Manufacturing method of circuit board assembly and circuit board assembly

Abstract

The invention provides a manufacturing method of a circuit board assembly, and the method comprises the steps: providing a first circuit substrate which comprises a first circuit layer and a dielectric layer, the first circuit layer comprises a cooling region, the cooling region is recessed towards the dielectric layer, and the cooling region is provided with a groove; providing a second circuit substrate; providing a first adhesive layer which is provided with an opening; laminating and pressing the first circuit substrate, the first adhesive layer and the second circuit substrate, wherein the cooling area is exposed out of the opening; forming a through hole which penetrates through the second circuit substrate and is communicated with the opening; cooling liquid is injected into the groove, and heat-conducting glue is bonded to the periphery of the cooling area; and placing an electronic component in the through hole, and bonding the electronic component with heat-conducting glue to seal the opening. The invention also provides a circuit board assembly with a good heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a method for manufacturing a circuit board assembly and a circuit board assembly. Background Art

[0002] The chip (CMOS) of the camera module is usually embedded in the circuit board. When the camera module is working, the chip will generate heat. The circuit board itself or the metal reinforcement sheet can be used to conduct heat to dissipate heat. The above structure has a large thermal resistance and a small contact area, resulting in poor heat dissipation performance. It is also possible to use a copper column plus coolant to achieve heat dissipation, but the existing manufacturing process is complicated and the production feasibility is low. Summary of the invention

[0003] In view of this, it is necessary to provide a method for manufacturing a circuit board assembly that is simple to manufacture and can achieve rapid heat dissipation, and a circuit board assembly.

[0004] The present application provides a method for manufacturing a circuit board assembly, comprising providing a first circuit substrate, comprising a first circuit layer and a dielectric layer, the first circuit layer comprising a cooling zone, the cooling zone being recessed toward the dielectric layer, and the cooling zone being provided with a groove; providing a second circuit substrate; providing a first adhesive layer, and providing an opening; stacking and pressing the first circuit substrate, the first adhesive layer, and the second circuit substrate, with the cooling zone exposed to the opening; forming a through hole that penetrates the second circuit substrate and is connected to the opening; injecting a coolant into the groove, and bonding a thermal conductive adhesive to the periphery of the cooling zone; placing an electronic component in the through hole, and bonding the electronic component with the thermal conductive adhesive to seal the opening.

[0005] In some embodiments, the steps of making a first circuit substrate include: providing a double-sided copper-clad laminate, including a dielectric layer and a first copper layer and a second copper layer located on opposite surfaces of the dielectric layer; forming a blind hole on the first copper layer and the dielectric layer, with the second copper layer exposed to the blind hole; forming a metal layer in the blind hole, the metal layer also extending to the surface of the first copper layer at the periphery of the blind hole, and the metal layer is also connected to the second copper layer; and etching the first copper layer to form a first circuit layer.

[0006] In some embodiments, during the step of etching the first copper layer, the second copper layer is also etched to form a second circuit layer, and the second circuit layer is connected to the cooling zone.

[0007] In some embodiments, the cooling zone includes a receiving portion and a connecting portion, the receiving portion penetrates the dielectric layer, and the receiving portion is surrounded to form a groove; the connecting portion protrudes from the receiving portion along the direction in which the first circuit substrate extends, and the connecting portion is located on the surface of the dielectric layer facing the thermal conductive adhesive, and the thermal conductive adhesive bonds the connecting portion to the electronic component.

[0008] In some embodiments, before the lamination step, the manufacturing method further includes: providing an intermediate circuit substrate and a second adhesive layer; during the lamination step, laminating in a manner in which the first circuit substrate, the first adhesive layer, the intermediate circuit substrate, the second adhesive layer and the second circuit substrate are stacked.

[0009] The present application also provides a method for manufacturing a circuit board assembly, including: providing a first circuit substrate, including a first circuit layer, the first circuit layer including a cooling zone, and the cooling zone is provided with a groove; providing a first glue layer, and providing an opening; providing a second circuit substrate, and providing a through hole; laminating the first circuit substrate, the first glue layer, and the second circuit substrate in a stacked manner, with the cooling zone exposed to the opening, and the opening is connected to the through hole; injecting cooling liquid into the groove, and bonding thermal conductive glue to the periphery of the cooling zone; and placing electronic components in the through hole, and bonding the thermal conductive glue to the electronic components to seal the opening.

