve the cutting effect.

[0068] Example 2

[0069] An embodiment of the present invention further provides a cutting device, which includes a cutting machine and a saw blade, wherein the saw blade is mounted on the cutting machine, and the cutting device uses the ceramic plate cutting method described in the above embodiment to cut the ceramic plate.

[0070] In addition, the cutting device further comprises a controller, and the controller is used to execute instructions to implement the ceramic plate cutting method described in any one of the above embodiments.

[0071] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative, for example, the flowcharts and block diagrams in the accompanying drawings show the possible implementation architectures, functions and operations of the devices, methods and computer program products according to the various embodiments of the present invention.

[0072] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0073] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A method for cutting a ceramic plate, characterized in that: include: Obtaining the actual contour shape and the preset contour shape of the ceramic plate to be cut; Comparing the actual contour morphology with the preset contour morphology; Dividing the actual contour into a plurality of cutting areas according to the preset contour; Cutting a plurality of the cutting areas in sequence until the actual contour conforms to the standard of the preset contour; The cutting depth at any one time is no more than one third of the thickness of the ceramic plate until the ceramic plate is cut through.

2. The cutting method according to claim 1, characterized in that: The step of sequentially cutting a plurality of the cutting areas comprises: Dividing the outer circle of the ceramic plate into a plurality of cutting areas along the edge position of the actual contour shape; The plurality of cutting areas are cut in sequence until the actual contour conforms to the standard of the preset contour, and the cutting direction of the ceramic plate is parallel to the edge position of the preset contour.

3. The cutting method according to claim 2, characterized in that: From the edge position of the actual contour to the preset contour, a first circle of cutting is performed around the outer circle of the ceramic plate, and an nth circle of cutting is performed by moving a preset distance toward the inner side of the ceramic plate.

4. The cutting method according to claim 3, characterized in that: The four edges of the ceramic plate include a first edge, a second edge, a third edge and a fourth edge. Cutting is performed in sequence along the first edge, the second edge, the third edge and the fourth edge, and the four edges are cut in a cycle for several circles until the actual contour meets the standard of the preset contour.

5. The cutting method according to claim 1, characterized in that: Opening a second opening for the actual contour shape according to the first opening of the preset contour shape; The size of the first opening is obtained by cutting around the edge of the second opening.

6. The cutting method according to claim 5, characterized in that: The opening area of ​​the first opening is Q1, and the opening area of ​​the second opening is Q2, satisfying: Q2<Q1.

7. The cutting method according to any one of claims 1 to 6, characterized in that: The depth of the cutting groove of the ceramic plate at any time is H, and the thickness of the ceramic plate is D, which satisfies: 3H=D.

8. The cutting method according to any one of claims 1 to 6, characterized in that: Before any cutting through the ceramic plate, the width of the nth cutting is L1, and the width of the n+1th cutting is L2, satisfying: L1<L2.

9. The cutting method according to any one of claims 1 to 6, characterized in that: The ceramic plate is cut by a saw blade, and the cutting speed of the saw blade is 6000 RPM.

10. A cutting device, characterized in that: The cutting device comprises a cutting machine and a saw blade, wherein the saw blade is mounted on the cutting machine. The cutting device uses the cutting method described in any one of claims 1 to 9 to cut the ceramic plate.

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