Touch sensor and touch panel

Abstract

The invention relates to a touch sensor and a touch panel. The technical problem to be solved is to provide a touch sensor and a touch panel having the touch sensor capable of suppressing reduction of conductivity in peripheral wires and migration between the peripheral wires. A touch sensor according to the present invention is provided with a substrate and a conductive layer formed on the surface of the substrate, the conductive layer having: a touch detection electrode comprising a plurality of thin metal wires arranged in a grid; an electrode connection terminal electrically connected to the touch detection electrode; and a peripheral wiring electrically connected to the electrode connection terminal, the peripheral wiring having a plated layer and a metal plating layer covering the plated layer, and the surface of the substrate having a water contact angle of 20-50 DEG.

Description

Technical Field

[0001] The present invention relates to a touch sensor and a touch panel for detecting a touch operation. Background Art

[0002] In the past, various electronic devices, including tablet computers and smart phones, have used touch sensors for detecting so-called touch operations that are caused by a finger, a stylus pen, etc. touching or approaching a screen. Such a touch sensor generally includes a touch detection electrode formed on the surface of a substrate and detecting a touch operation, an external connection terminal formed on the surface of the substrate and used to electrically connect the touch sensor to an external device, and peripheral wiring that electrically connects the touch detection electrode and the external connection terminal.

[0003] For example, Patent Document 1 discloses a method for manufacturing a conductive substrate having a plated layer and a plating layer using a laminate having a substrate, a base layer, and a plated layer precursor layer arranged in contact with the base layer in sequence. Patent Document 1 also describes that when the conductive substrate is applied to a touch panel sensor, the plating layer functions as a detection electrode or lead wiring.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2023-066192

[0005] In recent years, in touch sensors, attempts have been made to achieve so-called narrow borders in which the outer area is narrower than the area where the detection electrodes are arranged. The present inventors have studied narrow borders of touch sensors with reference to the technology disclosed in Patent Document 1, and have found that in touch sensors with narrow borders, the conductivity of peripheral wiring is sometimes reduced due to an increase in resistivity, or migration between peripheral wirings is likely to occur. Summary of the invention

[0006] In view of the above actual situation, an object of the present invention is to provide a touch sensor capable of suppressing the reduction of conductivity in peripheral wiring and the occurrence of migration between peripheral wirings. In addition, an object of the present invention is to provide a touch panel having the above touch sensor.

[0007] The present inventors have completed the present invention as a result of intensive research to solve the above-mentioned problems. Specifically, they have found that the above-mentioned problems can be solved by the following structure.

[0008] [1] A touch sensor comprising a substrate and a conductive layer formed on the surface of the substrate, wherein the conductive layer comprises: a touch detection electrode composed of a plurality of metal fine wires arranged in a grid pattern; an electrode connection terminal electrically connected to the touch detection electrode; and a peripheral wiring electrically connected to the electrode connection terminal, wherein the peripheral wiring comprises a plated layer and a metal plating layer covering the plated layer, and the water contact angle of the surface of the substrate is 20 to 50°.

[0009] [2] A touch sensor according to [1], wherein:

[0010] The substrate contains a surfactant.

[0011] [3] A touch sensor according to [2], wherein:

[0012] The above surfactant is a nonionic surfactant.

[0013] [4] A touch sensor according to [3], wherein:

[0014] The water contact angle of the surface of the substrate is 20 to 40°.

[0015] [5] A touch sensor according to [1], wherein:

[0016] There are multiple peripheral wirings mentioned above.

[0017] In at least a portion of a region on the surface of the substrate where the peripheral wiring is disposed, the peripheral wiring extends in a first direction, is arranged in a second direction perpendicular to the first direction, and a distance S between two adjacent peripheral wirings is 30 μm or less.

[0018] [6] A touch sensor according to [5], wherein:

[0019] There are multiple peripheral wirings mentioned above.

[0020] In at least a portion of a region on the surface of the substrate where the peripheral wiring is disposed, the peripheral wiring extends in a first direction, is arranged in a second direction perpendicular to the first direction, and a distance S between two adjacent peripheral wirings is less than 15 μm.

[0021] [7] A touch panel having the touch sensor described in any one of [1] to [6].

[0022] Effects of the Invention

[0023] According to the present invention, it is possible to provide a touch sensor capable of suppressing a decrease in conductivity in peripheral wirings and migration between peripheral wirings. In addition, according to the present invention, it is possible to provide a touch panel having the above touch sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a plan view showing an example of the structure of the touch sensor according to the present invention.

[0025] Figure 2This is a plan view showing an example of an enlarged structure of peripheral wiring included in the touch sensor according to the present invention.

[0026] Figure 3 It is a plan view showing an example of the structure of a touch detection electrode included in the touch sensor according to the present invention in an enlarged manner. DETAILED DESCRIPTION

[0027] Hereinafter, the touch sensor and the touch panel of the present invention will be described in detail with reference to the accompanying drawings.

[0028] The description of the constituent elements described below is based on representative embodiments of the present invention, but the present invention is not limited to such embodiments. Furthermore, the drawings shown below are examples for explaining the present invention, and the present invention is not limited to the drawings shown below.

[0029] In the present specification, a numerical range expressed by "to" means a range including the numerical values ​​described before and after "to" as the lower limit and the upper limit.

[0030] In the present specification, when two or more kinds of a certain component are present, the "content" of the component means the total content of these two or more kinds of components.

[0031] Unless otherwise specified, angles expressed with specific numerical values ​​and expressions related to angles such as "parallel", "perpendicular" and "orthogonal" include the error range generally allowed in the technical field.

[0032] "Polymer" or "high molecule" refers to a compound having a weight average molecular weight of 2000 or more. Here, the weight average molecular weight is defined as a polystyrene conversion value measured under the following conditions using gel permeation chromatography (GPC: Gel Permeation Chromatography).

[0033] · Device: HLC-8320GPC manufactured by TOSOH CORPORATION

[0034] Column: TSK-GEL G3000PWXL manufactured by TOSOH CORPORATION

[0035] Column temperature: 35℃

[0036] Flow rate: 0.5mL / min

[0037] Calibration curve: POLY SODIUMACRYLATE STANDARD manufactured by SOHWA Science inc.

[0038] Eluent: A mixture of sodium dihydrogen phosphate 12 hydrate / sodium dihydrogen phosphate dihydrate (34.5 g / 46.2 g) was diluted with pure water to a solution of 5000 g.

[0039] The term "principal surface" refers to the surface having the largest area in a film-like, sheet-like or flat member.

[0040] "Transparent" means that the light transmittance in the visible light wavelength region of 400 to 800 nm is 40% or more (preferably 60% or more, more preferably 80% or more, and even more preferably 90% or more). The light transmittance is measured using a known transmittance measuring instrument in accordance with "Plastics - Method for determining total light transmittance and total light reflectance" specified in JIS K 7375:2008.

[0041] [Touch sensor]

[0042] The touch sensor of the present invention comprises a substrate and a conductive layer formed on the surface of the substrate. The conductive layer comprises: a touch detection electrode, which is composed of a plurality of metal thin wires arranged in a grid; an electrode connection terminal, which is electrically connected to the touch detection electrode; and a peripheral wiring, which is electrically connected to the electrode connection terminal, and the peripheral wiring comprises a plated layer and a metal plating layer covering the plated layer. In addition, the water contact angle of the surface of the substrate of the touch sensor of the present invention is 20 to 50 degrees.

[0043] Hereinafter, the touch sensor of the present invention will be described in detail with reference to the accompanying drawings.

[0044] Figure 1 It is a plan view showing an example of the structure of the touch sensor according to the present invention.

[0045] The touch sensor 10 includes a substrate 1 , a first conductive layer 2 formed on one surface 1A of the substrate 1 , and a second conductive layer 3 formed on the other surface 1B of the substrate 1 .

