Semiconductor chip packaging defoaming system and defoaming method

Abstract

The invention discloses a semiconductor chip packaging defoaming system and defoaming method in the technical field of chip packaging, the semiconductor chip packaging defoaming system comprises a substrate, a chip and a welding spot, and further comprises a vacuum box, and the substrate, the chip and the welding spot are arranged in the vacuum box; the filling mechanism is arranged in the vacuum box, and the filling mechanism is used for injecting a circle of insulating glue for blocking the gap between the substrate and the chip into the gap between the substrate and the chip after the vacuum box is vacuumized; according to the invention, the substrate and the chip are switched under vacuum and atmospheric pressure, so that the insulating glue can be actively sucked into the gap between the substrate and the chip, and the insulating glue can be effectively sucked into the gap because no air exists in the gap and the insulating glue under the vacuum environment and the air is blocked by the insulating glue at the outer layer under the atmospheric pressure. Therefore, air cannot enter the gap and the insulation paste sucked into the gap, and no bubble is generated in the insulation paste filled in the gap.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a semiconductor chip packaging debubbling system and a debubbling method. Background Art

[0002] During the semiconductor chip packaging process, after the chip and the substrate are welded, the gap between the chip and the substrate needs to be filled with insulating glue to increase the stability of the semiconductor chip. After the insulating glue is filled, in order to prevent the bubbles that enter the insulating glue during the filling process from interfering with the working process of the semiconductor chip, the semiconductor chip needs to be defoamed to remove the bubbles in the insulating glue.

[0003] The traditional packaging debubbling method is to remove the bubbles in the insulating glue through debubbling equipment after filling with insulating glue. This method is difficult to completely remove the bubbles in the insulating glue, and special debubbling equipment needs to be added after the insulating glue is filled. The semiconductor chip needs to be transported, which reduces the production efficiency of the semiconductor chip. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor chip packaging debubbling system and debubbling method to solve the problem of traditional packaging debubbling method proposed in the above background technology, which is to remove the bubbles in the insulating glue through debubbling equipment after the insulating glue is filled. This method is difficult to completely remove the bubbles in the insulating glue, and special debubbling equipment needs to be added after the insulating glue is filled. The semiconductor chip needs to be transported, which reduces the production efficiency of the semiconductor chip.

[0005] To achieve the above object, the present invention provides the following technical solution: a semiconductor chip packaging debubbling system, comprising a substrate, a chip and a solder joint, and also comprising a vacuum box, wherein the substrate, the chip and the solder joint are arranged in the vacuum box;

[0006] The filling mechanism is arranged in the vacuum box and is used to inject a circle of insulating glue to seal the gap between the substrate and the chip after the vacuum box is evacuated.

[0007] As a further solution of the present invention, the filling mechanism includes a driving device, a rectangular injection tube is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube to engage with the side wall of the chip, an injection port is opened at the lower end of the inner wall of the rectangular injection tube, the injection port is used to inject insulating glue, and a material storage mechanism is arranged at the upper end of the rectangular injection tube, the material storage mechanism is used to inject insulating glue into the rectangular injection tube or suck the insulating glue out of the rectangular injection tube.

[0008] As a further solution of the present invention, the driving device includes a mounting plate, the upper end of the mounting plate is fixedly connected to the upper end of the vacuum box, the lower end of the mounting plate is longitudinally slidingly connected to the first driving block, the lower end of the first driving block is transversely slidingly connected to the second driving block, the lower end of the second driving block is rotatably connected to a driving telescopic rod, the lower end of the driving telescopic rod is fixedly connected to the upper end of the rectangular injection tube, the first driving block, the second driving block and the driving telescopic rod are each equipped with a driving unit, and the driving unit is respectively used to drive the first driving block to move longitudinally, drive the second driving block to move transversely, and drive the driving telescopic rod to rotate and extend.

[0009] As a further solution of the present invention, the storage mechanism is connected to a liquid pump inside and outside, and the liquid pump is used to pump out the insulating glue.

[0010] As a further solution of the present invention, the material storage mechanism includes a first material storage box, a second material storage box is mounted on the outside of the first material storage box, the first material storage box and the second material storage box are both fixedly connected to the upper end of the rectangular injection tube, a partition plate is arranged inside the rectangular injection tube, the partition plate divides the rectangular injection tube into two layers of independent pipes inside and outside, the upper ends of the two layers of independent pipes inside and outside are fixedly connected to the lower ends of the first material storage box and the second material storage box respectively, and the first material storage box and the second material storage box are both externally connected to liquid pumps.

