Wafer adhesive film removing device

Abstract

A wafer adhesive film removing device comprises a material placing module used for bearing a wafer and an adhesive film tearing module capable of changing the distance between the adhesive film tearing module and the material placing module in the working direction, and an adhesive tape is attached to or separated from the surface of the wafer through displacement of the adhesive film tearing module. When the sticking and tearing adhesive tape is separated from the surface of the wafer, a thin film arranged on the surface of the wafer is removed together with the sticking and tearing adhesive tape.

Description

Technical Field

[0001] The invention relates to a device for processing wafers, and in particular to a wafer adhesive film removing device. Background Art

[0002] Since the contamination of the wafer surface is an important factor in determining the smoothness of the semiconductor process and the product yield, the current industry has extremely high requirements for the cleanliness of the wafer surface. Whether it is the chemicals used in the cleaning, etching, lithography, deposition and other processes of the wafer surface, or human contact during the process, they may all cause contamination of the wafer surface. Therefore, if the contact with reagents or humans during wafer production can be reduced, the overall process and product yield can be greatly improved.

[0003] The main function of the wafer grinding tape is to be attached to the front side of the wafer so that the back side of the wafer can protect the front side of the wafer during grinding and prevent the grinding liquid from penetrating into the front side of the wafer and causing contamination. After the wafer grinding is completed, the wafer grinding tape is removed to proceed to the next step. However, in the prior art, most of the wafer grinding tapes are torn off manually, which is not only time-consuming and labor-intensive, but also difficult to meet the requirements of automated production and more likely to cause human contamination. Summary of the invention

[0004] In order to overcome the above-mentioned problems that the current manual removal of wafer grinding tape still causes the burden of time and labor costs, is difficult to meet the needs of automated production, and is prone to human pollution, the present invention provides a wafer adhesive film removal device, comprising a loading module for carrying a wafer with a thin film attached to its surface at a gluing position, comprising an edge finding device, the edge finding device is used to position the wafer so that at least a portion of the thin film corresponds to a working direction; and a gluing module, comprising a gluing device and a clamping device adjacently arranged along the working direction, a peeling tape can be guided between the gluing device and the clamping device, the gluing device can selectively provide a pressure to the peeling tape from top to bottom at the gluing position, and the clamping device can selectively move toward the gluing device and clamp the peeling tape, wherein the loading module and / or the gluing module can change the distance between the two by moving along the working direction, so that the gluing device corresponds to the top of the gluing position.

[0005] Among them, the material placement module includes a receiving platform and a material placement platform arranged on the receiving platform. The material placement platform is a circular column and can be selectively moved up and down and rotated relative to the receiving platform. The upper end surface of the material placement platform is used to receive the lower surface of the wafer. The material placement platform is moved up and down relative to the receiving platform to the glue application position before or after the edge-finding device positions the wafer.

[0006] Among them, a substrate includes a glue rod protruding from one side of the substrate, and a tape rolling strip is arranged around the outer periphery of the substrate, and the tape rolling strip is used for the adhesive tape to be wound around and stacked into a roll; at least one glue guide rod protrudes from one side of the substrate, and guides at least a part of the adhesive tape to move to the glue application module on the tape rolling strip in a belt shape; and the glue application module is arranged on one side of the substrate, and at least a part of the glue application device protrudes downward from the substrate.

[0007] Wherein, a track is provided for the material placement table or the substrate to move along the working direction.

[0008] Among them, the material loading table includes an inner material table and an outer material table arranged in concentric circles, the end face of the inner material table is the upper end face, and a horizontal position of the end face of the external material table is the glue applying position, the inner material table can be selectively displaced upward to protrude the external material table, and the inner material table can be selectively rotated relative to the external material table, and the diameter formed by the inner material table is smaller than the diameter of the wafer, and the diameter formed by the external material table is larger than the diameter of the wafer.

[0009] When the upper end surface of the built-in feed table receives the wafer, the edge-finding device is started and the built-in feed table rotates relative to the external feed table, and the edge-finding device detects a cutting position of the wafer. When the cutting position corresponds to a detection area of ​​the edge-finding device, the built-in feed table stops rotating.

[0010] Furthermore, the placing table includes a vacuum structure to fix the wafer.

