Fan

Abstract

The invention relates to the field of household appliances, particularly provides a fan, and aims to solve the technical problem of poor refrigeration effect of the fan to a certain extent. To this end, the fan of the present invention comprises: a housing having an air inlet and an air outlet; the air guide piece is arranged on the shell and located between the air inlet and the air outlet; and the refrigerating part is connected to the shell, and the refrigerating part is provided with a through hole allowing air to pass through, so that when the air guiding part guides the air to flow, the air can pass through the through hole, and therefore the air is refrigerated by the refrigerating part.

Description

Technical Field

[0001] The invention relates to the technical field of household appliances, and in particular provides a fan. Background Art

[0002] Fans are commonly used household refrigeration equipment. Compared with air conditioners that cool large spaces, fans can cool local spaces and achieve significant energy savings.

[0003] Some fans in the prior art are provided with refrigeration structures, but these refrigeration structures can usually only exchange heat with a small part of the air in the fan housing, or only a small area can exchange heat with the air in the fan housing, which results in poor refrigeration effect of the fans in the prior art.

[0004] Accordingly, the art needs to provide a new technical solution to solve the above problems. Summary of the invention

[0005] In order to overcome the above-mentioned defects to at least a certain extent, the present invention is proposed. Specifically, the present invention provides a fan that can at least a certain extent solve the technical problem of poor cooling effect of the fan.

[0006] The present invention provides a fan, which comprises a shell, and the fan comprises: the shell having an air inlet and an air outlet; an air guide member, which is arranged on the shell and located between the air inlet and the air outlet; and a refrigeration member connected to the shell, wherein the refrigeration member has a through hole allowing air to pass through, so that: when the air guide member guides the air flow, the air can pass through the through hole and is thus cooled by the refrigeration member.

[0007] It is understandable that in the prior art, in order to avoid affecting the air flow, the refrigeration structure is usually arranged parallel to the air flow direction, or is arranged perpendicular to the air flow direction only in a small range. However, in these arrangements, only a small part of the air flowing through the surface of the refrigeration structure can exchange heat with the refrigeration structure, resulting in a poor refrigeration effect. In this example, the refrigeration element has a through hole that allows air to pass through, and the air can pass through the through hole and is therefore cooled by the refrigeration element, thereby seeking a larger contact area between the refrigeration element and the air, thereby obtaining a better refrigeration effect.

[0008] In a technical solution of the above-mentioned fan, at least a part of the structure of the refrigeration component is a plate-shaped structure, a cylindrical structure or a ring-shaped structure.

[0009] Through such a configuration, several optional structural forms of the refrigeration component are provided, among which a plate-shaped structure is more preferred. Compared with other structures, the refrigeration component with a plate-shaped structure has a larger refrigeration area under the premise of the same volume.

[0010] In a technical solution of the above fan, when at least a part of the structure of the refrigeration component is a plate-like structure, the through holes include a plurality of through holes, and the plurality of through holes are distributed in the plate-like structure.

[0011] Through such a structure, a possible distribution mode of the through holes is provided. Under this distribution mode, a plurality of through holes can produce a uniform flow effect on the air, thereby increasing the heat exchange area between the air and the refrigeration component, and seeking a better refrigeration effect.

[0012] In a technical solution of the above-mentioned fan, the extension direction of the plate-like structure is perpendicular to the air flow direction in the shell, or at least forms an angle therewith.

[0013] This structure can increase the range of air that the refrigeration unit can contact, thereby achieving a better cooling effect.

[0014] In a technical solution of the above-mentioned fan, a projection of the plate-like structure on the plane where the air inlet is located covers the air inlet.

[0015] With such a structure, almost all the air flowing through the air inlet will come into contact with the refrigeration element and be cooled, thereby achieving a better cooling effect.

[0016] In a technical solution of the above-mentioned fan, the through hole is configured to have an adjustable opening.

[0017] Through such a structure, a solution for adjusting the cooling intensity is provided. It can be understood that when the opening of the through hole changes, the amount of air allowed to pass through the through hole will change, and at the same time, the heat exchange area between the air and the refrigeration element will also change, so that the air volume and cooling intensity of the fan can be adjusted at the same time.

[0018] In a technical solution of the above-mentioned fan, the refrigeration component includes a plurality of refrigeration partitions, and the refrigeration functions of the plurality of refrigeration partitions are configured to be independently turned on or off.

[0019] Through such a structure, another solution for adjusting the refrigeration intensity is provided. In this solution, the refrigeration intensity can be adjusted by adjusting the number of refrigeration components opened. Compared with the method of adjusting the through-hole opening, this implementation will not cause changes in the air volume while adjusting the refrigeration intensity.

[0020] In a technical solution of the above fan, the fan includes: a driving member connected to the refrigeration member so as to drive the refrigeration member to move.

[0021] Through such a structure, another solution for adjusting the refrigeration intensity is provided. In this solution, the refrigeration component can be moved to change its heat exchange position and heat exchange range with the air, thereby adjusting the refrigeration intensity. This adjustment method will also not bring about changes in the air volume. Moreover, this adjustment method does not require the refrigeration component itself to have the ability to adjust the refrigeration intensity, and is more versatile.

[0022] In a technical solution of the above fan, when the driving member drives the refrigeration member to move, the ratio between the air flow in the through hole and the air flow entering the shell changes.

[0023] Through such a structure, a specific implementation method of changing the refrigeration intensity by moving the refrigeration element is provided. It can be understood that the air passing through the through hole can have a relatively sufficient contact with the refrigeration element, so the degree of cooling will be higher than that of the air not passing through the through hole. When the ratio between the air flow in the through hole and the air flow entering the shell changes, it means that the proportion of air passing through the through hole changes, thereby changing the overall refrigeration intensity.

