Display panel preparation method, display panel and display terminal

Abstract

The embodiment of the invention provides a display panel preparation method, a display panel and a display terminal. The preparation method of the display panel comprises the following steps: sequentially forming a first electrode layer, a pixel definition layer and an isolation structure layer on a substrate; a pixel opening is formed in the pixel definition layer, and a first pixel, a second pixel and a third pixel are arranged in the pixel opening; before the first pixels are formed in the first pixel openings corresponding to the first pixels, protection layers are arranged in the second pixel openings corresponding to the second pixels and the third pixel openings corresponding to the third pixels; and forming a first pixel in the first pixel opening, removing the protective layer after the first pixel is formed, and respectively forming the second pixel and the third pixel in the other pixel openings. According to the embodiment of the invention, bad conditions in the manufacturing process of the OLED panel are effectively reduced, and the yield of the OLED panel is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display terminal. Background Art

[0002] Organic light emitting diodes (OLEDs) and flat panel display devices based on technologies such as light emitting diodes (LEDs) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the Invention

[0004] In view of this, embodiments of the present application provide a display panel manufacturing solution to at least partially solve the above-mentioned problems.

[0005] According to a first aspect of an embodiment of the present application, a method for preparing a display panel is provided, the method comprising:

[0006] forming a first electrode layer, a pixel definition layer, and an isolation structure layer on a substrate in sequence, wherein the isolation structure layer includes an isolation structure and a plurality of isolation openings surrounded by the isolation structure;

[0007] Opening a pixel opening on the pixel definition layer to dispose a first pixel, a second pixel, and a third pixel in the pixel opening;

[0008] Before forming the first pixel in the first pixel opening corresponding to the first pixel, disposing a protective layer in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel;

[0009] A first pixel is formed in the first pixel opening. After the first pixel is formed, the protective layer is removed, and the second pixel and the third pixel are respectively formed in the remaining pixel openings.

[0010] In an optional embodiment, providing a protective layer in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel includes:

[0011] The second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel are filled with photoresist to form the protection layer.

[0012] In an optional embodiment, filling the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel with photoresist to form the protective layer includes:

[0013] Negative photoresist is used to completely fill the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel; and the negative photoresist at least partially covers at least a portion of the surface of the isolation structure corresponding to the second pixel opening and the third pixel opening away from the substrate to form the protective layer.

[0014] In an optional embodiment, the isolation structure includes a first portion and a second portion, and the first portion is disposed on a side of the second portion away from the substrate;

[0015] The negative photoresist at least partially covers at least a portion of the surface of the isolation structure corresponding to the second pixel opening and the third pixel opening, which is away from the substrate, and includes:

[0016] The negative photoresist at least partially covers at least a portion of the surface of the first portion of the isolation structure corresponding to the second pixel opening and the third pixel opening, which is away from the substrate.

[0017] In an optional embodiment, before forming the first pixel in the first pixel opening corresponding to the first pixel, providing a protective layer in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel, includes:

[0018] A protective layer is provided in a second pixel opening corresponding to the second pixel and a third pixel opening corresponding to the third pixel through a mask.

[0019] In an optional embodiment, after forming the first pixel, removing the protective layer and forming the second pixel and the third pixel in the remaining pixel openings respectively include:

[0020] After forming the first pixel, removing the protective layer in the second pixel opening and the protective layer in the third pixel opening;

[0021] forming the second pixel in the second pixel opening corresponding to the second pixel;

[0022] After forming the second pixel, the third pixel is formed in a third pixel opening corresponding to the third pixel.

[0023] In an optional embodiment, after forming the first pixel, removing the protective layer and forming the second pixel and the third pixel in the remaining pixel openings respectively include:

[0024] After forming the first pixel, the protective layer in the second pixel opening is removed, and the protective layer in the third pixel opening is retained;

[0025] The second pixel is formed in the second pixel opening;

[0026] After forming the second pixel, the protective layer in the third pixel opening is removed, and the third pixel is formed in the third pixel opening.

[0027] In an optional embodiment, after forming the first pixel, removing the protective layer, and forming the second pixel and the third pixel in the remaining pixel openings respectively includes:

[0028] After forming the first pixel, the protective layer in the second pixel opening and the protective layer in the third pixel opening are removed;

[0029] A protective layer is provided in the third pixel opening;

[0030] The second pixel is formed in the second pixel opening;

[0031] After forming the second pixel, the protective layer in the third pixel opening is removed, and the third pixel is formed in the third pixel opening.

[0032] In an optional embodiment, for the isolation structure corresponding to the first pixel opening, the protruding part of the first part compared with the second part in the positive projection on the substrate is SA1, the protruding part of the first part compared with the second part in the isolation structure corresponding to the second pixel opening in the positive projection on the substrate is SA2, and the protruding part of the first part compared with the second part in the isolation structure corresponding to the third pixel opening in the positive projection on the substrate is SA3. There is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

[0033] In an optional embodiment, forming the first pixel in the first pixel opening includes:

[0034] The first light-emitting layer, the second electrode layer, and the encapsulation layer are sequentially formed in the first pixel opening;

[0035] Wherein, the second electrode layer is disposed on a side of the first light-emitting layer away from the substrate, and the encapsulation layer is disposed on a side of the second electrode layer away from the substrate.

[0036] According to a second aspect of the embodiments of the present application, a display panel is provided, including:

[0037] A substrate, a first electrode layer, a pixel definition layer, and an isolation structure layer;

[0038] Among them, the first electrode layer is disposed on the substrate; the pixel defining layer is disposed on a side of the first electrode layer away from the substrate; the isolation structure layer is disposed on a side of the pixel defining layer away from the substrate;

[0039] The isolation structure layer includes an isolation structure, and the isolation structure includes a first part and a second part. The first part is disposed on a side of the second part away from the substrate; a positive projection of the second part on the substrate is located within a positive projection of the first part on the substrate;

[0040] It further includes: a first pixel, a second pixel, and a third pixel; among them, at least a part of the first pixel is disposed in a first pixel opening on the pixel defining layer, at least a part of the second pixel is disposed in a second pixel opening on the pixel defining layer, and at least a part of the third pixel is disposed in a third pixel opening on the pixel defining layer;

[0041] Among them, a protruding part of the first part of the isolation structure corresponding to the first pixel opening compared to the positive projection of the second part on the substrate is SA1, a protruding part of the first part of the isolation structure corresponding to the second pixel opening compared to the positive projection of the second part on the substrate is SA2, and a protruding part of the first part of the isolation structure corresponding to the third pixel opening compared to the positive projection of the second part on the substrate is SA3. There is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

[0042] In an optional embodiment, a protruding part of the first part of the isolation structure compared to the positive projection of the second part on the substrate ranges from greater than 0.3 micrometers to less than 1.0 micrometers.