[0011] Furthermore, the vacuum pumping structure is a plurality of through holes formed through the upper end surface.

[0012] Furthermore, the vacuum structure is formed in the gap between the internal material platform and the external material platform.

[0013] Furthermore, the glue applying device is arranged on a side of the adhesive tape without glue, and includes: a glue applying roller, a roller end of the glue applying roller protrudes from the substrate, and the horizontal height of the lower edge of the roller end corresponds to the glue applying position, and a glue applying cylinder provides the glue applying roller with pressure from top to bottom at the other end relative to the roller end; the glue clamping device is arranged on the other side of the adhesive tape with glue, and includes a clamping member that provides a compressive force for the displacement of the glue applying device via a clamping cylinder, so that the clamping member and the glue applying device jointly clamp the adhesive tape passing therethrough.

[0014] The clamping piece is formed corresponding to the contour of the glue applying device facing the peeling tape.

[0015] The lower edge of the clamping piece is in a smooth arc shape.

[0016] The glue placement rod and the glue guiding rod can be rotated or displaced relative to the substrate as required.

[0017] Furthermore, one of the glue guiding rods corresponds to the glue applying module, so that the peeling tape is guided downward to the glue applying module from top to bottom.

[0018] Furthermore, a cutting device is arranged at a position whose horizontal height is lower than the glue applying position and far away from the receiving platform.

[0019] Furthermore, the cutting position is a flat angle, and when the wafer is positioned, a flat edge formed by the cutting position is perpendicular to the working direction, or the intersection of the flat edge and an arc edge of the wafer is aligned with the working direction.

[0020] The wafer film removal device provided by the present invention has the following advantages:

[0021] 1. Through the relative displacement of the material placement module and the tear film assembly, the tear tape is ensured to be attached to the surface of the wafer and the film and the film is effectively removed during resetting.

[0022] 2. Through the setting of the edge-finding device, the wafer film removal device can determine the relative position of the cutting position 31 and the working direction according to the shape of the film and the position on the wafer surface.

[0023] 3. By displacing the glue application module or the glue clamping device relative to the substrate, the angle of the peeling tape relative to the wafer surface is changed to facilitate the removal of the peeling tape and the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of a preferred embodiment of the present invention;

[0025] Figure 2A It is a schematic diagram of the first action of a partial structure of a preferred embodiment of the present invention;

[0026] Figure 2B It is a schematic diagram of the second action of a partial structure of a preferred embodiment of the present invention;

[0027] Figure 2C It is a schematic diagram of the third action of a partial structure of a preferred embodiment of the present invention;

[0028] Figure 2D It is a schematic diagram of the fourth action of a partial structure of a preferred embodiment of the present invention;

[0029] Figure 3A This is a schematic diagram of the first action of peeling off glue in a preferred embodiment of the present invention;

[0030] Figure 3B This is a schematic diagram of the second action of peeling off glue in a preferred embodiment of the present invention;

[0031] Figure 3C This is a schematic diagram of the third action of peeling off glue in a preferred embodiment of the present invention;

[0032] Figure 3D This is a schematic diagram of the fourth action of peeling off glue in a preferred embodiment of the present invention.

[0033] Explanation of symbols:

[0034] 10 Loading module

[0035] 11 Base

[0036] 111 Track

[0037] 12 receiving platform

[0038] 13 Material table

[0039] 131 built-in feeding table

[0040] 132 External material table

[0041] 133 upper end surface

[0042] 14 Edge finding device

[0043] 20 film tearing set

[0044] 21 substrate

[0045] 211 rubber rod

[0046] 212 rubber guide rod

[0047] 213 Gluing Module

[0048] 2131 Glue application device

[0049] 2132 Laminating device

[0050] 2133 Glue Roller

[0051] 2134 glue cylinder

[0052] 2135 clamping parts

[0053] 2136 Clamping Cylinder

[0054] 22 substrate tracks

[0055] 23 cutting device

[0056] 30 wafers

[0057] 31 cutting positions

[0058] 32 film

[0059] ARobotic Arm

[0060] B tape rolling strip

[0061] B1 Tear Tape DETAILED DESCRIPTION

[0062] Please refer to Figure 1 , which is a preferred embodiment of a wafer film removal device provided by the present invention, comprises a loading module 10 and a film tearing group 20. The loading module 10 is disposed adjacent to the film tearing group 20 and the distance between the two can be changed by displacement along a working direction.

