Intelligent bionic surface heat dissipation device

Abstract

The invention relates to the technical field of electronic device cooling, and provides an intelligent bionic surface heat dissipation device. The intelligent bionic surface heat dissipation device comprises a base body, the base body is provided with a heat dissipation face and a cavity formed in the base body, a plurality of liquid drainage holes are formed in the heat dissipation face to form a capillary structure, and the liquid drainage holes are communicated with the cavity; the heat dissipation medium is accommodated in the cavity; the plug is arranged on the base body, and the plug can be switched between a first working position and a second working position along with temperature changes; under the condition that the plug is located at the first working position, the drain hole is plugged by the plug; and under the condition that the plug is located at the second working position, the drain hole is opened by the plug, and the heat dissipation medium can be discharged to the heat dissipation surface from the drain hole under the action of capillary force. The intelligent bionic surface heat dissipation device imitates the perspiration process of the human body, the base body is endowed with the heat dissipation capacity adjusting function, the heat dissipation capacity can be adjusted along with changes of the working conditions, and the heat dissipation requirement of electronic devices under the variable working conditions of the ship is met.

Description

Technical Field

[0001] The invention relates to the technical field of electronic device cooling, and in particular to an intelligent bionic surface heat dissipation device. Background Art

[0002] Conventional heat dissipation methods for electronic devices are to use surface fins and air cooling. However, as the power of electronic devices increases and the size decreases, the power density increases significantly, and the demand for heat exchange technology also increases. The traditional means of increasing the heat dissipation capacity of heat dissipation devices is to increase the heat dissipation area by adding fins or heat dissipation spikes to improve the heat dissipation capacity.

[0003] However, in the field of ships, there are variable operating conditions, especially extreme operating conditions, which are prone to thermal shock, which has a great impact on electronic devices, and in severe cases, directly leads to the failure of electronic devices. Therefore, the existing heat dissipation devices cannot meet the heat dissipation needs of electronic devices under variable operating conditions. However, extreme operating conditions account for a relatively small proportion of the entire operating time. If the heat dissipation device is designed based on extreme operating conditions, the heat dissipation device will be large in size and not suitable for ships with limited space. Therefore, there is an urgent need for an adaptive heat dissipation technology that can take into account both the requirements of small size and strong heat dissipation capacity. Summary of the invention

[0004] The present invention provides an intelligent bionic surface heat dissipation device, which is used to solve the problem that the heat dissipation device of electronic devices in the prior art cannot meet the heat dissipation demand under variable working conditions of ships.

[0005] The present invention provides an intelligent bionic surface heat dissipation device, which is characterized by comprising: A substrate, the substrate having a heat dissipation surface and a cavity arranged inside the substrate, the heat dissipation surface is provided with a plurality of drainage holes to form a capillary structure, and the drainage holes are connected to the cavity; a heat dissipation medium, the heat dissipation medium being contained in the cavity; A plug, the plug is arranged on the base, and the plug can be switched between a first working position and a second working position according to temperature changes; When the plug is in the first working position, the plug blocks the drainage hole; when the plug is in the second working position, the plug opens the drainage hole, and the heat dissipation medium can be discharged from the drainage hole to the heat dissipation surface under the action of capillary force.

[0006] An intelligent bionic surface heat dissipation device provided by the present invention also includes: A deformable member, one end of which is connected to the base body, and the other end of which is connected to the plug, and the deformable member can switch between a first size state and a second size state as the temperature changes; When the deformable member is in the first size state, the plug is in the first working position, and the deformable member presses the plug against the base; when the deformable member is in the second size state, the plug is in the second working position.

[0007] According to an intelligent bionic surface heat dissipation device provided by the present invention, the cavity is provided with a first wall surface and a second wall surface which are arranged opposite to each other, the first wall surface is arranged back to back with the heat dissipation surface, the deformable member and the plug are located between the first wall surface and the second wall surface, the plug is located between the deformable member and the first wall surface, one end of the deformable member is fixedly connected to the second wall surface, and the other end of the deformable member is fixedly connected to the plug.

