Antenna module with anisotropic hexagonal boron nitride thermal interface

Abstract

The invention provides an integrated antenna module with thermal management. The module comprises at least one antenna and an amplifier such as a power amplifier or a low noise amplifier. And an anisotropic thermal interface material that is thermally conductive with other components. Wherein the anisotropic thermal interface material comprises a plurality of thermally anisotropic composite layers aligned with each other, having a first thermal conductivity in a first direction, having a second, higher thermal conductivity in a second direction, and exhibiting a parallel extension in the first direction. These thermally anisotropic composite layers comprise a hexagonal boron nitride and a binder and are aligned in a second direction perpendicular to the first direction such that the x-y plane of the hexagonal boron nitride may also be aligned in the second direction, whereby the thermal conductivity in the second direction is at least 13.5 W / mK and has a dielectric constant of less than 4 and a loss tangent of less than 0.007.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS:

[0001] This application claims priority to U.S. Provisional Patent Application Serial No. 63 / 510,634 filed on June 28, 2023 and U.S. Patent Application Serial No. 18 / 754,206 filed on June 26, 2024, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present invention relates to an antenna module, and more particularly, to a 5G antenna module with anisotropic hexagonal boron nitride thermal interface material. Background Art

[0003] In 5G communication modules, the antenna system can send and receive signals with minimal delay. Therefore, it is necessary to optimize some design parameters of the antenna, such as gain, beamforming, and directivity, to ensure the most efficient signal propagation and reception. In addition, advanced antenna technologies, such as massive multiple input multiple output (MIMO) and beamforming, can help improve spatial multiplexing and reduce interference, thereby increasing system capacity and reducing latency.

[0004] Temperature changes caused by environmental factors or heat generated inside the module can have a serious impact on antenna performance. For example, an increase in temperature will cause the resonant frequency of the antenna to change because the physical properties of the antenna and its components, such as length and dielectric constant, change as the temperature rises, which in turn causes the resonant frequency to decrease. Low network latency is a basic requirement for 5G communication systems because application scenarios include some real-time and interactive applications such as self-driving cars, remote surgery, and augmented reality. The reduction in resonant frequency and the increase in return loss will cause the antenna's specified frequency to be inconsistent with the actual operating frequency, thereby reducing antenna efficiency and signal transmission quality. Therefore, network latency has many negative effects. Figure 7 The return loss of the antenna is shown in Figure 1. The return loss specifically refers to the amount of power returned or reflected at the antenna power input port. Generally, in antenna design, the lower the return loss, the better. The trough of the return loss can be used to observe the resonant frequency of the antenna. Temperature will affect the resonant frequency of the antenna; when the temperature rises, the resonant frequency will drop to a lower frequency. Therefore, in Figure 7 In the example, when the temperature increases from 27°C to 117°C, the trough (V) moves down from 2.95 GHz to 2.9 GHz, which is a big change and will have an impact on the entire communication system.

[0005] In addition, 5G antenna modules usually have some heat-generating components that are tightly packaged together, which increases the challenge of thermal management of antenna modules. In particular, 5G antenna modules include power amplifiers for amplifying received RF signals to the required power, and the power amplifiers generate a lot of heat in the process of amplifying power. The higher the required power, the more heat is generated. Therefore, effective thermal management and removal of the generated heat to maintain its performance and prevent overheating are also very important.

[0006] In addition, the transceiver integrated circuits used to tune and demodulate wireless signals in 5G antenna modules also generate heat during signal processing, especially when operating at high frequencies and high data rates. Therefore, adequate thermal management is also very important to maintain the optimal performance and reliability of these integrated circuits. In addition, the baseband processor responsible for digital signal processing in the 5G antenna module may also consume a lot of power and generate heat when performing tasks such as data encoding, decoding, and signal synchronization. Therefore, for the baseband processor, an effective heat dissipation mechanism is also required to prevent thermal problems related to its performance and life.

