Efficient wafer gluing equipment and method

Abstract

The invention relates to efficient wafer gluing equipment and method, relates to the technical field of gluing, and aims at solving the problem that wafer gluing positioning is inaccurate. The efficient wafer gluing equipment comprises a rack, a wafer disc used for containing wafers is arranged on the rack, a gluing mechanism is arranged on the rack, and the wafer disc is arranged on the rack; the gluing mechanism comprises a gluing frame, a transverse assembly, a lifting assembly, a longitudinal assembly and a gluing head, the transverse assembly is arranged between the rack and the gluing frame, the lifting assembly is arranged in the height direction of the gluing frame, the transverse assembly is arranged on the lifting assembly, the gluing head is connected to the transverse assembly, and the longitudinal assembly is arranged on the gluing head. The gluing head is arranged towards the circle center direction of the wafer disc; the transverse assembly comprises an X-axis transmission lead screw, a first motor, an X-axis guide rod and an X-axis sliding block. The wafer gluing device has the effect of meeting the high-precision alignment requirement of wafer gluing.

Description

Technical Field

[0001] The present application relates to the field of glue coating technology, and in particular to a high-efficiency wafer glue coating device and method. Background Art

[0002] As a core component in semiconductor manufacturing, the quality of photoresist coated on the surface of the wafer directly affects the subsequent process steps such as lithography, etching, and ion implantation, which in turn affects the overall performance and yield of the chip. With the continuous development of semiconductor technology, the requirements for the accuracy, uniformity and efficiency of wafer coating are becoming increasingly higher; especially in advanced processes, the feature size on the wafer is constantly shrinking, which puts more stringent requirements on the accuracy and uniformity of photoresist coating.

[0003] In the related art, since the wafer needs to be precisely aligned during the coating process to ensure that the photoresist can be accurately coated at the specified position on the wafer surface, the existing coating equipment often has certain errors in positioning accuracy. This error may cause the coating position to deviate from the predetermined target, thereby affecting the manufacturing quality and yield of the chip, so it needs to be improved. Summary of the invention

[0004] In order to solve the problem of inaccurate wafer gluing positioning, the present application provides a high-efficiency wafer gluing equipment and method.

[0005] The present application provides an efficient wafer gluing device and method using the following technical solutions: A high-efficiency wafer gluing device comprises a frame, a wafer tray for placing wafers is arranged on the frame, a gluing mechanism is arranged on the frame, the gluing mechanism comprises a gluing frame, a transverse component, a lifting component, a longitudinal component and a gluing head, the transverse component is arranged between the frame and the gluing frame, the lifting component is arranged along the height direction of the gluing frame, the transverse component is arranged on the lifting component, the gluing head is connected to the transverse component, and the gluing head is arranged toward the center of the wafer tray; The transverse component includes an X-axis transmission screw, a first motor, an X-axis guide rod and an X-axis slider, wherein the X-axis transmission screw is rotatably connected to the frame, the X-axis transmission screw is arranged toward the wafer disk, the X-axis guide rod is connected to the frame, the X-axis guide rod is arranged parallel to the X-axis transmission screw, the X-axis slider is threadedly connected to the X-axis transmission screw, the X-axis slider is slidably connected to the X-axis guide rod, the output end of the first motor is connected to the X-axis transmission screw, and the glue coating frame is connected to the top of the X-axis slider; The frame is provided with a positioning mechanism for lateral positioning of the gluing frame, and the positioning mechanism includes a positioning block, a positioning seat and a positioning switch. The positioning block is connected to the gluing frame, the positioning seat is connected to the frame, and the positioning switch is arranged on the positioning seat. The positioning block corresponds to the positioning switch, and the positioning switch is used to control the first motor to stop. The gluing frame is provided with a travel mechanism for controlling the upper and lower positions of the lifting assembly.

[0006] Since the wafer needs to be precisely aligned during the coating process to ensure that the photoresist can be accurately coated at the designated position on the wafer surface, the existing coating equipment often has certain errors in positioning accuracy. This error may cause the coating position to deviate from the predetermined target, thereby affecting the manufacturing quality and yield of the chip. By adopting the above technical solution, the equipment realizes the precise movement of the gluing head in the X-axis direction through the design of the lateral components, improves the stability and accuracy of the movement, and cooperates with the positioning mechanism (including the positioning block, the positioning seat and the positioning switch) to accurately control the position of the gluing head during the gluing process to ensure that the gluing head can accurately stay at the predetermined position to meet the high-precision alignment requirements of wafer gluing. The high-precision positioning and movement control effectively reduces the possibility of the gluing position deviating from the predetermined target, improves the uniformity and consistency of the gluing, and thus improves the manufacturing quality and yield of the chip. At the same time, through precise automated control, the gluing head can be flexibly moved in three-dimensional space to adapt to the gluing requirements of wafers of different sizes and shapes. The equipment can quickly complete the gluing process of the wafer, reduce the errors and time costs of manual operations, and improve production efficiency.