[0046] The first conductive layer 2 includes a plurality of touch detection electrodes 11 extending along the Y direction (first direction) and arranged along the X direction (second direction) orthogonal to the Y direction, a plurality of electrode connection terminals 12 respectively formed at one end of the plurality of touch detection electrodes 11, a plurality of peripheral wirings 13 respectively electrically connected to the plurality of electrode connection terminals 12, and a plurality of external connection terminals 14 respectively electrically connected to the plurality of peripheral wirings 13. The plurality of external connection terminals 14 are used for electrical connection to an external device not shown.

[0047] One end of each of the plurality of peripheral wirings 13 is connected to the corresponding electrode connection terminal 12 , and the other end is connected to the external connection terminal 14 .

[0048] The second conductive layer 3 includes a plurality of touch detection electrodes 21 extending along the X direction (first direction) and arranged along the Y direction (second direction), a plurality of electrode connection terminals 22 electrically connected to one end of each of the plurality of touch detection electrodes 21, a plurality of peripheral wirings 23 electrically connected to each of the plurality of electrode connection terminals 22, and a plurality of external connection terminals 24 electrically connected to each of the plurality of peripheral wirings 23. The plurality of external connection terminals 24 are used for electrical connection to an external device (not shown).

[0049] One end of each of the plurality of peripheral wirings 23 is connected to the corresponding electrode connection terminal 22 , and the other end is connected to the external connection terminal 24 .

[0050] As described later, the touch detection electrodes 11 and 21 function as sensor electrodes for detecting a so-called touch operation, and are composed of a plurality of metal thin wires.

[0051] exist Figure 1 In the touch sensor 10 shown, the detection region R1 is a region surrounding the touch detection electrodes 11 and 21 arranged on the surface of the substrate 1. The peripheral region R2 is a region outside (on the peripheral side) the detection region R1, and the peripheral wiring 13 is arranged in the peripheral region R2.

[0052] Figure 2 FIG. 1 is an enlarged top view showing an example of the structure of peripheral wiring in the peripheral area of ​​the touch sensor. Figure 2 In the embodiment, each of the plurality of peripheral wirings 13 extends in the X direction and is arranged in the Y direction perpendicular to the X direction. Furthermore, the plurality of peripheral wirings 13 have a line width L, and two adjacent peripheral wirings 13 are arranged at a distance S therebetween.

[0053] Here, the above-mentioned narrow frame is an attempt to further enlarge the detection area R1 for detecting touch operations in the touch sensor 10 and further reduce the peripheral area R2. As a method for realizing the narrow frame of the touch sensor, for example, Figure 2 In the peripheral region R2 where the peripheral wirings 13 are arranged, at least one of the distance S between two adjacent peripheral wirings and the line width L of the peripheral wirings is narrowed.

[0054] The inventors of the present invention have studied the structure and configuration of peripheral wiring for narrow-frame touch sensors, and found that sometimes the conductivity decreases due to an increase in resistivity in the area where the peripheral wiring is arranged, or migration occurs between the peripheral wiring, especially in an area with a narrow distance S, the conductivity decreases and migration is prone to occur.

[0055] In contrast, the touch sensor 10 according to the present invention includes a substrate 2 having a surface 2A with a water contact angle of 20 to 50 degrees. When the water contact angle of the surface 2A of the substrate 2 is within the above range, it is possible to suppress a decrease in the conductivity of the peripheral wiring and migration between the peripheral wirings in an area where a plurality of peripheral wirings are arranged, especially in an area where the distance S is narrowed for narrowing the frame. That is, the touch sensor according to the present invention has the above-mentioned characteristics, thereby having an excellent effect of suppressing a decrease in the conductivity and migration in the peripheral wirings.

[0056] Although the mechanism of the excellent performance of suppressing the decrease in conductivity and migration in the peripheral wiring of the touch sensor according to the present invention is not clear, the present inventors speculate as follows.

[0057] The peripheral wiring of the touch sensor involved in the present invention is composed of a plated layer and a metal plating layer covering the plated layer. Here, in order to form a conductive layer, the following plating treatment is performed: after forming the plated layer at a position corresponding to the peripheral wiring, the formed plated layer is subjected to a plating treatment, and metal is precipitated on the surface of the plated layer to form a metal plating layer. In the process of forming the conductive layer, it is believed that bubbles sometimes adhere to the surface of the plated layer due to the reaction of the structural materials of the conductive layer such as the plating metal and the components in the plating treatment solution. In this case, the metal will not be precipitated on the surface portion of the plated layer to which the bubbles are attached. As a result, it can be inferred that a part of the metal plating layer responsible for the conductivity of the peripheral wiring is missing and the conductivity is reduced.

[0058] In contrast, in the touch sensor according to the present invention, the water contact angle of the surface of the substrate is 50° or less, so that bubbles are less likely to adhere to the exposed region of the substrate between the plated layers (particularly, the region where the plated layer corresponding to the peripheral wiring having a narrow distance S is formed). As a result, it is inferred that the plating process can be performed without bubbles remaining on the surface of the plated layer, and the reduction in the conductivity of the peripheral wiring can be suppressed.

[0059] Furthermore, in the touch sensor involved in the present invention, the water contact angle of the surface of the substrate is greater than 20°, so the water content near the surface of the substrate is low in the area where peripheral wiring is configured (especially, the area where peripheral wiring with a narrow distance S is configured), so it can be inferred that the migration of peripheral wiring can be suppressed.

[0060] Each component included in the touch sensor according to the present invention will be described in detail.

[0061] Hereinafter, the expression “the present invention has excellent effects” means that at least one of the effect of suppressing a decrease in conductivity in the peripheral wiring and the effect of suppressing migration in the peripheral wiring in the touch sensor is excellent.

[0062] <Substrate>

[0063] The substrate is a member having the function of supporting the conductive layer.

[0064] As described above, the substrate included in the touch sensor of the present invention is characterized in that the water contact angle of the surface on the side where the conductive layer is formed is 20 to 50°.

[0065] In order to achieve more excellent effects of the present invention, the water contact angle of the surface of the substrate is preferably 40° or less, more preferably 35° or less, and even more preferably 30° or less.

[0066] In order to achieve more excellent effects of the present invention, the water contact angle of the surface of the substrate is preferably 22° or more, and more preferably 25° or more.

[0067] In this specification, the water contact angle refers to the water contact angle measured by the following method. First, prepare a substrate as a measurement object, use a contact angle meter (for example, "DM500" manufactured by Kyowa Interface Science Co., Ltd., etc.), and drip pure water (2 μL of droplets) on the surface of the substrate maintained horizontally. After dripping, measure the contact angle at 10 points after 20 seconds, and take the arithmetic mean of the measurement results as the water contact angle of the surface of the substrate (unit: °). In addition, the above measurement test is carried out at room temperature of 20°C based on the static drop method of JISR 3257:1999.

[0068] The method for preparing a substrate having a surface water contact angle within the above range is not particularly limited, and examples thereof include a method of appropriately selecting a structural material of the substrate and adjusting the water contact angle of the substrate within the above range from the viewpoint of hydrophilicity and hydrophobicity.

[0069] The substrate preferably contains a hydrophilic component as a constituent material. Examples of the hydrophilic component include surfactants, hydrophilic polymers, and hydrophilic oligomers, and surfactants are preferred.

[0070] As for the substrate containing a hydrophilic component (preferably a surfactant), for example, there can be cited a method in which the substrate is composed of a single mixed layer containing a main component such as a resin and a hydrophilic component, and a method in which the substrate is composed of a multilayer structure of a support body that mainly bears the function of supporting the conductive layer and a base layer containing the hydrophilic component. Preferably, the method is composed of a multilayer structure of the above-mentioned support body and a base layer containing a surfactant.

