Heating disc angle adjusting device and method and semiconductor device processing equipment

Abstract

The invention provides a heating disc angle adjusting device and method and semiconductor device processing equipment. The heating disc angle adjusting device comprises a supporting seat which is fixedly connected with a machine table of semiconductor device processing equipment, and the upper surface of the supporting seat is provided with a plurality of first limiting structures which are distributed in the circumferential direction; the upper end of the ball seat is connected with the heating plate body, and a plurality of second limiting structures distributed in the circumferential direction are arranged on the lower surface of the ball seat and used for being matched with the first limiting structures so as to adjust and lock the circumferential deflection angle of the heating plate body. The circumferential angle adjusting device is used for realizing circumferential angle adjustment without installing a heating disc rotating mechanism, so that the limitations of sealing, transmission and maintenance are reduced, and the cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a heating plate angle adjustment device, a heating plate angle adjustment method, and a semiconductor device processing equipment. Background Art

[0002] In thin film deposition equipment, the heating and positioning of the wafer are very critical process links. In a multi-layer thin film structure, the pattern of each layer needs to be accurately aligned with the layer below. The accuracy of wafer positioning directly affects the alignment accuracy between different layers, which is crucial for the manufacture of complex integrated circuits. In addition, the film deposition at the edge of the wafer is usually different from that in the center area. Accurate positioning helps control this edge effect and ensure the deposition quality of the entire wafer.

[0003] In the prior art, the design of the heating plate is mainly divided into fixed type and rotating type. The fixed heating plate only has the functions of horizontal and centering adjustment, while the rotating heating plate can be adjusted in angle. However, the rotating heating plate has certain limitations in terms of sealing, transmission and maintenance, resulting in higher cost of use.

[0004] In order to overcome the above-mentioned defects of the prior art, the art urgently needs a heating plate angle adjustment technology, which can realize circumferential angle adjustment without installing a heating plate rotating mechanism, thereby reducing the limitations in sealing, transmission and maintenance and effectively reducing costs. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heating plate angle adjustment device, a heating plate angle adjustment device method, and a semiconductor device processing equipment, which are used to eliminate the need to install a heating plate rotating mechanism and realize circumferential angle adjustment, thereby reducing the limitations in sealing, transmission and maintenance, and effectively reducing costs.

[0007] Specifically, the heating plate angle adjustment device provided according to the first aspect of the present invention includes: a support seat, fixedly connected to the machine table of the semiconductor device processing equipment, and a plurality of first limiting structures distributed along the circumferential direction are provided on its upper surface; and a ball seat, the upper end of which is connected to the heating plate body, and a plurality of second limiting structures distributed along the circumferential direction are provided on its lower surface, which are used to cooperate with the plurality of first limiting structures to adjust and lock the circumferential deflection angle of the heating plate body.

[0008] Furthermore, in some embodiments of the present invention, the first limiting structure is configured as a longitudinal recessed structure or a raised structure, and the second limiting structure is correspondingly configured as a longitudinal raised structure or a recessed structure, wherein the ball seat is lifted to adjust the circumferential deflection angle of the heating plate body, and dropped to lock the circumferential deflection angle of the heating plate body.

[0009] Furthermore, in some embodiments of the present invention, the multiple first limiting structures include multiple grooves distributed along the circumference of the support seat, and the multiple second limiting structures include multiple tooth-like protrusions distributed along the circumference of the ball seat, wherein the number of the grooves is 360 and surrounds the support seat, and every two adjacent grooves form a central angle of 1° on the circumference of the circle where they are located, and the multiple tooth-like protrusions are divided into three sections, each section includes 30 tooth-like protrusions, and every two adjacent tooth-like protrusions form a central angle of 1° on the circumference where they are located.

[0010] Furthermore, in some embodiments of the present invention, the heating plate angle adjustment device also includes: a water cooling block, whose upper end is connected to the heating plate body, and whose lower surface is a raised spherical surface, wherein the spherical surface is movably connected to the upper end of the ball seat to adjust the axial inclination angle of the heating plate body.

