Template printing machine

Abstract

The template printing machine comprises a template supporting piece and a clamping assembly, the template supporting piece can move relative to a template, the template supporting piece comprises a support and an adsorption part, the support is movably connected with the adsorption part, and the adsorption part can apply adsorption force to the template; the clamping assembly can clamp or release the adsorption part, when the clamping assembly clamps the adsorption part, the support can move by a preset distance in the direction away from the adsorption part relative to the adsorption part, and the adsorption part can be kept at the original position relative to the template. According to the template printing machine, the phenomenon that residual solder paste on the template drips due to shaking of the template when the machining element leaves the template can be avoided.

Description

Technical Field

[0001] The present disclosure relates to a stencil printer, in particular to a solder paste stencil printer for a printed circuit board. Background Art

[0002] In a typical surface mount circuit board production process, a stencil printer is used to print solder paste onto a printed circuit board. A circuit board, also broadly referred to as an electronic substrate, has a pattern of pads or some other conductive surface on which solder paste can be deposited, and the circuit board is fed into a stencil printer. Some small holes or marks on the circuit board, called fiducials, are used to align the circuit board with the stencil or screen of the stencil printer before printing solder paste onto the circuit board. The fiducials are used as reference points when aligning the circuit board and the stencil. Once the circuit board is aligned with the stencil of the printer, the circuit board is raised to the stencil and fixed relative to the stencil by a circuit board support, such as a platform with pins or other object supports. The solder paste is then dispensed by moving a scraper or scraper across the stencil so that the solder paste passes through the holes in the stencil and reaches the circuit board. As the scraper moves across the stencil, the solder paste rolls in front of the blade, which promotes the desired mixing and shearing of the solder paste to obtain the desired viscosity to help fill the holes in the stencil or stencil. The solder paste is usually dispensed onto the stencil from a standard solder paste supply barrel. At the end of the printing operation, the circuit board is released, lowered and cleared from the stencil and transported to another location within the PCB production line.

[0003] The pattern on the circuit board matches the pattern formed by the mesh holes on the template, so that the solder paste can be printed from the mesh holes to the desired positions on the circuit board, and the solder paste is correctly printed on the circuit board. Summary of the invention

[0004] The present application provides a template printing machine, comprising: a template support and a clamping assembly, wherein the template support (can move relative to the template, the template support comprises a bracket and an adsorption portion, the bracket is movably connected to the adsorption portion, and the adsorption portion can apply an adsorption force to the template; the clamping assembly can clamp or release the adsorption portion, when the clamping assembly clamps the adsorption portion, the bracket can move a predetermined distance relative to the adsorption portion in a direction away from the adsorption portion, and the adsorption portion can maintain an original position relative to the template.

[0005] As described above, in the template printing machine, the template support has a first working position, a second working position and a release position. In the first working position and the second working position, the adsorption portion of the template support is close to the template, and in the release position, the template support is away from the template. During the process of the template support changing from the first working position to the second working position, the clamping assembly clamps the adsorption portion so that the bracket can move relative to the adsorption portion in a direction away from the adsorption portion. During the process of the template support changing from the second working position to the release position, the clamping assembly releases the adsorption portion, and the adsorption portion leaves the template.

[0006] As described above, the template printer further comprises an adsorption part moving assembly, wherein the adsorption part moving assembly is connected to the bracket and the adsorption part, and the adsorption part moving assembly is configured to be able to drive the adsorption part to move toward the bracket.

[0007] As described above, the template printer further comprises a control device and an execution device, wherein the execution device is capable of connecting or disconnecting the adsorption force of the adsorption portion; and the control device is capable of sending a control signal to the execution device to connect or disconnect the adsorption force of the adsorption portion.

[0008] In the template printing machine as described above, the control device is configured as follows: when the template support is in the first working position and the second working position, the control device controls the actuator to connect the adsorption force of the adsorption part; when the template support leaves the first working position and the second working position, the control device controls the actuator to disconnect the adsorption force of the adsorption part.

