Laser drilling control method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses a laser drilling control method and device, electronic equipment and a storage medium. The method comprises the steps that S1, a first drilling instruction is generated according to an expected drilling image of a to-be-drilled material; s2, laser drilling equipment is controlled to form a first hole in the to-be-drilled material based on the first drilling instruction; s3, generating a second drilling instruction according to the first position information of the first hole, the material information of the to-be-drilled material and the drilling image; s4, based on the second drilling instruction, laser drilling equipment is controlled to form a new second hole in the to-be-drilled material; s5, taking the second hole as a first hole; and S6, circulating the steps S3 to S5 until a drilling image is formed on the to-be-drilled material. By adopting the method and the device, the drilling instruction of the next drilling can be dynamically adjusted according to the position information of the hole formed during the previous drilling, the material information and the drilling image, material deformation caused by heat influence generated during drilling is avoided, and therefore the efficiency of dense hole manufacturing is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser drilling control method, device, electronic equipment and storage medium. Background Art

[0002] In the related technologies, common laser drilling processing methods include single pulse processing, multi-pulse direct punch processing, rotary cutting processing, spiral processing, etc. Each processing method has its own advantages and disadvantages, and can be selected according to the actual processing situation. As laser drilling is increasingly widely used, the drilling quality and efficiency are also getting higher and higher.

[0003] However, for materials with small hole diameters and hole spacing, it is difficult to complete the production of thousands of dense holes, resulting in low drilling efficiency in dense hole production. In addition, the heat-affected zone during the dense hole production process is large, making the material prone to deformation, seriously affecting the drilling efficiency.

[0004] Therefore, how to improve the efficiency of laser in dense hole production has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The embodiments of the present application provide a laser drilling control method, device, electronic device and storage medium to solve the technical problem of low efficiency when laser is used to make dense holes.

[0006] In the first aspect, in order to solve the above technical problems, the embodiment of the present application provides a laser drilling control method for controlling a laser drilling device to perform laser drilling, wherein the laser drilling device comprises a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence, and the laser drilling control method comprises the following steps:

[0007] S1, generating a first drilling instruction according to an expected drilling image of a material to be drilled;

[0008] S2, based on the first drilling instruction, controlling the laser to switch to a first working state, controlling the scanning galvanometer to deflect to a first deflection angle, and focusing the first laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a first hole, wherein the first hole belongs to a drilling point in the drilling image;

[0009] S3, generating a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image;

[0010] S4, based on the second drilling instruction, controlling the laser to switch to a second working state, controlling the scanning galvanometer to deflect to a second deflection angle, and focusing the second laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, wherein the second hole belongs to a drilling point in the drilling image;

[0011] S5, using the second hole as the first hole;

[0012] S6. Loop step S3 to step S5 until the drilling image is formed on the material to be drilled.

[0013] In an embodiment of the present invention, the step of generating a first drilling instruction according to an expected drilling image of the material to be drilled includes:

[0014] Dividing the material to be drilled into a plurality of first drilling areas according to the distribution of drilling points in the drilling image expected for the material to be drilled;

[0015] A first drilling instruction for drilling a target area is generated according to the plurality of first drilling areas, wherein the target area is a drilling area where there are un-drilled points to be drilled.

[0016] In an embodiment of the present invention, the step of controlling the laser to switch to a first working state and controlling the scanning galvanometer to deflect to a first deflection angle based on the first drilling instruction includes:

[0017] Determine a first working state of the laser and a first deflection angle of the scanning galvanometer based on the first drilling instruction and the position information of the target area on the material to be drilled;

[0018] The laser is controlled to switch to the first working state, and the scanning galvanometer is controlled to deflect to the first deflection angle.

[0019] In an embodiment of the present invention, the step of generating a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image includes:

[0020] Determining drilling position information of a next drilling position according to the first position information and the drilling image;

[0021] Determining a second deflection angle of the scanning galvanometer according to the drilling position information;

[0022] Determining working parameters used by the laser when drilling the material to be drilled according to the material type information and material thickness information of the material to be drilled, wherein the working parameters include power parameters and working time;

[0023] A second drilling instruction for controlling the scanning galvanometer and the laser is generated according to the second deflection angle and the working parameter.

[0024] In an embodiment of the present invention, the step of determining the drilling position information of the next drilling position according to the first position information and the drilling image includes:

[0025] According to the first position information, acquiring temperature information of the surface of the material to be drilled at the first position information;

[0026] In the case where the temperature information satisfies the target temperature threshold, determining the undrilled points on the target area corresponding to the drilling image according to the first position information, wherein the target temperature threshold is a temperature threshold corresponding to when the material to be drilled does not produce material deformation;

[0027] The position information of the point to be drilled is determined as the drilling position information of the next drilling position.

[0028] In an embodiment of the present invention, after the step of acquiring temperature information of the surface of the material to be drilled at the first position information according to the first position information, the laser drilling control method further includes:

[0029] When it is determined that there is no point to be drilled on the target area corresponding to the drilling image, or when the temperature information does not meet the target temperature threshold, another drilling area with a point to be drilled is used as the target area;

[0030] The position information of the to-be-drilled point in the target area is determined as the drilling position information of the next drilling position.

