Novel ceramic plate jointed board production process

Abstract

The invention belongs to the field of ceramic circuit board production, and particularly relates to a novel ceramic plate jointed board production process which comprises the following specific steps: S1, raw material preparation: selecting high-purity aluminum oxide, aluminum nitride or silicon nitride as a base material, and screening proper particle sizes and shapes according to product requirements; s2, burdening: mixing a base material and an additive according to a certain proportion to obtain a mixture so as to obtain required performance and process characteristics; s3, preparing slurry, namely preparing the mixture in the S2 into the slurry so as to facilitate subsequent printing and forming; s4, printing: printing the slurry on a ceramic substrate by using modes such as silk-screen printing or offset printing so as to form a required circuit pattern; s5, sintering: sintering the printed ceramic substrate at a high temperature to completely cure the slurry; the staggered splicing grooves are formed in the surface of the ceramic substrate, so that the strength of the ceramic circuit board is higher in the processing process, and the ceramic circuit board is not easy to break.

Description

Technical Field

[0001] The invention belongs to the field of ceramic circuit board production, in particular to a novel ceramic board assembly production process. Background Art

[0002] Ceramic circuit board is a circuit board made of ceramic materials, also known as ceramic PCB. Unlike the common glass fiber reinforced plastic substrate, ceramic circuit board uses ceramic substrate, which can provide higher temperature stability, better mechanical strength, better dielectric properties and longer life. Ceramic circuit boards are mainly used in high temperature, high frequency and high power circuits, such as LED lights, power amplifiers, semiconductor lasers, RF transceivers, sensors and microwave devices.

[0003] During the production process of ceramic circuit boards, the ceramic circuit boards need to be spliced. The traditional ceramic circuit board structure is that the gaps on the front and back sides overlap. When splicing the ceramic circuit boards, due to the large rigidity of the ceramic circuit boards and the gaps in the ceramic circuit boards, the connection area between the splicing and the ceramic circuit boards is small, which can easily make the structural frame of the ceramic circuit boards break, resulting in damage to the ceramic circuit boards, which can easily affect the processing of the ceramic circuit boards.

[0004] To this end, the present invention provides a novel ceramic panel assembly production process. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a new ceramic panel assembly production process described in the present invention, the specific steps of the production process are as follows:

[0007] S1: Raw material preparation, select high-purity alumina, aluminum nitride or silicon nitride as the base material, and select the appropriate particle size and shape according to product requirements;

[0008] S2: batching, mixing the base material and additives in a certain proportion to obtain a mixture to obtain the required performance and process characteristics;

[0009] S3: preparing slurry, making the mixed material in S2 into slurry for subsequent printing and molding;

[0010] S4: Printing, using screen printing or offset printing to print the slurry onto the ceramic substrate to form the desired circuit pattern;

[0011] S5: sintering, sintering the printed ceramic substrate at high temperature to completely solidify the slurry and achieve a firm bond between the circuit pattern and the ceramic substrate;

[0012] S6: Processing, cutting, grinding, drilling, etc. are performed on the sintered ceramic substrate to obtain the required size and shape, and at the same time, staggered splicing grooves are cut on the surface of the ceramic substrate, and the ceramic substrate is spliced ​​and fixed;

[0013] S7: Inspection, quality inspection of the processed ceramic substrate;

[0014] S8: Packaging: Pack qualified products to protect the ceramic substrate from damage during transportation.

[0015] Preferably, the steps of splicing the ceramic substrate in S6 are as follows:

[0016] S11: drilling fixing holes at the same position on a plurality of ceramic substrates;

[0017] S12: Use ceramic matrix composite materials to produce pins or rivets with appropriate length and diameter;

[0018] S13: After the splicing grooves of the ceramic substrate are spliced ​​together, the ceramic substrate is fixed using pins or rivets and connectors;

[0019] S14: The pins or rivets and the ceramic substrate are fixed by using a chemical vapor infiltration deposition method to complete the splicing of the ceramic substrate.

[0020] Preferably, the additive in S2 can be an oxide sintering aid, a non-oxide sintering aid or other sintering aid. When silicon nitride ceramics are sintered, the main function of the additive is to promote the sintering process and improve the microstructure and properties of the material. By using different additives, the density, strength, thermal properties and mechanical properties of silicon nitride ceramics can be optimized, making the performance of the ceramic substrate more excellent.