[0007] Switches and filters are important components in 5G antenna modules responsible for signal routing, beamforming, and frequency selection. Depending on the design and complexity of the module, these components may consume power and generate heat. Similarly, proper thermal management techniques are also required to minimize heat accumulation and maintain its performance. Finally, 5G antenna modules may also include control and monitoring circuits that manage module operations for power management, signal monitoring, and system diagnostics. Although these circuits may not be the main heat-generating components, they are still one of the considerations for the overall heat dissipation needs of the module.

[0008] Although 5G antenna modules may vary depending on the specific module design, power requirements and operating conditions, they all require effective thermal management strategies, such as using appropriate thermal interface materials, heat sinks and cooling mechanisms to ensure proper heat dissipation and avoid performance degradation or damage to components within the module. However, existing thermal interface materials still have some unsurmounted challenges, especially regarding dielectric constant (Dk) and loss tangent (Df), as well as metal issues at high frequencies (especially above 20GHz).

[0009] Thermal interface materials are usually materials with relatively high dielectric constants and loss tangents, where the dielectric constant represents the material's ability to store electrical energy, while the loss tangent reflects the dissipation caused by the conversion of energy into heat. At high frequencies greater than 20 GHz, the wavelength of electromagnetic waves becomes smaller, and the parasitic capacitance and inductance effects of thermal interface materials become more significant, which may lead to increased signal loss, impedance mismatch, and reduced antenna performance.

[0010] Many existing thermal interface materials utilize metal particles or fillers to enhance their thermal conductivity. However, metals may lead to higher electrical losses, especially at higher frequencies, because at frequencies above 20 GHz, the skin depth of the metal increases, that is, the current will be concentrated near the surface of the material, resulting in higher resistive losses and signal attenuation, and heat accumulation, thereby reducing the efficiency of the overall system.

[0011] Thermal interface materials transfer heat from the power amplifier to the heat sink or chassis. However, the above-mentioned issues such as dielectric constant, loss tangent and metal may lead to reduced thermal conductivity and increased thermal resistance, causing heat accumulation in the antenna module, negatively affecting the reliability and efficiency of the system, and may even cause related components to fail prematurely.

[0012] In summary, the optimization of the antenna system of the 5G module needs to ensure low network latency through proper thermal management to minimize the impact of temperature changes, thereby improving the performance, reliability and efficiency of the 5G communication system to achieve seamless and real-time responsive connections in various applications. The present invention solves this need. Summary of the invention

[0013] The object of the present invention is to provide an integrated antenna module to solve the above technical problems.

[0014] According to a first aspect of the present invention, an integrated antenna module is provided.

[0015] The present invention provides an antenna module having a thermal interface material made of hexagonal boron nitride (hBN). Hexagonal boron nitride is a two-dimensional material having excellent thermal conductivity on its basal surface, and is therefore suitable as an anisotropic thermal interface material, wherein hexagonal boron nitride has a unique structure of a hexagonal lattice composed of alternating boron atoms and nitrogen atoms, and can effectively transfer heat through lattice vibration, and the basal surface of hexagonal boron nitride has a thermal conductivity of more than 500 W / mK; in addition, hexagonal boron nitride has a low dielectric constant of about 3.5 to 4 and a low loss tangent of 0.0012.

[0016] In 5G antenna modules, using anisotropic hexagonal boron nitride as a thermal interface material can enhance heat dissipation and improve thermal management, while also preventing signal loss and delay commonly caused by the high dielectric constant and loss tangent of thermal interface materials. The present invention can minimize thermal resistance and facilitate effective heat transfer by adding a thin layer of hexagonal boron nitride between a heat-generating component (such as a power amplifier) ​​and a heat sink or base. Similarly, it can also prevent heat accumulation, maintain a low operating temperature, and maintain the performance and reliability of the antenna module.

[0017] In addition, as a thermal interface material, anisotropic hexagonal boron nitride has other properties, including high resistivity, chemical stability and low interface thermal resistance with various materials. These properties highlight that anisotropic hexagonal boron nitride is suitable for solving thermal and electrical problems in 5G antenna modules.