[0063] The loading module 10 is used to carry a wafer 30 (Wafer), which is a common material in the current semiconductor industry and is mostly presented in a round sheet shape. According to demand, there is also a wafer designed in a square sheet shape. The size of the wafer is not limited. 3-inch, 4-inch, 6-inch, 12-inch or even larger wafers can all be suitable for a wafer film removal device provided in this case.

[0064] The wafer 30 includes a cutting position 31 and a film 32 attached to the surface. The cutting position 31 can be a flat angle (Flat) or a U-shaped notch (Notch) of about 10 mm (mm) formed after cutting, so that the wafer 30 can be positioned in its direction during production through the cutting position 30. The film 32 is attached to the surface of the wafer, and can be a layer covering the surface of the wafer for protection and pollution prevention, or attached to the wafer in a strip shape for positioning. The tear film set 20 is used to remove the film 32.

[0065] The material placement module 10 includes a base 11, a receiving platform 12, a material placement platform 13 and an edge finding device 14. A track 111 is arranged on the surface of the base 11 along the working direction, so that the receiving platform 12 can be displaced above the base 11 along the working direction to approach or move away from the tear film set 20. The material placement platform 13 is a circular column arranged on the receiving platform 12, and the material placement platform 13 can move up and down and / or rotate relative to the receiving platform 12 as needed. The upper end surface 133 of the material placement platform 13 is used to receive the lower surface of the wafer 30. At this time, the film 32 is arranged on the upper surface of the wafer 30.

[0066] The edge-finding device 14 is disposed near the position of the material placement table 13, and forms a detection area when it is started. The edge-finding device 14 is used to detect the cutting position 31 of the wafer 30 to determine that the cutting position 31 corresponds to the detection area, so that the wafer 30 can be correctly positioned and at least a portion of a film 32 can be aligned with the working direction or the adhesive film tearing group 20. Furthermore, the material placement table 13 can be moved up and down relative to the receiving table 12 to a glue application position before or after the edge-finding device 14 is positioned, so as to facilitate the subsequent operation of the adhesive film tearing group 20 on the wafer 30.

[0067] When the cutting position 31 of the wafer 30 is the U-shaped notch, the edge finding device 14 can be an image vision lens (CCD lens) or an infrared detection device to accurately confirm the cutting position 31 of the wafer 30 .

[0068] Please refer to FIG. 2A to FIG. 2B , illustrating a preferred embodiment of the material placement module 10 carrying the wafer 30. In this embodiment, the material placement table 13 includes an internal material table 131 and an external material table 132 arranged in concentric circles, wherein the end face of the internal material table 131 is the upper end face 133, and a horizontal position of the end face of the external material table 132 is the glue application position. The internal material table 131 can protrude the external material table 132 upward according to the required displacement, and the upper end face 133 of the internal material table 131 can bear the wafer 30. Among them, the diameter formed by the internal material table 131 is smaller than the diameter of the wafer 30, and the diameter formed by the external material table 132 is larger than the diameter of the wafer 30.

[0069] A robot arm A moves the wafer 30 to a position corresponding to the upper end surface 133 of the built-in loading platform 131, and any part of the robot arm A does not overlap with the upper end surface 133 and / or the built-in loading platform 131 along the top-to-bottom direction. Preferably, the wafer 30 corresponds to the built-in loading platform 131 coaxially.

[0070] When the robot arm A moves downward to a horizontal position lower than the upper end surface 133, at least a portion of the lower surface of the wafer 30 contacts the upper end surface 133, and the wafer 30 is placed on the built-in material table 131. Alternatively, when the built-in material table 131 moves upward to a horizontal position higher than the robot arm A, the effect of receiving the wafer 30 can also be achieved.

[0071] Please refer to Figure 2C to Figure 2D , which illustrates a preferred embodiment of the placement module 10 positioning the wafer 30. When the wafer 30 is placed on the upper end surface 133, the internal loading platform 131 rotates relative to the external loading platform 132, and the rotation can be clockwise or counterclockwise and is not limited here. At this time, the edge finding device 14 starts detection, and when the cutting position 31 corresponds to the detection area of ​​the edge finding device 14, the internal loading platform 131 stops rotating to position the wafer 30.

