Electronic device

Abstract

The invention provides an electronic device. The electronic equipment comprises a back shell, a decoration assembly, a heating device and a piezoelectric air cooling module. The back shell has a first opening. The decoration assembly is provided with a containing groove, a first air inlet and a first air outlet, the containing groove communicates with the first opening to form a containing space, and the first air inlet and the first air outlet communicate with the containing groove; the heating device is arranged in the accommodating space; the piezoelectric air cooling module is arranged in the containing space and corresponds to the heating device, the piezoelectric air cooling module comprises one or more piezoelectric air cooling assemblies, each piezoelectric air cooling assembly comprises one or more piezoelectric air cooling units, each piezoelectric air cooling unit comprises a vibration part and a piezoelectric part, the piezoelectric parts are borne on the vibration parts, and the piezoelectric parts are arranged on the piezoelectric air cooling units. And the piezoelectric piece is used for deforming under the control of the control signal and driving the vibration piece to deform so as to dissipate heat of the heating device. The thickness of the electronic equipment is small.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] With the development of technology, mobile phones and other electronic devices are becoming more and more popular and more powerful. The electronic device includes a fan to dissipate heat from a heat generating device (such as a power device module) in the electronic device. The fan in the related art generally includes an impeller and a motor. The size of the impeller and the motor is large, which increases the thickness of the electronic device. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising:

[0004] A back shell, wherein the back shell has a first opening;

[0005] A decoration component, the decoration component having a receiving groove, a first air inlet and a first air outlet, the receiving groove is connected to the first opening to form a receiving space, and the first air inlet and the first air outlet are both connected to the receiving groove;

[0006] A heating device, wherein the heating device is disposed in the receiving space; and

[0007] A piezoelectric air-cooling module is arranged in the receiving space and corresponds to the heating device. The piezoelectric air-cooling module includes one or more piezoelectric air-cooling components. The piezoelectric air-cooling components include one or more piezoelectric air-cooling units. The piezoelectric air-cooling unit includes a vibrating member and a piezoelectric member. The piezoelectric member is carried by the vibrating member. The piezoelectric member is used to deform under the control of a control signal and drive the vibrating member to deform so as to dissipate heat from the heating device.

[0008] In summary, the electronic device provided in the embodiment of the present application includes a piezoelectric air-cooling module, the piezoelectric air-cooling module includes one or more piezoelectric air-cooling components, the piezoelectric air-cooling components include one or more piezoelectric air-cooling units, the piezoelectric element of the piezoelectric air-cooling unit can be deformed under the control of a control signal, and drive the vibration element to deform, so as to form active air cooling, dissipate heat for the heating device, and thus have a better heat dissipation effect. The thickness and size of the piezoelectric element of the piezoelectric air-cooling unit can be made smaller, so the thickness and size of the piezoelectric air-cooling unit are smaller, which is convenient for layout in the electronic device, and makes the thickness of the electronic device smaller. In addition, the piezoelectric air-cooling module in the electronic device provided in the embodiment of the present application is arranged in the receiving space formed by the decorative part and the back shell, which can make full use of the space formed by the decorative part and the back shell, and is convenient for the layout of the piezoelectric air-cooling module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0010] Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application;

[0011] Figure 2 for Figure 1 A schematic diagram of a portion of the structure of the electronic device shown in ;

[0012] Figure 3 A schematic diagram of a piezoelectric air-cooling module provided in one embodiment;

[0013] Figure 4 An implementation method Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II provided in;

[0014] Figure 5 for Figure 3 A schematic diagram of the specific structure of the piezoelectric air-cooling unit shown in ;

[0015] Figure 6 is a schematic diagram of a working state of a piezoelectric air-cooling unit shown in one embodiment;

[0016] Figure 7 for Figure 6 A schematic diagram of another working state of the piezoelectric air-cooling unit shown in ;

[0017] Figure 8 is a schematic diagram of the thickness of a piezoelectric air-cooling module shown in one embodiment;

[0018] Fig. 9 for Figure 4 A schematic diagram of the cross-sectional view of a portion of the structure of the electronic device shown in FIG.

[0019] Fig.10 Another embodiment Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II is provided;

[0020] Fig.11 For yet another embodiment Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II is provided;

[0021] Fig.12 Another embodiment Figure 1A schematic cross-sectional view of a partial structure of an electronic device along line II is provided;

[0022] Fig.13 Another embodiment Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II is provided;

[0023] Fig.14 Yet another embodiment Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II is provided. DETAILED DESCRIPTION

[0024] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0025] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0026] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0027] The embodiment of the present application provides an electronic device 1, which can be, but is not limited to, a mobile phone, a watch, a tablet computer, a laptop computer, etc. The embodiment of the present application takes the mobile phone as an example for illustration and description, which should not be understood as a limitation on the embodiment of the present application.

[0028] Please also read Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of a portion of the structure of the electronic device shown in ; Figure 3 A schematic diagram of a piezoelectric air-cooling module provided in one embodiment; Figure 4 An implementation method Figure 1 A cross-sectional schematic diagram of a partial structure of an electronic device along line II provided in the specification. The electronic device 1 includes a back shell 10, a decorative component 20, a heating device 30 and a piezoelectric air-cooling module 40. The back shell 10 has a first opening 10a. The decorative component 20 has a receiving groove 20a, a first air inlet 20b and a first air outlet 20c. The receiving groove 20a is connected to the first opening 10a to form a receiving space 10b. The first air inlet 20b and the first air outlet 20c are both connected to the receiving groove 20a. The heating device 30 is arranged in the receiving space 10b. The piezoelectric air-cooling module 40 is arranged in the receiving space 10b and corresponds to the heating device 30. The piezoelectric air-cooling module 40 includes one or more piezoelectric air-cooling components 410. The piezoelectric air-cooling component 410 includes one or more piezoelectric air-cooling units 411. Please refer to Figure 5 , Figure 5 for Figure 3 The specific structural schematic diagram of the piezoelectric air cooling unit is shown in FIG. The piezoelectric air cooling unit 411 includes a vibrating member 4111 and a piezoelectric member 4112. The piezoelectric member 4112 is carried by the vibrating member 4111, and the piezoelectric member 4112 is used to deform under the control of a control signal and drive the vibrating member 4111 to deform so as to dissipate heat from the heating device 30.

[0029] The back shell 10 is also called a back cover or a battery cover. The back shell 10 has a first opening 10a, and the shape of the first opening 10a can be, but is not limited to, a rectangle, a circle, a polygon, etc.