[0071] Examples of the substrate and the support body constituting a multilayer structure with the above-mentioned base layer (hereinafter also referred to as "substrate etc." when the two are not distinguished) include resin substrates, glass substrates, ceramic substrates, and metal substrates.

[0072] The substrate etc. may be a transparent substrate having a transmittance of visible light (wavelength 400 to 800 nm) of 60% or more. The visible light transmittance of the substrate etc. is preferably 80% or more, more preferably 90% or more. The upper limit is not particularly limited, but in most cases is less than 100%. Examples of the above-mentioned transparent substrate include resin substrates, glass substrates, and ceramic substrates.

[0073] Among them, the substrate and the like are preferably flexible in terms of excellent bendability. Examples of the flexible substrate and the like include the above-mentioned resin substrates.

[0074] Also, the substrate or the like may have a three-dimensional shape. That is, the touch sensor may have a three-dimensional shape.

[0075] As the material constituting the substrate, preferably, a resin having a melting point of about 290°C or less, such as polyethylene terephthalate (PET) (258°C), polycycloolefin (134°C), polycarbonate (250°C), acrylic resin (128°C), polyethylene naphthalate (269°C), polyethylene (135°C), polypropylene (163°C), polystyrene (230°C), polyvinyl chloride (180°C), polyvinylidene chloride (212°C), and triacetyl cellulose (290°C), is used, more preferably PET, polycycloolefin or polycarbonate, and even more preferably PET. The numerical values ​​in the above () are melting points or glass transition temperatures.

[0076] The content of the resin contained in the substrate is not particularly limited, but is preferably 80% by mass or more, more preferably 90% by mass or more, relative to the total mass of the substrate. The upper limit may be 100% by mass relative to the total mass of the substrate.

[0077] (Surfactant)

[0078] When the substrate contains a surfactant, the type of the surfactant is not particularly limited, and examples thereof include nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants, and nonionic surfactants are preferred.

[0079] Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyalkylene monoalkyl ethers, propylene oxide / ethylene oxide block polymers, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, glycerol fatty acid esters, polyoxyethylene fatty acid esters, and alkyl (poly)glycosides.

[0080] Commercially available nonionic surfactants include "Polyflow KL-510" manufactured by TEGO Co., Ltd. (solid content 100%, ingredient: polyoxyalkylene monoalkyl ether), "SN984" manufactured by SAN NOPCO LIMITED (solid content 100%, ingredient: polyether compound), "SN366" manufactured by SAN NOPCO LIMITED (solid content 100%, ingredient: polyoxyethylene fatty acid ester), "NEWCOL1004" manufactured by DKS Co., Ltd. (solid content 100%, ingredient: polyoxyethylene-2-ethylhexyl ether), "DMH-40" manufactured by DKS Co., Ltd. (solid content 100%, ingredient: polyoxyethylene alkyl ether), "NOIGEN140A" manufactured by DKS Co., Ltd. (solid content 100%, ingredient: polyoxyethylene-alkylphenyl ether), and ADEKA "Pluronic (registered trademark) L-44" manufactured by Pluronic Corporation (solid content: 100%, components: propylene oxide / ethylene oxide block polymer).

[0081] The surfactant may be used alone or in combination of two or more.

[0082] (basal layer)

[0083] When the base layer is composed of a multilayer structure of a support and a base layer containing a hydrophilic component, the base layer is not particularly limited as long as the base layer is a layer containing a surfactant.

[0084] The base layer is disposed on the surface of the substrate on which the conductive layer is formed. When the substrate is composed of a multilayer structure of a support and a base layer, it is preferred that base layers containing a surfactant are disposed on both surfaces of the support.

[0085] The surfactant contained in the base layer is as described above including preferred embodiments.

[0086] The content of the surfactant contained in the base layer is preferably 0.5 to 20% by mass, more preferably 1 to 15% by mass, based on the total mass of the base layer.

[0087] The base layer may contain a polymer in addition to the surfactant.

[0088] Examples of the polymer that may be contained in the base layer include a cross-linked polymer and a linear polymer having a cross-linked structure.

[0089] A crosslinked polymer is a polymer having a two-dimensional or three-dimensional mesh network in which polymer chains are bonded to each other via a crosslinked structure. The type of the crosslinked polymer is not particularly limited, and examples thereof include polymers having a carbamate structure (—NH—(C═O)—).

[0090] The molecular weight between crosslinking points of the crosslinked polymer is preferably more than 20000 and not more than 500000. The molecular weight between crosslinking points can be determined by measuring solid viscoelasticity.

[0091] A linear polymer refers to a structure in which repeating units are one-dimensionally bonded and the bonding between the repeating units does not include branching. As the linear polymer, known polymers can be used, and examples thereof include copolymers of acrylonitrile and 1,3-butadiene (nitrile rubber), hydrogenated nitrile rubber, copolymers containing repeating units derived from acrylic acid and / or methacrylic acid (acrylic polymers), copolymers containing repeating units derived from acrylic acid derivatives and / or methacrylic acid derivatives (acrylic polymers), and urethane polymers.

[0092] The weight average molecular weight of the linear polymer may be 500 to 500,000, and preferably 1,000 to 100,000.

[0093] The polymer contained in the base layer may be used alone or in combination of two or more.

[0094] The content of the polymer contained in the base layer is not particularly limited and may be the remainder of the surfactant, for example, 80 to 99.5% by mass based on the total mass of the base layer.

[0095] The base layer may contain other components in addition to the surfactant and the polymer. Examples of the other components include oligomers and polymerization initiators.

[0096] The thickness of the base layer is, for example, 0.3 to 20 μm, preferably 0.5 to 10 μm, and more preferably 1 to 5 μm.

[0097] -Method for forming base layer-

[0098] Examples of the method for forming the underlayer include a method in which a composition for forming an underlayer containing the components contained in the above-mentioned underlayer is brought into contact with the above-mentioned support to form the underlayer on the surface of the support.

[0099] The method of contacting the support with the base layer forming composition is not particularly limited, and examples thereof include a method of coating the base layer forming composition on the surface of the support and a method of immersing the support in the base layer forming composition. If necessary, after contacting the base layer forming composition with the support, a drying treatment may be performed to remove the solvent contained in the base layer forming composition.

[0100] Furthermore, after forming a base layer on the surface of a pseudo support body different from the support body in the same manner as described above, the surface of the base layer formed on the pseudo support body on the side opposite to the pseudo support body can be bonded to one surface of the support body, and the pseudo support body can be peeled off at the interface between the pseudo support body and the base layer, thereby configuring the base layer on the surface of the support body.

[0101] The base layer forming composition may contain a solvent. The type of solvent is not particularly limited, and water and an organic solvent may be mentioned. As the organic solvent, known organic solvents (for example, alcohol solvents, ether solvents, ester solvents, ketone solvents, halogen solvents, hydrocarbon solvents, etc.) may be mentioned.

[0102] The base layer can be formed by bringing a composition containing a precursor of a polymer that can be contained in the base layer into contact with a support to form a base layer precursor layer, and then polymerizing the precursor to form a polymer. Examples of the treatment for polymerizing the precursor include exposure treatment.

[0103] When performing an exposure treatment, it is preferred that the base layer forming composition and the base layer precursor layer contain a polymerization initiator. The polymerization initiator is appropriately selected depending on the type of the polymer precursor.

[0104] The thickness of the substrate is not particularly limited, but is preferably 20 to 1000 μm, more preferably 25 to 200 μm, in terms of a balance between handleability and thickness reduction.

[0105] <Conductive layer>

[0106] The conductive layer is a layer formed on the surface of the substrate and includes touch detection electrodes composed of a plurality of metal thin wires arranged in a grid, electrode connection terminals electrically connected to the touch detection electrodes, and peripheral wirings electrically connected to the electrode connection terminals.