[0024] In a technical solution of the above-mentioned fan, the refrigeration element includes: a semiconductor refrigeration part, the through hole is located in the semiconductor refrigeration part, and a heat dissipation part, which is arranged on the heat generating side of the semiconductor refrigeration part.

[0025] Through such a structure, a possible implementation method of the refrigeration component is provided. Compared with other implementation methods, the use of the semiconductor refrigeration unit can achieve a better refrigeration effect.

[0026] In a technical solution of the above-mentioned fan, the semiconductor refrigeration part is a plate-shaped structure, a cooling side of which is arranged toward the air guide member, and a heat generating side is arranged toward the air inlet.

[0027] Through such a structure, a possible arrangement of the semiconductor refrigeration unit is provided, and this arrangement can significantly increase the heat exchange area between the semiconductor refrigeration unit and the air, thereby obtaining a better refrigeration effect.

[0028] In a technical solution of the above-mentioned fan, the heat dissipation part includes a heat dissipation pipe arranged around the through hole, and the heat dissipation pipe allows a cooling medium to flow therein so as to dissipate heat for the semiconductor refrigeration part.

[0029] Through such a structure, a possible arrangement of the heat dissipation part is provided. Compared with other arrangements, the use of heat dissipation pipes for heat dissipation can achieve a better heat dissipation effect.

[0030] In a technical solution of the above fan, the fan comprises: a storage element for storing the cooling medium, and a pumping element connected to the storage element and the heat dissipation pipe so as to pump the cooling medium to the heat dissipation pipe.

[0031] Through such a structure, a method of introducing a cooling medium into the heat dissipation pipe is provided. Compared with other methods, the cooling medium in this method can circulate and dissipate heat, save resources and be convenient for users.

[0032] In a technical solution of the above-mentioned fan, the refrigeration element has a cavity in which a refrigerant medium is arranged; the fan includes: a storage element for storing the cooling medium, and the refrigeration element is connected to the storage element so that the cooling medium absorbs the heat of the refrigerant medium.

[0033] Through such a structure, another possible implementation mode of the refrigeration element is provided. Compared with semiconductor refrigeration, the use of a refrigeration medium for refrigeration can save energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the drawings represent similar components, wherein:

[0035] Figure 1 is a side view of a fan according to an embodiment of the present invention;

[0036] Figure 2 yes Figure 1 A cross-sectional view of a fan in FIG.

[0037] Figure 3 yes Figure 1 An exploded view of the fan in the

[0038] Figure 4 yes Figure 1 A schematic diagram of the structure of the cooling side of the cooling element of the central fan;

[0039] Figure 5 yes Figure 4 A schematic diagram of the structure of the heat generating side of the refrigeration component;

[0040] Figure 6 is a cross-sectional view of a fan according to another embodiment of the present invention;

[0041] Figure 7 yes Figure 6 A schematic diagram of the structure of the cooling element and the storage element of the fan;

[0042] Figure 8 yes Figure 7A cross-sectional view of the refrigeration element and the storage element in FIG.

[0043] Reference numerals list :

[0044] 1: Shell; 11: Air inlet; 12: Air outlet; 2: Air guide; 3: Refrigeration component; 31: Through hole; 32: Semiconductor refrigeration part; 33: Heat dissipation part; 34: Main body; 35: Extension part; 351: First extension section; 352: Second extension section; 4: Storage component; 5: Pumping component. DETAILED DESCRIPTION

[0045] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0046] An embodiment of the present invention provides a fan. Figure 1 is a side view of a fan according to an embodiment of the present invention, Figure 2 yes Figure 1 A cross-sectional view of the fan in FIG. Figure 3 yes Figure 1 Exploded view of the fan in the . Figure 1-Figure 3 The fan of this embodiment includes a shell 1, an air guide member 2, and a refrigeration member 3.

[0047] The shell 1 has an air inlet 11 and an air outlet 12. In this example, the shell 1 is roughly in a cubic shape. The air inlet 11 and the air outlet 12 are respectively arranged on two opposite side walls of the shell 1. However, it can be understood that the shell 1 can have any suitable shape, and the air inlet 11 and the air outlet 12 can include one or more air inlet 11 and the air outlet 12. The air inlet 11 and the air outlet 12 can be arranged at any suitable position of the shell 1. When the air inlet 11 includes multiple air inlets, the multiple air inlets 11 can be arranged on the same side of the shell 1, or on different sides of the shell 1. The same is true for the air outlet 12. Technical personnel in this field can make a selection according to actual needs.

[0048] The air guide 2 is arranged on the housing 1 and is located between the air inlet 11 and the air outlet 12. In the actual working process, it can guide the airflow from the air inlet 11 into the housing 1 and blow it out from the air outlet 12. The air guide 2 can be, for example, a cross-flow fan, an axial flow fan or other commonly used fan in the art. Those skilled in the art can select a suitable type of fan according to the positions of the air inlet 11 and the air outlet 12, and can determine the power parameters of the fan according to actual use requirements. Preferably, the air inlet 11 and the air outlet 12 can be arranged on the opposite side walls of the housing 1, and a cross-flow fan is used as the air guide 2 to reduce the wind resistance of the air during the flow.

