Separate-cavity shielding SIP product and preparation method thereof

Abstract

The invention provides a cavity-divided shielding SIP (Session Initiation Protocol) product and a preparation method thereof. The preparation method of the cavity-divided shielding SIP product comprises the following steps: mounting each group of electronic modules on a substrate; mounting isolation resistor devices on the cavity-divided shielding areas on the substrate so as to separate the groups of electronic modules; the plastic package body covers each group of electronic modules on the substrate in a plastic package manner; and sputtering a sputtering shielding layer covering the plastic package body and the isolation resistor device on the plastic package body. According to the cavity-divided shielding SIP product and the preparation method thereof provided by the invention, the problems of low efficiency and high overhead of the preparation process of the existing cavity-divided shielding SIP product can be solved.

Description

Technical Field

[0001] The present invention relates to the field of electromagnetic shielding technology, and more specifically, to a cavity-shielded SIP product and a preparation method thereof. Background Art

[0002] With the rapid development of SIP (system-in-package) technology, the functions of electronic products are becoming more and more complex. However, the electromagnetic interference problem between modules (or devices) in such SIP products is becoming more and more prominent. Electromagnetic shielding technology uses the absorption of electromagnetic waves by metal shielding and the reflection of metal waves to effectively reduce the electromagnetic interference between electronic components inside SIP products (cavity shielding) and between electronic components and the external environment.

[0003] If SIP products are not effectively electromagnetically shielded, the electromagnetic waves generated by the alternating electromagnetic field will affect the normal operation of the electronic components inside the SIP products, mainly manifesting as: 1) reduced electronic product signals; 2) reduced electronic product life; 3) overheating of electronic products.

[0004] For electromagnetic interference between electronic components and the external environment, such as Figure 1 As shown in the figure, the electronic components are usually isolated from the interference sources in the external environment by covering with conductive materials, which is called common shielding. For electromagnetic interference between electronic components inside SIP products, such as Figure 2 and Figure 3 As shown in the figure, electronic components that interfere with each other are isolated by conductive materials, which is called cavity shielding.

[0005] Existing cavity shielding solutions such as Figure 4 As shown, each electronic component is first mounted on the substrate, and then all the electronic components on the substrate are plastic-sealed using a plastic-sealing process. The plastic-sealed body is then slotted using a laser process to form grooves between the electronic components that interfere with each other. The grooves are then filled with conductive glue using a dispensing process. Finally, a layer of metal shielding film is plated on the surface of the entire product to achieve a cavity-by-cavity shielding effect.

[0006] However, in actual operation, the efficiency of the laser process and the glue dispensing process is low, and the cost of the conductive glue is high, resulting in low efficiency and high cost of the entire preparation process of the traditional cavity shielding solution.

[0007] Based on the above technical problems, there is an urgent need for a cavity shielding solution that can both save costs and improve preparation efficiency. Summary of the invention

[0008] In view of the above problems, an object of the present invention is to provide a cavity-shielded SIP product and a preparation method thereof, so as to solve the problems of low efficiency and high cost in the preparation process of the existing cavity-shielded SIP product.

[0009] The cavity-shielded SIP product provided by the present invention comprises a substrate and at least two groups of electronic modules arranged on the substrate; wherein electromagnetic waves are generated between the electronic modules of each group; and

[0010] An isolation resistor device is arranged between each group of electronic modules.

[0011] In addition, a preferred solution is that the isolation resistor device is vertically fixed on the substrate.

[0012] In addition, a preferred solution is that a cavity shielding area is provided on the substrate, and the isolation resistor device is attached to the cavity shielding area.

[0013] In addition, a preferred solution is that the isolation resistor components are evenly distributed and attached in the sub-cavity shielding area.

[0014] In addition, a preferred solution is that two groups of electronic modules are arranged on the substrate; and

[0015] The isolation resistor device is attached to the periphery of any group of the electronic modules.

[0016] In addition, a preferred solution is that a plastic packaging body covering each group of the electronic modules is plastic-sealed on the substrate, and the plastic packaging body is located on the side of the isolation resistor device.

[0017] In addition, a preferred solution is that a sputtering shielding layer covering the plastic package body and the isolation resistor device is sputtered on the plastic package body.

[0018] In addition, a preferred solution is that the substrate is a PCB board.

[0019] On the other hand, the present invention also provides a method for preparing the aforementioned cavity-shielded SIP product, the preparation method comprising:

[0020] Mounting each group of electronic modules on the substrate;

[0021] Mounting the isolation resistor device in the cavity shielding area on the substrate to separate the groups of electronic modules;

[0022] Plastic-sealing a plastic-sealed body covering each group of the electronic modules on the substrate;

[0023] A sputtering shielding layer covering the plastic package body and the isolation resistor device is sputtered on the plastic package body.

[0024] In addition, a preferred solution is that the isolation resistor device is fixed on the substrate by mounting.

