Molding die, resin molding device, and method for manufacturing resin molded article

Abstract

A molding die (C) is provided with: a lower die (LM) including a lower die cavity block (53) and a cartridge block (54) in which a cartridge (54b) is formed; an upper mold (UM) including an upper mold cavity block (64) and a culling block (65) disposed above the cylinder block (54) and capable of lifting independently from the upper mold cavity block (64); a first elastic member (55) that presses the lower mold cavity block (53) to the upper mold (UM); a plurality of support members (63) that are elastically deformable and press the upper mold cavity block (64) and the culling block (65); and a second elastic member (66) capable of pressing the culling block (65) so that the culling block (65) protrudes downward from the lower surface of the upper mold cavity block (64).

Description

Technical Field

[0001] The present disclosure relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product. Background Art

[0002] Substrates or the like having semiconductor chips fixed thereon are usually used as electronic components by resin encapsulation. Conventionally, as a resin molding device for encapsulating substrates or the like with resin, there is known a device having a transfer molding mold for manufacturing semiconductor packages such as MAP (molded array packaging) (for example, see Patent Document 1).

[0003] In the molding die disclosed in Patent Document 1, when a transfer molding die is used to perform resin molding of a resin material with high fluidity, an air vent block is used to close the vent groove. Thus, it is recorded that the air is prevented from remaining in the cavity and causing the resin material to not be filled, and that the resin material is prevented from flowing out of the mold. In addition, as a countermeasure for uneven thickness of the substrate, it is recorded that an elastic member is used in the lower mold cavity block, and a floating pin is used in the upper mold cavity block, so that the cavity block becomes a floating structure.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-226014 Summary of the invention

[0007] Problems to be solved by the invention

[0008] In order to stably manufacture resin molded products, it is preferred that the pressing force applied to the substrate during resin molding is small. However, in the molding die disclosed in Patent Document 1, in order to deal with burrs, the elastic force of the elastic member and the pressing force of the floating pin need to be set to the maximum before the resin material flows in the cavity, so as to suppress the floating of the lower mold cavity block and the upper mold cavity block. As a result, a large pressure is required during resin molding. In addition, since an excessively large pressing force is applied to the substrate during resin molding, sometimes the exhaust hole groove is crushed and the air is not fully discharged, so that the air remains in the cavity and a gap is generated, or the resin material is not filled into the entire cavity.

[0009] Therefore, a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product that can stably manufacture a resin molded product by reducing the pressing force acting on a substrate during resin molding are desired.

[0010] Solutions for solving problems

[0011] The molding die disclosed in the present invention is characterized in that it comprises: a lower mold, including a lower mold cavity block for placing a molding object, and a barrel block formed with a barrel for filling the resin material; an upper mold, including an upper mold cavity block having a mold cavity and a venting hole groove, and a cull block arranged above the barrel block and capable of being raised and lowered independently of the upper mold cavity block; a first elastic member for pressing the lower mold cavity block toward the upper mold; a plurality of supporting members that can be elastically deformed to press the upper mold cavity block and the cull block; and a second elastic member that can press the cull block so that the cull block protrudes downward from the lower surface of the upper mold cavity block.

[0012] The resin molding device disclosed in the present invention is characterized in that it includes the above-described molding die and a mold clamping mechanism for clamping the molding die.

[0013] The manufacturing method of the resin molded product disclosed in the present invention is characterized in that it is a manufacturing method of the resin molded product using the resin molding device described above, and includes the following steps: a supply step, supplying the molding object and the resin material to the molding die; a clamping step, elastically deforming the second elastic member through a first clamping force, causing the rejection block to contact the barrel block and causing the lower surface of the upper mold cavity block to contact the upper surface of the molding object, thereby supplying the resin material filled in the barrel to the mold cavity and closing the exhaust hole groove using the second clamping force; and a molding step, performing resin molding of the molding object.

[0014] Effects of the Invention

[0015] According to the present disclosure, it is possible to provide a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product that can stably manufacture a resin molded product by reducing the pressing force acting on a substrate during resin molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram showing a resin molding apparatus according to this embodiment.

[0017] Figure 2 A schematic diagram showing a mold clamping mechanism of a resin molding device.

[0018] Figure 3 A schematic diagram showing a molding process including a mold clamping process.

[0019] Figure 4 A graph showing the relationship between the molding time in the molding process, the position of the transfer mechanism, the mold clamping force, and the supply pressure of the molten resin. DETAILED DESCRIPTION

[0020] Hereinafter, embodiments of the molding die, resin molding apparatus, and method for manufacturing a resin molded product disclosed herein will be described based on the drawings. However, the present disclosure is not limited to the following embodiments, and various modifications are possible without departing from the gist thereof.

[0021] [Overall structure of the device]

[0022] Molding objects such as substrates with semiconductor chips (hereinafter sometimes referred to as "chips") fixed thereon are used as electronic parts by resin encapsulation. Such electronic parts are used, for example, as high-frequency module substrates for portable communication terminals, module substrates for power control, substrates for device control, and the like. As one of the technologies for resin encapsulation of molding objects, there is a transfer method of manufacturing semiconductor packages by resin encapsulation of BGA (Ball Grid Array) substrates and the like. This transfer method is a method of placing a substrate with a chip fixed thereon in a mold cavity of a molding mold, supplying a resin sheet formed by solidifying a powdered resin into the barrel of the molding mold, heating and melting the resin sheet, and then, in a state where the molding mold is closed, supplying a molten resin formed by melting the resin sheet into the mold cavity to solidify it, and then opening the mold to manufacture a resin molded product.