[0031] In an embodiment of the present invention, after the step of acquiring temperature information of the surface of the material to be drilled at the first position information according to the first position information, the laser drilling control method further includes:

[0032] In the case where the temperature information does not meet the target temperature threshold, the first drilling area is adjusted accordingly according to the temperature information and the target temperature threshold to obtain a second drilling area, where the second drilling area indicates that the corresponding temperature information meets the target temperature threshold when drilling is performed in the second drilling area;

[0033] According to the distribution of the drilling images and the second drilling areas, the material to be drilled is divided into a plurality of second drilling areas, and a drilling area in the plurality of second drilling areas where there are points to be drilled is taken as a target area;

[0034] The position information of the to-be-drilled point in the target area is determined as the drilling position information of the next drilling position.

[0035] In the second aspect, in order to solve the same technical problem, the embodiment of the present application further provides a laser drilling control device for controlling a laser drilling device to perform laser drilling, wherein the laser drilling device comprises a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence, and the laser drilling control device comprises:

[0036] A first generating module, used for generating a first drilling instruction according to an expected drilling image of a material to be drilled;

[0037] a first control module, configured to control the laser to switch to a first working state based on the first drilling instruction, and control the scanning galvanometer to deflect to a first deflection angle, and focus the first laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a first hole, wherein the first hole belongs to a drilling point in the drilling image;

[0038] A second generating module, configured to generate a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image;

[0039] a second control module, configured to control the laser to switch to a second working state based on the second drilling instruction, and control the scanning galvanometer to deflect to a second deflection angle, and focus the second laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, wherein the second hole belongs to a drilling point in the drilling image;

[0040] A conversion module, used for using the second hole as the first hole;

[0041] A loop module is used for loopingly executing the second generation module, the second control module and the conversion module until the drilling image is formed on the material to be drilled.

[0042] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of any of the above-mentioned laser drilling control methods when executing the computer program.

[0043] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any one of the above-mentioned laser drilling control methods are implemented.

[0044] The embodiments of the present application provide a laser drilling control method, device, electronic device and storage medium, which dynamically adjust the second drilling instruction for the next drilling according to the first position information of the first hole formed in the previous drilling, the material information of the material to be drilled and the drilling image in real time, thereby avoiding the deformation of the material to be drilled caused by the heat generated during drilling, thereby effectively improving the efficiency of dense hole production. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 It is a flow chart of a laser drilling control method provided by an embodiment of the present invention;

[0047] Figure 2 is a flow chart of generating a second drilling instruction provided by an embodiment of the present invention;

[0048] Figure 3 It is a schematic diagram of a process for determining drilling position information of a next drilling position provided by an embodiment of the present invention;

[0049] Figure 4 is another flow chart of determining drilling position information of a next drilling position provided by an embodiment of the present invention;

[0050] Figure 5 is a structural schematic diagram of a laser drilling control device provided by an embodiment of the present invention;

[0051] Figure 6 is a structural schematic diagram of an electronic device provided by an embodiment of the present invention;

[0052] Figure 7 This is another structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0054] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In the present application, " / " means "or".

[0055] The present application may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0056] In the embodiment of the present invention, common laser drilling processing methods include single pulse processing, multi-pulse direct punch processing, rotary cutting processing, spiral processing, etc. Each processing method has its own advantages and disadvantages and can be selected according to the actual processing situation. As laser drilling is increasingly widely used, the drilling quality and efficiency are also getting higher and higher.

[0057] However, for materials with small hole diameters and hole spacing, it is difficult to complete the production of thousands of dense holes, resulting in low drilling efficiency in dense hole production. In addition, the heat-affected zone during the dense hole production process is large, making the material prone to deformation, seriously affecting the drilling efficiency.

[0058] Therefore, how to improve the efficiency of laser in dense hole production has become a technical problem that needs to be solved urgently.

[0059] In order to solve the above technical problems, the embodiment of the present application provides a laser drilling control method for controlling a laser drilling device to perform laser drilling, wherein the laser drilling device includes a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence. For details, see Figure 1 , Figure 1 is a flow chart of a laser drilling control method provided by an embodiment of the present invention. Figure 1 As shown, the laser drilling control method provided in this embodiment includes steps S1 to S6;

[0060] S1. Generate a first drilling instruction according to an expected drilling image of a material to be drilled.

[0061] In this embodiment, the expected drilling image of the material to be drilled is an image consisting of holes that need to be formed on the material to be drilled. The first drilling instruction can be an instruction to drill the material to be drilled once to form a hole; or it can be an instruction to drill the material to be drilled multiple times in succession to form multiple holes, but the multiple holes need to correspond to the drilling points in the drilling image.

[0062] In some embodiments, in order to avoid a large heat-affected zone in the process of making dense holes, which makes the material easy to deform and affects the drilling efficiency, this embodiment can divide the material to be drilled into drilling areas to control the laser drilling equipment to drill each divided drilling area in turn, so as to avoid large-scale drilling resulting in a large heat-affected zone and easy deformation of the material. Specifically, the step of generating a first drilling instruction according to the drilling image expected for the material to be drilled provided in this embodiment may include: dividing the material to be drilled into multiple first drilling areas according to the distribution of drilling points in the drilling image expected for the material to be drilled; generating a first drilling instruction for drilling a target area according to the multiple first drilling areas, wherein the target area is a drilling area where there are undrilled points to be drilled.