[0030] The decoration component 20 (Decoration, abbreviated as deco) is used to decorate the electronic device 1. The first air outlet 20c is spaced apart from the first air inlet 20b. The structure of the decoration component 20 will be described in detail later. The shape of the decoration component 20 can be, but is not limited to, a rectangular, circular, polygonal, and other shapes. The electronic device 1 may include one or more decoration components 20. In the schematic diagram of this embodiment, the electronic device 1 includes a decoration component 20 as an example. The material of the decoration component 20 can be, but is not limited to, metal, plastic, glass fiber (abbreviated as glass fiber), and other materials.

[0031] The heating device 30 may be, but is not limited to, a functional module for realizing a preset function in the electronic device 1, also known as a power device. The heating device 30 may be, but is not limited to, a processor chip, a camera module, a flash module, a WiFi module, etc., which are not limited here.

[0032] Please also read Figure 6 and Figure 7 , Figure 6 is a schematic diagram of a working state of a piezoelectric air-cooling unit shown in one embodiment; Figure 7 for Figure 6 Schematic diagram of another working state of the piezoelectric air-cooling unit shown in . The shape of the piezoelectric air-cooling unit 411 can be, but not limited to, a rectangular, circular, polygonal, etc. The vibrating member 4111 can be, but not limited to, a material that is easily deformed, such as metal. The shape of the vibrating member 4111 can be, but not limited to, a rectangular, circular, polygonal, etc.

[0033] The piezoelectric element 4112 is made of piezoelectric material. When the piezoelectric element 4112 is connected to a control signal, it will shrink or stretch, and the surface of the piezoelectric element 4112 will bend and deform. When the piezoelectric element 4112 is deformed under the control of the control signal, since the piezoelectric element 4112 is carried by the vibrating element 4111, the deformation of the piezoelectric element 4112 will drive the deformation of the vibrating element 4111. The deformation of the piezoelectric element 4112 and the vibrating element 4111 will drive the air flow, thereby being able to perform air cooling and heat dissipation on the heating device 30.

[0034] The manner in which the piezoelectric component 4112 is carried on the vibrating component 4111 may be, but is not limited to, that the surface of the piezoelectric component 4112 is directly attached to the vibrating component 4111, or that the piezoelectric component 4112 is carried on the vibrating component 4111 via a connecting component (such as an adhesive). In one embodiment, the piezoelectric air-cooling unit 411 may be formed by a microelectromechanical system (MEMS) molding process. The size of the fan in the related art is usually 3 mm or even higher. The size of the piezoelectric air-cooling unit 411 is less than or equal to 2 mm, and is even controlled at the micron (μm) level. When the piezoelectric air-cooling assembly 410 includes a plurality of piezoelectric air-cooling units 411, the plurality of piezoelectric air-cooling units 411 may be connected by a silicon-based circuit to form a closed loop.

[0035] See also Figure 6 and Figure 7, the advantage of the piezoelectric air-cooling unit 411 is that the device shape of the piezoelectric air-cooling unit 411 is variable, and the direction of deformation of the piezoelectric air-cooling unit 411 is different, which will be described in detail later. Therefore, the piezoelectric air-cooling unit 411 can drive the air to move to form wind. Since the piezoelectric air-cooling unit 411 of the electronic device 1 provided in the embodiment of the present application can be deformed under the control of the control signal, and drive the vibration member 4111 to deform to form wind, the piezoelectric air-cooling unit 411 provided in the embodiment of the present application is also called an active air-cooling unit. When the piezoelectric element 4112 of the piezoelectric air-cooling module 40 receives the control signal, the piezoelectric air-cooling module 40 starts working, sucks in low-temperature external air, and the sucked external air absorbs heat from the heating device 30 and becomes high-temperature air, and then is discharged.

[0036] Compared with the fan in the related art, the overall size and thickness of the piezoelectric air cooling unit 411 in the embodiment of the present application can be greatly reduced. Thanks to the characteristics of the piezoelectric material, the piezoelectric air cooling unit 411 provided in the embodiment of the present application can provide a back pressure far exceeding the fan in the related art, and the requirements for the air duct structure in the electronic device 1 are reduced.

[0037] The piezoelectric air-cooling unit 411 provided in the embodiment of the present application can provide a relatively large back pressure, that is, the piezoelectric air-cooling unit 411 provided in the embodiment of the present application has a relatively large power to drive the air to form wind and has a better heat dissipation effect.

[0038] In summary, the electronic device 1 provided in the embodiment of the present application includes a piezoelectric air-cooling module 40, the piezoelectric air-cooling module 40 includes one or more piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 include one or more piezoelectric air-cooling units 411, and the piezoelectric element 4112 of the piezoelectric air-cooling unit 411 can be deformed under the control of the control signal, and drive the vibration element 4111 to deform, so as to form active air-cooling, and dissipate heat for the heating device 30, thereby having a better heat dissipation effect. The thickness and size of the piezoelectric element 4112 of the piezoelectric air-cooling unit 411 can be made smaller, so the thickness and size of the piezoelectric air-cooling unit 411 are small, which is convenient for layout in the electronic device 1, and makes the thickness of the electronic device 1 small. In addition, the piezoelectric air-cooling module 40 in the electronic device 1 provided in the embodiment of the present application is arranged in the receiving space 10b formed by the decorative element and the back shell 10, which can make full use of the space formed by the decorative element and the back shell 10, and is convenient for the layout of the piezoelectric air-cooling module 40.

[0039] Please refer again Figure 5 , Figure 6 and Figure 7, the vibrating element 4111 and the piezoelectric element 4112 are stacked along a preset direction D0. The control signal includes a plurality of first sub-control signals and a plurality of second sub-control signals, and the first sub-control signals and the second sub-control signals are alternated in sequence. The first sub-control signal is used to control the piezoelectric element 4112 to bend toward the preset direction D0, and drive the vibrating element 4111 to bend toward the preset direction D0. The second sub-control signal is used to control the piezoelectric element 4112 to bend in the opposite direction of the preset direction D0, and drive the vibrating element 4111 to bend in the opposite direction of the preset direction D0.

[0040] In the perspective of the schematic diagram of this embodiment, the preset direction D0 is a vertically upward direction. It can be understood that as the placement posture of the piezoelectric air-cooling unit 411 changes, the preset direction D0 will also change.