[0009] As described above, the template printer further comprises a vacuum pumping device, wherein the vacuum pumping device is connected to the adsorption portion via the execution device, and the vacuum pumping device can provide adsorption force to the adsorption portion.

[0010] In the template printer as described above, when the template support is in the first working position, the processing element is in contact with the template, and when the template support is in the second working position, the processing element is separated from the template.

[0011] As described above, the template printer further comprises a workbench moving assembly, wherein the workbench moving assembly can be connected to the bracket, and the workbench moving assembly can move to drive the template support to move closer to or away from the template.

[0012] In the template printer as described above, the clamping assembly includes a cylinder or a motor.

[0013] In the template printer as described above, the adsorption portion moving component includes a cylinder or a motor.

[0014] In the template printer as described above, the predetermined distance is greater than 1 mm.

[0015] In the template printer as described above, during the process in which the template support member changes from the second working position to the release position, the adsorption portion moving assembly can drive the adsorption portion to move toward the bracket.

[0016] The present application also provides a control method for a stencil printer, the stencil printer comprising a stencil support and a printing device, characterized in that it comprises the following steps:

[0017] a. moving the formwork support and the processing element so that the formwork support and the processing element are in contact with the formwork;

[0018] b. The printing device printing processing element;

[0019] c. moving the processing element away from the template, wherein the template support member remains in contact with the template during the process of moving the processing element away from the template;

[0020] d. Move the formwork support away from the formwork.

[0021] In the control method of the template printer as described above, in the step b and the step c, the template support member applies an adsorption force to the template.

[0022] In the control method of the template printer as described above, after the step c is completed, the template support member disconnects the adsorption force on the template and the step d is executed.

[0023] The solder paste printer in the present application is used for printing processing components, such as circuit boards. The template printer in the present application has a template support and a clamping assembly. The template support has an adsorption portion, which can adsorb the template to prevent the template from moving or vibrating. The clamping assembly can clamp and release the adsorption portion of the template support, so that when the processing component has just been printed and moved away from the template, the clamping assembly can clamp the adsorption portion so that the adsorption portion continues to adsorb the template, thereby preventing residual solder paste on the template from dripping onto the processing component due to the movement of the template. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of a stencil printer in the present application;

[0025] Figure 2A is a three-dimensional diagram of the conveying and supporting device of the stencil printing machine in the present application;

[0026] Figure 2B yes Figure 2AExploded view of the conveying and supporting device of the stencil printer;

[0027] Figure 3A yes Figure 2A A three-dimensional view of a formwork support member;

[0028] Figure 3B yes Figure 3A Exploded view of the middle formwork support;

[0029] Figure 4 yes Figure 2A Schematic diagram of the conveying and supporting device of the stencil printing machine;

[0030] Figure 5A It is a schematic diagram of the conveying and supporting device when the moving assembly of the workbench is in the initial state;

[0031] Figure 5B is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the template support is in contact with the circuit board;

[0032] Figure 5C is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the circuit board is flush with the template support;

[0033] Figure 5D It is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the circuit board contacts the template;

[0034] Figure 5E It is a schematic diagram of the conveying and supporting device when the clamping assembly clamps the adsorption part and the circuit board contacts the template;

[0035] Fig. 5F It is a schematic diagram of the conveying and supporting device when the clamping assembly clamps the adsorption part and the circuit board leaves the template;

[0036] Figure 5G is a schematic diagram of the conveying and supporting device after the clamping assembly releases the adsorption portion;

[0037] Figure 6 It is a flow chart of an embodiment of a control method of a stencil printer in the present application. DETAILED DESCRIPTION

[0038] Various specific embodiments of the present application will be described below with reference to the accompanying drawings that form a part of this specification. It should be understood that although terms indicating directions, such as "front", "rear", "upper", "lower", "left", "right", "top", "bottom", etc., are used in this application to describe the orientation of various example structural parts and elements of the present application, these terms are used here only for the purpose of convenience of description and are determined based on the example orientations shown in the accompanying drawings. Since the embodiments disclosed in the present application can be set in different directions, these terms indicating directions are only for illustration and should not be regarded as limitations. Where possible, the same or similar figure numbers used in this application refer to the same parts.