[0021] Preferably, the oxide sintering aid may be aluminum oxide, aluminum oxide, chromium oxide or silicon oxide. Rare earth oxides may also be used as sintering aids instead of metal oxides. Crystalline phases formed by rare earth elements and silicon oxide nitrogen are found in grain boundaries, and silicon nitride ceramic materials with better performance are prepared. However, rare earth oxides are relatively expensive and are usually used in the manufacture of more sophisticated equipment.

[0022] Preferably, the non-oxide sintering aid may be a metal carbide, nitride or boride, such as silicon carbide, boron nitride or magnesium boride.

[0023] Preferably, the other sintering aids may be ceramic fibers or metal nanoparticles.

[0024] Preferably, after printing in S4 is completed, the ceramic substrate needs to be fully dried. The reasons for drying are as follows: removing solvents. The conductive paste usually contains a certain proportion of solvents to facilitate printing and coating. These solvents will gradually evaporate during the drying process. If they are not removed, they may have an adverse effect on the conductive performance and stability; curing the conductive paste. During the drying process, the organic components in the conductive paste will gradually solidify to form a stable conductive film, which helps to improve the conductive performance and stability and increase durability; enhancing adhesion. The adhesion between the conductive film and the ceramic substrate will be enhanced after drying, and it will not fall off or crack easily; avoiding pollution. If the conductive paste is not completely dried, it may be contaminated during subsequent processing, such as dust, fingerprints, etc. The surface of the conductive film after drying is smoother and less susceptible to pollution.

[0025] Preferably, the ceramic board detection step in S7 includes appearance inspection, dimension measurement, conductivity test, function test, electrical property test and thermal performance test.

[0026] The beneficial effects of the present invention are as follows:

[0027] 1. The novel ceramic panel splicing production process described in the present invention can make the ceramic circuit board stronger during the processing and less prone to breakage by opening staggered splicing grooves on the surface of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] Figure 1 It is a process flow chart of the production process in the present invention;

[0030] Figure 2 is a flow chart of the steps of splicing ceramic substrates in the present invention;

[0031] Figure 3 It is a front schematic diagram of the finished ceramic substrate of the present invention;

[0032] Figure 4 It is a schematic diagram of the back side of the finished ceramic substrate of the present invention;

[0033] Figure 5 It is a schematic diagram of the splicing structure of the finished ceramic substrate of the present invention. DETAILED DESCRIPTION

[0034] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0035] like Figure 1As shown, a novel ceramic panel assembly production process according to an embodiment of the present invention has the following specific steps:

[0036] S1: Raw material preparation, select high-purity alumina, aluminum nitride or silicon nitride as the base material, and select the appropriate particle size and shape according to product requirements;

[0037] S2: batching, mixing the base material and additives in a certain proportion to obtain a mixture to obtain the required performance and process characteristics;

[0038] S3: preparing slurry, making the mixed material in S2 into slurry for subsequent printing and molding;

[0039] S4: Printing, using screen printing or offset printing to print the slurry onto the ceramic substrate to form the desired circuit pattern;

[0040] S5: sintering, sintering the printed ceramic substrate at high temperature to completely solidify the slurry and achieve a firm bond between the circuit pattern and the ceramic substrate;

[0041] S6: Processing, cutting, grinding, drilling, etc. are performed on the sintered ceramic substrate to obtain the required size and shape, and at the same time, staggered splicing grooves are cut on the surface of the ceramic substrate, and the ceramic substrate is spliced ​​and fixed;

[0042] S7: Inspection, quality inspection of the processed ceramic substrate;

[0043] S8: Packaging: Pack qualified products to protect the ceramic substrate from damage during transportation.

[0044] like Figure 2 As shown, the steps for splicing the ceramic substrate in S6 are as follows:

[0045] S11: drilling fixing holes at the same position on a plurality of ceramic substrates;

[0046] S12: Use ceramic matrix composite materials to produce pins or rivets with appropriate length and diameter;

[0047] S13: After the splicing grooves of the ceramic substrate are spliced ​​together, the ceramic substrate is fixed using pins or rivets and connectors;

[0048] S14: The pins or rivets and the ceramic substrate are fixed by using a chemical vapor infiltration deposition method to complete the splicing of the ceramic substrate.

[0049] The additive in S2 can be an oxide sintering aid, a non-oxide sintering aid or other sintering aid. When sintering silicon nitride ceramics, the main function of the additive is to promote the sintering process and improve the microstructure and properties of the material. By using different additives, the density, strength, thermal properties and mechanical properties of silicon nitride ceramics can be optimized, making the performance of the ceramic substrate even better.