[0107] Figure 1 The first conductive layer 2 and the second conductive layer 3 shown are examples of preferred aspects of the conductive layer included in the touch sensor according to the present invention.

[0108] The touch sensor involved in the present invention is not limited to Figure 1 The method shown.

[0109] For example, Figure 1 The touch sensor 10 shown has a first conductive layer 2 and a second conductive layer 3 formed on two surfaces 1A and 1B of a substrate 1, respectively, but the conductive layer may be formed only on one surface of the substrate. That is, the touch sensor involved in the present invention may be a touch sensor including a substrate and a conductive layer formed only on one surface of the substrate, and the surface of the substrate on which the conductive layer is formed may have a water contact angle of 20 to 50 degrees.

[0110] Next, the peripheral wiring and the touch detection electrodes included in the conductive layer will be described in more detail.

[0111] (Peripheral wiring)

[0112] The peripheral wiring has a function of transmitting an electric signal detected in the touch detection electrode to an external device by electrically connecting the electrode connection terminal and the external connection terminal.

[0113] exist Figure 2 In the embodiment, the plurality of peripheral wirings 13 extend in the X direction (first direction) and are arranged in the Y direction (second direction) perpendicular to the X direction. Figure 2 FIG. 2 shows the arrangement of the peripheral wiring 13 in a section of the total length of the peripheral wiring 13 that connects the electrode connection terminal 12 and the external connection terminal 14. Figure 1 As shown, the peripheral wiring 13 connects the electrode connection terminal 12 and the external connection terminal 14 while changing the extending direction according to the arrangement of the electrode connection terminal 12, the external connection terminal 14 and other components.

[0114] In terms of making it easier to achieve a narrow frame, the peripheral wiring preferably has at least one of a distance S between two adjacent peripheral wirings and a line width L of the peripheral wiring in at least a portion of an area on the surface of a substrate where the peripheral wirings are arranged, and more preferably a distance S between the peripheral wirings is within a specified range.

[0115] Specifically, the distance S between the peripheral wirings is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 15 μm or less.

[0116] Furthermore, the line width L of the peripheral wiring is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 15 μm or less.

[0117] In the touch sensor involved in the present invention, when the distance S between peripheral wirings and / or the line width L of peripheral wirings in at least a part of the area where peripheral wirings are arranged are within the above range, the conductivity reduction of peripheral wirings and the migration between peripheral wirings can be suppressed by narrowing the frame.

[0118] In terms of achieving a more excellent effect of suppressing migration, the distance S between the peripheral wirings is preferably 5 μm or more, and more preferably 10 μm or more.

[0119] Furthermore, in order to ensure sufficient conductivity, the line width L of the peripheral wiring is preferably 3 μm or more, and more preferably 5 μm or more.

[0120] In addition, in this specification, the line width of the peripheral wiring refers to the line width measured by observing the length in the direction perpendicular to the direction in which each component is extended using an optical microscope (for example, a digital microscope "VHX-7000" manufactured by Keyence Corporation, etc.) in the touch sensor. Specifically, the line width is measured by observing 10 points randomly selected in the conductive layer with the optical microscope, and the measured values ​​are arithmetic averaged to calculate the line width of the peripheral wiring.

[0121] Furthermore, for example, "the distance S between the peripheral wirings in at least a portion of the area where the peripheral wirings are arranged is 30 μm or less" means that the distance S between the peripheral wirings obtained by the following method for a section of 1000 μm in length extending in one direction of a plurality of peripheral wirings is 30 μm or less. More specifically, in a target section of 1000 μm in length extending in one direction of a plurality of peripheral wirings to be measured, five points including both ends of the target section and spaced equally from each other are selected, and optical microscope observation is performed according to the above method. Next, the distance between two adjacent peripheral wirings is measured from the observed image, and the measured values ​​of the five points are arithmetic averaged to calculate the distance S between the peripheral wirings in the target section.

[0122] (Touch detection electrode)

[0123] Figure 3 FIG. 1 is an enlarged plan view showing an example of the structure of the touch detection electrode included in the conductive layer of the touch sensor of the present invention. Figure 3 As shown, the touch detection electrode 11 is composed of a plurality of metal thin wires MW arranged in a grid shape, and functions as a sensor electrode for detecting a so-called touch operation.

[0124] The grid shape refers to a shape including a plurality of openings formed by intersecting metal thin wires MW. The opening is an opening area surrounded by metal thin wires MW. Figure 3 In the touch detection electrode 11 shown, a mesh pattern MP having a rhombus-shaped opening is formed by a plurality of metal thin wires MW. The shape of the mesh pattern of the touch detection electrode is not limited to the rhombus, and may be other shapes.

[0125] As the shape of the grid pattern of the touch detection electrode, for example, triangles such as regular triangles, isosceles triangles and right triangles, squares, rectangles, rhombuses, quadrilaterals such as parallelograms and trapezoids, (regular) n-gons such as (regular) hexagons and (regular) octagons, circles, ellipses, stars, and geometric figures formed by combining these can be cited. In addition, the shape of one side of the opening can be set to a curved shape or an arc shape in addition to being set to a straight line. When set to an arc shape, for example, the two opposing sides can be set to an outwardly convex arc shape, and the other two opposing sides can be set to an inwardly convex arc shape. In addition, the shape of each side can be set to a wavy line formed by a continuous arc convex outwardly and an inwardly convex arc. Of course, the shape of each side can also be set to a sine curve. As a grid pattern, it is not particularly limited, and can be a random pattern, a regular pattern, or a regular grid pattern in which multiple consistent shapes are repeatedly configured.

[0126] As the grid pattern of the touch detection electrode, a regular grid pattern with the same rhombus grid is preferred. In terms of visibility, the length of one side of the rhombus, that is, the length of one side of the opening is preferably 50 to 1500 μm, more preferably 150 to 800 μm, and further preferably 200 to 600 μm. When the length of one side of the opening is within the above range, transparency can be well maintained, and when the touch sensor is mounted on the display surface of the image display device, a display image without a sense of disobedience can be visually recognized.

[0127] In terms of visible light transmittance, the opening ratio of the mesh pattern of the touch detection electrode is preferably 90% or more, and more preferably 95% or more. The opening ratio is equivalent to the area ratio of the openings other than the metal thin wires MW in the area where the touch detection electrode is provided to the area where the touch detection electrode is provided.

[0128] In addition, the mesh pattern of the touch detection electrode can be observed and measured using an optical microscope.

[0129] In terms of better visibility, the line width W of the metal fine wire MW constituting the grid pattern of the touch detection electrode is preferably 10 μm or less, more preferably 5 μm or less, and further preferably 3 μm or less. The lower limit is not particularly limited, but in terms of better conductive properties of the metal fine wire, it is preferably 0.5 μm or more, and more preferably 1 μm or more.

[0130] In the touch sensor according to the present invention, the peripheral wiring includes a plated layer formed on the surface of the substrate and a metal plating layer covering the plated layer.

[0131] Furthermore, it is preferred that the components constituting the conductive layer, such as the touch detection electrodes, electrode connection terminals, and external connection terminals, excluding the peripheral wirings, that is, the entire conductive layer include a plated layer formed on the surface of the substrate and a metal plating layer covering the plated layer.

[0132] (Plated)

[0133] The layer to be plated refers to a layer having a metal plating layer covering the surface thereof formed by performing a plating treatment.

[0134] The conductive layer is formed by the plated layer and the metal plating layer covering the plated layer, so it is preferred that the plated layer be arranged on the surface of the substrate in a pattern corresponding to the shape of the pattern of the target conductive layer. For example, the plated layer arranged in the area where the touch detection electrode is formed preferably has the same grid pattern as the touch detection electrode when the touch detection electrode is in a grid shape, and preferably has the same stripe pattern as the touch detection electrode when the touch detection electrode is in a stripe shape.