[0011] Furthermore, in some embodiments of the present invention, the heating plate angle adjustment device also includes: a plurality of top screw assemblies, each including a connecting seat, a nut and a first top screw, wherein the connecting seats of the plurality of top screw assemblies are circumferentially installed at a plurality of positions of the ball seat, and corresponding nuts are provided thereon, and the first top screws of each of the top screw assemblies abut against the side of the water cooling block via the corresponding nut, so as to adjust the axial inclination angle of the heating plate body by laterally pushing the water cooling block.

[0012] Furthermore, in some embodiments of the present invention, a first threaded hole is provided at the position where the side of the water cooling block contacts the first top screw, and the first top screw is screwed into the first threaded hole to pull closer and raise the corresponding position of the water cooling block, or is screwed out of the first threaded hole to push away and lower the corresponding position of the water cooling block.

[0013] Furthermore, in some embodiments of the present invention, a first locking structure corresponding to a plurality of positions is provided on the support seat and the ball seat, which is used to lock the support seat and the ball seat after the circumferential deflection angle of the heating plate body is adjusted, and / or a second locking structure corresponding to a plurality of positions is provided on the ball seat and the water cooling block, which is used to lock the ball seat and the water cooling block after the axial inclination angle of the heating plate body is adjusted.

[0014] Furthermore, in some embodiments of the present invention, the heating plate angle adjustment device further comprises: a plurality of second top screws, distributed in multiple directions on the side of the support seat, for driving the heating plate body to perform radial centering adjustment via the support seat.

[0015] In addition, the processing equipment of the semiconductor device provided according to the second aspect of the present invention includes: a process chamber, in which a heating disk is configured; and a heating disk angle adjustment device as described in any one of the first aspect of the present invention, at least for adjusting and locking the circumferential deflection angle of the heating disk body.

[0016] In addition, the method for adjusting the angle of the heating disk provided in accordance with the third aspect of the present invention comprises the following steps: adjusting the axial inclination angle of the heating disk via the spherical surface raised on the lower surface of the water-cooling block of the heating disk angle adjustment device, wherein the upper end of the water-cooling block is fixedly connected to the heating disk, and the spherical surface at its lower end is movably connected to the upper end of the ball seat of the heating disk angle adjustment device; adjusting and locking the circumferential deflection angle of the heating disk via a plurality of second limiting structures distributed circumferentially along the lower surface of the ball seat in cooperation with a plurality of first limiting structures distributed circumferentially along the upper surface of the support seat therebelow, wherein the support seat is fixedly connected to the machine table of the semiconductor device processing equipment; and driving the heating disk to perform radial centering adjustment via a plurality of second top screws distributed in multiple directions on the side surface of the support seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 Semiconductor processing equipment provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of a heating plate angle adjustment device provided according to some embodiments of the present invention is shown.

[0020] Figure 3A schematic structural diagram of a support base provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A schematic structural diagram of a ball seat provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic structural diagram of a water cooling block provided according to some embodiments of the present invention is shown.

[0023] Figure 6 A schematic structural diagram of a jackscrew device provided according to some embodiments of the present invention is shown.

[0024] Figure 7A to Figure 7B A schematic diagram of a locking structure provided according to some embodiments of the present invention is shown.

[0025] Figure 8 A schematic flow chart of a method for adjusting the angle of a heating plate provided according to some embodiments of the present invention is shown.

[0026] Fig. 9 A schematic diagram of installing a support ring and a wafer according to some embodiments of the present invention is shown.

