Infrared thermal wave detection equipment

Abstract

The invention relates to the technical field of PCB (Printed Circuit Board) infrared thermal wave detection, in particular to infrared thermal wave detection equipment, which comprises a rack, a PCB width adjusting, transporting and clamping device is arranged on the upper layer in the rack, and the PCB width adjusting, transporting and clamping device is used for width adjusting, transporting and clamping of a PCB; a marble base is placed at the bottom end of the interior of the rack, a laser heating device is fixed to the surface of the marble base, and an infrared camera device is installed on the surface of the laser heating device. The automation degree of the PCB during infrared thermal wave detection is improved, manual auxiliary operation is not needed in the detection process, the labor intensity during PCB detection is reduced, and the working efficiency in the detection process is improved; and the whole gluing process is automatically completed by a machine, and manual operation does not exist in the process, so that the position is relatively accurate during detection, the phenomena of wrong detection and missing detection are avoided, and the yield during PCB production is increased.

Description

Technical Field

[0001] The invention relates to the technical field of PCB infrared heat wave detection, in particular to infrared heat wave detection equipment. Background Art

[0002] PCB, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. PCB needs to be subjected to infrared thermal wave nondestructive testing during production. The working principle of infrared thermal wave nondestructive testing is to heat the surface of the object being tested. Since the thermal resistance of the defect is different from that of other parts, the defect will produce temperature changes different from those of normal parts. At this time, the surface of the object being tested is observed by an infrared thermal imager to obtain the defect information of the object being tested.

[0003] However, existing PCBs require manual operation during infrared thermal wave detection, and the degree of automation in the detection process is low, which increases the labor intensity during PCB detection and reduces the work efficiency during the detection process; and because the entire infrared thermal wave detection process requires manual assistance, the position is not accurate enough and is prone to errors and omissions, thereby reducing the yield rate during PCB production. Summary of the invention

[0004] The purpose of the present invention is to provide an infrared thermal wave detection equipment to solve the problems raised in the above background technology that the existing PCB has a low degree of automation, low work efficiency, easy to have errors and omissions, and low yield rate during infrared thermal wave detection.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an infrared heat wave detection equipment, comprising a frame, wherein a PCB width adjustment, transportation and clamping device is installed on the upper layer inside the frame, and the PCB width adjustment, transportation and clamping device is used for width adjustment, transportation and clamping of the PCB; a marble base is placed at the bottom end inside the frame, and a laser heating device is fixed on the surface of the marble base, and the laser heating device is used for laser heating of the PCB; an infrared camera device is installed on the surface of the laser heating device, and the infrared camera device is used to perform detection on the surface of the PCB after laser heating.

[0006] Preferably, the PCB width-adjusting transport and clamping device comprises a carrier, a width-adjusting motion module, a movable side transport mechanism, a fixed side transport mechanism, an X-axis cylinder blocking mechanism and a Y-axis cylinder clamping mechanism. The carrier is provided with two groups, and the two groups of carriers are installed side by side inside the frame, and a width-adjusting motion module is installed between adjacent carriers.

[0007] Preferably, a movable side transport mechanism is fixed to the sliding end of the width-adjusting motion module, a barcode scanner is fixed to the surface of the width-adjusting motion module through a bracket, a fixed side transport mechanism is fixed to the surface of the carrier on one side of the movable side transport mechanism, and the fixed side transport mechanism cooperates with the movable side transport mechanism to transport the PCB.

[0008] Preferably, the surfaces of the movable side transport mechanism and the fixed side transport mechanism are both installed with an X-direction cylinder blocking mechanism, which is used for blocking the PCB in the X direction; the bottom of the movable side transport mechanism is installed with a Y-direction cylinder clamping mechanism, which is used for clamping the PCB.

[0009] Preferably, both left and right sides of the frame are provided with material openings, which are convenient for loading and unloading the PCB to be processed; a touch screen for loading and unloading protection is provided inside the frame and on one side of the material opening, and the touch screen is fixedly connected to the left and right sides of the carrier.

[0010] Preferably, a safety light curtain is also provided inside the frame, and the safety light curtain is installed on the surface of the carrier through a support plate, and the safety light curtain is used for controlling the entire equipment.

[0011] Preferably, the laser heating device comprises a Y-axis lead screw module, an X-axis linear module, a mounting frame and a laser heater, and the Y-axis lead screw module is fixedly connected to the surface of the marble base.