[0072] Next, the internal material table 131 is displaced downward until the end face of the wafer 30 contacts the external material table 132, so that the wafer 30 is placed at the gluing position. In the present embodiment, the internal material table 131 is displaced downward until the upper end face 133 is aligned with the end face of the external material table 132, and at this time, the wafer 30 is completely in contact with the plane formed by the external material table 132 and the internal material table 131. By means of the setting relationship of the concentric circles of the external material table 132 and the internal material table 131 and the definition of the gluing position, it is not necessary to repeatedly calibrate the horizontal position of the wafer 30 set in the material loading module 10, and whether the wafer 30 remains horizontal when in the gluing position, or the accuracy corresponding to the tearing film group 20, thereby effectively saving the manpower and time costs generated during calibration.

[0073] Preferably, the loading platform 13 includes a vacuum structure for connecting a vacuum device to fix the wafer 30 to prevent the wafer 30 from shifting relative to the upper end surface 133. The type of the vacuum structure is not limited, and can be a plurality of through holes penetrating the upper end surface 133. When the upper end surface 133 receives the wafer 30, the vacuum structure can exhibit the function of attracting the lower surface of the wafer 30. The vacuum structure can also be a gap formed between the internal loading platform 131 and the external loading platform 132, so that the lower surface of the wafer 30 can receive the uniform adsorption force provided by the loading platform 13, preventing the wafer 30 from being subjected to uneven force and causing problems such as poor fixing effect or even damage.

[0074] Preferably, the vacuum force provided by the vacuum structure to attract the wafer 30 can be adjusted according to the thickness of the wafer 30 to avoid the situation where the vacuum force is too low, which may easily cause the wafer 30 to be displaced or even damaged when the film 32 is subsequently removed, and the situation where the vacuum force is too high, which may directly cause the wafer 30 to break.

[0075] Furthermore, in addition to being positioned by the edge-finding device 14 before moving to the glue application position, the wafer 30 may also be positioned again by the edge-finding device 14 after moving to the glue application position, thereby achieving a secondary positioning effect to ensure that the wafer 30 is in the correct position.

[0076] refer to Figure 1 as well as FIG. 3A to FIG. 2D The tear film assembly 20 includes a substrate 21, a substrate track 22 arranged along the working direction, and a cutting device 23. One side of the substrate 21 is arranged on the substrate track 22, and the substrate 21 can move along the working direction according to the substrate track 22 to approach or move away from the tear film assembly 20.

[0077] The other side of the substrate 21 relative to the substrate track 22 includes a glue rod 211, at least one glue guide rod 212 and a glue application module 213. A tape rolling bar is disposed around the outer periphery of the glue rod 211, and the surface of the tape rolling bar B is used for a sticking and tearing tape B1 to be wound around and stacked into a roll. At least one of the glue guide rods 212 is used to guide at least a portion of the sticking and tearing tape B1 in a belt shape to move to the glue application module 23 on the tape rolling bar B.

[0078] The adhesive placement rod 211 and the adhesive guiding rod 212 can rotate relative to the substrate as required to help guide the displacement of the adhesive tape B1.

[0079] The adhesive rod 211 and the adhesive guide rod 212 can be displaced relative to the substrate as required to determine the tension of the adhesive tape B1, thereby affecting the subsequent removal effect of the film 32. In this embodiment, two adhesive guide rods 212 are included, and the two adhesive guide rods 212 can be displaced relative to the substrate to determine the guiding direction of the adhesive tape B1 and the tension performance of the adhesive tape B1 after turning along the adhesive guide rods 222.

[0080] Further, one of the glue guide rods 212 corresponds to the glue application module 213, and enables the adhesive tape B1 to be guided downward from top to bottom to the glue application module 23. The horizontal position of the glue application module 23 corresponds to the glue application position, and includes a glue application device 2131 and a glue clamping device 2132. The glue application device 2131 and the glue clamping device 2132 are adjacently arranged along the working direction and the adhesive tape B1 can be guided between the two.