[0011] As a further solution of the present invention, a connecting pipe is fixedly connected to the upper end of the first storage box, the upper end of the connecting pipe passes through the upper end of the second storage box, a through hole is vertically penetrated through the upper end of the second storage box, and a filter is fixedly connected to the inner wall of the upper end of the connecting pipe and the inner wall of the through hole, and the filter is used to block the insulating glue.

[0012] As a further solution of the present invention, a sealing block is fixedly connected to the inner wall of the inner cavity of the rectangular injection tube, and the lower end of the sealing block is transmission-connected to a driving rod. A motor is embedded inside the sealing block, and the motor is used to drive the driving rod to perform vertical displacement. The lower end of the driving rod is fixedly connected to a baffle.

[0013] A semiconductor chip packaging defoaming method, the method is as follows:

[0014] S1. First, place the substrate and chip that have completed thermal compression bonding into a fixed position in a vacuum box;

[0015] S2. Then, the vacuum box is closed and started, so that the substrate and chip in the vacuum box are in a vacuum environment.

[0016] S3, then, a circle of insulating glue is injected into the gap between the substrate and the chip through a filling mechanism to seal the gap;

[0017] S4. Finally, the vacuum box is closed to restore the normal air pressure in the vacuum box, so that the insulating glue at the gap between the substrate and the chip enters between the substrate and the chip under atmospheric pressure to complete the filling of the insulating glue.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention switches the substrate and the chip under vacuum and atmospheric pressure, so that the gap between the substrate and the chip can actively absorb the insulating glue into the gap. In addition, because there is no air in the gap and the insulating glue under the vacuum environment, and at the same time, under atmospheric pressure, the air is blocked by the outer layer of insulating glue, so that the air cannot enter the gap and the insulating glue absorbed into the gap, thereby preventing bubbles from being generated in the insulating glue filled in the gap.

[0020] 2. The present invention injects insulating glue through an injection port located at the gap and keeps it beside the gap, so that there is enough insulating glue beside the gap to block the air, further avoiding the generation of bubbles in the gap.

[0021] 3. The present invention forms two channels between the inner wall of the rectangular injection tube and the side wall of the chip and between the lower end of the rectangular injection tube and the upper end of the substrate, so that when the liquid pump sucks, its suction force can be concentrated, and then the insulating glue outside the gap is sucked into the rectangular injection tube, completing the cleaning of the insulating glue, thereby ensuring the production quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic cross-sectional view of the overall structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the present invention after removing the vacuum box and the driving device;

[0025] Figure 4 for Figure 3 Schematic diagram of the cross-section structure;

[0026] Figure 5 for Figure 4 A schematic diagram of the structure enlargement in the middle;

[0027] Figure 6 for Figure 3 A schematic diagram of the structure after removing the first storage box and the second storage box;

[0028] Figure 7 for Figure 6 Schematic diagram of the top-down structure;

[0029] Figure 8 It is a schematic diagram of the method flow of the present invention.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] Substrate 11, chip 12, solder joint 13, vacuum box 14, rectangular injection tube 22, injection port 23, mounting plate 24, first drive block 25, second drive block 26, drive telescopic rod 27, first material storage box 41, second material storage box 42, partition plate 43, sealing block 51, drive rod 52, baffle 53, connecting pipe 61, filter screen 62. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 8 , the present invention provides a technical solution: a semiconductor chip packaging degassing system, comprising a substrate 11, a chip 12 and a solder joint 13, and also comprising a vacuum box 14, wherein the substrate 11, the chip 12 and the solder joint 13 are arranged in the vacuum box 14;

[0034] The filling mechanism is arranged in the vacuum box 14 . The filling mechanism is used to inject a circle of insulating glue to seal the gap between the substrate 11 and the chip 12 after the vacuum box 14 is evacuated.