[0023] It should be noted that the powdered resin includes not only a powdered resin, but also a resin sheet formed by compacting and consolidating the powdered resin into a solid resin, either of which is melted by heating to become a liquid molten resin. The powdered resin can be a thermoplastic resin or a thermosetting resin. As for thermosetting resins, the viscosity decreases when heated, and when further heated, it will polymerize and solidify to become a solidified resin. For the powdered resin in this embodiment, based on the ease of operation, it is preferably a resin sheet formed by a solid resin, and further in order to reliably fill the molten resin between the chip and the substrate, it is preferably a thermosetting resin with high fluidity containing micronized fillers.

[0024] Figure 1 1 shows a schematic structure of a resin molding device 100 of this embodiment. The resin molding device 100 is a device that uses a molding die C to mold a pre-resin molding substrate Sa (an example of a molding object) with resin. In this embodiment, the pre-resin molding substrate Sa is rectangular and has a semiconductor chip fixed thereto in advance.

[0025] The resin molding device 100 includes: a CPU 1 (central processing unit) as a central control device; a storage unit 8 storing control information such as a control program; a molding mechanism 2 having a molding die C; a drive mechanism driving each part described later; and a touch panel 9 receiving an operation instruction from a user and input of abnormality processing related information, and displaying various output information of the resin molding device 100. The CPU 1 constitutes a control unit 10, and the control unit 10 controls the operation of each part of the resin molding device 100 by executing a program stored in the storage unit 8, etc.

[0026] Unless otherwise specified, the operation of the resin molding device 100 described below is performed based on the operation command of the control unit 10. In the following description, the operation command of the control unit 10 is omitted in principle, and the operation command of the control unit 10 is described as needed.

[0027] The resin molding device 100 is composed of a device that sequentially connects the modules of a supply module M1, a molding module M2, and a storage module M3. The supply module M1 has a feed box 7 that accommodates a plurality of pre-resin molding substrates Sa, the molding module M2 has a molding die C, and the storage module M3 has a discharge box 72 that stores a resin-molded substrate Sb (an example of a resin molded product) after the pre-resin molding substrate Sa is molded using resin. A guide G that spans each of these modules and is arranged in a straight line is provided in the supply module M1, the molding module M2, and the storage module M3. The guide G is a rail-shaped member that allows the loader 40 and the unloader 44 described later to travel. The guide G is arranged on the back side of each module.

[0028] Each module is disposed so as to be detachable from each other and to be increased or decreased. The resin molding device 100 of this embodiment has two molding modules M2. The resin molding device 100 may have only one molding module M2 or three or more molding modules M2.

[0029] 〔Drive mechanism〕

[0030] The driving mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transmission mechanism 39 described later (see Figure 2 ).

[0031] The loader 40 is a conveying mechanism for carrying the pre-resin molding substrate Sa into the molding die C. The substrate supply unit 42 is a conveying mechanism for pushing the pre-resin molding substrate Sa from the feed box 7 and delivering it to the arrangement mechanism 70. The unloader 44 is a conveying mechanism for carrying the resin molding-completed substrate Sb out of the molding die C. The transfer mechanism is a mechanism for supplying the resin formed by melting the resin sheet T (an example of resin material) from the barrel to the cavity in the molding die C. The mold clamping mechanism 35 is a mechanism for clamping the molding die C. The transfer mechanism 39 is driven independently of the mold clamping mechanism 35.

[0032] The loader 40, the substrate supply unit 42, and the unloader 44 have actuators 40b, 42b, and 44b, respectively. The actuators 40b, 42b, and 44b are air cylinders corresponding to their respective installation locations, distances for driving each part, and the like.

[0033] 〔Substrate supply unit〕

[0034] The substrate supply unit 42 is a mechanism for pushing out the pre-resin molding substrates Sa one by one from the feed box 7, which is a storage container for storing a plurality of pre-resin molding substrates Sa at intervals in the vertical direction, and conveying them to the arrangement mechanism 70. The substrate supply unit 42 has an actuator 42b. In the present embodiment, the substrate supply unit 42 pushes the pre-resin molding substrates Sa from the feed box 7 by the actuator 42b, and moves it to the arrangement mechanism 70 arranged adjacent to the feed box 7. The arrangement mechanism 70 has a rotating disk 70a, and when the pre-resin molding substrates Sa are placed, the rotating disk 70a is rotated to arrange the pre-resin molding substrates Sa in a state suitable for the loader 40 to pick up the pre-resin molding substrates Sa. The substrate supply unit 42, the feed box 7, and the arrangement mechanism 70 are provided in the supply module M1. The substrate supply unit 42, the feed box 7, and the arrangement mechanism 70 are arranged on the front side of the guide G in the supply module M1.

[0035] 〔Loader〕

[0036] The loader 40 is a conveying mechanism for carrying the pre-resin molding substrate Sa into the molding die C. The loader 40 can move from the supply module M1 to the molding module M2 along the guide G. The loader 40 has a loader pickup unit 40a for picking up the pre-resin molding substrate Sa and the resin sheet T.

[0037] The loader pickup unit 40a includes a plurality of pairs of claws (not shown) extending downward. The loader pickup unit 40a drives the pair of claws by an actuator (not shown) to pick up the pre-resin molding substrate Sa from the arranging mechanism 70, transport it to the lower mold LM of the molding die C, and place (carry in) it on the lower mold LM. Hereinafter, the picking-up operation of the loader pickup unit 40a is simply referred to as picking up.

[0038] The loader pickup unit 40a drives the resin material holding claws by other actuators (not shown) to pick up the resin sheet T from the resin supply device 79. The resin sheet T is picked up in the same manner as the pre-resin molding substrate Sa. However, in this embodiment, each claw picks up one resin sheet.