[0135] The layer to be plated is not particularly limited as long as a metal plating layer can be formed by plating treatment, and for example, a layer containing an organic component as a main component may be used.

[0136] The term "organic component as the main component" means that the content of the organic component relative to the total mass of the plated layer is more than 50 mass %, preferably 80 mass % or more, more preferably 90 mass % or more. The upper limit is not particularly limited and may be 99.9 mass % or less.

[0137] The layer to be plated preferably contains a plating catalyst.

[0138] As the plating catalyst, an electroless plating catalyst is preferred.

[0139] The electroless plating catalyst is not particularly limited as long as it is an active core for electroless plating treatment, and examples thereof include metals having a catalytic ability for self-catalyst reduction reaction (metals known to have an ionization tendency lower than Ni and capable of being used for electroless plating treatment). Specifically, Pd, Ag, Cu, Pt, Au, and Co can be mentioned.

[0140] As the organic component contained in the layer to be plated, a compound in which the plating catalyst is adsorbed in a compound having a functional group that interacts with the plating catalyst or a precursor thereof (hereinafter also referred to as an "interactive group") is preferred.

[0141] The interactive group refers to a functional group that can interact with the electroplating catalyst or its precursor imparted to the plated layer, for example, a functional group that can form an electrostatic interaction with the electroplating catalyst or its precursor, and a nitrogen-containing functional group, a sulfur-containing functional group and an oxygen-containing functional group that can form a coordination with the electroplating catalyst or its precursor.

[0142] As the interactive group, from the viewpoint of high polarity and high adsorption capacity for the plating catalyst or its precursor, etc., preferably, it is an ionic polar group such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a boric acid group, or a cyano group, and more preferably a carboxylic acid group or a cyano group.

[0143] As the compound having the above-mentioned interactive group, it is preferably a polymer having the interactive group, and more preferably a polymer comprising a repeating unit having the interactive group. That is, the plated layer preferably contains a compound formed by adsorbing the electroplating catalyst in the polymer having the interactive group (more preferably a polymer comprising a repeating unit having the interactive group).

[0144] The thickness of the layer to be plated is not particularly limited, but is preferably 0.05 to 2.0 μm, more preferably 0.1 to 1.0 μm, in terms of being able to sufficiently support the plating catalyst or its precursor and preventing plating abnormalities.

[0145] The line width of the plated layer is appropriately selected depending on whether the conductive layer formed by the plating process constitutes a touch detection electrode, an electrode connection terminal, a peripheral wiring, or the like, or the specific method of the plating process.

[0146] -Method for forming a plated layer-

[0147] The method for forming the layer to be plated is not particularly limited. For example, the following method can be cited: a composition for forming the layer to be plated containing the components contained in the layer to be plated is brought into contact with a substrate to form a precursor layer to be plated, the precursor layer to be plated is subjected to exposure treatment and development treatment to form a patterned layer to be plated, and the obtained layer to be plated is further provided with an electroplating catalyst or its precursor.

[0148] Examples of the composition for forming a layer to be plated include a composition containing the following compound X or composition Y.

[0149] Compound X: Compound with interactive groups and polymerizable groups

[0150] Composition Y: a composition comprising a compound having an interactive group and a compound having a polymerizable group

[0151] Compound X is a compound having an interactive group and a polymerizable group. The definition of the interactive group is as described above.

[0152] The compound X may have two or more types of interactive groups.

[0153] The polymerizable group is a functional group that can form a chemical bond by energy donation, and for example, a free radical polymerizable group and a cationic polymerizable group can be cited. Among them, from the viewpoint of being more excellent in reactivity, a free radical polymerizable group is preferably used. As the free radical polymerizable group, a methacryloyloxy group, an acryloxy group or a styryl group is more preferably used.

[0154] Compound X may have two or more polymerizable groups. Furthermore, the number of polymerizable groups possessed by compound X is not particularly limited, and may be one or two or more.

[0155] The compound X may be a low molecular weight compound or a high molecular weight compound. A low molecular weight compound refers to a compound having a molecular weight of less than 1000, and a high molecular weight compound refers to a compound having a molecular weight (weight average molecular weight when the molecular weight has a distribution) of 1000 or more.

[0156] When the compound X is a polymer, the weight average molecular weight of the polymer is not particularly limited, but is preferably 1,000 to 700,000, more preferably 2,000 to 200,000, in terms of better handling properties such as solubility.

[0157] The method for synthesizing the polymer having such a polymerizable group and an interactive group is not particularly limited, and a known synthesis method can be applied (see paragraphs

[0097] to

[0125] of Japanese Patent Application Laid-Open No. 2009-280905).

[0158] Composition Y is a composition comprising a compound having an interactive group and a compound having a polymerizable group. That is, composition Y comprises both a compound having an interactive group and a compound having a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above.

[0159] The compound having an interactive group may be a low molecular weight compound or a high molecular weight compound. Furthermore, the compound having an interactive group may contain a polymerizable group.

[0160] A preferred embodiment of the compound having an interactive group is a polymer including a repeating unit having an interactive group (eg, polyacrylic acid).

[0161] As a preferred embodiment of the polymer containing repeating units having an interactive group, in terms of easily forming a plated layer with a small amount of energy applied (for example, exposure amount), a polymer X having repeating units derived from a conjugated diene compound and repeating units derived from an unsaturated carboxylic acid or a derivative thereof can be cited.

[0162] The conjugated diene compound is not particularly limited as long as it has a molecular structure having two carbon-carbon double bonds separated by one single bond.

[0163] The repeating unit derived from the conjugated diene compound is preferably a repeating unit derived from a compound having a butadiene skeleton. Examples of the compound having a butadiene skeleton (monomer having a butadiene structure) include 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene, 2-n-propyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1-α-naphthyl-1,3-butadiene, 1-β-naphthyl-1,3-butadiene, 2-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, 1-chloroprene, 2-fluoro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 1,1,2-trichloro-1,3-butadiene, and 2-cyano-1,3-butadiene.

[0164] The content of the repeating unit derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol % based on all the repeating units.

[0165] The content of the repeating unit derived from an unsaturated carboxylic acid or a derivative thereof in the polymer X is preferably 25 to 75 mol% based on all the repeating units.

[0166] The compound having a polymerizable group is a so-called monomer. In terms of the better hardness of the patterned plated layer formed, a polyfunctional monomer having two or more polymerizable groups is preferred. Specifically, the polyfunctional monomer is preferably a monomer having 2 to 6 polymerizable groups. From the perspective of the mobility of the molecules in the cross-linking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 800.

[0167] The composition for forming a layer to be plated may contain components other than the above components.

[0168] For example, the composition for forming a layer to be plated may contain a polymerization initiator. The type of the polymerization initiator is not particularly limited, and a known polymerization initiator (preferably a photopolymerization initiator) may be mentioned.

[0169] The composition for forming the plated layer may contain a solvent. The type of solvent is not particularly limited, and water and an organic solvent may be mentioned. As the organic solvent, known organic solvents (for example, alcohol solvents, ester solvents, ketone solvents, halogen solvents, hydrocarbon solvents, etc.) may be mentioned.

[0170] In the exposure treatment implemented on the precursor layer to be plated, the precursor layer to be plated is irradiated with light in a pattern to obtain a desired patterned plated layer. The type of light used is not particularly limited, and examples thereof include ultraviolet light and visible light. When irradiating light in a pattern, it is preferred to use a mask having an opening of a predetermined shape for irradiation.

[0171] In the exposed portion of the precursor layer to be plated, the polymerizable groups contained in the compounds in the precursor layer to be plated are activated to cause crosslinking between the compounds, and the layer is cured.