[0041] exist Figure 6 In the state where the first sub-control signal controls the piezoelectric element 4112 to bend toward the preset direction D0 and drives the vibration element 4111 to bend toward the preset direction D0 is called the first state. Figure 7 In the state where the second sub-control signal controls the piezoelectric element 4112 to bend in the opposite direction of the preset direction D0 and drives the vibrating element 4111 to bend in the opposite direction of the preset direction D0, the state is also referred to as the second state. The first sub-control signal and the second sub-control signal alternate in sequence, so the state of the piezoelectric air-cooling unit 411 is the first state and the second state that alternate in sequence, thereby the piezoelectric air-cooling unit 411 can form a continuous wind.

[0042] In this embodiment, the first state and the second state of the piezoelectric air cooling unit 411 are generated by the inverse piezoelectric effect of the piezoelectric element 4112. The current directions of the first sub-control signal and the second sub-control signal are opposite, so that the piezoelectric air cooling unit 411 has the first state and the second state.

[0043] In the electronic device 1 provided in the embodiment of the present application, the vibrating element 4111 and the piezoelectric element 4112 are stacked along a preset direction D0. The control signal includes a plurality of first sub-control signals and a plurality of second sub-control signals, and the first sub-control signals and the second sub-control signals are alternated in sequence. The first sub-control signal is used to control the piezoelectric element 4112 to bend toward the preset direction D0, and drive the vibrating element 4111 to bend toward the preset direction D0. The second sub-control signal is used to control the piezoelectric element 4112 to bend in the opposite direction of the preset direction D0, and drive the vibrating element 4111 to bend in the opposite direction of the preset direction D0, thereby forming a regular wind and improving the heat dissipation effect of the heating device 30.

[0044] Please continue Figure 6 and Figure 7 The piezoelectric air-cooling unit 411 further includes a housing shell 4113. The housing shell 4113 has a housing space 411a, a second air inlet 411b, and a second air outlet 411c. The housing space 411a is used to accommodate the vibrating element 4111 and the piezoelectric element 4112. The second air inlet 411b is connected to the housing space 411a and is arranged corresponding to the first air inlet 20b. The second air outlet 411c is connected to the housing space 411a and is arranged corresponding to the first air outlet 20c.

[0045] The piezoelectric air cooling unit 411 includes a housing shell 4113, wherein the housing shell 4113 has a housing space 411a, and the housing space 411a is used to house the vibrating element 4111 and the piezoelectric element 4112. Therefore, the housing shell 4113 can protect the vibrating element 4111 and the piezoelectric element 4112. In addition, the housing space 411a is also used to provide a deformation space for the vibrating element 4111 and the piezoelectric element 4112.

[0046] In this embodiment, the receiving shell 4113 includes a top wall 41131, a bottom wall 41132 and a peripheral side wall 41133. The bottom wall 41132 is opposite to and spaced from the top wall 41131. One end of the peripheral side wall 41133 is bent and connected to the periphery of the top wall 41131, and the other end of the peripheral side wall 41133 is bent and connected to the periphery of the bottom wall 41132.

[0047] It can be understood that one end of the vibration member 4111 of the piezoelectric air cooling unit 411 and one end of the piezoelectric member 4112 are fixed to the side wall of the receiving shell 4113. When the piezoelectric air cooling unit 411 is in the first state and the second state, there is a gap between the other end of the vibration member 4111 of the piezoelectric air cooling unit 411 and the other end of the piezoelectric member 4112 and the receiving shell 4113, so that air can enter the receiving space 411a from the second air inlet 411b, and the air entering the receiving space 411a can flow out from the second air outlet 411c.

[0048] It should be noted that, in this embodiment, the second air inlet 411b is located on the top wall 41131 of the receiving shell 4113, and the second air outlet 411c is located on the bottom wall 41132 of the receiving shell 4113. In other embodiments, the second air inlet 411b and the second air outlet 411c may also be arranged at other positions of the receiving shell 4113. The positions of the second air inlet 411b and the second air outlet 411c shown in the schematic diagram of this embodiment should not be understood as limiting the embodiments of the present application.

[0049] See also Figure 8 , Figure 8 Schematic diagram of the thickness of a piezoelectric air cooling module shown in an embodiment. In this embodiment, the thickness of the piezoelectric air cooling module 40 is taken as an example to illustrate the thickness of a piezoelectric air cooling unit 411. The thickness d of the piezoelectric air cooling module 40 satisfies: 0mm<d≤2mm.

[0050] The thickness d of the piezoelectric air-cooling module 40 may be, but is not limited to, 0.5 mm, 1.0 mm, 1.5 mm, or 2.0 mm.

[0051] The thickness d of the piezoelectric air cooling module 40 satisfies: 0 mm<d≤2 mm. It can be seen that the thickness of the piezoelectric air cooling unit 411 is relatively small, which is convenient for layout in the electronic device 1 and makes the thickness of the electronic device 1 relatively small.

[0052] See also Fig. 9 , Fig. 9 for Figure 4Detailed identification diagram of the cross-sectional schematic diagram of the partial structure of the electronic device shown in . The decorative component 20 includes a peripheral side frame 210 and a top cover 220. The peripheral side frame 210 has a second opening 210a, one end of the peripheral side frame 210 is arranged corresponding to the back shell 10, and the second opening 210a is connected to the first opening 10a. The top cover 220 is arranged corresponding to the other end of the peripheral side frame 210 and corresponding to the second opening 210a to form the receiving groove 20a. Among them, the first air inlet 20b is arranged on the peripheral side frame 210 or the top cover 220, and the first air outlet 20c is arranged on the peripheral side frame 210 or the top cover 220.

[0053] In this embodiment, the decoration assembly 20 includes a peripheral frame 210 and a top cover 220, and the top cover 220 and the peripheral frame 210 are separate structures. It can be understood that in other embodiments, the peripheral frame 210 and the top cover 220 can also be an integrated structure.

[0054] One end of the peripheral side frame 210 is arranged corresponding to the back shell 10. Specifically, in this embodiment, the peripheral side frame 210 is arranged on one side of the outer surface of the back shell 10. It can be understood that in other embodiments, one end of the peripheral side frame 210 can also be arranged in the first opening 10a of the back shell 10, as long as the second opening 210a is connected to the first opening 10a.

[0055] The top cover 220 is disposed corresponding to the other end of the peripheral frame 210 and the second opening 210a. Specifically, in this embodiment, the top cover 220 is located in the second opening 210a and is disposed at the other end of the peripheral frame 210. It can be understood that in other embodiments, the top cover 220 can also be disposed on the side of the peripheral frame 210 away from the back cover.