[0043] In an optional embodiment, the first pixel, the second pixel, and the third pixel all include a second electrode layer, and the second part of the isolation structure and the second electrode layer overlap.

[0044] In an optional embodiment, the first pixel further includes a first light-emitting layer and a first sub-packaging layer; the second pixel further includes a second light-emitting layer and a second sub-packaging layer; the third pixel further includes a third light-emitting layer and a third sub-packaging layer;

[0045] Preferably, materials of the first sub-packaging layer, the second sub-packaging layer, and the third sub-packaging layer include inorganic materials.

[0046] In an optional embodiment, the isolation structure further includes a third part, and the third part is disposed on a side of the second part close to the substrate;

[0047] Preferably, the orthographic projection of the second part on the substrate is located within the orthographic projection of the third part on the substrate;

[0048] Preferably, the orthographic projection of the third part on the substrate is located within the orthographic projection of the first part on the substrate;

[0049] Preferably, the material of the first part includes titanium, and / or the material of the second part includes aluminum, and / or the material of the third part includes molybdenum.

[0050] According to the third aspect of the present application, a display panel is provided, including:

[0051] A substrate and an isolation structure layer;

[0052] Wherein, the isolation structure layer is disposed on one side of the substrate;

[0053] The isolation structure layer includes an isolation structure and a plurality of isolation openings surrounded by the isolation structure. The isolation structure includes a first part and a second part. The first part is disposed on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate is located within the orthographic projection of the first part on the substrate;

[0054] It further includes: a first pixel, a second pixel, and a third pixel; wherein, at least a part of the first pixel is disposed within a first isolation opening among the plurality of isolation openings, at least a part of the second pixel is disposed within a second isolation opening among the plurality of isolation openings, and at least a part of the third pixel is disposed within a third isolation opening among the plurality of isolation openings;

[0055] Wherein, the protruding part of the first part compared to the second part in the orthographic projection of the isolation structure corresponding to the first pixel on the substrate is SA1, the protruding part of the first part compared to the second part in the orthographic projection of the isolation structure corresponding to the second pixel on the substrate is SA2, and the protruding part of the first part compared to the second part in the orthographic projection of the isolation structure corresponding to the third pixel on the substrate is SA3. There is SA1 = SA2, and, SA1 < SA3; or, there is SA1 = SA2 = SA3.

[0056] In an optional embodiment, the protruding part of the first part compared to the second part in the orthographic projection of the isolation structure ranges from greater than 0.3 microns to less than 1.0 microns.

[0057] In an optional embodiment, the first pixel includes a first light-emitting layer and a first sub-packaging layer; the second pixel includes a second light-emitting layer and a second sub-packaging layer; the third pixel includes a third light-emitting layer and a third sub-packaging layer;

[0058] Preferably, the materials of the first sub-encapsulation layer, the second sub-encapsulation layer and the third sub-encapsulation layer include inorganic materials;

[0059] Preferably, it further includes an organic encapsulation layer and an inorganic encapsulation layer, the organic encapsulation layer is located on the side of the first sub-encapsulation layer, the second sub-encapsulation layer and the third sub-encapsulation layer away from the substrate, and the inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the substrate.

[0060] In an optional embodiment, the isolation structure further includes a third portion, and the third portion is disposed on a side of the second portion close to the substrate;

[0061] Preferably, the orthographic projection of the second portion on the substrate is located within the orthographic projection of the third portion on the substrate;

[0062] Preferably, the orthographic projection of the third portion on the substrate is located within the orthographic projection of the first portion on the substrate;

[0063] Preferably, the material of the first portion includes titanium, and / or the material of the second portion includes aluminum, and / or the material of the third portion includes molybdenum.

[0064] According to a fourth aspect of an embodiment of the present application, a display terminal is provided, comprising a terminal device body, and a display panel as described in the second aspect or the third aspect, which is arranged on the terminal device body.

[0065] According to the display panel preparation scheme provided in the embodiment of the present application, a first electrode layer, a pixel definition layer, and an isolation structure layer are sequentially formed on a substrate; pixel openings are opened on the pixel definition layer according to the positions of the isolation structures in the isolation structure layer, so as to arrange the first pixel, the second pixel, and the third pixel in the pixel openings; before forming the first pixel in the first pixel opening, a protective layer is arranged in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel. The protective layer shields and protects the second pixel opening and the third pixel opening when forming the first pixel, preventing the isolation structures corresponding to the second pixel opening and the third pixel opening from being affected by the etching solution used in the wet etching process during the first pixel processing; after the first pixel is formed, the protective layer is removed, and the second pixel and the third pixel are respectively formed in the remaining pixel openings.

[0066] As a result, the protrusion of the first portion of the isolation structure corresponding to the second and third pixels relative to the orthographic projection of the second portion on the substrate does not exceed the specified limit, thereby ensuring smooth overlap between the second electrode layer corresponding to the second and third pixels and the second portion of the corresponding isolation structure, allowing the second and third pixels to successfully emit light. This reduces the risk of large-area darkening caused by failed overlap of the second electrode layer of the second and third pixels, reduces defects during OLED panel manufacturing, and improves the yield rate of OLED panels. Furthermore, the encapsulation performance of the encapsulation layer corresponding to the second and third pixels is enhanced, preventing moisture and air intrusion and extending the service life of the panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0068] Figure 1 This is a schematic diagram of the structure of a partial OLED panel;

[0069] Figure 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;

[0070] Figure 3a is a partial schematic diagram of a film layer structure during a manufacturing process of a display panel manufacturing method according to an embodiment of the present application;

[0071] Figure 3b is another partial schematic diagram of a film structure during a manufacturing process of a display panel manufacturing method according to an embodiment of the present application;

[0072] Figure 4 is a partial schematic diagram of a film layer structure of a display panel according to an embodiment of the present application;

[0073] Figure 5 is a partial schematic diagram of a film layer structure of another display panel according to an embodiment of the present application;

[0074] Figure 6 2 is a schematic structural diagram of a display terminal according to an embodiment of the present application. DETAILED DESCRIPTION

[0075] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0076] The terms used in the embodiments of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in the embodiments of this application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in the embodiments of this application refers to and includes any or all possible combinations of one or more associated listed items.

[0077] It should be understood that in the description of the embodiments of the present application, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the scheme of the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0078] In addition, when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.

[0079] The terms first, second, etc. are used to describe various elements, components, regions, layers and / or sections, but these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section.

