3D printing process fault monitoring method, system, medium and equipment

Abstract

The invention discloses a 3D printing process fault monitoring method and system, a medium and equipment, and relates to the technical field of 3D printing, and the method comprises the steps: building a lower computer based on a data collection module and a data processing module, obtaining parameter information in a 3D printing process through the data collection module, transmitting the parameter information to an upper computer built based on LabVIEW software through a data processing module; the upper computer compares the obtained parameter information with a preset threshold value, and whether the printing equipment breaks down or not is judged; when the acquired parameter information does not exceed the preset threshold value, the parameter information is sent to a display module for data display; otherwise, an alarm module is triggered to give a fault alarm, the fault type of the printing equipment is judged, and abnormal data are displayed. According to the invention, through real-time monitoring and analysis of the equipment and the equipment operation environment, effective management and control of equipment monitoring and fault diagnosis are carried out according to the equipment and environment conditions, so that the efficiency of the 3D printing equipment is improved.

Description

Technical Field

[0001] The present invention relates to the field of 3D printing technology, and in particular to a 3D printing process fault monitoring method, system, medium and equipment. Background Art

[0002] The prototype of 3D printing system is inkjet printer. Since the introduction of optical technology in the field of rapid prototyping in the 1980s, the door to 3D printing has been opened. As an emerging technology in the field of rapid prototyping, 3D printing is a technology with great potential and is developing rapidly. After decades of development, 3D printing technology has gradually been integrated into national production and life.

[0003] As an application of emerging technology, 3D printing systems may malfunction due to various reasons during operation. If the faults are not discovered and handled in time, the working efficiency of the 3D printing equipment will be directly affected. Summary of the invention

[0004] The present invention provides a 3D printing process fault monitoring method, system, medium and device to solve the above-mentioned problem existing in the prior art, that is, the problem of low working efficiency of 3D printing equipment in the prior art. The present invention provides a 3D printing process fault monitoring method, the method comprising: A lower computer is built based on a data acquisition module and a data processing module, parameter information in the 3D printing process is obtained through the data acquisition module, and the parameter information is transmitted to a host computer built using LabVIEW through the data processing module; wherein the parameter information includes temperature, humidity, voltage, and current information; When the host computer receives the parameter information, it compares the obtained parameter information with the preset threshold to determine whether the printing device has a fault. When the obtained parameter information does not exceed the preset threshold, the parameter information is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing process; when the host computer does not receive the parameter information, it waits until the parameter information is received, and then determines whether the printing device has a fault.

[0005] Optionally, the acquiring parameter information in the 3D printing process through the data acquisition module specifically includes: The temperature and humidity information is obtained through the temperature and humidity sensor, the pressure information is obtained through the pressure sensor, the voltage and current information is obtained through the voltage and current metering module, and the oxygen content information is obtained through the oxygen sensor.

[0006] Optionally, the transmitting of the parameter information to a host computer built using LabVIEW through the data processing module specifically includes: STM32F103RCT6 is used as the main control chip of the data processing module, which is electrically connected to the Bluetooth module HC-05 to transmit the parameter information to the host computer built using LabVIEW.

[0007] Also includes: The acquired parameter information is recorded and stored through the host computer.

[0008] The present invention provides a 3D printing process fault monitoring system, comprising: The upper computer and the lower computer; the upper computer includes a data display and recording module and a fault detection module; the lower computer includes a data acquisition module and a data processing module; Data acquisition module, used to obtain parameter information during 3D printing; The data processing module is used to display the parameter information through the serial port screen after analog-to-digital conversion, and send the parameter information to the host computer through the data Bluetooth module; The data display and recording module is used to display the received parameter information and waveform, and record the historical data; The fault detection module is used to compare the value of the acquired parameter information with the preset threshold to determine whether the printing device has a fault. When the value of the parameter information does not exceed the preset threshold, it is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing device.

[0009] The present invention provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned 3D printing process fault monitoring method is implemented.

[0010] The present invention provides a computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the above-mentioned 3D printing process fault monitoring method when executing the program.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides a 3D printing process fault monitoring method, which obtains the operating conditions and operating environment during the 3D printing process for real-time monitoring, thereby determining the operating environment of the equipment, and then compares the obtained parameter information with the preset threshold value, and promptly determines whether the equipment has a fault. If a fault occurs, an alarm is issued and the type of fault is determined. The equipment and the equipment operating environment are timely monitored and analyzed, and effective management and control of equipment monitoring and fault diagnosis are performed according to the current specific conditions of the equipment and environment, and the operating status of the 3D printing equipment is accurately obtained, thereby improving the working efficiency of the 3D printing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0013] Figure 1 A flowchart of a 3D printing process fault monitoring method provided by an embodiment of the present invention; Figure 2 The overall architecture diagram of the host computer provided by the embodiment of the present invention; Figure 3 A host computer fault detection flow chart of a 3D printing process fault monitoring method provided by an embodiment of the present invention; Figure 4 A schematic diagram of a computer device for a 3D printing process fault monitoring method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0016] Figure 1 is a flow chart of a 3D printing process fault monitoring method provided by an embodiment of the present invention, such as Figure 1 As shown, this embodiment shows a 3D printing process fault monitoring method, including: S1: Build a lower computer based on the data acquisition module and the data processing module, obtain parameter information in the 3D printing process through the data acquisition module, and transmit the parameter information to the upper computer built using LabVIEW through the data processing module; wherein the parameter information includes temperature, humidity, voltage and current information.

