Plane integrated design power adapter

Abstract

The invention discloses a plane integrated design power adapter, which comprises a plate A and a plate B. The inner side of the plate A is fixedly connected with an E-piece magnetic core, the outer side of the plate A is provided with an I-piece magnetic core, a separation frame is arranged between the plate A and the plate B, and the outer sides of the plate A and the plate B are both provided with cooling fins. The magnetic core module has the advantages that by arranging the A plate, the B plate, the E magnetic core, the I magnetic core and other structures, the A plate and the B plate are independent integrated modules and are separated by the separation frame; the two modules can be separately manufactured and tested by adopting an independent process, so that the complexity of the process is greatly simplified, the yield is improved, automatic production is facilitated, the product consistency is good, and the cost effectiveness is better. The plate A and the plate B are separated by the separation frame, heat generated by the plate A and the plate B during working is diffused outwards through the radiating fins on the outer sides, heat transfer between the plate A and the plate B is reduced, and rapid dissipation of heat of the power adapter is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of power adapters, in particular to a power adapter with a planar integrated design. Background Art

[0002] A power adapter, also known as a power adapter, is a power conversion device for small portable electronic devices and electronic appliances. The working principle of a power adapter is to convert AC input into DC output.

[0003] In reality, most of the power adapters we come into contact with are switching power supplies. Through modern electronic technology, the ratio of the time when the switch is turned on and off is controlled to maintain a stable output voltage. Switching power supplies are usually composed of pulse width modulation (PWM) control ICs and MOSFETs, and have the advantages of high conversion efficiency, small size, and the ability to work over a wide voltage range.

[0004] Since the power adapter must have an AC module and a DC module, assembling the two together often faces problems such as complex design and mixing process, high cost, and low yield rate. At the same time, there are also problems such as the heat between the two being transferred to each other, which is not conducive to the heat dissipation of the power adapter. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the present invention provides a power adapter with a planar integrated design, which has the advantages of simplifying the complexity of the process, improving the yield rate, facilitating automated production, having good product consistency, better cost-effectiveness, and being conducive to the rapid dissipation of heat from the power adapter.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a flat integrated power adapter, comprising an A plate and a B plate, wherein an E-piece magnetic core is fixedly connected to the inner side of the A plate, an I-piece magnetic core is arranged on the outer side of the A plate, a partition frame is arranged between the A plate and the B plate, and heat sinks are arranged on the outer sides of the A plate and the B plate.

[0009] Preferably, a plurality of electronic components are disposed on the A board and the B board, and a circular through hole and a slot are provided on the A board.

[0010] Preferably, the E-sheet magnetic core is adhered to the A-sheet by epoxy glue, and the middle part of the E-sheet magnetic core is inserted into the circular through hole of the A-sheet.

[0011] The above technical solution is adopted: Board A provides an installation platform for the AC input circuit, rectification circuit, and EMI circuit. The AC input circuit, rectification circuit, and EMI circuit are integrated into a single board to form an AC module. Board B provides an installation platform for the PWM-DCDC circuit. The PWM-DCDC circuit is separately integrated into a single board to form a DC module. Among them, the AC module uses a double-sided plug-in process, and the DC module uses a six-layer patch process. Several electronic components are welded on boards A and B. Among them, the capacitors need to distinguish between positive and negative poles during welding. The components should be installed in place before welding. The solder joints should be smooth and full. When welding, adjacent components should be prevented from detaching or bridging.

[0012] Preferably, the I-piece magnetic core is fixedly connected to the E-piece magnetic core by epoxy glue, and one end of the B plate is fixedly connected with an insert.

[0013] Preferably, the insert at the end of the B plate is inserted into the A plate and welded at the connection position, and the two sides of the partition frame are respectively provided with clamping positions corresponding to the A plate and the B plate.

[0014] Adopt the above technical solution: the E-piece magnetic core cooperates with the I-piece magnetic core and is fixedly connected on both sides of the A plate. When installing the E-piece magnetic core and the I-piece magnetic core, epoxy glue should be applied to the functional surface and inner groove of the E-piece magnetic core first, and then the E-piece magnetic core should be buckled into the circular through hole in the middle of the A plate. Then, apply thermal conductive soft glue to the middle column of the E-piece magnetic core, buckle the I-piece magnetic core to the E-piece magnetic core, and then clamp the two magnetic cores with clips. Use a baking device to bake the assembled structure so that the assembled structure is fixed.