[0008] According to an intelligent bionic surface heat dissipation device provided by the present invention, the deformable part is a memory metal part.

[0009] According to the intelligent bionic surface heat dissipation device provided by the present invention, the memory metal part is a memory metal spring.

[0010] An intelligent bionic surface heat dissipation device provided by the present invention also includes: The heat dissipation fins are arranged at intervals on the heat dissipation surface, and the plurality of drainage holes are arranged in the gaps between the plurality of heat dissipation fins.

[0011] An intelligent bionic surface heat dissipation device provided by the present invention also includes: A plurality of heat dissipation nail columns are arranged at intervals on the heat dissipation surface, and a plurality of drainage holes are arranged in the gaps between the plurality of heat dissipation nail columns.

[0012] According to an intelligent bionic surface heat dissipation device provided by the present invention, a groove is provided on a side of the substrate opposite to the heat dissipation surface, and the groove is used to embed a heat dissipation chip.

[0013] An intelligent bionic surface heat dissipation device provided by the present invention also includes: A fluid replenishing device is communicated with the cavity and is used to replenish the heat dissipation medium into the cavity.

[0014] The present invention also provides an electronic device, comprising: a heat dissipation chip and any one of the above intelligent bionic surface heat dissipation devices, wherein the heat dissipation chip is thermally connected to the substrate.

[0015] The intelligent bionic surface heat dissipation device provided by the present invention forms a capillary structure by arranging a cavity in a base, arranging a heat dissipation medium in the cavity, arranging a drainage hole connected to the cavity on the heat dissipation surface of the base, and blocking or opening the drainage hole by switching the working position with the temperature change using a plug. Under normal working conditions, the drainage hole is blocked and the base is used for normal heat dissipation; under extremely high temperature working conditions, the drainage hole is opened and the capillary force formed by the heat dissipation medium in the capillary structure is used to cause the heat dissipation medium in the cavity to be discharged to the heat dissipation surface, thereby accelerating the dissipation of heat from the base. The heat dissipation device provided by the embodiment of the present invention imitates the sweating process of the human body. Under high heat dissipation requirements, the skin takes away heat through sweating and sweat evaporation, giving the base 1 the function of adjusting the heat dissipation capacity, and being able to adjust the heat dissipation capacity as the working conditions change, thereby meeting the heat dissipation requirements of electronic devices under variable working conditions of ships, that is, taking into account the requirements of small size and strong heat dissipation capacity of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is one of the structural schematic diagrams of the intelligent bionic surface heat dissipation device provided by the present invention.

[0018] Figure 2 This is one of the structural schematic diagrams of the intelligent bionic surface heat dissipation device provided by the present invention.

[0019] Figure 3 It is a top view of the intelligent bionic surface heat dissipation device provided by the present invention.

[0020] Reference numerals: 1. Base; 11. Heat dissipation surface; 12. Cavity; 121. First wall; 122. Second wall; 13. Drain hole; 14. Groove; 2. Heat dissipation medium; 3. Plug; 4. Deformable part; 5. Heat dissipation ribs; 6. Heat dissipation chip. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are for the purpose of clearly describing the numbering of product components and do not represent any substantial difference. The terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to the specific circumstances. In addition, the meaning of "multiple" is two or more.

[0023] Combine the following Figure 1-Figure 3 The intelligent bionic surface heat dissipation device of the present invention is described.

[0024] like Figure 1 and Figure 2 As described above, the intelligent bionic surface heat dissipation device provided in the embodiment of the present invention includes a substrate 1, a heat dissipation medium 2 and a plug 3. The substrate 1 has a heat dissipation surface 11 and a cavity 12 arranged inside the substrate 1. A plurality of drainage holes 13 are arranged on the heat dissipation surface 11 to form a capillary structure, and the drainage holes 13 are connected to the cavity 12. The heat dissipation medium 2 is accommodated in the cavity 12. The plug 3 is arranged on the substrate 1, and the plug 3 can switch between a first working position and a second working position as the temperature changes. When the plug 3 is in the first working position, the plug 3 blocks the drainage hole 13. When the plug 3 is in the second working position, the plug 3 opens the drainage hole 13, and the heat dissipation medium 2 can be discharged from the drainage hole 13 to the heat dissipation surface 11 under the action of capillary force.