[0056] The first air inlet 20b is arranged on the peripheral side frame 210 or the top cover 220, and the first air outlet 20c is arranged on the peripheral side frame 210 or the top cover 220. Therefore, the position of the first air inlet 20b and the position of the first air outlet 20c can be arranged and combined, and the present application does not limit the position combination of the first air inlet 20b and the first air outlet 20c.

[0057] The embodiment of the present application provides an electronic device 1, wherein the decorative component 20 includes a peripheral frame 210 and a top cover 220, so that the decorative component 20 is conveniently matched with the back shell 10 of the electronic device 1. In addition, the first air inlet 20b is arranged on the peripheral frame 210 or the top cover 220, and the first air outlet 20c is arranged on the peripheral frame 210 or the top cover 220, so that the position setting of the first air inlet 20b and the first air outlet 20c is more flexible.

[0058] Please continue reading Fig. 9 The electronic device 1 further includes a circuit board 50. The circuit board 50 is disposed on one side of the back shell 10, and the circuit board 50 is used to carry the heating device 30. The piezoelectric air cooling module 40 is disposed on the side of the heating device 30 away from the circuit board 50. The first air inlet 20b and the first air outlet 20c are both disposed on the peripheral side frame 210, and the first air inlet 20b and the first air outlet 20c are disposed opposite to each other.

[0059] For the convenience of description, Fig. 9 The electronic device 1 provided in the corresponding embodiment is referred to as the electronic device 1 provided in the first embodiment (also referred to as embodiment 1). In this embodiment, the circuit board 50 is a printed circuit board (PCB). The circuit board 50 is used to carry the heating device 30. In this embodiment, the heating device 30 is arranged on the surface of the circuit board 50 facing the back cover.

[0060] The piezoelectric air cooling module 40 is disposed on a side of the heating device 30 away from the circuit board 50. In this embodiment, the piezoelectric air cooling module 40 is directly disposed on the surface of the heating device 30 away from the circuit board 50. When the piezoelectric air cooling module 40 is directly disposed on the surface of the heating device 30 away from the circuit board 50, the piezoelectric air cooling module 40 can better dissipate heat from the heating device 30 and has a better heat dissipation effect.

[0061] In this embodiment, the first air inlet 20b and the first air outlet 20c are both arranged on the peripheral side frame 210, and the first air inlet 20b and the first air outlet 20c are arranged back to back. Therefore, the air entering from the first air inlet 20b can be transmitted to the first air outlet 20c via a longer path, thereby having a better heat dissipation effect on the heating device 30.

[0062] In this embodiment, one end of the piezoelectric air cooling module 40 abuts the first air inlet 20b, and the other end of the piezoelectric air cooling module 40 abuts the first air outlet 20c. One end of the piezoelectric air cooling module 40 abuts the first air inlet 20b, and the other end of the piezoelectric air cooling module 40 abuts the first air outlet 20c, so that the air entering the receiving space 10b through the first air inlet 20b can quickly enter the piezoelectric air cooling module 40, and the air discharged from the piezoelectric air cooling module 40 can be quickly discharged through the first air outlet 20c, thereby improving the utilization efficiency of the piezoelectric air cooling module 40 for the air and improving the heat dissipation effect on the heating device 30.

[0063] In one embodiment, the second air inlet 411 b is disposed corresponding to the first air inlet 20 b , and the second air outlet 411 c is disposed corresponding to the first air outlet 20 c , thereby improving the heat dissipation effect of the piezoelectric air cooling module 40 on the heating device 30 .

[0064] Further, in this embodiment, there is a gap between the piezoelectric air-cooling module 40 and the top cover 220. When there is a gap between the piezoelectric air-cooling module 40 and the top cover 220, when the top cover 220 is hit, the gap provides a space for the top cover 220 to deform, so that the piezoelectric air-cooling module 40 is not easily damaged. It can be understood that in other embodiments, the piezoelectric air-cooling module 40 fits the top cover 220. The piezoelectric air-cooling module 40 fits the top cover 220, so that the thickness (also called height) of the decorative component 20 can be reduced, so that the thickness of the electronic device 1 is reduced, which is conducive to the thinning of the electronic device 1.

[0065] See also Fig.10 , Fig.10 Another embodiment Figure 1 A cross-sectional schematic diagram of a partial structure of an electronic device along line II is provided. For the convenience of description, Fig.10 The electronic device 1 provided in the corresponding embodiment is referred to as the electronic device 1 provided in the second embodiment (also referred to as embodiment 2). The electronic device 1 also includes a circuit board 50. The circuit board 50 is arranged on one side of the back shell 10, and the circuit board 50 is used to carry the heating device 30. The piezoelectric air cooling module 40 is arranged on the side of the heating device 30 away from the circuit board 50. Among them, the first air inlet 20b is arranged on one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged on the other of the peripheral side frame 210 and the top cover 220.

[0066] In this embodiment, the circuit board 50 is a printed circuit board (PCB) and is used to carry the heating device 30. In this embodiment, the heating device 30 is disposed on a surface of the circuit board 50 facing the back cover.

[0067] The piezoelectric air cooling module 40 is disposed on a side of the heating device 30 away from the circuit board 50. In this embodiment, the piezoelectric air cooling module 40 is directly disposed on the surface of the heating device 30 away from the circuit board 50. When the piezoelectric air cooling module 40 is directly disposed on the surface of the heating device 30 away from the circuit board 50, the piezoelectric air cooling module 40 can better dissipate heat from the heating device 30 and has a better heat dissipation effect.

[0068] The first air inlet 20b is arranged at one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged at the other of the peripheral side frame 210 and the top cover 220, specifically including: the first air inlet 20b is arranged at the top cover 220, and the first air outlet 20c is arranged at the peripheral side frame 210; or, the first air inlet 20b is arranged at the peripheral side frame 210, and the first air outlet 20c is arranged at the top cover 220. In the schematic diagram of this embodiment, the first air inlet 20b is arranged at the top cover 220, and the first air outlet 20c is arranged at the peripheral side frame 210. It can be understood that it should not be understood as a limitation on the electronic device 1 provided in the embodiment of the present application.

[0069] In this embodiment, the first air inlet 20b is arranged at one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged at the other of the peripheral side frame 210 and the top cover 220. This allows the first air inlet 20b and the first air outlet 20c to be flexibly arranged, so that the piezoelectric air cooling module 40 in the electronic device 1 can dissipate heat for the heating device 30 while taking into account the appearance design requirements of the electronic device 1.

