Printed circuit board capable of saving wiring space

Abstract

The invention discloses a printed circuit board capable of saving wiring space, and belongs to the technical field of printed circuit boards. Comprising a hole ring bonding pad arranged on the welding face of the printed circuit board, a board edge drilling hole is formed in the hole ring bonding pad, one side of the board edge drilling hole is tangent to a first connecting board, the other side of the board edge drilling hole is tangent to a second connecting board, and the board edge drilling hole is used for conducting the internal layer faces of the first connecting board and the second connecting board. The technical scheme has the beneficial effects that the circuit conduction between the layers of the printed circuit board is realized through the board edge drilling, the number of blind holes in the board is reduced, the appearance of the printed circuit board is not changed, and the wiring space and the design cost of the printed circuit board are saved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, and in particular to a printed circuit board that saves wiring space. Background Art

[0002] With the continuous advancement of technology, many electronic products are moving towards miniaturization, such as mobile phones and laptops. Nowadays, mobile phone research and development pays more and more attention to thin and light design, which leads to extremely limited internal space of the product. All components, including PCB (printed circuit board), need to be miniaturized. This demand brings great challenges to designers and developers. For example, the area of ​​PCB board is very limited, but in order to achieve high functional integration, the space for circuit layout becomes extremely narrow, and it is even difficult to add additional blind holes or vias (VIA).

[0003] Function of VIA hole: VIA hole is mainly used to achieve electrical conduction between different layers in PCB design. Its internal copper plating process allows the signal to pass from one circuit layer to another. The diameter of VIA hole is usually small and must be round to ensure its functionality and manufacturing consistency.

[0004] Application of VIA holes on pads: When the VIA holes are located on the component pads, the pads are used for component soldering. In this case, in order to prevent the solder paste from flowing into the back of the PCB during the reflow process, the VIA holes need to be treated with resin plugging. This treatment ensures that the solder paste solidifies only in the predetermined pad area, thereby ensuring the soldering quality.

[0005] Application of VIA holes in pad leads: VIA holes can be directly drilled at the lead position of the pad. This design does not require resin plugging. This can simplify the production process and achieve electrical connection between multiple layers when necessary.

[0006] Application of VIA holes on copper layers: VIA holes can also be directly punched on the copper layer of the PCB. It helps to conduct with other circuit layers, thereby expanding the effect of the current channel. It is often used in circuit designs that need to increase current carrying capacity or strengthen electrical connections.

[0007] PCB drilling shape and size: PCB drilling can have a variety of shapes, including circular, oval, rectangular, etc. There is no fixed limit on the size of the hole, the inner diameter can be designed according to actual needs, and whether copper plating is required can be determined.

[0008] Drilling's soldering function: Drilling can be used to solder component pins. In this application, the tin layer in the hole helps to electrically connect the component pins to the circuit on the PCB, ensuring the stability and functionality of the component.

[0009] Drilled holes as screw holes: Drilled holes can also be used as screw holes without tinning. In this case, the drilled holes are used to install screws to fix electronic components or other components to the PCB.

[0010] Drilling as hollow areas: Drilling can also be used as hollow areas inside the board. This design can be used to reduce the weight of the PCB, improve heat dissipation performance, or create other structural design requirements.

[0011] In the prior art, the design space can usually be increased by expanding the area of ​​the PCB board, but this method will increase the production cost and increase the design time and cost due to the change of the PCB board shape. In addition, the enlarged PCB board will face problems such as assembly difficulty. Summary of the invention

[0012] The purpose of the present invention is to provide a printed circuit board that saves wiring space and solves the above technical problems;

[0013] A printed circuit board for saving wiring space, comprising:

[0014] A hole ring pad is arranged on the welding surface of the printed circuit board, and a board edge drill hole is opened on the hole ring pad. One side of the board edge drill hole is tangent to the first connecting plate, and the other side of the board edge drill hole is tangent to the second connecting plate. The board edge drill hole is used to conduct the internal layers of the first connecting plate and the second connecting plate.

[0015] Preferably, the plate edge drilled hole is an elliptical drilled hole, a first side wall of the plate edge drilled hole is tangent to the plate edge of the first connecting plate, and a second side wall of the plate edge drilled hole is tangent to the plate edge of the second connecting plate.

[0016] Preferably, the inner wall of the board edge drill hole is plated with copper.