[0025] See also Figure 1 and Figure 2 The intelligent bionic surface heat dissipation device provided in the embodiment of the present invention is used to dissipate heat for the heat dissipation chip 6 of the electronic device, and the substrate 1 is thermally connected to the heat dissipation chip 6.

[0026] At least one heat dissipation element selected from the group consisting of heat dissipation fins, heat dissipation ribs, and heat dissipation nails can be provided on the heat dissipation surface 11. The heat dissipation medium 2 uses a safe cooling liquid, usually water. The drainage holes 13 are tiny pores, forming a porous capillary structure. By setting the pores with appropriate pore diameters and porosity, a capillary force can be generated at the junction of the heat dissipation medium 2 and the substrate 1, and the heat dissipation medium 2 is discharged from the drainage holes 13 to the heat dissipation surface 11 under the action of the capillary force.

[0027] A plug 3 may be provided corresponding to each drainage hole 13 , and of course, a plug 3 may be provided corresponding to multiple drainage holes 13 .

[0028] Under normal working conditions, that is, when the heat dissipation chip 6 generates less heat, the temperature of the base 1 is low, and the plug 3 is in the first working position. The heat generated by the heat dissipation chip 6 is conducted to the heat dissipation surface 11 through the base 1, and the heat is dissipated through the heat dissipation surface 11 or through the heat dissipation surface 11 and the heat dissipation element on the heat dissipation surface 11.

[0029] Under extremely high temperature conditions, that is, when the heat dissipation chip 6 generates a large amount of heat, the temperature of the base 1 rises rapidly, the plug 3 switches to the second working position, the drainage hole 13 on the heat dissipation surface 11 opens, and the heat dissipation medium 2 in the cavity 12 is discharged from the drainage hole 13 to the heat dissipation surface 11 under the action of capillary force and the liquid pressure in the cavity 12. After the heat dissipation process of the human body is flattened, the heat dissipation medium 2 takes away the heat through natural evaporation. After the heat is dissipated, the temperature of the base 1 decreases, and the plug 3 returns to the first working position.

[0030] The intelligent bionic surface heat dissipation device provided by the embodiment of the present invention forms a capillary structure by arranging a cavity 12 in the substrate 1, arranging a heat dissipation medium 2 in the cavity 12, and arranging a drainage hole 13 connected to the cavity 12 on the heat dissipation surface 11 of the substrate 1. The drainage hole 13 is blocked or opened by switching the working position with the temperature change by using the plug 3. Under normal working conditions, the drainage hole 13 is blocked, and the substrate 1 is used for normal heat dissipation; under extremely high temperature working conditions, the drainage hole 13 is opened, and the capillary force formed by the heat dissipation medium 2 in the capillary structure is used to cause the heat dissipation medium 2 in the cavity 12 to be discharged to the heat dissipation surface 11, thereby accelerating the heat dissipation of the substrate 1. The heat dissipation device provided by the embodiment of the present invention imitates the sweating process of the human body. Under high heat dissipation requirements, the skin takes away heat through sweating and sweat evaporation, giving the substrate 1 the function of adjusting the heat dissipation capacity, and can adjust the heat dissipation capacity with the change of working conditions, meeting the heat dissipation requirements of electronic devices under variable working conditions of ships, that is, taking into account the requirements of small size and strong heat dissipation capacity of the heat dissipation device.

[0031] The intelligent bionic surface heat dissipation device provided by the embodiment of the present invention further includes a deformation member 4, one end of the deformation member 4 is connected to the base 1, and the other end is connected to the plug 3, and the deformation member 4 can switch between the first size state and the second size state with temperature changes. When the deformation member 4 is in the first size state, the plug 3 is in the first working position, and the deformation member 4 presses the plug 3 against the base 1. When the deformation member 4 is in the second size state, the plug 3 is in the second working position.

