Continuous material taking device

Abstract

The invention discloses a continuous material taking device which comprises a supporting plate capable of moving in the horizontal direction and a wafer clamping and plugging box, a plurality of wafers arranged at intervals in the vertical direction are arranged in the wafer clamping and plugging box capable of moving in the vertical direction, a strip-shaped piece is installed on the lower surface of the supporting plate, and the strip-shaped piece is arranged on the lower surface of the supporting plate. An air groove is formed in the upper surface of the end, connected with the supporting plate, of the strip-shaped piece, an air hole corresponding to the air groove is formed in the supporting plate, a plurality of adsorption holes are formed in the upper surface of the end, close to the wafer clamping plug box, of the strip-shaped piece, and a protruding part is arranged on the outer side of the circumferential direction of each adsorption hole. According to the invention, the strip-shaped sheet can be conveniently stretched into the space between the wafers which are stacked up and down, the wafers above the strip-shaped sheet can be adsorbed, picked up and carried, and the situation that the wafers fall off due to insufficient adsorption force can be effectively avoided; and the contact interference with the wafer is reduced while the adsorption force on the wafer is ensured.

Description

Technical Field

[0001] The invention relates to a continuous material taking device, belonging to the technical field of wafer testing. Background Art

[0002] The wafer itself is very thin and light, and carries many IC patches on it. Therefore, during the production process, the wafer must be handled with care. Wafers in the prior art are usually stacked up and placed in a wafer card box, but the distance between the stacked wafers is small, which is not convenient for the robot to pick up. When using adsorption to pick up, the adsorption force is insufficient and the wafer is easy to fall, and the large contact area will cause contact interference to the wafer. Summary of the invention

[0003] The object of the present invention is to provide a continuous material picking device, which is convenient for extending a strip sheet into between stacked wafers and for adsorbing, picking up and transporting the wafers above the strip sheet and can effectively avoid the wafers from falling due to insufficient adsorption force. The device also contacts the local surface of the wafer through multiple protrusions, thereby ensuring the adsorption force on the wafer and reducing contact interference with the wafer.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a continuous material taking device, comprising: a support plate and a wafer plug box that can be moved in the horizontal direction, the wafer plug box that can be moved in the vertical direction is provided with a plurality of wafers arranged at intervals in the vertical direction, a strip piece is installed on the lower surface of the support plate, one end of the strip piece is sealed and connected to the lower surface of the support plate, and the other end of the strip piece extends horizontally toward the wafer plug box, the thickness of the strip piece is less than the spacing between adjacent wafers, so that the strip piece can extend between two adjacent wafers; An air groove is provided on the upper surface of one end of the strip sheet connected to the support plate, an air hole corresponding to the air groove is provided on the support plate, the lower end of the air hole connected to the vacuum generator at the upper end is connected to the air groove on the strip sheet, and a plurality of adsorption holes are provided on the upper surface of the strip sheet near one end of the wafer plug box, each of the adsorption holes is connected to the air groove through an air channel provided in the strip sheet, and each of the adsorption holes has a protruding portion on the circumferential outer side, so that the upper surface of the protruding portion is higher than the upper surface of the strip sheet and can contact the lower surface of the wafer.

[0005] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, the wafer plug box is installed on a lifting assembly, and the lifting assembly includes: an upper base plate, a lower base plate, at least two guide pillars connecting the upper base plate and the lower base plate, a screw rod rotatably installed between the upper base plate and the lower base plate, and a motor installed on the lower surface of the lower base plate, the upper end of the motor output shaft is connected to the lower end of the screw rod, and a movable block is threadedly mounted on the screw rod and located between the upper base plate and the lower base plate, and a lower movable plate is connected to the outer side of the movable block that can move up and down along the screw rod, and the guide pillar can slidably pass through the lower movable plate, and an upper movable plate is arranged above the upper base plate, and the upper movable plate and the lower movable plate are connected by at least two connecting plates, and a carrier is installed on the upper surface of the upper movable plate, and the wafer plug box is installed on the carrier.

