Chip capacitor tray placing equipment

Abstract

The invention relates to chip capacitor wobble plate equipment which comprises a vibration module, a driving module, a material taking module, a deviation rectifying module and a wobble plate module. Wherein the driving module is connected with the material taking module and drives the material taking module to pass through the vibration module, the deviation rectifying module and the plate arranging module; the vibration module comprises a vibration screen and a vibration driver, and the vibration screen is connected with the vibration driver; the material taking module comprises a first camera and a suction nozzle, the first camera is used for shooting the chip capacitor on the vibrating screen, and the suction nozzle is used for adsorbing or desorbing the chip capacitor; the wobble plate module comprises a cam, a cam follow-up device, a clamping jaw device and a collecting box, the cam follow-up device is installed on the clamping jaw device and abuts against the cam, and when the cam rotates, the clamping jaw device clamps or loosens the collecting box; and the deviation rectifying module comprises a second camera, and the second camera is used for shooting the chip capacitor adsorbed by the suction nozzle. According to the chip capacitor tray placing equipment, full-automatic tray placing can be achieved during tray placing, manual intervention is not needed, and the tray placing efficiency and accuracy are improved.

Description

Technical Field

[0001] The invention relates to the field of chip capacitor collection, and in particular to a chip capacitor plate swing device. Background Art

[0002] A chip capacitor is a device that holds charge. It consists of two conductors close to each other with a layer of non-conductive insulating medium in between. Its ability to hold charge is usually referred to as capacitance. Capacitors are one of the electronic components used in large quantities in electronic equipment. They are widely used in circuits in terms of DC isolation, AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, and control.

[0003] Due to their small size, chip capacitors are not easy to collect and arrange in an orderly manner with existing machines. The accuracy of placement is low, and they cannot be completely removed during placement and removal. Manual intervention is usually required, which is inefficient. Summary of the invention

[0004] Based on this, the purpose of the present invention is to provide a chip capacitor swing device to reduce manual intervention during swinging and improve swinging efficiency.

[0005] A chip capacitor plate swing device, comprising a vibration module, a drive module, a material picking module, a deviation correction module, a swing plate module and a control unit; wherein the drive module is connected to the material picking module and can drive the material picking module to move above the vibration module, the deviation correction module or the swing plate module; the vibration module comprises a vibration screen and a vibration driver, and the vibration screen and the vibration driver are connected; the material picking module comprises a first camera and a suction nozzle, the first camera is used to take pictures of chip capacitors on the vibration screen, and the suction nozzle is rotatable and used to adsorb or desorb chip capacitors; the deviation correction module comprises a second camera, and the second camera is used to take pictures of chip capacitors on the suction nozzle; the swing plate The module includes a cam, a cam follower, a clamping device and a collection box. The cam follower is installed on the clamping device and abuts against the cam. When the cam rotates, the clamping device clamps or releases the collection box; the control unit determines the position of each chip capacitor on the vibrating screen according to the picture taken by the first camera, and the driving module drives the material picking module to move above one of the chip capacitors, and the suction nozzle adsorbs the chip capacitor; the control unit also obtains the deflection angle of the chip capacitor on the suction nozzle according to the picture taken by the second camera, and the suction nozzle rotates the deflection angle; when the material picking module moves to above the collection box, the suction nozzle detaches the chip capacitor.

