Manufacturing method of laminated substrate and laminated substrate

Abstract

The embodiment of the invention discloses a manufacturing method of a laminated substrate and a laminated substrate, relates to the field of laminated substrates, and can improve the alignment precision of the laminated substrate. The manufacturing method of the laminated substrate comprises the following steps: providing a substrate with a frame; and forming a plurality of positioning holes in different areas of the substrate with the frame. Placing the substrate with the frame on the bottom plate; a plurality of positioning rods are arranged on the bottom plate, and one positioning rod penetrates through one positioning hole. And removing the frame of the substrate, and fixing the substrate on the bottom plate.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of laminated substrates, and relate to but are not limited to a method for manufacturing a laminated substrate and a laminated substrate. Background Art

[0002] In the process of manufacturing laminated substrates with multi-layer wiring, mechanical or laser drilling, through-hole metallization, conductor printing, lamination, pressing and sintering processes are used to realize the manufacture of laminated substrates. The lamination process is a process that requires very high precision. However, in the process of laminating multiple substrates, the shrinkage and deformation of the substrates will have a serious impact on the alignment accuracy between the multiple substrates, reducing the yield of the laminated substrates. Summary of the invention

[0003] In view of this, embodiments of the present application provide a method for manufacturing a laminated substrate and a laminated substrate to solve at least one problem existing in the prior art.

[0004] The technical solution of the embodiment of the present application is implemented as follows:

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a laminated substrate. The manufacturing method comprises: providing a substrate with a frame. Forming a plurality of positioning holes on different regions of the substrate with a frame. Placing the substrate with a frame on a bottom plate; a plurality of positioning rods are provided on the bottom plate, and one positioning rod passes through one positioning hole. Removing the frame of the substrate, and fixing the substrate on the bottom plate.

[0006] In some examples, removing the frame of the substrate and fixing the substrate on the bottom plate includes: pressing the substrate with the frame on the bottom plate; the frame is disposed on a side surface of the substrate and surrounds the side edge of the substrate; the side edge of the substrate and the frame are fixedly connected by an adhesive layer. Pressing the frame on a side surface of the substrate, removing the adhesive layer, and separating the substrate from the frame. Removing the frame, pressing the substrate and fixing it on the bottom plate.

[0007] In some examples, forming a plurality of positioning holes on different regions of the substrate having a frame includes: the substrate includes a circuit setting region and an edge region surrounding the circuit setting region. A plurality of first positioning holes are formed in the edge region. At least one second positioning hole is formed in the circuit setting region; and at least one positioning rod passes through the at least one second positioning hole.

[0008] In some examples, forming a plurality of positioning holes on different regions of the substrate having a frame includes: forming the first positioning hole having an opening size of a first size, and forming the second positioning hole having an opening size of a second size, wherein the first size is greater than or equal to the second size.

[0009] In some examples, forming a plurality of positioning holes on different regions of the substrate having a frame includes: forming a plurality of second positioning holes within a unit area of ​​the circuit setting region. Forming a plurality of first positioning holes within a unit area of ​​the edge region. The distribution density of the plurality of first positioning holes is greater than the distribution density of the plurality of second positioning holes.

[0010] In some examples, a plurality of positioning holes are formed on different areas of the substrate having a frame, including a plurality of positioning holes disposed in the circuit setting area, wherein the spacing between two adjacent positioning holes is equal; and / or a plurality of positioning holes disposed in the edge area, wherein the spacing between two adjacent positioning holes is equal.

[0011] In some examples, a plurality of positioning holes are formed on different regions of the substrate having a frame, including: the size of the positioning holes is formed to be larger than the diameter of the positioning rods on the bottom plate, and the difference between the two is 15 micrometers to 20 micrometers.

[0012] In some examples, forming a plurality of positioning holes on different regions of the substrate having a frame includes forming the positioning holes having the same cross-sectional shape as the corresponding positioning rods on the bottom plate along a direction perpendicular to the length of the positioning rods.

[0013] Placing the substrate with the frame on the bottom plate comprises: placing the substrate with the frame on the bottom plate along an angle at which the edge of the positioning hole is parallel to the side wall of the positioning rod.