[0063] In one case, the present embodiment can divide the material to be drilled into regions by marking the surface of the material to be drilled; in other cases, the present embodiment can also fix the material to be drilled, collect an image of the material to be drilled, and then divide the drilling area on the collected image, and match the position of each pixel of the material to be drilled in the image with the specific position on the actual material to be drilled, so that the image can be divided into regions instead of dividing the material to be drilled into regions, thereby reducing the time required for dividing the material to be drilled into regions, thereby improving the overall efficiency of drilling the material to be drilled.

[0064] In this way, the drilling area of ​​the material to be drilled is divided according to the distribution of drilling points in the drilling image, so that the material to be drilled is divided into multiple first drilling areas with uniform distribution of drilling points, thereby avoiding large-scale drilling, reducing the heat-affected zone of the drilling process, and effectively avoiding the problem of easy deformation of the material, thereby improving the drilling efficiency of dense hole production.

[0065] As an optional embodiment, in order to avoid the splashing generated by the laser during the drilling process that affects the drilling efficiency, this embodiment can coat the surface of the material to be drilled with an ink layer before drilling, that is, before step S1, and clean the ink after the laser drilling is completed, which can effectively avoid the splashing generated by the laser during the drilling process, thereby improving the drilling efficiency.

[0066] Specifically, in this embodiment, the ink layer coated on the surface of the material to be drilled has an ink thickness of less than 10 microns.

[0067] S2. Based on the first drilling instruction, control the laser to switch to a first working state, control the scanning galvanometer to deflect to a first deflection angle, and make the first laser beam emitted by the laser focus on the material to be drilled through the beam expander, the scanning galvanometer and the focusing lens to form a first hole, and the first hole belongs to the drilling point in the drilling image.

[0068] In this embodiment, the first drilling instruction provided in this embodiment may include control instructions for controlling the laser and the scanning galvanometer of the laser drilling device. Specifically, the step of controlling the laser to switch to the first working state and controlling the scanning galvanometer to deflect to the first deflection angle based on the first drilling instruction provided in this embodiment may include: determining the first working state of the laser and the first deflection angle of the scanning galvanometer based on the first drilling instruction and the position information of the target area on the material to be drilled; controlling the laser to switch to the first working state and controlling the scanning galvanometer to deflect to the first deflection angle.

[0069] Among them, the laser provided in this embodiment is mainly used to provide laser, and emit the laser beam of the laser to the beam expander, the beam expander is used to expand the laser beam and reduce the divergence angle of the laser beam, the scanning galvanometer is used to deflect the exit angle of the laser beam emitted through the beam expander, and the focusing lens is used to focus the laser beam deflected by the scanning galvanometer onto the material to be drilled, so as to form a hole in the material to be drilled.

[0070] It should be noted that the working state of the laser provided in the present embodiment may be a working state in a target working mode. For example, the working state of the laser provided in the present embodiment may be a working state in a high-power working mode. The working state in this mode may be targeted at materials to be drilled that are difficult to drill or have thicker materials, thereby increasing the power of the laser during drilling, and correspondingly improving the efficiency of forming holes in the materials to be drilled. At the same time, the working state of the laser provided in the present embodiment may also be a working state in a low-power working mode. The working state in this mode may be targeted at materials to be drilled that are easy to drill, thereby reducing the power of the laser during drilling, and correspondingly reducing the heat generated when holes are formed in the materials to be drilled, thereby effectively avoiding the problem of a large heat-affected zone in the process of dense hole production, which makes it easy for the material to deform and affects the drilling efficiency.

[0071] Specifically, the first working state of the laser provided in this embodiment can be customized according to parameters such as the material and thickness of the material to be drilled, so the actual value of the working power of the laser in the first working state is not limited.

[0072] For example, on stainless steel with a thickness of 50 microns, the working conditions of the laser provided in this embodiment may include: working power of 25W, focused spot of 15 microns, working frequency of 50kHz, working pulse width of 100ns, and dotting time of 0.4ms, so as to obtain dense microholes with a diameter of 5 to 15 microns.

[0073] Furthermore, on stainless steel with a thickness of 500 microns, the working conditions of the laser provided in this embodiment may include: working power of 50 W, focused spot of 25 microns, working frequency of 50 kHz, working pulse width of 100 ns, and dotting time of 0.5 ms, so as to obtain dense microholes with a diameter of 20 to 30 microns.

[0074] After the first hole is formed in the material to be drilled, step S3 may be performed;

[0075] S3. Generate a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image.

[0076] In order to avoid a large heat-affected zone in the process of making dense holes, which makes the material easy to deform and affects the drilling efficiency, after forming the first hole on the material to be drilled, this embodiment can dynamically adjust the drilling instructions for the next drilling according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image in real time, so as to avoid the heat generated during drilling causing material deformation, thereby effectively improving the efficiency of dense hole production. For details, please refer to Figure 2 , Figure 2 is a flow chart of generating a second drilling instruction provided by an embodiment of the present invention, such as Figure 2 As shown, the step of generating the second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image provided in this embodiment may include: step S31 to step S34;

[0077] S31, determining drilling position information of a next drilling position according to the first position information and the drilling image.

[0078] After the first hole is formed on the material to be drilled, the drilling point in the drilling image corresponding to the first hole can be determined based on the first position information of the first hole, and then the position information of the next drilling position on the material to be drilled that has not been drilled can be determined based on the remaining un-drilled points to be drilled in the drilling image.

[0079] S32: Determine a second deflection angle of the scanning galvanometer according to the drilling position information.