[0039] The loader pickup 40a can be moved by the actuator 40b from Figure 1 The loader 40 moves forward and backward from the back side to the front side. The loader 40 moves forward and backward from the loader pickup portion 40a, picks up the pre-resin molding substrate Sa from the arrangement mechanism 70, moves from the supply module M1 to the molding module M2, and carries the pre-resin molding substrate Sa into the molding die C. In addition, the loader 40 moves forward and backward from the loader pickup portion 40a, picks up the resin sheet T from the resin supply device 79, moves from the supply module M1 to the molding module M2, and carries the resin sheet T into the molding die C.

[0040] 〔Unloader〕

[0041] The unloader 44 is a conveying mechanism for carrying out the resin-molded substrate Sb from the molding die C. The unloader 44 can move from the molding module M2 to the storage module M3 along the guide G. The unloader 44 has an unloader pickup unit 44a for picking up the resin-molded substrate Sb and the like. The unloader pickup unit 44a can use an actuator 44b to move the substrate Sb from the molding module M2 to the storage module M3. Figure 1 The unloader 44 moves forward and backward from the back side to the front side. As for the unloader 44, the unloader pickup portion 44a moves forward and backward, picks up the resin-molded substrate Sb from the lower mold LM of the molding mold C, moves from the molding module M2 to the storage module M3, and carries the resin-molded substrate Sb into the gate disconnection mechanism 71 of the storage module M3. The unloader 44 conveys the resin-molded substrate Sb after removing the unnecessary resin part by the gate disconnection mechanism 71 and stores it in the discharge box 72.

[0042] It should be noted that the unloader pickup part 44a includes a plurality of pairs of claws (not shown) extending downward, similarly to the loader pickup part 40a. Pickup by the unloader pickup part 44a is performed similarly to the pickup by the loader pickup part 40a.

[0043] Next, the molding module M2 will be described in detail.

[0044] like Figure 2As shown, in the molding module M2, tie-bars 32 are erected at the four corners of the lower fixed plate 31 which is rectangular when viewed from above, and an upper fixed plate 33 which is rectangular when viewed from above is provided near the upper end of the tie-bar 32. A movable platen 34 which is rectangular when viewed from above is provided between the lower fixed plate 31 and the upper fixed plate 33. The movable platen 34 is provided with holes at the four corners for the tie-bars 32 to pass through so that it can move up and down along the tie-bars 32. A clamping mechanism 35 which is a device for moving the movable platen 34 up and down is provided on the lower fixed plate 31. The clamping mechanism 35 includes: an electric motor Ma composed of a servo motor or the like as a driving source; and a load sensor Wa composed of a strain gauge, a force sensor, etc. for measuring the clamping force (hereinafter referred to as "clamping force") of the molding mold C. The mold clamping mechanism 35 can clamp the molding die C by moving the movable platen 34 upward, and can open the molding die C by moving the movable platen 34 downward.

[0045] The molding die C is configured to include a lower die LM and an upper die UM. The lower die LM and the upper die UM are composed of dies and the like arranged to face each other.

[0046] The lower mold LM is placed on the lower mold plate 38, and the lower mold plate 38 is placed on the movable platen 34. The lower mold LM includes a base block 51, a side block 52 placed on the base block 51, a lower mold cavity block 53, and a barrel block 54. The side block 52 is mounted on the base block 51. A first elastic member 55 is arranged between the base block 51 and the lower mold cavity block 53, and the first elastic member 55 presses the lower mold cavity block 53 toward the upper side of the upper mold UM relative to the base block 51. As an example of the first elastic member 55, for example, an elastic member in which a plurality of disc springs are stacked. The lower mold cavity block 53 is arranged so that it can move relative to the base block 51 and the side block 52 in the vertical direction by elastic deformation of the first elastic member 55. That is, the lower mold LM has a floating structure in which the lower mold cavity block 53 can move in the vertical direction. It should be noted that the elastic force of the first elastic member 55 is set so that the elastic deformation starts before the floating pin 63 described later when the mold is closed.

[0047] In the state before the molding mold C is closed, in the lower mold LM, the upper surface of the lower mold cavity block 53 is flush with the upper surface 58 of the side block 52. The substrate Sa before resin molding is placed on the upper surface of the lower mold cavity block 53 in a manner such that the surface on which the semiconductor chip Sc and the like are fixed faces upward. In addition, a lower mold heater 36 for heating the substrate Sa before resin molding and the resin sheet T is built into the lower mold cavity block 53. In the present embodiment, the lower mold LM has two lower mold cavity blocks 53, 53, and a barrel block 54 is arranged at a position sandwiched by the two lower mold cavity blocks 53, 53. A cylindrical recess, namely a barrel 54b, is formed in the barrel block 54, and the interior of the barrel 54b is filled with a resin sheet T (resin melted by heating). Below the barrel block 54, the plunger 54a driven by an electric motor Mb such as a servo motor is inserted so that the plunger 54a can move up and down. An elastic member (not shown) is provided at the support portion of the plunger 54a, and the plunger 54a is slightly displaced by the elastic force of the elastic member to release the excess pressing force, and can adapt to the deviation of the resin amount when the resin sheet T is melted during the pressure holding. In addition, the lower mold LM has a load sensor Wb composed of a strain gauge, a force sensor, etc. for measuring the force of the plunger 54a to push out the molten resin Ta (an example of the resin material).

[0048] The upper mold UM is arranged opposite to the lower mold LM. The upper mold UM has: a holder base 61 fixed to the lower surface of the upper fixed plate 33, a pin holder 62 fixed to the lower surface of the holder base 61, and an upper mold cavity block 64 and a reject block 65 supported by the pin holder 62 via a plurality of floating pins 63 (an example of a supporting member). The plurality of floating pins 63 are respectively inserted into a plurality of through holes formed in the pin holder 62, and the upper and lower ends are not fixed to the holder base 61, the upper mold cavity block 64, and the reject block 65. The length of the floating pin 63 arranged above the reject block 65 is the same as the length of the floating pin 63 arranged above the upper mold cavity block 64. As described later, since the ejector block 65 is supported on the holder base 61 via the second elastic member 66 in a manner that the lower surface 69 thereof protrudes downward from the lower surface 68 of the upper cavity block 64, the other end of the floating pin 63 disposed on the ejector block 65, which is held by the pin holder 62, is separated from the holder base 61. In the state before the molding mold C is closed, the upper cavity block 64 and the ejector block 65 are separated from the pin holder 62.

