Wafer uniform glue developing machine with self-cleaning function
By adding a nozzle and a brush sweeper in the wafer uniform developer, and combining the drive mechanism to achieve automatic cleaning, the problem of incomplete cleaning of the inner wall of the protective cover in traditional equipment is solved, the cleaning and stability of the equipment is improved, and the crystal is ensured. High quality preparation of circles.
Patent Information
- Application Number
- CN202411566863.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-01-03
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional wafer uniforming developers lack a flushing mechanism when cleaning the inner wall of the protective cover, making it difficult to completely remove residues, affecting equipment performance and wafer quality.
A wafer uniform developer with self-cleaning function was designed. By adding a nozzle and a brush sweep rod, the inner wall of the protective cover is washed by using water flow, and the driving mechanism is combined to realize automatic transportation and switching of glue, developer and clean water. , ensure the automation and efficient cleaning of the entire process.
Effectively removes glue residues on the inner wall of the protective cover, improves the cleanliness and stability of the equipment, and ensures high-quality preparation of wafers.
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Figure CN119247708A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer processing equipment, and in particular to a wafer coating and developing machine with a self-cleaning function. Background Art
[0002] In the field of semiconductor manufacturing, wafer coating and developing machines are one of the key equipment in the photolithography process, and their performance is directly related to the accuracy and yield of the circuit pattern on the wafer. After completing the process steps of wafer coating and developing, traditional wafer coating and developing machines usually require manual or additional cleaning equipment to clean the operating space to ensure the stability of the equipment and the accuracy of subsequent processes. However, this cleaning method is not only time-consuming and labor-intensive, but may also lead to reduced equipment performance or wafer contamination due to incomplete cleaning.
[0003] A multi-station wafer coating and developing machine disclosed with announcement number CN221746436U is a multi-station wafer coating and developing machine. The patented multi-station wafer coating and developing machine is equipped with a filter plate, an adsorption plate and an ultraviolet disinfection lamp. Wastewater is discharged into a collecting chamber through a connecting port. It is first filtered through the filter plate, and then the filtered wastewater passes through an adsorption plate made of activated carbon to adsorb and purify the wastewater. Then the ultraviolet disinfection lamp emits ultraviolet rays to disinfect the wastewater. Finally, the control valve is opened to discharge the liquid through the drain port. The bottom of the collecting chamber is inclined to facilitate the rapid discharge of the internal liquid, thereby reducing the impact on the environment.
[0004] Although the design of the above-mentioned multi-station wafer coating and developing machine includes multiple functions and components, and realizes the coating, developing, cleaning, wastewater treatment and partial cleaning of wafers, there are still some shortcomings, especially in the cleaning of the inner wall of the protective cover. Although a scraper is provided to clean the glue adhered to the inner wall of the protective cover, there is a lack of a flushing mechanism. Although the scraper can scrape off most of the adhered matter, it is difficult to ensure that all residues are completely removed. The lack of a flushing mechanism means that the power of water flow or cleaning liquid cannot be used to further flush and clean the inner wall of the protective cover, which may leave cleaning dead corners or residues.
[0005] Therefore, it is necessary to invent a wafer coating and developing machine with a self-cleaning function to solve the above problems. Summary of the invention
[0006] The purpose of the present invention is to provide a wafer coating developer with a self-cleaning function to solve the problems in the above technology.
