Thermistor assembly, temperature sensor and manufacturing method thereof

Abstract

A thermistor assembly (110) includes: a thermistor (111); two guide parts (112) having rigidity; and a first resin part (113) in which the first end parts (1121) of the two guide members (112) are connected to the thermistor (111), and the thermistor (111) is sealed by the first resin part (113).

Description

Technical Field

[0001] The invention relates to a thermistor component, a temperature sensor and a manufacturing method thereof. Background Art

[0002] There is a temperature sensor using a thermistor. As a manufacturing method of such a temperature sensor, there is a method of injecting a filling resin into a protective case and then inserting a thermistor assembly including a thermistor and a lead wire into the filling resin in the protective case.

[0003] As a thermistor assembly, a thermistor sealed in glass is known (see Patent Document 1). According to the thermistor assembly by sealing the thermistor in glass, Dumet wires having a thermal expansion coefficient close to that of glass are used as lead wires.

[0004] [Citation List]

[0005] [Patent Document]

[0006] [Patent Document 1] JP 6405074B Summary of the invention

[0007] [Technical issues]

[0008] The Dumet wire is soft and may bend when the thermistor assembly is inserted into the filling resin, making it difficult to accurately position it relative to the thermistor's protective housing.

[0009] Therefore, a solution is provided in which a lead wire having rigidity is further connected to a Dumet wire, the glass and the Dumet wire sealed with the thermistor are sealed with a sealing resin, and then the thermistor assembly is inserted into the filling resin. The sealing resin is formed by dipping, and the shape and size of the sealing resin are unstable. In this case, although the lead wire is not bent, it is difficult to accurately position the thermistor relative to the protective housing due to the instability of the shape and size of the sealing resin.

[0010] It is therefore an object of the present invention to provide a temperature sensor in which the thermistor is accurately positioned relative to the housing.

[0011] [Solution to the problem]

[0012] In order to solve the above technical problems, a thermistor assembly according to an embodiment of the present invention includes: a thermistor; two guide components with rigidity; and a first resin portion, wherein first ends of the two guide components are connected to the thermistor, and the thermistor is sealed by the first resin portion.

[0013] A temperature sensor according to an embodiment of the present invention includes: the above-mentioned thermistor assembly; a housing having an accommodation area opened in a second direction; and a second resin part, wherein the second resin part is arranged in the accommodation area to seal the first resin part.

[0014] A method for manufacturing a thermistor assembly according to an embodiment of the present invention includes: a connecting step of connecting a thermistor to first ends of two guide members having rigidity; and a molding step of molding a first resin portion by transfer molding so that the thermistor is sealed by the first resin portion.

[0015] A manufacturing method according to an embodiment of the present invention is a manufacturing method for manufacturing a temperature sensor, comprising: a connecting step of connecting a thermistor to first ends of two guide members having rigidity; a molding step of molding a first resin portion by transfer molding so that the thermistor is sealed by the first resin portion; an injecting step of injecting resin into a housing area of ​​a housing; an inserting step of inserting a thermistor assembly into the resin so that the first resin portion is sealed by the resin injected into the housing area of ​​the housing; and a curing step of curing the resin.

[0016] [Effects of the invention]

[0017] According to the present invention, it is possible to provide a temperature sensor in which a thermistor is accurately positioned relative to a housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a view showing a temperature sensor according to an embodiment of the present invention.

[0019] Figure 2 is a front view of the temperature sensor 100 .

[0020] Figure 3 It is along Figure 2 2 is a cross-sectional view of the temperature sensor 100 at section AA.

[0021] Figure 4 It is along Figure 2 Section BB is a cross-sectional view of the temperature sensor 100 .

[0022] Figure 5 It is along Figure 2 1 is a cross-sectional view of the temperature sensor 100 with section CC.

[0023] Figure 6 is a view showing the thermistor assembly 110 .

[0024] Figure 7 1 is a view for describing the relationship between the thermistor 111 and the two guide members 112 .

[0025] Figure 8 is a view showing another example of the thermistor assembly 110 .

[0026] Fig. 9 is a view showing the relationship between the guide member 112 and the second resin portion 130 .

[0027] Fig.10 is a view showing an example of a method of manufacturing the temperature sensor 100 .