[0049] A cavity MC, which is a recessed portion for supplying molten resin Ta, is formed on a lower surface 68 of the upper cavity block 64. An upper heater 37 for heating the cavity MC is built into the upper cavity block 64. The upper cavity block 64 faces the lower cavity block 53 and the side blocks 52.

[0050] In the present embodiment, the upper mold UM has two upper mold cavity blocks 64, 64, and a reject block 65 is arranged at a position sandwiched by the two upper mold cavity blocks 64, 64. The reject block 65 has a flow path 65a for allowing the molten resin Ta to flow from the barrel 54b of the barrel block 54 to the cavity MC. That is, the reject block 65 is arranged above the barrel block 54. The upper mold cavity block 64 and the reject block 65 are composed of separate components, and the reject block 65 is configured to be able to rise and fall independently from the upper mold cavity block 64 (can be moved in the up and down directions). The reject block 65 is provided with an inlet, i.e., a gate 65b, through which the molten resin Ta flows from the flow path 65a to the cavity MC. One end of the reject block 65 is supported on the retaining frame base 61 via a second elastic member 66 fixed to the retaining frame base 61. The ejection block 65 is configured so that, before the mold C is closed, the lower surface 69 of the ejection block 65 protrudes downward from the lower surface 68 of the upper mold cavity block 64 through the second elastic member 66. An elastic member in which a plurality of disc springs are stacked can be cited as an example of the second elastic member 66. It should be noted that the elastic force of the second elastic member 66 is set so that it starts to elastically deform before the first elastic member 55 when the mold is closed.

[0051] A vent groove 64a for discharging air from the cavity MC to the outside of the upper mold UM is formed at the lower surface 68 of the upper mold cavity block 64 and at a position separated from the gate 65b. The vent groove 64a is configured to be opened and closed by a vent block 67. One end of the vent block 67 is mounted on the pin holder 62, and is inserted into a through hole formed in the upper mold cavity block 64 in such a manner that it is located in the middle of the vent groove 64a when advancing. The lower end of the vent block 67 is set to be above the lower surface 68 of the upper mold cavity block 64 in a state before the molding mold C is closed. That is, when the molding die C is in a state of being molded, when the vent block 67 is arranged flush with or above the bottom surface of the vent groove 64a, the air in the cavity MC can be discharged to the outside of the upper mold UM by operating the pump not shown, and when the vent block 67 advances (moves downward) and closes the vent groove 64a, the air in the cavity MC (and the molten resin Ta) cannot be discharged to the outside of the upper mold UM. Since one end of the vent block 67 of the present embodiment is mounted on the pin holder 62, when the floating pin 63 is compressed by the mold closing mechanism 35, the vent block 67 can be relatively advanced (moved downward) relative to the upper mold cavity block 64. Therefore, there is no need for a special drive mechanism for advancing and retreating the vent block 67, the structure of the molding die C can be simplified, and the molding die C can be constructed inexpensively.

[0052] [Manufacturing method of resin molded product]

[0053] Next, use Figure 1 to Figure 4The manufacturing method of the resin molded product is described. The manufacturing method of the resin molded product (resin molded substrate Sb) includes: a supply process, supplying the pre-resin molded substrate Sa and the resin sheet T to the molding mold C; a mold clamping process, clamping the molding mold C; and a molding process, by filling the molten resin Ta supplied from the gate 65b into the cavity MC, to resin mold the pre-resin molded substrate Sa. The molding process is a process in which the molding module M2 performs resin molding on the pre-resin molded substrate Sa during the period from the time when the pre-resin molded substrate Sa is moved into the molding module M2 to the time when the resin molded substrate Sb is moved out of the molding module M2, and the molding process includes a mold clamping process. The operation of the molding mold C and the mold clamping mechanism 35 in the molding process is controlled by the control unit 10.

[0054] First, the supply process is described. Figure 1 As shown, the loader 40 is preheated in the state where the storage space of the resin sheet T is insulated. In addition, the heaters 36 and 37 are energized to preheat the molding die C (see also Figure 2 ). Then, a plurality of pre-resin molded substrates Sa taken out from the feed box 7 are placed on the arrangement mechanism 70. The arrangement mechanism 70 has a rotating disk 70a, and when the pre-resin molded substrates Sa are placed, the rotating disk 70a is rotated to arrange the pre-resin molded substrates Sa into a state suitable for the loader 40 to pick up the pre-resin molded substrates Sa. The loader pickup unit 40a uses the actuator 40b to pick up the pre-resin molded substrates Sa from the arrangement mechanism 70 and place it on the loader 40, and picks up the resin sheet T from the resin supply device 79 and accommodates it in the accommodating space for the resin sheet T of the loader 40. Then, the loader 40 transports the pre-resin molded substrate Sa to the molding module M2, places the pre-resin molded substrate Sa with one side on which the semiconductor chip Sc is fixed facing upward on the substrate setting portion of the lower mold LM, and accommodates the resin sheet T in the barrel 54b of the barrel block 54 (refer to Figure 2 ). By accommodating the resin sheet T in the barrel 54b of the barrel block 54, the lower mold heater 36 built into the lower mold LM heats the resin sheet T to become a molten resin Ta. It should be noted that before the movable platen 34 is raised by the clamping mechanism 35 described later, a release film (not shown) is previously made to be adsorbed on the lower surface 68 of the upper mold cavity block 64 of the upper mold UM.