[0070] Further, please refer again Fig.10 The piezoelectric air cooling module 40 has a top surface 40a and a peripheral side surface 40b. The top surface 40a of the piezoelectric air cooling module 40 faces away from the heating device 30, and the top surface 40a of the piezoelectric air cooling module 40 is in contact with the top cover 220. The peripheral side surface 40b is bent and connected to the top surface 40a, and the peripheral side surface 40b of the piezoelectric air cooling module 40 is in contact with the peripheral side frame 210.

[0071] In this embodiment, the top surface 40a of the piezoelectric air-cooling module 40 is away from the heating device 30, and the top surface 40a of the piezoelectric air-cooling module 40 is in contact with the top cover 220, and the peripheral side surface 40b of the piezoelectric air-cooling module 40 is in contact with the peripheral side frame 210. Therefore, there is no gap between the top surface 40a of the piezoelectric air-cooling module 40 and the top cover 220 of the piezoelectric air-cooling module 40. On the one hand, the thickness (also called height) and the lateral size of the decorative component 20 can be smaller, so that the thickness of the electronic device 1 is smaller, which is conducive to the thinning of the electronic device 1; on the other hand, the air entering the receiving space 10b through the first air inlet 20b can quickly enter the piezoelectric air-cooling module 40, and the air discharged from the piezoelectric air-cooling module 40 can be quickly discharged through the first air outlet 20c, thereby improving the utilization efficiency of the air by the piezoelectric air-cooling module 40 and improving the heat dissipation effect of the heating device 30.

[0072] See also Fig.11 , Fig.11 For yet another embodiment Figure 1 A cross-sectional schematic diagram of a partial structure of an electronic device along line II is provided. For the convenience of description, Fig.11 The electronic device 1 provided in the corresponding implementation manner is referred to as the electronic device 1 provided in the third embodiment (also referred to as embodiment 3). The electronic device 1 also includes a circuit board 50. The circuit board 50 is arranged on one side of the back shell 10, and the circuit board 50 is used to carry the heating device 30. The heating device 30 includes a plurality of heating sub-components 310. The heating device 30 and the peripheral side frame 210 have a first gap 30a. Adjacent heating sub-components 310 are arranged with a second gap 30b between them. The piezoelectric air-cooling module 40 includes a plurality of piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 are arranged in the first gap 30a and the second gap 30b. Among them, the first air inlet 20b and the first air outlet 20c are both arranged on the peripheral side frame 210, and the first air inlet 20b and the first air outlet 20c are arranged opposite to each other.

[0073] In this embodiment, the circuit board 50 is a printed circuit board (PCB) and is used to carry the heating device 30. In this embodiment, the heating device 30 is disposed on a surface of the circuit board 50 facing the back cover.

[0074] The heating device 30 includes a plurality of heating sub-devices 310 , and the types of the heating devices 30 in the plurality of heating sub-devices 310 may be the same or different.

[0075] In this embodiment, the piezoelectric air cooling module 40 includes a plurality of piezoelectric air cooling components 410, and the piezoelectric air cooling components 410 are disposed in the first gap 30a and the second gap 30b, so that more piezoelectric air cooling components 410 are disposed in the receiving space 10b to improve the heat dissipation effect.

[0076] In this embodiment, the first air inlet 20b and the first air outlet 20c are both arranged on the peripheral side frame 210, and the first air inlet 20b and the first air outlet 20c are arranged back to back. Therefore, the air entering from the first air inlet 20b can be transmitted to the first air outlet 20c via a longer path, thereby having a better heat dissipation effect on the heating device 30.

[0077] In this embodiment, the piezoelectric air-cooling component 410 disposed in the first gap 30a abuts against the peripheral side frame 210. The piezoelectric air-cooling component 410 disposed in the first gap 30a abuts against the peripheral side frame 210, so that the air entering the receiving space 10b through the first air inlet 20b can quickly enter the piezoelectric air-cooling component 410 disposed in the first gap 30a, and the air discharged from the piezoelectric air-cooling component 410 can be quickly discharged through the first air outlet 20c, thereby improving the utilization efficiency of the air by the piezoelectric air-cooling module 40 and improving the heat dissipation effect of the heating device 30.

[0078] See also Fig.12 , Fig.12 Another embodiment Figure 1 A cross-sectional schematic diagram of a partial structure of an electronic device along line II is provided. For the convenience of description, Fig.12 The electronic device 1 provided in the corresponding implementation manner is referred to as the electronic device 1 provided in the fourth embodiment (also referred to as embodiment 4). The electronic device 1 also includes a circuit board 50. The circuit board 50 is arranged on one side of the back shell 10, and the circuit board 50 is used to carry the heating device 30. The heating device 30 includes a plurality of heating sub-components 310, and the two ends of the heating device 30 respectively have a first gap 30a with the peripheral side frame 210. Adjacent heating sub-components 310 are arranged with a second gap 30b between them. The piezoelectric air-cooling module 40 has a plurality of piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 are arranged in the first gap 30a and the second gap 30b. Among them, the first air inlet 20b and the first air outlet 20c are both arranged on the top cover 220, the first air inlet 20b is connected to a first gap 30a, and the first air outlet 20c is connected to another first gap 30a.

[0079] In this embodiment, the circuit board 50 is a printed circuit board (PCB) and is used to carry the heating device 30. In this embodiment, the heating device 30 is disposed on a surface of the circuit board 50 facing the back cover.

[0080] The heating device 30 includes a plurality of heating sub-devices 310 , and the types of the heating devices 30 in the plurality of heating sub-devices 310 may be the same or different.

[0081] In this embodiment, the piezoelectric air cooling module 40 includes a plurality of piezoelectric air cooling components 410, and the piezoelectric air cooling components 410 are disposed in the first gap 30a and the second gap 30b, so that more piezoelectric air cooling components 410 are disposed in the receiving space 10b to improve the heat dissipation effect.

[0082] The two ends of the heating device 30 respectively have a first gap 30a with the peripheral side frame 210, so the heating sub-component 310 located at one end of the heating device 30 forms a first gap 30a with the peripheral side frame 210, and the heating sub-component 310 located at the other end of the heating device 30 forms a first gap 30a with the peripheral side. In other words, there are two first gaps 30a between the heating device 30 and the peripheral side frame 210. Adjacent heating sub-components 310 are arranged at intervals of a second gap 30b. The piezoelectric air-cooling module 40 has a plurality of piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 are arranged in the first gap 30a and the second gap 30b. Among them, the first air inlet 20b and the first air outlet 20c are both arranged on the top cover 220, the first air inlet 20b is connected to a first gap 30a (that is, one of the two first gaps 30a), and the first air outlet 20c is connected to another first gap 30a (that is, the other of the two first gaps 30a).