[0014] In some examples, removing the frame of the substrate and fixing the substrate on the bottom plate includes: removing the frame of the first substrate placed on the bottom plate and fixing the first substrate on the bottom plate. Removing the frame of the second substrate placed on the bottom plate and fixing the second substrate on the first substrate. Removing the frame of the Nth substrate placed on the bottom plate and fixing the Nth substrate on the N-1th substrate. Pressing the N substrates on the bottom plate to form a stacked substrate; N is a positive integer greater than 1.

[0015] In some examples, removing the border of the substrate and fixing the substrate on the bottom plate includes: fixing a plurality of the substrates on the bottom plate in sequence, wherein the pressure for fixing different substrates decreases as the number of stacked substrates increases.

[0016] In a second aspect, an embodiment of the present application provides a laminated substrate design, which uses a laminated substrate manufactured as in any of the examples above.

[0017] In the embodiment of the present application, a method for manufacturing a laminated substrate and a laminated substrate are provided. After placing a substrate with a frame on a bottom plate, the frame is removed to reduce the large deformation of the substrate caused by the frame removal operation, thereby reducing the adverse effect of the deformation of the substrate on the alignment accuracy of multiple substrates. The position and number of positioning holes are set, the structural relationship between the positioning holes and the positioning rods on the bottom plate, and the pressure acting on the substrate are used to further improve the alignment accuracy of multiple substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 1 ;

[0019] Figure 2 Schematic diagram of the structure of the substrate provided for the implementation of this application Figure 1 ;

[0020] Figure 3 A schematic diagram of the structure of the base plate provided for the implementation of this application;

[0021] Figure 4 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 2 ;

[0022] Figure 5 Schematic diagram of the frame structure of the substrate provided for the implementation of this application Figure 1 ;

[0023] Figure 6 Schematic diagram of the frame structure of the substrate provided for the implementation of this application Figure 2 ;

[0024] Figure 7 (a)~ Figure 7 (d) is a schematic diagram of a process flow of a method for manufacturing a laminated substrate provided by the present application;

[0025] Figure 8 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 3 ;

[0026] Fig. 9 Schematic diagram of the structure of the substrate provided for the implementation of this application Figure 2 ;

[0027] Fig.10 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 4 ;

[0028] Fig.11 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 5 ;

[0029] Fig.12 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 6 ;

[0030] Fig.13 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 7 ;

[0031] Fig.14 Schematic diagram of the process of manufacturing the laminated substrate provided for the implementation of this application Figure 8 ;

[0032] Fig.15 A schematic diagram of the partial structure of a laminate substrate provided for the implementation of the present application. DETAILED DESCRIPTION

[0033] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.

[0034] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0035] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0036] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers.

[0037] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part. When the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has a first element, component, region, layer or part.

[0038] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0039] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0041] In the related art, a lamination process is used to stack and press a plurality of raw ceramic sheets with through holes and printed circuits to form a laminated substrate. Among them, the alignment accuracy of the plurality of raw ceramic sheets during the lamination process and the electrical connection performance of the circuit on a laminated substrate affect the yield of the laminated substrate.

[0042] For example, during the lamination process of multiple raw ceramic sheets, after the multiple raw ceramic sheets are stacked on the bottom plate, a laminating machine is used to perform pressure lamination to fix and connect the multiple raw ceramic sheets together. In this way, misalignment will occur between the multiple raw ceramic sheets, especially under the action of pressure, which will cause the degree of misalignment to increase, and the alignment accuracy of the multiple raw ceramic sheets will decrease. Alternatively, due to the small number of positioning pins on the bottom plate and the large spacing, the positioning pins play a small positioning role in the process of fixing the raw ceramic sheets on the bottom plate, especially the positioning pins are only set at the edge area of ​​the raw ceramic sheet, and the deformation amount of the stress area on the raw ceramic sheet (the circuit center dense area in the center area of ​​the raw ceramic sheet or the area with large tearing force of the rubber layer) is large, and multiple raw ceramic sheets have the problem of poor alignment accuracy. For example, the misalignment distance of the side wall edge on the same side of the alignment hole of multiple stacked raw ceramic sheets is 35 microns to 70 microns, and the difference in the misalignment size of different alignment holes is large, which indicates that the surface is uneven on the entire laminated substrate.