[0055] Next, the molding process including the mold clamping process is described. Figure 2 In the state shown, the movable platen 34 is moved upward by the mold clamping mechanism 35, so that the lower mold LM is relatively moved in the direction of the upper mold UM, as shown in FIG. Figure 3As shown in (A), the cylinder block 54 is brought into contact with the ejector block 65. At this time, the upper surface 56 of the pre-resin molding substrate Sa placed on the lower mold LM and the lower surface 68 of the upper mold cavity block 64 are not in contact.

[0056] Figure 4 They show respectively: Figure 4 (A), wherein the horizontal axis is the molding time of the resin molded product and the vertical axis is the coordinate diagram of the position of the transmission mechanism; Figure 4 (B), the horizontal axis is the same molding time, and the vertical axis is the coordinate diagram of the clamping force; and Figure 4 (C) shows a coordinate diagram in which the horizontal axis represents the same molding time and the vertical axis represents the supply pressure of the molten resin Ta to the cavity MC. That is, Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4 The items on the horizontal axis of the coordinate graph (C) are common, and the items on the vertical axis are different. Figure 3 The state of (A) is set to zero (reference position). Figure 3 The state shown in (A) is Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4 That is, at time (a), the transfer mechanism has not moved upward from the reference position as shown in the coordinate graph (A), the clamping force obtained by the elastic force of the second elastic member 66 has not yet occurred as shown in the coordinate graph (B), and the supply of the molten resin Ta has not yet started as shown in the coordinate graph (C), so the supply pressure is zero. Figure 3 The state of mold clamping when (A) is called the first mold clamping state. Figure 4 Each time (timing) from time (a) to time (e) shown is preset by the control unit.

[0057] After the time (a) has passed, if the movable platen is further moved upward by the mold clamping mechanism from the first mold clamping state, and the lower mold LM is relatively moved in the direction of the upper mold UM, the second elastic member 66 begins to elastically deform, and a deformation occurs. Figure 4 The mold clamping force (hereinafter referred to as the "first mold clamping force") shown in the coordinate diagram (B) of Figure 3As shown in (B), the second elastic member 66 elastically deforms while the barrel block 54 and the rejection block 65 remain in close contact, and the upper surface 56 of the substrate Sa before resin molding contacts the lower surface 68 of the upper mold cavity block 64. At this time, the first elastic member 55 and the floating pin 63 have no elastic force at all on the substrate Sa before resin molding and the upper mold cavity block 64, or only slightly act on them. Therefore, the pressing force exerted on the substrate Sa before resin molding by the first elastic member 55 and the floating pin 63 is extremely small. Therefore, the upper surface of the lower mold cavity block 53 maintains a flush state with the upper surface 58 of the side block 52. Later, Figure 3 The mold-closing state at (B) is called the second mold-closing state. Figure 3 (B) shows a state where the molten resin Ta is supplied while keeping the positional relationship between the lower mold LM and the upper mold UM as described above.

[0058] In the second mold clamping state, the air in the cavity MC is exhausted from the exhaust hole groove 64a by a pump (not shown), and the plunger 54a is moved upward by the electric motor Mb, so that the molten resin Ta flows from the barrel 54b to the gate 65b through the flow path 65a of the ejector block 65. Thus, the supply of the molten resin Ta to the cavity MC is started. When the supply starts, Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4 In the coordinate graph (C), the time (b) is used to represent it. That is, at time (b), the transfer mechanism including the plunger 54a starts to move upwards as shown in the coordinate graph (A), the first clamping force after time (a) is maintained as shown in the coordinate graph (B), and the supply of the molten resin Ta starts and the supply pressure is generated as shown in the coordinate graph (C), but the pressure is small. Therefore, even if the pressing force acting on the pre-resin molding substrate Sa is small, the molten resin Ta will not leak out of the molding mold C.

[0059] Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4 After the time (b) in the coordinate diagram (C) of FIG. 1 , the transmission mechanism including the plunger rises while maintaining the second state (refer to FIG. 1 ). Figure 4 The molten resin Ta in the barrel 54b gradually fills the cavity MC. Figure 4 As shown in the coordinate diagram (B), the first clamping force is maintained, and as Figure 4 As shown in the coordinate diagram (C), the supply pressure of the molten resin Ta is maintained at a small state. Then, just before the molten resin Ta is filled into the cavity MC and the resin does not leak out of the molding mold C (time (c), the mold clamping mechanism further moves the movable platen upward to increase the mold clamping force (refer to Figure 4As a result, the first elastic member 55 is elastically deformed, as shown in FIG. Figure 3 As shown in (C), the side block 52 of the lower mold LM contacts the upper mold cavity block 64 of the upper mold UM, and the upper surface 56 of the substrate Sa before resin molding is flush with the upper surface 58 of the side block 52 and the upper surface 57 of the barrel block 54. After the compression amount (elastic deformation amount) obtained by the elastic deformation of the first elastic member 55 becomes maximum, the floating pin 63 elastically deforms, and when its compression amount becomes maximum, the pin holder 62 contacts the upper mold cavity block 64. As a result, Figure 3 As shown in (C), the vent groove 64a is closed by the vent block 67. As a result, the air in the cavity MC cannot be discharged to the outside, but since the cavity MC is almost filled with the molten resin Ta and there is almost no air left, no gap will be generated after the molten resin Ta solidifies. Hereinafter, the mold clamping state at this time is referred to as the third mold clamping state, and the mold clamping force is referred to as the second mold clamping force. It should be noted that Figure 3 (B) to Figure 3 The compression of the floating pin 63 due to elastic deformation in (C) is exaggerated. The actual compression amount of the floating pin 63 is very small.