[0017] Preferably, the first connecting plate comprises:

[0018] At least one top layer and one bottom layer, a first top layer connection circuit is provided in the top layer of the first connection board, a first bottom layer connection circuit is provided in the bottom layer of the first connection board, the first top layer connection circuit is connected to the board edge drilling hole, and the first bottom layer connection circuit is connected to the board edge drilling hole.

[0019] Preferably, the second connecting plate comprises:

[0020] At least one top layer and one bottom layer, a second top layer connecting circuit is provided in the top layer of the second connecting board, a second bottom layer connecting circuit is provided in the bottom layer of the second connecting board, the second top layer connecting circuit is connected to the board edge drilling hole, and the second bottom layer connecting circuit is connected to the board edge drilling hole.

[0021] Preferably, the first top-layer connection circuit includes a first top-layer electronic component and a first top-layer routing line, and the first bottom-layer connection circuit includes a first bottom-layer electronic component and a first bottom-layer routing line.

[0022] Preferably, the second top-layer connection circuit includes a second top-layer electronic component and a second top-layer routing line, and the second bottom-layer connection circuit includes a second bottom-layer electronic component and a second bottom-layer routing line.

[0023] Preferably, a first board edge routing distance on the first connecting board and a second board edge routing distance on the second connecting board are both less than 0.35 mm.

[0024] Preferably, the width of the hole ring pad is 6 mil to 10 mil.

[0025] Preferably, a first circular pad is provided on the welding surface of the first connecting plate, and a first circular drilling hole penetrating through the first connecting plate is opened on the first circular pad;

[0026] A second circular pad is disposed on the welding surface of the second connecting plate, and a second circular drilling hole penetrating through the second connecting plate is opened on the second circular pad.

[0027] The beneficial effects of the present invention are: circuit conduction between layers of the printed circuit board is achieved by drilling holes at the edge of the board, the number of blind holes in the board is reduced, the shape of the printed circuit board is not changed, and the wiring space and design cost of the printed circuit board are saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a top view of a printed circuit board for saving wiring space of the present invention;

[0029] Figure 2 It is a cross-sectional view of a printed circuit board for saving wiring space according to the present invention.

[0030] In the accompanying drawings: 1. first connecting board; 2. second connecting board; 3. hole ring pad; 4. board edge drilling; 5. first board edge routing distance; 6. second board edge routing distance; 7. first top-layer electronic components; 8. second top-layer electronic components; 9. first top-layer routing; 10. second top-layer routing; 11. first bottom-layer electronic components; 12. first bottom-layer routing. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0033] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0034] A printed circuit board that saves wiring space, such as Figure 1 , Figure 2 As shown, including,

[0035] A hole ring pad 3 is arranged on the welding surface of the printed circuit board, and a board edge drill hole 4 is opened on the hole ring pad 3. One side of the board edge drill hole 4 is tangent to the first connecting plate 1, and the other side of the board edge drill hole 4 is tangent to the second connecting plate 2. The board edge drill hole 4 is used to conduct the internal layers of the first connecting plate 1 and the second connecting plate 2.

[0036] Specifically, the present invention provides a printed circuit board that saves wiring space. The circuits between various layers of the printed circuit board are connected by drilling holes on the edge of the board, the number of blind holes in the board is reduced, the shape of the printed circuit board is not changed, and the wiring space and design cost of the printed circuit board are saved.

[0037] Specifically, the wiring space inside the PCB is made more spacious, so that other functional components can be arranged more efficiently. The use of edge drilling reduces the complex wiring in the central area, thereby simplifying the design and manufacturing process and improving the efficiency of wiring.

[0038] Edge drilling provides flexible routing options, allowing for more freedom in arranging routing on other layers during design without being limited by the routing density in the center area. This reduces the need for complex routing inside the board, making the PCB design simpler and reducing issues with inter-layer conduction and signal interference. By arranging drilling holes on the edge of the board, signal crosstalk generated during internal routing is avoided, improving signal integrity and stability.

[0039] The edge area is usually able to dissipate heat better, which helps improve the thermal management of the PCB and avoids heat accumulation in the central area. The edge drilling design helps to simplify the production process of the PCB, especially in high-density wiring design, which can reduce production complexity and cost. It reduces the complex wiring inside the board, simplifies the assembly process of components, and improves the reliability and efficiency of production.