[0080] After determining the drilling position information of the next drilling position, the second deflection angle at which the scanning galvanometer in the laser drilling equipment needs to be deflected can be determined based on the drilling position information of the next drilling position, so that the scanning galvanometer can deflect the laser beam emitted by the laser to the position corresponding to the drilling position information to form a new hole at the position corresponding to the drilling position information.

[0081] S33, determining working parameters used by the laser when drilling the material to be drilled according to the material type information and material thickness information of the material to be drilled, wherein the working parameters include power parameters and working time.

[0082] In this embodiment, in order to improve the drilling efficiency of dense hole production, this embodiment can obtain the material type information and material thickness information of the material to be drilled after completing the last drilling, and obtain the working parameters of the laser corresponding to the material type information and the material thickness information. It should be noted that this embodiment can set a comparison table of "laser working parameters" and "material type information and material thickness information of the material to be drilled" in advance according to the material type information and material thickness information of different materials to be drilled, as well as the drilling experience obtained by the staff through multiple drilling tests. Selecting the working parameters of the laser according to the comparison table can ensure that under the selected working parameters, high-efficiency drilling is achieved while avoiding the heat generated during drilling exceeding the temperature that will cause the material to be drilled to deform.

[0083] Therefore, this embodiment can adopt the pre-set comparison table provided in the above embodiment, as well as the material type information and material thickness information of the material to be drilled, to determine the working parameters of the laser, so as to achieve the purpose of dynamically adjusting the next drilling instruction, which can not only effectively improve the drilling efficiency during the next drilling, but also ensure that the material to be drilled will not be deformed.

[0084] It should be noted that the working parameters provided in this embodiment are not limited to the power parameters and working time of the laser, but may also include the number of laser pulses, the output diameter of the laser and other working parameters related to the laser.

[0085] S34, generating a second drilling instruction for controlling the scanning galvanometer and the laser according to the second deflection angle and the working parameter.

[0086] In this embodiment, the second drilling instruction provided in this embodiment can also be an instruction for drilling the material to be drilled once to form a hole; it can also be an instruction for drilling the material to be drilled multiple times in succession to form multiple holes, but the multiple holes need to correspond to the drilling points in the drilling image.

[0087] S4. Based on the second drilling instruction, control the laser to switch to a second working state, control the scanning galvanometer to deflect to a second deflection angle, and make the second laser beam emitted by the laser focus on the material to be drilled through the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, and the second hole belongs to the drilling point in the drilling image.

[0088] S5. Use the second hole as the first hole.

[0089] S6. Loop step S3 to step S5 until the drilling image is formed on the material to be drilled.

[0090] By adopting the method provided in the above embodiment, after completing one or more drilling operations corresponding to the first drilling instruction, the second drilling instruction for the next drilling is dynamically adjusted according to the position information, material information and drilling image of the hole formed in the previous drilling. This can not only effectively improve the drilling efficiency of the next drilling, but also ensure that the material to be drilled will not be deformed.

[0091] As an optional embodiment, in order to further improve the drilling efficiency of dense hole production in the material to be drilled, see Figure 3 , Figure 3 is a flow chart of determining the drilling position information of the next drilling position provided by an embodiment of the present invention, such as Figure 3 As shown, the step of determining the drilling position information of the next drilling position according to the first position information and the drilling image provided in this embodiment may include: step S311 to step S313;

[0092] Step S311: acquiring temperature information of the surface of the material to be drilled at the first position information according to the first position information.

[0093] In this embodiment, the laser drilling equipment provided in this embodiment may further include a temperature collector. By controlling the temperature collector to collect the temperature of the material to be drilled, the temperature information of the surface of the material to be drilled at the first position information can be collected.

[0094] Step S312, when the temperature information meets the target temperature threshold, determine the undrilled points on the target area corresponding to the drilling image according to the first position information, and the target temperature threshold is the temperature threshold corresponding to the material to be drilled without material deformation.

[0095] In this embodiment, this embodiment can determine in advance the temperature thresholds corresponding to different materials to be drilled when no material deformation occurs based on different materials to be drilled, and use the temperature threshold as the target temperature threshold corresponding to the material to be drilled. This facilitates the determination of the corresponding target temperature threshold directly based on the material to be drilled when the next drilling instruction needs to be dynamically adjusted to determine whether drilling can continue in the target area, thereby ensuring that when drilling continues in the target area, the material to be drilled will not change due to the temperature during drilling, thereby effectively improving the drilling efficiency for dense hole production.

[0096] Step S313: determine the position information of the point to be drilled as the drilling position information of the next drilling position.

[0097] In some embodiments, there is a case where the temperature information does not meet the target temperature threshold. In this case, in order to ensure the drilling efficiency of dense hole production and to ensure that the material to be drilled does not deform, please refer to Figure 4 , Figure 4 is another flow chart of determining the drilling position information of the next drilling position provided by an embodiment of the present invention, such as Figure 4 As shown, after step S311, the laser drilling method provided in this embodiment may further include steps S314 to S315;

[0098] Step 314: when it is determined that there is no point to be drilled in the target area corresponding to the drilling image, or when the temperature information does not meet the target temperature threshold, another drilling area with a point to be drilled is used as the target area.

[0099] In this embodiment, when it is determined that there is no point to be drilled on the target area corresponding to the drilling image, it indicates that the current target area has been drilled, and it is necessary to select the next drilling area with a point to be drilled as the target area. Therefore, in this case, another drilling area with a point to be drilled can be directly used as the target area.