[0007] Furthermore, the lifting assembly includes a Z-axis transmission screw, a second motor, a Z-axis guide rod and a Z-axis slider. The Z-axis transmission screw is rotatably connected to the glue coating frame, the Z-axis transmission screw is arranged in the height direction of the glue coating frame, the Z-axis guide rod is connected to the glue coating frame, the Z-axis guide rod is arranged parallel to the Z-axis transmission screw, the Z-axis slider is threadedly connected to the Z-axis transmission screw, the Z-axis slider is slidably connected to the Z-axis guide rod, the output end of the second motor is connected to the Z-axis transmission screw, and the longitudinal assembly is connected to the top of the Z-axis slider.

[0008] By adopting the above technical solution, it is helpful to achieve precise movement of the gluing head in the vertical direction (i.e., the Z-axis direction), ensuring the stability and accuracy of the gluing head during the vertical movement. The lifting assembly can easily adjust the height of the gluing head to adapt to wafers of different sizes and different glue coating thickness requirements. It can process various types of wafers, thereby improving the versatility and adaptability of the equipment.

[0009] Furthermore, the travel mechanism includes two in-position switches, which are respectively arranged on both sides of the glue coating frame in the height direction, and the Z-axis slider is respectively provided with in-position notches for cooperating with the two in-position switches.

[0010] By adopting the above technical solution, by opening a positioning notch on the Z-axis slider and cooperating with the in-place switches on both sides of the glue coating frame, the up and down movement range of the Z-axis slider (i.e., the glue coating head) can be accurately controlled; when the Z-axis slider moves to the upper or lower limit position, the in-place notch will contact the corresponding in-place switch, thereby triggering a switch signal to ensure that the glue coating head does not exceed the predetermined movement range, effectively preventing the glue coating head from colliding with the glue coating frame or other components during movement, thereby avoiding equipment damage or personal injury. At the same time, the in-place switch simplifies the operating procedures during the gluing process and reduces the need for manual intervention and monitoring.

[0011] Furthermore, the glue coating rack is provided with an auxiliary cylinder for auxiliary driving, the auxiliary cylinder is arranged on one side of the second motor, the auxiliary cylinder is arranged toward the height direction of the glue coating rack, a cylinder connecting seat is provided on the Z-axis slider, and the output end of the auxiliary cylinder is connected to the cylinder connecting seat.

[0012] By adopting the above technical solution, the addition of auxiliary cylinders provides additional driving force for the up and down movement of the Z-axis slider (and the connected glue coating head), improves the response speed and stability of the system, and helps to achieve high-precision positioning of the glue coating head in the Z-axis direction. At the same time, the addition of auxiliary cylinders can help balance the load and reduce equipment vibration or offset caused by uneven load.

[0013] Furthermore, the longitudinal component includes the Y-axis transmission screw, the third motor, the Y-axis guide rod, the Y-axis slider and the longitudinal support plate, the longitudinal support plate is connected to the cylinder connecting seat, the Y-axis transmission screw is rotatably connected to the longitudinal support plate, the Y-axis transmission screw is arranged vertically with the X-axis transmission screw, the Y-axis guide rod is connected to the longitudinal support plate, the Y-axis guide rod is arranged parallel to the Z-axis transmission screw, the Y-axis slider is threadedly connected to the Y-axis transmission screw, the Y-axis slider is slidably connected to the Y-axis guide rod, the output end of the third motor is connected to the Y-axis transmission screw, and the glue coating head is connected to the Y-axis slider.

[0014] By adopting the above technical solution, through the cooperation of the Y-axis transmission screw and the third motor, the precise movement of the glue coating head in the Y-axis direction (i.e., one of the horizontal directions) is achieved, ensuring the stability of the glue coating head during the movement. By accurately controlling the movement speed and position of the glue coating head in the three directions of X, Y, and Z, the glue coating process can be optimized, which helps to reduce the waste and pollution of photoresist and improve the manufacturing quality and yield of chips.