[0083] The two ends of the heating device 30 have first gaps 30a with the peripheral frame 210, respectively. The first air inlet 20b and the first air outlet 20c are both arranged on the top cover 220. The first air inlet 20b is connected to one first gap 30a, and the first air outlet 20c is connected to another first gap 30a. Therefore, the distance between the first air inlet 20b and the first air outlet 20c is relatively far. The air entering from the first air inlet 20b can be transferred to the first air outlet 20c via a longer path, so that the heating device 30 has a better heat dissipation effect.

[0084] In this embodiment, the piezoelectric air-cooling component 410 disposed in the first gap 30a abuts against the top cover 220. The piezoelectric air-cooling component 410 disposed in the first gap 30a abuts against the top cover 220, so that the air entering the receiving space 10b through the first air inlet 20b can quickly enter the piezoelectric air-cooling component 410 disposed in the first gap 30a, and the air discharged from the piezoelectric air-cooling component 410 can be quickly discharged through the first air outlet 20c, thereby improving the utilization efficiency of the air by the piezoelectric air-cooling module 40 and improving the heat dissipation effect on the heating device 30.

[0085] See also Fig.13 , Fig.13 Another embodiment Figure 1 A cross-sectional schematic diagram of a partial structure of an electronic device along line II is provided. For the convenience of description, Fig.13 The electronic device 1 provided in the corresponding embodiment is referred to as the electronic device 1 provided in the fifth embodiment (also referred to as embodiment 5). The electronic device 1 also includes a circuit board 50. The circuit board 50 is arranged on one side of the back shell 10, and the circuit board 50 is used to carry the heating device 30. The heating device 30 includes a plurality of heating sub-components 310, and the two ends of the heating device 30 respectively have a first gap 30a with the peripheral side frame 210. Adjacent heating sub-components 310 are arranged at intervals of a second gap 30b, and the piezoelectric air-cooling module 40 includes a plurality of piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 are arranged in the first gap 30a and the second gap 30b. Among them, the first air inlet 20b is arranged at one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged at the other of the peripheral side frame 210 and the top cover 220, and the first air inlet 20b is connected to a first gap 30a, and the first air outlet 20c is connected to another first gap 30a.

[0086] In this embodiment, the circuit board 50 is a printed circuit board (PCB) and is used to carry the heating device 30. In this embodiment, the heating device 30 is disposed on a surface of the circuit board 50 facing the back cover.

[0087] The heating device 30 includes a plurality of heating sub-devices 310 , and the types of the heating devices 30 in the plurality of heating sub-devices 310 may be the same or different.

[0088] In this embodiment, the piezoelectric air cooling module 40 includes a plurality of piezoelectric air cooling components 410, and the piezoelectric air cooling components 410 are disposed in the first gap 30a and the second gap 30b, so that more piezoelectric air cooling components 410 are disposed in the receiving space 10b to improve the heat dissipation effect.

[0089] The two ends of the heating device 30 respectively have a first gap 30a with the peripheral side frame 210, so the heating sub-component 310 located at one end of the heating device 30 forms a first gap 30a with the peripheral side frame 210, and the heating sub-component 310 located at the other end of the heating device 30 forms a first gap 30a with the peripheral side. In other words, there are two first gaps 30a between the heating device 30 and the peripheral side frame 210. Adjacent heating sub-components 310 are arranged at intervals of a second gap 30b. The piezoelectric air-cooling module 40 has a plurality of piezoelectric air-cooling components 410, and the piezoelectric air-cooling components 410 are arranged in the first gap 30a and the second gap 30b.

[0090] The first air inlet 20b is arranged at one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged at the other of the peripheral side frame 210 and the top cover 220, specifically including: the first air inlet 20b is arranged at the top cover 220, and the first air outlet 20c is arranged at the peripheral side frame 210; or, the first air inlet 20b is arranged at the peripheral side frame 210, and the first air outlet 20c is arranged at the top cover 220. In the schematic diagram of this embodiment, the first air inlet 20b is arranged at the top cover 220, and the first air outlet 20c is arranged at the peripheral side frame 210. It can be understood that it should not be understood as a limitation on the electronic device 1 provided in the embodiment of the present application.

[0091] In this embodiment, the first air inlet 20b is arranged at one of the peripheral side frame 210 and the top cover 220, and the first air outlet 20c is arranged at the other of the peripheral side frame 210 and the top cover 220. This allows the first air inlet 20b and the first air outlet 20c to be flexibly arranged, so that the piezoelectric air cooling module 40 in the electronic device 1 can dissipate heat for the heating device 30 while taking into account the appearance design requirements of the electronic device 1.

[0092] It can be seen from the above introduction that the piezoelectric air-cooling module 40 in the electronic device 1 provided in the first embodiment of the present application and the electronic device 1 provided in the second embodiment is stacked and assembled with the heating device 30. The piezoelectric air-cooling module 40 in the electronic device 1 provided in the third embodiment of the present application, the electronic device 1 provided in the fourth embodiment and the electronic device 1 provided in the fifth embodiment includes a plurality of piezoelectric air-cooling components 410, the heating device 30 includes a plurality of heating sub-components 310, adjacent heating sub-components 310 are arranged at intervals of a second gap 30b, and the plurality of piezoelectric air-cooling components 410 are arranged in the second gap 30b, so the piezoelectric air-cooling module 40 is embedded and assembled with the heating device 30.

[0093] In addition, it can be seen from the above introduction that the piezoelectric air-cooling module 40 in the electronic device 1 provided in the first embodiment of the present application and the electronic device 1 provided in the second embodiment is an integral module. The piezoelectric air-cooling module 40 in the electronic device 1 provided in the third embodiment of the present application, the electronic device 1 provided in the fourth embodiment and the electronic device 1 provided in the fifth embodiment includes a plurality of piezoelectric air-cooling components 410, and therefore, the piezoelectric air-cooling module 40 can be regarded as including a plurality of discontinuous parts. The plurality of piezoelectric air-cooling components 410 can be connected by a connecting circuit. When the piezoelectric air-cooling module 40 includes a plurality of piezoelectric air-cooling components 410, the plurality of piezoelectric air-cooling components 410 cooperate to perform air-cooling heat exchange. Whether the piezoelectric air-cooling module in the electronic device 1 is an integral module or includes a plurality of piezoelectric air-cooling components 410 is related to the size of the piezoelectric air-cooling component 410. In addition, whether the piezoelectric air-cooling module in the electronic device 1 is an integral module or includes a plurality of piezoelectric air-cooling components 410 is related to the structure of the heating device 30.