[0043] In order to solve the above problems, the present application provides a method for manufacturing a laminated substrate. Figure 1 As shown, the manufacturing method includes S100 to S400.

[0044] S100: Figure 2 As shown, a substrate 100 having a frame 110 is provided.

[0045] The frame 110 is used to fix the substrate 100, which can reduce the adverse effects of the operation process of making positioning holes and circuit lines on the substrate 100 on the structural stability of the substrate 100, reduce the deformation degree of the substrate 100, improve the structural stability of the substrate 100, and improve the alignment accuracy of multiple substrates 100.

[0046] For example, the material of the frame 110 may include stainless steel. The substrate 100 may include a green ceramic sheet.

[0047] S200: forming a plurality of positioning holes 120 on different regions of the substrate 100 having the frame 110 (see Figure 2 ).

[0048] For example, the positioning holes 120 can be arranged in different areas of the substrate 100 according to requirements, which will be described in detail in the following examples. For example, nine positioning holes 120 are formed in different areas on the substrate 100 .

[0049] The opening shape of the positioning hole 120 may include one or more shapes such as a circle, a rectangle, and an arc, and may be shaped according to the positioning rod (e.g. Figure 3 The structural arrangement of the positioning rod 210 on the midsole plate 200 is not specifically limited here.

[0050] It is understandable that the substrate 100 with the frame 110 is placed on the bottom plate 200, and the frame 110 may also be provided with a plurality of through holes for the positioning rods 210 on the bottom plate 200 to pass through. For example, when the frame 110 covers the entire surface of one side of the substrate 100, in the process of forming the positioning holes 120 on the substrate 100 with the frame 110, through holes corresponding to the positioning holes 120 are also formed on one surface where the frame 110 and the substrate 100 overlap.

[0051] In addition, the frame 110 may only extend from the edge area of ​​one side surface of the substrate 100 (for providing a force bearing surface for bearing the force of pressing the substrate 100 on the bottom plate 200) to the side edge of the substrate 100, and is an annular structure, and does not overlap with the setting area of ​​the positioning hole 120, and the frame 110 may not need to be provided with a through hole corresponding to the positioning hole 120. This application does not make specific restrictions on this, and it can be selected according to actual needs.

[0052] S300: placing the substrate 100 having the frame 110 on the bottom plate 200. Figure 2 and Figure 3 As shown, a plurality of positioning rods 210 are disposed on the bottom plate 200 , and one positioning rod 210 passes through one positioning hole 120 .

[0053] For example, the positioning rods 210 and the positioning holes 120 may correspond one to one. It is understandable that there must be a corresponding positioning hole 120 if there is a positioning rod 210, and there may not be a positioning rod 210 passing through the positioning hole 120, as long as the substrate 100 with the frame 110 can be stably placed on the bottom plate 200.

[0054] S400 : removing the frame 110 of the substrate 100 and fixing the substrate 100 on the bottom plate 200 .

[0055] For example, after the substrate 100 with the frame 110 is stably placed on the bottom plate 200, the frame 110 is removed. Even if the substrate 100 is deformed, the deformation of the substrate 100 can be reduced based on the positioning effect (i.e., traction) of the positioning rods 210. Then, the substrate 100 is fixed on the bottom plate 200, so that in the process of stacking multiple substrates 100, the probability of the subsequent substrate 100 being placed unsteadily due to the movement of the previously placed substrate 100 is reduced.

[0056] In the above manufacturing method, after placing the substrate 100 with the frame 110 on the bottom plate 200, the frame 110 is removed to reduce the large deformation of the substrate 100 caused by the removal of the frame 110, thereby reducing the adverse effect of the deformation of the substrate 100 on the alignment accuracy between multiple substrates 100.