[0027] Reference numerals:

[0028] 10 Wafer

[0029] 101 Positioning slot

[0030] 20 Support ring

[0031] 30 Heating plate body

[0032] 40 Water cooling block

[0033] 401 First threaded hole

[0034] 50 Jackscrew Assembly

[0035] 501 Connector

[0036] 502 Nut

[0037] 503 First Top Thread

[0038] 60 Tee

[0039] 601 Second limit structure

[0040] 70 Support seat

[0041] 701 First limit structure

[0042] 702 Second top thread

[0043] 801 First locking structure

[0044] 802 Second locking structure DETAILED DESCRIPTION

[0045] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0048] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0049] In the prior art, the design of the heating plate is mainly divided into fixed type and rotating type. The fixed heating plate only has the functions of horizontal and centering adjustment, while the rotating heating plate can be adjusted in angle. However, the rotating heating plate has certain limitations in terms of sealing, transmission and maintenance, resulting in higher cost of use.

[0050] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heating plate angle adjustment device, a heating plate angle adjustment device method, and a semiconductor device processing equipment, which are used to eliminate the need to install a heating plate rotating mechanism and realize circumferential angle adjustment, thereby reducing the limitations in sealing, transmission and maintenance, and effectively reducing costs.

[0051] In some non-limiting embodiments, the heating plate angle adjustment device provided in the first aspect of the present invention can be configured in the semiconductor device processing equipment provided in the second aspect of the present invention. The heating plate angle adjustment method provided in the third aspect of the present invention can be implemented based on the heating plate angle adjustment device provided in the first aspect of the present invention.

[0052] Please refer to Figure 1 , Figure 1 Semiconductor processing equipment provided according to some embodiments of the present invention is shown.

[0053] like Figure 1 As shown, the processing equipment of the semiconductor device includes a process chamber and a heating plate angle adjustment device. The process chamber is provided with a heating plate. The heating plate angle adjustment device can at least be used to adjust and lock the circumferential deflection angle of the heating plate body 30.

[0054] Please refer to Figure 2 , Figure 2 A schematic structural diagram of a heating plate angle adjustment device provided according to some embodiments of the present invention is shown.

[0055] like Figure 2 As shown, the heating plate angle adjustment device includes a support seat 70, a ball seat 60, a water-cooling block 40 and a plurality of top screw assemblies 50. Here, the support seat 70 is fixedly connected to the slider of the machine table of the semiconductor device processing equipment, and rises and falls with the slider. The upper end of the ball seat 60 can be connected to the heating plate body 30 via the water-cooling block 40. The lower surface of the water-cooling block 40 is a raised spherical surface, and the spherical surface is movably connected to the upper end of the ball seat 60 to adjust the axial tilt angle of the heating plate body 30. The plurality of top screw assemblies 50 adjust the axial tilt angle of the heating plate body 30 by pushing the water-cooling block 40 laterally.

[0056] Please refer to Figure 3 to Figure 6 , Figure 3 A schematic structural diagram of a support base provided according to some embodiments of the present invention is shown. Figure 4 A schematic structural diagram of a ball seat provided according to some embodiments of the present invention is shown. Figure 5 A schematic structural diagram of a water cooling block provided according to some embodiments of the present invention is shown. Figure 6 A schematic structural diagram of a jackscrew device provided according to some embodiments of the present invention is shown.

[0057] like Figure 3 As shown, the support base 70 is fixedly connected to a machine table of a semiconductor device processing equipment, and a plurality of first limiting structures 701 distributed along the circumferential direction are provided on the upper surface of the support base 70.

[0058] Further, the first limiting structure 701 is configured as a radially extending concave structure or convex structure, and the second limiting structure 601 is correspondingly configured as a radially extending convex structure or concave structure. Here, the ball seat 60 is lifted to adjust the circumferential deflection angle of the heating plate body 30, and dropped to lock the circumferential deflection angle of the heating plate body 30.

[0059] Further, the plurality of first limiting structures 701 may include a plurality of grooves distributed along the circumference of the support seat 70 , and the plurality of second limiting structures 601 may include a plurality of tooth-shaped protrusions distributed along the circumference of the ball seat 60 .