[0039] Figure 1 is a schematic diagram of a template printer in this application, such as Figure 1 As shown, the template printer includes a frame 101, a printing device 102, and a template 103. The template 103 is provided with mesh holes. The template 103 is connected to the frame 101. A conveying and supporting device 200 ( Figure 1 The conveying and supporting device 200 can convey and fix the processing element (such as a circuit board) to the corresponding position below the template 103. A printing device 102 is provided above the template, and the printing device 102 can apply and coat the solder paste to the template 103, and the solder paste is printed onto the surface of the processing element through the mesh on the template 103.

[0040] Figure 2A is a three-dimensional diagram of the conveying and supporting device of the template printing machine in this application, Figure 2B yes Figure 2A Exploded view of the conveying and supporting device of the stencil printing machine. Figure 2A and Figure 2B As shown, the conveying and supporting device has a height direction H, a length direction L and a width direction W. The conveying and supporting device includes a pair of rail components 212 and 213 , a pair of template supports 202 and 203 , a circuit board support 201 and a workbench moving component 208 . Figure 2A and Figure 2BA circuit board 210 is also schematically shown. A pair of rail assemblies 212 and 213 and a pair of template supports 202 and 203 extend along the length direction of the conveying and supporting device. The rail assemblies 212 and 213 can convey the circuit board 210 along the length direction L. The pair of rail assemblies 212 and 213 are arranged along the width direction W of the conveying and supporting device, and a spacing is provided between the two. The circuit board support 201 is arranged between the pair of rail assemblies 212 and 213 for supporting the circuit board 210. The pair of template supports 202 and 203 are respectively arranged on the outer sides of the pair of rail assemblies 212 and 213 for supporting the template 103. The workbench moving assembly 208 is arranged below the rail assemblies 212 and 213 and the circuit board support 201. The workbench moving assembly includes a platform portion 231 and a power portion 232, and the power portion 232 can push the platform portion 231 to move in a direction toward or away from the template 103. The template supports 202 and 203 and the circuit board support 201 can be connected to the platform portion 231 , so that the template supports 202 and 203 and the circuit board support 201 can move following the platform portion 231 .

[0041] In the present application, the track components 212 and 213 have similar structures, and the template support members 202 and 203 have similar structures. The structure of the template support member is described below by taking the template support member 202 as an example.

[0042] Figure 3A yes Figure 2A A three-dimensional image of a formwork support. Figure 3B yes Figure 3A Exploded view of the formwork support. Figure 3A and Figure 3B Shows Figure 2A The structure of the middle template support member 203. Figure 3A and Figure 3B As shown, the template support 202 includes a bracket 305, a suction portion 306, a suction portion moving assembly 314, and a clamping assembly 330. The suction portion 306 is slidably connected to the bracket 305, so that the suction portion 306 can move relative to the bracket 305 along the height direction H of the conveying and supporting device of the template printer. The clamping assembly 330 includes a first part 317 and a second part 318, and the first part 317 and the second part 318 are respectively arranged below the two ends of the suction portion 306 in the length direction, and can support and release the suction portion 306. The suction portion moving assembly 314 is installed on the bracket 305 and connected to the suction portion 306, and the suction portion moving assembly 314 can apply a pulling force to the suction portion 306.

[0043] The adsorption part 306 has a cavity 362, and the cavity 362 is connected to the vacuum device 450. The top surface of the adsorption part 306 has a plurality of holes 361, and the plurality of holes 361 are connected to the cavity 362. The vacuum device 450 can reduce the pressure inside the cavity 362, so that the top surface of the adsorption part 306 has an adsorption force, and can adsorb the template.

[0044] In one embodiment of the present application, the suction moving assembly 314 and the first part 317 and the second part 318 of the clamping assembly 330 are cylinders. In another embodiment of the present application, one or more of the suction moving assembly 314 and the first part 317 and the second part 318 of the clamping assembly 330 are motors.