[0049] The refrigeration component 3 is connected to the shell 1, and has a through hole 31 that allows air to pass through. It is understandable that in the prior art, in order to avoid affecting the air flow, the refrigeration structure is usually arranged parallel to the air flow direction, or is arranged perpendicular to the air flow direction only in a small range. However, in these settings, only a small part of the air flowing through the surface of the refrigeration structure can exchange heat with the refrigeration structure, resulting in a poor refrigeration effect. In this example, the refrigeration component 3 has a through hole 31 that allows air to pass through, so that when the air guide 2 guides the air flow, the air can pass through the through hole 31 and is therefore cooled by the refrigeration component 3, thereby seeking a larger heat exchange area between the air and the refrigeration component 3 and obtaining a better refrigeration effect.

[0050] Those skilled in the art can select any suitable refrigeration device as the refrigeration element 3 according to actual needs, and construct it into a form with a through hole 31 to achieve the above-mentioned technical effect. For example, the refrigeration element 3 may include a semiconductor refrigeration device, which is a type of device that uses the thermoelectric effect of a semiconductor to produce cooling. After the power is turned on, electron-hole pairs are generated near the contact on one end, the internal energy is reduced, the temperature is lowered, and heat is absorbed from the outside, which is called the cold end. The other end increases the internal energy and the temperature rises due to the recombination of the electron-hole pairs, and releases heat to the environment, which is called the hot end. For another example, the refrigeration element 3 may be a device with a refrigerant medium inside, and these refrigerants can achieve a refrigeration effect by exchanging heat with the air. The refrigeration element 3 may also be other suitable devices with refrigeration functions, which those skilled in the art can select according to actual needs.

[0051] The refrigeration element 3 can be connected to any suitable position of the housing 1, for example, the refrigeration element 3 can be connected to the inner wall of the housing 1, or to the outer wall of the housing 1, or to other structures connected to the housing 1. In the case where the refrigeration element 3 is connected to the outer wall of the housing 1, the refrigeration element 3 can be connected to the outer wall corresponding to the air inlet 11, or to the outer wall corresponding to the air outlet 12, and in these cases, the refrigeration element 3 can be detachably connected to the housing 1, so that the refrigeration element 3 can be removed from the housing 1 without cooling the blown air. In the case where the refrigeration element 3 is connected to the inner wall of the housing 1, the refrigeration element 3 can be connected to only one inner wall of the housing 1, or to multiple inner walls at the same time. The refrigeration element 3 can include one or more refrigeration elements. In the case where the refrigeration element 3 includes multiple refrigeration elements, the multiple refrigeration elements 3 can be connected to the same wall of the housing 1, or can be connected to different walls of the housing 1 (including the inner wall and the outer wall) respectively. Those skilled in the art can set the refrigeration element 3 at any suitable position according to actual needs, as long as it can cool the air flowing out of the housing 1.

[0052] As a preferred embodiment, the refrigeration component 3 can be arranged at a position corresponding to the air inlet 11 inside the housing 1, so that when the air guide 2 guides the air flow, the air flows through the air inlet 11, the through hole 31 and the air outlet 12 in sequence. This arrangement will bring about a better cooling effect. In the case where there are multiple air inlets 11, there can also be multiple refrigeration components 3, and the multiple refrigeration components 3 can be respectively arranged at a position corresponding to each air inlet 11, so that the air flowing into the multiple air inlets 11 can all pass through the through hole 31 and be cooled by the refrigeration component 3.

[0053] The refrigeration component 3 will inevitably generate heat during the refrigeration process, and this heat will affect the refrigeration effect of the refrigeration component 3. When the heat accumulation exceeds the limit, the refrigeration effect of the refrigeration component 3 may be realized. Therefore, technical personnel in this field may need to pay attention to the heat dissipation of the refrigeration component 3 when setting the refrigeration component 3. The heat generated during operation can be dissipated to the surrounding environment by setting the refrigeration component 3 in a suitable position, or suitable cooling structures, heat dissipation structures, etc. can be added. Technical personnel in this field can make reasonable settings based on the specific heat dissipation requirements of the refrigeration component 3 actually selected. Corresponding heat dissipation solutions will also be given for several types of refrigeration components 3 below, which will not be repeated here.

[0054] In one possible implementation, refer to Figure 3 , part of the structure of the refrigeration component 3 is a plate-like structure, which can be a flat plate-like structure as shown in the figure, or an arc-shaped plate-like structure. It is understandable that the refrigeration component 3 can have any suitable structural form, such as at least part of the structure of the refrigeration component 3 can also be any one of an annular structure, a cylindrical structure, a columnar structure, or even an irregular structure, and the refrigeration component 3 can have multiple of the above structural forms at the same time. In the case where the refrigeration component 3 includes multiple refrigeration components, the structural forms of the multiple refrigeration components 3 can be the same or different, and those skilled in the art can choose according to actual needs.

[0055] When the refrigeration component 3 is a plate-like structure or an annular structure, it can be arranged on one side of the air guide 2. Compared with other structures, these structures have a larger contact area with the air and have a better refrigeration effect. When the refrigeration component 3 is a cylindrical structure, the air guide 2 can be arranged at the hollow part of the cylindrical structure, so that the air will exchange heat with the refrigeration component 3 multiple times during the flow of air, thereby obtaining a better refrigeration effect. Obviously, when setting the specific structural form of the refrigeration component 3, it is also necessary to consider the spatial layout inside the shell 1, the air flow form, and the structure of the components of the refrigeration component 3 itself. Those skilled in the art can reasonably set the structural form of the refrigeration component 3 according to actual needs, which will not be repeated here.