[0060] In some embodiments, the number of grooves may be 360 ​​and surround the support seat 70, and each adjacent two grooves form a central angle of 1° on the circumference thereof. The plurality of tooth-like protrusions may be divided into three sections, each section including 30 tooth-like protrusions, and each adjacent two tooth-like protrusions form a central angle of 1° on the circumference thereof.

[0061] like Figure 4 As shown, in some embodiments, the upper end of the ball seat 60 can be directly connected to the heating plate body 30, and its lower surface is provided with a plurality of second limiting structures 601 distributed along the circumference, which are used to cooperate with the plurality of first limiting structures 701 to adjust and lock the circumferential deflection angle of the heating plate body 30.

[0062] like Figure 5-6 As shown, in some embodiments, the upper end of the water cooling block 40 is connected to the heating plate body 30, and its lower surface is a convex spherical surface. The spherical surface is movably connected to the upper end of the ball seat 60, and the water cooling block 40 can rotate at various angles on the ball seat 60 to adjust the axial tilt angle of the heating plate body 30.

[0063] The multiple top screw assemblies 50 respectively include a connecting seat 501, a nut 502 and a first top screw 503, wherein the connecting seat 501 of the multiple top screw assemblies 50 is circumferentially installed at multiple positions of the ball seat 60, and a corresponding nut 502 is provided thereon, and the first top screw 503 of each top screw assembly 50 respectively abuts against the side of the water cooling block 40 via the corresponding nut 502, so as to adjust the axial inclination angle of the heating plate body 30 by laterally pushing the water cooling block 40.

[0064] Furthermore, the side of the water-cooling block 40 is provided with a first threaded hole 401 (for example, three evenly distributed) at a position where the first top screw 503 contacts the side of the water-cooling block 40. The first top screw 503 is screwed into the first threaded hole 401 to pull the corresponding position of the water-cooling block 40 closer and raise it, or is screwed out of the first threaded hole 401 to push the corresponding position of the water-cooling block 40 farther and lower it.

[0065] Please refer to Figure 7A to Figure 7B , Figure 7A to Figure 7B A schematic diagram of a locking structure provided according to some embodiments of the present invention is shown.

[0066] like Figure 7A to Figure 7B As shown, the support seat 70 and the ball seat 60 are also provided with a first locking structure 801 corresponding to multiple positions (for example: threaded holes with bolts, and / or through holes with bolts and nuts 502, etc.), which are used to lock the support seat 70 and the ball seat 60 after the circumferential deflection angle of the heating plate body 30 is adjusted.

[0067] In some embodiments, the ball seat 60 and the water cooling block are further provided with a plurality of corresponding second locking structures 802 for locking the ball seat 60 and the water cooling block 40 after the axial tilt angle of the heating plate body 30 is adjusted.

[0068] In some embodiments, the heating plate angle adjustment device further includes a plurality of second top screws 702 distributed in multiple directions on the side of the support seat 70, and used to drive the heating plate body 30 to perform radial centering adjustment via the support seat 70, thereby driving the heating plate thereon to be centered.

[0069] Here, in the absence of a locking structure, multiple bolts directly bear the gravity of the heating plate. After the equipment has been running for a long time, a slight looseness between the threads will directly affect the gap of the heating plate. Therefore, the locking structure can prevent the heating plate gap problem caused by loose threads, thereby effectively improving the process quality of the film.

[0070] The following will describe the working principles of the heating disk angle adjustment device and the semiconductor device processing equipment in combination with some embodiments of the heating disk angle adjustment method. Those skilled in the art will understand that these embodiments of the heating disk angle adjustment method are only some non-restrictive implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the heating disk angle adjustment device. Similarly, the heating disk angle adjustment device is also only some non-restrictive implementation methods provided by the present invention, and does not constitute a limitation on the execution subject or execution order of each step in these heating disk angle adjustment methods.