[0012] Preferably, an X-axis linear module is installed on the sliding end of the Y-axis lead screw module, and a mounting frame is installed on the sliding seat of the X-axis linear module.

[0013] Preferably, a laser heater is fixed on the surface of the mounting frame, and the laser heater is used for laser heating of the PCB.

[0014] Preferably, the infrared camera device includes an infrared thermal imaging camera and a visual positioning camera, and the infrared thermal imaging camera and the visual positioning camera are both fixedly connected to the surface of the mounting frame. The infrared thermal imaging camera is used for infrared thermal imaging observation of the PCB surface, and the visual positioning camera is used for visual detection of PCB defects.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the infrared heat wave detection equipment is set; the present invention sets a PCB width adjustment transport clamping device, a laser heating device and an infrared camera device, and feeds the PCB to be detected from the material port on the left side of the frame. The fed PCB will move under the transportation of the movable side transport mechanism and the fixed side transport mechanism, and will be blocked by the X-axis cylinder blocking mechanism when moving. At this time, the PCB to be detected is fixed by the Y-axis cylinder clamping mechanism, and then the PCB to be detected is laser heated by the laser heating device. After heating, the infrared thermal imaging camera in the infrared camera device is used to observe the PCB surface by infrared thermal imaging, and the visual positioning camera is used to visually detect whether there are defects in the PCB; the present invention improves the automation degree of PCB during infrared heat wave detection, does not require manual auxiliary operation during the detection process, reduces the labor intensity during PCB detection, and improves the work efficiency during the detection process; and because the entire gluing process is automatically completed by the machine, there is no manual operation in the middle, so the position is more accurate during detection, and the phenomenon of missed detection will not occur, thereby increasing the yield rate during PCB production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional appearance structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional internal structure of the present invention; Figure 3 It is a schematic diagram of the partial explosion structure of the present invention; Figure 4 It is a schematic diagram of the exploded structure of the PCB width adjustment transportation clamping device of the present invention; Figure 5 It is a partial structural schematic diagram of the PCB width adjustment transportation clamping device of the present invention; Figure 6 It is a schematic structural diagram of the laser heating device of the present invention; Figure 7 It is a schematic diagram of the structure of the infrared camera device of the present invention.

[0017] In the figure: 1. Rack; 11. Material inlet; 12. Safety light curtain; 13. Touch screen; 2. PCB width adjustment transport clamping device; 21. Carrier; 22. Width adjustment motion module; 221. Barcode scanner; 23. Movable side transport mechanism; 24. Fixed side transport mechanism; 25. X-axis cylinder blocking mechanism; 26. Y-axis cylinder clamping mechanism; 3. Marble base; 4. Laser heating device; 41. Y-axis lead screw module; 42. X-axis linear module; 43. Mounting bracket; 44. Laser heater; 5. Infrared camera device; 51. Infrared thermal imaging camera; 52. Visual positioning camera. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] The structure of an infrared thermal wave detection device provided by the present invention is as follows Figure 1 as well as Figure 2 As shown, it includes a frame 1, and a PCB width adjustment, transportation and clamping device 2 is installed on the upper layer inside the frame 1. The PCB width adjustment, transportation and clamping device 2 is used for width adjustment, transportation and clamping of the PCB. Material openings 11 are opened on the left and right sides of the frame 1, and the material openings 11 are convenient for the feeding and unloading of the PCB to be processed; a touch screen 13 for feeding and unloading protection is arranged inside the frame 1 and on one side of the material opening 11, and the touch screen 13 is fixedly connected to the left and right sides of the carrier 21. A safety light curtain 12 is also arranged inside the frame 1, and the safety light curtain 12 is installed on the surface of the carrier 21 through a support plate. The safety light curtain 12 is used for controlling the entire equipment.

[0020] During implementation, the PCB to be inspected is fed in from the material port 11 on the left side of the rack 1 , and after being fed in, it is protected by the safety light curtain 12 , and the fed in PCB will enter the PCB width-adjusting transport clamping device 2 .