[0040] In a preferred embodiment, the plate edge drilled hole 4 is an elliptical drilled hole, the first side wall of the plate edge drilled hole 4 is tangent to the plate edge of the first connecting plate 1 , and the second side wall of the plate edge drilled hole 4 is tangent to the plate edge of the second connecting plate 2 .

[0041] Specifically, the elliptical drilling occupies less space in the edge area, effectively utilizing the wiring space in the edge area while maintaining the connection function. The elliptical drilling can reduce the edge stress concentration that may be caused by traditional circular drilling, thereby enhancing the mechanical strength and durability of the PCB.

[0042] The oval hole design can provide a larger contact area, which helps to enhance the reliability of electrical connection. Oval holes are usually easier to control during the manufacturing process, which helps to improve the overall manufacturing accuracy and reduce manufacturing errors.

[0043] In a preferred embodiment, the inner wall of the plate edge drilled hole 4 is plated with copper.

[0044] Specifically, copper plating can provide good electrical conductivity, allowing current to be transmitted more efficiently between different layers, thereby improving the reliability of electrical connections. Copper plating helps reduce the resistance of current in the vias, enhancing the quality and stability of signal transmission. Copper plating can increase the mechanical strength of the hole wall, making the drilled hole less susceptible to damage when the PCB is subjected to mechanical stress, thereby improving the durability of the overall structure.

[0045] In a preferred embodiment, the first connecting plate 1 comprises:

[0046] At least one top layer and one bottom layer, the top layer of the first connecting plate 1 is provided with a first top layer connecting line, the bottom layer of the first connecting plate 1 is provided with a first bottom layer connecting line, the first top layer connecting line is connected to the plate side with a hole 4, and the first bottom layer connecting line is connected to the plate side with a hole 4;

[0047] The second connecting plate 2 comprises,

[0048] At least one top layer and one bottom layer, a second top layer connecting line is arranged in the top layer of the second connecting board 2, a second bottom layer connecting line is arranged in the bottom layer of the second connecting board 2, a hole 4 is drilled on the edge of the connecting board for the second top layer connecting line, and a hole 4 is drilled on the edge of the connecting board for the second bottom layer connecting line.

[0049] Specifically, comprehensive connection can be provided, and the connection lines of the top layer and the bottom layer ensure that the board edge drilling holes 4 can effectively transmit signals and currents between different layers, thereby improving the reliability of the electrical connection.

[0050] The top layer and the bottom layer are directly connected to the board edge drilling hole 4, which can reduce the wiring that needs to be arranged and save space on the PCB.

[0051] Connecting directly to edge drill via 4 helps reduce the path length of signal transmission, reducing signal loss and delay.

[0052] In a preferred embodiment, the first top-layer connection circuit includes a first top-layer electronic component 7 and a first top-layer routing line 9, and the first bottom-layer connection circuit includes a first bottom-layer electronic component 11 and a first bottom-layer routing line 12;

[0053] The second top-layer connection circuit includes a second top-layer electronic component 8 and a second top-layer routing line 10 , and the second bottom-layer connection circuit includes a second bottom-layer electronic component and a second bottom-layer routing line.

[0054] Specifically, refer to Figure 2 , the first top layer wiring 9 on the top surface of the PCB needs to be connected to the first bottom layer wiring 12 on the bottom surface, and the most direct method is to directly connect them by drilling VIA holes. If the wiring in the board is dense, drilling a VIA may interfere with the wiring on other levels. The present invention places an elliptical hole ring on the edge of the board, the line on the top surface is connected to the elliptical hole ring on the edge of the board, and the line on the bottom surface is also connected to the elliptical hole ring on the edge of the board, and then the copper foil on the inner wall of the hole of the elliptical hole ring is connected, so that the board is connected without changing the area and appearance of the PCB board.

[0055] To be more specific, the PCB board can be designed as a multi-layer circuit board, and a circle of bottom line is wrapped around the outer periphery of the circuit board to reduce external electromagnetic interference. Due to the limitations of the shape design of some boards and the limited routing space in local areas, VIA holes cannot be drilled (the drilling size is 0.15mm and the hole ring size is 0.35mm). When the routing space at the edge of the board is less than 0.35mm, VIA holes cannot be drilled in this space. In this case, in order to achieve signal conduction between layers, the invented board edge drilling copper plating design is adopted, and the space at the edge of the board is used for side copper plating process, so that the PCB board is conductive from top to bottom, achieving the same purpose as drilling VIA holes.