[0025] Compared with the prior art, the cavity-shielded SIP product and its preparation method according to the present invention have the following beneficial effects:

[0026] The cavity-shielded SIP product provided by the present invention can effectively reduce the production cost of the product by adopting low-cost isolation resistor devices instead of high-cost conductive materials made of conductive glue; in addition, the preparation method of the cavity-shielded SIP product provided by the present invention can omit the laser process and glue dispensing process in the existing preparation process by first mounting the isolation resistor device on the substrate, which can significantly improve the preparation efficiency of the cavity-shielded SIP product.

[0027] In order to achieve the above and related purposes, one or more aspects of the present invention include features that will be described in detail later and are particularly pointed out in the claims. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all of these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] By referring to the following description and claims in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easier to understand. In the accompanying drawings:

[0029] Figure 1 This is a schematic diagram of the principle of common shielding;

[0030] Figure 2 It is a first principle schematic diagram of cavity shielding;

[0031] Figure 3 It is a second principle schematic diagram of cavity shielding;

[0032] Figure 4 This is a process flow chart for the preparation of existing cavity shielded SIP products;

[0033] Figure 5 A process flow chart of the preparation of a cavity-shielded SIP product provided by an embodiment of the present invention;

[0034] Figure 6 A top view of a cavity-divided shielded SIP product provided in an embodiment of the present invention.

[0035] Description of reference numerals:

[0036] Substrate 1', electronic components 2', plastic package 3', groove 4', conductive glue 5', metal shielding film 6'; substrate 1, electronic components 2, plastic package 3, isolation resistor device 4, sputtering shielding layer 6;

[0037] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0038] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0039] It should be understood that the terms described in the present invention are only for describing special embodiments and are not intended to limit the present invention. In addition, for the numerical range in the present invention, it should be understood that each intermediate value between the upper and lower limits of the scope is also specifically disclosed. Each smaller range between the intermediate value in any stated value or stated range and any other stated value or intermediate value in the described range is also included in the present invention. The upper and lower limits of these smaller ranges can be independently included or excluded in the scope.

[0040] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; in addition, unless otherwise expressly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] It will be apparent to those skilled in the art that various modifications and variations may be made to the specific embodiments of the present invention description without departing from the scope or spirit of the present invention. Other embodiments derived from the present invention description will be apparent to those skilled in the art. The present application description and examples are exemplary only.

[0042] Figure 5 The following is a process flow diagram of a preparation process of a cavity-shielded SIP product provided by an embodiment of the present invention. Figure 6 The top view of the structure of the cavity-divided shielded SIP product provided by an embodiment of the present invention is shown.

[0043] Depend on Figure 5 The last step diagram and Figure 6 It can be seen that the cavity-shielded SIP product provided in the embodiment of the present invention includes a substrate 1 for mounting and carrying various electronic components 2 that can realize the functions of the product. Electronic components 2 (mainly chips, but also resistors and capacitors, etc.) with different functions and types are mounted on the substrate 1. These electronic components 2 are divided into multiple groups of electronic modules (at least two groups) according to their functions and whether they generate electromagnetic waves (forming electromagnetic interference) with each other. Each group of electronic modules contains at least one electronic component 2. The electronic components 2 in the same group of electronic modules do not generate electromagnetic interference, but electronic modules in different groups will generate electromagnetic waves with each other, thereby causing electromagnetic interference.

[0044] In order to solve the problem of electromagnetic interference caused by electromagnetic waves generated by different groups of electronic modules, the cavity shielding SIP product provided by the present invention is provided with an isolation resistor device 4 between each group of electronic modules for isolating the electromagnetic waves generated by different groups of electronic modules, and the electromagnetic interference between different groups of electronic modules is solved by the isolation resistor device 4. It should be noted that the isolation resistor device 4 in the cavity shielding SIP product provided by the present invention is essentially a resistor device, which is different from the conductive material provided between the mutually interfering electronic components 2 in the existing scheme (which needs to be grooved by a laser process first, and then filled with conductive glue by a dispensing process to form), the isolation resistor device 4 provided by the present invention can be fixed at the required position on the substrate 1 by the same mounting process as the components, and by mounting the isolation resistor device 4, the electronic modules of different groups can be directly isolated, without the need for the laser process and dispensing process in the traditional process, which can significantly improve the preparation efficiency of the cavity shielding SIP product; and the cavity shielding SIP product provided by the present invention can effectively reduce the production cost of the product by using the low-cost isolation resistor device 4 instead of the high-cost conductive material made of conductive glue.

[0045] In the actual production process, the isolation resistor device 4 can be mounted on the substrate 1 together with the electronic components 2, and in order to improve the electromagnetic shielding effect of the isolation resistor device 4, usually, the isolation resistor device 4 needs to be vertically fixed and mounted on the substrate 1; of course, according to the setting requirements, the isolation resistor device 4 can also be mounted on the substrate 1 in other ways, for example, horizontal fixed mounting, etc.

[0046] In addition, in a preferred embodiment of the present invention, an area for mounting the isolation resistor device 4 can be planned on the substrate 1, which is recorded as a cavity shielding area (usually a linear area, such as a rectangular area surrounding a group of electronic modules as shown in Figure 6). The cavity shielding area can separate the groups of electronic modules, and then the isolation resistor device 4 can be evenly or equidistantly mounted in the cavity shielding area, thereby realizing the electromagnetic shielding function between the groups of electronic modules.