[0006] The chip capacitor plate swinging device described in the present invention, when it is necessary to swing the chip capacitor plate, first put the chip capacitor into the vibrating screen, vibrate it through the vibration driver, and shake the stacked chip capacitor products to disperse and lay them flat in the vibrating screen; then the driving module moves the material picking module to the top of the vibrating screen, and the chip capacitors on the vibrating screen are photographed by the first camera, and the control unit controls the material picking module to move to the top of one of the chip capacitors, and then the chip capacitor is sucked by the suction nozzle; after the suction nozzle sucks the chip capacitor, the driving module moves the material picking module to the top of the deviation correction module, and the second camera is used to shoot to obtain the deflection angle of the chip capacitor; then the control unit controls the suction nozzle to rotate a deflection angle, rotates the chip capacitor to the correct direction, and at the same time, the material picking module moves to the collection box of the swinging plate module to place the chip capacitor. When the collection box is full of chip capacitors, the cam rotates, and the cam follower moves from the concave position of the cam to the convex position, thereby pushing the clamping device to move, so that the clamping device releases the collection box, and the collection box can be taken out at this time, completing the chip capacitor swinging. The present invention can realize the automatic plating of chip capacitors. The vibrating screen can spread the chip capacitors in bulk by vibrating them, and then absorb and place the chip capacitors one by one through the feedback of the visual function of the first camera to ensure that all the materials can be taken out. At the same time, visual correction is completed through the second camera and the control unit to improve the efficiency and accuracy of plating.

[0007] As a preferred solution, a chip capacitor plate placing device further includes a material cleaning module, the material cleaning module includes a waste box, when the control unit determines that the chip capacitor is not in a qualified posture when being sucked according to the picture taken by the second camera, the driving module drives the material picking module to move above the material cleaning module, and the suction nozzle detaches the chip capacitor. That is, after the chip capacitor is sucked by the material picking module and passes through the deviation correction module, the chip capacitor with a poor posture and unable to be corrected is moved to the waste box of the material cleaning module.

[0008] As a preferred solution, the cleaning module further includes a first magnet, a second magnet, a sensor and a base, wherein the first magnet is mounted on the waste box, the first magnet is connected to the second magnet, the second magnet is mounted on the base, and the sensor is fixed on the base to sense whether the waste box exists. When the waste box is removed, the sensor senses that the waste box is not on the base, and the driving module stops running to ensure safety.

[0009] As a preferred solution, the material picking module further includes a screw rod, which is connected to the first camera and the suction nozzle and is used to control the vertical movement of the first camera and the suction nozzle. The screw rod can accurately control the moving distance to avoid damaging the chip capacitor.

[0010] As a preferred solution, the wobble plate module further comprises a workbench and a collection box carrier, the collection box carrier is fixed on the workbench and is located above the cam; the collection box carrier is provided with at least one collection box station, and the collection station can be used to place the collection box. The collection box is placed on the collection box station, which is convenient for installation and removal of the collection box.

[0011] As a preferred solution, the clamping device includes a base and a clamping part connected to each other, the base is located below the collection box carrier, the cam follower is located on the base, and the clamping part is located above the collection box. When the clamping device clamps the collection box, the clamping part is pressed against the edge of the collection box. The base and the clamping part are respectively arranged on both sides of the collection box carrier, which makes full use of space and has a compact structure.

[0012] As a preferred solution, the clamping portion is provided with a right-angled notch facing the collection box, and when the clamping jaw device clamps the collection box, the clamping portion is pressed against two adjacent sides of the collection box. The right-angled notch compacts the two adjacent sides of the collection box, making it easier for the clamping jaw device to compact and release the collection box.

[0013] As a preferred solution, there are several clamping devices, which are arranged around the outer side of the cam. The swing plate module also includes a moving track and a reset spring. Each clamping device is installed on the moving track. The two ends of the reset spring are respectively connected to the collection box carrier and the clamping device. When the cam rotates, the clamping device can move closer to or away from the cam along the moving track, and the clamping device clamps or releases the collection box. When the clamping device needs to release the collection box, the cam rotates, the cam follower moves from the concave position of the cam to the convex position, the clamping device moves away from the cam, and the reset spring stretches; when the clamping device needs to compact the clamping device, the cam rotates, the cam follower moves from the convex position of the cam to the concave position, the reset spring contracts, and the clamping device is pulled close to the cam.

[0014] As a preferred solution, the wobble plate module further comprises an air circuit assembly, an air circuit is arranged in the collection box carrier, an air hole is arranged on the surface of the collection box station, and the air circuit assembly is connected with the air circuit and the air hole. When in use, the air circuit assembly can form a negative pressure, and when working, the collection box carrier can absorb the collection box, so as to avoid vibration caused by the clamping device when resetting, so as to cause vibration of the collection box.