[0056] The through hole 31 may also have any suitable structural form. For example, the cross-sectional shape of the through hole 31 may be rectangular, circular, triangular or even irregular. The through hole 31 may be a straight hole, a curved hole or even an irregular hole, as long as air can pass through it. The through hole 31 may be arranged at any suitable position of the refrigeration component 3. The through hole 31 may include one or more through holes. In the case where the through hole 31 includes multiple through holes, the shape, size, extension direction, etc. of the through hole 31 may be the same, different or not completely the same. As described above, the structure of the refrigeration component 3 may be a structure having a hollow part such as an annular structure or a cylindrical structure. In this case, the hollow structure of the refrigeration component 3 may be used as a through hole 31. On this basis, other through holes 31 may no longer be arranged, or other through holes 31 may continue to be arranged. Those skilled in the art may flexibly arrange it according to actual use requirements.

[0057] In a possible implementation, still referring to Figure 3 In the case where at least part of the structure of the refrigeration component 3 is a plate-like structure, the through hole 31 may include a plurality of through holes 31, and the plurality of through holes 31 may be distributed on the plate-like structure. Through such a structure, the plurality of through holes 31 can produce a flow-equalizing effect on the air, thereby increasing the heat exchange area between the air and the refrigeration component 3, and seeking a better refrigeration effect. In this case, preferably, the structure, size, etc. of the plurality of through holes 31 may be the same, and they may be evenly distributed on the plate-like structure, for example, in a grid-like distribution, a concentric circle-like distribution, a honeycomb-like distribution, etc., to seek a better flow-equalizing effect. Of course, those skilled in the art may also set the through holes 31 on the plate-like structure in any other suitable manner according to actual needs.

[0058] In a possible implementation, the extension direction of the plate-like structure can be perpendicular to the air flow direction in the housing 1, or at least form an angle. In other words, the plate-like structure can be arranged facing the wind, and the advantage of the windward arrangement is that the range of air that the refrigeration element 3 can contact can be increased, thereby obtaining a better cooling effect. Since the plate-like structure has a plurality of through holes 31, the windward arrangement of the plate-like structure does not result in a reduction in the fan air volume.

[0059] In a possible implementation, the projection range of the plate-like structure on the plane corresponding to the air inlet 11 can cover the air inlet 11. It should be noted that the projection range here covers the air inlet 11. With such a structure, almost all of the air flowing through the air inlet 11 will contact the refrigeration element 3 and be cooled, thereby achieving a better cooling effect.

[0060] It is understandable that under different usage conditions, users have different requirements for the cooling intensity of the fan. In the prior art, the fan usually only has the function of adjusting the air volume (the amount of air blown out from the air outlet per unit time), even for some fans with active cooling function.

[0061] Air volume adjustment can only make the user feel the change of wind intensity, but cannot make the user feel the change of wind temperature. In view of this, the fan in some embodiments provided by the present invention further adds a cooling intensity adjustment function. Some implementation methods of this function will be described below. Those skilled in the art can use any of the following implementation methods alone or in combination to implement the cooling intensity adjustment function.

[0062] In a possible implementation, the through hole 31 may be set to have an adjustable opening. It is understandable that when the opening of the through hole 31 changes, the amount of air allowed to pass through the through hole 31 will change, thereby causing the heat exchange area between the air and the refrigeration element 3 to change, thereby causing the air volume and refrigeration intensity of the fan to change at the same time.

[0063] The adjustable opening here may mean that the opening of the through hole 31 can be linearly adjusted between 0 and the maximum opening, or may mean that the opening of the through hole 31 can be switched between 0 and the maximum opening, or between 0, the maximum opening, and one or more openings within the range of 0 and the maximum opening. In the case where there are multiple through holes 31, the openings of the multiple through holes 31 may all be set to be adjustable, or the openings of only some of the through holes 31 may be set to be adjustable. The openings of the multiple through holes 31 may be set to be adjustable synchronously, or individually, and the ranges of the openings of the multiple through holes 31 that are allowed to be adjusted may be the same or different.

[0064] A suitable mechanical structure may be provided at the through hole 31 to make the opening of the through hole 31 adjustable. For example, a movable baffle structure may be provided at the through hole 31. Alternatively, a mechanical structure may be added to the refrigeration component 3 to make the opening of the through hole 31 adjustable. Those skilled in the art may make the arrangements according to actual needs, which will not be elaborated herein.

[0065] In a possible implementation, the refrigeration components 3 may include multiple refrigeration components, and the refrigeration functions of the multiple refrigeration components 3 may be set to be independently turned on or off. In actual use, the refrigeration intensity can be adjusted by adjusting the number of refrigeration components 3 that are turned on. Compared with the method of adjusting the opening of the through hole 31, this implementation will not cause a change in the air volume while adjusting the refrigeration intensity. The adjustment of the air volume can be achieved by other methods such as changing the power of the air guide 2, thereby achieving independent adjustment of the refrigeration intensity and the air volume, and achieving a better user experience.

[0066] As another possible implementation, when there is only one refrigeration component 3, the refrigeration component 3 may include multiple refrigeration partitions, and the refrigeration functions of the multiple refrigeration partitions may be configured to be independently turned on or off, thereby achieving a similar effect. Obviously, when there are multiple refrigeration components 3, and the refrigeration functions of the multiple refrigeration components 3 may be independently turned on or off, each refrigeration component 3 may still be configured to have multiple refrigeration partitions, so as to achieve a refined adjustment of the refrigeration intensity.

[0067] In a possible implementation, the fan 1 may include a driving member (not shown in the figure), which is connected to the refrigeration member 3 so as to drive the refrigeration member 3 to move. Thus, the heat exchange position and heat exchange range between the refrigeration member 3 and the air can be changed by moving the refrigeration member 3, thereby adjusting the refrigeration intensity.