[0018] In one aspect, the present invention provides an integrated antenna module with thermal management, the module comprising at least one antenna or antenna array and at least one amplifier, such as a power amplifier or a low noise amplifier; an anisotropic thermal interface material, which is thermally connected to the at least one antenna or antenna array and the at least one amplifier, wherein the anisotropic thermal interface material comprises a plurality of aligned thermally anisotropic composite layers, which have a first thermal conductivity in a first direction and a higher second thermal conductivity in a second direction, and the aligned thermally anisotropic composite layers extend substantially parallel to each other in the first direction.

[0019] Each thermally anisotropic composite layer comprises hexagonal boron nitride and a binder. The hexagonal boron nitride is aligned in a second direction, and the second direction is approximately perpendicular to the first direction, so that the xy plane of the hexagonal boron nitride is aligned in the second direction to present a higher second thermal conductivity. With this arrangement, the thermal conductivity in the second direction is at least 13.5 W / mK, the dielectric constant is less than 4, and the loss tangent is less than 0.007. And the thermally anisotropic conductive composite layer is adhered to the adjacent thermally anisotropic composite layer, thereby producing a laminated anisotropic composite thermal interface device.

[0020] In one aspect, the adhesive of the anisotropic thermal interface material is a polymer adhesive.

[0021] Each thermally anisotropic composite layer contains 60 to 95 weight percent of hexagonal boron nitride and 5 to 40 weight percent of a binder. In one embodiment, the content of hexagonal boron nitride is 70 to 75 weight percent.

[0022] In one aspect, the polymer binder is selected from polysiloxane, thermoplastic elastomer, polyisoprene or polybutadiene.

[0023] In one aspect, the anisotropic thermal interface material has a thickness of about 0.1 to 0.6 mm.

[0024] In one aspect, the anisotropic thermal interface material has a dielectric breakdown voltage of at least about 13 kV / mm.

[0025] In one aspect, the anisotropic thermal interface material is thermally coupled to a heat sink or heat exchanger to further enhance thermal management performance.

[0026] In another aspect, the module further includes a passive or active cooling device in thermal communication with the anisotropic thermal interface material to more effectively dissipate heat.

[0027] In one aspect, the anisotropic thermal interface material is flexible and can be in close contact with irregular surfaces of the antenna, antenna array, amplifier, and passive components.

[0028] In one aspect, the anisotropic thermal interface material further includes a layer of thermally conductive adhesive on one or both sides to enhance thermal contact with the antenna, antenna array, amplifier, and passive components.

[0029] In one aspect, the anisotropic thermal interface material has an operating temperature range of -40°C to 150°C, and its thermal performance does not significantly decrease within this temperature range.

[0030] In another aspect, the at least one antenna or antenna array is integrated into a printed circuit board, and the anisotropic thermal interface material is located between the printed circuit board and the amplifier.

[0031] In another aspect, the anisotropic thermal interface material further comprises a protective outer layer or coating to provide protection and enhance its durability.

[0032] In one aspect, the anisotropic thermal interface material includes a layer of thermally conductive adhesive on one or both sides to enhance thermal contact with the antenna or antenna array and the amplifier.

[0033] In one aspect, the at least one antenna or antenna array may operate in the frequency range of VHF, UHF, L-band, S-band, C-band, X-band, Ku-band, K-band or Ka-band.

[0034] In one aspect, the thermal resistance of the anisotropic thermal interface material in the second direction is less than 0.5° C. / W.