[0047] It should be noted that, for the case where only two groups of electronic modules are arranged on the substrate 1, the cavity shielding area can be set around a group (any group) of electronic modules and the isolation resistor device 4 can be attached to the cavity shielding area. In this way, a group of electronic modules can be surrounded by the isolation resistor device 4, so that the two groups of electronic modules can be completely isolated, thereby improving the electromagnetic shielding function between the two groups of electronic modules.

[0048] In a specific embodiment of the present invention, the cavity-shielded SIP product provided by the present invention also needs to be plastic-encapsulated on the substrate 1 with a plastic encapsulation body 3 covering each group of electronic modules, and at this time, the plastic encapsulation body 3 is on the side of the isolation resistor device 4; by setting the plastic encapsulation body 3, each electronic component 2 can be effectively protected and further fixed; the plastic encapsulation body 3 is on the side of the isolation resistor device 4. In addition, in order to achieve the common shielding function of the entire cavity-shielded SIP product, it is also necessary to sputter a sputtering shielding layer 6 covering the plastic encapsulation body 3 and the isolation resistor device 4 on the plastic encapsulation body 3, and by using the sputtering shielding layer 6 to cover the electronic components 2 inside the entire cavity-shielded SIP product, it is isolated from the interference sources in the external environment to achieve common shielding.

[0049] In addition, it should be noted that in order to further improve the integration of the entire product, the substrate 1 can adopt a PCB board (Printed Circuit Board in English, the Chinese name is printed circuit board, which is the support body of the electronic components 2) printed with internal circuits.

[0050] On the other hand, Figure 5 As shown, the present invention also provides a method for preparing a fir tree cavity shielding SIP product, the preparation method comprising:

[0051] Mounting each group of electronic modules on the substrate 1;

[0052] An isolation resistor device 4 is mounted on the cavity shielding area on the substrate 1 to separate the groups of electronic modules;

[0053] A plastic packaging body 3 covering each group of electronic modules is plastic-sealed on the substrate 1;

[0054] A sputtering shielding layer 6 covering the plastic package 3 and the isolation resistor device 4 is sputtered on the plastic package 3 .

[0055] It can be seen from the various steps of the preparation method of the cavity shielded SIP product provided by the above-mentioned present invention that the preparation method of the cavity shielded SIP product provided by the present invention, compared with the existing preparation method of the cavity shielded SIP product, can directly isolate different groups of electronic modules by mounting an isolation resistor device 4, and does not require the laser process and glue dispensing process in the existing process (such as the background technology), which can significantly improve the preparation efficiency of the cavity shielded SIP product; and, the cavity shielded SIP product provided by the present invention can effectively reduce the product production cost by adopting a low-cost isolation resistor device 4 instead of a high-cost conductive material made of conductive glue.

[0056] As above Figure 5 and Figure 6 The cavity-shielded SIP product and its preparation method according to the present invention are described in an exemplary manner. However, those skilled in the art should understand that various improvements can be made to the cavity-shielded SIP product and its preparation method proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A cavity shielded SIP product, characterized in that: The method comprises a substrate and at least two groups of electronic modules arranged on the substrate; wherein electromagnetic waves are generated between the groups of electronic modules; and An isolation resistor device is arranged between each group of electronic modules.

2. The cavity-shielded SIP product according to claim 1, characterized in that: The isolation resistor device is vertically fixed on the substrate.

3. The cavity-shielded SIP product according to claim 2, characterized in that: A cavity shielding area is arranged on the substrate, and the isolation resistor device is attached in the cavity shielding area.

4. The cavity-shielded SIP product according to claim 3, characterized in that: The isolation resistor components are evenly distributed and attached in the sub-cavity shielding area.

5. The cavity-shielded SIP product according to claim 3, characterized in that: The electronic modules are arranged in two groups on the substrate; and The isolation resistor device is attached to the periphery of any group of electronic modules.

6. The cavity-shielded SIP product according to claim 4, characterized in that: A plastic packaging body covering each group of electronic modules is plastic-sealed on the substrate, and the plastic packaging body is located on the side of the isolation resistor component.

7. The cavity-shielded SIP product according to claim 6, characterized in that: A sputtering shielding layer covering the plastic package body and the isolation resistor device is sputtered on the plastic package body.

8. The cavity-shielded SIP product according to any one of claims 1 to 7, characterized in that: The substrate is a PCB board.

9. A method for preparing the cavity shielded SIP product according to any one of claims 1 to 8, characterized in that: The preparation method comprises: Mounting each group of electronic modules on the substrate; Mounting isolation resistor components in the cavity shielding area on the substrate to separate the groups of electronic modules; Plastic-sealing a plastic-sealed body covering each group of electronic modules on the substrate; A sputtering shielding layer covering the plastic package body and the isolation resistor device is sputtered on the plastic package body.

10. The method for preparing the cavity-shielded SIP product according to claim 9, characterized in that: The isolation resistor device is fixed on the substrate in a mounting manner.

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