[0100] Since the target temperature threshold is the temperature threshold corresponding to the time when the material to be drilled will not produce material deformation, therefore, when the temperature information does not meet the target temperature threshold, it can be determined that if the drilling operation is continued in the target area, the material to be drilled will be deformed. Therefore, in this embodiment, another drilling area with a point to be drilled can be selected as the target area, and drilling can be continued to avoid the heat-affected zone from continuing to grow in the same target area, effectively avoiding the problem of deformation of the material to be drilled, thereby improving drilling efficiency.

[0101] Optionally, in order to avoid the thermal impact of the high temperature generated during drilling on the material to be drilled, the present embodiment can select a drilling area at a certain distance from the current target area as the new target area when selecting the next drilling area with a point to be drilled as the new target area, or can select the drilling area farthest from the current target area as the new target area, as long as it can be ensured that the heat during drilling will not be transferred and accumulated. The selection of the next drilling area with a point to be drilled as the new target area is not limited here.

[0102] Step 315: determine the position information of the to-be-drilled point in the target area as the drilling position information of the next drilling position.

[0103] After the new target area is determined, the position information of the undrilled points in the new target area can be automatically determined as the drilling position information of the next drilling position, thereby improving the drilling efficiency.

[0104] In other embodiments, in order to ensure the drilling efficiency of dense hole production when the temperature information does not meet the target temperature threshold, and to ensure that the material to be drilled will not be deformed, please continue to refer to Figure 4 ,like Figure 4 As shown, after step S311, the laser drilling method provided in this embodiment may further include steps S316 to S318;

[0105] Step 316, when the temperature information does not meet the target temperature threshold, the first drilling area is adjusted accordingly according to the temperature information and the target temperature threshold to obtain a second drilling area, and the second drilling area indicates that the corresponding temperature information when drilling in the second drilling area meets the target temperature threshold.

[0106] Since the target temperature threshold is the temperature threshold corresponding to when the material to be drilled will not produce material deformation, therefore, when the temperature information does not meet the target temperature threshold, it can be determined that if the drilling operation is continued in the target area, the material to be drilled will be deformed. Therefore, this embodiment needs to avoid continuing to drill in the current target area. In an optional manner, this embodiment can narrow the area range of the drilling area according to the difference between the temperature information of the current material to be drilled and the minimum target temperature value in the target temperature threshold, thereby obtaining the second drilling area. In this way, by reducing the number of times drilling is required in the drilling area, the heat accumulation in the drilling area can be effectively reduced, ensuring that the heat accumulated when drilling all holes in the adjusted second drilling area does not cause the temperature of the material to be drilled to exceed the target temperature threshold, thereby ensuring that when drilling continuously in the adjusted second drilling area, the material to be drilled will not change.

[0107] The larger the difference is, the smaller the range of the adjusted second drilling area is relative to the first drilling area, that is, the difference is inversely proportional to the area range of the second drilling area.

[0108] Step 317: divide the material to be drilled into a plurality of second drilling areas according to the distribution of the drilling images and the second drilling areas, and use a drilling area in the plurality of second drilling areas where there are points to be drilled as a target area.

[0109] Step 318: determine the position information of the point to be drilled in the target area as the drilling position information of the next drilling position.

[0110] After the new target area is determined, the position information of the undrilled points in the new target area can be automatically determined as the drilling position information of the next drilling position, thereby improving the drilling efficiency.

[0111] In summary, an embodiment of the present invention provides a laser drilling control method for controlling a laser drilling device to perform laser drilling, wherein the laser drilling device includes a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence, and the laser drilling control method includes the following steps: S1, generating a first drilling instruction according to an expected drilling image of a material to be drilled; S2, based on the first drilling instruction, controlling the laser to switch to a first working state, and controlling the scanning galvanometer to deflect to a first deflection angle, and making a first laser beam emitted by the laser focus on the material to be drilled via the beam expander, the scanning galvanometer, and the focusing lens to form a first hole, and the first The hole belongs to the drilling point in the drilling image; S3, according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image, generate a second drilling instruction; S4, based on the second drilling instruction, control the laser to switch to the second working state, and control the scanning galvanometer to deflect to the second deflection angle, and make the second laser beam emitted by the laser focus on the material to be drilled through the beam expander, the scanning galvanometer and the focusing lens to form a new second hole on the material to be drilled, and the second hole belongs to the drilling point in the drilling image; S5, take the second hole as the first hole; S6, loop step S3 to step S5 until the drilling image is formed on the material to be drilled. The method provided by the embodiment of the present invention is adopted, by dynamically adjusting the second drilling instruction for the next drilling according to the first position information of the first hole formed in the last drilling, the material information of the material to be drilled and the drilling image in real time, it is possible to avoid the deformation of the material to be drilled caused by the heat generated during drilling, thereby effectively improving the efficiency of dense hole production.

[0112] In order to solve the same technical problem, this embodiment also provides a laser drilling control device, which is used to control a laser drilling device to perform laser drilling. The laser drilling device includes a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence. For details, please refer to Figure 5 , Figure 5 is a structural schematic diagram of a laser drilling control device provided by an embodiment of the present invention, such as Figure 5 As shown, the laser drilling control device 500 provided in the embodiment of the present invention includes: a first generation module 501, a first control module 502, a second generation module 503, a second control module 504, a conversion module 505 and a circulation module 506;

[0113] The first generating module 501 is used to generate a first drilling instruction according to an expected drilling image of the material to be drilled.