[0015] As a preferred solution, the swing plate module further comprises an elastic membrane component, which is detachably connected to the collection box carrier or the workbench. When only chip capacitors need to be screened and no swing plate is needed, the elastic membrane component can be used for collection.

[0016] As a preferred solution, the elastic membrane assembly includes a blue membrane and a fixture, the blue membrane is attached to the surface of the fixture, an air path is provided in the fixture, the air path assembly is connected to the air path, and an air hole is provided on the surface of the fixture, and the air hole is connected to the air path. When in use, the air path assembly can form a negative pressure, which can make the blue membrane attached to the surface of the fixture to form a suitable collection surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a chip capacitor plate swing device;

[0018] Figure 2 It is a schematic diagram of the structure of a driving module of a chip capacitor swing device;

[0019] Figure 3 It is a partial structural schematic diagram of a chip capacitor panning device;

[0020] Figure 4 It is a schematic diagram of the structure of a vibration module of a chip capacitor swing plate device;

[0021] Figure 5 It is an exploded diagram of the cleaning module of a chip capacitor tray equipment;

[0022] Figure 6 It is a schematic diagram of the structure of a correction module of a chip capacitor panning device;

[0023] Figure 7 It is an exploded diagram of a plate-swinging module of a chip capacitor plate-swinging device;

[0024] Figure 8 It is a schematic diagram of the structure of a material taking module of a chip capacitor tray device;

[0025] Among them, 1-driving module, 11-first motor, 12-second motor, 2-vibration module, 21-bin, 22-vibration screen, 23-vibration driver, 3-cleaning module, 31-waste box, 32-first magnet, 33-second magnet, 34-base, 35-sensor, 4-correction module, 41-second camera, 42-fixed seat, 5-swing plate module, 51-cam, 52-cam follower, 53-gripper, 54-collection box, 5 5-collection box carrier, 551-collection box station, 56-moving track, 57-elastic membrane assembly, 58-workbench, 581-air inlet connector, 582 digital display, 6-material picking module, 61-first camera, 62-suction nozzle, 63-screw rod, 64-solenoid valve assembly, 65-servo motor, 66-synchronous wheel assembly, 67-positive pressure regulating valve, 68-negative pressure regulating valve, 69-connecting plate, 71-first direction, 72 second direction, 73-third direction. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0030] like Figure 1-3 As shown, a chip capacitor wobble device described in the present invention includes a driving module 1, a vibration module 2, a material cleaning module 3, a deviation correction module 4, a wobble module 5, a material picking module 6 and a control unit. Among them, the driving module 1 includes a first motor 11 and a second motor 12; the first motor 11 is connected to the material picking module 6, and drives the material picking module 6 to move along the first direction 71 when working, and the second motor 12 drives the first motor 11 to move along the second direction 72 when working. The movement of the material picking module 6 driven by the first motor 11 and the movement of the first motor 12 driven by the second motor 11 can be achieved by a screw nut mechanism, or can be achieved by other conventional technologies in the field, which will not be repeated here. In this embodiment, the first direction 71 and the second direction 72 are located on the same horizontal plane and are perpendicular to each other. The vibration module 2, the material cleaning module 3, the deviation correction module 4 and the wobble module 5 are arranged in a straight line along the first direction 71 in sequence.

[0031] like Figure 4 As shown, the vibration module 2 includes a silo 21, a vibrating screen 22 and a vibration driver 23. The opening of the silo 21 faces the vibrating screen 22, and the vibrating screen 22 is connected to the vibration driver 23. The chip capacitors can be directly placed in the vibrating screen 22, or first placed in the silo 21 and then enter the vibrating screen 22 in batches through the silo 21; the vibrating screen 22 is vibrated by the vibration driver 23 to flatten and disperse the chip capacitors.