[0045] Figure 4 yes Figure 2A Schematic diagram of the conveying and supporting device of the stencil printing machine. Figure 4 yes Figure 2A Schematic diagram of the conveying and supporting device of the template printing machine viewed along the length direction. Figure 2A and Figure 4 As shown, there is a certain interval between the track components 212 and 213, and the interval matches the width of the processing element to be transported, and the two ends of the processing element can be supported and transported by the track components 212 and 213. Along the width direction of the conveying and supporting device, the circuit board support 201 is arranged between the track components 212 and 213. The bottom 411 of the circuit board support 201 is connected to the workbench moving component 208, and the top 412 is used to support the circuit board. The top 412 of the circuit board support 201 has a cavity 426, and the surface of the top 412 has a plurality of holes 425, and the plurality of holes 425 are connected to the cavity 426. The cavity 426 is connected to the vacuum device 450 through the second actuator 403. The vacuum device 450 can reduce the air pressure of the cavity 426, so that the surface of the top 412 of the circuit board support 201 has an adsorption force, and can adsorb the circuit board. That is, the top 412 of the circuit board support 201 has a circuit board adsorption portion.

[0046] The template support 202 is arranged outside the track assembly 212 and is slidably connected to the track assembly 212. A limit device (not shown in the figure) is provided between the template support 202 and the track assembly 212 to limit the distance that the template support 202 moves downward relative to the track assembly 212 along the height direction H of the conveying and supporting device, that is, the template support 202 can slide relative to the track assembly 212 along the height direction H of the conveying and supporting device within a certain range. The template support 202 has a bracket 305 adsorption portion 306. The bottom of the bracket 305 has a magnetic component that can be adsorbed on the top surface of the workbench moving assembly 208 or separated from the top surface of the workbench moving assembly 208.

[0047] Similarly, the template support 203 is arranged outside the track assembly 213 and is slidably connected to the track assembly 213. A limit device (not shown in the figure) is provided between the template support 203 and the track assembly 213 to limit the distance that the template support 203 moves downward relative to the track assembly 213 along the height direction H of the conveying and supporting device, that is, the template support 203 can slide relative to the track assembly 213 along the height direction H of the conveying and supporting device within a certain range. The template support 203 has a bracket 405 adsorption portion 406. The bottom of the bracket 405 has a magnetic component that can be adsorbed on the top surface of the workbench moving assembly 208 or separated from the top surface of the workbench moving assembly 208.

[0048] The adsorption part 306 and the adsorption part 406 are connected to the vacuum device 450 through the first actuator 402. The first actuator 402 is connected to the control device 401 and can receive a signal from the control device 401 to turn on or off the first actuator. When the first actuator 402 is turned on, the adsorption part 306 and the adsorption part 406 can generate an adsorption force to adsorb the template. When the first actuator 402 is turned off, the adsorption force of the adsorption part 306 and the adsorption part 406 is cut off, and the adsorption part 306 and the adsorption part 406 no longer generate an adsorption force.

[0049] Clamping assemblies 330 and 430 are respectively provided below the adsorption portion 306 and the adsorption portion 406 . The clamping assemblies 330 and 430 are connected to the control device 401 and can receive signals from the control device 401 to clamp or release the adsorption portion 306 .

[0050] The adsorption part moving components 314 and 414 are connected to the control device 401, and can receive a signal from the control device 401 to pull the adsorption parts 306 and 406. The adsorption part moving components 314 and 414 are used to overcome the friction between the adsorption parts 306 and 406 and the brackets 305 and 405, so that the adsorption parts 306 and 406 can be restored to the closest position relative to the brackets 305 and 405.

[0051] In one embodiment of the present application, the first actuator 402 and the second actuator 403 are solenoid valves.

[0052] Figure 5A It is a schematic diagram of the conveying and supporting device when the moving assembly of the workbench is in the initial state; Figure 5B is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the template support is in contact with the circuit board; Figure 5C is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the circuit board is flush with the template support; Figure 5DIt is a schematic diagram of the conveying and supporting device when the workbench moving assembly moves to the point where the circuit board contacts the template; Figure 5E It is a schematic diagram of the conveying and supporting device when the clamping assembly clamps the adsorption part and the circuit board contacts the template; Fig. 5F It is a schematic diagram of the conveying and supporting device when the clamping assembly clamps the adsorption part and the circuit board leaves the template; Figure 5G It is a schematic diagram of the conveying and supporting device after the clamping component releases the adsorption part. Figure 5A-5G The working process of the conveying and supporting device is shown.