[0081] The glue applying device 2131 is disposed on a side of the adhesive tape B1 without adhesive, and includes a glue applying roller 2133 and a glue applying cylinder 2134. One roller end of the glue applying roller 2133 protrudes from the substrate 21 and the horizontal height of the lower edge of the roller end corresponds to the glue applying position. The glue applying cylinder 2134 provides a pressure from top to bottom to the glue applying roller 2133 at the other end relative to the roller end, so that the glue applying roller 2133 can reach the side of the adhesive tape B1 without adhesive and use the roller end to stick the adhesive tape B1 to the film 32. At the same time, the glue applying roller 2133 can also press the adhesive tape B1 with the pressure to guide the strip displacement of the adhesive tape B1.

[0082] The pressure from top to bottom provided by the glue roller 2133 can be adjusted according to the thickness of the wafer to avoid the wafer 30 from being damaged when the pressure is too high, or the peeling tape B1 is not easy to completely adhere to the film 32 on the surface of the wafer 30 when the pressure is too low.

[0083] The glue clamping device 2132 is disposed on the other side of the adhesive peeling tape B1, and includes a clamping member 2135 and a clamping cylinder 2136. The clamping cylinder 2136 provides a pressure force for the clamping member 2135 to move toward the glue applying device 2131, so that the clamping member 2135 and the glue applying device 2131 can jointly clamp the peeling tape B1 passing through it.

[0084] The clamping member 2135 is formed corresponding to the contour of the glue applying device 2131 facing the adhesive tape B1 , so as to enhance the firmness of the clamping member 2135 and the glue applying device 2131 in clamping the adhesive tape B1 .

[0085] The lower edge of the clamping member 2135 is in a smooth arc shape to prevent the peeling tape B1 from breaking when the film 32 is subsequently removed.

[0086] Please refer to FIG. 3A to FIG. 3B , which illustrates a preferred embodiment of the glue applying module 213 sticking the peeling tape B1 to the film 32. Before this step is performed, at least a portion of the end of the peeling tape B1 protrudes downward from the peeling film assembly 20. When the material placement table 13 moves to the glue applying position and / or the secondary positioning, the receiving table 12 and / or the substrate 21 can be selectively moved along the working direction according to the track 111 and / or the substrate track 22, so that the receiving table 12 and the substrate 21 are close to each other.

[0087] Since the roller end of the glue roller 2133 is at the same level as the glue application position, when the substrate 21 together with the glue roller 2133 is displaced to above the material placement table 13, that is, when the glue roller 2133 corresponds to above the glue application position, the peeling tape B1 with the end protruding from the peeling film set 20 will be attached to the material placement table 13 and / or the wafer 30. Figure 3A As the receiving platform 12 and / or the substrate 21 continue to move, the glue roller 2133 presses the side without glue to guide the peeling tape B1 on the glue rod 211 while the tape rolling bar B moves, and at the same time, it can also give pressure to the peeling tape B1 to adhere to the surface of the wafer 30. When the glue roller 2133 moves along the working direction and completely passes over the loading platform 13, the peeling tape B1 also adheres to the wafer 30 along the working direction and adheres to at least a portion of the film 32, as shown in FIG. Figure 3B In this embodiment, the film 32 completely covers the surface of the wafer in a layered manner.

[0088] Please refer to FIG. 3C to FIG. 3D, which illustrates a preferred embodiment of the glue applying module 213 using the peeling tape B1 to remove the film 32. After the glue applying roller 2133 moves along the working direction and completely passes over the loading platform 13, the clamping member 2135 moves toward the glue applying device 2131 to clamp the peeling tape B1 passing through it. At this time, the receiving platform 12 and / or the substrate 21 are displaced in the opposite direction along the working direction according to the track 111 and / or the substrate track 22 and reset, so that the receiving platform 12 and the substrate 21 move in a direction away from each other.

[0089] Since the clamping member 2135 and the glue applying device 2131 clamp at least a portion of the peeling tape B1 together, the peeling tape B1 stops being output. At the same time, the peeling tape B1 adhered to the surface of the wafer is pulled by the reverse displacement of the receiving platform 12 and / or the substrate 21, so that the peeling tape B1 between the clamping position and the adhesion to the surface of the wafer 30 generates a tension, wherein the tension is greater than the adhesion force of the peeling tape B1 and / or the film 32 adhered to the surface of the wafer, and the tension is less than the adhesion force of the peeling tape B1 adhered to the surface of the film 32. In this way, the peeling tape B1 can be separated from the surface of the wafer 30 by the reverse displacement of the receiving platform 12 and / or the substrate 21, and the film 32 on the surface of the wafer 30 is removed at the same time.