[0068] It is understandable that the above describes the adjustment method of adjusting the refrigeration intensity by turning on and off the refrigeration function of the refrigeration component 3. However, for some refrigeration components 3, turning on and off their refrigeration functions may not be easy to achieve, especially when it is necessary to control their refrigeration functions in the form of refrigeration partitions. For example, when using a device provided with a refrigeration medium as the refrigeration component 3, the realization of the above function may require the setting of an extremely complex valve structure inside the device. However, this adjustment method of moving the refrigeration component 3 to adjust the refrigeration intensity does not rely on the refrigeration function adjustment capability of the refrigeration component 3 itself, and is more versatile.

[0069] The driving member may be any suitable driving mechanism, which may be transmission-connected with the refrigerating member 3 so as to drive the refrigerating member 3 to move. The specific transmission connection mode may be set by those skilled in the art according to the movement mode of the refrigerating member 3 to be achieved.

[0070] In a possible implementation, the driving member can change the ratio between the air flow in the through hole 31 and the air flow entering the housing 1 when driving the refrigeration member 3 to move. As described above, the through hole 31 may include one or more. In the case where the through hole 31 includes more than one, the air flow in the through hole 31 here refers to the total flow of air in the multiple through holes 31.

[0071] It can be understood that the air passing through the through hole 31 can have a relatively sufficient contact with the refrigeration component 3, so the degree of cooling will be higher than that of the air not passing through the through hole 31. When the ratio between the air flow in the through hole 31 and the air flow entering the shell 1 changes, it means that the proportion of air passing through the through hole 31 changes, thereby changing the overall cooling intensity.

[0072] Furthermore, in the above embodiment, the ratio between the air flow in the through hole 31 and the air flow entering the housing 1 can be changed by translating or rotating the refrigeration element 3. Figure 2 Take the refrigeration element 3 with a middle plate structure as an example. Figure 2 In the position shown in the figure, the projection range of the refrigeration component 3 on the plane corresponding to the air inlet 11 covers the air inlet 11, and the ratio between the air flow in the through hole 31 and the air flow entering the shell 1 is close to 1. If the refrigeration component 3 is translated vertically upward or downward, or the refrigeration component 3 is rotated with the central axis of the shell 1 in the vertical direction as the rotation axis, after the translation and rotation, part of the through holes 31 will no longer face the air inlet, and the flow of the part of the through holes 31 will be reduced, thereby causing the ratio between the air flow in the through holes 31 and the air flow entering the shell 1 to change. Those skilled in the art can reasonably plan the path of the driving member when driving the refrigeration component 3 to move according to the specific spatial layout in the shell 1, the specific structural form of the refrigeration component 3, etc., which will not be repeated here.

[0073] In a possible implementation, when the refrigeration element 3 includes a plurality of refrigeration elements, the driving element may be connected to each refrigeration element 3 respectively, so as to drive each refrigeration element 3 to move respectively. The specific manner in which the driving element drives each refrigeration element 3 to move respectively can refer to the movement manner given above. The driving element may drive these refrigeration elements 3 to move in the same movement manner, or may drive these refrigeration elements 3 to move in different or not completely the same movement manner.

[0074] In a possible implementation, when the driving element drives each refrigeration element 3 to move, the positional relationship between the plurality of refrigeration elements 3 can be changed to allow part of the air to pass through the respective through holes of at least two refrigeration elements 3 .

[0075] It can be understood that each time the air passes through a through hole 31, it will undergo a relatively sufficient heat exchange with the refrigeration component 3, and through the above adjustment, part of the air will pass through the through holes 31 of at least two refrigeration components 3, that is, this part of the air will undergo at least two heat exchanges with the refrigeration component 3, thereby increasing the cooling intensity of this part of the air.

[0076] One advantage of this adjustment method is that it can significantly increase the cooling intensity in a certain area, meeting the user's demand for rapid cooling. Figure 2Similarly, the plate-like structure can completely cover the air inlet 11. In this use state, the temperature of the air blown out by the fan will be more uniform. In the second use state, the two refrigeration components 3 can be adjusted to a state where they completely overlap each other when viewed from the air flow direction. In this way, part of the air will flow through the through holes 31 of the two refrigeration components 3 in turn. The cool feeling of this part of the air after being blown out will be greatly increased compared to the first use state, meeting the user's rapid cooling needs.

[0077] The following will further supplement and expand the possible configuration of the refrigeration component 3 in combination with two specific examples.

[0078] Embodiment 1:

[0079] Reference Figure 1-Figure 5 In this example, the refrigeration element 3 may include a semiconductor refrigeration portion 32 and a heat dissipation portion 33. The semiconductor refrigeration portion 32 may include the semiconductor refrigeration device described above, and the through hole 31 may be provided on the semiconductor refrigeration portion 32. The semiconductor refrigeration portion 32 has a refrigeration side (corresponding to the cold end of the semiconductor device) and a heat generating side (corresponding to the hot end of the semiconductor device).

[0080] Figure 4 and Figure 5 The schematic diagrams of the structures of the cooling side and the heat generating side of the semiconductor refrigeration unit 32 are shown respectively. Figure 5 The heat dissipation part 33 can be arranged on the heat generating side of the semiconductor refrigeration part 32 to dissipate heat therefrom, thereby ensuring that the refrigeration side of the semiconductor refrigeration part can continuously and high-quality refrigeration.