[0015] Furthermore, the frame is provided with an assembly boss, the wafer disc is arranged on the assembly boss, a rotating shaft for rotating the wafer disc is provided on the assembly boss, and a driving mechanism for driving the wafer disc to rotate is provided on the frame, the driving mechanism includes a driving motor, a transmission belt and two transmission pulleys, one of the transmission pulleys is sleeved on the rotating shaft, and the other transmission pulley is rotatably connected to the frame, the two ends of the transmission belt are respectively tensioned on the two transmission pulleys, and the output end of the driving motor is connected to one of the transmission pulleys.

[0016] By adopting the above technical solution, the driving motor, transmission belt and two transmission pulleys are coordinated to ensure the stable rotation of the wafer disc on the assembly boss, which helps to evenly apply photoresist on the wafer surface and improve the quality and consistency of the coating. At the same time, the design of the assembly boss and the driving mechanism makes the entire equipment structure more compact, reduces the footprint, and helps to arrange more equipment in a limited production space.

[0017] Furthermore, the frame is provided with an adsorption mechanism for adsorbing wafers, and the adsorption mechanism includes a vacuum pump and a vacuum suction pipe. The vacuum pump is connected to the frame, one end of the vacuum suction pipe is connected to the exhaust end of the vacuum pump, and the other end of the vacuum suction pipe is arranged toward the wafer disk. A through hole for the vacuum suction pipe to evacuate air is opened on the wafer disk.

[0018] By adopting the above technical solution, the vacuum pump generates negative pressure, and the vacuum straw can firmly adsorb the wafer, ensuring that the wafer will not be displaced or fall off during the glue coating process, which helps to ensure the accuracy and consistency of the glue coating, and can quickly and accurately adsorb and release the wafer, reducing the time and errors of manual operation, and flexibly responding to different production needs. At the same time, the vacuum adsorption method reduces the use of physical contact methods such as mechanical clamping, reduces the damage that may be suffered by the wafer during the adsorption and release process, and improves the product yield.

[0019] Furthermore, a heightening platform is provided on the frame, and the transverse assembly and the gluing frame are arranged on the heightening platform, and the arrangement height of the heightening platform is consistent with the arrangement height of the assembly boss.

[0020] By adopting the above technical solution, the equipment layout is optimized. By arranging the horizontal components and the glue coating rack on the raising platform and keeping the arrangement height consistent with the assembly boss, the layout of the entire equipment can be made more compact and reasonable, and the space utilization rate of production can be improved.

[0021] Furthermore, reinforcement plates are provided on both sides of the X-axis slider, and the two reinforcement plates are respectively connected to the two sides of the glue coating frame.

[0022] By adopting the above technical solution, the structural stability of the X-axis slider and the glue coating frame connected thereto is significantly enhanced, the forces are effectively dispersed and borne, deformation or damage of the X-axis slider and the glue coating frame are prevented, and the overall life of the equipment is extended.