[0015] Preferably, a grounding wire is welded on the B plate, and there are several heat sinks.

[0016] Preferably, a plurality of the heat sinks are provided with positions adapted to the A plate and the B plate.

[0017] The above technical solution is adopted: the partition frame separates the A plate and the B plate, isolates the heat of the A plate and the B plate, and prevents the heat generated by the A plate and the B plate from being transferred to each other. The heat sink is arranged on the outside of the A plate and the B plate to transfer the heat generated by the A plate and the B plate to the outside. Several heat sinks are arranged on the outside of the A plate and the B plate to facilitate the heat dissipation of the A plate and the B plate. Corresponding card positions are provided on the heat sink to facilitate its connection with the A plate and the B plate.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the present invention provides a flat integrated power adapter, which has the following beneficial effects:

[0020] The power adapter with a flat integrated design is provided with structures such as A plate, B plate, E plate magnetic core, I plate magnetic core, a partition frame, and a heat sink. The A plate and the B plate are separate integrated modules, and the partition frame separates the two. The two modules can be manufactured and tested separately using separate processes, which greatly simplifies the complexity of the process, improves the yield rate, facilitates automated production, has good product consistency, and is more cost-effective. The partition frame separates the A plate and the B plate, and the heat generated by the A plate and the B plate at work is diffused outward through the heat sinks on the outside of each plate, reducing the heat transfer between the two, which is conducive to the rapid dissipation of heat in the power adapter. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure from a first perspective of a flat integrated power adapter proposed by the present invention;

[0022] Figure 2 A schematic diagram of the structure of a power adapter with a flat integrated design from a second viewing angle proposed by the present invention;

[0023] Figure 3 A schematic diagram of the structure of a power adapter with a planar integrated design from a third perspective proposed by the present invention;

[0024] Figure 4 This is a structural schematic diagram of the A plate of a flat integrated power adapter proposed by the present invention;

[0025] Figure 5 This is a schematic structural diagram of the assembled A plate, E magnetic core and I magnetic core of a flat integrated power adapter proposed by the present invention;

[0026] Figure 6 A schematic diagram of the structure of a partition frame of a power adapter with a flat integrated design proposed by the present invention;

[0027] Figure 7 This is a structural schematic diagram of a B board of a flat integrated power adapter proposed by the present invention;

[0028] Figure 8 This is a circuit schematic diagram of a flat integrated power adapter proposed by the present invention.

[0029] In the figure: 1-A plate, 2-E magnetic core, 3-I magnetic core, 4-partition frame, 5-B plate, 6-heat sink. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1-8 A power adapter with a planar integrated design includes an A plate 1 and a B plate 5, an E-piece magnetic core 2 is fixedly connected to the inner side of the A plate 1, an I-piece magnetic core 3 is arranged on the outer side of the A plate 1, a partition frame 4 is arranged between the A plate 1 and the B plate 5, and heat sinks 6 are arranged on the outer sides of the A plate 1 and the B plate 5.

[0032] Embodiment 1: A board 1 and B board 5 are both provided with a number of electronic components, and A board 1 is provided with a circular through hole and a slot. E sheet magnetic core 2 is adhered to A board 1 by epoxy glue, and the middle part of E sheet magnetic core 2 is plugged into the circular through hole of A board 1. A board 1 provides an installation platform for AC input circuit, rectification circuit, and EMI circuit, and the AC input circuit, rectification circuit, and EMI circuit are integrated into a single board to form an AC module. B board 5 provides an installation platform for PWM-DCDC circuit, and the PWM-DCDC circuit is separately integrated into a single board to form a DC module. Among them, the AC module uses a double-sided plug-in process in this case, and the DC module uses a six-layer patch process. A number of electronic components are welded on A board 1 and B board 5, among which, the capacitor components need to distinguish between positive and negative poles during welding, and the components are welded after they are installed in place. The solder joints should be smooth and full, and adjacent components should be prevented from detaching or bridging when welding.

[0033] Embodiment 2: The I-piece magnetic core 3 is fixedly connected to the E-piece magnetic core 2 by epoxy glue, and one end of the B plate 5 is fixedly connected with a plug-in. The plug-in at the end of the B plate 5 is inserted into the A plate 1 and welded at the connection position, and the two sides of the partition frame 4 are respectively provided with corresponding positions for the A plate 1 and the B plate 5. The E-piece magnetic core 2 cooperates with the I-piece magnetic core 3 and is fixedly connected to the two sides of the A plate 1. When installing the E-piece magnetic core 2 and the I-piece magnetic core 3, epoxy glue should be applied to the functional surface and the inner groove of the E-piece magnetic core first, and then the E-piece magnetic core should be buckled into the circular through hole in the middle of the A plate. Then apply thermal conductive soft glue to the middle column of the E-piece magnetic core 2, buckle the I-piece magnetic core 3 corresponding to the E-piece magnetic core 2, and then clamp the two magnetic cores with a clip. The assembled structure is baked using a baking device to fix the assembled structure.