[0114] In this embodiment, the first generation module 501 provided in this embodiment is specifically used to: divide the material to be drilled into multiple first drilling areas according to the distribution of drilling points in the drilling image expected for the material to be drilled; and generate a first drilling instruction for drilling a target area according to the multiple first drilling areas, wherein the target area is a drilling area where there are undrilled points to be drilled.

[0115] The first control module 502 is used to control the laser to switch to a first working state based on the first drilling instruction, and control the scanning galvanometer to deflect to a first deflection angle, so that the first laser beam emitted by the laser is focused on the material to be drilled through the beam expander, the scanning galvanometer and the focusing lens to form a first hole, and the first hole belongs to the drilling point in the drilling image.

[0116] In this embodiment, the first control module 502 provided in this embodiment is specifically used to: determine the first working state of the laser and the first deflection angle of the scanning galvanometer based on the first drilling instruction and the position information of the target area on the material to be drilled; control the laser to switch to the first working state, and control the scanning galvanometer to deflect to the first deflection angle.

[0117] The second generating module 503 is used to generate a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image.

[0118] In this embodiment, the second generation module 503 provided in this embodiment is specifically used to: determine the drilling position information of the next drilling position according to the first position information and the drilling image; determine the second deflection angle of the scanning galvanometer according to the drilling position information; determine the working parameters used by the laser when drilling the material to be drilled according to the material type information and material thickness information of the material to be drilled, and the working parameters include power parameters and working time; generate a second drilling instruction for controlling the scanning galvanometer and the laser according to the second deflection angle and the working parameters.

[0119] Optionally, the second generation module 503 provided in this embodiment is also specifically used to: obtain the temperature information of the surface of the material to be drilled at the first position information according to the first position information; determine the to-be-drilled point on the target area corresponding to the drilling image that has not been drilled according to the first position information when the temperature information meets the target temperature threshold, and the target temperature threshold is the temperature threshold corresponding to the material to be drilled when no material deformation occurs; and determine the position information of the to-be-drilled point as the drilling position information of the next drilling position.

[0120] In one embodiment, the second generation module 503 provided in this embodiment is also specifically used for: when it is determined that there is no point to be drilled in the target area corresponding to the drilling image, or when the temperature information does not meet the target temperature threshold, taking another drilling area with a point to be drilled as the target area; and determining the position information of the point to be drilled in the target area as the drilling position information of the next drilling position.

[0121] In another embodiment, the second generation module 503 provided in this embodiment is also specifically used for: when the temperature information does not meet the target temperature threshold, according to the temperature information and the target temperature threshold, correspondingly adjusting the first drilling area to obtain a second drilling area, wherein the second drilling area represents that the corresponding temperature information when drilling in the second drilling area meets the target temperature threshold; according to the distribution of the drilling image and the second drilling area, dividing the material to be drilled into multiple second drilling areas, and taking the drilling areas where there are points to be drilled in the multiple second drilling areas as target areas; determining the position information of the points to be drilled in the target area as the drilling position information of the next drilling position.

[0122] A second control module 504 is used to control the laser to switch to a second working state based on the second drilling instruction, and control the scanning galvanometer to deflect to a second deflection angle, so that the second laser beam emitted by the laser is focused on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, and the second hole belongs to the drilling point in the drilling image;

[0123] A conversion module 505, configured to use the second hole as the first hole;

[0124] The loop module 506 is used to loop the second generation module, the second control module and the conversion module until the drilling image is formed on the material to be drilled.

[0125] During specific implementation, the above modules and / or units can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities. The specific implementation of the above modules and / or units can refer to the previous method embodiments. The specific beneficial effects that can be achieved can also refer to the beneficial effects in the previous method embodiments, which will not be repeated here.

[0126] Also, see Figure 6 , Figure 6 1 is a schematic diagram of a structure of an electronic device provided by an embodiment of the present invention, and the electronic device may be a mobile terminal such as a smart phone, a tablet computer, or the like. Figure 6As shown, the electronic device 600 includes a processor 601 and a memory 602. The processor 601 is electrically connected to the memory 602.

[0127] The processor 601 is the control center of the electronic device 600. It uses various interfaces and lines to connect various parts of the entire electronic device. It executes various functions of the electronic device 600 and processes data by running or loading applications stored in the memory 602 and calling data stored in the memory 602, thereby monitoring the electronic device 600 as a whole.

[0128] In this embodiment, the processor 601 in the electronic device 600 will load the instructions corresponding to the processes of one or more applications into the memory 602 according to the following steps, and the processor 601 will run the application stored in the memory 602, thereby implementing any step in the laser drilling control method provided in the above embodiment.

[0129] The electronic device 600 can implement the steps in any embodiment of the laser drilling control method provided in the embodiments of the present invention, and therefore can achieve the beneficial effects that can be achieved by any laser drilling control method provided in the embodiments of the present invention. For details, please refer to the previous embodiments and will not be repeated here.

[0130] See also Figure 7 , Figure 7 is another structural schematic diagram of an electronic device provided by an embodiment of the present invention, such as Figure 7 As shown, Figure 7 The specific structural block diagram of the electronic device provided by the embodiment of the present invention is shown, and the electronic device can be used to implement the laser drilling control method provided in the above embodiment. The electronic device 700 can be a mobile terminal such as a smart phone or a laptop computer.