[0006] 2. In the above solution, the upper surface of the carrier is provided with at least two limit blocks cooperating with the wafer plug box.

[0007] 4. In the above solution, the limit block is an L-shaped limit block.

[0008] 5. In the above solution, the four limit blocks are respectively arranged at the four corners of the lower end of the wafer plug box.

[0009] 6. In the above solution, the support plate is installed on the horizontal conveying mechanism.

[0010] 7. In the above scheme, several airways are interconnected.

[0011] 8. In the above solution, a sealing ring embedded in the air groove is in compression contact with the lower surface of the support plate.

[0012] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The continuous material taking device of the present invention has a wafer plug box which can move in the vertical direction and is provided with a plurality of wafers arranged at intervals in the vertical direction. A strip piece is installed on the lower surface of a support plate, one end of the strip piece is sealed and connected to the lower surface of the support plate, and the other end of the strip piece extends horizontally toward the wafer plug box. The thickness of the strip piece is less than the spacing between adjacent wafers, so that the strip piece can extend between two adjacent wafers. An air groove is provided on the upper surface of one end of the strip piece connected to the support plate, and an air hole corresponding to the air groove is provided on the support plate. The lower end of the air hole whose upper end is connected to a vacuum generator is connected to the air groove on the strip piece. A plurality of adsorption holes are provided on the upper surface of the strip piece close to one end of the wafer plug box, and each adsorption hole is connected to the air groove by a hole provided therebetween. The strip sheet is connected to the air passage in the strip sheet, and each adsorption hole has a convex portion on the outer side in the circumferential direction, so that the upper surface of the convex portion is higher than the upper surface of the strip sheet and can contact the lower surface of the wafer, which is convenient for extending the strip sheet between the stacked wafers and adsorbing, picking up and transporting the wafer above the strip sheet, and can effectively avoid the wafer from falling due to insufficient adsorption force. The multiple convex portions are in contact with the local surface of the wafer, which reduces the contact interference with the wafer while ensuring the adsorption force on the wafer. The card box with multiple wafers stacked on it can also move step by step in the vertical direction, so that the strip sheet can pick up the wafers arranged at intervals in the vertical direction one by one, thereby improving the efficiency of picking up and transporting the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Attached Figure 1 It is a structural schematic diagram of the continuous material taking device of the present invention; Attached Figure 2 It is a partial structural schematic diagram of the jacking assembly of the continuous material taking device of the present invention; Attached Figure 3 For attachment Figure 2 Schematic diagram of the cross section along AA; Attached Figure 4 It is a partial structural schematic diagram of the continuous material taking device of the present invention; Attached Figure 5 For attachment Figure 4 Schematic diagram of the cross section along BB; Attached Figure 6 For attachment Figure 5 The enlarged schematic diagram of the center C; Attached Figure 7 For attachment Figure 5 The enlarged schematic diagram of point D in the middle; Attached Figure 8 It is a schematic structural diagram of the strip sheet of the continuous material taking device of the present invention.

[0014] In the above drawings: 100, wafer; 1, upper substrate; 2, lower substrate; 3, guide column; 4, screw rod; 5, motor; 6, movable block; 71, lower movable plate; 72, upper movable plate; 8, connecting plate; 9, carrier; 91, limit block; 10, wafer plug box; 11, guide sleeve; 12, coupling; 13, bearing; 14, bracket; 15, support plate; 151, air hole; 16, strip sheet; 161, air groove; 162, adsorption hole; 163, airway; 164, sealing ring; 165, protrusion. Implementation