[0007] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer coating developer with a self-cleaning function, comprising an operating table and a liquid storage tank, a driving mechanism is arranged on the top of the operating table, the driving mechanism comprises a Y-axis linear module, an X-axis linear module, a No. 1 Z-axis linear module and a No. 2 Z-axis linear module, the Y-axis linear module is installed on one side of the top of the operating table, the surface of the Y-axis linear module is transmission-connected to a No. 1 slide, one end of the X-axis linear module is installed on the surface of the No. 1 slide, the surface of the X-axis linear module is transmission-connected to a No. 2 slide and a No. 3 slide in the same direction, the No. 1 Z-axis linear module is installed on the surface of the No. 2 slide, the No. 2 Z-axis linear module is installed on the surface of the No. 3 slide, the No. 1 Z-axis linear module surface The surface transmission is connected to the No. 4 slide, and a glue dripping box and a developer dripping box are installed on the surface of the No. 4 slide. The surface transmission of the No. 2 Z-axis linear module is connected to the No. 5 slide, and a clean water dripping box is installed on the surface of the No. 5 slide. A fixed conduit is installed at the bottom of the clean water dripping box, and the bottom end of the fixed conduit is rotatably connected to a movable conduit through a rotating joint. A No. 1 motor is installed on one side of the clean water dripping box, and the No. 1 motor is transmission-connected to the movable conduit through a driving assembly. A plurality of staggered nozzles and brush sweeping rods are installed at the bottom of the movable conduit, and an isolation sleeve is installed on the top of the operating table. The nozzle is arranged toward the inner wall of the isolation sleeve, and the brush sweeping rod matches the isolation sleeve, and bristles are installed on the side of the brush sweeping rod close to the inner wall of the isolation sleeve.
[0008] By setting a driving mechanism, it is possible to quickly and accurately switch between the glue solution dripping box, the developer solution dripping box and the clean water dripping box.
[0009] Preferably, a support leg is installed at one end of the X-axis linear module away from the Y-axis linear module, a slide rail is installed on the side of the top of the operating table away from the Y-axis linear module, and the bottom of the support leg is slidably connected to the slide rail.
[0010] The design of added support legs and slide rails improves the stability and mobility of the X-axis linear module in the Y-axis direction.
[0011] Preferably, the driving assembly consists of a belt and two pulleys, wherein one of the pulleys is mounted on the surface of the movable conduit, and the other pulley is mounted on one end of the output shaft of motor No. 1, and the belt is tensioned on the two pulleys.
[0012] The rotation control of the movable guide tube by the No. 1 motor is realized through a driving assembly consisting of a belt and a pulley.
[0013] Preferably, a three-jaw chuck is provided inside the isolation sleeve, a No. 2 motor is installed inside the operating table, and one end of the output shaft of the No. 2 motor passes through the operating table and is fixedly connected to the bottom of the three-jaw chuck.
[0014] The wafer is quickly positioned and clamped by a three-jaw chuck, and the three-jaw chuck is driven by motor No. 2 to rotate the wafer.
[0015] Preferably, a drain pipe is provided on the top of the operating table, one end of the drain pipe is connected to the inside of the isolation sleeve, and the other end of the drain pipe extends to the outside of the operating table.
[0016] The provision of the drain pipe can conveniently discharge the waste liquid inside the isolation sleeve, which helps to keep the equipment clean and sanitary.
[0017] Preferably, the liquid storage tank is sequentially provided with a glue storage chamber, a developer storage chamber and a clean water storage chamber, a No. 1 injection interface is installed on the surface of the glue dripping box, a No. 1 dripping tube is installed at the bottom of the glue dripping box, a No. 2 injection interface is installed on the surface of the developer dripping box, a No. 2 dripping tube is installed at the bottom of the developer dripping box, and a No. 3 injection interface is installed on the surface of the clean water dripping box.
[0018] Different storage chambers are set inside the liquid storage tank, which are used to store glue, developer and clean water respectively. This design makes the storage and management of various liquids more orderly and convenient.
[0019] Preferably, pump No. 1, pump No. 2 and pump No. 3 are installed on the top of the liquid storage tank in sequence, the input end of pump No. 1 is connected to the inside of the glue storage chamber through a pipeline, and the output end of pump No. 1 is connected to injection interface No. 1 through a pipeline.
[0020] Through the design of No. 1 pump, the automatic delivery of glue from the liquid storage tank to the dripping tank is realized.
[0021] Preferably, the input end of the No. 2 pump is connected to the inside of the developer storage chamber through a pipeline, and the output end of the No. 2 pump is connected to the No. 2 injection interface through a pipeline.
[0022] Through the design of the No. 2 pump, the developer is automatically transported from the storage tank to the developer dripping tank.