[0090] Furthermore, the glue applying module 213 or the glue clamping device 2132 can move up and down relative to the substrate 21 before or during the process of removing the film 32 to change a removal angle of the peeling tape B1 between the clamping position and the adhesion on the surface of the wafer 30 relative to the wafer surface, so as to facilitate the removal of the peeling tape B1 and the film 32. The removal angle is preferably 15 degrees initially, and the removal angle will change with the proportion of the film 32 relative to the surface of the wafer 30.

[0091] When the glue applying module 213 has finished removing the film 32, the cutting device 23 can be used to cut off the used peeling tape B1 and the film 32 that protrudes from the peeling film set 20. The cutting device 23 is set at a level lower than the glue applying position and away from the receiving platform 12, so that after the peeling tape B1 is cut off by the cutting device 23, at least a portion of the end of the peeling tape B1 can be retained protruding from the peeling film set 20, so as to be used when the film 32 is removed next time.

[0092] Furthermore, the cutting device 23 may also be disposed at a position higher than the cutting device 23 . When the glue applying module 213 completes removing the film 32 , the peeling tape B1 and the film 32 may be moved upward to the cutting device 23 for cutting.

[0093] Furthermore, the edge detection device 14 is used or an image vision lens (CCD lens) is additionally provided to detect whether there are scratches, cracks, or residual adhesive on the surface of the wafer 30 after the film 32 is removed.

[0094] Furthermore, the edge finding device 14 can determine the relative position of the cutting position 31 and the working direction according to the shape of the film 32 and the position on the surface of the wafer 30. In this embodiment, if the cutting position 31 is a flat angle, a flat edge formed by the cutting position 31 is perpendicular to the working direction, so that the film 32 can evenly receive the pulling force of the peeling tape B1 to remove it. Alternatively, the flat edge and the arc edge of the wafer can be aligned with the working direction so that the peeling tape B1 can remove the film 32 more easily.

[0095] Furthermore, the wafer film removal device may also include a control center to automatically or manually execute the above-mentioned loading module 10 and the film tearing group 20, or the wafer film removal device may include an operation interface connected to the control center, so that an operator can adjust the process data of the wafer film removal device when it is started through the operation interface according to the conditions provided in the above paragraphs (the thickness of the wafer 30, the shape of the cutting position 31, and the shape and position of the film 32) to ensure that the wafer 30 is successfully removed from the film 32.

[0096] In addition, when the wafer adhesive film removing device removes the film 32 , the operation interface simultaneously displays the tension value to ensure the safety of the wafer 30 when the film 32 is removed.

[0097] The wafer film removal device provided by the present invention has the following advantages:

[0098] 1. Through the relative displacement of the loading module 10 and the tear film assembly 20, the peel tape B1 is ensured to be attached to the surface of the wafer 30 and the film 31 and the film 32 is effectively removed during resetting.

[0099] 2. Through the setting of the edge finding device 14 , the wafer film removal device can determine the relative position of the cutting position 31 and the working direction according to the shape of the film 32 and the position on the surface of the wafer 30 .

[0100] 3. By displacing the glue applying module 23 or the glue clamping device 2132 relative to the substrate 21 , the angle of the peeling tape B1 relative to the wafer surface is changed to facilitate the removal of the peeling tape B1 and the film 32 .

[0101] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer film removal device, characterized in that: Include: a material placement module, used for carrying a wafer with a film attached to its surface at a glue application position, comprising an edge finding device, the edge finding device is used for positioning the wafer so that at least a portion of the film corresponds to a working direction; and A glue applying module comprises a glue applying device and a glue clamping device which are adjacently arranged along the working direction, a sticking and tearing tape can be guided between the glue applying device and the glue clamping device, the glue applying device can selectively provide a pressure to the sticking and tearing tape from top to bottom at the glue applying position, and the glue clamping device can selectively move toward the glue applying device and clamp the sticking and tearing tape, wherein The material placement module and / or the glue application module can be displaced along the working direction to change the distance between them, so that the glue application device corresponds to the upper part of the glue application position.