[0021] Furthermore, if Figure 4 as well as Figure 5As shown, the PCB width adjustment transport clamping device 2 includes a carrier 21, a width adjustment motion module 22, a movable side transport mechanism 23, a fixed side transport mechanism 24, an X-axis cylinder blocking mechanism 25, and a Y-axis cylinder clamping mechanism 26. The carrier 21 is provided with two groups, and the two groups of carriers 21 are installed side by side inside the frame 1, and the width adjustment motion module 22 is installed between adjacent carriers 21. The sliding end of the width adjustment motion module 22 is fixed with the movable side transport mechanism 23, and the surface of the width adjustment motion module 22 is fixed with a scanner 221 through a bracket. A fixed side transport mechanism 24 is fixed to the surface of the carrier 21 on one side of the movable side transport mechanism 23, and the fixed side transport mechanism 24 cooperates with the movable side transport mechanism 23 to transport the PCB. An X-direction cylinder blocking mechanism 25 is installed on the surface of the movable side transport mechanism 23 and the fixed side transport mechanism 24, and the X-direction cylinder blocking mechanism 25 is used to block the PCB in the X direction; a Y-direction cylinder clamping mechanism 26 is installed at the bottom of the movable side transport mechanism 23, and the Y-direction cylinder clamping mechanism 26 is used to clamp the PCB.

[0022] During implementation, the spacing between the movable side transport mechanism 23 and the fixed side transport mechanism 24 is adjusted according to the width of the PCB to be inspected. When adjusting, the width-adjusting motion module 22 drives the movable side transport mechanism 23 to move closer to or away from the fixed side transport mechanism 24. After adjustment, both sides of the PCB to be inspected can be placed on the movable side transport mechanism 23 and the fixed side transport mechanism 24 for transportation.

[0023] Furthermore, if Figure 6 as well as Figure 7 As shown, a marble base 3 is placed at the bottom end of the frame 1, and a laser heating device 4 is fixed on the surface of the marble base 3. The laser heating device 4 is used for laser heating of the PCB. The laser heating device 4 includes a Y-axis lead screw module 41, an X-axis linear module 42, a mounting frame 43 and a laser heater 44. The Y-axis lead screw module 41 is fixedly connected to the surface of the marble base 3, the X-axis linear module 42 is mounted on the sliding end of the Y-axis lead screw module 41, and the mounting frame 43 is mounted on the sliding seat of the X-axis linear module 42. A laser heater 44 is fixed on the surface of the mounting frame 43, and the laser heater 44 is used for laser heating of the PCB.

[0024] During implementation, the Y-axis lead screw module 41 and the X-axis linear module 42 cooperate with each other to drive the laser heater 44 on the surface of the mounting frame 43 to move to the desired position, and then the laser heater 44 performs laser heating on the PCB.

[0025] Furthermore, if Figure 3 as well as Figure 7As shown, an infrared camera device 5 is installed on the surface of the laser heating device 4. The infrared camera device 5 is used to detect the surface of the PCB after laser heating. The infrared camera device 5 includes an infrared thermal imaging camera 51 and a visual positioning camera 52. The infrared thermal imaging camera 51 and the visual positioning camera 52 are both fixedly connected to the surface of the mounting frame 43. The infrared thermal imaging camera 51 is used for infrared thermal imaging observation of the PCB surface, and the visual positioning camera 52 is used for visual detection of PCB defects.

[0026] During implementation, the infrared thermal imaging camera 51 is used to observe the surface of the PCB by infrared thermal imaging, and the visual positioning camera 52 is used to visually detect whether there are defects on the PCB.

[0027] Working principle: When in use, first adjust the spacing between the movable side transport mechanism 23 and the fixed side transport mechanism 24 according to the width of the PCB to be tested. When adjusting, the width-adjusting motion module 22 drives the movable side transport mechanism 23 to move closer to or away from the fixed side transport mechanism 24. After adjustment, both sides of the PCB to be tested can be placed on the movable side transport mechanism 23 and the fixed side transport mechanism 24 for transportation.

[0028] After the adjustment is completed, the PCB to be tested is fed in from the material port 11 on the left side of the rack 1. After being fed in, it is protected by the safety light curtain 12. The fed PCB will move under the transportation of the movable side transport mechanism 23 and the fixed side transport mechanism 24. When it moves at the X-axis cylinder blocking mechanism 25, it will be blocked by its descending. At this time, the PCB to be tested will be fixed by the Y-axis cylinder clamping mechanism 26.

[0029] Subsequently, the PCB to be inspected is laser heated by the laser heating device 4. When the laser heating device 4 is implemented, the Y-axis lead screw module 41 and the X-axis linear module 42 cooperate with each other to drive the laser heater 44 on the surface of the mounting frame 43 to move to the desired position, and then the laser heater 44 laser heats the PCB.