[0080] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," and the like should be interpreted broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0081] The specific implementation of the embodiment of the present application is further explained below in conjunction with the accompanying drawings of the embodiment of the present application.

[0082] The corresponding structural parts mentioned below, such as the isolation structure, are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072 , CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A are further described for reference.

[0083] In the process of implementing the present invention, the inventors discovered the following problems in the related art: Figure 1 A schematic diagram of the partial structure of an OLED panel prepared by a display panel preparation method is shown. During preparation, R pixels are formed first, then G pixels, and finally B pixels. Among them, the protruding portion SA of the first part of the isolation structure of the pixel formed later becomes longer and longer compared to the orthographic projection of the second part on the substrate. The SA of the finally formed B pixel exceeds the specified length, which in turn affects the overlap between the second electrode layer of the B pixel and the second part of the isolation structure, causing the overlap to fail, resulting in large-area darkening defects. In addition, if the SA of the B pixel (the protruding portion of the first part of the isolation structure compared to the orthographic projection of the second part on the substrate) exceeds the specified length, it will also affect the encapsulation effect of the corresponding encapsulation layer of the B pixel, allowing air and water vapor to intrude, further causing darkening defects, thereby affecting the yield of the OLED panel.

[0084] Based on this, the present invention provides a method for manufacturing a display panel. Figure 2 As shown, the following steps are included:

[0085] S102: forming a first electrode layer, a pixel definition layer and an isolation structure layer in sequence on the substrate.

[0086] Among them, the substrate is the basis of the display panel, most of which are thin and uniform. After depositing various layers of materials on the substrate through processes such as evaporation, gluing, exposure, and etching, a complete OLED structure is formed.

[0087] In one feasible manner, the substrate 10 can be implemented as a TFT (Thin Film Transistor) substrate. In this step, a first electrode layer 20 is first deposited on the substrate 10, and the first electrode layer 20 includes a plurality of first electrodes. The deposition process is a process of forming a "layer" on the substrate, which can be implemented by chemical vapor deposition, atomic layer deposition or physical vapor deposition. In one feasible manner, the plurality of first electrodes are obtained by photolithography of the deposited first electrode layer 20. The photolithography process is an important process in the production of planar transistors. In one example, a photoresist can be coated on the first electrode layer 20 and exposed to light. During the exposure process, the photosensitive agent contained in the photoresist undergoes a photochemical reaction, changing the solubility of the photoresist; the unnecessary photoresist portion is dissolved by a development step, and the portion of the first electrode layer 20 not protected by the photoresist is etched away, and finally the remaining photoresist is stripped off, thereby forming a plurality of first electrodes in the first electrode layer 20.

[0088] In one possible embodiment, the first electrode may be an anode.

[0089] In this step, after forming a plurality of first electrodes in the first electrode layer 20, a pixel definition layer 30 is deposited on the first electrode layer 20, and an isolation structure layer is deposited on the pixel definition layer 30. The isolation structure layer includes an isolation structure 40 and a plurality of isolation openings enclosed by the isolation structure 40.

[0090] In one feasible approach, a plurality of isolation structures 40 are formed on the isolation structure layer through a photolithography process. Specifically, the process may include: coating the isolation structure layer with photoresist and exposing the photoresist to light to change the solubility of the photoresist; dissolving unnecessary photoresist portions through a development step; removing portions of the isolation structure layer not protected by the photoresist through dry etching; stripping off the remaining photoresist; and forming the plurality of isolation structures 40 through wet etching.

[0091] The isolation structure 40 includes a first portion 41 and a second portion 42. The first portion 41 is disposed on a side of the second portion 42 away from the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 overlaps the orthographic projection of the second portion 42 on the substrate 10. The first portion 41 can be made of a metal material. In one embodiment, the first portion 41 is made of titanium Ti. In another embodiment, the second portion 42 is made of aluminum Al. The isolation structure 40 is capable of carrying and transmitting electrical signals.

[0092] The isolation structure 40 also includes a third portion 43, which is disposed on a side of the second portion 42 that is closer to the substrate 10. The orthographic projection of the third portion 43 on the substrate 10 overlaps the orthographic projection of the second portion 42 on the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 overlaps the orthographic projection of the third portion 43 on the substrate 10. In one embodiment, the third portion 43 is implemented as a metal film layer to prevent elements in the isolation structure layer from diffusing into the pixel definition layer 30, thereby increasing the service life of the display panel. In one embodiment, the metal film layer is made of molybdenum (Mo).

[0093] S104. Open a pixel opening on the pixel definition layer to set a first pixel, a second pixel and a third pixel in the pixel opening.

[0094] In one feasible manner, according to the position of each isolation structure 40 in the isolation structure layer, a plurality of pixel openings are opened at positions corresponding to the first electrode on the pixel definition layer 30 through a photolithography process, and the pixel openings and the isolation openings are arranged correspondingly. The first electrode is at least partially exposed through the pixel openings. In one feasible manner, the pixel openings are shaped to gradually increase in size in a direction away from the substrate 10, and are used to carry the pixel unit group. The partial schematic diagram of the film layer structure formed is shown as follows: Figure 3a As shown in part (1) of .

[0095] The pixel unit group may include a first pixel, a second pixel, and a third pixel arranged in sequence, each corresponding to a different pixel opening. The first pixel, the second pixel, and the third pixel are configured to emit light of different colors, thereby achieving color display on the display panel.

[0096] S106 . Before forming the first pixel in the first pixel opening corresponding to the first pixel, a protective layer is provided in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel.

[0097] Before forming the first pixel, a photoresist is used to completely fill the second pixel opening 52 corresponding to the second pixel and the third pixel opening 53 corresponding to the third pixel using a mask. The photoresist at least partially covers at least a portion of the surface of the first portion 41 of the isolation structure 40 corresponding to the second pixel opening 52 on the side away from the substrate 10, and at least partially covers at least a portion of the surface of the first portion 41 of the isolation structure 40 corresponding to the third pixel opening 53 on the side away from the substrate 10. This protects the sidewalls of the second portion 42 of the isolation structure 40 corresponding to the second pixel opening 52 when forming the first pixel, and also protects the sidewalls of the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 from being affected by the wet etching solution during the first pixel processing. The isolation structure 40 corresponding to the second pixel opening 52 refers to the isolation structure 40 that encloses the isolation opening on the side away from the substrate of the second pixel opening 52; and the isolation structure 40 corresponding to the third pixel opening 53 refers to the isolation structure 40 that encloses the isolation opening on the side away from the substrate of the third pixel opening 53.