[0053] like Figure 5A As shown, the circuit board 210 is transported by the rail assemblies 212 and 213 until it stops at a specific position below the template 103. At this time, the circuit board 210 is supported by the rail assemblies 212 and 213, and there is a gap between the circuit board 210 and the template 103, and it is aligned with a specific area of ​​the template 103. The workbench moving assembly 208 is at the farthest position relative to the template 103, that is, it is at the lowest position in the height direction of the conveying and supporting device. The circuit board support 201 is connected to the workbench moving assembly 208, and the circuit board support 201 is also at the farthest position relative to the template 103. The circuit board support 201 is located below the circuit board 210 and there is a gap between it and the circuit board 210. The template supports 202 and 203 are at the farthest position relative to the template 103. The template supports 202 and 203 are supported by the rail assemblies 212 and 213, and are separated from the workbench moving assembly 208, and there is a gap between them. The clamping assemblies 330 and 430 are in a released state, and there is a distance between the clamping assemblies 330 and 430 and the adsorption parts of the template support members 202 and 203. In one embodiment of the present application, in the initial state, there is a distance of 35-50 mm between the template support members 202 and 203 and the template 103.

[0054] like Figure 5B As shown, when the circuit board printing starts, the workbench moving assembly 208 moves upward along the height direction H (i.e., toward the template 103), so that the circuit board support 201 moves toward the template 103 along with the workbench moving assembly 208. The circuit board support 201 gradually approaches the circuit board 210 and can contact the circuit board 210. Figure 5B FIG. 2 shows the position of the circuit board support 201 when it moves to contact the circuit board 210. FIG. 5A to FIG. 5B During the movement, the workbench moving assembly 208 and the circuit board support 201 move together, the template supports 202 and 203 remain in place, and the distance between the template supports 203 and 203 and the workbench moving assembly 208 gradually decreases. The clamping assemblies 330 and 430 remain in the released state.

[0055] like Figure 5C As shown, the workbench moving assembly 208 drives the circuit board support 201 to continue to move toward the template 103, and the circuit board support 201 drives the circuit board 210 to leave the track assemblies 212 and 213 and move toward the template 103. When the circuit board 210 is flush with the top of the template supports 202 and 203, the bottom of the template supports 202 and 203 contacts the workbench moving assembly 208. The bottom of the template supports 202 and 203 has a magnetic element that can be adsorbed to the surface of the workbench moving assembly 208, so that the workbench moving assembly 208 is connected to the template supports 202 and 203. The clamping assemblies 330 and 430 remain in the released state.

[0056] like Figure 5D As shown, the workbench moving assembly 208 continues to move toward the template 103, and the workbench moving assembly 208 drives the circuit board support 201 and the template supports 202 and 203 to continue to move toward the template 103, until the circuit board 210 and the top of the template supports 202 and 203 contact the template 103, and the template supports 202 and 203 reach the first working position. When the template supports 202 and 203 move to the first working position, the control device 401 controls the first actuator 402 and the second actuator 403 to open, so that the circuit board support 201 generates an adsorption force to adsorb the circuit board 210, and the template supports 202 and 203 generate an adsorption force to adsorb the template 103. Figure 5D In the position shown, the first actuator 402 and the second actuator 403 remain in the open state, and the printing device 102 performs printing. Since the circuit board 210 and the template 103 are both subjected to the adsorption force, during the printing process, the circuit board 210 and the template 103 can remain relatively stable and are not prone to shaking or shifting, which is conducive to ensuring the quality of printing.

[0057] like Figure 5E As shown, when the printing device 102 is in the printing process, or after printing is completed, the clamping assemblies 330 and 430 clamp and lock the adsorption portions 306 and 406 of the template supports 202 and 203, so that the adsorption portions 306 and 406 remain in the first working position in contact with the template 103 and cannot move along the height direction H.