[0010] A circuit board assembly includes a first circuit substrate, a first adhesive layer, a cooling liquid, a thermally conductive adhesive and an electronic component. The first circuit substrate includes a first circuit layer and a dielectric layer. The first circuit layer includes a cooling zone and is recessed toward the dielectric layer. A groove is provided in the cooling zone. The first adhesive layer is located on a surface of the first circuit substrate. The first adhesive layer is provided with an opening. The cooling zone is accommodated in the opening and exposed to the opening. The cooling liquid is accommodated in the groove. The thermally conductive adhesive is arranged around the periphery of the cooling zone and bonded to the first adhesive layer. The electronic component is bonded to the thermally conductive adhesive and the opening is sealed.

[0011] In some embodiments, the cooling zone includes a receiving portion and a connecting portion, the receiving portion penetrates the dielectric layer, and the receiving portion is surrounded to form a groove; the connecting portion protrudes from the receiving portion along the direction in which the first circuit substrate extends, and the connecting portion is located on the surface of the dielectric layer facing the thermal conductive adhesive, and the thermal conductive adhesive bonds the connecting portion to the electronic component.

[0012] In some embodiments, the first circuit substrate further includes a second circuit layer, the second circuit layer is located on a surface of the dielectric layer away from the first circuit layer, and the receiving portion is further connected to the second circuit layer.

[0013] In some embodiments, the groove includes a plurality of connecting portions and a plurality of recessed portions, two adjacent recessed portions are connected via at least one connecting portion, and one connecting portion connects at least two recessed portions.

[0014] The manufacturing method of the circuit board assembly provided in the present application is highly feasible; by sealing the coolant in the circuit board assembly, and the inner wall used to contain the coolant is the first circuit layer with good thermal conductivity, the combination of the two can quickly transfer the heat generated by the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic cross-sectional view of a double-sided copper clad laminate provided in an embodiment of the present application.

[0016] Figure 2 For Figure 1 Schematic diagram of the cross section after blind vias are formed on the double-sided copper clad laminate.

[0017] Figure 3 For Figure 2 A cross-sectional schematic diagram of the cooling zone formed in and around the blind hole is shown.

[0018] Figure 4 A schematic top view of a cooling zone is provided for some embodiments.

[0019] Figure 5 A schematic cross-sectional view of an intermediate circuit substrate provided in an embodiment of the present application.

[0020] Figure 6 This is a schematic cross-sectional diagram of the first adhesive layer and the second adhesive layer provided in an embodiment of the present application.

[0021] Figure 7 It is a cross-sectional schematic diagram of an embodiment of the present application in which a first circuit substrate, a first adhesive layer, an intermediate circuit substrate, a second adhesive layer, and a second circuit substrate are arranged in this order.

[0022] Figure 8 For pressing Figure 7 Schematic cross-section of the structure shown.

[0023] Fig. 9 For Figure 8 The structure shown is a schematic cross-sectional view after the cover is opened.

[0024] Fig.10 For Fig. 9 Schematic diagram of the cross section after coolant is injected into the groove.

[0025] Fig.11 For Fig.10 A schematic cross-sectional view of a circuit board assembly obtained after electronic components are connected to the cooling area shown.

[0026] Main component symbols

[0027]

[0028] DETAILED DESCRIPTION

[0029] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0031] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0032] See also Figures 1 to 11 The present invention provides a method for manufacturing a circuit board assembly 100, which may include the following steps:

[0033] Step S1: Please refer to Figures 1 to 3 , providing a first circuit substrate 10 , the first circuit substrate 10 includes a first circuit layer 13 , the first circuit layer 13 includes a cooling area 132 , and the cooling area 132 is provided with a groove 134 .

[0034] The first circuit substrate 10 further includes a dielectric layer 11 and a second circuit layer 15 (see Fig. 9 ), the number of layers of the dielectric layer 11 and the first circuit layer 13 and the second circuit layer 15 can be one or more layers. In this embodiment, the number of layers of the dielectric layer 11 is one layer, and the first circuit layer 13 and the second circuit layer 15 are located on opposite sides of the dielectric layer 11 respectively.