[0032] Specifically, the deformable member 4 is a structural member that changes shape under the stimulation of temperature change, and has shape memory and shape recovery capabilities. For example, the deformable member 4 is a memory metal member, that is, a shape memory alloy. Of course, the deformable member 4 can also be a shape memory polymer or other structural member with similar properties, which is not specifically limited in this embodiment.

[0033] Furthermore, the memory metal part is a memory metal spring. The memory metal spring is a spring wound with a shape memory alloy, which utilizes the memory effect of the shape memory alloy, has the dual functions of temperature sensing and driving, can be effectively used as a thermal driving part, can automatically expand and contract according to temperature changes, has small temperature hysteresis, and has strong fatigue resistance.

[0034] In a specific embodiment, the cavity 12 has a first wall 121 and a second wall 122 that are oppositely arranged. The first wall 121 is arranged back to back with the heat dissipation surface 11. The deformation member 4 and the plug 3 are located between the first wall 121 and the second wall 122. The plug 3 is located between the deformation member 4 and the first wall 121. One end of the deformation member 4 is fixedly connected to the second wall 122, and the other end of the deformation member 4 is fixedly connected to the plug 3.

[0035] Under normal working conditions, when the base 1 and the heat sink on the base 1 are sufficient to dissipate the heat of the heat sink chip 6, the deformable member 4 is in the first size state, and the deformable member 4 presses the plug 3 against the first wall 121 to block the drain hole 13. Under high temperature extreme working conditions, the temperature of the heat dissipation medium 2 also rises, and the deformable member 4 is heated to the second size state, the size is reduced, and there is a gap between the plug 3 and the first wall 121, and the heat dissipation medium 2 in the cavity 12 can be discharged from the drain hole 13, and the heat dissipation is accelerated by the evaporation of the heat dissipation medium 2.

[0036] The plug 3 and the memory metal spring are arranged between the first wall surface 121 and the second wall surface 122. When the plug 3 is located at the first working position, the relationship between the pressure on the memory metal spring and its length is: F=K×(L T -X0)(1)

[0037] In formula (1), K=f(T), F is the pressure on the memory metal spring, X0 is the initial length of the memory metal spring, and L T is the length of the memory metal at time T, K is the Hooke's coefficient of the memory metal spring, and K is a function of temperature T, so the length L of the memory metal spring at time T can be obtained T = When the plug 3 and the memory metal spring are distributed in the vertical direction and the plug 3 is located above the memory metal spring, the pressure on the memory metal spring comes from the compression of the first wall 121 and the weight of the plug 3 itself.

[0038] Therefore, at different temperatures, the memory metal spring has different lengths. The length of the memory metal spring is designed in combination with the distance between the first wall 121 and the second wall 122, so that when the temperature gradually rises, the spring gradually contracts, the drainage hole gradually opens, the liquid is discharged and evaporated, and the surface heat dissipation capacity is enhanced. When the heat dissipation gradually decreases and the temperature drops, the memory metal spring gradually recovers, the drainage hole gradually decreases, the liquid discharge amount initially decreases, the evaporation amount also decreases, the heat dissipation capacity decreases, and returns to a balanced state. In this way, the appropriate amount of liquid is adaptively discharged according to the temperature to achieve adaptive adjustment of the heat dissipation capacity.

[0039] The intelligent bionic surface heat dissipation device provided in this embodiment stores the heat dissipation medium 2 in the internal cavity 12 of the substrate 1, senses the temperature of the substrate 1 through the deformable member 4, automatically controls the plug 3 to block or open the drainage hole 13, and uses the capillary structure on the substrate 1 to automatically discharge the internal heat dissipation medium 2 to the heat dissipation surface 11, imitating the mechanism of human skin sweating and heat dissipation, realizing self-evaporative surface heat dissipation, and greatly enhancing the heat dissipation capacity of the surface structure. At the same time, imitating the muscle movement in the human skin, a self-closing mechanism of the drainage hole 13 based on the deformable member 4 is constructed, which can realize autonomous control of drainage under different heating conditions, so that the heat can be evaporated and dissipated through the heat dissipation surface 11 in time.