[0081] Further, the semiconductor refrigeration part 32 can be a plate-like structure, which can be arranged between the air guide 2 and the air inlet 11, and its extension direction can be perpendicular to the air flow direction in the shell 1. As described above, this windward arrangement can achieve a better cooling effect. Further, the heat-generating side of the semiconductor refrigeration part 32 can be arranged toward the air inlet 11, and the cooling side can be arranged toward the air guide 2, so that the air entering the shell 1 will first contact the heat-generating side of the semiconductor refrigeration part 32, and then contact the cooling side of the semiconductor refrigeration part 32, and will not contact the heat-generating side again after contacting the cooling side, thereby ensuring a better cooling effect. Obviously, the semiconductor refrigeration part 32 can also be the annular structure, cylindrical structure, etc. described above, and those skilled in the art can choose according to actual needs.

[0082] Furthermore, the through holes 31 may include a plurality of through holes 31, and the plurality of through holes 31 may be distributed in a grid shape on the semiconductor refrigeration part 32. As described above, the through holes 31 will have a flow-averaging effect on the air flowing through, thereby obtaining a better cooling effect. Obviously, the arrangement of the through holes 31 is not limited to this, and may also be any of the arrangement methods described above.

[0083] Further, refer to Figure 5 In this example, the heat dissipation part 33 includes a heat dissipation pipe arranged around the through hole, and the heat dissipation pipe allows a cooling medium to flow therein so as to dissipate heat for the semiconductor refrigeration part 33. The cooling medium here can be water, ice, ice crystals, dry ice, etc., which can allow the user to select a suitable medium as the cooling medium according to their own conditions. This heat dissipation method can achieve a better heat dissipation effect, thereby ensuring a better cooling effect. The heat dissipation pipe is arranged around the through hole 31 to ensure a better heat dissipation effect. Obviously, the heat dissipation pipe can also be arranged in other ways, such as being arranged around the edge of the heat-generating side of the semiconductor refrigeration part 32, etc., and those skilled in the art can choose according to actual needs.

[0084] In addition to this arrangement, the heat dissipation portion 33 may also be any other suitable heat dissipation structure. For example, the heat dissipation portion 33 may be a structure such as heat dissipation fins that completes heat dissipation by radiation, which may extend to the outside of the housing 1 to complete heat dissipation. However, this heat dissipation method will cause the ambient temperature in other ranges (the range that the heat dissipation fins can radiate) outside the fan cooling range (the range covered by the cold air blown by the fan) to increase.

[0085] Furthermore, the fan may be provided with a storage element 4 and a pumping element 5. The storage element 4 is used to store the cooling medium, and the pumping element 5 is used to pump the cooling medium in the storage element 4 into the heat dissipation pipe, thereby realizing a continuous supply of the cooling medium. The storage element 4 may be any suitable container, which may be arranged inside the housing 1 or outside the housing 1, and the pumping element 5 may be any suitable pump structure. The pumping element 5 may be arranged to pump the cooling medium flowing out of the heat dissipation pipe back into the storage element 4, or may be arranged to pump the cooling medium flowing out of the heat dissipation pipe to other locations, such as a sewer, etc., and those skilled in the art may select according to actual needs.

[0086] In addition to providing the storage element 4 and the pumping element 5 to realize the supply of the cooling medium, those skilled in the art may also adopt other suitable methods to realize the supply of the cooling medium, such as connecting the heat dissipation pipe with the tap water pipe, so that the tap water flows into the heat dissipation pipe as the cooling medium. This method can avoid the noise caused by the operation of the pumping element 5, but may cause a waste of water resources to a certain extent, and the temperature of the tap water cannot be controlled artificially, and may not meet the heat dissipation requirements at certain times.

[0087] In this example, in addition to the refrigeration intensity adjustment method described above, the refrigeration intensity can also be adjusted by adjusting the flow rate of the cooling medium in the heat dissipation pipeline. Specifically, when the flow rate of the cooling medium in the heat dissipation pipeline decreases, its heat dissipation capacity will deteriorate, so that the temperature of the heat generating side of the semiconductor refrigeration part 32 will increase, and the temperature of the refrigeration side will also increase accordingly, thereby resulting in a decrease in the refrigeration intensity. The flow rate adjustment of the cooling medium can be achieved by adjusting the power of the pumping member 5, or by setting an adjustable flow limiting structure in the heat dissipation pipeline, etc., and there is no limitation on this.

[0088] Furthermore, the heat dissipation part 33 may also have multiple heat dissipation partitions, and the heat dissipation functions of the multiple heat dissipation partitions may be set to be independently turned on or off. Through such a configuration, another way to adjust the refrigeration intensity is provided. Specifically, closing a heat dissipation partition will increase the temperature of the heat-generating side of the refrigeration partition corresponding to the area, and the temperature of the refrigeration side will also increase accordingly, thereby causing a decrease in the refrigeration intensity.

[0089] Furthermore, when the refrigeration component 3 includes multiple refrigeration zones, the multiple heat dissipation zones of the heat dissipation portion 33 can correspond one-to-one to the multiple refrigeration zones. When adjusting the on / off state of the refrigeration zone, the on / off state of the corresponding heat dissipation zone can be adjusted synchronously.

[0090] Those skilled in the art may use any suitable method to set the heat dissipation partitions. For example, the heat dissipation part 33 includes a heat dissipation pipe. A valve may be provided in the heat dissipation pipe, and the valve may partition the heat dissipation pipe, thereby causing the heat dissipation part 33 to be divided into a plurality of heat dissipation partitions. The opening and closing of the heat dissipation function of the heat dissipation partition may be controlled by controlling the opening and closing of the valve. The heat dissipation partition and the refrigeration partition may be set to be opened or closed synchronously with the corresponding refrigeration partition, or may be set to be independent of the corresponding heat dissipation partition, and there is no limitation on this.