[0032] like Figure 5 As shown, the cleaning module 3 includes a waste box 31, a first magnet 32, a second magnet 33, a base 34 and a sensor 35. The first magnet 32 ​​is mounted on the waste box 31, the first magnet 32 ​​is connected to the second magnet 33, the second magnet 33 is mounted on the base 34, and the sensor 35 is fixed on the base 34 to sense whether the waste box 31 is fixed on the base 34. When the waste box 31 is taken away, the sensor 35 senses that the waste box 31 is not on the base 34, and sends a signal to the control unit, which controls the driving module 1 to stop running to ensure safety.

[0033] like Figure 6 As shown, the correction module 4 includes a second camera 41 and a fixing base 42, and the second camera is fixed on the fixing base 42. The correction module takes a picture of the chip capacitor located above through the second camera 41, and sends the obtained attitude information of the chip capacitor to the control unit.

[0034] like Figure 7As shown, the wobble plate module 5 includes a workbench 58, a cam 51, a cam follower 52, a clamping device 53, a collection box 54, a collection box carrier 55, a collection box station 551, a reset spring, a moving track 56, an elastic membrane assembly 57 and an air circuit assembly; the cam 51 has 4 concave positions and 4 convex positions, and the concave positions and the convex positions are arranged in sequence. There are 4 groups of cam followers 52, clamping devices 53, collection boxes 54 and moving tracks 56, and the 4 groups of clamping devices 53 are arranged around the cam 51. Each group of clamping devices 53 is installed on a corresponding group of moving guide rails 56 and can reciprocate along the moving guide rails 56. Specifically, the reciprocating motion of the clamping devices 53 is realized by a reset spring (not shown). The collection box carrier 55 is fixed on the workbench 58 and is located above the cam 51. The collection box carrier 55 has four collection box stations 551. An air path is provided in the collection box carrier 55. Air holes are provided on the surface of the collection box stations 551. The air path is connected to the air holes. In this embodiment, the two ends of the return spring are respectively connected to the clamping device 53 and the collection box carrier 55. In other embodiments, the return spring can also be installed in the moving guide rail 56, and the two ends are respectively connected to the bottom end of the clamping device 53 and the end of the moving rail 56 away from the cam 51; the two ends of the return spring can also be respectively connected to the clamping device 53 and the workbench 58. The cam follower 52 is installed on the end of the clamping device 53 close to the cam 51, and abuts against the cam 51. The end of the clamping device 53 close to the cam is formed with a right-angled notch. In the embodiment of the present invention, the collection box 54 is a waffle box, which has a stepped edge. When the cam follower 52 abuts against the concave position of the cam 51, the clamping jaw 53 abuts against the right-angled side of the collection box 54 and can compact the edge of the collection box 54. The elastic membrane assembly 57 can be detachably mounted on the workbench 58. The elastic membrane assembly 57 includes a blue membrane and a fixture. The blue membrane is attached to the surface of the fixture. An air path is provided in the fixture. Air holes are provided on the surface of the fixture. The air path is connected to the air holes. The air path assembly includes an air inlet connector 581 and a digital display 582. The air inlet connector 581 is connected to the air path in the collection box carrier 55 through a pipeline, and is also connected to the air path of the elastic membrane assembly 57. The digital display 582 is used to display the pressure conditions inside the four collection box stations 551 and the elastic membrane assembly 57.