[0172] Next, the plated layer precursor layer that has been cured in a pattern is developed to remove unexposed portions, thereby forming a patterned plated layer having a shape corresponding to the conductive layer such as the touch detection electrodes, electrode connection terminals, and peripheral wiring.

[0173] The method of the development treatment is not particularly limited, and an optimal development treatment is performed according to the type of material used. Examples of the developer include organic solvents, pure water, and alkaline aqueous solutions.

[0174] Next, in the formed patterned layer to be plated, a plating catalyst or its precursor is provided to the layer to be plated. Since the layer to be plated has the above-mentioned interactive groups, the plating catalyst or its precursor provided to the layer to be plated is adsorbed to the interactive groups according to the functions of the interactive groups.

[0175] The plating catalyst or its precursor adsorbed to the layer to be plated functions as a catalyst or electrode in the plating treatment described below. Therefore, the type of the plating catalyst or its precursor to be used is appropriately determined according to the type of plating treatment.

[0176] As a method for imparting a plating catalyst or its precursor to a layer to be plated, for example, there can be cited a method of preparing a solution in which a plating catalyst or its precursor is dispersed or dissolved in a solvent and applying the solution to the surface of the layer to be plated, and a method of immersing a substrate with a layer to be plated in the above solution.

[0177] As the electroplating catalyst, an electroless plating catalyst is preferred. The electroless plating catalyst is as described above. As the electroless plating catalyst, a metal colloid can be used.

[0178] The electroless plating catalyst precursor is not particularly limited as long as it is a precursor that becomes an electroless plating catalyst through a chemical reaction, and for example, the ions of the metals cited as the above-mentioned electroless plating catalysts can be cited. The metal ions that serve as the electroless plating catalyst precursor become zero-valent metals that serve as electroless plating catalysts through a reduction reaction. After the metal ions that serve as the electroless plating catalyst precursor are imparted to the patterned plated layer, before being immersed in the electroless plating bath, they can be changed into zero-valent metals and become electroless plating catalysts through other reduction reactions. In addition, the electroless plating catalyst precursor is immersed in the electroless plating bath as it is, and can be changed into a metal (electroless plating catalyst) by the reducing agent in the electroless plating bath.

[0179] Examples of the solvent include water and organic solvents.

[0180] (Metal coating)

[0181] The metal plating layer is a layer formed by subjecting a layer to be plated to a plating treatment.

[0182] As the metal material contained in the metal plating layer, for example, metals such as gold (Au), silver (Ag), copper (Cu) and aluminum (Al) and alloys containing these metals can be cited. Among them, the metal plating layer preferably contains silver or copper, and more preferably contains copper, in terms of excellent conductivity of the conductive layer.

[0183] Examples of the metal plating layer containing copper include a layer composed of copper alone (metallic copper) and a layer composed of a mixture containing copper and a metal other than copper (copper alloy), preferably a layer composed of copper alone. Examples of the metal other than copper contained in the copper alloy include silver, gold, aluminum, nickel, molybdenum, chromium and palladium.

[0184] The metal plating layer is not limited to being composed of a single layer containing a metal, and may be composed of a multilayer structure composed of two or more metal layers having different compositions.

[0185] The metal plating layer preferably does not have a layer containing a compound of a metal and atoms other than a metal, such as a metal oxide.

[0186] The thickness of the metal plating layer and the conductive layer is not particularly limited, but is preferably 0.1 to 5.0 μm, and more preferably 0.2 to 3.0 μm, in terms of lower electrical resistance and better adhesion.

[0187] -Method for forming a metal plating layer-

[0188] The plating method for forming the metal plating layer is not particularly limited, and examples thereof include electroless plating and electrolytic plating (electroplating).

[0189] The method for forming a metal plating layer preferably includes a step of subjecting a layer to be plated provided with an electroplating catalyst or a precursor thereof to electroless plating.

[0190] The metal plating layer may be a layer formed by performing electroless plating alone, or may be a layer formed by performing electroless plating followed by electrolytic plating.

[0191] Furthermore, the plating treatment may be repeated a plurality of times, and in this case, a plating solution containing a different metal may be used in each plating treatment.

[0192] In the plating process, the line width and thickness of the metal plating layer can be adjusted by the composition of the plating solution, the plating temperature, the plating time, and the like.

[0193] Electroless plating is a process in which a solution in which metal ions to be deposited are dissolved is used for electroplating to deposit metal by a chemical reaction.

[0194] As an example of electroless plating treatment, the following method can be cited: first, a substrate having a plated layer provided with a plating catalyst is washed with water, and after removing excess plating catalyst, it is immersed in an electroless plating bath. As the electroless plating bath, a known electroless plating bath can be used.

[0195] The composition of a common electroless plating bath mainly contains metal ions for plating, a reducing agent, and an additive (stabilizer) for improving the stability of the metal ions, in addition to a solvent (e.g., water). In addition to these, the plating bath may also contain known additives such as a stabilizer for the plating bath.

[0196] The organic solvent used in the electroless plating bath must be soluble in water. From this point of view, ketones such as acetone or alcohols such as methanol, ethanol or isopropanol are preferably used. The electroless plating bath contains a metal that depends on the metal plating layer as the target. The reducing agent and additives contained in the electroless plating bath are selected to be optimal according to the above-mentioned metal.

[0197] The immersion time in the electroless plating bath is, for example, about 1 minute to 6 hours, preferably about 1 minute to 3 hours.

[0198] <Method for manufacturing touch sensor>

[0199] The touch sensor according to the present invention can be manufactured by, for example, a manufacturing method including the following steps 1 to 4.

[0200] Step 1: A step of preparing a substrate having a surface water contact angle of 20 to 50°.

[0201] Step 2: A step of forming a patterned layer on the surface of a substrate.

[0202] Step 3: A step of providing a plating catalyst or a precursor thereof to the patterned layer formed on the surface of the substrate.

[0203] Step 4: A step of forming a metal plating layer by subjecting the patterned layer to which the plating catalyst or its precursor has been applied to be plated to a plating treatment.

[0204] As described above, regarding step 1, it is preferable to prepare a substrate with a base layer according to the above-mentioned method for forming a base layer.

[0205] Steps 2 and 3 are preferably performed according to the above-mentioned method for forming the layer to be plated.

[0206] The step 4 is preferably performed according to the above-mentioned method for forming the metal plating layer.

[0207] In addition, if Figure 1 As shown, a touch sensor having conductive layers disposed on both surfaces of a substrate can be manufactured by preparing a substrate having water contact angles of 20 to 50° on both surfaces and forming a plated layer and a metal plated layer according to steps 2 to 4 above.

[0208] During handling and transportation, the touch sensor can be used in the form of a laminate having the touch sensor, and other components such as an adhesive sheet and a release sheet. When the laminate is transported, the release sheet functions as a protective sheet for preventing scratches on the conductive component. In addition, the touch sensor can be handled in the form of a composite having the touch sensor, the adhesive sheet, and the protective layer in this order.

[0209] [Touch panel]

[0210] The touch sensor according to the present invention can be preferably applied to a touch panel.

[0211] As a specific embodiment of the touch panel with a touch sensor involved in the present invention, there can be cited an embodiment including a touch sensor, an image display device arranged on one main surface of the touch sensor, and a cover member arranged on the other main surface of the touch sensor. In the touch panel with this embodiment, a user's finger or a stylus pen etc. in contact with or close to the cover member is detected to detect a touch operation by the user.

[0212] Example

[0213] Hereinafter, the present invention will be described in further detail based on examples.

[0214] Unless departing from the spirit of the present invention, the materials, usage amounts, ratios, processing contents, and processing steps shown in the following examples can be appropriately changed. Therefore, the scope of the present invention should not be interpreted as being limited to the examples shown below.