[0058] like Fig. 5FAs shown, after the printing device 102 completes printing, the control device 401 controls the workbench moving assembly 208 to move downward, that is, in a direction away from the template 103. The circuit board support 201 moves downward following the workbench moving assembly 208, so that the circuit board 210 leaves the template 103. The brackets 305 and 405 of the template supports 202 and 203 have a magnetic effect with the workbench moving assembly 208 and can attract each other, so that the brackets 305 and 405 move downward following the workbench moving assembly 208. The adsorption parts 306 and 406 of the template supports 202 and 203 are clamped by the clamping assemblies 330 and 430 and cannot move downward following the workbench moving assembly 208, so that relative sliding occurs between the adsorption parts 306 and 406 and the brackets 305 and 405, and the template supports 202 and 203 reach the second working position.

[0059] During the process of the template supports 202 and 203 moving from the first working position to the second working position, the circuit board support 201 moves downward following the workbench moving assembly 208, the second actuator 403 remains open, and the circuit board 210 is adsorbed by the circuit board support 201 and follows the circuit board support 201 to leave the template 103. During the process of the circuit board 210 leaving the template 103, there is a certain degree of stickiness between the circuit board 210 and the template 103, and the movement of the circuit board 210 will drive the template 103 to have a downward movement trend. In practical applications, it is expected that when the circuit board 210 leaves, the template 103 remains stable to prevent the residual solder paste on the template 103 from dripping onto the printed circuit board 210. During the process of the template supports 202 and 203 in the present application moving from the first working position to the second working position, the adsorption parts 306 and 406 of the first actuator 402 remain open, and the adsorption parts 306 and 406 maintain the adsorption force on the template 103, so that the template 103 can remain stable and not prone to shaking or shifting, thereby avoiding the influence of residual solder paste on the template 103 on the printed circuit board 210.

[0060] In one embodiment of the present application, during the movement of the template support members 202 and 203 from the first working position to the second working position, the brackets 305 and 405 move a predetermined distance relative to the adsorption parts 306 and 406, and the predetermined distance is 1 mm-3 mm, that is, the circuit board 210 moves 1 mm-3 mm. The predetermined distance is sensed by a position sensor or a motor of the workbench moving assembly 208.

[0061] like Figure 5GAs shown, when the circuit board 210 leaves the template 103, the control device 401 sends a control signal to the clamping components 330 and 430, so that the clamping components 330 and 430 release the adsorption parts 306 and 406. The control device 401 sends a control signal to the moving components 314 and 414, and the moving components 314 and 414 pull the adsorption parts 306 and 406 toward the brackets 305 and 405, so that the adsorption parts 306 and 406 leave the template 103, so that the template supports 202 and 203 reach the release position.

[0062] When the formwork support members 202 and 203 reach the Figure 5G After the release position is shown, the workbench moving assembly 208 drives the template support members 202 and 203 and the circuit board support member 201 to continue to move downward until the template support members 202 and 203 are in the release position shown in FIG. Figure 5C In the position shown, the template supports 202 and 203 are restricted by the track components 212 and 213 and cannot move further downward. The workbench moving component 208 continues to move downward, overcoming the magnetic force between the workbench moving component 208 and the template supports 202 and 203, thereby separating from the template supports 202 and 203. The workbench moving component 208 continues to drive the circuit board support 201 to move downward, reaching Figure 5B In the position shown, the circuit board 210 contacts the rail components 212 and 213. Then, the workbench moving component 208 continues to move downward, and the circuit board support 201 leaves the circuit board 210. The circuit board 210 is supported by the rail components 212 and 213, and a gap is generated between the circuit board support 201 and the circuit board 210. Figure 5A The position shown, the conveying and supporting device returns to the initial state. At this time, the printed circuit board 210 is transported to the next position by the track components 212 and 213, and another circuit board that has not been processed reaches the bottom of the template 103, ready for printing.