[0035] like Figure 8As shown, the material taking module 6 includes a first camera 61, a suction nozzle 62, a screw rod 63, a solenoid valve assembly 64, a servo motor 65, a synchronous wheel assembly 66, a positive pressure regulating valve 67, a negative pressure regulating valve 68, and a connecting plate 69. The connecting plate 69 is connected to the first motor 11, and the screw rod 63 can be rotatably fixed on the connecting plate 69. The first camera 61 and the suction nozzle 62 are sleeved on the screw rod 63. When the screw rod rotates, it drives the first camera 61 and the suction nozzle 62 to move along the third direction 73. The third direction 73 is perpendicular to the first direction 71 and the second direction 72, respectively. In this embodiment, the third direction 73 is a vertical direction. The first camera 61 is used to take pictures of the vibrating screen 22 and send the position information of the chip capacitor in the vibrating screen 22 to the control unit. The solenoid valve assembly 64 is electrically connected to the positive pressure regulating valve 67 and the negative pressure regulating valve 68, which are connected to the suction nozzle 62, and can control the switch of the positive pressure regulating valve 67 and the negative pressure regulating valve 68, thereby adjusting the pressure state of the suction nozzle 62 for sucking and placing chip capacitors. The servo motor 65 is connected to the synchronous wheel assembly 66, which is connected to the suction nozzle 62. The synchronous wheel assembly 66 rotates under the control of the servo motor 65, thereby driving the suction nozzle 62 to rotate, so that the chip capacitor sucked by the suction nozzle 62 rotates to correct the angle.

[0036] The control unit is used to control the driving module 1, the vibration module 2, the material cleaning module 3, the deviation correction module 4, the swing plate module 5 and the material picking module 6. The control unit can control the driving module 1 to move the material picking module 6 to the top of the vibration screen 22 of the vibration module; the position of each chip capacitor on the vibration screen can be determined according to the picture taken by the first camera 61, and the screw rod 63 and / or the first motor 11 and / or the second motor 12 can be controlled to work so that the suction nozzle 62 moves to the top of a chip capacitor in the vibration screen 22; when the suction nozzle 62 is located above the chip capacitor and does not suck the chip capacitor, the solenoid valve assembly 64 can be controlled to make the suction nozzle 62 in a negative pressure state to suck the chip capacitor; after the suction nozzle 62 sucks the chip capacitor, the driving module 1 can be controlled to move the material picking module 6 to the top of the deviation correction module 4, and the chip capacitor picture sent by the second camera is compared with the posture of the standard sample to determine the deflection angle of the chip capacitor. If the chip capacitor is in an upright posture when it is adsorbed, or is away from the suction nozzle 62, the suction nozzle 62 can be moved to the top of the vibration screen 22. If the center deviates too much and there is an uncorrectable posture, the control driving module 1 drives the material picking module 6 to move to the top of the cleaning module 3. If the posture is qualified and has a deflection angle, the control unit controls the servo motor 65 to drive the suction nozzle 62 to rotate the corresponding deflection angle for angle correction. If there is no deflection angle, proceed directly to the next step. After performing the angle correction step, the control unit can drive the material picking module 6 to move to the top of one of the collection boxes 54 in the swing plate module 5, and control the solenoid valve assembly 64 to make the suction nozzle 62 in a positive pressure state, so that the chip capacitor falls into the collection box 54, and then the control unit controls the material picking module 6 to move to the top of the cleaning module 3, and then performs a throwing process to ensure that there is no chip capacitor residue on the suction nozzle 62, to avoid the chip capacitor sticking to the suction nozzle 62, and multiple chip capacitors are superimposed during the second material picking.

[0037] The chip capacitor plate swinging device of the present invention has the following working principle:

[0038] When the chip capacitors need to be placed on a plate, the chip capacitors are placed in the vibration module 2. The chip capacitors can be placed directly in the vibration screen 22, or placed in the silo 21 first, and then enter the vibration screen 22 in batches through the silo 21. The vibration screen 22 makes the chip capacitors flat and dispersed under the vibration of the vibration driver 23. The first motor 11 and the second motor 12 of the driving module 1 drive the material taking module 6 to move above the vibration screen 22 along the first direction 71 and the second direction 72.