[0028] Reference Mark List

[0029] 100 Temperature Sensor

[0030] 110 Thermistor Assembly

[0031] 111 Thermistor assembly 110 Thermistor

[0032] 112 guide member of thermistor assembly 110

[0033] 1121 first end portion of the guide member 112

[0034] 1122 A second end portion of the guide member 112

[0035] 1123 first guide portion of the guide member 112

[0036] 1124 second guide portion of the guide member 112

[0037] 113 The first resin portion of the thermistor assembly 110

[0038] 120 Shell

[0039] 121 first guide portion of the housing 120

[0040] 122 second guide portion of the housing 120

[0041] 123 Insertion port of housing 120

[0042] 130 Second resin part

[0043] 140 Lead

[0044] 150 Connecting parts

[0045] 151 hole of connecting component 150 DETAILED DESCRIPTION

[0046] <Temperature sensor 100>

[0047] Figure 1 is a view showing a temperature sensor 100 according to an embodiment of the present invention. Figure 2 is a front view of the temperature sensor 100, Figure 3 is shown along Figure 2 A cross-sectional view of the temperature sensor 100 in section AA, Figure 4 is shown along Figure 2 A cross-sectional view of the temperature sensing device 100 in section BB, and Figure 5 It is shown along Figure 2 FIG. 1 is a cross-sectional view of the temperature sensor 100 at section CC. Figure 1 , the upper direction is the Z direction, and the two directions orthogonal to the Z direction are the X direction and the Y direction.

[0048] The temperature sensor 100 includes a thermistor assembly 110 , a housing 120 , and a second resin portion 130 .

[0049] Figure 6 1 is a view showing the thermistor assembly 110. The thermistor assembly 110 includes a thermistor 111, two guide members 112, and a first resin portion 113.

[0050] The thermistor 111 is a resistor whose resistance value varies according to temperature, such as a negative temperature coefficient (NTC) thermistor and a positive temperature coefficient (PTC) thermistor, for example. The thermistor 111 is, for example, a chip type thermistor.

[0051] Each of the two guide members 112 includes a first end 1121 and a second end 1122, and the first end 1121 of the guide member 112 is connected to the thermistor 111. Figure 7 As shown, a thermistor 111 is connected to two guide members 112 between them. Figure 7 is a view for describing the relationship between the thermistor 111 and the two guide members 112, and Figure 7 In FIG. 1 , only the thermistor 111 and two guide members 112 are shown.

[0052] The first end portion 1121 of the guide member 112 and the thermistor 111 are connected to each other by, for example, welding or soldering. The guide member 112 extends from the first end portion 1121 connected to the thermistor 111 in the first direction (Z direction).

[0053] The guide member 112 has rigidity, that is, its rigidity is high, for example Figure 3 , Figure 6 and Figure 7As shown, it is a metal plate (e.g., a guide frame). The guide member 112 may be a metal rod, and may be configured to include both a metal plate portion and a metal rod portion. The thickness of the metal plate is equal to or greater than the first thickness, and the size of the metal rod may be appropriately set to be equal to or greater than the first radius. The first thickness and the first radius are appropriately set so that the thermistor assembly 110 does not bend when inserted into the second resin portion 130.

[0054] like Figure 4 and Figure 6 As shown, the first resin portion 113 seals the thermistor 111 to protect the thermistor 111. Figure 4 and Figure 6 As shown, in the guide member 112, the first end portion 1121 connected to the thermistor 111 is sealed by the first resin portion 113. Figure 6 As shown, the second end portion 1122 of the guide member 112 is not sealed by the first resin portion 113 , but exists outside the first resin portion 113 .

[0055] The first resin portion 113 is a resin and is formed by transfer molding. That is, the thermistor assembly 110 is manufactured by placing a thermistor 111 connected to a guide member 112 in a mold cavity, then press-fitting a heated and softened resin into the cavity, and curing the resin pressed into the cavity.

[0056] As described above, according to the present embodiment, the first resin portion 113 is molded by transfer molding, and thus has high rigidity. In addition, according to the present embodiment, the guide member 112 has rigidity, and the thermistor 110 as a whole has rigidity.

[0057] The second end 1122 of the guide member 112 is connected to the lead 140. Figure 6 In addition, the second end 1122 of the guide member 112 may be in the shape of a connector, such as Figure 8 shown.

[0058] like Figure 1 and Figures 3 to 5 As shown, the housing 120 has a receiving area CA, and the receiving area CA is open in the second direction (X direction). The thermistor assembly 110 is received in the receiving area CA of the housing 120.