[0060] Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4 After the time (c) in the coordinate diagram (C) of FIG. 1 , the transfer mechanism including the plunger rises and supplies the molten resin Ta into the cavity MC. At the time (d), the plunger 54a reaches the top dead center. After the time (d), the plunger 54a does not move, but Figure 4 As shown in the coordinate diagram (A), the transfer mechanism continues to rise. The reason for this is that the elastic member (not shown) provided on the support portion of the plunger 54a is elastically deformed. As a result, the molten resin Ta remaining in the barrel 54b is gradually filled into the cavity MC, and since the exhaust hole groove 64a is closed, the supply pressure of the molten resin Ta rises sharply (see Figure 4 Then, when the supply pressure of the molten resin Ta reaches a predetermined value, the transfer mechanism stops (see Figure 4 Coordinate diagram (A) Figure 4 The supply of the molten resin Ta is terminated. Figure 4 As shown in the coordinate diagram (B), the third mold clamping state and the second mold clamping force are maintained after time (c).

[0061] like Figure 4 Coordinate diagram (A) Figure 4 Coordinate diagram (B), Figure 4As shown in the coordinate diagram (C), after time (e), the position of the transfer mechanism, the clamping force, and the supply pressure of the molten resin maintain this state, so that the molten resin Ta is solidified. Then, after a specified time, the control unit 10 reduces the clamping force of the clamping mechanism to move the movable platen downward to open the molding mold C. Next, the resin-molded substrate Sb is demolded from the cavity MC to end the resin molding. Then, the unloader picking portion 44a of the unloader 44 is used to pick up the resin-molded substrate Sb, and the unloader 44 is used to move the resin-molded substrate Sb from the molding module M2 to the storage module M3. Then, the gate disconnection mechanism 71 is used to remove the unnecessary resin portion from the resin-molded substrate Sb, and then it is accommodated in the discharge box 72 (refer to Figure 1 ).

[0062] In this embodiment, the upper surface 56 of the substrate Sa before resin molding contacts the lower surface 68 of the upper mold cavity block 64 by elastically deforming the second elastic member 66, and the first elastic member 55 and the floating pin 63 start to supply resin in a state where there is no elastic force at all or only a slight elastic force on the substrate Sa before resin molding and the upper mold cavity block 64, and resin supply can be performed. In the existing device, the resin supply must be performed by elastically deforming the first elastic member 55 of the lower mold so that the upper surface 56 of the substrate Sa before resin molding contacts the lower surface 68 of the upper mold cavity block 64, and only the clamping force (pressing force) of the magnitude of the elastic deformation of the first elastic member 55 is applied to the substrate before resin molding during resin injection. In this embodiment, the second elastic member 66 is set to start elastic deformation before the first elastic member 55, that is, the elastic coefficient of the second elastic member 66 is set to be smaller than the elastic coefficient of the first elastic member 55, so that the pressing force acting on the substrate during resin molding can be reduced.

[0063] Furthermore, in the present embodiment, immediately before the molten resin Ta is completely filled into the cavity MC, the first elastic member 55 and the floating pin 63 are elastically deformed, and first, the upper surface 56 of the pre-resin molding substrate Sa is flush with the upper surface 58 of the side block 52 and the upper surface 57 of the barrel block 54, and then the floating pin 63 is completely elastically deformed immediately, and the venting hole groove 64a is closed by the venting hole block 67. In the conventional device, the elastic force for starting the elastic deformation of the floating pin 63 needs to be set much larger than the elastic force for elastic deformation of the first elastic member 55 so that the venting hole groove is not closed until immediately before the molten resin Ta is completely filled into the cavity MC. In the present embodiment, the resin can be filled into the substantially entire cavity MC with a smaller clamping force (the first clamping force in the present embodiment) than in the past, so it is not necessary to set the elastic force for starting the elastic deformation of the floating pin 63 as large as in the past so that the venting hole groove 64a is not closed, and the final clamping force (the second clamping force in the present embodiment) can also be set smaller than in the past. As a result, the pressing force acting on the substrate during resin molding can be reduced.

[0064] [Other implementation methods]

[0065] Hereinafter, other embodiments of the above-mentioned embodiment will be described. It should be noted that, for easy understanding, the same terms and reference numerals are used for the same components as those of the above-mentioned embodiment.

[0066] <1> In the above embodiment, the powdery particulate resin of the resin sheet T is a high-flowability thermosetting resin containing a filler, but it does not need to be a high-flowability resin. Furthermore, it is not necessary to contain a filler.

[0067] <2> In the above embodiment, the first elastic member 55 and the second elastic member 66 are each an elastic member formed by laminating a plurality of disc springs, but the present invention is not limited thereto. For example, any elastic member may be used, such as a compression coil spring.

[0068] <3> In the above embodiment, the substrate Sa before resin molding is rectangular, but the present invention is not limited thereto. For example, a substrate of any shape such as a circular substrate may be used. In addition, the size of the substrate is not limited thereto.

[0069] Assuming that the size of the substrate Sa before resin molding increases, the cavity MC of the upper mold cavity block 64 increases, and the area outside the cavity MC of the upper mold cavity block 64 that contacts the upper surface 56 of the substrate Sa before resin molding becomes relatively smaller. In this case, the pressure applied to the upper surface 56 of the substrate Sa before resin molding by the clamping force becomes larger than the case of using the upper mold cavity block 64 with a small cavity MC. However, if the resin molding device 100 using the molding mold C of this embodiment is used, since the clamping force when supplying the molten resin Ta can be made into the first clamping force in which only the second elastic member 66 exerts elastic force, even if the size of the substrate Sa before resin molding is large, it is possible to prevent excessive pressing force from being applied to the substrate Sa before resin molding.