[0056] In a preferred embodiment, the first board edge routing distance 5 on the first connecting board 1 and the second board edge routing distance 6 on the second connecting board 2 are both less than 0.35 mm. Specifically, the board edge routing space is less than 0.35 mm, and the traditional method cannot drill VIA holes. The method proposed in this application of copper plating on the board edge can achieve the conduction of the circuit board within 0.35 mm. This method can not only effectively utilize other layers of the printed circuit board to complete the conduction, but also avoid the need to change the appearance of the circuit board, thereby reducing the number of VIA holes and saving space in the board. The routing layout is optimized and the space utilization rate of the circuit board design is improved.

[0057] In a preferred embodiment, the width of the annular ring pad 3 is 6 mil to 10 mil.

[0058] Specifically, by providing an annular ring pad 3 between the first connecting plate 1 and the second connecting plate 2, and opening a board edge drill hole 4 on the annular ring pad 3, the internal layer of the printed circuit board can be effectively used for conduction. This design reduces the need for VIA holes, thereby optimizing the spatial layout of the circuit board.

[0059] Using the board edge drilling hole 4 as the conduction mode instead of drilling VIA holes in a narrow space can reduce the need for complex drilling processes in the production process, simplify the manufacturing process and improve production efficiency.

[0060] When designing a circuit board, this method can realize complex connections within a limited space, avoiding the need to modify the circuit board shape due to space limitations, thereby increasing the flexibility and adaptability of the design.

[0061] The width of the annular ring pad 3 is set within the range of 6mil to 10mil, which helps to ensure a good connection between the pad and the drill hole and improve the reliability of electrical conduction. At the same time, such a width selection also helps to prevent the copper foil from falling off the PCB board due to insufficient adhesion when the board is washed, causing problems such as poor circuit contact.

[0062] In a preferred embodiment, a first circular pad is provided on the welding surface of the first connecting plate 1, and a first circular drilling hole penetrating through the first connecting plate 1 is opened on the first circular pad;

[0063] A second circular pad is disposed on the welding surface of the second connecting plate 2 , and a second circular drilled hole penetrating through the second connecting plate 2 is opened on the second circular pad.

[0064] Specifically, by providing through holes (first circular drilled holes and second circular drilled holes) on the first connection board 1 and the second connection board 2, direct electrical connection can be achieved between the two layers of the circuit board, reducing the need for additional VIA holes. This design effectively utilizes existing pads and apertures, reducing wiring complexity and space occupancy.

[0065] Using through holes to connect the pads of two layers of circuit boards helps reduce the number of jumpers between layers. This simplified wiring method reduces the complexity of wiring, thereby optimizing the design of the circuit board and reducing the difficulty of design and manufacturing.

[0066] Reducing the use of traditional VIA holes can reduce the interference and delay that the signal may encounter during transmission. Reducing the transition points in the signal path helps to improve the overall signal integrity and stability of the circuit.

[0067] By reducing wiring complexity and reducing the number of VIA holes, the production process of the circuit board can be simplified. This not only shortens the manufacturing cycle, but also reduces the error rate in production, thereby improving production efficiency and quality control.

[0068] Reducing extra VIA holes and wiring complexity can reduce the material and manufacturing costs of the circuit board. By simplifying the production process and reducing extra process steps, the overall production cost can be effectively reduced.

[0069] Opening through holes on the pads can provide stronger mechanical support and help improve the structural strength and stability of the circuit board. This design method helps to improve the durability and reliability of the circuit board in practical applications.

[0070] By setting through holes on the pads, designers can flexibly optimize the wiring without changing the appearance of the circuit board. This design method provides more design freedom, allowing the circuit board to better adapt to complex application requirements.

[0071] Reference Figure 1 The present invention relates to an improved PCB design and preparation method to optimize electrical conduction and manufacturing process. The specific design and preparation method is as follows:

[0072] Drilling design: The present invention adopts an elliptical drilling, and its inner wall is copper-plated. The width of the hole ring pad 3 is designed to be between 6mil and 10mil to ensure that the hole ring width of all layers inside the PCB board is consistent. The surface hole ring is not coated with solder paste.

[0073] Drilling location: The elliptical holes are arranged at the edge of the PCB board, and the inner wall of the holes is tangent to the board edge. This helps to maintain the structural stability of the holes and optimize electrical performance.