[0215] (Preparation of base layer forming composition)

[0216] The raw material components used for preparing the base layer forming composition are shown below.

[0217] ·Z913-3: "Z913-3" manufactured by Aica Kogyo Company, weight average molecular weight (Mw): 50,000

[0218] HO-250: "LIGHT ESTER HO-250 (N)" manufactured by Kyoeisha Chemical Co., Ltd., 2-hydroxyethyl methacrylate

[0219] ·FOM-03006: "FOM-03006" manufactured by FUJIFILM Wako Pure Chemical Corporation, a crosslinking compound represented by the following structural formula

[0220] [Chemical formula 1]

[0221]

[0222] OXE-02: "IRGACURE (registered trademark) OXE-02" manufactured by BASF, oxime ester polymerization initiator

[0223] Surfactant A: "Pluronic L-44" manufactured by ADEKA CORPORATION, solid content 100% by mass, nonionic surfactant composed of propylene oxide / ethylene oxide block polymer

[0224] Mixed solvent 1: a mixture of methyl ethyl ketone (MEK) and isopropyl alcohol (IPA) in a volume ratio of 1:3 (MEK:IPA)

[0225] Mixed solvent 2: a mixture of methyl ethyl ketone (MEK) and isopropyl alcohol (IPA) in a volume ratio of 1:1 (MEK:IPA)

[0226] The raw material components were mixed so as to have the contents shown in Table 1 below, and compositions A to H as compositions for forming an underlayer were prepared, respectively.

[0227] For example, 3 parts by mass of "Z913-3", 0.015 parts by mass of "OXE-02", 0.065 parts by mass of surfactant A, and 97 parts by mass of mixed solvent 1 were mixed to prepare composition A.

[0228] [Table 1]

[0229]

[0230] (Preparation of Composition for Forming Layer to be Plated)

[0231] The following components were mixed to obtain a composition for forming a layer to be plated.

[0232] · 38 parts by mass of isopropyl alcohol

[0233] · Polybutadiene maleic acid (butadiene-maleic acid alternating copolymer, repeating units derived from butadiene:repeating units derived from maleic acid = 1:1 (molar ratio), manufactured by PolySciences) 4 parts by mass

[0234] · FAM-201 (difunctional acrylamide, manufactured by FUJIFILM Corporation) 1 part by mass

[0235] IRGACURE OXE02 (oxime ester polymerization initiator, manufactured by BASF) 0.05 parts by mass

[0236] [Example 1]

[0237] (Formation of the basal layer)

[0238] The composition A was applied to one surface of a 50 μm thick polyester film with double-sided adhesive layers (COSMOSHINE (registered trademark) A4360, manufactured by TOYOBO CO., LTD.) by a bar coating method, and the coating was dried at 120° C. to form a 1.2 μm thick base layer precursor layer. The formed base layer precursor layer was irradiated with ultraviolet light at an exposure dose of 500 mJ / cm 2 A substrate having a base layer A containing a cross-linked polymer and a surfactant A was prepared.

[0239] (Production of a plated substrate)

[0240] The above-mentioned composition for forming a plated layer was applied to the surface of the base layer A of the prepared substrate by a rod coating method. At this time, the coating amount of the composition for forming a plated layer was adjusted so that the thickness of the layer after drying was about 0.3 μm. The coating film was dried at a temperature of 120° C. for 1 minute to form a plated layer precursor layer. Immediately after the formation of the plated layer precursor layer, a polypropylene protective film with a thickness of 12 μm was attached to the surface of the plated layer precursor layer.

[0241] will have the same Figure 1 An exposure mask having an exposure pattern corresponding to the touch detection electrodes 11 , the electrode connection terminals 12 , the peripheral wirings 13 , and the external connection terminals 14 is arranged on the substrate with the plated layer precursor attached with a protective film.

[0242] Expose the mask with a high pressure mercury lamp at 30 mJ / cm 2The substrate with the precursor layer to be plated was irradiated with ultraviolet rays. After the ultraviolet rays were irradiated, the protective film was peeled off from the substrate with the precursor layer to be plated. The substrate with the precursor layer to be plated, from which the protective film was peeled off, was spray-washed with a 1% by mass sodium carbonate aqueous solution, thereby performing an alkali development treatment to obtain a substrate with a plated layer.

[0243] The formed plated layer has a shape corresponding to the mesh-shaped touch detection electrodes 11 , the electrode connection terminals 12 , the peripheral wirings 13 , and the external connection terminals 14 .

[0244] (Manufacturing of copper-plated substrate (touch sensor))

[0245] The Pd catalyst imparting liquid "Omnishield 1573 Activator" (manufactured by ROHM AND HAAS ELECTRONIC MATERIALS KK) was diluted with pure water to 4.8% by volume, and the plated substrate was immersed in an aqueous solution adjusted to pH (hydrogen ion index) of 4 with 0.1 predetermined concentration of hydrochloric acid at a temperature of 45° C. for 8 minutes. Then, the plated substrate was washed twice with pure water.

[0246] Next, the plated substrate was immersed in a 0.8 vol% aqueous solution of a reducing agent "CIRCUPOSIT PB Oxide Converter 60C" (manufactured by Dow Chemical Company) at 30°C for 5 minutes. The plated substrate was then washed twice with pure water and subjected to Pd catalyst treatment.

[0247] Next, the substrate with a plated layer treated with a Pd catalyst was immersed in an electroless plating solution obtained by mixing 12% by volume of agent M, 6% by volume of agent A, and 10% by volume of agent B of "CIRCUPOSIT 4500" (manufactured by Dow Chemical Company) for 30 minutes at a temperature of 50° C. Then, the substrate treated with the electroless plating solution was washed with pure water, thereby obtaining a substrate with a copper plated layer having a copper plated layer covering the plated layer (touch sensor).

[0248] like Figure 3 As shown, the obtained touch sensor has a conductive layer including a plurality of touch detection electrodes 11, a plurality of electrode connection terminals 12, a plurality of peripheral wirings 13, and a plurality of external connection terminals 14. In addition, in the obtained touch sensor, the line width L of each peripheral wiring is 35 μm, and the distance S between two adjacent peripheral wirings is 35 μm.

[0249] [Example 2]

[0250] The touch sensor of Example 2 was manufactured in the same manner as Example 1, except that the above-mentioned composition B was used as the composition for forming the base layer to form the base layer B in the base layer forming step and a substrate having the base layer B was used in the preparation step of the substrate with a plated layer.

[0251] [Example 3]

[0252] The touch sensor of Example 3 was manufactured in the same manner as Example 1, except that in the step of forming the base layer, the above-mentioned composition C was used as the composition for forming the base layer to form the base layer C, and in the step of manufacturing the substrate with the plated layer, a substrate having the base layer C was used and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a line width L and a distance S of 30 μm for peripheral wiring was used.

[0253] [Example 4]

[0254] The touch sensor of Example 4 was manufactured in the same manner as Example 1, except that in the step of forming the base layer, the base layer D was formed using the above-mentioned composition D as the base layer forming composition, and in the step of manufacturing the substrate with the plated layer, a substrate having the base layer D was used and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 15 μm was used.

[0255] [Example 5]

[0256] In the manufacturing process of the substrate with a plated layer, an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 10 μm is used. Except for this, the touch sensor of Example 5 is manufactured in the same manner as Example 4.

[0257] [Example 6]

[0258] The touch sensor of Example 6 was manufactured in the same manner as Example 1, except that in the step of forming the base layer, the base layer E was formed using the above-mentioned composition E as the base layer forming composition, and in the step of manufacturing the substrate with the plated layer, a substrate having the base layer E was used and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 15 μm was used.