[0023] Furthermore, an efficient wafer gluing method comprises the following steps: S1. Wafer positioning: Place the wafer on the wafer plate, start the vacuum pump through the adsorption mechanism on the rack, and firmly adsorb the wafer on the wafer plate; S2, initial positioning of the glue coating head: start the first motor to drive the X-axis transmission screw to rotate, drive the X-axis slider and the connected glue coating frame to move to a suitable position along the X-axis direction, and accurately control the lateral positioning of the glue coating frame through the cooperation of the positioning block and the positioning switch in the positioning mechanism; S3, height adjustment of the gluing head: start the second motor to drive the Z-axis transmission screw to rotate, drive the Z-axis slider and the connected longitudinal components to move along the Z-axis direction to a suitable gluing height, and accurately control the height position of the gluing head through the coordination of the in-position switch in the stroke mechanism and the in-position notch on the Z-axis slider; S4, longitudinal fine adjustment of the glue coating head: After the height adjustment of the glue coating head is completed, the third motor can be started to drive the Y-axis transmission screw to rotate, and the Y-axis slider and the glue coating head can be fine-tuned along the Y-axis direction to optimize the position of the glue coating head relative to the wafer disk; S5, wafer disk rotation glue coating: start the drive motor, drive the wafer disk to rotate around the rotation axis through the cooperation of the transmission belt and two transmission pulleys, and at the same time, start the glue coating function of the glue coating head. As the wafer disk rotates, the glue coating head evenly coats the glue along the surface of the wafer; S6. Reset after glue coating is completed: After glue coating is completed, turn off the glue coating function of the glue coating head, then stop the drive motor, stop the wafer disc from rotating, reset the horizontal component, lifting component and vertical component, reset the glue coating head to the initial position, and finally, turn off the vacuum pump to release the adsorption of the wafer, and take out the wafer after glue coating.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: The equipment realizes the precise movement of the glue coating head in the X-axis direction through the design of the lateral components, improves the stability and accuracy of the movement, and cooperates with the positioning mechanism (including the positioning block, the positioning seat and the positioning switch) to accurately control the position of the glue coating head during the glue coating process, ensuring that the glue coating head can accurately stay at the predetermined position to meet the high-precision alignment requirements of wafer glue coating. The high-precision positioning and movement control effectively reduce the possibility of the glue coating position deviating from the predetermined target, improve the uniformity and consistency of glue coating, and thus improve the manufacturing quality and yield of the chip. At the same time, through precise automatic control, the glue coating head can be flexibly moved in three-dimensional space to meet the glue coating requirements of wafers of different sizes and shapes. The equipment can quickly complete the wafer glue coating process, reduce the error and time cost of manual operation, and improve production efficiency. By opening a positioning notch on the Z-axis slider and cooperating with the in-position switches on both sides of the glue coating rack, the up and down movement range of the Z-axis slider (i.e., the glue coating head) can be accurately controlled; when the Z-axis slider moves to the upper or lower limit position, the in-position notch will contact the corresponding in-position switch, thereby triggering a switch signal to ensure that the glue coating head does not exceed the predetermined movement range, effectively preventing the glue coating head from colliding with the glue coating rack or other components during movement, thereby avoiding equipment damage or personal injury. At the same time, the in-position switch simplifies the operating procedures during the glue coating process and reduces the need for manual intervention and monitoring; The vacuum pump generates negative pressure, and the vacuum straw can firmly adsorb the wafer to ensure that the wafer will not move or fall off during the glue coating process, which helps to ensure the accuracy and consistency of the glue coating. It can quickly and accurately adsorb and release the wafer, reducing the time and errors of manual operation, and flexibly respond to different production needs. At the same time, the vacuum adsorption method reduces the use of physical contact methods such as mechanical clamping, reduces the possible damage to the wafer during the adsorption and release process, and improves the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a high-efficiency wafer coating equipment in an embodiment of the present application.

[0026] Figure 2 It is a partial cross-sectional view used to illustrate the adsorption mechanism in the embodiment of the present application.

[0027] Figure 3 This is a front view of a high-efficiency wafer coating device in an embodiment of the present application.

[0028] Figure 4 It is a structural schematic diagram used to reflect the gluing mechanism in this embodiment.

[0029] Figure 5 for Figure 4 Enlarged view of part A.

[0030] Figure 6 It is a structural schematic diagram used to reflect the lifting component and the longitudinal component in the embodiment of the present application.

[0031] Description of the accompanying drawings: 1, frame; 2, wafer plate; 21, through hole; 3, glue coating mechanism; 31, glue coating frame; 32, horizontal component; 321, X-axis transmission screw; 322, first motor; 323, X-axis guide rod; 324, X-axis slider; 33, lifting component; 331, Z-axis transmission screw; 332, second motor; 333, Z-axis guide rod; 334, Z-axis slider; 34, longitudinal component; 341, Y-axis transmission screw; 342, third motor; 343, Y-axis guide rod; 34 4. Y-axis slider; 345. Longitudinal support plate; 35. Glue coating head; 4. Positioning mechanism; 41. Positioning block; 42. Positioning seat; 43. Positioning switch; 5. Travel mechanism; 51. In-position switch; 52. In-position notch; 6. Auxiliary cylinder; 61. Cylinder connecting seat; 7. Assembly boss; 71. Rotating shaft; 8. Driving mechanism; 81. Driving motor; 82. Transmission belt; 83. Transmission pulley; 9. Adsorption mechanism; 91. Vacuum pump; 92. Vacuum suction tube; 10. Raising platform; 11. Reinforcement plate. DETAILED DESCRIPTION

[0032] In order to elaborate on the technical scheme adopted by the present invention to achieve the predetermined technical purpose, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only partial embodiments of the present invention, rather than all embodiments, and the technical means or technical features in the embodiments of the present invention can be replaced without paying creative work. The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0033] The following is combined with Figure 1-6 This application is described in further detail.