[0098] A mask is a processing structure used in the photolithography process. It can be made of transparent glass, transparent resin, or a hard light-shielding film. The mask image on the mask can be designed based on actual needs. Using the mask, the mask image is transferred to the area to be processed, determining which areas will be exposed and which will be blocked. This allows for batch replication of patterns, improving production efficiency.

[0099] In one feasible manner, the material of the protective layer 60 is realized as a negative photoresist. After exposure, the solubility of the exposed area of ​​the negative photoresist becomes insoluble, while the negative photoresist in the unexposed area remains soluble, and the negative photoresist in the unexposed area can be dissolved and removed by the development step; after the negative photoresist is coated on the pixel definition layer 30, the negative photoresist in the first pixel opening 51 area is not exposed with the help of a mask, so that the negative photoresist in this area is dissolved in the development step, while the negative photoresist in the second pixel opening 52 and the third pixel opening 53 is exposed and can be retained in the development step, so that the protective layer 60 is set in the second pixel opening 52 and the third pixel opening 53, forming a protective layer 60 as shown in FIG. Figure 3aThe film layer structure diagram shown by the arc in part (2) of the figure. The protective layer 60 at least partially covers at least a portion of the surface of the first portion 41 of the isolation structure 40 corresponding to the second pixel opening 52 away from the substrate 10, and at least partially covers at least a portion of the surface of the first portion 41 of the isolation structure 40 corresponding to the third pixel opening 53 away from the substrate 10. Among them, the isolation structure 40 corresponding to the second pixel opening 52 refers to the isolation structure 40 that encloses the isolation opening on the side of the second pixel opening 52 away from the substrate; the isolation structure 40 corresponding to the third pixel opening 53 refers to the isolation structure 40 that encloses the isolation opening on the side of the third pixel opening 53 away from the substrate. The retained negative photoresist can protect the sidewalls of the second portion 42 of the isolation structure 40 corresponding to the second pixel opening 52 when forming the first pixel, and at the same time protect the sidewalls of the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 so that it is not etched when forming the first pixel.

[0100] S108. Form a first pixel in the first pixel opening. After forming the first pixel, remove the protective layer, and form a second pixel and a third pixel in the remaining pixel openings, respectively.

[0101] For example, the first light-emitting layer 70 is evaporated by evaporation, and after the first light-emitting layer 70 is evaporated, the second electrode layer 80 is evaporated. After the evaporation step is completed, a packaging layer 90 is deposited on the second electrode layer 80. The partial schematic diagram of the formed film structure is shown in FIG. Figure 3a As shown in part (3) of the figure, the first pixel includes a first light-emitting layer 70, a second electrode layer 80, and an encapsulation layer 90. The second electrode layer 80 is disposed on a side of the first light-emitting layer 70 away from the substrate 10, and the encapsulation layer 90 is disposed on a side of the second electrode layer 80 away from the substrate 10. In one embodiment, the material of the encapsulation layer 90 includes an inorganic material.

[0102] In one feasible manner, the second electrode layer 80 may be a cathode layer, which is used to cooperate with the first electrode to enable the first light-emitting layer 70 to emit light.

[0103] In one feasible manner, after the encapsulation layer 90 is deposited, the first pixel in each pixel unit group is patterned. In which, a photoresist 100 is coated on the encapsulation layer 90 area corresponding to the first pixel opening 51, and a partial schematic diagram of the film structure formed is shown as follows: Figure 3a The film structure is dry-etched to remove the portion of the encapsulation layer 90 corresponding to the second pixel opening 52 and the third pixel opening 53. The partial schematic diagram of the film structure is shown in FIG. Figure 3aAfter removing the portion of the encapsulation layer 90 corresponding to the second pixel opening 52 and the third pixel opening 53, the second electrode layer 80 corresponding to the second pixel opening 52 and the third pixel opening 53 is removed by wet etching, and a partial schematic diagram of the film structure is formed as shown in FIG. Figure 3b As shown in part (6), during this process, since the side edges of the second portion 42 in the isolation structure 40 corresponding to the second pixel opening 52 and the side edges of the second portion 42 in the isolation structure 40 corresponding to the third pixel opening 53 are protected by the negative photoresist, they will not be lateral-etched by the wet etching solution. Continuing to peel off the remaining photoresist 100 and the first light-emitting layer 70 and the protective layer (negative photoresist) on the second pixel opening 52 and the third pixel opening 53, the partial schematic diagram of the film structure formed is shown as follows: Figure 3b As shown in section (7), the first pixel patterning is completed. The second electrode layer 80 corresponding to the first pixel overlaps the second portion 42 of the isolation structure 40 corresponding to the first pixel opening 51, receiving the electrical signal transmitted by the second portion 42 to cooperate with the first electrode to cause the first pixel to emit light. During the stripping process, since the negative photoresist is easily stripped, no damage is caused to the first electrode under the second pixel opening 52 and the third pixel opening 53.

[0104] After forming the first pixel, the protective layer 60 in the second pixel opening 52 and the third pixel opening 53 is removed. In each pixel unit group, the second light-emitting layer 110 is continuously evaporated, and the second electrode layer 80 is evaporated on the second light-emitting layer 110. After the evaporation step is completed, the encapsulation layer 90 is deposited on the second electrode layer 80. The second electrode layer 80 is disposed on the side of the second light-emitting layer 110 away from the substrate 10, and the encapsulation layer 90 is disposed on the side of the second electrode layer 80 away from the substrate 10.

[0105] In one feasible method, a photoresist 100 is coated on the encapsulation layer 90 area corresponding to the second pixel opening 52, and a partial schematic diagram of the film structure formed is shown as follows: Figure 3b As shown in part (8) of the above. Through the above-mentioned dry etching, wet etching and peeling steps, the patterning of the second pixel is completed, and the partial schematic diagram of the formed film structure is shown as follows Figure 3b As shown in part (9) of FIG. 1 , during the patterning process of the second pixel, the side edge of the second portion 42 in the isolation structure 40 corresponding to the third pixel opening 53 is affected by the etching solution in the wet etching step, resulting in inward retraction.