[0040] The plug 3 can also exist in an intermediate state between the blocked and open states, that is, the size of the drainage hole 13 can be independently controlled under different heating conditions, thereby independently controlling the drainage volume, thereby achieving flexible adaptive adjustment of the heat dissipation capacity.

[0041] It should be noted that the plug 3 can block or open the drain hole 13 by the deformation member 4 as the temperature changes as in the above embodiment, or can block or open the drain hole 13 by other driving members according to the temperature change. For example, the plug 3 is connected to a driving member, a temperature sensor is provided on the base 1, and the driving member is in communication connection with the temperature sensor. When the temperature sensor senses that the temperature rises above the set temperature, the driving member drives the plug 3 to switch to the second working position; when the temperature senses that the temperature drops to the set temperature or below the set temperature, the driving member drives the plug 3 to switch to the first working position.

[0042] It should be noted that the plug 3 can be arranged in the cavity 12, that is, the plug 3 blocks or opens the drainage hole 13 from the inside. The plug 3 can also be arranged outside the cavity 12, that is, the plug 3 blocks or opens the drainage hole 13 from the outside. In a specific embodiment of the present invention, the plug 3 and the deformable member 4 are both arranged in the cavity 12, and the deformable member 4 changes in size after sensing the temperature change, pushing the plug 3 to block the drainage hole 13 or pulling the plug 3 to open the drainage hole 13.

[0043] like Figure 3As shown, the intelligent bionic surface heat dissipation device provided in the embodiment of the present invention further includes heat dissipation ribs 5, a plurality of heat dissipation ribs 5 are arranged at intervals on the heat dissipation surface 11, and a plurality of drainage holes 13 are arranged in the gaps between the plurality of heat dissipation ribs 5. The heat dissipation medium 2 discharged from the drainage holes 13 is spread out in the gaps between the plurality of heat dissipation ribs 5 for evaporation and heat dissipation. Different heat dissipation ribs 5 can be arranged according to actual conditions, such as straight ribs or ring ribs. Air flow and heat transfer can be optimized by the arrangement design of different fins.

[0044] In some optional embodiments, the intelligent bionic surface heat dissipation device provided by the embodiments of the present invention further includes heat dissipation spikes (not shown in the figure), a plurality of heat dissipation spikes are arranged at intervals on the heat dissipation surface 11, and a plurality of drainage holes 13 are arranged in the gaps between the plurality of heat dissipation spikes. The heat dissipation medium 2 discharged from the drainage holes 13 is spread out in the gaps between the plurality of heat dissipation spikes for evaporative heat dissipation. The heat dissipation spikes can increase the heat dissipation area of ​​the heat dissipation device, and can disturb the airflow passing through the heat dissipation device, increase the contact area and contact time between the air and the surface of the heat dissipation device, and thus improve the heat dissipation efficiency. Under the same volume, the heat dissipation spikes have a stronger heat dissipation capacity than the heat dissipation ribs 5.

[0045] In fact, different heat sinks can be combined and arranged on the heat dissipation surface 11 according to the different heat dissipation in different areas of the electronic device, that is, different heat sinks can be arranged in different areas of the heat dissipation surface 11. For example, heat dissipation ribs 5 can be arranged in areas with lower heat dissipation, and heat dissipation pins can be arranged in areas with higher heat dissipation, so that the heat dissipation of the entire electronic device can be more uniform and thermal stress can be reduced.

[0046] On the basis of the above embodiment, a groove 14 is provided on the side of the base 1 opposite to the heat dissipation surface 11, and the groove 14 is used to embed the heat dissipation chip 6. By embedding the heat dissipation chip 6 in the groove 14 of the base 1, the contact area between the heat dissipation chip 6 and the base 1 can be increased, and the heat dissipation efficiency can be improved.