[0035] In one aspect, the hexagonal boron nitride has a form selected from flakes, fibers, or platelets. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, in which:

[0037] Figure 1 An antenna module according to an embodiment of the present invention;

[0038] Figure 2 The preparation process of the thermal interface material of the antenna module of the present invention is shown;

[0039] Figure 3 The performance of the thermal interface material of the antenna module of the present invention is shown;

[0040] Figures 4A-4B The correlation between the dielectric constant of hexagonal boron nitride and filler content is shown ( Figure 4A ) and the relationship between the dielectric loss of hexagonal boron nitride and the filler content ( Figure 4B );

[0041] Figure 5A-5B Displays the results of the thermal conductivity test, where Figure 5A Shows the correlation between impedance and thickness, Figure 5B This is a scanning electron microscope image showing vertically aligned hexagonal boron nitride;

[0042] Figure 6A-6B The dielectric constant at high frequencies is shown by splitting the cylindrical resonator ( Fig. 6A ) and dielectric loss ( Figure 6B );

[0043] Figure 7 (Prior Art) Shows the relationship between return loss and frequency. DETAILED DESCRIPTION

[0044] In the following description, the integrated antenna module is listed as a preferred embodiment. It will be apparent to those skilled in the art that modifications including additions and / or substitutions may be made without departing from the scope and spirit of the invention. Specific details may be omitted below to avoid obscuring the invention; however, this article is written to enable those skilled in the art to practice the technical content disclosed herein without undue experimentation.

[0045] According to a first aspect of the present invention, an integrated antenna module is provided.

[0046] With reference to the detailed drawings, Figure 1 The antenna module with thermal management of the present invention is shown in FIG. The antenna module 100 includes an antenna or antenna array 10 (e.g., a multiple-input multiple-output antenna for 4G and 5G communications), and multiple active and passive components are required in the antenna module 100 to manage the power signal received from or sent to the antenna 10. These components may include amplifiers such as power amplifiers, and a large amount of heat is generated when amplifying the antenna signal. The active component 20 may include a low-noise amplifier, and the antenna module 100 also includes other components, such as passive components 30 such as filters and switches. In addition, the antenna module may also include other components such as transceiver integrated circuits for tuning and demodulating wireless transmissions.

[0047] The thermal interface material, such as anisotropic thermal pad 200, is in thermal contact with the antenna / antenna array 10, active components 20, and (optionally) passive components 30 that generate less heat. The so-called "thermal contact" means that the heat generated by each component will be transferred to the thermal interface material 200, which can be transferred by direct contact, through a paste that can enhance contact, or through a heat transfer component. Although Figure 1 Not shown, but the anisotropic thermal interface material 200 itself may also be in thermal contact with a heat sink, heat exchanger, or other passive or active cooling component.

[0048] The thermal interface material 200 includes multiple layers of compacted hexagonal boron nitride layers, which can form a thermally anisotropic composite layer structure to maximize the anisotropic thermal conduction of the antenna assembly. The anisotropic thermal interface material includes multiple thermally anisotropic composite layers aligned with each other, which have a first thermal conductivity in a first direction and a larger second thermal conductivity in a second direction, and the aligned thermally anisotropic composite layers are substantially parallel in the first direction.

[0049] More specifically, each thermally anisotropic composite layer includes hexagonal boron nitride and a binder (e.g., a polymer binder). The arrangement of the hexagonal boron nitride layer in the second direction is substantially perpendicular to the first direction, so that the xy plane of the hexagonal boron nitride layer is aligned with the second direction having a larger thermal conductivity. In this way, the thermal conductivity in the second direction is at least 13.5 W / mK, the dielectric constant is less than 4, and the loss tangent is less than 0.007. The thermally anisotropic composite layers are adhered to each other to form a stacked anisotropic composite thermal interface device.

[0050] In one embodiment, the polymer matrix of the polymer binder can be selected from polysiloxane, thermoplastic elastomer, polyisoprene, polybutadiene or other suitable polymers. Figures 4A-4B As shown, the preferred weight ratio is 5 to 40 weight percent of the polymer matrix and 60 to 95 weight percent of the hexagonal boron nitride flakes, wherein 70 to 75 weight percent of the hexagonal boron nitride flakes is a more preferred embodiment. This ratio can ensure the best balance between thermal conductivity and mechanical properties.