[0106] In a feasible manner, in each pixel unit group, the third light-emitting layer 120 and the second electrode layer 80 are continuously vapor-deposited. After the vapor-deposition step, the encapsulation layer 90 is deposited on the second electrode layer 80. Photoresist 100 is coated on the area of the encapsulation layer 90 corresponding to the third pixel opening 53, and then through the above dry etching, wet etching, and stripping steps, the patterning of the third pixel is completed. A partial schematic diagram of the formed film layer structure is as shown in Figure 3b the part (10) shown in the figure. The second electrode layer 80 is disposed on a side of the third light-emitting layer 120 away from the substrate 10, and the encapsulation layer 90 is disposed on a side of the second electrode layer 80 away from the substrate 10. By sequentially forming the second pixel and the third pixel, the side of the second part 42 in the isolation structure 40 corresponding to the second pixel opening 52 is not etched, and the side of the second part 42 in the isolation structure 40 corresponding to the third pixel opening 53 is only eroded by the etching solution once. Thus, the influence of the etching solution on the side of the second part 42 in the isolation structure 40 corresponding to the third pixel opening 53 is reduced.

[0107] In a feasible manner, the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer can be formed based on EL (Electro-Luminescence) materials.

[0108] In this step, since the side of the second part 42 in the isolation structure 40 corresponding to the second pixel opening 52 is not eroded, the side of the second part 42 in the isolation structure 40 corresponding to the third pixel opening 53 is eroded by the etching solution once, the first length of the first part 41 in the isolation structure 40 corresponding to the first pixel opening 51 is equal to the second length of the first part 41 in the isolation structure 40 corresponding to the second pixel opening 52.

[0109] For the protruding part SA1 of the first part 41 compared to the second part 42 in the projection of the isolation structure 40 corresponding to the first pixel opening 51 on the substrate 10, the protruding part SA2 of the first part 41 compared to the second part 42 in the projection of the isolation structure 40 corresponding to the second pixel opening 52 on the substrate 10, and the protruding part SA3 of the first part 41 compared to the second part 42 in the projection of the isolation structure 40 corresponding to the third pixel opening 53 on the substrate 10, there is SA1 = SA2, and SA1 < SA3. In a preferred embodiment, the range of the protruding part SA of the first part 41 compared to the second part 42 in the projection of the isolation structure 40 corresponding to the pixel opening on the substrate 10 is greater than 0.3 microns and less than 1.0 microns, specifically, it can be 0.4 microns, 0.5 microns, 0.6 microns, 0.7 microns, 0.8 microns, or 0.9 microns, so that the second electrode layer 80 corresponding to the third pixel and the second part 42 of the isolation structure 40 corresponding to the third pixel opening 53 are successfully overlapped.

[0110] Specifically, the isolation structure 40 corresponding to the first pixel opening 51 refers to the isolation structure 40 that surrounds the first pixel opening 51 on the side away from the substrate.

[0111] The side edges of the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 are only corroded by the etching solution during the first etching process of the second pixel. As a result, the SA3 does not exceed the specified length, allowing the second electrode layer 80 corresponding to the third pixel to successfully overlap with the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53. In conjunction with the first electrode, the third pixel successfully emits light, resolving the problem of large-area dimming caused by SA3 exceeding the specified length and improving the yield of the OLED panel. Furthermore, the SA3 does not exceed the specified length, allowing the encapsulation layer 90 to better encapsulate the third light-emitting layer 120 and the second electrode layer 80, thereby isolating the third light-emitting layer 120 and the second electrode layer 80 from the encapsulation layer 90, thereby isolating the third light-emitting layer 120 and the second electrode layer 80 from the encapsulation layer 90 and improving the service life of the OLED panel.

[0112] In another feasible solution, after the first pixel is formed, the protective layer 60 in the second pixel opening 52 is removed, and the protective layer 60 in the third pixel opening 53 is retained.

[0113] In each pixel unit group, the second pixel is continuously formed; after the second pixel is formed, the protective layer 60 in the third pixel opening 53 is removed, and in each pixel unit group, the third pixel is continuously formed.

[0114] The side edges of the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 are protected by the protective layer 60 during the formation of the second pixel and are not corroded by the etching solution. Therefore, for the protruding portion SA1 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the first pixel opening 51, the protruding portion SA2 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the second pixel opening 52, and the protruding portion SA3 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the third pixel opening 53, SA1 = SA2 = SA3.

[0115] The implementation of each step in this solution can refer to the description of the corresponding parts in the aforementioned embodiments, and will not be repeated here.

[0116] As a result, SA3 does not exceed the specified length, allowing the second electrode layer 80 corresponding to the third pixel and the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 to successfully overlap. This, in conjunction with the first electrode, allows the third pixel to successfully emit light, resolving the problem of large-area dimming caused by SA3 exceeding the specified length and improving the yield rate of the OLED panel. Furthermore, since SA3 does not exceed the specified length, the encapsulation layer 90 effectively encapsulates the third light-emitting layer 120 and the second electrode layer 80, thereby isolating the third pixel from moisture and air intrusion and extending the service life of the OLED panel.

[0117] In another feasible solution, after the first pixel is formed, the protective layer 60 in the second pixel opening 52 and the third pixel opening 53 is removed, and the protective layer 60 is continuously formed on the third pixel opening 53 .

[0118] In each pixel unit group, the second pixel is continuously formed. After the second pixel is formed, the protective layer 60 in the third pixel opening 53 is removed, and in each pixel unit group, the third pixel is continuously formed.

[0119] The side edges of the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 are protected by the protective layer 60 during the formation of the second pixel and are not corroded by the etching solution. Therefore, for the protruding portion SA1 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the first pixel opening 51, the protruding portion SA2 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the second pixel opening 52, and the protruding portion SA3 of the first portion 41 relative to the orthographic projection of the second portion 42 on the substrate 10 in the isolation structure 40 corresponding to the third pixel opening 53, SA1 = SA2 = SA3.

[0120] The implementation of each step in this solution can refer to the description of the corresponding parts in the aforementioned embodiments, and will not be repeated here.

[0121] As a result, SA3 does not exceed the specified length, allowing the second electrode layer 80 corresponding to the third pixel and the second portion 42 of the isolation structure 40 corresponding to the third pixel opening 53 to successfully overlap. This, in conjunction with the first electrode, allows the third pixel to successfully emit light, resolving the problem of large-area dimming caused by SA3 exceeding the specified length and improving the yield rate of the OLED panel. Furthermore, since SA3 does not exceed the specified length, the encapsulation layer 90 effectively encapsulates the third light-emitting layer 120 and the second electrode layer 80, thereby isolating the third pixel from moisture and air intrusion and extending the service life of the OLED panel.

[0122] The embodiment of the present application further provides a display panel. The partial schematic diagram of the film layer structure of the display panel is shown in FIG. Figure 4As shown, it includes: a substrate 10, a first electrode layer 20, a pixel definition layer 30 and an isolation structure layer.