[0070] <4> In the above embodiment, Figure 4 The time (c) (the time elapsed from time (b)) at which the clamping force changes from the first clamping force to the second clamping force as shown in the coordinate graph (B) of FIG. 1 is preset by the control unit 10, but is not limited thereto. For example, the clamping force may be controlled to change based on the resin pressure of the molten resin Ta measured by the load sensor Wb. In addition, the clamping force may be controlled to change based on Figure 4 The mold clamping force is changed by the position of the transmission mechanism 39 (position of the plunger 54a) shown in the coordinate diagram (A).

[0071] <5> In the above embodiment, the ejector block 65 is disposed only in the upper mold UM, but the present invention is not limited thereto and the ejector block may be disposed separately in the upper mold UM and the lower mold LM.

[0072] [Overview of the above-mentioned embodiment]

[0073] Hereinafter, an overview of the molding die C, the resin molding apparatus 100, and the method for manufacturing a resin molded product (resin molded substrate Sb) described in the above-described embodiment will be described.

[0074] (1) The molding die C is characterized in that it comprises: a lower mold LM including a lower mold cavity block 53 for placing a molding object (a substrate Sa before resin molding), and a barrel block 54 having a barrel 54b for filling a resin material (resin sheet T, molten resin Ta); an upper mold UM including an upper mold cavity block 64 having a mold cavity MC and an exhaust hole groove 64a, and a reject block 65 arranged above the barrel block 54 and capable of being raised and lowered independently of the upper mold cavity block 64; a first elastic member 55 for pressing the lower mold cavity block 53 toward the upper mold UM; a plurality of supporting members (floating pins 63) that can be elastically deformed to press the upper mold cavity block 64 and the reject block 65; and a second elastic member 66 that can press the reject block 65 so that the reject block 65 protrudes downward from the lower surface of the upper mold cavity block 64.

[0075] In the molding die C of this characteristic configuration, before the mold is closed, that is, in the unclosed state, the ejector block 65 is pressed by the second elastic member 66 in such a manner that the ejector block 65 protrudes downward from the lower surface 68 of the upper mold cavity block 64. As a result, when the mold is closed, the ejector block 65 contacts the barrel block 54 of the lower mold LM before the upper mold cavity block 64. Thereafter, the upper mold cavity block 64 contacts the upper surface 56 of the molding object (pre-resin molding substrate Sa) by deformation of the second elastic member 66, thereby enabling the supply of resin material (molten resin Ta) to the mold cavity MC, thereby preventing an excessive pressing force from being applied to the molding object (pre-resin molding substrate Sa) when the mold is closed (during resin molding).

[0076] (2) In the molding die C described in (1) above, the elastic force of the first elastic member 55 may be set so that the first elastic member 55 starts to elastically deform before the plurality of support members (floating pins 63) when the mold is closed.

[0077] According to this configuration, the molding object (pre-resin molding substrate Sa) is held by the elastic force of the first elastic member 55 , thereby preventing excessive pressing force from being applied to the molding object (pre-resin molding substrate Sa) during mold clamping (during resin molding).

[0078] (3) In the molding die C described in (1) or (2) above, the elastic force of the second elastic member 66 may be set so that the second elastic member 66 starts to elastically deform before the first elastic member 55 when the mold is closed.

[0079] According to this configuration, the molding object (pre-resin molding substrate Sa) is held by the elastic force of the second elastic member 66 , thereby preventing an excessive pressing force from acting on the molding object (pre-resin molding substrate Sa) during mold clamping (during resin molding).

[0080] (4) The resin molding apparatus 100 is characterized in that it includes the molding die C as described in any one of (1) to (3) above and a mold clamping mechanism 35 for clamping the molding die C.

[0081] According to the resin molding apparatus 100 having the characteristic configuration, a resin molded product (resin molded substrate Sb) can be manufactured using the molding die C described in any one of (1) to (3) above.

[0082] (5) The method for manufacturing a resin molded product (resin molded substrate Sb) using the resin molding device 100 described in (4) above is characterized in that it includes: a supply process for supplying a molding object (pre-resin molding substrate Sa) and a resin material (resin sheet T) to a molding mold C; a clamping process in which the second elastic member 66 is elastically deformed by a first clamping force so that the rejection block 65 contacts the barrel block 54 and the lower surface 68 of the upper mold cavity block 64 contacts the upper surface 56 of the molding object (pre-resin molding substrate Sa), thereby supplying the resin material (resin sheet T, molten resin Ta) filled in the barrel 54b to the mold cavity MC and closing the exhaust hole groove 64a by the second clamping force; and a molding process for performing resin molding of the molding object (pre-resin molding substrate Sa).

[0083] In the manufacturing method of the resin molded product (resin molded substrate Sb) having the present characteristics, after the molding object (pre-resin molded substrate Sa) and the resin material (resin sheet T) are supplied to the molding mold C in the supply process, the ejector block 65 is brought into contact with the barrel block 54 by the first mold clamping force that elastically deforms the second elastic member 66 in the mold clamping process, and the lower surface 68 of the upper mold cavity block 64 is brought into contact with the upper surface 56 of the molding object (pre-resin molded substrate Sa). Then, in this state, the resin material (molten resin Ta) is supplied to the mold cavity MC, and then the venting hole groove 64a is closed by the second mold clamping force to manufacture the molded resin molded product (resin molded substrate Sb) (molding process). In this way, the resin material (molten resin Ta) is supplied by the first mold clamping force until the venting hole groove 64a is closed by the second mold clamping force to manufacture the resin molded product (resin molded substrate Sb), so that the resin molded product (resin molded substrate Sb) can be manufactured without applying an excessive pressing force to the molding object (pre-resin molded substrate Sa).