[0039] The first camera 61 of the material picking module 6 takes a picture of the vibrating screen 22, and the control unit obtains the position information of the chip capacitor, and then controls the screw rod 63 to rotate, driving the first camera 61 and the suction nozzle 62 to move along the third direction 73. At the same time, the first motor 11 and the second motor 12 drive the material picking module 6 to move along the first direction 71 and the second direction 72 to above one of the chip capacitors; the control unit controls the solenoid valve assembly 64 to open the negative pressure regulating valve 68, close the positive pressure regulating valve 67, and switch to a negative pressure state. For chip capacitors of different sizes and different suction distances, the suction nozzle 62 is adjusted to a suitable pressure through the negative pressure regulating valve 68 to suck the chip capacitor through the air. After the chip capacitor is sucked, the control unit controls the first motor 11 and the second motor 12 to drive the material picking module 6 to move along the first direction 71 and the second direction 72 to the top of the correction module 4. After the second camera 41 takes a picture, the control unit obtains the posture information of the chip capacitor, and judges whether the posture of the chip capacitor when being sucked is qualified through algorithm analysis and comparison with the posture of the standard sample. If it is unqualified, it moves to the top of the cleaning module 3, the solenoid valve assembly closes the negative pressure regulating valve 68, and opens the positive pressure regulating valve 67, and throws the chip capacitor into the waste box 31. Then the first motor 11 and the second motor 12 drive the material picking module 6 to return to the top of the vibration module 2 to suck the chip capacitor again; if the posture of the sucked chip capacitor is qualified, the algorithm is used to determine whether the chip capacitor is qualified. The deflection angle of the chip capacitor is not zero, so it needs to be corrected. The control unit controls the servo motor 65 to rotate and drive the synchronous wheel assembly 66 to rotate the above deflection angle, thereby driving the suction nozzle 62 to rotate, rotating the chip capacitor to the correct direction, and simultaneously moving it to the top of one of the collection boxes 54 in the swing plate module 5. At this time, the control unit controls the solenoid valve assembly 64 to open the positive pressure regulating valve 67, close the negative pressure regulating valve 68, switch to the positive pressure state, and adjust the suction nozzle 62 to the appropriate pressure through the positive pressure regulating valve 68, place the chip capacitor in the collection box 54, and then the control unit drives the material picking module 6 to move to the top of the cleaning module 3, and then performs another throwing process to complete the swing of the chip capacitor.

[0040] When one of the collection boxes 54 is full, the control unit controls the cam 51 to rotate, and the cam follower 52 enters the convex position from the concave position of the cam 51, driving the clamping device 53 to move along the moving guide rail 56. At this time, the reset spring is stretched, and the end of the clamping device 53 relaxes the collection box 54, and the full collection box 54 is taken out from the collection box station 551, and a new collection box 54 is re-placed. Then the cam 51 rotates again, and the cam follower 52 enters the concave position from the convex position of the cam 51. At this time, the reset spring contracts, pulling the clamping device 53 to reset along the moving guide rail 56, and the end of the clamping device 53 compacts the collection box 54; when the collection box 54 is placed in the collection box station 551, since the air inlet joint 581 is connected to the air hole on the surface of the collection box station 551 through the air path in the collection box carrier 55, the air is sucked to generate negative pressure, adsorbing the collection box 54, thereby preventing the vibration caused by the reset spring during the reset from bouncing off the collection box 54 and scattering the chip capacitor.

[0041] When only chip capacitors need to be screened and no plate swing is required, the elastic membrane assembly 57 can be used for collection. The air inlet connector 581 is connected to the elastic membrane assembly 57 to adsorb the blue film on the surface of the fixture to form a suitable collection surface.

[0042] like Figure 1 As shown, the chip capacitor plate-staggering device of the embodiment of the present invention is a double-station device, having two groups of drive modules 1, vibration modules 2, material cleaning modules 3, deviation correction modules 4, plate-staggering modules 5 and material picking modules 6, and can simultaneously stagger chip capacitors of different sizes.