[0123] The first electrode layer 20 is disposed on the substrate 10 and includes a plurality of first electrodes. The pixel definition layer 30 is disposed on the side of the first electrode layer 20 away from the substrate 10, and a plurality of pixel openings are defined in the pixel definition layer 30. The first electrodes are disposed corresponding to the pixel openings, and at least portions of the first electrodes are exposed through the pixel openings. The isolation structure layer is disposed on the side of the pixel definition layer 30 away from the substrate 10 and includes an isolation structure 40. The isolation structure 40 includes a first portion 41 and a second portion 42. The first portion 41 is disposed on the side of the second portion 42 away from the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 overlaps the orthographic projection of the second portion 42 on the substrate 10. In one embodiment, the material of the first portion 41 includes titanium. In another embodiment, the material of the second portion 42 includes aluminum. The isolation structure 40 also includes a third portion 43, disposed on the side of the second portion 42 closer to the substrate 10, to prevent elements in the isolation structure layer from diffusing into the pixel definition layer 30, thereby increasing the service life of the display panel. The orthographic projection of the third portion 43 on the substrate 10 covers the orthographic projection of the second portion 42 on the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 covers the orthographic projection of the third portion 43 on the substrate 10. In one embodiment, the material of the third portion 43 includes molybdenum.

[0124] The pixel opening carries a pixel unit group, which includes a first pixel, a second pixel and a third pixel arranged in sequence; wherein the first pixel is at least partially set in the first pixel opening 51 on the pixel definition layer 30, the second pixel is at least partially set in the second pixel opening 52 on the pixel definition layer 30, and the third pixel is at least partially set in the third pixel opening 53 on the pixel definition layer 30.

[0125] Specifically, the first pixel includes a first light-emitting layer 70, a second electrode layer 80, and a first sub-encapsulation layer 91. The second electrode layer 80 is disposed on a side of the first light-emitting layer 70 away from the substrate 10, and the first sub-encapsulation layer 91 is disposed on a side of the second electrode layer 80 away from the substrate 10; the second pixel includes a second light-emitting layer 110, a second electrode layer 80, and a second sub-encapsulation layer 92. The second electrode layer 80 is disposed on a side of the second light-emitting layer 110 away from the substrate 10, and the second sub-encapsulation layer 92 is disposed on a side of the second electrode layer 80 away from the substrate 10; the third pixel includes a third light-emitting layer 120, a second electrode layer 80, and a third sub-encapsulation layer 93. The second electrode layer 80 is disposed on a side of the third light-emitting layer 120 away from the substrate 10, and the third sub-encapsulation layer 93 is disposed on a side of the second electrode layer 80 away from the substrate 10. After successfully overlapping with the second part 42 in the isolation structure 40, the second electrode layer 80 cooperates with the first electrode to cause the first light-emitting layer 70, the second light-emitting layer 110, and the third light-emitting layer 120 to emit light.

[0126] In a feasible manner, the materials of the first sub-encapsulation layer 91, the second sub-encapsulation layer 92, and the third sub-encapsulation layer 93 include inorganic materials.

[0127] For the isolation structure 40 corresponding to the first pixel opening 51, the protruding part SA1 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10, the protruding part SA2 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10 in the isolation structure 40 corresponding to the second pixel opening 52, and the protruding part SA3 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10 in the isolation structure 40 corresponding to the third pixel opening 53, there is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

[0128] In a preferred embodiment, the range of the protruding part SA of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10 in the isolation structure 40 corresponding to the pixel opening is greater than 0.3 micrometers and less than 1.0 micrometers, so that the second electrode layer 80 corresponding to the third pixel and the second part 42 of the isolation structure 40 corresponding to the third pixel opening 53 are successfully overlapped. <>

[0129] Thus, SA3 does not exceed the specified length, and further enables the second electrode layer 80 corresponding to the third pixel and the second part 42 of the isolation structure 40 corresponding to the third pixel opening 53 to be successfully overlapped, and cooperates with the first electrode to enable the third pixel to emit light successfully, solving the problem of large-area darkening caused by SA3 exceeding the specification and improving the yield of the OLED panel. At the same time, SA3 not exceeding the specified length enables the third sub-encapsulation layer 93 to have a better encapsulation effect on the third light-emitting layer 120 and the second electrode layer 80, thereby isolating the intrusion of moisture and air and improving the service life of the OLED panel.

[0130] The present application also provides another display panel, such as Figure 5 As shown, it comprises: a substrate 10 and an isolation structure layer. The isolation structure layer is arranged on one side of the substrate 10.

[0131] The isolation structure layer includes a plurality of isolation structures 40 and a plurality of isolation openings enclosed by the isolation structures 40. The isolation structure 40 includes a first portion 41 and a second portion 42. The first portion 41 is disposed on a side of the second portion 42 away from the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 covers the orthographic projection of the second portion 42 on the substrate 10.

[0132] In a feasible manner, a first electrode layer 20 is further included. The first electrode layer 20 includes a plurality of first electrodes. The first electrode layer 20 and the isolation structure layer are disposed on the same side of the substrate 10 .

[0133] In one feasible embodiment, the material of the first portion 41 includes titanium. In one feasible embodiment, the material of the second portion 42 includes aluminum. The isolation structure 40 also includes a third portion 43, which is arranged on the side of the second portion 42 close to the substrate 10 to prevent the elements in the isolation structure layer from diffusing into the pixel definition layer 30, thereby increasing the service life of the display panel. The orthographic projection of the third portion 43 on the substrate 10 covers the orthographic projection of the second portion 42 on the substrate 10, and the orthographic projection of the first portion 41 on the substrate 10 covers the orthographic projection of the third portion 43 on the substrate 10. That is, the orthographic projection of the second portion 42 on the substrate 10 is located within the orthographic projection of the third portion 43 on the substrate 10; the orthographic projection of the third portion 43 on the substrate 10 is located within the orthographic projection of the first portion 41 on the substrate 10.

[0134] In one possible embodiment, the material of the third portion 43 includes molybdenum.