[0023] Preferably, the input end of the No. 3 pump is connected to the inside of the clean water storage chamber through a pipeline, and the output end of the No. 3 pump is connected to the No. 3 injection interface through a pipeline.
[0024] Through the design of the No. 3 pump, the automatic delivery of deionized water from the liquid storage tank to the clean water drip tank is realized.
[0025] Preferably, a No. 1 feed pipe port, a No. 2 feed pipe port and a No. 3 feed pipe port are installed on the top of the liquid storage tank in sequence, the No. 1 feed pipe port is connected to the inside of the glue storage chamber, the No. 2 feed pipe port is connected to the inside of the developer storage chamber, and the No. 3 feed pipe port is connected to the inside of the clean water storage chamber.
[0026] Different feeding pipe openings are arranged on the top of the liquid storage tank, which are used to add liquid to each storage cavity respectively.
[0027] In the above technical solution, the technical effects and advantages provided by the present invention are:
[0028] 1. The flushing function is realized by adding a nozzle, and the inner wall of the protective cover is flushed with the power of the water flow, which strengthens the cleaning function of the inner wall of the protective cover. With the bristles on the surface of the brush sweeping rod, the glue attached to the inner wall of the isolation sleeve can be effectively removed. The flushed glue can be taken away with the water flow to avoid leaving residues;
[0029] 2. By setting up a driving mechanism, it is possible to quickly and accurately switch between the glue drop box, the developer drop box and the clean water drop box, realizing the automation of the entire process of wafer from glue dropping, development to cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention when it is in a standby state;
[0031] Figure 2 This is a schematic diagram of the overall structure of the present invention when the glue solution is added dropwise;
[0032] Figure 3 It is a schematic diagram of the overall structure of the present invention when it is in a self-cleaning state;
[0033] Figure 4 This is a schematic diagram of the structure of the first Z-axis linear module of the present invention;
[0034] Figure 5 This is a schematic diagram of the structure of the second Z-axis linear module of the present invention;
[0035] Figure 6 It is a structural sectional view of the operating table of the present invention.
[0036] Description of reference numerals:
[0037] 1. Operation table; 2. Liquid storage tank; 3. Y-axis linear module; 4. X-axis linear module; 5. No. 1 Z-axis linear module; 6. No. 2 Z-axis linear module; 7. Glue dripping box; 8. Developer dripping box; 9. Clean water dripping box; 10. Rotary joint; 11. Movable guide tube; 12. No. 1 motor; 13. Drive assembly; 14. Nozzle; 15. Brush sweeping rod; 16. Isolation sleeve; 17. Brush; 18. Support legs; 19. Slide rails; 20. Three-jaw chuck; 21. Motor No. 2; 22. Drain pipe; 23. Injection interface No. 1; 24. Drip tube No. 1; 25. Injection interface No. 2; 26. Drip tube No. 2; 27. Injection interface No. 3; 28. Pump No. 1; 29. Pump No. 2; 30. Pump No. 3; 31. Feed pipe No. 1; 32. Feed pipe No. 2; 33. Feed pipe No. 3. DETAILED DESCRIPTION
[0038] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
[0039] The present invention provides Figure 1-6 A wafer coating developer with a self-cleaning function is shown, comprising an operating table 1 and a liquid storage tank 2. A driving mechanism is arranged on the top of the operating table 1, and the driving mechanism comprises a Y-axis linear module 3, an X-axis linear module 4, a No. 1 Z-axis linear module 5 and a No. 2 Z-axis linear module 6. The Y-axis linear module 3 is installed on one side of the top of the operating table 1. The surface of the Y-axis linear module 3 is connected to the No. 1 slide by transmission. One end of the X-axis linear module 4 is installed on the surface of the No. 1 slide. The surface of the X-axis linear module 4 is connected to the No. 2 slide and the No. 3 slide by transmission in the same direction. The No. 1 Z-axis linear module 5 is installed on the surface of the No. 2 slide. The No. 2 Z-axis linear module 6 is installed on the surface of the No. 3 slide. The surface of the No. 1 Z-axis linear module 5 is connected to the No. 4 slide by transmission. The surface of the No. 4 slide is installed There are a glue dripping box 7 and a developer dripping box 8, the surface of the No. 5 slide is connected to the No. 5 slide by transmission, and a clean water dripping box 9 is installed on the surface of the No. 5 slide. A fixed conduit is installed at the bottom of the clean water dripping box 9, and the bottom end of the fixed conduit is rotatably connected to a movable conduit 11 through a rotating joint 10. A No. 1 motor 12 is installed on one side of the clean water dripping box 9, and the No. 1 motor 12 is connected to the movable conduit 11 by transmission through a driving component 13. A plurality of staggered nozzles 14 and a brush sweeping rod 15 are installed at the bottom of the movable conduit 11, and an isolation sleeve 16 is installed on the top of the operating table 1, and the nozzle 14 is arranged toward the inner wall of the isolation sleeve 16, and the brush sweeping rod 15 matches the isolation sleeve 16, and a brush 17 is installed on the side of the brush sweeping rod 15 close to the inner wall of the isolation sleeve 16.