[0050] The oxide sintering aid can be aluminum oxide, aluminum oxide, chromium oxide or silicon oxide. Rare earth oxides can also be used instead of metal oxides as sintering aids. Crystalline phases formed by rare earth elements and silicon oxide nitrogen are found in the grain boundaries, and silicon nitride ceramic materials with better performance are prepared. However, rare earth oxides are relatively expensive and are usually used in the manufacture of more sophisticated equipment.

[0051] The non-oxide sintering aid may be a metal carbide, nitride or boride, such as silicon carbide, boron nitride or magnesium boride.

[0052] The other sintering aids may be ceramic fibers or metal nanoparticles.

[0053] After printing in S4 is completed, the ceramic substrate needs to be fully dried. The reasons for drying are as follows: remove solvents. Conductive paste usually contains a certain proportion of solvents to facilitate printing and coating. These solvents will gradually evaporate during the drying process. If they are not removed, they may have an adverse effect on the conductive performance and stability; solidify the conductive paste. During the drying process, the organic components in the conductive paste will gradually solidify to form a stable conductive film, which helps to improve the conductive performance and stability and increase durability; enhance adhesion. The adhesion between the dried conductive film and the ceramic substrate will be enhanced and will not easily fall off or crack; avoid pollution. If the conductive paste is not completely dried, it may be contaminated during subsequent processing, such as dust, fingerprints, etc. The surface of the dried conductive film is smoother and less susceptible to pollution.

[0054] The ceramic board inspection steps in S7 include appearance inspection, dimension measurement, conductivity test, functional test, electrical characteristics test and thermal performance test.

[0055] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A new ceramic panel production process, characterized in that: The specific steps of the production process are as follows: S1: Raw material preparation, select high-purity alumina, aluminum nitride or silicon nitride as the base material, and select the appropriate particle size and shape according to product requirements; S2: batching, mixing the base material and additives in a certain proportion to obtain a mixture to obtain the required performance and process characteristics; S3: preparing slurry, making the mixed material in S2 into slurry for subsequent printing and molding; S4: Printing, using screen printing or offset printing to print the slurry onto the ceramic substrate to form the desired circuit pattern; S5: sintering, sintering the printed ceramic substrate at high temperature to completely solidify the slurry and achieve a firm bond between the circuit pattern and the ceramic substrate; S6: Processing, cutting, grinding, drilling and other processing are performed on the sintered ceramic substrate to obtain the required size and shape, and at the same time, splicing grooves are cut on the surface of the ceramic substrate, and the ceramic substrate is spliced ​​and fixed; S7: Inspection, quality inspection of the processed ceramic substrate; S8: Packaging: Pack qualified products to protect the ceramic substrate from damage during transportation.

2. A novel ceramic panel production process according to claim 1, characterized in that: The steps for splicing the ceramic substrate in S6 are as follows: S11: drilling fixing holes at the same position on a plurality of ceramic substrates; S12: Use ceramic matrix composite materials to produce pins or rivets with appropriate length and diameter; S13: After the splicing grooves of the ceramic substrate are spliced ​​together, the ceramic substrate is fixed using pins or rivets and connectors; S14: The pins or rivets and the ceramic substrate are fixed by using a chemical vapor infiltration deposition method to complete the splicing of the ceramic substrate.

3. A novel ceramic panel production process according to claim 1, characterized in that: The additive in S2 may be an oxide sintering aid, a non-oxide sintering aid or other sintering aids.

4. A novel ceramic panel production process according to claim 3, characterized in that: The oxide sintering aid may be aluminum oxide, aluminum oxide, chromium oxide or silicon oxide.

5. A novel ceramic panel production process according to claim 3, characterized in that: The non-oxide sintering aid may be a metal carbide, a nitride or a boride.

6. A novel ceramic panel production process according to claim 3, characterized in that: The other sintering aids may be ceramic fibers or metal nanoparticles.

7. A novel ceramic panel production process according to claim 1, characterized in that: After the printing in S4 is completed, the ceramic substrate needs to be fully dried.

8. A novel ceramic panel production process according to claim 1, characterized in that: The ceramic board inspection steps in S7 include appearance inspection, dimension measurement, conductivity test, functional test, electrical characteristics test and thermal performance test.

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