[0063] In the existing design, the circuit board 210 and the template supports 202 and 203 leave the template 103 at the same time. When the circuit board 210 just leaves the template 103, the template 103 may move or shake slightly, and the residual solder paste on the template 103 may drip onto the circuit board 210, affecting the processing accuracy of the circuit board 210. In the present application, the adsorption parts 306 and 406 of the template supports 202 and 203 can be clamped by the clamping components 330 and 430, so as to move relative to the brackets 305 and 405. In the process of the circuit board 210 leaving the template 103, the adsorption parts 306 and 406 can maintain contact with the template 103 and continue to apply adsorption force, thereby preventing the template from moving or shaking when the circuit board 210 leaves the template 103. That is to say, in the present application, the time when the adsorption parts 306 and 406 of the template supports 202 and 203 leave the template 103 is different from the time when the circuit board 210 leaves the template 103. When the circuit board 210 just leaves the template 103, the adsorption parts 306 and 406 have not left the template 103. The adsorption parts 306 and 406 can continue to adsorb the template 103 for a period of time to keep the template 103 relatively stable.

[0064] Figure 6 FIG. 1 is a flow chart of an embodiment of a control method of a template printer in the present application. Figure 6 As shown, at step 601, the control method of the stencil printer starts to be executed. Before the method starts, the processing element (such as the circuit board 210) and the stencil supports 202 and 203 are all at the farthest position relative to the stencil 103.

[0065] In step 602 , the workbench moving assembly 208 drives the template supports 202 and 203 and the processing element to move toward the template 103 until the template supports 202 and 203 and the processing element are in contact with one side of the template 103 and the printing device 102 is located on the other side of the template 103 .

[0066] In step 603, the control device 401 controls the first actuator 402 to open, so that the template supports 202 and 203 can apply suction force to the template 103. At the same time, when executing step 603, the control device 401 controls the second actuator 403 to open, and the circuit board support 201 applies suction force to the processing element.

[0067] In step 604, the template supports 202 and 203 absorb the template 103, so that the template remains relatively stable. The circuit board support 201 absorbs the processing element, so that the processing element remains relatively stable. The printing device 102 prints the processing element.

[0068] In step 605, the workbench moving assembly 208 drives the circuit board support 201 to move, so that the processing element leaves the template 103. The adsorption parts 306 and 406 of the template supports 202 and 203 are clamped by the clamping assemblies 330 and 340, so that the adsorption parts 306 and 406 keep in contact with the template 103. In step 604, the first execution device 402 remains open, and the adsorption parts 306 and 406 of the template supports 202 and 203 continue to adsorb the template.

[0069] In step 606 , the control device 401 controls the first execution device 402 to be turned off, so that the adsorption force of the template supports 202 and 203 on the template 103 is disconnected.

[0070] In step 607, the template supports 202 and 203 leave the template 103. The circuit board support 201 and the template supports 202 and 203 move to the initial position.

[0071] Next, the process goes from step 607 to step 608 to end the printing operation.

[0072] exist Figure 6 In the method shown, after printing is completed and the processing element just leaves the template 103, the template supports 202 and 203 remain in contact with the template and absorb the template 103, so that the template remains stable.

[0073] Although the present disclosure has been described in conjunction with the examples of the embodiments summarized above, various alternatives, modifications, variations, improvements and / or substantially equivalent solutions, whether known or currently or foreseeable in the near future, may be apparent to those of ordinary skill in the art. In addition, the technical effects and / or technical problems described in this specification are exemplary rather than restrictive; so the disclosure in this specification may be used to solve other technical problems and have other technical effects. Therefore, the examples of the embodiments of the present disclosure set out above are intended to be illustrative rather than restrictive. Various changes may be made without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is intended to include all known or earlier developed alternatives, modifications, variations, improvements and / or substantially equivalent solutions.