[0059] The second resin portion 130 is a resin and is arranged in the accommodation area CA of the housing 120 to seal the first resin portion 113. Figure 3 and Figure 4 When the lead wire 140 is connected to the second end portion 1122 of the guide member 112, for example, Figure 3As shown, the second resin portion 130 is arranged in the accommodating area CA of the housing 120 to seal the entire thermistor assembly 110. In addition, in the case where the second end portion 1122 of the guide member 112 is in the shape of a connector, as shown in FIG. Fig. 9 As shown, the second resin portion 130 is arranged in the accommodation area CA of the housing 120 such that the connector-shaped portion is located outside the second resin portion 130 . Fig. 9 is a view showing the relationship between the guide member 112 and the second resin portion 130 .

[0060] For example, before curing, the second resin part 130 is injected into the accommodation area CA of the housing 120. Then, the thermistor assembly 110 is inserted into the second resin part 130 injected into the accommodation area CA of the housing 120, so that the first resin part 113 is sealed by the second resin part 130. Then, the second resin part 130 is cured in a state where the first resin part 113 is sealed.

[0061] According to the present embodiment, as described above, in the present embodiment, the thermistor assembly 110 has rigidity as a whole. Therefore, according to the present embodiment, when the thermistor assembly 110 is inserted into the second resin portion 130, the thermistor 11 can be accurately positioned relative to the housing 120 without bending the thermistor assembly 110. As a result, a temperature sensor in which the thermistor is accurately positioned relative to the housing can be provided.

[0062] At this time, if Figure 3 As shown, the guide member 112 and the housing 120 include first guide portions 1123 and 121, respectively, and the first guide portions 1123 and 121 are used to position the thermistor 111 relative to the housing 120 in a first direction (Z direction). Figure 3 In the example shown, the first guide portion 1123 of the guide member 112 is a surface facing the opposite direction (-Z direction) of the first direction, and the first guide portion 121 of the housing 120 is a surface facing the first direction (Z direction). The thermistor assembly 110 is fixed to the housing 120 so that the two surfaces are in contact with each other, thereby being able to accurately position the thermistor 111 relative to the housing 120 in the first direction (Z direction).

[0063] In addition, if Figure 5 As shown, the guide member 112 and the housing 120 may further include second guide portions 1124, 122, respectively, and the second guide portions 1124, 122 are used to position the thermistor 111 relative to the housing 120 in a plane orthogonal to the first direction. Figure 5In the example shown, the second guide portion 122 of the housing 120 is a groove extending from the accommodating area CA in the second direction (X direction) and in the opposite direction of the second direction (-X direction), and the second guide portion 1124 of the guide member 112 is a portion of the guide member 112 that fits into the groove. Figure 5 In the example shown, the thickness of the groove is set so that the guide member 112 contacts the bottom of the groove, and the width of the groove in the third direction (Y direction) is set to be equal to the thickness of the guide member 112 in the third direction. Figure 5 In the illustrated example, the thermistor 111 can be accurately positioned relative to the housing 120 on a plane orthogonal to the first direction (Z direction).

[0064] The temperature sensor 100 may further include a connection member 150. The connection member 150 is a member for connecting with a measurement target of the temperature sensor 100. Therefore, the housing 120 includes an insertion port 123 for inserting the connection member 150, and the connection member 150 is inserted into the insertion port 123.

[0065] For example, the connection component 150 is a component having high thermal conductivity. When the connection component 150 is connected to the measurement target, the temperature of the connection component 150 becomes the same as the temperature of the measurement target. In addition, the connection component 150 is a conductor. In the case where the measurement target is a conductor through which current flows, when the connection component 150 is connected to the measurement target, the current flowing through the measurement target flows through the connection component 150, and the temperature of the connection component 150 becomes the same as the temperature of the measurement target.

[0066] For example, the connection member 150 has a hole 151. At this time, the connection member 150 is inserted into the insertion hole 123 of the housing 120 so that the thermistor 111 is positioned in the hole 151. In this way, the thermistor 111 is surrounded by the connection member 150 and is not affected by the temperature of other components, so that the temperature of the connection member 150 (that is, the temperature of the measurement target) can be measured with appropriate accuracy. The hole 151 is, for example, a through hole.

[0067] <Method of Manufacturing Temperature Sensor 100>

[0068] Fig.10 1 is a diagram showing an example of a method for manufacturing the temperature sensor 100. Fig.10 In the manufacturing method shown, the thermistor assembly 110 is first manufactured, and then the temperature sensor 100 is manufactured using the manufactured thermistor assembly 110 .