[0135] A pixel unit group is carried on multiple isolation openings. The pixel unit group includes a first pixel, a second pixel, and a third pixel arranged in sequence. Among them, at least a part of the first pixel is disposed in the first isolation opening 131 among the multiple isolation openings. Specifically, the first pixel includes a first light-emitting layer 70, a second electrode layer 80, and a first sub-packaging layer 91. The second electrode layer 80 is disposed on a side of the first light-emitting layer 70 away from the substrate 10, and the first sub-packaging layer 91 is disposed on a side of the second electrode layer 80 away from the substrate 10. At least a part of the second pixel is disposed in the second isolation opening 132 among the multiple isolation openings. Specifically, the second pixel includes a second light-emitting layer 110, a second electrode layer 80, and a second sub-packaging layer 92. The second electrode layer 80 is disposed on a side of the second light-emitting layer 110 away from the substrate 10, and the second sub-packaging layer 92 is disposed on a side of the second electrode layer 80 away from the substrate 10. At least a part of the third pixel is disposed in the third isolation opening 133 among the multiple isolation openings. Specifically, the third pixel includes a third light-emitting layer 120, a second electrode layer 80, and a third sub-packaging layer 93. The second electrode layer 80 is disposed on a side of the third light-emitting layer 120 away from the substrate 10, and the third sub-packaging layer 93 is disposed on a side of the second electrode layer 80 away from the substrate 10. After successfully overlapping with the second part 42 in the isolation structure 40, the second electrode layer 80 and the first electrode cooperate to cause the first light-emitting layer 70, the second light-emitting layer 110, and the third light-emitting layer 120 to emit light.

[0136] In a feasible manner, the materials of the first sub-packaging layer 91, the second sub-packaging layer 92, and the third sub-packaging layer 93 include inorganic materials.

[0137] In a feasible manner, the display panel further includes an organic packaging layer and an inorganic packaging layer. The organic packaging layer is located on a side of the first sub-packaging layer 91, the second sub-packaging layer 92, and the third sub-packaging layer 93 away from the substrate 10, and the inorganic packaging layer is located on a side of the organic packaging layer away from the substrate 10.

[0138] For the isolation structure 40 corresponding to the first pixel, the protruding part SA1 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10, the protruding part SA2 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10 in the isolation structure 40 corresponding to the second pixel, and the protruding part SA3 of the first part 41 compared to the second part 42 in the orthographic projection on the substrate 10 in the isolation structure 40 corresponding to the third pixel, there is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

[0139] Specifically, the isolation structure 40 corresponding to the first pixel refers to the isolation structure 40 that encloses the isolation opening where the first pixel is located, the isolation structure 40 corresponding to the second pixel refers to the isolation structure 40 that encloses the isolation opening where the second pixel is located, and the isolation structure 40 corresponding to the third pixel refers to the isolation structure 40 that encloses the isolation opening where the third pixel is located.

[0140] In a preferred embodiment, the range of the protruding portion SA of the first portion 41 in the isolation structure 40 corresponding to the isolation opening relative to the positive projection of the second portion 42 on the substrate 10 is greater than 0.3 microns and less than 1.0 microns, so that the second electrode layer 80 corresponding to the third pixel and the second portion 42 of the isolation structure 40 corresponding to the third isolation opening 133 are successfully overlapped.

[0141] As a result, the SA3 does not exceed the specified length, allowing the second electrode layer 80 corresponding to the third pixel and the second portion 42 of the isolation structure 40 corresponding to the third isolation opening 133 to successfully overlap. This, in conjunction with the first electrode, allows the third pixel to successfully emit light, resolving the issue of large-area dimming caused by SA3 exceeding the specified length and improving the yield of the OLED panel. Furthermore, the SA3 does not exceed the specified length, allowing the third sub-encapsulation layer 93 to better encapsulate the third light-emitting layer 120 and the second electrode layer 80, thereby isolating the third pixel from moisture and air intrusion and extending the service life of the OLED panel.

[0142] Further optionally, an embodiment of the present application further provides a display terminal, which includes a terminal device body and a display panel arranged on the terminal device body, and the display panel may be the display panel as described above.

[0143] An exemplary display terminal is Figure 6 As shown, it includes a terminal device body 601 and a display panel 602. The display panel 602 is provided on the terminal device body 601 and is electrically connected to the terminal device body 601. The display panel 602 is the display panel described in the above embodiment, and is used to display static images or dynamic images.

[0144] Exemplarily, the above-mentioned display terminal can be implemented in the form of various electronic devices such as mobile phones, tablet computers, handheld computers, PADs, etc.

[0145] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A method for preparing a display panel, characterized in that: include: Forming a first electrode layer, a pixel definition layer and an isolation structure layer on the substrate in sequence, wherein the isolation structure layer includes an isolation structure and a plurality of isolation openings surrounded by the isolation structure; Opening a pixel opening on the pixel definition layer to arrange a first pixel, a second pixel and a third pixel in the pixel opening; Before forming the first pixel in the first pixel opening corresponding to the first pixel, a protective layer is provided in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel; A first pixel is formed in the first pixel opening, after the first pixel is formed, the protective layer is removed, and the second pixel and the third pixel are respectively formed in the remaining pixel openings.

2. The method according to claim 1, characterized in that The step of providing a protective layer in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel comprises: The protection layer is formed by filling the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel with photoresist.

3. The method according to claim 2, characterized in that The step of filling the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel with photoresist to form the protective layer comprises: A negative photoresist is used to completely fill the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel; and the negative photoresist at least partially covers at least a portion of the surface of the isolation structure corresponding to the second pixel opening and the third pixel opening away from the substrate to form the protective layer.

4. The method according to claim 3, characterized in that: The isolation structure comprises a first portion and a second portion, wherein the first portion is disposed on a side of the second portion away from the substrate; The negative photoresist at least partially covers at least a portion of the surface of the isolation structure corresponding to the second pixel opening and the third pixel opening which is away from the substrate, and includes: The negative photoresist at least partially covers at least a portion of the surface of the first portion of the isolation structure corresponding to the second pixel opening and the third pixel opening that is away from the substrate.

5. The method according to any one of claims 1 to 4, characterized in that: Before forming the first pixel in the first pixel opening corresponding to the first pixel, providing a protective layer in the second pixel opening corresponding to the second pixel and the third pixel opening corresponding to the third pixel, comprising: A protective layer is disposed in a second pixel opening corresponding to the second pixel and a third pixel opening corresponding to the third pixel through a mask.

6. The method according to any one of claims 1 to 4, characterized in that: After forming the first pixel, removing the protective layer, and forming the second pixel and the third pixel in the remaining pixel openings respectively, comprising: After forming the first pixel, removing the protective layer in the second pixel opening and the protective layer in the third pixel opening; forming the second pixel in a second pixel opening corresponding to the second pixel; After forming the second pixel, forming the third pixel in a third pixel opening corresponding to the third pixel.

7. The method according to any one of claims 1-4, characterized in that after forming the first pixel, removing the protective layer and forming the second pixel and the third pixel in the remaining pixel openings respectively, includes: after forming the first pixel, removing the protective layer in the second pixel opening and retaining the protective layer in the third pixel opening; forming the second pixel in the second pixel opening; after forming the second pixel, removing the protective layer in the third pixel opening and forming the third pixel in the third pixel opening.