[0057] In some examples, such as Figure 4As shown, step S400: removing the frame 110 of the substrate 100 and fixing the substrate 100 on the bottom plate 200, including S410-S430.

[0058] S410: Press the substrate 100 with the frame 110 onto the bottom plate 200. Figure 2 As shown, the frame 110 is disposed on one side surface of the substrate 100 and surrounds the side edge of the substrate 100 ; the side edge of the substrate 100 and the frame 110 are fixedly connected via an adhesive layer 130 .

[0059] For example, Figure 5 As shown, the frame 110 covers an entire side of the substrate 100 and extends to the side edge of the substrate 100, and the adhesive layer 130 is disposed between the side edge of the substrate 100 and the frame 110. The overlapping area of ​​the frame 110 and the surface of one side of the substrate 100 is pressed so that the substrate 100 is pressed evenly on the bottom plate 200.

[0060] Or, if Figure 6 As shown, the frame 110 is located at the edge area of ​​one side surface of the substrate 100 and extends to the side edge of the substrate 100 (i.e., the cross-sectional figure along the thickness direction of the substrate 100 is "L" shaped), and the adhesive layer 130 is arranged between the side edge of the substrate 100 and the frame 110. The area where the frame 110 overlaps with the surface of one side of the substrate 100 is pressed so that the substrate 100 is uniformly pressed on the bottom plate 200. The example provided in this application does not limit the position of the specific receiving point of the force applied to the area where the frame 110 overlaps with the surface of one side of the substrate 100.

[0061] S420 : pressing the frame 110 located on one side surface of the substrate 100 , removing the adhesive layer 130 , and separating the substrate 100 from the frame 110 .

[0062] For example, Figure 5 and Figure 6 As shown, the frame 110 located on one side of the substrate 100 is pressed, and the frame 110 and the substrate 100 will not move, so that in the process of tearing off the adhesive layer 130 (see Figure 7 In (b)), the force of pressing the substrate 100 can reduce the influence of the force of tearing the adhesive layer 130 on the structure of the substrate 100, and reduce the probability of the substrate 100 being deformed to a large extent.

[0063] S430 : removing the frame 110 , applying pressure to the substrate 100 and fixing it on the bottom plate 200 .

[0064] For example, Figure 7 (b) and Figure 7As shown in (c), after the adhesive layer 130 is removed, a gap is generated between the substrate 100 and the frame 110. The operation of removing the frame 110 will not affect the structure of the substrate 100, and the substrate 100 will not be deformed. Then, the substrate 100 is fixed on the bottom plate 200 so that the substrate 100 does not move relative to the bottom plate 200, providing a stable surface for the subsequent stacking of multiple substrates 100.

[0065] In some examples, step S400: removing the frame 110 of the substrate 100 and fixing the substrate 100 on the bottom plate 200 includes:

[0066] like Figure 7 (a)~ Figure 7 As shown in (c) , the frame 110 of the first substrate 100 placed on the bottom plate 200 is removed, and the first substrate 100 is fixed on the bottom plate 200 .

[0067] like Figure 7 As shown in (d) in FIG. 1 , the frame 110 of the second substrate 100 placed on the bottom plate 200 is removed, and the second substrate 100 is fixed on the first substrate 100 .

[0068] The frame 110 of the Nth substrate 100 placed on the bottom plate 200 is removed, and the Nth substrate 100 is fixed on the N−1th substrate 100 .

[0069] N substrates 100 are pressed onto the bottom plate 200 to form a stacked substrate 300; N is a positive integer greater than 1.

[0070] In the process of stacking the multiple substrates 100 on the bottom plate 200, each substrate 100 is pressed and fixed respectively, so as to provide a stable and flat surface for the subsequently stacked substrates 100. After stacking the multiple substrates 100, a force is applied to press the multiple substrates 100 tightly together. Compared with the method of applying a force to the multiple substrates 100 to fix the multiple substrates 100 at the same time after placing the multiple substrates 100 on the bottom plate 200, the means provided in the present application can reduce the degree of misalignment between the multiple substrates 100 and improve the alignment accuracy between the multiple substrates 100.