[0259] [Comparative Example 1]

[0260] The touch sensor of Comparative Example 1 was manufactured in the same manner as in Example 1, except that the composition F was used as the composition for forming the base layer to form the base layer F in the base layer forming step and the substrate having the base layer F was used in the process of manufacturing the substrate with a plated layer.

[0261] [Comparative Example 2]

[0262] The touch sensor of Comparative Example 2 was manufactured in the same manner as in Example 1, except that in the step of forming the base layer, the base layer F was formed using the above-mentioned composition F as the composition for forming the base layer, and in the step of manufacturing the substrate with the plated layer, a substrate having the base layer F was used and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 15 μm was used.

[0263] [Comparative Example 3]

[0264] The touch sensor of Comparative Example 3 was manufactured in the same manner as in Example 1, except that in the step of forming the base layer, the base layer G was formed using the above-mentioned composition G as a composition for forming the base layer, and in the step of manufacturing the substrate with the plated layer, a substrate having the base layer G was used and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 15 μm was used.

[0265] [Comparative Example 4]

[0266] The touch sensor of Comparative Example 4 was manufactured in the same manner as in Example 1, except that the composition H was used as a composition for forming a base layer to form the base layer H in the base layer forming step, and a substrate having the base layer H was used in the substrate manufacturing step with a plated layer, and an exposure mask having an exposure pattern in the shape of a copper plating layer having a conductive pattern with a peripheral wiring having a line width L and a distance S of 15 μm was used.

[0267] [Measurement and evaluation]

[0268] The following measurements and evaluations were performed on the manufactured touch sensors of the respective examples and comparative examples.

[0269] (Water contact angle on the surface of the substrate)

[0270] For the substrates prepared in each embodiment and each comparative example, the water contact angle (unit: °) on the surface of the side where the conductive layer was formed (i.e., the base layer side) was measured. The water contact angle was measured using a contact angle meter ("DM500" manufactured by Kyowa Interface Science Co., Ltd.) according to the above-mentioned sessile drop method.

[0271] Table 2 described below shows the measurement results of the water contact angle on the surface of the substrate in each Example and each Comparative Example.

[0272] (Migration Evaluation)

[0273] In order to evaluate the migration in each touch sensor, a photomask corresponding to the migration test pattern based on IPC-TM650 or SM840 was used instead of the exposure mask used in the above (production of a substrate with a plated layer), and a migration test sample having conductive fine wires composed of a plated layer and a copper plating layer was produced in the same manner as the method described in each embodiment. In addition, the line width and spacing width of the pattern of the conductive fine wires in the migration test sample are the same as the line width L and distance S of each embodiment and each comparative example, and the number of lines is 17 / 18 (hereinafter also referred to as comb pattern electrodes).

[0274] In the above migration test sample, wiring was connected at both ends of the conductive thin wire. Next, as a migration test, the sample was placed in a hot and humid environment of 85°C and 85%RH, and a direct current was continuously passed through the wiring to the conductive thin wire of the sample, thereby applying a voltage of 20V between the two ends of the conductive thin wire.

[0275] After a predetermined time from the start of the test, the sample was taken out from the 85°C 85%RH atmosphere, and the insulation resistance of the conductive thin wire when a direct current voltage of 18 V was applied was measured using a digital ultra-high resistance / micro-ammeter ("R8340A" manufactured by ADVANTEST CORPORATION).

[0276] Based on the time elapsed from the start of the test and the measured value of the insulation resistance of the conductive thin wire, the migration of the conductive thin wire of the sample was evaluated according to the following criteria. The insulation resistance value is 10 10 The longer the time is, the better the migration suppression performance is. In addition, in any of the embodiments and comparative examples, the insulation resistance value of the sample before the start of the test measured by the above method is also 10 10 Ω or more.

[0277] - Migration Evaluation Criteria -

[0278] "A": The insulation resistance value after 1000 hours from the start of the test is 10 10 Ω or more.

[0279] "B": The insulation resistance value after 500 hours from the start of the test is 10 10 Ω or more, but the insulation resistance value after 1000 hours is less than 10 10 Ω.

[0280] "C": The insulation resistance value after 500 hours from the start of the test is less than 10 10 Ω.

[0281] (Conductivity evaluation)

[0282] Ten peripheral wirings were randomly selected from one touch sensor manufactured in each embodiment and comparative example, and the resistance between both ends of the selected peripheral wirings was measured. Peripheral wirings with a measured resistance value of 1 kΩ or more were judged as "defective wirings" and their number was counted.

[0283] For each embodiment and comparative example, 50 touch sensors manufactured by the same method were measured and judged according to the above method, and the defective generation rate was calculated from the ratio of the number of defective wirings to the total number of peripheral wirings measured. The conductivity of the touch sensor was evaluated based on the following criteria from the obtained defective generation rate.

[0284] -Continuity Evaluation Standards-

[0285] "A": The defective generation rate is 0.5% or less.

[0286] "B": The defective generation rate is more than 0.5% and less than 1.0%.

[0287] "C": The defective generation rate is more than 1.0% and less than 1.5%.

[0288] "D": The defective generation rate is more than 1.5% and less than 2.0%.

[0289] "E": The defective generation rate exceeds 2.0%.

[0290] Table 2 shows the structure of each touch sensor and each evaluation result.

[0291] [Table 2]

[0292]

[0293] From the results in Table 2, it was confirmed that the touch sensor of the present invention suppressed the decrease in conductivity in the peripheral wiring and suppressed the occurrence of migration.

[0294] From the comparison of Examples 1 to 5, it is confirmed that when the water contact angle of the substrate is 40° or less, the conductivity of the peripheral wiring is better, when the water contact angle of the substrate is 35° or less, the conductivity of the peripheral wiring is further better, and when the water contact angle of the substrate is 30° or less, the conductivity of the peripheral wiring is particularly excellent.

[0295] Furthermore, from the comparison between Example 4 and Example 6, it was confirmed that when the water contact angle of the substrate was 25° or more, the performance of suppressing the migration of the peripheral wiring was more excellent.

[0296] Explanation of symbols

[0297] 1-substrate, 1A, 1B-surface, 2-first conductive layer, 3-second conductive layer, 11, 21-touch detection electrodes, 12, 22-electrode connection terminals, 13, 23-peripheral wiring, 14, 24-external connection terminals, L-line width, MW-metal fine wire, MP-pattern, R1-detection area, R2-peripheral area, S-distance.

Claims

1. A touch sensor comprising a substrate and a conductive layer formed on a surface of the substrate, The conductive layer has: The touch detection electrode is composed of a plurality of metal thin wires arranged in a grid pattern; an electrode connection terminal electrically connected to the touch detection electrode; and peripheral wiring, electrically connected to the electrode connection terminal, The peripheral wiring has a plated layer and a metal plating layer covering the plated layer. The water contact angle of the surface of the substrate is 20 to 50°.

2. The touch sensor according to claim 1, wherein: The substrate contains a surfactant.

3. The touch sensor according to claim 2, wherein: The surfactant is a nonionic surfactant.

4. The touch sensor according to claim 3, wherein: The water contact angle of the surface of the substrate is 20 to 40 degrees.

5. The touch sensor according to claim 1, wherein: There are multiple peripheral wirings. In at least a portion of a region on the surface of the substrate where the peripheral wiring is arranged, the peripheral wiring extends in a first direction, is arranged in a second direction perpendicular to the first direction, and a distance S between two adjacent peripheral wirings is 30 μm or less.

6. The touch sensor according to claim 5, wherein: There are multiple peripheral wirings. In at least a portion of a region on the surface of the substrate where the peripheral wiring is arranged, the peripheral wiring extends in a first direction, is arranged in a second direction perpendicular to the first direction, and a distance S between two adjacent peripheral wirings is 15 μm or less. 7 . A touch panel comprising the touch sensor according to claim 1 .

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