[0030] After heating, infrared heat wave detection is performed through the infrared camera device 5. When the infrared camera device 5 is implemented, infrared thermal imaging observation of the PCB surface is performed through the infrared thermal imaging camera 51, and visual detection is performed through the visual positioning camera 52 to see if there are any defects in the PCB.

[0031] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An infrared heat wave detection device, comprising a frame (1), characterized in that: A PCB width adjustment, transport and clamping device (2) is installed on the upper layer inside the frame (1), and the PCB width adjustment, transport and clamping device (2) is used for width adjustment, transport and clamping of the PCB; a marble base (3) is placed at the bottom end inside the frame (1), and a laser heating device (4) is fixed on the surface of the marble base (3), and the laser heating device (4) is used for laser heating of the PCB; an infrared camera device (5) is installed on the surface of the laser heating device (4), and the infrared camera device (5) is used for detecting the surface of the PCB after laser heating.

2. The infrared thermal wave detection equipment according to claim 1, characterized in that: The PCB width-adjusting transport clamping device (2) comprises a carrier (21), a width-adjusting motion module (22), a movable side transport mechanism (23), a fixed side transport mechanism (24), an X-direction cylinder blocking mechanism (25), and a Y-direction cylinder clamping mechanism (26); the carrier (21) is provided in two groups, the two groups of carriers (21) are installed side by side inside the frame (1), and a width-adjusting motion module (22) is installed between adjacent carriers (21).

3. The infrared thermal wave detection equipment according to claim 2, characterized in that: A movable side transport mechanism (23) is fixed to the sliding end of the width-adjusting motion module (22); a barcode scanner (221) is fixed to the surface of the width-adjusting motion module (22) via a bracket; a fixed side transport mechanism (24) is fixed to the surface of the carrier (21) on one side of the movable side transport mechanism (23); and the fixed side transport mechanism (24) cooperates with the movable side transport mechanism (23) to transport the PCB.

4. The infrared thermal wave detection equipment according to claim 3, characterized in that: An X-direction cylinder blocking mechanism (25) is installed on the surface of the movable side transport mechanism (23) and the fixed side transport mechanism (24), and the X-direction cylinder blocking mechanism (25) is used for blocking the PCB in the X direction; and a Y-direction cylinder clamping mechanism (26) is installed on the bottom of the movable side transport mechanism (23), and the Y-direction cylinder clamping mechanism (26) is used for clamping the PCB.

5. The infrared thermal wave detection equipment according to claim 1, characterized in that: The left and right sides of the frame (1) are both provided with material openings (11), and the material openings (11) facilitate the feeding and unloading of PCBs to be processed; a touch screen (13) for feeding and unloading protection is provided inside the frame (1) and on one side of the material opening (11), and the touch screen (13) is fixedly connected to the left and right sides of the carrier (21).

6. The infrared thermal wave detection equipment according to claim 1, characterized in that: A safety light curtain (12) is also provided inside the frame (1), and the safety light curtain (12) is mounted on the surface of the carrier (21) via a support plate, and the safety light curtain (12) is used for controlling the entire equipment.

7. The infrared thermal wave detection equipment according to claim 1, characterized in that: The laser heating device (4) comprises a Y-axis lead screw module (41), an X-axis linear module (42), a mounting frame (43) and a laser heater (44); the Y-axis lead screw module (41) is fixedly connected to the surface of the marble base (3).

8. The infrared thermal wave detection equipment according to claim 7, characterized in that: An X-axis linear module (42) is mounted on the sliding end of the Y-axis lead screw module (41), and a mounting frame (43) is mounted on the sliding seat of the X-axis linear module (42).

9. The infrared thermal wave detection equipment according to claim 8, characterized in that: A laser heater (44) is fixed on the surface of the mounting frame (43), and the laser heater (44) is used for laser heating of the PCB.

10. The infrared thermal wave detection equipment according to claim 1, characterized in that: The infrared camera device (5) comprises an infrared thermal imaging camera (51) and a visual positioning camera (52), wherein the infrared thermal imaging camera (51) and the visual positioning camera (52) are both fixedly connected to the surface of the mounting frame (43), the infrared thermal imaging camera (51) is used for infrared thermal imaging observation of the PCB surface, and the visual positioning camera (52) is used for visual detection of PCB defects.

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