[0071] In some examples, step S400: removing the frame 110 of the substrate 100 and fixing the substrate 100 on the bottom plate 200 includes: fixing multiple substrates 100 on the bottom plate 200 in sequence, and the pressure for fixing different substrates 100 decreases as the number of stacked substrates 100 increases.

[0072] Considering that as the number of stacked substrates 100 increases, the force applied to the bottom substrate 100 is greater than that applied to the top substrate 100, in order to reduce the adverse effect of the deformation of the previous substrate 100 during the process of fixing the substrate 100, for example, the pressure applied to the top substrate 100 can be reduced by 0.5 MPa for every 3 to 5 layers of stacked substrates 100. This is conducive to improving the alignment accuracy of the positioning holes 120 of the multiple substrates 100.

[0073] In some examples, such as Figure 8 As shown, step S200: forming a plurality of positioning holes 120 on different areas of a substrate 100 having a frame 110, including S210 and S220.

[0074] like Figure 2 and Fig. 9 As shown, the substrate 100 includes a circuit arrangement area 101 and an edge area 102 surrounding the circuit arrangement area 101. The circuit arrangement area 101 is an area where a circuit line is arranged, and the edge area 102 is an annular area surrounding the circuit arrangement area 101 where no circuit line is arranged.

[0075] S210 : forming a plurality of first positioning holes 121 in the edge region 102 .

[0076] S220 : forming at least one second positioning hole 122 in the circuit arrangement area 101 . At least one positioning rod 210 passes through the at least one second positioning hole 122 .

[0077] For example, a plurality of first positioning holes 121 are formed in the edge area 102, and at least one second positioning hole 122 is formed in the circuit setting area 101, so that different areas of the substrate 100 can be positioned and the difference in deformation degree of different areas of the substrate 100 can be reduced, which is beneficial to improving the stability of the structure of the substrate 100 and improving the alignment accuracy of multiple substrates 100.

[0078] The number and distribution positions of the second positioning holes 122 in the circuit setting area 101 can be adjusted according to the circuit structure to be designed later. Figure 2 As shown, a second positioning hole 122 is formed in the circuit arrangement area 101. Alternatively, as Fig. 9 As shown, five second positioning holes 122 are formed in the circuit arrangement area 101 .

[0079] It should be noted that the first positioning hole 121 and the second positioning hole 122 are used to distinguish the positioning holes 120 set in different areas of the substrate 100, and do not limit the two positioning holes 120 to have different structures. The first positioning hole 121 and the second positioning hole 122 can be formed in two separate steps, or can be formed in one step using different laser energies. The example provided in this application does not specifically limit the order of the steps of forming the first positioning hole 121 and the second positioning hole 122.

[0080] In some examples, such as Fig.10 As shown, step S200: forming a plurality of positioning holes 120 on different areas of a substrate 100 having a frame 110, including S211 and S221.

[0081] S211: Fig. 9 As shown, a first positioning hole 121 with an opening size of a first size L1 is formed.

[0082] S221: Fig. 9 As shown, a second positioning hole 122 with an opening size of a second size L2 is formed. Wherein, the first size L1 is greater than or equal to the second size L2.

[0083] It is understandable that "opening size" may refer to the diameter of the opening. For example, if the opening shape is circular, the opening size may refer to the diameter of the circle; or, if the opening shape is rectangular, the opening size may refer to the diagonal or side length of the rectangle. The opening sizes of the first positioning hole 121 and the second positioning hole 122 may be compared using the same parameter type.

[0084] For examples, see Fig. 9 The opening shapes of the first positioning hole 121 and the second positioning hole 122 may both be squares, and the opening sizes of the two may refer to the side lengths of the squares. The side length of the first positioning hole 121 formed is the first size L1, and the side length of the second positioning hole 122 formed is the second size L2.

[0085] Lasers with different energies or etching times may be used to etch the substrate 100 to form the first positioning holes 121 and the second positioning holes 122 with different opening sizes.