[0015] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0016] Embodiment 1: A continuous material removal device comprises: a support plate 15 movable in a horizontal direction and a wafer plug box 10, wherein the wafer plug box 10 movable in a vertical direction is provided with a plurality of wafers 100 arranged at intervals in a vertical direction, a strip sheet 16 is installed on the lower surface of the support plate 15, one end of the strip sheet 16 is sealedly connected to the lower surface of the support plate 15, and the other end of the strip sheet 16 extends horizontally toward the wafer plug box 10, and the thickness of the strip sheet 16 is less than the spacing between adjacent wafers 100, so that the strip sheet 16 can extend between two adjacent wafers 100; When incoming wafers are usually stacked in a wafer cassette in the form of 12 or 25 wafers, when the wafers need to be processed later, the wafer on the top layer is picked up first. After the wafer on the top layer is picked up, a lifting component drives the wafer cassette to move the next wafer up, and then the next wafer is picked up; An air groove 161 is provided on the upper surface of one end of the strip sheet 16 connected to the support plate 15, an air hole 151 corresponding to the air groove 161 is provided on the support plate 15, the lower end of the air hole 151 whose upper end is connected to the vacuum generator is connected to the air groove 161 on the strip sheet 16, and a plurality of adsorption holes 162 are provided on the upper surface of the strip sheet 16 close to the end of the wafer plug box 10, each of the adsorption holes 162 is connected to the air groove 161 through an air channel 163 provided in the strip sheet 16, and each of the adsorption holes 162 has a convex portion 285 on the outer side in the circumferential direction, so that the upper surface of the convex portion 285 is higher than the upper surface of the strip sheet 16 and can contact the lower surface of the wafer 100; When picking, the strip sheet is first moved toward the wafer cassette by a support plate that can move horizontally and extends under the wafer to be picked up, and then the vacuum generator is started to generate a vacuum around the adsorption holes on the strip sheet, so that the wafer can be adsorbed and grasped from the bottom surface, and then the strip sheet is driven by the reverse movement of the support plate to move the adsorbed wafer out of the cassette.

[0017] The supporting plate 15 is installed on the horizontal conveying mechanism.

[0018] The above-mentioned several air passages 163 are interconnected.

[0019] A sealing ring 164 embedded in the air groove 161 is in compression contact with the lower surface of the support plate 15 .

[0020] The strip sheet 16 is a ceramic sheet, which can effectively prevent static electricity from being generated during the process of picking up the wafer, thereby preventing the subsequent processing of the wafer from being affected.

[0021] The thickness of the strip sheet 16 is 3.5 mm.

[0022] The air groove 161 is a circular air groove.

[0023] The plurality of adsorption holes 162 are distributed in a T-shape.

[0024] Embodiment 2: A continuous material removal device comprises: a support plate 15 movable in the horizontal direction and a wafer plug box 10, wherein the wafer plug box 10 movable in the vertical direction is provided with a plurality of wafers 100 arranged at intervals in the vertical direction, a strip sheet 16 is installed on the lower surface of the support plate 15, one end of the strip sheet 16 is sealedly connected to the lower surface of the support plate 15, and the other end of the strip sheet 16 extends horizontally toward the wafer plug box 10, and the thickness of the strip sheet 16 is less than the spacing between adjacent wafers 100, so that the strip sheet 16 can extend between two adjacent wafers 100; An air groove 161 is provided on the upper surface of one end of the strip sheet 16 connected to the support plate 15, an air hole 151 corresponding to the air groove 161 is provided on the support plate 15, the lower end of the air hole 151 whose upper end is connected to the vacuum generator is connected to the air groove 161 on the strip sheet 16, and a plurality of adsorption holes 162 are provided on the upper surface of the strip sheet 16 close to the end of the wafer plug box 10, each of the adsorption holes 162 is connected to the air groove 161 through an air channel 163 provided in the strip sheet 16, and each of the adsorption holes 162 has a convex portion 285 on the outer side in the circumferential direction, so that the upper surface of the convex portion 285 is higher than the upper surface of the strip sheet 16 and can contact the lower surface of the wafer 100; During the entire handling process, only the raised parts around the adsorption holes are in adsorption contact with the lower surface of the wafer, which has little interference with the wafer to be picked up and will not damage the wafer. The wafer is supported while being adsorbed, thereby effectively avoiding the wafer from falling due to insufficient adsorption force. The use of ceramic sheets will not generate static electricity to interfere with subsequent processing of the wafer; nor will it interfere with other wafers stacked above or below the wafer to be picked up.