[0091] Embodiment 2:

[0092] Reference Figure 6 , the refrigeration element 3 may have a cavity, in which a refrigerant medium may be disposed, and the fan further includes a storage element 4, which is used to store the cooling medium. The storage element 4 is connected to the refrigeration element 3 so that the cooling medium absorbs the heat of the refrigerant medium. In this example, when the air flows, the refrigerant medium may exchange heat with the air through the portion of the refrigeration element 3 facing the air, thereby cooling the air. At the same time, the refrigerant medium may also exchange heat with the cooling medium stored in the storage element 4 through the portion of the refrigeration element 3 and the storage element 4, thereby dissipating the heat absorbed by the storage element 4 to achieve continuous cooling.

[0093] In this example, the reason why both the refrigeration medium and the cooling medium are set is that the medium that exchanges heat with the air needs to have a sufficiently high heat exchange efficiency to obtain the desired refrigeration effect, and it is necessary to always maintain a low temperature to achieve continuous refrigeration. The medium whose heat exchange efficiency meets this requirement is usually more expensive and may include substances that are not suitable for direct contact with users (such as some chemical raw materials, etc.), and it is difficult for users to continuously supply low-temperature medium during use.

[0094] In the case where both the refrigeration medium and the cooling medium are provided at the same time, the refrigeration medium only needs to have a sufficiently high heat exchange efficiency. The user can absorb the heat of the refrigeration medium by continuously providing a low-temperature cooling medium to ensure its continuous cooling capacity. There is no requirement for the heat exchange efficiency of the cooling medium. Common media in daily life such as water, ice, and ice crystals can be used as cooling media. It is easy for users to continuously provide a low-temperature cooling medium.

[0095] In this example, those skilled in the art can select a medium with heat exchange efficiency that meets the requirements as the refrigeration medium according to the actual refrigeration requirements, without limitation. Compared with the semiconductor refrigeration method used in the first embodiment, the refrigeration method using the refrigeration medium in this example is more energy-efficient.

[0096] In this example, the specific setting of the storage element 4 can be similar to that in the first embodiment, and it can be any suitable type of container. The difference is that in this example, the refrigeration element 3 can extend to the storage element 4 and contact the cooling medium stored therein, so there is no need to set a pumping element 5 to pump the cooling medium to the refrigeration element 3, thereby reducing the noise when the fan is working. Obviously, those skilled in the art can also choose to adopt a heat dissipation pipeline structure similar to the first embodiment or any other suitable structure to realize heat exchange between the refrigeration medium and the cooling medium, without limitation.

[0097] Furthermore, the cavity of the refrigeration element 3 can be arranged around the through hole 31 so that the refrigerant medium exchanges heat with the air in the through hole 31 through the inner wall of the through hole 31. With such a configuration, the heat exchange area between the refrigerant medium and the air is significantly increased, thereby achieving a better refrigeration effect.

[0098] Further, part of the structure of the refrigeration component 3 can be a plate-like structure, and the through holes 31 include a plurality of through holes 31, and the plurality of through holes 31 are distributed on the plate-like structure. As described above, the through holes 31 can be distributed on the plate-like structure in a grid, concentric circles, honeycomb, or any other suitable manner. Obviously, in addition to the plate-like structure, the refrigeration component 3 can also be any other suitable structure described above, such as a cylindrical structure, an annular structure, etc.

[0099] Taking the partial structure of the refrigeration component 3 as an example, referring to Figure 7 and Figure 8 , the refrigeration element 3 may include a main body 34 and an extension 35, the extension 35 extends from the main body 34 to the inside of the storage element 4, the main body 34 and the extension 35 both have cavities, and the cavities of the main body 34 and the extension 35 are connected. Therefore, after the refrigerant medium at the main body 34 exchanges heat with the air, it can move to the extension 35 and exchange heat with the cooling medium stored in the storage element 4, so that it can continue to cool. In this example, the main body 34 is a plate-like structure. Obviously, it can also be other structures described above, which will not be repeated here.

[0100] Furthermore, in this example, the extension direction of the main body 34 is perpendicular to the air flow direction in the housing 1 or at least forms an angle, that is, the main body 34 is arranged to face the wind, thereby ensuring that it has a larger contact area with the air. Furthermore, the projection of the main body 34 on the plane corresponding to the air inlet 11 can cover the air inlet 11, thereby ensuring that almost all the air entering the housing 1 will pass through the through hole 31, seeking a better cooling effect. Obviously, those skilled in the art can also use any other suitable method to set the position of the main body 34 according to actual needs, without limitation.

[0101] Further, refer to Figure 7 and Figure 8 , the storage element 4 can be arranged on the side of the main body 34 away from the gravity direction, that is, the extension portion 35 will eventually extend to the side of the main body 34 away from the gravity direction. In this case, the refrigerant can be arranged to absorb heat and convert from liquid to gas when exchanging heat with air, and to release heat and convert from gas to liquid when exchanging heat with the cooling medium.

[0102] Therefore, after the refrigerant medium in the main body 34 exchanges heat with the air and is converted into gas, it will automatically diffuse to the extension part 35 and exchange heat with the cooling medium, and the liquefied refrigerant medium after heat exchange with the cooling medium will automatically flow back to the main body 34, realizing the natural circulation of the refrigerant medium.