[0084] In addition, the second clamping force can be significantly reduced compared to the clamping force in the second clamping process of the resin packaging device disclosed in Patent Document 1, and the press machine for clamping can be miniaturized. In addition, since the pressing force acting on the vent groove 64a in contact with the upper surface 56 of the molding object (pre-resin molding substrate Sa) can also be reduced, the vent groove 64a can be prevented from being crushed.

[0085] (6) The method for manufacturing the resin molded product (resin molded substrate Sb) described in (5) above may be such that, in the mold closing process, after the ejection block 65 is brought into contact with the barrel block 54 by utilizing the elastic force of the second elastic member 66, the second elastic member 66 is compressed to bring the lower surface 68 of the upper mold cavity block 64 into contact with the upper surface 56 of the molding object (pre-resin molded substrate Sa).

[0086] According to this method, through the elastic deformation of the second elastic member 66, the rejection block 65 contacts the barrel block 54, and the lower surface 68 of the upper mold cavity block 64 contacts the upper surface 56 of the molding object (the substrate Sa before resin molding). Therefore, the resin molded product (resin molded substrate Sb) can be manufactured without applying excessive pressing pressure to the molding object (the substrate Sa before resin molding).

[0087] (7) The method for manufacturing the resin molded product (resin molded substrate Sb) described in (5) or (6) above may be such that, in the mold clamping step, the exhaust hole groove 64a is closed when the compression amount of the supporting member (floating pin 63) is maximized by utilizing the second mold clamping force.

[0088] Normally, the air in the cavity MC is exhausted from the vent groove 64a, so the vent groove 64a is not closed until just before the resin material (molten resin Ta) is filled into the cavity MC. Therefore, according to the present method, when the compression amount of the support member (floating pin 63) is maximized by the second mold clamping force, the vent groove 64a is closed, so that the resin molded product (resin molded substrate Sb) can be manufactured without applying the pressing force obtained by the second mold clamping force to the molding object (pre-resin molding substrate Sa) until just before the resin material (molten resin Ta) is filled.

[0089] (8) The method for manufacturing the resin molded product (substrate Sb after resin molding) described in any one of (5) to (7) above may be such that when the elastic deformation of the first elastic member 55 becomes maximum, the upper surface 56 of the molding object (substrate Sa before resin molding) is flush with the upper surface 57 of the barrel block 54.

[0090] According to this method, the timing at which the pressing force due to the elastic force of the first elastic member 55 acts on the molding object (pre-resin molding substrate Sa) can be delayed, so the time during which the pressing force acts on the molding object (pre-resin molding substrate Sa) can be shortened.

[0091] Industrial Applicability

[0092] The present disclosure can be used for a molding die, a resin molding device, and a method for manufacturing a resin molded product.

[0093] Description of Reference Numerals

[0094] 35: clamping mechanism;

[0095] 53: lower model cavity block;

[0096] 54: barrel block;

[0097] 54b: barrel;

[0098] 55: first elastic member;

[0099] 63: floating pin (supporting member);

[0100] 64: upper model cavity block;

[0101] 64a: exhaust hole slot;

[0102] 65: remove block;

[0103] 66: second elastic member;

[0104] 100: resin molding device;

[0105] C: forming die;

[0106] LM: lower die;

[0107] MC: cavity;

[0108] Sa: substrate before resin molding (molding object);

[0109] Sb: Resin molded substrate (resin molded product);

[0110] T: resin sheet (resin material);

[0111] Ta: molten resin (resin material);

[0112] UM: Upper mold.

Claims

1. A molding die, comprising: A lower mold including a lower mold cavity block for placing a molding object, and a barrel block formed with a barrel for filling a resin material; The upper mold includes an upper mold cavity block having a mold cavity and a venting hole groove, and a reject block disposed above the barrel block and capable of rising and falling independently of the upper mold cavity block; a first elastic member, pressing the lower mold cavity block toward the upper mold; A plurality of supporting members, capable of elastic deformation, press the upper mold cavity block and the reject block; as well as The second elastic member can press the ejection block to make the ejection block protrude downward from the lower surface of the upper mold cavity block.

2. The molding die according to claim 1, wherein: The elastic force of the first elastic member is set so that, when the mold is closed, the first elastic member starts to elastically deform before the plurality of supporting members.

3. The molding die according to claim 1 or 2, wherein: The elastic force of the second elastic member is set so that the second elastic member starts to elastically deform before the first elastic member when the mold is closed. 4 . A resin molding device comprising the molding die according to claim 1 and a mold clamping mechanism for clamping the molding die.

5. A method for producing a resin molded product, which is a method for producing a resin molded product using the resin molding apparatus according to claim 4, wherein: The method for manufacturing the resin molded product comprises: A supplying step of supplying the molding object and the resin material to the molding die; a mold clamping step of elastically deforming the second elastic member by a first mold clamping force, causing the ejection block to contact the barrel block and causing the lower surface of the upper mold cavity block to contact the upper surface of the molding object, thereby supplying the resin material filled in the barrel to the mold cavity and closing the exhaust hole groove by a second mold clamping force; and The molding step is to perform resin molding of the molding object.

6. The method for producing a resin molded article according to claim 5, wherein: In the mold clamping step, after the ejector block is brought into contact with the barrel block by the elastic force of the second elastic member, the second elastic member is compressed to bring the lower surface of the upper mold cavity block into contact with the upper surface of the molding object.

7. The method for producing a resin molded article according to claim 5 or 6, wherein: In the mold clamping step, the vent groove is closed when the compression amount of the support member is maximized by the second mold clamping force.

8. The method for producing a resin molded article according to any one of claims 5 to 7, wherein: When the elastic deformation amount of the first elastic member becomes maximum, the upper surface of the molding object is flush with the upper surface of the barrel block.

Images