[0086] In this way, the first positioning hole 121 having the first size L1 can eliminate some stress and reduce the degree of deformation of the circuit setting area 101, and the second positioning hole 122 can also eliminate some stress and reduce the degree of deformation of the circuit setting area 101. The size of the first positioning hole 121 can be equal to the size of the second positioning hole 122.

[0087] Alternatively, the size of the first positioning hole 121 is further set to be larger than the size of the second positioning hole 122, so that the stress generated by the deformation of the substrate 100 is preferentially eliminated through the first positioning hole 121, which can reduce the influence of the deformation of the second positioning hole 122 on the stability of the circuit line structure in the circuit setting area 101, and improve the yield of the laminated substrate formed by the substrate 100 after the subsequent process. In this way, the deformation degree of the substrate 100 can be reduced from the perspective of the opening size of the positioning hole 120, and the alignment accuracy of the substrate 100 can be improved.

[0088] In other examples, such as Fig.11 As shown, step 200: forming a plurality of positioning holes 120 on different regions of a substrate 100 having a frame 110, including S212 and S222.

[0089] S212 : forming a plurality of second positioning holes 122 within a unit area of ​​the circuit arrangement region 101 .

[0090] S222: forming a plurality of first positioning holes 121 within a unit area of ​​the edge region 102. The distribution density of the plurality of first positioning holes 121 is greater than the distribution density of the plurality of second positioning holes 122.

[0091] For example, the number of positioning holes 120 set in a unit area of ​​the substrate 100 (i.e., the distribution density) is related to the ability to eliminate stress on the substrate 100 (or the ability to reduce the deformation degree of the substrate 100). Combined with the circuit line structure of the circuit setting area 101 on the substrate 100, a larger number of positioning holes 120 can be set in the edge area 102. For example, the distribution density of the first positioning holes 121 in the edge area 101 is greater than the distribution density of the plurality of second positioning holes 122. In this way, the deformation degree of the substrate 100 can be reduced from the perspective of the number of positioning holes 120, and the alignment accuracy of the substrate 100 can be improved.

[0092] In some examples, such as Fig.12 As shown, step S200: forming a plurality of positioning holes 120 on different areas of a substrate 100 having a frame 110, including S230.

[0093] S230 : forming a positioning hole 120 having the same cross-sectional shape as the corresponding positioning rod 210 on the bottom plate 200 along a direction perpendicular to the length of the positioning rod 210 .

[0094] And, step S300: placing the substrate 100 having the frame 110 on the bottom plate 200, including S310.

[0095] S310 : placing the substrate 100 with the frame 110 on the bottom plate 200 along an angle at which the sides of the positioning holes 120 are parallel to the side walls of the positioning rods 210 .

[0096] For example, the opening shape of the positioning hole 120 is the same as the cross-sectional shape of the positioning rod 210 along the length direction perpendicular to the positioning rod 210, and the angle along the edge of the positioning hole 120 is parallel to the side wall of the positioning rod 210. In the process of setting the substrate 100 on the positioning rod 210 through the positioning hole 120, the size and structure of the positioning rod 210 will not have an adverse effect on the shape of the positioning hole 120. For example, when the substrate 100 is deformed under pressure, the probability of the corners of the side wall of the positioning rod 210 pulling or scratching the hole wall of the positioning hole 120 is reduced, the structural stability of the positioning hole 120 is improved, and the degree of deformation of the substrate 100 reduced by the positioning hole 120 and the positioning rod 210 is improved, which is beneficial to improving the alignment accuracy of the substrate 100.

[0097] In some examples, step 200: forming a plurality of positioning holes 120 on different regions of a substrate 100 having a frame 110, including: forming the positioning holes 120 to have a size larger than a diameter of a positioning rod 210 on a bottom plate 200, and the difference between the two is 15 microns to 20 microns.

[0098] It should be noted that the diameter of the positioning rod 210 may be the size of the cross section of the positioning rod 210 perpendicular to its length. For example, if the cross section of the positioning rod 210 perpendicular to its length is circular, the diameter of the positioning rod 210 may refer to the diameter of the circle; or, if the cross section of the positioning rod 210 perpendicular to its length is rectangular, the diameter of the positioning rod 210 may refer to the diagonal or side length of the rectangle. The size of the positioning hole 120 and the diameter of the positioning rod 210 may be compared using the same parameter type.