[0071] Please refer to Figure 8 , Figure 8 A schematic flow chart of a method for adjusting the angle of a heating plate provided according to some embodiments of the present invention is shown.

[0072] like Figure 8 As shown, the heating plate angle adjustment device can first adjust the axial tilt angle of the heating plate via the convex spherical surface on the lower surface of the water cooling block 40 of the heating plate angle adjustment device. Here, the upper end of the water cooling block 40 is fixedly connected to the heating plate, and the spherical surface at the lower end thereof is movably connected to the upper end of the ball seat 60 of the heating plate angle adjustment device.

[0073] Afterwards, the circumferential deflection angle of the heating plate is adjusted and locked by using a plurality of second limiting structures 601 distributed circumferentially arranged on the lower surface of the ball seat 60 in cooperation with a plurality of first limiting structures 701 distributed circumferentially arranged on the upper surface of the support seat 70 therebelow, wherein the support seat 70 is fixedly connected to the machine table of the semiconductor device processing equipment.

[0074] Finally, the heating plate is driven to be radially centered via a plurality of second top screws 702 distributed in multiple directions on the side surface of the support base 70 .

[0075] Furthermore, after the heating disk is radially centered, the heating disk angle adjustment device also needs to calibrate the spacing of the heating disk.

[0076] Specifically, the heating plate angle adjustment device cooperates with the automatic gapping system (AGS) to calibrate the spacing of the heating plate. Specifically, the AGS is placed on the support ring, the device is evacuated to a vacuum state, and the heating plate is moved upward until the computer displays the spacing distances of three places, and the first top screws 503 evenly distributed at the three places are adjusted to make the displayed spacing distances of the three places consistent, thereby completing the spacing calibration of the heating plate.

[0077] In addition, please continue to refer to Figure 1 and Fig. 9 , Fig. 9 A schematic diagram of installing a support ring and a wafer according to some embodiments of the present invention is shown.

[0078] like Figure 1 and Fig. 9 As shown, the adjustment device for the angle of the heating plate can also be provided with a support ring 20. The support ring 20 is fixed on the heating plate. In the process of depositing a thin film on the back of the wafer 10, a positioning groove 101 (usually V-shaped) is provided directly below the wafer 10 for positioning or marking. In order to prevent the deposition gas from entering the front area of ​​the wafer 10 through the small groove, resulting in the growth of a film on the front of the wafer 10, a convex surface is usually designed to block the position of the corresponding groove of the support ring 20 of the wafer 10. However, due to the complex installation structure of the support ring 20 of the wafer 10, the heating plate and the water-cooling block 40, in order to ensure that the groove of the wafer 10 coincides with the convex surface of the support ring 20, the processing accuracy of the device is extremely high, the installation difficulty is extremely great, and it is easy to cause the unqualified rate of the heating plate to increase.

[0079] Therefore, the device can also adjust the angle of the heating plate by meshing the small teeth, thereby adjusting the angle of the support ring through the heating plate, so as to achieve the purpose of shielding and adjusting the V-shaped groove of the wafer after the device is installed.

[0080] In summary, the heating plate angle adjustment device, method, and semiconductor device processing equipment provided by the present invention can be used to avoid the installation of a heating plate rotating mechanism, and can achieve circumferential angle adjustment, thereby reducing limitations in sealing, transmission and maintenance, and effectively reducing costs.

[0081] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0082] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating plate angle adjustment device, characterized in that: include: A support base, fixedly connected to a machine table of a semiconductor device processing equipment, and having a plurality of first limiting structures distributed along the circumferential direction on its upper surface; as well as The upper end of the ball seat is connected to the heating plate body, and the lower surface of the ball seat is provided with a plurality of second limiting structures distributed along the circumference, which are used to cooperate with the plurality of first limiting structures to adjust and lock the circumferential deflection angle of the heating plate body.