[0035] The substrate 11 and chip 12 that have completed the thermocompression bonding are placed in a fixed position in the vacuum box 14 (in actual use, the welding device can be integrated into the vacuum box 14 to reduce the transfer of workpieces), and then the vacuum box 14 is closed and started, so that the substrate 11 and the chip 12 in the vacuum box 14 are in a vacuum environment, and then a circle of insulating glue to seal the gap is injected into the gap between the substrate 11 and the chip 12 through the filling mechanism; then the vacuum box 14 is closed to restore the normal air pressure in the vacuum box 14, and further, the insulating glue in the gap between the substrate 11 and the chip 12 enters between the substrate 11 and the chip 12 under atmospheric pressure to complete the filling of the insulating glue.

[0036] The present invention switches the substrate 11 and the chip 12 between vacuum and atmospheric pressure, so that the gap between the substrate 11 and the chip 12 can actively absorb the insulating glue into the gap. In addition, because there is no air in the gap and the insulating glue under the vacuum environment, and at the same time, under atmospheric pressure, the air is blocked by the outer layer of insulating glue, so that the air cannot enter the gap and the insulating glue absorbed into the gap, thereby preventing bubbles from being generated in the insulating glue filled in the gap.

[0037] As a further solution of the present invention, the filling mechanism includes a driving device, a rectangular injection tube 22 is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube 22 to engage with the side wall of the chip 12, an injection port 23 is opened at the lower end of the inner wall of the rectangular injection tube 22, the injection port 23 is used to inject insulating glue, and a storage mechanism is arranged at the upper end of the rectangular injection tube 22, the storage mechanism is used to inject insulating glue into the rectangular injection tube 22 or suck the insulating glue out of the rectangular injection tube 22.

[0038] After the vacuum box 14 is evacuated, the driving device drives the rectangular injection tube 22 to move, so that the lower end of the rectangular injection tube 22 fits with the upper end of the substrate 11, and the inner wall of the rectangular injection tube 22 is aligned with the side wall of the chip 12, and then the injection port 23 of the rectangular injection tube 22 injects the insulating glue, and further, the insulating glue is accumulated between the injection port 23 located at the gap and the side wall of the chip 12, and then the vacuum box 14 is closed to allow air to enter the vacuum box 14, and further, the air squeezes the insulating glue accumulated in the gap into the gap.

[0039] In the present invention, the insulating glue is injected through the injection port 23 located at the gap and stays beside the gap, so that there is enough insulating glue beside the gap to block the air, further avoiding the generation of bubbles in the gap.

[0040] As a further solution of the present invention, the driving device includes a mounting plate 24, the upper end of the mounting plate 24 is fixedly connected to the upper end of the vacuum box 14, the lower end of the mounting plate 24 is longitudinally slidably connected to the first driving block 25, the lower end of the first driving block 25 is transversely slidably connected to the second driving block 26, the lower end of the second driving block 26 is rotatably connected to the driving telescopic rod 27, the lower end of the driving telescopic rod 27 is fixedly connected to the upper end of the rectangular injection tube 22, the first driving block 25, the second driving block 26 and the driving telescopic rod 27 are all built-in with a driving unit, and the driving unit is respectively used to drive the first driving block 25 to move longitudinally, drive the second driving block 26 to move transversely, and drive the driving telescopic rod 27 to rotate and extend.

[0041] The driving unit drives the first driving block 25 to move longitudinally, the second driving block 26 to move laterally, and the telescopic rod 27 to rotate according to the position of the chip 12, so that the inner side of the rectangular injection tube 22 is aligned with the chip 12, and then drives the telescopic rod 27 to extend so that the inner side of the rectangular injection tube 22 is engaged with the chip 12. During the process, the lower end of the rectangular injection tube 22 will not squeeze the upper end of the chip 12.

[0042] As a further solution of the present invention, the storage mechanism is connected to a liquid pump inside and outside, and the liquid pump is used to pump out the insulating glue.

[0043] After the insulating glue in the gap is filled into the gap under the action of air pressure, the liquid pump is started so that the insulating glue accumulated on the outside of the gap at the injection port 23 is sucked into the storage mechanism through the rectangular injection tube 22 by the liquid pump. In this process, since the gap between the substrate 11 and the chip 12 is small and there is no gas in the gap, the insulating glue in the gap will not be sucked out, and the insulating glue between the inner wall of the rectangular injection tube 22 and the side wall of the chip 12 will be sucked into the rectangular injection tube 22, and the insulating glue between the lower end of the rectangular injection tube 22 and the upper end of the substrate 11 will be sucked into the rectangular injection tube 22.