[0025] The wafer plug box 10 is installed on a lifting assembly, which includes: an upper base plate 1, a lower base plate 2, at least two guide pillars 3 connecting the upper base plate 1 and the lower base plate 2, a screw rod 4 rotatably installed between the upper base plate 1 and the lower base plate 2, and a motor 5 installed on the lower surface of the lower base plate 2, the upper end of the output shaft of the motor 5 is connected to the lower end of the screw rod 4, a movable block 6 is threadedly mounted on the screw rod 4 and located between the upper base plate 1 and the lower base plate 2, a lower movable plate 71 is connected to the outer side of the movable block 6 that can move up and down along the screw rod 4, the guide pillar 3 can slidably pass through the lower movable plate 71, an upper movable plate 72 is arranged above the upper base plate 1, the upper movable plate 72 and the lower movable plate 71 are connected by at least two connecting plates 8, a carrier 9 is installed on the upper surface of the upper movable plate 72, and the wafer plug box 10 is installed on the carrier 9; When the lifting assembly is working, the motor is first started to drive the screw to rotate and then drive the movable block to move upward. The upward movement of the movable block is finally transmitted to the carrier on the upper movable plate to drive the wafer plug box to move upward, so that the topmost wafer among the remaining wafers in the plug box rises to the height of the original top wafer, so as to facilitate subsequent picking operations.

[0026] At least two stop blocks 91 cooperating with the wafer plug box 10 are disposed on the upper surface of the carrier 9 .

[0027] The above-mentioned limit block 91 is an L-shaped limit block.

[0028] The four limit blocks 91 are respectively disposed at the four corners of the lower end of the wafer plug box 10 .

[0029] The thickness of the strip sheet 16 is 2 mm.

[0030] A plurality of guide sleeves 11 through which the guide pillars 3 can pass are installed on the lower movable plate 71 .

[0031] There are four guide pillars 3 , which are respectively located at four corners of the upper substrate 1 and the lower substrate 2 .

[0032] There are four connecting plates 8 , which are respectively located at the edges of the lower movable plate 71 and between two adjacent guide pillars 3 .

[0033] The screw rod 4 is connected to the output shaft of the motor 5 via a coupling 12 .

[0034] The screw rod 4 is rotatably connected to the upper base plate 1 and the lower base plate 2 via at least one bearing 13 .

[0035] The motor 5 is mounted on the lower base plate 2 via a bracket 14 .

[0036] The working principle of the present invention is as follows: When incoming wafers are usually stacked in a wafer cassette in the form of 12 or 25 wafers, when the wafers need to be processed later, the wafer on the top layer is picked up first. After the wafer on the top layer is picked up, a lifting component drives the wafer cassette to move the next wafer up, and then the next wafer is picked up; When the lifting assembly is working, the motor is first started to drive the screw to rotate and then drive the movable block to move upward. The upward movement of the movable block is finally transmitted to the carrier on the upper movable plate to drive the wafer plug box to move upward, so that the uppermost wafer among the remaining wafers in the plug box rises to the height of the original top wafer, so as to facilitate the subsequent picking operation; When picking up, the strip sheet is first driven by a support plate that can move in the horizontal direction to move toward the wafer plug box and extend under the wafer to be picked up, and then the vacuum generator is started to generate a vacuum around the adsorption holes on the strip sheet, so that the wafer can be adsorbed and grasped from the bottom surface, and then the strip sheet is driven by the reverse movement of the support plate to carry the adsorbed wafer out of the plug box; During the entire above-mentioned transportation process, only the raised parts around the adsorption holes are in adsorption contact with the lower surface of the wafer, which has little interference with the wafer to be picked up and will not damage the wafer. The wafer is supported while being adsorbed, thereby effectively avoiding the wafer from falling due to insufficient adsorption force. The use of ceramic sheets will not generate static electricity to interfere with subsequent processing of the wafer; nor will it interfere with other wafers stacked above or below the wafer to be picked up.