8. The method according to any one of claims 1-4, characterized in that after forming the first pixel, removing the protective layer and forming the second pixel and the third pixel in the remaining pixel openings respectively, includes: after forming the first pixel, removing the protective layer in the second pixel opening and the protective layer in the third pixel opening; providing a protective layer in the third pixel opening; forming the second pixel in the second pixel opening; after forming the second pixel, removing the protective layer in the third pixel opening and forming the third pixel in the third pixel opening.

9. The method according to claim 4, characterized in that for the isolation structure corresponding to the first pixel opening, the protruding part of the first part compared to the second part in the orthographic projection on the substrate is SA1, for the isolation structure corresponding to the second pixel opening, the protruding part of the first part compared to the second part in the orthographic projection on the substrate is SA2, and for the isolation structure corresponding to the third pixel opening, the protruding part of the first part compared to the second part in the orthographic projection on the substrate is SA3, there is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

10. The method according to any one of claims 1-9, characterized in that forming the first pixel in the first pixel opening includes: successively forming a first light-emitting layer, a second electrode layer and a packaging layer in the first pixel opening; wherein, the second electrode layer is disposed on a side of the first light-emitting layer away from the substrate, and the packaging layer is disposed on a side of the second electrode layer away from the substrate.

11. A display panel, characterized in that: including: a substrate, a first electrode layer, a pixel definition layer and an isolation structure layer; wherein, the first electrode layer is disposed on the substrate; the pixel definition layer is disposed on a side of the first electrode layer away from the substrate; the isolation structure layer is disposed on a side of the pixel definition layer away from the substrate; the isolation structure layer includes an isolation structure, the isolation structure includes a first part and a second part, the first part is disposed on a side of the second part away from the substrate; the orthographic projection of the second part on the substrate is located within the orthographic projection of the first part on the substrate; It further includes: a first pixel, a second pixel, and a third pixel; wherein, at least a part of the first pixel is disposed in a first pixel opening on the pixel definition layer, at least a part of the second pixel is disposed in a second pixel opening on the pixel definition layer, and at least a part of the third pixel is disposed in a third pixel opening on the pixel definition layer; Wherein, a protruding part of a first part compared to a second part in a positive projection on the substrate in an isolation structure corresponding to the first pixel opening is SA1, a protruding part of a first part compared to a second part in a positive projection on the substrate in an isolation structure corresponding to the second pixel opening is SA2, and a protruding part of a first part compared to a second part in a positive projection on the substrate in an isolation structure corresponding to the third pixel opening is SA3. There is SA1 = SA2, and SA1 < SA3; or, there is SA1 = SA2 = SA3.

12. The display panel according to claim 11, wherein A protruding part of the first part compared to the second part in a positive projection on the substrate in the isolation structure ranges from greater than 0.3 micrometers to less than 1.0 micrometers.

13. The display panel according to claim 11, wherein The first pixel, the second pixel, and the third pixel all include a second electrode layer, and the second part in the isolation structure overlaps with the second electrode layer.

14. The display panel according to claim 11, wherein The first pixel further includes a first light-emitting layer and a first sub-encapsulation layer; the second pixel further includes a second light-emitting layer and a second sub-encapsulation layer; the third pixel further includes a third light-emitting layer and a third sub-encapsulation layer; Preferably, materials of the first sub-encapsulation layer, the second sub-encapsulation layer, and the third sub-encapsulation layer include inorganic materials.

15. The display panel according to claim 11, wherein The isolation structure further includes a third part, and the third part is disposed on a side of the second part close to the substrate; Preferably, a positive projection of the second part on the substrate is located within a positive projection of the third part on the substrate; Preferably, a positive projection of the third part on the substrate is located within a positive projection of the first part on the substrate; Preferably, the material of the first part includes titanium, and / or the material of the second part includes aluminum, and / or the material of the third part includes molybdenum.

16. A display panel, characterized in that: It includes: A substrate and an isolation structure layer; Wherein, the isolation structure layer is disposed on one side of the substrate; The isolation structure layer includes an isolation structure and a plurality of isolation openings surrounded by the isolation structure. The isolation structure includes a first part and a second part. The first part is disposed on a side of the second part away from the substrate, and a positive projection of the second part on the substrate is located within a positive projection of the first part on the substrate; It further includes: a first pixel, a second pixel, and a third pixel; wherein, at least a part of the first pixel is disposed within a first isolation opening among the plurality of isolation openings, at least a part of the second pixel is disposed within a second isolation opening among the plurality of isolation openings, and at least a part of the third pixel is disposed within a third isolation opening among the plurality of isolation openings; Wherein, a protruding part of a first part compared to a second part in a front projection on the substrate in an isolation structure corresponding to the first pixel is SA1, a protruding part of a first part compared to a second part in a front projection on the substrate in an isolation structure corresponding to the second pixel is SA2, a protruding part of a first part compared to a second part in a front projection on the substrate in an isolation structure corresponding to the third pixel is SA3, there is SA1 = SA2, and, SA1 < SA3; or, there is SA1 = SA2 = SA3.

17. The display panel according to claim 16, characterized in that: A range of a protruding part of a first part compared to a second part in a front projection on the substrate in the isolation structure is greater than 0.3 micrometers and less than 1.0 micrometers.

18. The display panel according to claim 16, characterized in that: The first pixel includes a first light-emitting layer and a first sub-packaging layer; the second pixel includes a second light-emitting layer and a second sub-packaging layer; the third pixel includes a third light-emitting layer and a third sub-packaging layer; Preferably, materials of the first sub-packaging layer, the second sub-packaging layer, and the third sub-packaging layer include inorganic materials; Preferably, it further includes an organic packaging layer and an inorganic packaging layer, the organic packaging layer is located on a side of the first sub-packaging layer, the second sub-packaging layer, and the third sub-packaging layer away from the substrate, and the inorganic packaging layer is located on a side of the organic packaging layer away from the substrate.

19. The display panel according to claim 16, characterized in that: The isolation structure further includes a third part, and the third part is disposed on a side of the second part close to the substrate; Preferably, a front projection of the second part on the substrate is located within a front projection of the third part on the substrate; Preferably, a front projection of the third part on the substrate is located within a front projection of the first part on the substrate; Preferably, the material of the first part includes titanium, and / or, the material of the second part includes aluminum, and / or, the material of the third part includes molybdenum.

20. A display terminal, characterized in that: The display terminal includes a terminal device body, and a display panel as described in any one of claims 11 - 19 disposed on the terminal device body.

Images