[0094] See also Fig.14 , Fig.14 Yet another embodiment Figure 1 A schematic cross-sectional view of a partial structure of an electronic device along line II is provided. In this embodiment, the receiving shell 4113 of the piezoelectric air-cooling unit 411 constitutes at least a part of the decoration component 20 .

[0095] The housing shell 4113 of the piezoelectric air-cooling unit 411 constitutes at least a portion of the decorative component 20. For example, the top wall 41131 of the housing shell 4113 of the piezoelectric air-cooling unit 411 constitutes at least a portion of the top cover 220 of the decorative component 20; and / or, the peripheral side walls 41133 of the housing shell 4113 of the piezoelectric air-cooling unit 411 constitute at least a portion of the peripheral side frame 210 of the decorative component 20.

[0096] When the top wall 41131 of the housing 4113 of the piezoelectric air cooling unit 411 constitutes at least part of the top cover 220 of the decorative component 20, the thickness of the decorative component 20 can be made thinner, which is conducive to the thinning of the electronic device 1. When the peripheral side wall 41133 of the housing 4113 of the piezoelectric air cooling unit 411 constitutes at least part of the peripheral side frame 210 of the decorative component 20, the radial dimension of the decorative component 20 can be made smaller, which is convenient for layout in the electronic device 1.

[0097] In combination with the electronic device 1 provided in the above embodiment, the driving circuit for generating the control signal is integrated into the circuit board 50 to reduce the occupation of the receiving space 10 b of the decorative component 20 .

[0098] In one embodiment, when the first air inlet 20b of the decorative component 20 is spaced from the second air inlet 411b of the housing 4113 of the piezoelectric air cooling unit 411, the electronic device 1 further includes an air duct guide structure (which may be named a first air duct guide structure), which connects the first air inlet 20b and the second air inlet 411b. The air duct guide structure can conduct heat in a directional manner and reduce the wind resistance during air flow, so that the air entering through the first air inlet 20b can quickly enter the second air inlet 411b through the air duct guide structure, thereby improving the heat dissipation effect of the piezoelectric air cooling module 40 on the heating device 30. It can be understood from the above introduction that, thanks to the characteristics of piezoelectric materials, the back pressure that the piezoelectric air cooling unit 411 provided in the embodiment of the present application can provide far exceeds that of the fan in the related art, and the demand for the air duct structure in the electronic device 1 is reduced. Therefore, the specific structure of the first air duct guide structure in the electronic device 1 provided in the embodiment of the present application can be relatively simple.

[0099] In one embodiment, when the first air outlet 20c of the decorative component 20 is spaced apart from the second air outlet 411c of the housing 4113 of the piezoelectric air cooling unit 411, the electronic device 1 further includes an air duct guide structure (which may be named a second air duct guide structure), which connects the second air outlet 411c and the first air outlet 20c. The air duct guide structure can conduct heat in a directional manner and reduce the wind resistance during air flow, so that the air discharged through the second air outlet 411c can be quickly discharged through the first air outlet 20c through the air duct guide structure, thereby improving the heat dissipation effect of the piezoelectric air cooling module 40 on the heating device 30. It can be understood from the above introduction that, thanks to the characteristics of piezoelectric materials, the back pressure that the piezoelectric air cooling unit 411 provided in the embodiment of the present application can provide far exceeds that of the fan in the related art, and the demand for the air duct structure in the electronic device 1 is reduced. Therefore, the specific structure of the second air duct guide structure in the electronic device 1 provided in the embodiment of the present application can be relatively simple.

[0100] In addition, in one embodiment, the electronic device 1 further includes a ventilation protective film (which may be named a first ventilation protective film). The ventilation protective film is disposed at at least one of the first air inlet 20b and the first air outlet 20c. The ventilation protective film allows air to pass through, and is used to prevent dust and water vapor from entering the at least one.

[0101] In one embodiment, the piezoelectric air-cooling unit 411 further includes a ventilation protective film (which may be named a second ventilation protective film). The ventilation protective film is disposed at at least one of the second air inlet 411b and the second air outlet 411c. The ventilation protective film allows air to pass through, and is used to prevent dust and water vapor from entering the at least one.

[0102] In addition, in combination with the electronic device 1 provided by any one of the five embodiments provided by the first embodiment to the fifth embodiment introduced above, the working principles of the piezoelectric air cooling module 40 in the electronic device 1 can be divided into two types: the first piezoelectric air cooling module 40 blows air directly onto the surface of the heating device 30 to form an outward airflow to absorb heat from the heating device 30; the second piezoelectric air cooling module 40 is attached to the surface of the heating device 30, and the heat of the heating device 30 is transferred to the interior of the piezoelectric air cooling module 40, and the piezoelectric air cooling module 40 draws external air into the interior of the piezoelectric air cooling module 40 for jet cooling, and then discharges the air.

[0103] In summary, the piezoelectric air-cooling module 40 in the electronic device 1 provided in the embodiment of the present application is arranged in the receiving groove 20a of the decorative component 20 and the receiving space 10b defined by the first opening 10a of the back shell 10, and the piezoelectric air-cooling module 40 includes a piezoelectric air-cooling unit 411, which can realize active air-cooling and heat dissipation. Compared with the above in the related art, the piezoelectric air-cooling unit 411 of the piezoelectric air-cooling module 40 provided in the embodiment of the present application can be manufactured by MEMS precision process, so that the thickness of the piezoelectric air-cooling module 40 is relatively thin. For example, in one embodiment, the thickness of the piezoelectric air-cooling module 40 is less than or equal to 2mm. The thickness of the piezoelectric air-cooling module 40 is relatively thin, so when the piezoelectric air-cooling module 40 is arranged in the receiving groove 20a of the decorative component and the receiving space 10b defined by the first opening 10a of the back shell 10, the overall appearance (ID) of the electronic device 1 is less affected, and the balance between the heat dissipation of the heating device 30 of the electronic device 1 and the positive appearance of the electronic device 1 can be achieved.