[0037] When the above-mentioned continuous material removal device is used, it is convenient to extend the strip sheet between the stacked wafers and to absorb, pick up and transport the wafers above the strip sheet, and it can effectively avoid the wafers falling due to insufficient adsorption force. It also contacts the local surface of the wafer through multiple protrusions, thereby ensuring the adsorption force on the wafer while reducing contact interference with the wafer.

[0038] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A continuous material taking device, comprising: A support plate (15) and a wafer plug box (10) movable in a horizontal direction, characterized in that: a plurality of wafers (100) arranged at intervals in a vertical direction are arranged in the wafer plug box (10) movable in a vertical direction, a strip sheet (16) is installed on the lower surface of the support plate (15), one end of the strip sheet (16) is sealed to the lower surface of the support plate (15), and the other end of the strip sheet (16) extends horizontally toward the wafer plug box (10), and the thickness of the strip sheet (16) is less than the spacing between adjacent wafers (100), so that the strip sheet (16) can extend between two adjacent wafers (100); An air groove (161) is provided on the upper surface of one end of the strip sheet (16) connected to the support plate (15), an air hole (151) corresponding to the air groove (161) is provided on the support plate (15), the air hole (151) whose upper end is connected to the vacuum generator is connected to the air groove (161) on the strip sheet (16) at its lower end, a plurality of adsorption holes (162) are provided on the upper surface of one end of the strip sheet (16) close to the wafer plug box (10), each of the adsorption holes (162) is connected to the air groove (161) via an air channel (163) provided in the strip sheet (16), and each of the adsorption holes (162) has a protrusion (285) on the outer side in the circumferential direction, so that the upper surface of the protrusion (285) is higher than the upper surface of the strip sheet (16) and can contact the lower surface of the wafer (100).

2. The continuous material taking device according to claim 1, characterized in that: The wafer plug box (10) is mounted on a lifting assembly, and the lifting assembly comprises: an upper base plate (1), a lower base plate (2), at least two guide pillars (3) connecting the upper base plate (1) and the lower base plate (2), a screw rod (4) rotatably mounted between the upper base plate (1) and the lower base plate (2), and a motor (5) mounted on the lower surface of the lower base plate (2), wherein the upper end of the output shaft of the motor (5) is connected to the lower end of the screw rod (4), and the screw rod (4) is located between the upper base plate (1) and the lower base plate (2) through a threaded sleeve. A movable block (6) is provided, and a lower movable plate (71) is connected to the outer side of the movable block (6) which can move up and down along the screw rod (4), and the guide column (3) can slide through the lower movable plate (71). An upper movable plate (72) is provided above the upper base plate (1), and the upper movable plate (72) and the lower movable plate (71) are connected by at least two connecting plates (8). A carrier (9) is installed on the upper surface of the upper movable plate (72), and the wafer plug box (10) is installed on the carrier (9).

3. The continuous material taking device according to claim 2, characterized in that: The upper surface of the carrier (9) is provided with at least two limit blocks (91) that cooperate with the wafer plug box (10).

4. The continuous material taking device according to claim 3 is characterized in that: The limit block (91) is an L-shaped limit block.

5. The continuous material taking device according to claim 3 or 4, characterized in that: The four limit blocks (91) are respectively arranged at four corners of the lower end of the wafer plug box (10).

6. The continuous material taking device according to claim 1, characterized in that: The support plate (15) is installed on the horizontal conveying mechanism.

7. The continuous material taking device according to claim 1, characterized in that: Several airways (163) are interconnected.

8. The continuous material taking device according to claim 1, characterized in that: A sealing ring (164) embedded in the air groove (161) is in compression contact with the lower surface of the support plate (15).

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