[0035] Please also read Figure 4 The cooling area 132 includes a receiving portion 1321 and a connecting portion 1323. The receiving portion 1321 penetrates the dielectric layer 11 and is connected to the second circuit layer 15 (which can be combined with Fig. 9) is connected, the receiving portion 1321 is surrounded to form a groove 134; the connecting portion 1323 protrudes from the receiving portion 1321 along the extending direction of the first circuit substrate 10, and the connecting portion 1323 is located on the surface of the dielectric layer 11 away from the second circuit layer 15. The groove 134 includes a plurality of connecting portions 1341 and a plurality of recessed portions 1343, two adjacent recessed portions 1343 are connected through at least one connecting portion 1341, and one connecting portion 1341 is connected to at least two recessed portions 1343. Observing along the direction of the stacking of the first circuit substrate 10, the length of each recessed portion 1343 is greater than the length of the adjacent connecting portion 1341, and the width of each recessed portion 1343 is greater than the width of the adjacent connecting portion 1341. The recessed portion 1343 can facilitate the subsequent accommodation of a larger volume of cooling liquid 55, and the connecting portion 1341 is used to achieve the circulation of the cooling liquid 55 in different recessed portions 1343 to increase the speed of heat conduction; in addition, the structural arrangement of multiple recessed portions 1343 and multiple connecting portions 1341 is also conducive to increasing the connection area between the cooling liquid 55 and the inner wall of the accommodating portion 1321 to further increase the rate of heat conduction.

[0036] In this embodiment, the method for manufacturing the first circuit substrate 10 may include the following steps:

[0037] Step S11: Please refer to Figure 1 , providing a double-sided copper-clad board 17 , including a dielectric layer 11 and a first copper layer 171 and a second copper layer 173 located on two opposite surfaces of the dielectric layer 11 .

[0038] Step S12: Please refer to Figure 2 A blind hole 175 is formed on the first copper layer 171 and the dielectric layer 11 , and the second copper layer 173 is exposed in the blind hole 175 .

[0039] The blind via 175 penetrates the first copper layer 171 and the dielectric layer 11 .

[0040] Step S13: Please refer to Figure 3 , a metal layer 177 is formed in the blind hole 175 , and the metal layer 177 also extends to the surface of the first copper layer 171 at the periphery of the blind hole 175 ; and the first copper layer 171 is subjected to circuit fabrication to form a first circuit layer 13 .

[0041] The metal layer 177 covers the peripheral wall of the blind hole 175 and is connected to the surface of the first copper layer 171 located outside the blind hole 175 ; the metal layer 177 is also connected to the second copper layer 173 exposed to the blind hole 175 .

[0042] The metal layer 177 is a part of the first circuit layer 13 . The metal layer 177 located on the peripheral wall of the blind hole 175 forms a receiving portion 1321 . The metal layer 177 located outside the blind hole 175 and the first copper layer 171 form a connecting portion 1323 .

[0043] During the circuit manufacturing process, the second copper layer 173 may also be subjected to circuit manufacturing to form a second circuit layer 15 . In some embodiments, the step of forming the second circuit layer 15 may also be performed in a subsequent process.

[0044] In other embodiments, the manufacturing method of the first circuit substrate 10 is not limited to the above steps.

[0045] Step S2: Please refer to Figure 5 , providing an intermediate circuit substrate 20.

[0046] In some embodiments, the intermediate circuit substrate 20 may include an intermediate dielectric layer 21, an intermediate circuit layer 23 and a covering layer 25. The intermediate dielectric layer 21 and the intermediate circuit layer 23 are stacked, and the covering layer 25 covers a portion of the surface of the intermediate circuit layer 23 and / or the intermediate dielectric layer 21. The covering layer 25 is located on the outer surface of the intermediate circuit substrate 20.

[0047] Step S3: Please refer to Figure 6 , providing a first adhesive layer 30 and a second adhesive layer 35 , and the first adhesive layer 30 is provided with an opening 31 .

[0048] In some embodiments, the intermediate circuit substrate 20 and the second adhesive layer 35 may be omitted according to the actual number of circuit layers required, or other circuit substrates and corresponding adhesive layers may be added.