[0103] Obviously, in other possible implementations, the refrigerant medium may not undergo phase change during the heat exchange process. In these implementations, the refrigerant medium can be forced to circulate by a driving device such as a pump to ensure that the refrigerant medium can continue to cool. The advantages of these implementations are that the circulation of the refrigerant medium is more efficient than natural circulation. The disadvantage is that it will bring greater energy loss and noise.

[0104] Furthermore, the refrigeration medium may include a superconducting liquid. The refrigeration medium may include a superconducting liquid. The superconducting liquid is a liquid that can be prepared from chemical raw materials. Compared with conventional liquid media, the superconducting liquid has a higher heat exchange efficiency, thereby being able to obtain a better refrigeration effect. The physical properties such as the boiling point of the superconducting liquid can be regulated by adjusting the type of raw materials and the principle ratio. Those skilled in the art can select appropriate raw materials to set the superconducting liquid according to actual refrigeration needs, and there is no limitation on this. In a possible embodiment, the material of the main body 34 and the extension portion 35 can also be a material with a higher heat exchange efficiency, or even a super thermal conductive material, so as to further obtain a better refrigeration effect.

[0105] Further, refer to Figure 7 and Figure 8 , the extension portion 35 may specifically include a first extension section 351 connected to the main body portion 34, and at least one second extension section 352 connected to the first extension section 351, the storage element 4 may have an opening facing the direction of gravity, the first extension section 351 may cover the opening, and the second extension section 352 may extend to the interior of the storage element 4 through the opening. In this case, the cooling medium in the storage element 4 will be gathered at the opening due to gravity, so that the surfaces of the first extension section 351 and the second extension section 352 facing the storage element 4 can exchange heat with the cooling medium, significantly increasing the heat exchange area between the cooling medium and the cooling medium, thereby seeking a better cooling effect. In this example, the first extension section 351 and the storage element 4 can be sealed to prevent the cooling medium from flowing into the interior of the shell 1 from the opening.

[0106] Obviously, those skilled in the art may also arrange the extension portion 35 and the storage element 4 in other ways according to actual needs. For example, the storage element 4 may not be provided with an opening, and the extension portion 35 may pass through a wall of the storage element 4 and extend to the interior of the storage element 4.

[0107] Furthermore, in this example, the several methods described above can also be used to increase the refrigeration intensity adjustment function.

[0108] For example, the opening of the through hole 31 may be set to be adjustable, so that the air volume and the cooling intensity can be adjusted simultaneously by adjusting the opening of the through hole 31 .

[0109] For another example, a driving member may be provided to drive the refrigeration member 3 to move. Taking the refrigeration member 3 including the main body 34 and the extension 35 as an example, the driving member may be provided to drive the main body 34 to move alone, or may be provided to drive the main body 34, the extension 35 and even the storage member 4 to move at the same time. The specific movement method may refer to the description of the relevant part above, which will not be repeated here.

[0110] For another example, the refrigeration component 3 may also include multiple refrigeration partitions. Specifically, the cavity of the refrigeration component 3 may be divided into multiple partitions, and one or more valves are set in each partition. When the valve in a partition is closed, the refrigerant in the partition will not be able to flow to other partitions, and therefore cannot exchange heat with the cooling medium, thereby causing the refrigeration function of the refrigerant in the partition to fail. Alternatively, the refrigeration component 3 may also include multiple refrigeration components, and the opening and closing of the refrigeration function can also be controlled by controlling the flow of the refrigerant through the valve.

[0111] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A fan, characterized in that: The fan comprises: A housing having an air inlet and an air outlet; An air guide member, which is arranged on the housing and located between the air inlet and the air outlet; A refrigeration element is connected to the shell, wherein the refrigeration element has a through hole allowing air to pass through, so that: when the air guide element guides the air flow, the air can pass through the through hole and thus be cooled by the refrigeration element.

2. The fan according to claim 1, characterized in that At least a part of the refrigeration component has a plate-like structure, a cylindrical structure or a ring-like structure.

3. The fan according to claim 2, characterized in that: In the case that at least a part of the structure of the refrigeration component is a plate-like structure, the through holes include a plurality of through holes, and the plurality of through holes are distributed in the plate-like structure.

4. The fan according to claim 3, characterized in that: The extending direction of the plate-like structure is perpendicular to the air flow direction in the housing, or at least forms an angle thereto.

5. The fan according to claim 3, characterized in that: The plate-like structure is located between the air guide and the air inlet, and a projection range of the plate-like structure on a plane corresponding to the air inlet covers the air inlet.

6. The fan according to any one of claims 1 to 5, characterized in that: The refrigeration element comprises: A semiconductor refrigeration unit, wherein the through hole is located in the semiconductor refrigeration unit, and The heat dissipation part is arranged on the heat generating side of the semiconductor refrigeration part.

7. The fan according to claim 6, characterized in that: The semiconductor refrigeration part is a plate-shaped structure, a cooling side of which is arranged toward the air guide member, and a heat generating side of which is arranged toward the air inlet.

8. The fan according to claim 7, characterized in that: The heat dissipation part includes a heat dissipation pipe, and the heat dissipation pipe allows a cooling medium to flow therein so as to dissipate heat for the semiconductor refrigeration part.

9. The fan according to claim 8, characterized in that The heat dissipation pipe is arranged around the through hole.

10. The fan according to claim 9, characterized in that The fan comprises: a storage element for storing the cooling medium, and A pumping element is connected to the storage element and the heat dissipation pipeline so as to pump the cooling medium to the heat dissipation pipeline.

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