2. The wafer film removal device as claimed in claim 1, characterized in that: in: The material placement module comprises a receiving platform and a material placement platform arranged on the receiving platform, the material placement platform is a circular column and can be selectively moved up and down and rotated relative to the receiving platform, the upper end surface of the material placement platform is used to receive the lower surface of the wafer, and the material placement platform is moved up and down relative to the receiving platform to the glue application position before or after the edge-finding device positions the wafer; and A substrate comprising: A glue rod protrudes from one side of the base plate, and a tape rolling strip is sleeved around the outer periphery of the rod, and the tape rolling strip is used for the sticking and tearing tape to be wound around and stacked into a roll; At least one glue guide rod protrudes from one of the side surfaces of the substrate, and guides at least a portion of the adhesive tape to move to the adhesive application module on the tape rolling bar in a belt-like manner; and The glue applying module is disposed on one side of the substrate, and at least a portion of the glue applying device protrudes downward from the substrate, wherein A track is provided for the material placement table or the substrate to move along the working direction.

3. The wafer film removal device as claimed in claim 2, characterized in that: The material placement table includes an inner material placement table and an outer material placement table which are arranged in concentric circles, the end surface of the inner material placement table is the upper end surface, and a horizontal position of the end surface of the outer material placement table is the glue application position, wherein: The internal material platform can be selectively displaced upward to protrude from the external material platform, and the internal material platform can be selectively rotated relative to the external material platform; and The diameter formed by the internal material table is smaller than the diameter of the wafer, and the diameter formed by the external material table is larger than the diameter of the wafer; wherein: When the upper end surface of the built-in material table receives the wafer, the edge-finding device is activated and the built-in material table rotates relative to the external material table; and The edge-finding device detects a cutting position of the wafer, and when the cutting position corresponds to a detection area of ​​the edge-finding device, the built-in material table stops rotating.

4. The wafer film removal device as claimed in claim 3, characterized in that: The material placement table includes a vacuum structure to fix the wafer.

5. The wafer adhesive film removal device as claimed in claim 4, characterized in that: The vacuum pumping structure is a plurality of through holes which are arranged through the upper end surface.

6. The wafer adhesive film removal device as claimed in claim 4, characterized in that: The vacuum structure is formed in the gap between the internal material platform and the external material platform.

7. The wafer adhesive film removal device according to any one of claims 2 to 6, characterized in that: in: The glue applying device is arranged on a side of the adhesive tape without adhesive, and comprises: a glue-applying roller, wherein a roller end of the glue-applying roller protrudes from the substrate, and the horizontal height of the lower edge of the roller end corresponds to the glue-applying position; and A glue cylinder provides the glue roller with the pressure from top to bottom at the other end opposite to the roller end; and The glue clamping device is arranged on the other side of the adhesive tape, and comprises a clamping member which provides a compressive force for the glue displacing device through a clamping cylinder, so that the clamping member and the glue displacing device clamp the adhesive tape passing therethrough together.

8. The wafer adhesive film removal device as claimed in claim 7, characterized in that: The clamping piece is formed corresponding to the contour of the glue applying device facing the peeling tape.

9. The wafer adhesive film removal device as claimed in claim 7, characterized in that: The lower edge of the clamping piece is in a smooth arc shape.

10. The wafer adhesive film removal device as claimed in claim 7, characterized in that: The glue placement rod and the glue guiding rod can be rotated or displaced relative to the substrate as required.

11. The wafer adhesive film removal device as claimed in claim 7, characterized in that: One of the glue guide rods corresponds to the glue applying module, so that the peeling tape is guided downward to the glue applying module from top to bottom.

12. The wafer adhesive film removal device as claimed in claim 7, characterized in that: A cutting device is arranged at a position whose horizontal height is lower than the glue applying position and far away from the receiving platform.

13. The wafer adhesive film removal device as claimed in claim 7, characterized in that: The cutting position is a flat angle. When the wafer is positioned, a flat edge formed by the cutting position is perpendicular to the working direction, or the intersection of the flat edge and an arc edge of the wafer is aligned with the working direction.

Images