2. The heating plate angle adjustment device according to claim 1, characterized in that: The first limiting structure is configured as a longitudinal recessed structure or a convex structure, and the second limiting structure is correspondingly configured as a longitudinal convex structure or a recessed structure, wherein: The ball seat is lifted to adjust the circumferential deflection angle of the heating plate body, and dropped to lock the circumferential deflection angle of the heating plate body.

3. The heating plate angle adjustment device according to claim 2, characterized in that: The plurality of first limiting structures include a plurality of grooves distributed along the circumference of the support seat, and the plurality of second limiting structures include a plurality of tooth-shaped protrusions distributed along the circumference of the ball seat, wherein: The number of the grooves is 360 and they surround the support seat, and each two adjacent grooves form a central angle of 1° on the circumference of the circle where they are located. The plurality of tooth-like protrusions are divided into three sections, wherein each section includes 30 tooth-like protrusions, and every two adjacent tooth-like protrusions form a central angle of 1° on the circumference of the circle where they are located.

4. The heating plate angle adjustment device according to claim 1, characterized in that: Also includes: The water cooling block has an upper end connected to the heating plate body and a lower surface which is a convex spherical surface, wherein the spherical surface is movably connected to the upper end of the ball seat to adjust the axial tilt angle of the heating plate body.

5. The heating plate angle adjustment device according to claim 4, characterized in that: Also includes: Multiple top screw assemblies respectively include a connecting seat, a nut and a first top screw, wherein the connecting seats of the multiple top screw assemblies are circumferentially installed at multiple positions of the ball seat and are provided with corresponding nuts, and the first top screws of each of the top screw assemblies abut the side of the water-cooling block via the corresponding nut to adjust the axial inclination angle of the heating plate body by laterally pushing the water-cooling block.

6. The heating plate angle adjustment device according to claim 5, characterized in that: A first threaded hole is provided at the position where the side of the water-cooling block contacts the first top screw. The first top screw is screwed into the first threaded hole to pull closer and raise the corresponding position of the water-cooling block, or is screwed out of the first threaded hole to push away and lower the corresponding position of the water-cooling block.

7. The heating plate angle adjustment device according to claim 4, characterized in that: The support seat and the ball seat are also provided with a plurality of first locking structures corresponding to positions, which are used to lock the support seat and the ball seat after the circumferential deflection angle of the heating plate body is adjusted, and / or The ball seat and the water cooling block are also provided with a plurality of second locking structures corresponding to positions, which are used to lock the ball seat and the water cooling block after the axial tilt angle of the heating plate body is adjusted.

8. The heating plate angle adjustment device according to claim 1, characterized in that: Also includes: A plurality of second top screws are distributed in a plurality of directions on the side surface of the support base, and are used to drive the heating plate body to perform radial centering adjustment via the support base.

9. A semiconductor device processing equipment, characterized in that: include: a process chamber in which a heating plate is disposed; as well as The heating plate angle adjustment device according to any one of claims 1 to 8 is at least used to adjust and lock the circumferential deflection angle of the heating plate body.

10. A method for adjusting the angle of a heating plate, characterized in that: The following steps are involved: The axial tilt angle of the heating plate is adjusted via the convex spherical surface on the lower surface of the water-cooling block of the heating plate angle adjustment device, wherein the upper end of the water-cooling block is fixedly connected to the heating plate, and the spherical surface at the lower end thereof is movably connected to the upper end of the ball seat of the heating plate angle adjustment device; The circumferential deflection angle of the heating plate is adjusted and locked by using a plurality of second limiting structures distributed along the circumferential direction provided on the lower surface of the ball seat in cooperation with a plurality of first limiting structures distributed along the circumferential direction provided on the upper surface of the support seat thereunder, wherein the support seat is fixedly connected to a machine table of a semiconductor device processing equipment; and The heating plate is driven to be radially centered via a plurality of second top screws distributed in a plurality of directions on the side surface of the support seat.

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