[0040] In one aspect of the present embodiment, a support leg 18 is installed at one end of the X-axis linear module 4 away from the Y-axis linear module 3, a slide rail 19 is installed on the top of the operating table 1 away from the Y-axis linear module 3, the bottom of the support leg 18 is slidably connected to the slide rail 19, the driving assembly 13 is composed of a belt and two pulleys, one of which is installed on the surface of the movable guide tube 11, and the other pulley is installed at one end of the output shaft of the first motor 12, the belt tensioning is set on the two pulleys, and a three-jaw chuck 20 is arranged inside the isolation sleeve 16. A No. 2 motor 21 is installed inside the operating table 1. One end of the output shaft of the No. 2 motor 21 passes through the operating table 1 and is fixedly connected to the bottom of the three-jaw chuck 20. A drain pipe 22 is arranged on the top of the operating table 1. One end of the drain pipe 22 is connected to the inside of the isolation sleeve 16, and the other end of the drain pipe 22 extends to the outside of the operating table 1. A glue storage chamber, a developer storage chamber and a clean water storage chamber are arranged in sequence inside the liquid storage tank 2. A No. 1 injection interface 23 is installed on the surface of the glue dripping box 7. A No. 1 dripping tube 24 is installed at the bottom of the glue dripping box 7. The developer dripping A No. 2 injection interface 25 is installed on the surface of the box 8, a No. 2 dripping tube 26 is installed at the bottom of the developer dripping box 8, a No. 3 injection interface 27 is installed on the surface of the clean water dripping box 9, and a No. 1 pump 28, a No. 2 pump 29 and a No. 3 pump 30 are installed on the top of the liquid storage tank 2 in sequence. The input end of the No. 1 pump 28 is connected to the inside of the glue storage chamber through a pipeline, the output end of the No. 1 pump 28 is connected to the No. 1 injection interface 23 through a pipeline, the input end of the No. 2 pump 29 is connected to the inside of the developer storage chamber through a pipeline, and the output end of the No. 2 pump 29 is connected to the No. 1 injection interface 23 through a pipeline. The end is connected to the No. 2 injection interface 25 through a pipeline, the input end of the No. 3 pump 30 is connected to the inside of the clean water storage chamber through a pipeline, the output end of the No. 3 pump 30 is connected to the No. 3 injection interface 27 through a pipeline, and a No. 1 feed pipe port 31, a No. 2 feed pipe port 32 and a No. 3 feed pipe port 33 are installed on the top of the liquid storage tank 2 in sequence, the No. 1 feed pipe port 31 is connected to the inside of the glue storage chamber, the No. 2 feed pipe port 32 is connected to the inside of the developer storage chamber, and the No. 3 feed pipe port 33 is connected to the inside of the clean water storage chamber.