[0049] Step S4: Please refer to Figure 7 , providing a second circuit substrate 40.

[0050] The number of dielectric layers 11 and circuit layers in the second circuit substrate 40 is not limited.

[0051] Step S5: Please refer again Figure 7 and Figure 8 The first circuit substrate 10, the first adhesive layer 30, the intermediate circuit substrate 20, the second adhesive layer 35, and the second circuit substrate 40 are stacked and pressed.

[0052] The first adhesive layer 30 bonds the first circuit substrate 10 and the middle circuit substrate 20 . The cooling area 132 is exposed to the opening 31 , and the first adhesive layer 30 surrounds the periphery of the cooling area 132 and is connected to the cooling area 132 .

[0053] Along the direction in which each circuit substrate and adhesive layer are stacked, the thickness of the first adhesive layer 30 is greater than the thickness of the connecting portion 1323 protruding from the dielectric layer 11 , so that after lamination, the intermediate circuit substrate 20 and the connecting portion 1323 are spaced apart.

[0054] The first adhesive layer 30 and the second adhesive layer 35 are further provided with grooves 352 , which are arranged corresponding to the cover layer 25 of the intermediate circuit substrate 20 . The first adhesive layer 30 and the second adhesive layer 35 respectively cover the peripheral area of ​​the cover layer 25 , and the uncovered parts are respectively exposed to the second adhesive layer 35 .

[0055] Step S6: Please refer to Fig. 9 , the cover is opened to form a through hole 50 that penetrates the second circuit substrate 40 , the second adhesive layer 35 , and the intermediate circuit substrate 20 , and the through hole 50 is connected to the opening 31 to expose the cooling area 132 .

[0056] Before or after the step of forming the through hole 50 , the manufacturing method further includes the step of forming a conductive hole 45 , where the conductive hole 45 is used to electrically connect two adjacent circuit substrates.

[0057] During the uncovering process, the second circuit substrate 40 , the second adhesive layer 35 , the first adhesive layer 30 , and the area of ​​the first circuit substrate 10 corresponding to the groove 352 are also removed to expose the cover layer 25 .

[0058] Step S7: Please refer to Fig.10 , coolant 55 is injected into the groove 134 .

[0059] The cooling liquid 55 is contained in the receiving portion 1321. The cooling liquid 55 may be made of water, thermal oil, ammonia water, etc.

[0060] Step S8: Please refer to Fig.11 , a thermal conductive adhesive 60 is bonded to the periphery of the cooling area 132 , an electronic component 70 is placed in the through hole 50 , and the thermal conductive adhesive 60 is bonded to the electronic component 70 to seal the opening 31 , thereby obtaining the circuit board assembly 100 .

[0061] The heat conductive adhesive 60 is disposed in an annular shape on the surface of the cooling zone 132 away from the first circuit substrate 10 and adheres to the connecting portion 1323. In some embodiments, the heat conductive adhesive 60 can be further disposed on the surface of the connecting portion 1323 located in the middle area.

[0062] The electronic components 70 and the cooling area 132 are bonded to two opposite surfaces of the thermal conductive adhesive 60 , and the side surface of the thermal conductive adhesive 60 is also connected to the first adhesive layer 30 to seal the cooling liquid 55 in a closed space.

[0063] The surface of the electronic component 70 with pins (not shown) is disposed away from the coolant 55, and the electronic component 70 can be electrically connected to the second circuit substrate 40. The electronic component 70 can be any component that generates heat during operation, including but not limited to chips, resistors, etc.

[0064] In the circuit board assembly 100 manufactured in the embodiment of the present application, the heat generated by the electronic component 70 can be quickly conducted outward through the thermal conductive adhesive 60, the thermal conductive part, and the coolant 55. The circuit board assembly 100 is manufactured by adopting the above manufacturing method. First, a cooling area 132 for accommodating the coolant 55 is formed on the first circuit substrate 10, and then the circuit substrates are pressed, opened, and filled with the coolant 55. This method is suitable for manufacturing thicker circuit board assemblies 100 and thinner circuit board assemblies 100, and has high production feasibility.