[0051] In order to prepare a thermally anisotropic layer having the above-mentioned thermal conductivity structure, the hexagonal boron nitride is subjected to alignment and bonding treatment. Figure 2 As shown, hexagonal boron nitride is dispersed in a selected polymer binder or binder mixture, and a solvent may be optionally added to control its rheological properties. Various dispersion techniques may be used during dispersion, such as ultrasonic treatment, shear mixing or Figure 2The planetary mixing shown here ensures that the hexagonal boron nitride can be properly dispersed and prevents it from agglomerating. It is worth noting that if the damage of the hexagonal boron nitride during dispersion can be minimized, the thermal conductivity of the final material can be further improved.

[0052] Optionally, when a solvent is added, the solvent can be removed by means of a controlled drying step (not shown) to increase the alignment of the hexagonal boron nitride / binder hybrid layer. The alignment of the hexagonal boron nitride can give the formed layer structure anisotropic thermal transfer properties. By aligning the "two-dimensional" layer parallel to the direction of heat flow, heat can be effectively conducted along the basal plane of the hexagonal boron nitride because the thermal conductivity of the basal plane is significantly higher than that of the perpendicular plane direction. This anisotropic property allows preferential heat transfer, which helps to reduce thermal resistance at the interface.

[0053] After rolling, a plurality of thermally conductive composite films can be stacked in parallel, wherein the layers can be bonded with a polymer matrix or other polymer materials, and then further heated and compressed to form a compressed stacking structure.

[0054] Then, if Figure 3 As shown, the compressed stacked structure is processed by an ultrasonic cutter, and the cutter cuts the stacked adhesive film in a direction perpendicular to the plane direction of the film to produce a single-layer thermal interface material gasket with a selected thickness of 0.1 to 0.6 mm (the thickness can be selected according to the final antenna module configuration).

[0055] The thermal interface material for the antenna module of the present invention exhibits a variety of ideal properties for high-frequency signal transmission and thermal management. For example, it has a high full-plane thermal conductivity of at least 13.5 W / mK (tested by ASTM 5470-06 standard, thermal conductivity test results see Figure 5A-5B and Table 1, where Figure 5A The dependence of impedance on thickness is shown, Figure 5B showing vertically aligned hexagonal boron nitride as observed by scanning electron microscopy); in addition, Figure 6A-6B As shown, it has a low dielectric constant of less than 4 and a low loss tangent of less than 0.007, which are beneficial to minimize signal loss, reduce signal delay, and enhance system stability in high-frequency applications.

[0056] Table 1. Thermal conductivity results of ASTM 5470-06 test

[0057] In addition, it has a dielectric breakdown voltage of more than 13kV / mm, providing electrical insulation to prevent any electrical interference. The specific results are shown in Table 2.

[0058] Table 2. Dielectric breakdown voltage

[0059] In some embodiments, anisotropic thermal interface materials are used in the integrated antenna module, which are thermally coupled to a heat sink or heat exchanger to enhance thermal management. This coupling ensures that the heat generated by the antenna, antenna array, and amplifier is effectively dissipated, thereby maintaining optimal operating temperatures and extending the life of the components.

[0060] To further improve thermal management, the antenna module may further incorporate passive or active cooling devices that work in conjunction with the anisotropic thermal interface material to more effectively dissipate heat and prevent overheating, ensuring that the antenna module can maintain consistent performance even under high power conditions.

[0061] The anisotropic thermal interface material used in this module has high flexibility, which enables it to adapt to the irregular surfaces of antennas, antenna arrays, amplifiers and passive components; the high flexibility is very important for maintaining good thermal contact between all components, thereby improving the overall thermal conductivity of the system. In addition, a layer of thermally conductive adhesive can be further included on one or both sides of the thermal interface material to enhance thermal contact with the antenna, antenna array, amplifier and passive components. This adhesive layer further optimizes thermal contact and ensures that heat can be effectively conducted away from the components. Optionally, a layer of thermally conductive adhesive can be further included on one or both sides of the anisotropic thermal interface material to enhance thermal contact with the antenna or antenna array and amplifier.

