A temperature-resistant and salt-resistant polymer microsphere, its preparation method and application
By modifying dendritic mesoporous silica-loaded copper oxide quantum dots, hollow structure polyacrylamide microspheres were prepared by reverse phase emulsion polymerization process, which solved the problem of poor temperature and salt resistance in oil field applications, achieved the stability and controllable expansion of microspheres, and met the efficient demand for oil field oil production.
Patent Information
- Application Number
- CN202411755643.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-12-03
AI Technical Summary
In oil field applications, existing polymer microspheres have problems such as poor temperature and salt resistance, easy shear crushing and low sealing strength, which are difficult to meet the requirements of water blocking, deep dissection adjustment and displacement in oil field oil production.
Polyacrylamide microspheres with hollow structures were prepared by using modified dendritic mesoporous silica as a carrier and loading copper oxide quantum dots. The process involves modifying dendritic mesoporous silica with a mercaptosilane coupling agent, ultrasonic dispersing of copper oxide quantum dots, and subsequent polymerization under stirring conditions to form microspheres.
The prepared temperature-resistant and salt-resistant polymer microspheres have good stability and can be controlled to expand in brine, which improves the elastic deformation ability of the microspheres and the water absorption and rupture resistance of high-temperature and high-salt environments, and meets the requirements of improving crude oil recovery such as water blocking, deep dissection adjustment and displacement in oil field oil production.