[0043] The above-mentioned embodiment only expresses one implementation mode of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. For ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A chip capacitor plate swing device, characterized in that: It includes a vibration module, a driving module, a material picking module, a deviation correction module, a swing plate module and a control unit; wherein the driving module is connected to the material picking module and can drive the material picking module to move above the vibration module, the deviation correction module or the swing plate module; the vibration module includes a vibration screen and a vibration driver, and the vibration screen is connected to the vibration driver; the material picking module includes a first camera and a suction nozzle, the first camera is used to take pictures of chip capacitors on the vibration screen, and the suction nozzle is rotatable and used to adsorb or desorb chip capacitors; the deviation correction module includes a second camera, and the second camera is used to take pictures of chip capacitors on the suction nozzle; the swing plate module includes a cam , a cam follower, a clamping device and a collection box, the cam follower is installed on the clamping device and abuts against the cam, and when the cam rotates, the clamping device clamps or releases the collection box; the control unit determines the position of each chip capacitor on the vibrating screen according to the picture taken by the first camera, the driving module drives the material picking module to move to the top of one of the chip capacitors, and the suction nozzle adsorbs the chip capacitor; the control unit also obtains the deflection angle of the chip capacitor on the suction nozzle according to the picture taken by the second camera, and the suction nozzle rotates according to the deflection angle; when the material picking module moves to the top of the collection box, the suction nozzle detaches the chip capacitor.

2. A chip capacitor plate swinging device according to claim 1, characterized in that: It also includes a material cleaning module, which includes a waste box. When the control unit determines that the posture of the chip capacitor when being sucked is unqualified based on the picture taken by the second camera, the driving module drives the material picking module to move above the material cleaning module, and the suction nozzle detaches the chip capacitor.

3. A chip capacitor plate swinging device according to claim 2, characterized in that: The cleaning module also includes a first magnet, a second magnet, a sensor and a base. The first magnet is installed on the waste box, the first magnet is connected to the second magnet, the second magnet is installed on the base, and the sensor is fixed on the base to sense whether the waste box exists.

4. The chip capacitor plate swinging device according to claim 1, characterized in that: The material picking module also includes a screw rod, which is connected to the first camera and the suction nozzle and is used to control the vertical movement of the first camera and the suction nozzle.

5. The chip capacitor plate swinging device according to claim 1, characterized in that: The wobble plate module also includes a workbench and a collection box carrier, wherein the collection box carrier is fixed on the workbench and is located above the cam; at least one collection box station is provided on the collection box carrier, and the collection station can be used to place the collection box.

6. The chip capacitor plate swinging device according to claim 5, characterized in that: The clamping device includes a base and a clamping portion that are interconnected, the base is located below the collection box carrier, the cam follower is located on the base, and the clamping portion is located above the collection box. When the clamping device clamps the collection box, the clamping portion is pressed against the edge of the collection box.

7. The chip capacitor plate swinging device according to claim 6, characterized in that: The clamping portion is provided with a right-angled notch facing the collection box. When the clamping claw device clamps the collection box, the clamping portion is pressed against two adjacent sides of the collection box.

8. The chip capacitor plate swinging device according to claim 5, characterized in that: There are several clamping devices, which are arranged around the outer side of the cam. The swing plate module also includes a moving track and a reset spring. Each clamping device is installed on the moving track. The two ends of the reset spring are respectively connected to the collection box carrier and the clamping device. When the cam rotates, the clamping device can move along the moving track to approach or move away from the cam, and the clamping device clamps or releases the collection box.

9. The chip capacitor plate swinging device according to claim 5, characterized in that: The swing plate module also includes an air circuit component. An air circuit is provided in the collection box carrier. An air hole is provided on the surface of the collection box station. The air circuit component is connected to the air circuit and the air hole.

10. The chip capacitor plate swinging device according to claim 9, characterized in that: The wobble plate module further comprises an elastic membrane assembly, and the elastic membrane assembly is detachably connected to the collection box carrier or the workbench.

11. The chip capacitor plate swinging device according to claim 10, characterized in that: The elastic membrane assembly comprises a blue membrane and a fixture, wherein the blue membrane is attached to the surface of the fixture, an air path is arranged in the fixture, the air path assembly is connected with the air path, and air holes are arranged on the surface of the fixture, and the air holes are connected with the air path.

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