[0034] Embodiment 3: A grounding wire is welded on the B plate 5, and there are several heat sinks 6. Several heat sinks 6 are provided with slots adapted to the A plate 1 and the B plate. The partition frame 4 separates the A plate 1 and the B plate 5, isolates the heat of the A plate 1 and the B plate, and prevents the heat generated by the operation of the A plate 1 and the B plate from being transferred to each other. The heat sink 6 is arranged on the outside of the A plate 1 and the B plate to transfer the heat generated by the operation of the A plate 1 and the B plate to the outside. Several heat sinks 6 are arranged on the outside of the A plate 1 and the B plate, respectively, to facilitate the heat dissipation of the A plate 1 and the B plate. Corresponding slots are provided on the heat sink 6 to facilitate its connection with the A plate 1 and the B plate.

[0035] When in use, the AC input circuit, rectification circuit, and EMI circuit are integrated into a single board to form an AC module. The PWM-DCDC circuit is separately integrated into a single board to form a DC module. The two are assembled together in a modular manner. The two modules can be manufactured and tested separately using separate processes to avoid the complexity of mixed processes and improve costs and yields. The heating units of the AC module and the DC module are separated for easy heat dissipation. The DC module adopts a planar integrated design, and uses the latest planar transformer design technology to integrate the high-frequency transformer into the overall design and platformize it. The peripheral circuit design and assembly are all completed based on the transformer substrate, which simplifies the devices and electrical connections, unifies the manufacturing process, and greatly improves product consistency.

[0036] In summary, the power adapter with a planar integrated design is provided with structures such as A plate 1, B plate 5, E plate magnetic core 2, I plate magnetic core 3, partition frame 4, heat sink 6, etc., A plate 1 and B plate 5 are separate integrated modules, and the partition frame 4 separates the two. The two modules can be manufactured and tested separately using separate processes, which greatly simplifies the complexity of the process, improves the yield rate, facilitates automated production, has good product consistency, and is more cost-effective. The partition frame 4 separates the A plate 1 and the B plate 5, and the heat generated by the A plate 1 and the B plate 5 during operation is diffused outward through the heat sink 6 on the outside of each, reducing the heat transfer between the two, which is conducive to the rapid dissipation of heat in the power adapter.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flat integrated power adapter, characterized in that: The invention comprises an A plate (1) and a B plate (5), wherein an E-piece magnetic core (2) is fixedly connected to the inner side of the A plate (1), an I-piece magnetic core (3) is arranged on the outer side of the A plate (1), a partition frame (4) is arranged between the A plate (1) and the B plate (5), and heat sinks (6) are arranged on the outer sides of the A plate (1) and the B plate (5).

2. A flat integrated power adapter according to claim 1, characterized in that: A plurality of electronic components are arranged on the A plate (1) and the B plate (5), and a circular through hole and a slot are provided on the A plate (1).

3. A flat integrated power adapter according to claim 2, characterized in that: The E-sheet magnetic core (2) is adhered to the A-sheet (1) by epoxy glue, and the middle part of the E-sheet magnetic core (2) is inserted into the circular through hole of the A-sheet (1).

4. The flat integrated power adapter according to claim 3, characterized in that: The I-piece magnetic core (3) is fixedly connected to the E-piece magnetic core (2) via epoxy glue, and one end of the B plate (5) is fixedly connected with an insert.

5. The flat integrated power adapter according to claim 4, characterized in that: The insert at the end of the B plate (5) is inserted into the A plate (1) and welded at the connection position, and the two sides of the partition frame (4) are respectively provided with clamping positions corresponding to the A plate (1) and the B plate (5).

6. The flat integrated power adapter according to claim 5, characterized in that: A grounding wire is welded on the B plate (5), and there are a plurality of heat sinks (6).

7. The flat integrated power adapter according to claim 6, characterized in that: A plurality of the heat sinks (6) are provided with latching positions adapted to the A plate (1) and the B plate (5).

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