[0044] The present invention forms two channels between the inner wall of the rectangular injection tube 22 and the side wall of the chip 12 and between the lower end of the rectangular injection tube 22 and the upper end of the substrate 11, so that when the liquid pump sucks, its suction force can be concentrated, and then the insulating glue outside the gap is sucked into the rectangular injection tube 22, completing the cleaning of the insulating glue, thereby ensuring the production quality of the product.

[0045] As a further solution of the present invention, the material storage mechanism includes a first material storage box 41, a second material storage box 42 is mounted on the outside of the first material storage box 41, the first material storage box 41 and the second material storage box 42 are both fixedly connected to the upper end of the rectangular injection tube 22, a partition plate 43 is arranged inside the rectangular injection tube 22, the partition plate 43 divides the rectangular injection tube 22 into two layers of independent pipes inside and outside, the upper ends of the two layers of independent pipes are fixedly connected to the lower ends of the first material storage box 41 and the second material storage box 42 respectively, and the first material storage box 41 and the second material storage box 42 are both externally connected to liquid pumps.

[0046] The first storage box 41 and the second storage box 42 respectively inject and absorb insulating glue alternately toward the injection port 23 through two independent inner and outer pipes, so that when an independent pipe and its corresponding storage box inject insulating glue in a vacuum environment, the other set of independent pipes and its corresponding storage box can discharge bubbles in the vacuum environment (in the process of the injection port 23 absorbing the insulating glue, since the vacuum box 14 is switched to a normal atmospheric environment, the insulating glue will be sucked into the storage box together with a large amount of air during this process, so that a large number of bubbles will exist in the insulating glue in the storage box).

[0047] As a further solution of the present invention, a connecting pipe 61 is fixedly connected to the upper end of the first storage box 41, and the upper end of the connecting pipe 61 passes through the upper end of the second storage box 42. A through hole is vertically penetrated through the upper end of the second storage box 42, and a filter screen 62 is fixedly connected to the inner wall of the upper end of the connecting pipe 61 and the inner wall of the through hole, and the filter screen 62 is used to block the insulating glue.

[0048] The first material storage box 41 and the second material storage box 42 are connected to the outside through the connecting pipe 61 and the through hole respectively, so as to prevent the insulating glue from being sucked out from the rectangular injection tube 22 when the equipment is evacuated.

[0049] As a further solution of the present invention, a sealing block 51 is fixedly connected to the inner wall of the inner cavity of the rectangular injection tube 22, and a driving rod 52 is transmission-connected to the lower end of the sealing block 51. A motor is embedded inside the sealing block 51, and the motor is used to drive the driving rod 52 to vertically move. A baffle 53 is fixedly connected to the lower end of the driving rod 52.

[0050] The driving rod 52 drives the baffle 53 to move vertically, so that the baffle 53 switches between the lower end being in contact with the bottom of the inner cavity of the rectangular injection tube 22 and the upper end being in contact with the lower end of the sealing block 51. In the above two positions, the baffle 53 can respectively block the outer independent pipeline and the inner independent pipeline of the rectangular injection tube 22 divided by the partition plate 43. Correspondingly, when the equipment is using an independent pipeline to inject and suck materials into the injection port 23, the baffle 53 blocks another independent pipeline to prevent the cavity of the other independent pipeline from interfering with the injection and suction work.

[0051] A semiconductor chip packaging defoaming method, the method is as follows:

[0052] S1. First, the substrate 11 and the chip 12 that have been completed by thermal compression bonding are placed in a fixed position in a vacuum box 14;

[0053] S2, then, the vacuum box 14 is closed and started, so that the substrate 11 and the chip 12 in the vacuum box 14 are in a vacuum environment,

[0054] S3, then, a circle of insulating glue is injected into the gap between the substrate 11 and the chip 12 through a filling mechanism to seal the gap;

[0055] S4. Finally, the vacuum box 14 is closed to restore the normal air pressure in the vacuum box 14, so that the insulating glue at the gap between the substrate 11 and the chip 12 enters between the substrate 11 and the chip 12 under atmospheric pressure to complete the filling of the insulating glue.