[0041] Working principle of the present invention:
[0042] Refer to the instruction manual Figure 1-6 When using the present invention, first, a certain amount of glue is injected into the glue storage chamber through the No. 1 feed pipe opening 31, a certain amount of developer is injected into the developer storage chamber through the No. 2 feed pipe opening 32, and a certain amount of deionized water is injected into the clean water storage chamber through the No. 3 feed pipe opening 33;
[0043] Place the wafer inside the isolation sleeve 16, start the second motor 21, and drive the three-jaw chuck 20 to fix the wafer through the output shaft of the second motor 21;
[0044] Start the driving mechanism, and move the glue liquid dripping box 7 to the top of the wafer through the cooperation of the Y-axis linear module 3, the X-axis linear module 4, the No. 1 Z-axis linear module 5 and the No. 2 Z-axis linear module 6, start the No. 1 pump 28, extract the glue liquid in the glue storage chamber through the No. 1 pump 28, inject it into the glue liquid dripping box 7 through the No. 1 injection interface 23, and drip the glue liquid onto the surface of the wafer through the No. 1 dripping tube 24, start the No. 2 motor 21, and drive the three-jaw chuck 20 to drive the wafer to rotate through the No. 2 motor 21, and use the centrifugal force to evenly coat the glue liquid dripped on the wafer on the surface of the wafer. In this process, some of the glue liquid may be thrown onto the inner wall of the isolation sleeve 16;
[0045] The developer dripping box 8 is moved to the top of the wafer by the driving mechanism, and the No. 2 pump 29 is started. The developer in the developer storage chamber is extracted by the No. 2 pump 29, and injected into the developer dripping box 8 through the No. 2 injection interface 25. The developer is dripped into the isolation sleeve 16 through the No. 2 dripping tube 26. When the developer soaks the wafer, the extraction is stopped, and the wafer is developed by the developer. After the development process is completed, the developer in the isolation sleeve 16 is discharged through the drain pipe 22;
[0046] The clean water dripping box 9 is moved to the top of the wafer by the driving mechanism, and the brush sweeping rod 15 is probed into the isolation sleeve 16, and the No. 3 pump 30 is started. The deionized water in the clean water storage chamber is extracted by the No. 3 pump 30, and injected into the clean water dripping box 9 through the No. 3 injection interface 27, and the deionized water is transported to the nozzle 14 by the fixed conduit and the movable conduit 11, and the deionized water is sprayed out by the nozzle 14, which can not only spray the wafer but also rinse the inner wall of the isolation sleeve 16, and the No. 1 motor 12 is started, and the movable conduit 11 is driven by the No. 1 motor 12 to drive the nozzle 14 and the brush sweeping rod 15 to rotate, and the inner wall of the isolation sleeve 16 is washed, so that the attached glue liquid is separated from the inner wall of the isolation sleeve 16;
[0047] After a period of cleaning, the drive mechanism is restored to its original position, at which point the wafer and the isolation sleeve 16 are effectively cleaned.
Claims
1. A wafer coating and developing machine with a self-cleaning function, comprising an operating table (1) and a liquid storage tank (2), characterized in that: The top of the operating table (1) is provided with a driving mechanism, and the driving mechanism comprises a Y-axis linear module (3), an X-axis linear module (4), a No. 1 Z-axis linear module (5) and a No. 2 Z-axis linear module (6). The Y-axis linear module (3) is installed on one side of the top of the operating table (1). The surface of the Y-axis linear module (3) is connected to the No. 1 slide in a transmission manner. One end of the X-axis linear module (4) is installed on the surface of the No. 1 slide. The surface of the X-axis linear module (4) is connected to the No. 2 slide and the No. 3 slide in a same direction in a transmission manner. The No. 1 Z-axis linear module (5) is installed on the surface of the No. 2 slide. The No. 2 Z-axis linear module (6) is installed on the surface of the No. 3 slide. The surface of the No. 1 Z-axis linear module (5) is connected to the No. 4 slide in a transmission manner. The surface of the No. 4 slide is installed with a glue drop box (7) and a developer drop box (8). The surface of the module (6) is connected to a No. 5 slide in a transmission manner. A clean water dripping box (9) is installed on the surface of the No. 5 slide. A fixed conduit is installed at the bottom of the clean water dripping box (9). The bottom end of the fixed conduit is rotatably connected to a movable conduit (11) via a rotating joint (10). A No. 1 motor (12) is installed on one side of the clean water dripping box (9). The No. 1 motor (12) is connected to the movable conduit (11) in a transmission manner via a driving assembly (13). A plurality of staggered spray heads (14) and a brush sweeping rod (15) are installed at the bottom of the movable conduit (11). An isolation sleeve (16) is installed on the top of the operating table (1). The spray head (14) is arranged toward the inner wall of the isolation sleeve (16). The brush sweeping rod (15) matches the isolation sleeve (16). Bristles (17) are installed on the side of the brush sweeping rod (15) close to the inner wall of the isolation sleeve (16).
2. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: A support leg (18) is installed at one end of the X-axis linear module (4) away from the Y-axis linear module (3), a slide rail (19) is installed at one side of the top of the operating table (1) away from the Y-axis linear module (3), and the bottom of the support leg (18) is slidably connected to the slide rail (19).
3. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: The driving assembly (13) is composed of a belt and two pulleys, one of which is mounted on the surface of the movable conduit (11), and the other is mounted on one end of the output shaft of the first motor (12), and the belt is tensioned on the two pulleys.
4. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: A three-jaw chuck (20) is arranged inside the isolation sleeve (16), a No. 2 motor (21) is installed inside the operating table (1), and one end of the output shaft of the No. 2 motor (21) passes through the operating table (1) and is fixedly connected to the bottom of the three-jaw chuck (20).
5. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: A drainage pipe (22) is arranged on the top of the operating table (1), one end of the drainage pipe (22) is connected to the inside of the isolation sleeve (16), and the other end of the drainage pipe (22) extends to the outside of the operating table (1).
6. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: The liquid storage box (2) is provided with a glue storage chamber, a developer storage chamber and a clean water storage chamber in sequence. A first injection interface (23) is installed on the surface of the glue dripping box (7), a first dripping tube (24) is installed at the bottom of the glue dripping box (7), a second injection interface (25) is installed on the surface of the developer dripping box (8), a second dripping tube (26) is installed at the bottom of the developer dripping box (8), and a third injection interface (27) is installed on the surface of the clean water dripping box (9).
7. The wafer coating developer with self-cleaning function according to claim 6, characterized in that: A No. 1 pump (28), a No. 2 pump (29) and a No. 3 pump (30) are sequentially installed on the top of the liquid storage tank (2); the input end of the No. 1 pump (28) is connected to the inside of the glue storage chamber via a pipeline, and the output end of the No. 1 pump (28) is connected to a No. 1 injection interface (23) via a pipeline.
8. The wafer coating developer with self-cleaning function according to claim 7, characterized in that: The input end of the second pump (29) is connected to the inside of the developer storage chamber via a pipeline, and the output end of the second pump (29) is connected to the second injection interface (25) via a pipeline.
9. The wafer coating developer with self-cleaning function according to claim 7, characterized in that: The input end of the No. 3 pump (30) is connected to the inside of the clean water storage chamber via a pipeline, and the output end of the No. 3 pump (30) is connected to the No. 3 injection interface (27) via a pipeline.
10. The wafer coating developer with self-cleaning function according to claim 1, characterized in that: A No. 1 feed pipe opening (31), a No. 2 feed pipe opening (32) and a No. 3 feed pipe opening (33) are sequentially mounted on the top of the liquid storage box (2); the No. 1 feed pipe opening (31) is connected to the inside of the glue storage chamber, the No. 2 feed pipe opening (32) is connected to the inside of the developer storage chamber, and the No. 3 feed pipe opening (33) is connected to the inside of the clean water storage chamber.
Citation Information
Patent Citations
Automatic wafer cleaning device
CN113477599A
Cleaning device and thinning machine
CN118218284A
Wafer and chuck cleaning device
CN219106086U
Glue uniformizing device for wafer
CN221619910U
Multi-station wafer uniform glue developing machine
CN221746436U