[0074] Preparation method: The preparation process begins with drilling an elliptical hole in the board factory and copper plating the inner wall of the hole. Then, the narrow edge of the elliptical hole and the excess scrap board are cut off from left to right and from right to left using the board edge dividing groove. After cutting, the remaining long edge is electrically connected to other layers of the PCB through the copper foil on the inner wall of the hole.

[0075] The present invention is not limited to designing the hole between two products, which is mainly determined by the appearance of the products. Figure 1 When making a panel for two products, the same part can be used and only one hole can be drilled, which can improve the utilization rate of the panel. By drilling an elliptical hole on the edge of the board, the copper foil on the inner wall of the long side of the elliptical hole is directly connected to the circuits on other layers, reducing the number of VIA holes drilled inside the PCB board, leaving a channel for the actual routing space of the board.

[0076] In summary, the present application provides a printed circuit board that saves wiring space. By copper plating the edge of the board and conducting with other layers of the printed circuit board, the problem of insufficient wiring space on the printed circuit board is solved. There is no need to change the shape of the board, the number of VIAs is reduced, and space within the board is saved.

[0077] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed circuit board that saves wiring space, characterized in that: include, A hole ring pad (3) is provided on the welding surface of the printed circuit board, and a board edge drill hole (4) is opened on the hole ring pad (3), one side of the board edge drill hole (4) is tangent to the first connecting plate (1), and the other side of the board edge drill hole (4) is tangent to the second connecting plate (2), and the board edge drill hole (4) is used to conduct the internal layers of the first connecting plate (1) and the second connecting plate (2).

2. The printed circuit board for saving wiring space according to claim 1, characterized in that: The plate edge drill hole (4) is an elliptical drill hole, the first side wall of the plate edge drill hole (4) is tangent to the plate edge of the first connecting plate (1), and the second side wall of the plate edge drill hole (4) is tangent to the plate edge of the second connecting plate (2).

3. The printed circuit board for saving wiring space according to claim 1, characterized in that: The inner wall of the plate edge drill hole (4) is plated with copper.

4. The printed circuit board for saving wiring space according to claim 1, characterized in that: The first connecting plate (1) comprises: At least one top layer and one bottom layer, the top layer of the first connecting plate (1) is provided with a first top layer connecting line, the bottom layer of the first connecting plate (1) is provided with a first bottom layer connecting line, the first top layer connecting line is connected to the plate edge drilling hole (4), and the first bottom layer connecting line is connected to the plate edge drilling hole (4).

5. The printed circuit board for saving wiring space according to claim 1, characterized in that: The second connecting plate (2) comprises: At least one top layer and one bottom layer, the top layer of the second connecting plate (2) is provided with a second top layer connecting line, the bottom layer of the second connecting plate (2) is provided with a second bottom layer connecting line, the second top layer connecting line is connected to the plate edge drilling hole (4), and the second bottom layer connecting line is connected to the plate edge drilling hole (4).

6. The printed circuit board for saving wiring space according to claim 4, characterized in that: The first top-layer connection circuit comprises a first top-layer electronic component (7) and a first top-layer routing line (9), and the first bottom-layer connection circuit comprises a first bottom-layer electronic component (11) and a first bottom-layer routing line (12).

7. The printed circuit board for saving wiring space according to claim 5, characterized in that: The second top-layer connection circuit includes a second top-layer electronic component (8) and a second top-layer routing line (10), and the second bottom-layer connection circuit includes a second bottom-layer electronic component and a second bottom-layer routing line.

8. The printed circuit board for saving wiring space according to claim 1, characterized in that: The first board edge routing distance (5) on the first connecting board (1) and the second board edge routing distance (6) on the second connecting board (2) are both less than 0.35 mm.

9. The printed circuit board for saving wiring space according to claim 1, characterized in that: The width of the hole ring pad (3) is 6 mil to 10 mil.

10. The printed circuit board for saving wiring space according to claim 1, characterized in that: A first circular welding pad is provided on the welding surface of the first connecting plate (1), and a first circular drilling hole penetrating through the first connecting plate (1) is opened on the first circular welding pad; A second circular welding pad is provided on the welding surface of the second connecting plate (2), and a second circular drilling hole penetrating through the second connecting plate (2) is opened on the second circular welding pad.

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