Claims

1. A template printing machine, characterized in that include: A template support (202, 203), wherein the template support (202, 203) is movable relative to the template, wherein the template support (202, 203) comprises a bracket (305, 405) and an adsorption portion (306, 406), wherein the bracket (305, 406) is movably connected to the adsorption portion (306, 406), and the adsorption portion (306, 406) is capable of applying an adsorption force to the template; A clamping assembly (330, 430), wherein the clamping assembly (330, 430) is capable of clamping or releasing the adsorption portion (306, 406); when the clamping assembly (330, 430) clamps the adsorption portion (306, 406), the bracket (305, 406) is capable of moving a predetermined distance relative to the adsorption portion (306, 406) in a direction away from the adsorption portion (306, 406), and the adsorption portion (306, 406) is capable of maintaining an original position relative to a template.

2. The stencil printer according to claim 1, characterized in that: The template support member (202, 203) has a first working position, a second working position and a release position. In the first working position and the second working position, the adsorption portion (306, 406) of the template support member (202, 203) is close to the template. In the release position, the template support member leaves the template. When the template support member (202, 203) changes from the first working position to the second working position, the clamping assembly (330, 430) clamps the adsorption portion (306, 406), so that the bracket (305, 405) can move relative to the adsorption portion (306, 406) in a direction away from the adsorption portion (306, 406); During the process of the template support (202, 203) changing from the second working position to the release position, the clamping assembly (330, 430) releases the adsorption portion (306, 406), and the adsorption portion (306, 406) leaves the template.

3. The stencil printer according to claim 1, wherein: The template printer also includes an adsorption part moving component (314, 414), which is connected to the bracket (305, 405) and the adsorption part (306, 406), and the adsorption part moving component (314, 414) is configured to drive the adsorption part (306, 406) to move toward the bracket (305, 405).

4. The stencil printer according to claim 2, wherein: The template printer also includes a control device (401) and an execution device (402), wherein the execution device (402) is capable of connecting or disconnecting the adsorption force of the adsorption portion (306, 406); and the control device (401) is capable of sending a control signal to the execution device (402) to connect or disconnect the adsorption force of the adsorption portion (306, 406).

5. The stencil printer according to claim 4, characterized in that: The control device (401) is configured as follows: when the formwork support (202, 203) is in the first working position and the second working position, the control device (401) controls the actuator (402) to connect the adsorption force of the adsorption part (306, 406); when the formwork support leaves the first working position and the second working position, the control device (401) controls the actuator (402) to disconnect the adsorption force of the adsorption part.

6. The stencil printer according to claim 5, characterized in that: The template printer further comprises a vacuum pumping device (450), wherein the vacuum pumping device (450) is connected to the adsorption portion (306, 406) via the execution device (402), and the vacuum pumping device (450) can provide adsorption force to the adsorption portion (306, 406).

7. The stencil printer according to claim 2, wherein: In the first working position of the template support (202, 203), the processing element is in contact with the template, and in the second working position of the template support (202, 203), the processing element is separated from the template.

8. The stencil printer according to claim 1, wherein: The template printer also includes a workbench moving component (208), which can be connected to the bracket (305, 405), and the workbench moving component (208) can move to drive the template support (202, 203) to move closer to or away from the template.

9. The stencil printer according to claim 1, wherein: The clamping assembly (330) includes a cylinder or a motor.

10. The stencil printer according to claim 3, wherein: The adsorption part moving component includes a cylinder or a motor.

11. The stencil printer according to claim 1, wherein: The predetermined distance is greater than 1 mm.

12. The stencil printer according to claim 3, wherein: During the process of the template support (202, 203) changing from the second working position to the release position, the adsorption portion moving assembly (314) can drive the adsorption portion (306) to move toward the bracket (305).

13. A control method for a stencil printer, the stencil printer comprising a stencil support and a printing device, characterized in that The following steps are involved: a. Moving the template support and processing element so that the template support and processing element are in contact with the template; b. The printing device printing processing element; c. moving the processing element away from the template, wherein the template support member remains in contact with the template during the process of moving the processing element away from the template; d. Move the formwork support away from the formwork.

14. The stencil printer control method according to claim 13, wherein: In the step b and the step c, the template support member applies an adsorption force to the template.

15. The stencil printer control method according to claim 14, characterized in that: After step c is completed, the template support member disconnects the adsorption force on the template and executes step d.

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