[0047] On the basis of the above-mentioned embodiment, the intelligent bionic surface heat dissipation device provided in the embodiment of the present invention further includes a liquid replenishing device (not shown in the figure), which is connected to the cavity 12 and is used to replenish the heat dissipation medium into the cavity 12. Specifically, the base 1 is provided with a liquid inlet, which is connected to the liquid replenishing device through a pipeline, and the heat dissipation medium 2 can be replenished to the cavity 12 in time through the liquid replenishing device to ensure the normal function of the heat dissipation device.

[0048] The embodiment of the present invention further provides an electronic device. The electronic device includes a heat dissipation chip 6 and the intelligent bionic surface heat dissipation device described in any of the above embodiments, and the heat dissipation chip 6 is thermally connected to the substrate 1. The heat dissipation chip 6 can be thermally connected to the substrate 1 by being embedded in the groove 14 of the substrate 1, and the heat dissipation chip 6 can also be thermally connected to the substrate 1 by means of thermal conductive glue, thermal conductive pads, welding or clamping, etc., which is not specifically limited in this embodiment.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An intelligent bionic surface heat dissipation device, characterized in that: include: A substrate, the substrate having a heat dissipation surface and a cavity arranged inside the substrate, the heat dissipation surface is provided with a plurality of drainage holes to form a capillary structure, and the drainage holes are connected to the cavity; a heat dissipation medium, the heat dissipation medium being contained in the cavity; A plug, the plug is arranged on the base, and the plug can be switched between a first working position and a second working position according to temperature changes; When the plug is in the first working position, the plug blocks the drainage hole; When the plug is in the second working position, the plug opens the drainage hole, and the heat dissipation medium can be discharged from the drainage hole to the heat dissipation surface under the action of capillary force.

2. The intelligent bionic surface heat dissipation device according to claim 1, characterized in that: Also includes: A deformable member, one end of which is connected to the base body, and the other end of which is connected to the plug, and the deformable member can switch between a first size state and a second size state as the temperature changes; When the deformable member is in the first size state, the plug is in the first working position, and the deformable member presses the plug against the base; When the deformable member is in the second size state, the plug is in the second working position.

3. The intelligent bionic surface heat dissipation device according to claim 2, characterized in that: The cavity has a first wall surface and a second wall surface that are arranged opposite to each other, the first wall surface is arranged opposite to the heat dissipation surface, the deformation member and the plug are located between the first wall surface and the second wall surface, the plug is located between the deformation member and the first wall surface, one end of the deformation member is fixedly connected to the second wall surface, and the other end of the deformation member is fixedly connected to the plug.

4. The intelligent bionic surface heat dissipation device according to claim 2, characterized in that: The deformation member is a memory metal member.

5. The intelligent bionic surface heat dissipation device according to claim 4, characterized in that: The memory metal piece is a memory metal spring.

6. The intelligent bionic surface heat dissipation device according to claim 1, characterized in that: Also includes: The heat dissipation fins are arranged at intervals on the heat dissipation surface, and the plurality of drainage holes are arranged in the gaps between the plurality of heat dissipation fins.

7. The intelligent bionic surface heat dissipation device according to claim 1, characterized in that: Also includes: A plurality of heat dissipation nail columns are arranged at intervals on the heat dissipation surface, and a plurality of drainage holes are arranged in the gaps between the plurality of heat dissipation nail columns.

8. The intelligent bionic surface heat dissipation device according to claim 1, characterized in that: A groove is provided on the side of the base body opposite to the heat dissipation surface, and the groove is used for embedding a heat dissipation chip.

9. The intelligent bionic surface heat dissipation device according to claim 1, characterized in that: Also includes: A fluid replenishing device is communicated with the cavity and is used to replenish the heat dissipation medium into the cavity.

10. An electronic device, characterized in that: include: A heat dissipation chip and an intelligent bionic surface heat dissipation device as described in any one of claims 1 to 9, wherein the heat dissipation chip is thermally connected to the substrate.

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