[0065] The side surface of the electronic component 70 is connected to the intermediate circuit substrate 20 , and the heat generated by the electronic component 70 can also be conducted outward through the intermediate circuit layer 23 in the intermediate circuit substrate 20 .

[0066] Some other embodiments of the present application also provide a method for manufacturing a circuit board assembly 100, which differs from the manufacturing method of the previous embodiment in that: the circuit substrate and the adhesive layer corresponding to the cooling area 132 may be opened first, and then a pressing process step may be performed, for example, through holes (not shown) may be formed on the intermediate circuit substrate 20, the second adhesive layer 35, and the second circuit substrate 40, respectively, and then pressed, and the cooling area 132 is exposed to the through holes. Other steps may be the same as those of the previous embodiment, and will not be repeated here.

[0067] Please refer again Fig.11 The present application also provides a circuit board assembly 100, which can be manufactured by the above manufacturing method. The circuit board assembly 100 includes a first circuit substrate 10, a first adhesive layer 30, an intermediate circuit substrate 20, a second adhesive layer 35, a second circuit substrate 40, a coolant 55, a thermally conductive adhesive 60, and an electronic component 70. The first circuit substrate 10, the first adhesive layer 30, the intermediate circuit substrate 20, the second adhesive layer 35, and the second circuit substrate 40 are stacked, and the coolant 55 is sealed between the first circuit substrate 10 and the electronic component 70.

[0068] The first circuit substrate 10 includes a dielectric layer 11 and a first circuit layer 13 and a second circuit layer 15 located on two opposite surfaces of the dielectric layer 11. The first circuit layer 13 includes a cooling area 132, and the cooling area 132 is provided with a groove 134, and the coolant 55 is contained in the groove 134. The first adhesive layer 30 is located on the surface of the first circuit layer 13 away from the second circuit layer 15, and the first adhesive layer 30 is provided with an opening 31, and the opening 31 is surrounded by the cooling area 132. The heat conductive adhesive 60 is in the shape of an annular cooling area 132 away from the surface of the first circuit substrate 10 and is bonded to the electronic component 70 to seal the groove 134.

[0069] The cooling area 132 includes a receiving portion 1321 and a connecting portion 1323. The receiving portion 1321 penetrates the dielectric layer 11 and is connected to the second circuit layer 15. The receiving portion 1321 is surrounded by a groove 134. The connecting portion 1323 protrudes from the receiving portion 1321 along the direction in which the first circuit substrate 10 extends. The connecting portion 1323 is located on the surface of the dielectric layer 11 away from the second circuit substrate 40. Please refer to Figure 4 The groove 134 includes a plurality of connecting parts 1341 and a plurality of recessed parts 1343. Two adjacent recessed parts 1343 are connected through at least one connecting part 1341. One connecting part 1341 connects at least two recessed parts 1343. The recessed part 1343 is used to accommodate a larger volume of the cooling liquid 55. The connecting part 1341 is used to realize the circulation of the cooling liquid 55 in different recessed parts 1343. The heat generated by the electronic component 70 can be quickly transferred through the thermal conductive adhesive 60, the cooling area 132, and the cooling liquid 55, and diffused outward through the second circuit layer 15 connected to the cooling area 132.

[0070] The side of the electronic component 70 is connected to the first adhesive layer 30 and the intermediate circuit substrate 20, and can be further connected to the second adhesive layer 35. The part where the electronic component 70 is connected to the intermediate circuit substrate 20 can further play a role in rapid heat conduction.

[0071] The first circuit substrate 10 and the intermediate circuit substrate 20, and the intermediate circuit substrate 20 and the second circuit substrate 40 can be electrically connected through the conductive vias 45. The conductive vias 45 can also further play a role in heat conduction.

[0072] The manufacturing method of the circuit board assembly 100 provided in the present application is highly feasible; by sealing the coolant 55 in the circuit board assembly 100, and the inner wall used to contain the coolant 55 is the first circuit layer 13 with good thermal conductivity, the combination of the two can quickly transfer the heat generated by the electronic component 70.