[0104] For further information, see Figure 1 In one embodiment, the electronic device 1 further includes a middle frame 60 and a display screen 70. The middle frame 60 is disposed on one side of the back shell 10. When the electronic device 1 includes a circuit board 50 (see Figures 9 to 14), the middle frame 60 carries the circuit board 50, and the middle frame 60 is arranged on the side of the circuit board 50 away from the back shell 10. The middle frame 60 usually serves as the ground of the electronic device 1. The display screen 70 is arranged on the side of the middle frame 60 away from the back shell 10. In other words, the display screen 70 and the back shell 10 are respectively arranged on two opposite sides of the middle frame 60. The display screen 70 is a component for realizing the display function of the electronic device 1.

[0105] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A back shell, wherein the back shell has a first opening; A decoration component, the decoration component having a receiving groove, a first air inlet and a first air outlet, the receiving groove is connected to the first opening to form a receiving space, and the first air inlet and the first air outlet are both connected to the receiving groove; A heating device, wherein the heating device is disposed in the receiving space; and A piezoelectric air-cooling module is arranged in the receiving space and corresponds to the heating device. The piezoelectric air-cooling module includes one or more piezoelectric air-cooling components. The piezoelectric air-cooling components include one or more piezoelectric air-cooling units. The piezoelectric air-cooling unit includes a vibrating member and a piezoelectric member. The piezoelectric member is carried by the vibrating member. The piezoelectric member is used to deform under the control of a control signal and drive the vibrating member to deform so as to dissipate heat from the heating device.

2. The electronic device according to claim 1, wherein: The vibrating element and the piezoelectric element are stacked along a preset direction, the control signal includes a plurality of first sub-control signals and a plurality of second sub-control signals, and the first sub-control signals and the second sub-control signals are alternated in sequence; The first sub-control signal is used to control the piezoelectric element to bend toward the preset direction, and drive the vibration element to bend toward the preset direction; The second sub-control signal is used to control the piezoelectric element to bend in the opposite direction of the preset direction, and drive the vibration element to bend in the opposite direction of the preset direction.

3. The electronic device according to claim 2, characterized in that: The piezoelectric air cooling unit also includes: A containing shell, the containing shell having a containing space, a second air inlet and a second air outlet, the containing space is used to contain the vibrating component and the piezoelectric component, the second air inlet is connected to the containing space and is arranged corresponding to the first air inlet, and the second air outlet is connected to the containing space and is arranged corresponding to the first air outlet.

4. The electronic device according to claim 3, characterized in that: The thickness d of the piezoelectric air-cooling module satisfies: 0 mm < d ≤ 2 mm.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The decorative component comprises: A peripheral side frame, wherein the peripheral side frame has a second opening, one end of the peripheral side frame is arranged corresponding to the back shell, and the second opening is connected to the first opening; and A top cover, the top cover is arranged corresponding to the other end of the peripheral frame and corresponding to the second opening to form the receiving groove; Wherein, the first air inlet is arranged on the peripheral side frame or the top cover, and the first air outlet is arranged on the peripheral side frame or the top cover.

6. The electronic device according to claim 5, characterized in that: The electronic device further comprises: A circuit board, the circuit board is arranged on one side of the back shell, and the circuit board is used to carry the heating device; The piezoelectric air cooling module is arranged on a side of the heating device away from the circuit board; Wherein, the first air inlet and the first air outlet are both arranged on the peripheral side frame, and the first air inlet and the first air outlet are arranged opposite to each other.

7. The electronic device according to claim 5, characterized in that: The electronic device further comprises: A circuit board, the circuit board is arranged on one side of the back shell, and the circuit board is used to carry the heating device; The piezoelectric air cooling module is arranged on a side of the heating device away from the circuit board; Wherein, the first air inlet is arranged at one of the peripheral side frame and the top cover, and the first air outlet is arranged at the other of the peripheral side frame and the top cover.

8. The electronic device according to claim 7, characterized in that: The piezoelectric air-cooling module has a top surface and a peripheral side surface. The top surface of the piezoelectric air-cooling module faces away from the heating device, and the top surface of the piezoelectric air-cooling module fits the top cover, the peripheral side surface is bent and connected to the top surface, and the peripheral side surface of the piezoelectric air-cooling module fits the peripheral side frame.

9. The electronic device according to claim 5, characterized in that: The electronic device further comprises: A circuit board, the circuit board is arranged on one side of the back shell, and the circuit board is used to carry the heating device; The heating device comprises a plurality of heating sub-devices, wherein a first gap is formed between the heating device and the peripheral frame, and adjacent heating sub-devices are arranged at intervals of a second gap. The piezoelectric air-cooling module comprises a plurality of piezoelectric air-cooling components, and the piezoelectric air-cooling components are arranged in the first gap and the second gap. Wherein, the first air inlet and the first air outlet are both arranged on the peripheral side frame, and the first air inlet and the first air outlet are arranged opposite to each other.

10. The electronic device according to claim 5, characterized in that: The electronic device further comprises: A circuit board, the circuit board is arranged on one side of the back shell, and the circuit board is used to carry the heating device; The heating device comprises a plurality of heating sub-devices, both ends of the heating device respectively have a first gap with the peripheral frame, adjacent heating sub-devices are arranged at intervals of a second gap, and the piezoelectric air-cooling module comprises a plurality of piezoelectric air-cooling components, and the piezoelectric air-cooling components are arranged in the first gap and the second gap; Wherein, the first air inlet and the first air outlet are both arranged on the top cover, and the first air inlet is connected to a first gap, and the first air outlet is connected to another first gap.

11. The electronic device according to claim 5, characterized in that: The electronic device further comprises: A circuit board, the circuit board is arranged on one side of the back shell, and the circuit board is used to carry the heating device; The heating device comprises a plurality of heating sub-devices, both ends of the heating device respectively have a first gap with the peripheral frame, adjacent heating sub-devices are arranged at intervals of a second gap, and the piezoelectric air-cooling module comprises a plurality of piezoelectric air-cooling components, and the piezoelectric air-cooling components are arranged in the first gap and the second gap; Among them, the first air inlet is arranged at one of the peripheral side frame and the top cover, the first air outlet is arranged at the other of the peripheral side frame and the top cover, and the first air inlet is connected to a first gap, and the first air outlets are connected to another first gap.

12. The electronic device according to claim 3, characterized in that: The receiving shell of the piezoelectric air-cooling unit constitutes at least a part of the decorative component.

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