[0131] The RF circuit 710 is used to receive and send electromagnetic waves, realize the mutual conversion between electromagnetic waves and electrical signals, and thus communicate with a communication network or other devices. The RF circuit 710 may include various existing circuit elements for performing these functions, such as antennas, radio frequency transceivers, digital signal processors, encryption / decryption chips, user identity module (SIM) cards, memories, etc. The RF circuit 710 can communicate with various networks such as the Internet, corporate intranets, wireless networks, or communicate with other devices through wireless networks. The above-mentioned wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. The above-mentioned wireless networks can use various communication standards, protocols and technologies, including but not limited to Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (such as Institute of Electrical and Electronics Engineers standards IEEE 802.11a, IEEE 802.11b, IEEE802.11g and / or IEEE802.11n), Voice over Internet Protocol (VoIP), Worldwide Interoperability for Microwave Access (Wi-Max), other protocols for email, instant messaging and short messages, and any other suitable communication protocols, even those that have not yet been developed.

[0132] The memory 720 can be used to store software programs and modules, such as program instructions / modules corresponding to the laser drilling control method in the above embodiment. The processor 780 executes various functional applications and controls laser drilling by running the software programs and modules stored in the memory 720.

[0133] The memory 720 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 720 may further include a memory remotely arranged relative to the processor 780, and these remote memories may be connected to the electronic device 700 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0134] The input unit 730 can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, the input unit 730 may include a touch-sensitive surface 731 and other input devices 732. The touch-sensitive surface 731, also known as a touch display screen or touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface 731), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface 731 may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 780, and can receive and execute commands sent by the processor 780. In addition, the touch-sensitive surface 731 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 731, the input unit 730 may further include other input devices 732. Specifically, the other input devices 732 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.

[0135] The display unit 740 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 700, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 740 may include a display panel 741, and optionally, the display panel 741 may be configured in the form of LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface 731 may cover the display panel 741, and when the touch-sensitive surface 731 detects a touch operation on or near it, it is transmitted to the processor 780 to determine the type of the touch event, and then the processor 780 provides corresponding visual output on the display panel 741 according to the type of the touch event. Although in the figure, the touch-sensitive surface 731 and the display panel 741 are implemented as two independent components to implement input and output functions, in some embodiments, the touch-sensitive surface 731 and the display panel 741 can be integrated to implement input and output functions.

[0136] The electronic device 700 may also include at least one sensor 750, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 741 according to the brightness of the ambient light, and the proximity sensor may generate an interrupt when the flip cover is closed or closed. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary, which can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 700, they will not be repeated here.

[0137] The audio circuit 760, the speaker 761, and the microphone 762 can provide an audio interface between the user and the electronic device 700. The audio circuit 760 can transmit the electrical signal converted from the received audio data to the speaker 761, which is converted into a sound signal for output; on the other hand, the microphone 762 converts the collected sound signal into an electrical signal, which is received by the audio circuit 760 and converted into audio data, and then the audio data is output to the processor 780 for processing, and then sent to another terminal through the RF circuit 710, or the audio data is output to the memory 720 for further processing. The audio circuit 760 may also include an earplug jack to provide communication between an external headset and the electronic device 700.

[0138] The electronic device 700 can help the user receive requests, send information, etc. through the transmission module 770 (such as a Wi-Fi module), which provides the user with wireless broadband Internet access. Although the transmission module 770 is shown in the figure, it is understandable that it is not a necessary component of the electronic device 700 and can be omitted as needed without changing the essence of the invention.

[0139] The processor 780 is the control center of the electronic device 700. It uses various interfaces and lines to connect various parts of the entire mobile phone. By running or executing software programs and / or modules stored in the memory 720, and calling data stored in the memory 720, it executes various functions of the electronic device 700 and processes data, thereby monitoring the electronic device as a whole. Optionally, the processor 780 may include one or more processing cores; in some embodiments, the processor 780 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, etc., and the modem processor mainly processes wireless communications. It can be understood that the above-mentioned modem processor may not be integrated into the processor 780.

[0140] The electronic device 700 also includes a power supply 790 (such as a battery) for supplying power to various components. In some embodiments, the power supply can be logically connected to the processor 780 through a power management system, so that the power management system can manage charging, discharging, and power consumption management. The power supply 790 can also include any components such as one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators.

[0141] Although not shown, the electronic device 700 also includes a camera (such as a front camera, a rear camera), a Bluetooth module, etc., which will not be described in detail here. Specifically in this embodiment, the display unit of the electronic device is a touch screen display, and the mobile terminal also includes a memory, and one or more programs, wherein one or more programs are stored in the memory, and are configured to be executed by one or more processors to implement any step of the laser drilling control method provided in the above embodiment.

[0142] In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be found in the previous method embodiments, which will not be repeated here.

[0143] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions, or by controlling related hardware through instructions, and the instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. To this end, an embodiment of the present invention provides a storage medium, which stores a plurality of instructions, and when the instructions are executed by the processor, any step in the laser drilling control method provided in the above embodiments can be implemented.