[0073] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that: include: Providing a first circuit substrate, comprising a first circuit layer and a dielectric layer, wherein the first circuit layer comprises a cooling zone, the cooling zone is recessed toward the dielectric layer, and a groove is formed in the cooling zone; providing a second circuit substrate; Providing a first adhesive layer having an opening; The first circuit substrate, the first adhesive layer and the second circuit substrate are stacked and pressed together, and the cooling area is exposed to the opening; forming a through hole penetrating the second circuit substrate and communicating with the opening; Injecting cooling liquid into the groove and bonding thermal conductive glue to the periphery of the cooling zone; as well as An electronic component is placed in the through hole, and the thermal conductive adhesive is bonded to the electronic component to seal the opening.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: The steps of manufacturing the first circuit substrate include: Providing a double-sided copper-clad laminate, comprising a dielectric layer and a first copper layer and a second copper layer located on two opposite surfaces of the dielectric layer; forming a blind hole on the first copper layer and the dielectric layer, wherein the second copper layer is exposed to the blind hole; forming a metal layer in the blind hole, wherein the metal layer further extends to the surface of the first copper layer at the periphery of the blind hole, and the metal layer further connects to the second copper layer; and The first copper layer is etched to form the first circuit layer.

3. The method for manufacturing a circuit board assembly according to claim 2, characterized in that: In the step of etching the first copper layer, the second copper layer is also etched to form a second circuit layer, and the second circuit layer is connected to the cooling zone.

4. The method for manufacturing a circuit board assembly according to any one of claims 1 to 3, characterized in that: The cooling zone includes a receiving portion and a connecting portion, the receiving portion penetrates the dielectric layer, and the receiving portion is surrounded to form the groove; the connecting portion protrudes from the receiving portion along the direction in which the first circuit substrate extends, and the connecting portion is located on the surface of the dielectric layer facing the thermal conductive adhesive, and the thermal conductive adhesive bonds the connecting portion to the electronic component.

5. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: Before the pressing step, the manufacturing method further comprises: Providing an intermediate circuit substrate and a second adhesive layer; In the lamination step, the first circuit substrate, the first adhesive layer, the intermediate circuit substrate, the second adhesive layer and the second circuit substrate are laminated and laminated.

6. A method for manufacturing a circuit board assembly, characterized in that: include: Providing a first circuit substrate, including a first circuit layer, wherein the first circuit layer includes a cooling area, and the cooling area is provided with a groove; Providing a first adhesive layer having an opening; Providing a second circuit substrate with a through hole; The first circuit substrate, the first adhesive layer, and the second circuit substrate are laminated and pressed together, the cooling area is exposed to the opening, and the opening is connected to the through hole; Injecting cooling liquid into the groove and bonding thermal conductive glue to the periphery of the cooling zone; as well as An electronic component is placed in the through hole, and the thermal conductive adhesive is bonded to the electronic component to seal the opening.

7. A circuit board assembly, characterized in that: include: A first circuit substrate, comprising a first circuit layer and a dielectric layer, wherein the first circuit layer comprises a cooling zone and is recessed toward the dielectric layer, and the cooling zone is provided with a groove; A first adhesive layer is located on a surface of the first circuit substrate, the first adhesive layer is provided with an opening, and the cooling area is accommodated in the opening and exposed to the opening; A coolant is contained in the groove; Thermally conductive adhesive, disposed around the periphery of the cooling zone and bonded to the first adhesive layer; and The electronic component is bonded with the thermal conductive adhesive and the opening is sealed.

8. The circuit board assembly according to claim 7, characterized in that: The cooling zone includes a receiving portion and a connecting portion, the receiving portion penetrates the dielectric layer, and the receiving portion is surrounded to form the groove; the connecting portion protrudes from the receiving portion along the direction in which the first circuit substrate extends, and the connecting portion is located on the surface of the dielectric layer facing the thermal conductive adhesive, and the thermal conductive adhesive bonds the connecting portion to the electronic component.

9. The circuit board assembly according to claim 8, characterized in that: The first circuit substrate further includes a second circuit layer, the second circuit layer is located on a surface of the dielectric layer away from the first circuit layer, and the receiving portion is further connected to the second circuit layer.

10. The circuit board assembly according to claim 8 or 9, characterized in that: The groove includes a plurality of connecting parts and a plurality of recessed parts. Two adjacent recessed parts are connected through at least one connecting part, and one connecting part connects at least two recessed parts.

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