[0062] In further embodiments, the anisotropic thermal interface material includes a layer of thermally conductive adhesive on one or both sides to enhance thermal contact with the antenna or antenna array and amplifier.

[0063] A significant advantage of anisotropic thermal interface materials is their ability to withstand a wide operating temperature range from -40°C to 150°C, ensuring that the material maintains its thermal properties and structural integrity under extreme temperature conditions, making it suitable for a variety of applications and environments.

[0064] In addition, another feature of the antenna module is that it is suitable for embedding at least one antenna or antenna array into a printed circuit board, and its anisotropic thermal interface material can be placed between the printed circuit board and the amplifier to ensure that the heat generated by the amplifier can be effectively conducted away without affecting the printed circuit board, thereby preventing potential damage and maintaining signal integrity.

[0065] To enhance durability and provide protection, the integrated antenna module may include a protective layer or coating on the anisotropic thermal interface material to protect the thermal interface material from environmental factors such as moisture, dust and mechanical wear, thereby extending the service life of the module and ensuring its long-term reliable performance.

[0066] In some embodiments, the at least one antenna or antenna array may operate within the frequency range of VHF, UHF, L-band, S-band, C-band, X-band, Ku-band, K-band, or Ka-band.

[0067] In some embodiments, the thermal resistance of the anisotropic thermal interface material in the second direction is less than 0.5° C. / W.

[0068] In some embodiments, the hexagonal boron nitride may be in the form of flakes, fibers, or sheets.

[0069] In summary, the above detailed description of the integrated antenna module emphasizes the use of innovative anisotropic thermal interface materials and advanced cooling mechanisms to achieve excellent thermal performance, flexibility and durability, thereby achieving optimal performance in a compact and efficient design.

[0070] As used in this specification, the terms "approximately", "substantially", "substantially" and "about" are used to describe and explain a small change, and when used in conjunction with an event or situation, the terms may refer to a situation where the event or situation occurs exactly, as well as a situation where the event or situation occurs approximately. When used in conjunction with a numerical value, these terms may cover a range of variation of no more than ±10% of the numerical value, such as no more than ±5%, no more than ±4%, no more than ±3%, no more than ±2%, no more than ±1%, no more than ±0.5%, no more than ±0.1% or no more than ±0.05%. The term "substantially coplanar" may refer to two surfaces being in the same plane at the micron level, such as within 40 μm, within 30 μm, within 20 μm, within 10 μm or within 1 μm.

[0071] The singular terms "a", "an", and "the" used in this specification may include plural references unless the context clearly requires otherwise. When describing certain embodiments, a component provided "on" or "over" another component may include the case where the aforementioned component is directly on (e.g., physically in contact with) the latter component, and may also include the case where one or more intermediate components exist between the aforementioned component and the latter component.

[0072] Although this specification has been described and illustrated by specific embodiments, these descriptions and illustrations are not restrictive. It should be understood by those skilled in the art that modifications or substitutions may be made without departing from the true spirit and scope of this specification as defined in the attached claims. The illustrations provided in this specification are not necessarily drawn to scale, and there may be differences between the diagrammatic presentation in this specification and the actual device due to the preparation method and tolerance. There may be other embodiments that are not specifically described in this specification. Therefore, this specification and the drawings should be regarded as illustrative rather than restrictive. In order to adapt to specific circumstances, modifications may be made to materials, material components, methods or steps, etc., and these modifications are all within the purpose, spirit and scope of this specification, and these modifications should be included in the scope of protection claimed in the attached claims. In addition, although the methods disclosed herein have been described in a specific order, it should be understood that these steps can be combined, subdivided or reordered to form equivalent methods without departing from the teachings of this specification, so unless otherwise specified herein, the order and grouping of operations should not be regarded as limitations.

[0073] The above description has been presented to illustrate and describe the present invention, but is not intended to be exhaustive or to limit the present invention to the precise form disclosed. Many modifications and variations will be apparent to those skilled in the art.