[0017] Optionally, temperature and humidity information is obtained through a temperature and humidity sensor, pressure information is obtained through a pressure sensor, voltage and current information is obtained through a voltage and current metering module, and oxygen content information is obtained through an oxygen sensor.

[0018] Exemplarily, the selected temperature and humidity sensor model may be SHT31, the pressure sensor model may be BMP280, the oxygen sensor model may be JXM-O2, and the voltage and current sensor model may be IM1253B, so as to accurately obtain the above parameter information.

[0019] Among them, the humidity measurement range can be selected as 0 to 100% RH, the absolute deviation of humidity measurement accuracy is <= 2%, and the temperature measurement range can be selected as -40 to 125°C, and the absolute deviation of temperature measurement accuracy is <= 0.3°C.

[0020] S2: When the host computer receives the parameter information, it compares the obtained parameter information with the preset threshold to determine whether the printing device has a fault. When the obtained parameter information does not exceed the preset threshold, the parameter information is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing process; when the host computer does not receive the parameter information, it waits until the parameter information is received, and then determines whether the printing device has a fault.

[0021] Optionally, STM32F103RCT6 is used as the main control chip MCU to complete the data of parameter information obtained by each sensor, process it and transmit it to the host computer.

[0022] For example, when analyzing and processing the temperature, if there is a temperature difference between the working end and the free end of the temperature parameter, a thermoelectric potential is generated in the circuit. The voltage change is transmitted to the main control chip MCU through circuit transformation, and finally converted into a signal that can be recognized by the machine. The main control chip then transmits the temperature information to the host computer for subsequent processing.

[0023] Optionally, the HC-05 Bluetooth module is used to send the acquired parameter information to the host computer.

[0024] The host computer is built by LabVIEW, such as Figure 2 As shown, the main architecture of the host computer is a state machine, including six states: initialization Init, waiting Wait, sending data SendData, getting data GetData, data processing Deal, and exit Exit.

[0025] The Init state is mainly responsible for initializing the controls used by the host computer, configuring the initial state and initial value of each control to ensure the normal use of each control, so that the host computer system can operate normally.

[0026] The Wait state is mainly responsible for dealing with "emergency" situations that may change the system state due to human operations during system operation, such as opening the communication module, sending information, exiting the system, etc.

[0027] The SendData state is mainly responsible for sending information to the lower computer. This state can be used to control the lower computer system and optimize the communication strategy.

[0028] The GetData state is mainly responsible for obtaining the information sent by the lower computer, and it does not make any modifications to the data.

[0029] The Deal state is mainly responsible for processing the received data, such as splitting and intercepting strings, forcing strings to be converted into numbers, performing various operations on the data, drawing waveform charts, etc.

[0030] The Exit state is mainly responsible for exiting the system and releasing the resources used by the system.

[0031] After the system starts, it first goes to the Init state to perform initialization settings, then enters the Wait state, waiting for a button to be pressed. If the exit button is pressed, it enters the Exit state, exits the system and releases resources. If the serial port opening button is pressed, it enters the SendData state to send data, then goes to the GetData state to obtain data, goes to the Deal state to process data, and finally returns to the Wait state, waiting for a button to be pressed. If no button is pressed, the above process continues to repeat. If the serial port closing button is pressed, the above process is terminated and stays in the Wait state, waiting for a button to be pressed.

[0032] like Figure 3 As shown, first perform initialization settings, then determine whether the fault detection module receives data. If the fault detection module does not receive data, it waits until the fault detection module receives data. If the fault detection module receives data, it determines whether the data is normal data. If the data is normal data, the waveform icon control and the digital display control display the data and the Express table control records the data. If the data is abnormal data, the indicator light turns on to alarm, and then determine the cause of the error, and then the waveform icon control and the digital display control display the abnormal data and the Express table control records the abnormal data, and repeat the above process.

[0033] For example, the real environmental parameters and the electrical parameters of the 3D printer operation process simulated by using a cement resistor with a resistance of 20Ω and a power of 10W are collected and sent to the LabVIEW host computer for display through the Bluetooth module HC-05. The over-limit alarm module is set to the temperature alarm range: 5-35℃; humidity alarm range: 30-90%; air pressure alarm range: 75-106kPa; oxygen content alarm range: 0-30%; voltage alarm range: 0-36V; current alarm range: 0-30A.