[0099] For example, the opening shape of the positioning hole 120 can be circular. The cross-sectional shape of the positioning rod 210 along the direction perpendicular to its length is circular. The diameter of the positioning hole 120 is formed to be larger than the diameter of the positioning rod 210, and the difference between the two is 15 microns to 20 microns.

[0100] For example, the diameter of the positioning hole 120 is formed to be 16 microns larger than the diameter of the positioning rod 210. In this way, the substrate 100 can be stably mounted on the positioning rod 210; and in the process of removing the adhesive layer 130 to cause the substrate 100 to deform, or under the pressure of fixing the substrate 100 on the bottom plate 200, the spacing between the positioning hole 120 and the positioning rod 210 can reduce the probability of deformation of the substrate 100 caused by the structure of the positioning rod 210 itself.

[0101] In some examples, such as Fig.13 As shown, step S200: forming a plurality of positioning holes 120 on different areas of a substrate 100 having a frame 110, including S240.

[0102] S240: setting the spacing between two adjacent positioning holes 120 in the circuit setting area 101 to be equal; and / or setting the spacing between two adjacent positioning holes 120 in the edge area 102 to be equal.

[0103] For example, among the multiple positioning holes 120 located in the circuit setting area 101, the spacing between two adjacent positioning holes 120 may be 90 mm. And / or, among the multiple positioning holes 120 located in the edge area 102, the spacing between two adjacent positioning holes 120 may be 90 mm. The examples provided in this application do not impose specific limitations on this, and can be adjusted according to the structure of the substrate 100 and requirements.

[0104] In some examples, such as Fig.13 As shown, after step S200 : forming a plurality of positioning holes 120 on the substrate 100 with the frame 110 , and before step S300 : placing the substrate 100 with the frame 110 on the bottom plate 200 , the method further includes step S500 .

[0105] S500: forming a circuit line on the substrate 100; the spacing between the circuit line and the positioning hole 120 meets a preset value; the preset value is the minimum spacing between the positioning hole 120 and the circuit line when the deformation of the positioning hole does not affect the structure of the circuit line.

[0106] For example, the spacing between the positioning holes 120 at different positions and the circuit lines adjacent to the positioning holes 120 may be different. For example, in an area where the distribution density of the circuit lines is relatively high, the spacing between the positioning holes 120 and the circuit lines adjacent to them is greater than the spacing between the positioning holes 120 and the circuit lines adjacent to them in an area where the distribution density of the circuit lines is relatively low. In this way, it is beneficial to improve the stability of the circuit structure in the circuit setting area 101, reduce the adverse effects of the deformation of the positioning holes 120 on the circuit line structure, and help improve the yield of the substrate 100. In addition, the printing of the circuit line is implemented before removing the frame 110, and the frame 110 can also fix the structure of the substrate 100, reduce the effects of the process conditions for making the circuit line on the structural stability of the substrate 100, and help improve the alignment accuracy and performance of subsequent electrical connections based on the structures of multiple substrates 100.

[0107] like Fig.15 As shown, the present application also provides a laminate substrate 300, which is a laminate substrate manufactured as in any of the above examples.

[0108] For example, in the laminated substrate 300, the misalignment size of the hole walls of the positioning holes 120 of the plurality of laminated substrates 100 may be 10 microns to 35 microns. Fig.15The misaligned dimensions of the hole walls of the positioning holes 120 of the multiple stacked substrates 100 may include D1 and D2, and the misaligned dimensions at different positions may be different. For example, the maximum misaligned dimension D1 of the hole walls on the same side of the multiple positioning holes 120 may be 15.1 microns, and the maximum misaligned dimension D2 of the hole walls on the other side of the multiple positioning holes 120 may be 10.92 microns.

[0109] The laminated substrate 300 prepared by the above-mentioned laminated substrate manufacturing method can be applied to a variety of scenarios. Based on the high alignment accuracy of the laminated substrate 300, the laminated substrate 300 has good structural stability and good point connection performance, which is conducive to improving the reliability of application in different scenarios.