[0144] The storage medium may include: a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0145] Since the instructions stored in the storage medium can execute the steps in any embodiment of the laser drilling control method provided in the embodiments of the present invention, the beneficial effects that can be achieved by any laser drilling control method provided in the embodiments of the present invention can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0146] The above is a detailed introduction to a laser drilling control method, device, electronic device and storage medium provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application. Moreover, for those of ordinary skill in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A laser drilling control method, characterized in that: The method is used to control a laser drilling device to perform laser drilling, wherein the laser drilling device comprises a laser, a beam expander, a scanning galvanometer and a focusing lens which are optically connected in sequence, and the laser drilling control method comprises the following steps: S1, generating a first drilling instruction according to an expected drilling image of a material to be drilled; S2, based on the first drilling instruction, controlling the laser to switch to a first working state, controlling the scanning galvanometer to deflect to a first deflection angle, and focusing the first laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a first hole, wherein the first hole belongs to a drilling point in the drilling image; S3, generating a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image; S4, based on the second drilling instruction, controlling the laser to switch to a second working state, controlling the scanning galvanometer to deflect to a second deflection angle, and focusing the second laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, wherein the second hole belongs to a drilling point in the drilling image; S5, using the second hole as the first hole; S6. Loop step S3 to step S5 until the drilling image is formed on the material to be drilled.

2. The laser drilling control method according to claim 1, characterized in that: The step of generating a first drilling instruction according to the drilling image expected for the material to be drilled comprises: Dividing the material to be drilled into a plurality of first drilling areas according to the distribution of drilling points in the drilling image expected for the material to be drilled; A first drilling instruction for drilling a target area is generated according to the plurality of first drilling areas, wherein the target area is a drilling area where there are un-drilled points to be drilled.

3. The laser drilling control method according to claim 2, characterized in that: The step of controlling the laser to switch to a first working state and controlling the scanning galvanometer to deflect to a first deflection angle based on the first drilling instruction includes: Determine a first working state of the laser and a first deflection angle of the scanning galvanometer based on the first drilling instruction and the position information of the target area on the material to be drilled; The laser is controlled to switch to the first working state, and the scanning galvanometer is controlled to deflect to the first deflection angle.

4. The laser drilling control method according to claim 3, characterized in that: The step of generating a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image comprises: Determining drilling position information of a next drilling position according to the first position information and the drilling image; Determining a second deflection angle of the scanning galvanometer according to the drilling position information; Determining working parameters used by the laser when drilling the material to be drilled according to the material type information and material thickness information of the material to be drilled, wherein the working parameters include power parameters and working time; A second drilling instruction for controlling the scanning galvanometer and the laser is generated according to the second deflection angle and the working parameter.

5. The laser drilling control method according to claim 4, characterized in that: The step of determining the drilling position information of the next drilling position according to the first position information and the drilling image comprises: According to the first position information, acquiring temperature information of the surface of the material to be drilled at the first position information; In the case where the temperature information satisfies the target temperature threshold, determining the undrilled points on the target area corresponding to the drilling image according to the first position information, wherein the target temperature threshold is a temperature threshold corresponding to when the material to be drilled does not produce material deformation; The position information of the point to be drilled is determined as the drilling position information of the next drilling position.

6. The laser drilling control method according to claim 5, characterized in that: After the step of acquiring temperature information of the surface of the material to be drilled at the first position information according to the first position information, the laser drilling control method further includes: When it is determined that there is no point to be drilled on the target area corresponding to the drilling image, or when the temperature information does not meet the target temperature threshold, another drilling area with a point to be drilled is used as the target area; The position information of the to-be-drilled point in the target area is determined as the drilling position information of the next drilling position.

7. The laser drilling control method according to claim 5, characterized in that: After the step of acquiring temperature information of the surface of the material to be drilled at the first position information according to the first position information, the laser drilling control method further includes: In the case where the temperature information does not meet the target temperature threshold, the first drilling area is adjusted accordingly according to the temperature information and the target temperature threshold to obtain a second drilling area, where the second drilling area indicates that the corresponding temperature information meets the target temperature threshold when drilling is performed in the second drilling area; According to the distribution of the drilling images and the second drilling areas, the material to be drilled is divided into a plurality of second drilling areas, and a drilling area in the plurality of second drilling areas where there are points to be drilled is taken as a target area; The position information of the to-be-drilled point in the target area is determined as the drilling position information of the next drilling position.

8. A laser drilling control device, characterized in that: Used to control a laser drilling device to perform laser drilling, the laser drilling device includes a laser, a beam expander, a scanning galvanometer, and a focusing lens optically connected in sequence, the laser drilling control device includes: A first generating module, used for generating a first drilling instruction according to an expected drilling image of a material to be drilled; a first control module, configured to control the laser to switch to a first working state based on the first drilling instruction, and control the scanning galvanometer to deflect to a first deflection angle, and focus the first laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a first hole, wherein the first hole belongs to a drilling point in the drilling image; A second generating module, configured to generate a second drilling instruction according to the first position information of the first hole, the material information of the material to be drilled, and the drilling image; a second control module, configured to control the laser to switch to a second working state based on the second drilling instruction, and control the scanning galvanometer to deflect to a second deflection angle, and focus the second laser beam emitted by the laser on the material to be drilled via the beam expander, the scanning galvanometer and the focusing lens to form a new second hole, wherein the second hole belongs to a drilling point in the drilling image; A conversion module, used for using the second hole as the first hole; A loop module is used for loopingly executing the second generation module, the second control module and the conversion module until the drilling image is formed on the material to be drilled.

9. An electronic device, characterized in that: The electronic device comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, and the processor implements the steps in the method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the method according to any one of claims 1 to 7 are implemented.

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