[0034] After testing, the LabVIEW interface displayed a temperature of 27.8°C, a humidity of 46.5%, a voltage of 4.88V, a current of 0.25A, a pressure of 96.4kPa, and an oxygen content of 20.7%. The actual data were a temperature of 27.9°C, a humidity of 45.5%, a voltage of 5V, a current of 0.25A, a pressure of 97.2kPa, and an oxygen content of 20.9%. The data measured by the system was not much different from the actual data, the waveform display module operated normally, the over-limit alarm module was not triggered, and the over-limit alarm function worked normally.

[0035] In this embodiment, 5 groups of temperature, humidity, pressure, oxygen content, voltage and current data are collected, and the real data of temperature, humidity, pressure, oxygen content, voltage and current are measured and shown in Table 1.

[0036] Table 1 Comparison between measured data and real data:

[0037] Comparative analysis shows that the maximum absolute error of temperature data is 0.2℃, the maximum absolute error of humidity data is 0.3%, the maximum absolute error of pressure data is 0.3kPa, the maximum absolute error of oxygen content data is 0.4%, the maximum absolute error of voltage data is 0.4V, and the maximum absolute error of current data is 0.02A. The acquisition errors are all within the standard error range.

[0038] The above is a 3D printing process fault monitoring method provided by one or more embodiments of this specification. Based on the same idea, this specification also provides a corresponding 3D printing process fault monitoring system, including: The upper computer and the lower computer; the upper computer includes a data display and recording module and a fault detection module; the lower computer includes a data acquisition module and a data processing module; Data acquisition module, used to obtain parameter information during 3D printing; The data processing module is used to display the parameter information through the serial port screen after analog-to-digital conversion, and send the parameter information to the host computer through the data Bluetooth module; The data display and recording module is used to display the received parameter information and waveform, and record the historical data; The fault detection module is used to compare the value of the acquired parameter information with the preset threshold to determine whether the printing device has a fault. When the value of the parameter information does not exceed the preset threshold, it is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing device.

[0039] For the specific definition of a 3D printing process fault monitoring system, please refer to the definition of a 3D printing process fault monitoring method above, which will not be repeated here. Each module in the above-mentioned 3D printing process fault monitoring system can be implemented in whole or in part through software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0040] The present invention also provides a computer-readable storage medium, which stores a computer program. The computer program can be used to execute the above-mentioned 3D printing process fault monitoring method.

[0041] The present invention also provides Figure 4 The structural diagram of the computer device shown in FIG. Figure 4 As shown, at the hardware level, the computer device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory, and may also include hardware required for other services. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it to implement a 3D printing process fault monitoring method provided in the above embodiment.

[0042] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present invention.

Claims

1. A 3D printing process fault monitoring method, characterized in that: include: A lower computer is built based on a data acquisition module and a data processing module, parameter information in the 3D printing process is obtained through the data acquisition module, and the parameter information is transmitted to a host computer built using LabVIEW through the data processing module; wherein the parameter information includes temperature, humidity, voltage, and current information; When the host computer receives the parameter information, it compares the obtained parameter information with the preset threshold to determine whether the printing device has a fault. When the obtained parameter information does not exceed the preset threshold, the parameter information is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing process; when the host computer does not receive the parameter information, it waits until the parameter information is received, and then determines whether the printing device has a fault.

2. The 3D printing process fault monitoring method according to claim 1, characterized in that: The parameter information of the 3D printing process is obtained by the data acquisition module, specifically including: The temperature and humidity information is obtained through the temperature and humidity sensor, the pressure information is obtained through the pressure sensor, the voltage and current information is obtained through the voltage and current metering module, and the oxygen content information is obtained through the oxygen sensor.

3. The 3D printing process fault monitoring method according to claim 1, characterized in that: The parameter information is transmitted to the host computer built by LabVIEW through the data processing module, specifically including: STM32F103RCT6 is used as the main control chip of the data processing module, which is electrically connected to the Bluetooth module HC-05 to transmit the parameter information to the host computer built using LabVIEW.

4. The 3D printing process fault monitoring method according to claim 1, characterized in that: The method further comprises: The acquired parameter information is recorded and stored through the host computer.

5. A 3D printing process fault monitoring system, characterized in that: include: The upper computer and the lower computer; the upper computer includes a data display and recording module and a fault detection module; the lower computer includes a data acquisition module and a data processing module; Data acquisition module, used to obtain parameter information during 3D printing; The data processing module is used to display the parameter information through the serial port screen after analog-to-digital conversion, and send the parameter information to the host computer through the data Bluetooth module; The data display and recording module is used to display the received parameter information and waveform, and record the historical data; The fault detection module is used to compare the value of the acquired parameter information with the preset threshold to determine whether the printing device has a fault. When the value of the parameter information does not exceed the preset threshold, it is sent to the display module for data display; otherwise, the alarm module is triggered to issue a fault alarm and determine the type of fault in the printing device.

6. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the 3D printing process fault monitoring method according to any one of claims 1 to 4 is implemented.

7. A computer device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method for monitoring faults in a 3D printing process described in any one of claims 1 to 4 is implemented.

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