[0110] It should be understood that "one embodiment" or "an example" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned sequence numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments.

[0111] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0112] The above is only an implementation method of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for manufacturing a laminated substrate, characterized in that: include: providing a substrate having a frame; forming a plurality of positioning holes on different areas of the substrate having a frame; The substrate with the frame is placed on a bottom plate; a plurality of positioning rods are provided on the bottom plate, and one positioning rod passes through one positioning hole; The frame of the substrate is removed, and the substrate is fixed on the bottom plate.

2. The method according to claim 1, characterized in that The method of removing the frame of the substrate and fixing the substrate on the bottom plate includes: The substrate with the frame is pressed onto the bottom plate; the frame is arranged on one side surface of the substrate and surrounds the side edge of the substrate; the side edge of the substrate and the frame are fixedly connected by an adhesive layer; Pressing a frame located on one side surface of the substrate to remove the adhesive layer, and separating the substrate from the frame; The frame is removed, and the substrate is pressed and fixed on the bottom plate.

3. The method according to claim 1, characterized in that A plurality of positioning holes are formed on different areas of the substrate having a frame, including: The substrate comprises a circuit arrangement area and an edge area surrounding the circuit arrangement area; forming a plurality of first positioning holes in the edge region; At least one second positioning hole is formed in the circuit setting area; at least one positioning rod passes through the at least one second positioning hole.

4. The method according to claim 3, characterized in that A plurality of positioning holes are formed on different areas of the substrate having a frame, including: forming the first positioning hole with an opening size of a first size; forming the second positioning hole with an opening size of a second size; Wherein, the first size is greater than or equal to the second size.

5. The method according to claim 3, characterized in that: A plurality of positioning holes are formed on different areas of the substrate having a frame, including: forming a plurality of the second positioning holes within a unit area of ​​the circuit arrangement region; forming a plurality of the first positioning holes within a unit area of ​​the edge region; The distribution density of the plurality of first positioning holes is greater than the distribution density of the plurality of second positioning holes.

6. The method according to claim 3, characterized in that: A plurality of positioning holes are formed on different areas of the substrate having a frame, including: The plurality of positioning holes are arranged in the circuit arrangement area, and the spacing between two adjacent positioning holes is equal; And / or, among the plurality of positioning holes located in the edge area, the intervals between two adjacent positioning holes are equal.

7. The method according to claim 1, characterized in that A plurality of positioning holes are formed on different areas of the substrate having a frame, including: The size of the positioning hole is larger than the diameter of the positioning rod on the bottom plate, and the difference between the two is 15 microns to 20 microns.

8. The method according to claim 1, characterized in that A plurality of positioning holes are formed on different areas of the substrate having a frame, including: forming the positioning hole having the same cross-sectional shape as the corresponding positioning rod on the bottom plate along a direction perpendicular to the length of the positioning rod; Placing the substrate with the frame on the bottom plate comprises: The substrate with the frame is placed on the bottom plate along an angle at which the edge of the positioning hole is parallel to the side wall of the positioning rod.

9. The method according to claim 1, characterized in that: The method of removing the frame of the substrate and fixing the substrate on the bottom plate includes: Removing the frame of the first substrate placed on the bottom plate, and fixing the first substrate on the bottom plate; Removing a frame of the second substrate placed on the bottom plate, and fixing the second substrate on the first substrate; Removing the frame of the Nth substrate placed on the bottom plate, and fixing the Nth substrate on the N-1th substrate; N substrates are pressed onto the bottom plate to form a stacked substrate; N is a positive integer greater than 1.

10. The method according to claim 1, characterized in that The method of removing the frame of the substrate and fixing the substrate on the bottom plate includes: The plurality of substrates are fixed on the bottom plate in sequence, and the pressure for fixing different substrates decreases as the number of the stacked substrates increases.

11. A laminate substrate, characterized in that: It comprises a laminated substrate manufactured by the method according to any one of claims 1 to 10.

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