[0074] The above embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.

Claims

1. An integrated antenna module with thermal management, characterized in that: include: at least one antenna or antenna array; at least one amplifier selected from a power amplifier or a low noise amplifier; An anisotropic thermal interface material having thermal contact with at least one antenna or antenna array and at least one amplifier, and comprising: A plurality of anisotropic composite layers aligned with each other, each having a first thermal conductivity in a first direction and a second thermal conductivity higher than the first thermal conductivity in a second direction, wherein the aligned anisotropic composite layers extend in parallel in the first direction; Each of the anisotropic composite layers comprises hexagonal boron nitride and an adhesive, the hexagonal boron nitride is aligned in the second direction perpendicular to the first direction, so that the xy plane of the hexagonal boron nitride is aligned in the second direction to present a higher second thermal conductivity, and the thermal conductivity in the second direction is at least 13.5 W / mK, the dielectric constant of the anisotropic composite layer is less than 4, and the loss tangent is less than 0.007; wherein the anisotropic thermal conductive composite layers adhere to each other to form a laminated anisotropic composite thermal interface device. 2 . The integrated antenna module of claim 1 , wherein the adhesive is a polymer adhesive. 3 . The integrated antenna module of claim 1 , wherein each of the anisotropic composite layers comprises 60 to 95 weight percent of hexagonal boron nitride and 5 to 40 weight percent of a binder. 4 . The integrated antenna module of claim 3 , wherein each of the anisotropic composite layers comprises 70 to 75 weight percent of hexagonal boron nitride and 25 to 30 weight percent of a binder.

5. The integrated antenna module of claim 2, wherein the polymer binder is selected from polysiloxane, thermoplastic elastomer, polyisoprene or polybutadiene. 6 . The integrated antenna module as claimed in claim 1 , wherein the thickness of the anisotropic thermal interface material is 0.1 to 0.6 mm.

7. The integrated antenna module of claim 1, wherein the anisotropic thermal interface material has a dielectric breakdown voltage of at least 13 kV / mm.

8. The integrated antenna module of claim 1, wherein the anisotropic thermal interface material is further in thermal contact with a heat sink or a heat exchanger to enhance thermal management.

9. The integrated antenna module of claim 1, further comprising a passive or active cooling device in thermal contact with the anisotropic thermal interface material to dissipate heat more effectively.

10. The integrated antenna module of claim 1, wherein the anisotropic thermal interface material is flexible and can be in close contact with irregular surfaces of the antenna or antenna array, the amplifier, and passive components.

11. The integrated antenna module of claim 10, wherein one or both sides of the anisotropic thermal interface material further comprises a layer of thermally conductive adhesive to enhance thermal contact with the antenna or antenna array, the amplifier and the passive components.

12. The integrated antenna module of claim 1, wherein the anisotropic thermal interface material has an operating temperature range of -40°C to 150°C.

13. The integrated antenna module of claim 1, wherein the at least one antenna or antenna array is integrated into a printed circuit board, and the anisotropic thermal interface material is located between the printed circuit board and the amplifier.

14. The integrated antenna module of claim 1, wherein the anisotropic thermal interface material further comprises a protective layer or coating to provide a protective effect and enhance its durability.

15. The integrated antenna module of claim 1, wherein one or both sides of the anisotropic thermal interface material include a layer of thermally conductive adhesive to enhance thermal contact with the antenna or antenna array and the amplifier.

16. The integrated antenna module of claim 1, wherein the at least one antenna or antenna array is operable in a frequency range of VHF, UHF, L-band, S-band, C-band, X-band, Ku-band, K-band, or Ka-band. 17 . The integrated antenna module of claim 1 , wherein a thermal resistance of the anisotropic thermal interface material in the second direction is less than 0.5° C. / W.

18. The integrated antenna module of claim 1, wherein the hexagonal boron nitride has a form selected from a sheet, a fiber, or a flake.

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