[0056] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging degassing system, comprising a substrate (11), a chip (12) and a solder joint (13), characterized in that: It also includes a vacuum box (14), wherein the substrate (11), the chip (12) and the solder joint (13) are arranged in the vacuum box (14); A filling mechanism is provided in the vacuum box (14), and is used to inject a circle of insulating glue to seal the gap between the substrate (11) and the chip (12) after the vacuum box (14) is evacuated.

2. A semiconductor chip packaging debubbling system according to claim 1, characterized in that: The filling mechanism comprises a driving device, a rectangular injection tube (22) is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube (22) to engage with the side wall of the chip (12), an injection port (23) is opened at the lower end of the inner wall of the rectangular injection tube (22), the injection port (23) is used to inject insulating glue, and a material storage mechanism is arranged at the upper end of the rectangular injection tube (22), the material storage mechanism is used to inject insulating glue into the rectangular injection tube (22) or suck the insulating glue out of the rectangular injection tube (22).

3. A semiconductor chip packaging debubbling system according to claim 2, characterized in that: The driving device comprises a mounting plate (24), the upper end of the mounting plate (24) is fixedly connected to the upper end of the vacuum box (14), the lower end of the mounting plate (24) is longitudinally slidably connected to a first driving block (25), the lower end of the first driving block (25) is transversely slidably connected to a second driving block (26), the lower end of the second driving block (26) is rotatably connected to a driving telescopic rod (27), the lower end of the driving telescopic rod (27) is fixedly connected to the upper end of the rectangular injection tube (22), the first driving block (25), the second driving block (26) and the driving telescopic rod (27) are all built with a driving unit, and the driving unit is respectively used to drive the first driving block (25) to move longitudinally, drive the second driving block (26) to move transversely, and drive the driving telescopic rod (27) to rotate and extend.

4. A semiconductor chip packaging debubbling system according to claim 3, characterized in that: The material storage mechanism is connected internally and externally with a liquid pump, and the liquid pump is used for pumping out the insulating glue.

5. A semiconductor chip packaging debubbling system according to claim 4, characterized in that: The material storage mechanism comprises a first material storage box (41), a second material storage box (42) is mounted outside the first material storage box (41), the first material storage box (41) and the second material storage box (42) are both fixedly connected to the upper end of a rectangular injection tube (22), a partition plate (43) is arranged inside the rectangular injection tube (22), the partition plate (43) divides the rectangular injection tube (22) into two layers of independent pipes, the upper ends of the two layers of independent pipes are respectively fixedly connected to the lower ends of the first material storage box (41) and the second material storage box (42), and the first material storage box (41) and the second material storage box (42) are both externally connected to a liquid pump.

6. A semiconductor chip packaging debubbling system according to claim 5, characterized in that: The upper end of the first material storage box (41) is fixedly connected with a connecting pipe (61), the upper end of the connecting pipe (61) passes through the upper end of the second material storage box (42), and a through hole is vertically penetrated through the upper end of the second material storage box (42), and the inner wall of the upper end of the connecting pipe (61) and the inner wall of the through hole are fixedly connected with a filter screen (62), and the filter screen (62) is used to block the insulating glue.

7. A semiconductor chip packaging debubbling system according to claim 6, characterized in that: A sealing block (51) is fixedly connected to the inner wall of the inner cavity of the rectangular injection tube (22); a driving rod (52) is drivingly connected to the lower end of the sealing block (51); a motor is embedded inside the sealing block (51); the motor is used to drive the driving rod (52) to perform vertical displacement; a baffle (53) is fixedly connected to the lower end of the driving rod (52).

8. A semiconductor chip packaging debubbling method, applicable to any semiconductor chip packaging debubbling system of claims 1-7, characterized in that; The method is as follows: S1. First, the substrate (11) and the chip (12) that have been completed by thermal compression bonding are placed in a fixed position in a vacuum box (14); S2, then, the vacuum box (14) is closed and started, so that the substrate (11) and the chip (12) in the vacuum box (14) are in a vacuum environment, S3, then, a circle of insulating glue is injected into the gap between the substrate (11) and the chip (12) through a filling mechanism to seal the gap; S4. Finally, the vacuum box (14) is closed to restore the normal air pressure in the vacuum box (14), so that the insulating glue in the gap between the substrate (11) and the chip (12) enters between the substrate (11) and the chip (12) under atmospheric pressure, thereby completing the filling of the insulating glue.

Images