[0069] The thermistor 111 is connected to the first end portions 1121 of the two guide members 112 (connection step, step S1001). Then, the first resin portion 113 is molded by transfer molding (molding step, step S1002), so that the thermistor 111 is sealed by the first resin portion 113. The thermistor assembly 110 is manufactured by these connection steps (step S1001) and molding steps (step S1102).

[0070] After that, resin is injected into the accommodation area CA of the housing 120 (injection step, step S1003 ). The injected resin is the resin of the second resin portion 130 before being cured.

[0071] Then, the thermistor assembly 110 is inserted into the resin (insertion step, step S1004) so ​​that the first resin portion 113 is sealed by the resin injected into the accommodating area CA of the housing 120. At this time, the thermistor assembly 110 is inserted so that the first guide portion 1123 of the guide member 112 is in contact with the first guide portion 121 of the housing 120. In this way, the thermistor 111 is accurately positioned relative to the housing 120 in the first direction (Z direction). In addition, the thermistor assembly 110 is inserted so that the second guide portion 1124 of the guide member 112 is fitted into the groove (second guide portion 122) of the housing 120. In this way, the thermistor 111 is accurately positioned relative to the housing 120 on a plane orthogonal to the first direction (Z direction).

[0072] Finally, the resin injected into the accommodating area CA of the housing 120 is cured (curing step, step S1005). In this way, the resin injected into the accommodating area CA of the housing 120 is cured and arranged in the accommodating area CA of the housing 120, so that the first resin portion 113 is sealed by the second resin portion 130, and the temperature sensor 100 is completed.

[0073] Note that the above-described embodiment only illustrates typical aspects of the present invention, and the present invention is not limited to this embodiment. That is, various modifications can be made without departing from the spirit of the present invention. Of course, as long as these modifications still have structure according to the present invention, they are included in the scope of the present invention.

Claims

1. A thermistor assembly (110), comprising: Thermistor (111); Two rigid guide members (112); as well as a first resin portion (113), The first ends (1121) of the two guide components (112) are connected to the thermistor (111), and The thermistor (111) is sealed by the first resin portion (113).

2. The thermistor assembly (110) according to claim 1, wherein: Each of the two guide components (112) is a metal plate.

3. The thermistor assembly (110) according to claim 1 or 2, wherein: The first resin portion (113) is molded by transfer molding.

4. The thermistor assembly (110) according to claim 1, wherein: Each of the two guide components (112) is provided with a second end portion (1122), and the lead wire is connected to the second end portion (1122) of the corresponding guide component (112).

5. The thermistor assembly (110) according to claim 1, wherein: The second end portion (1122) of each of the two guide members (112) is in the shape of a connector.

6. A temperature sensor (100), comprising: The thermistor assembly (110) according to claim 1; A housing (120) having a receiving area (CA) opened in a second direction (X); as well as The second resin portion (130), Wherein, the second resin portion (130) is arranged in the accommodation area (CA) to seal the first resin portion (113).

7. The temperature sensor (100) according to claim 6, further comprising a connecting component (150) for connecting to a measurement target, in, The connecting member (150) comprises a hole (151), The housing (120) includes an insertion port (123) for inserting the connecting component (150), and The connecting component (150) is inserted into the insertion port (123) of the housing (120), so that the thermistor (111) is positioned in the hole (151).

8. The temperature sensor (100) according to claim 7, wherein: The guide component (112) and the housing (120) respectively have a first guide portion (121), and the first guide portion (121) is used to position the thermistor (111) relative to the housing (120) in the first direction (Z).

9. A method for manufacturing a thermistor assembly (110), comprising: A connecting step of connecting the thermistor (111) to first ends (1121) of two rigid guide members (112); as well as A molding step is performed by transfer molding to mold the first resin portion (113) so that the thermistor (111) is sealed by the first resin portion (113).

10. A method for manufacturing a temperature sensor (100), comprising: A connecting step of connecting the thermistor (111) to first ends (1121) of two rigid guide members (112); a molding step of molding the first resin portion (113) by transfer molding so that the thermistor (111) is sealed by the first resin portion (113); an injection step of injecting resin into the receiving area (CA) of the housing (120); an inserting step of inserting the thermistor assembly (110) into the resin so that the first resin portion (113) is sealed by the resin injected into the accommodating area (CA) of the housing (120); as well as The curing step is to cure the resin.

Images