[0034] The present application embodiment discloses a high-efficiency wafer glue coating device. Figure 1 The high-efficiency wafer gluing equipment includes a frame 1, on which a mounting boss 7 is mounted, on which a wafer disk 2 is mounted. In this embodiment, the wafer disk 2 is used to place wafers to be glued, and a gluing mechanism 3 is mounted on the frame 1. The gluing mechanism 3 is used to perform gluing operations on the wafers in the wafer disk 2.

[0035] Reference Figure 1 and Figure 2, an adsorption mechanism 9 is installed on the frame 1, and the adsorption mechanism 9 is used to adsorb the wafer. In this embodiment, the interior of the assembly boss 7 is a hollow structure, and the adsorption mechanism 9 is located in the assembly boss 7. The adsorption mechanism 9 includes a vacuum pump 91 and a vacuum suction pipe 92. One end of the vacuum suction pipe 92 is connected to the exhaust end of the vacuum pump 91, and at the same time, the assembly boss 7 and the wafer disk 2 are penetrated with a through hole 21 for the vacuum suction pipe 92 to exhaust and adsorb; the vacuum pump 91 generates negative pressure, and the vacuum suction pipe 92 can firmly adsorb the wafer to ensure that the wafer will not be displaced or fall off during the glue coating process, which helps to ensure the accuracy and consistency of the glue coating, and can quickly and accurately adsorb and release the wafer, reducing the time and error of manual operation, and flexibly responding to different production needs. At the same time, the vacuum adsorption method reduces the use of physical contact methods such as mechanical clamping, reduces the damage that the wafer may suffer during the adsorption and release process, and improves the product yield.

[0036] Reference Figure 2 and Figure 3 A rotating shaft 71 is rotatably mounted on the assembly boss 7, and the wafer disk 2 is fixedly mounted on the rotating shaft 71. At the same time, a driving mechanism 8 is mounted on the frame 1. The driving mechanism 8 is used to drive the wafer disk 2 to rotate. The driving mechanism 8 includes a driving motor 81, a transmission belt 82 and two transmission pulleys 83, one of which is fixedly mounted on the rotating shaft 71, and the other is rotatably connected to the frame 1. The two ends of the transmission belt 82 are respectively tensioned on the two transmission pulleys 83. The driving motor 81 is mounted on the frame 1. The driving motor 81 The output end is connected to the transmission pulley 83 located on the frame 1. In this embodiment, the adsorption mechanism 9 does not affect the normal rotation operation of the wafer disk 2; the driving motor 81, the transmission belt 82 and the two transmission pulleys 83 cooperate to ensure that the wafer disk 2 can achieve stable rotation on the assembly boss 7, which helps to evenly apply photoresist on the wafer surface and improve the quality and consistency of the glue coating. At the same time, the design of the assembly boss 7 and the driving mechanism 8 makes the entire equipment structure more compact, reduces the floor space, and helps to arrange more equipment in a limited production space.

[0037] Reference Figure 3 A raising platform 10 is installed on the frame 1, and the gluing mechanism 3 is arranged on the raising platform 10. In this embodiment, the arrangement height of the raising platform 10 is consistent with the arrangement height of the assembly boss 7, and the equipment layout is optimized. By arranging the transverse component 32 and the gluing frame 31 on the raising platform 10 and maintaining the same arrangement height as the assembly boss 7, the layout of the entire equipment can be made more compact and reasonable, thereby improving the space utilization rate of production.

[0038] Reference Figure 4 and Figure 5The glue coating mechanism 3 includes a glue coating frame 31, a horizontal component 32, a lifting component 33, a vertical component 34 and a glue coating head 35. The horizontal component 32 is installed on the raising platform 10. The horizontal component 32 includes an X-axis transmission screw 321, a first motor 322, an X-axis guide rod 323 and an X-axis slider 324. The X-axis transmission screw 321 is rotatably connected to the raising platform 10, and the X-axis transmission screw 321 is arranged toward the direction of the wafer disk 2. The X-axis guide rod 323 is connected to the frame 1, and the X-axis guide rod 323 is arranged in parallel with the X-axis transmission screw 321. In this embodiment, the number of X-axis guide rods 323 is two, and the two X-axis guide rods 323 are symmetrically arranged on both sides of the X-axis transmission screw 321.

[0039] Reference Figure 4 and Figure 5 The X-axis slider 324 is threadedly connected to the X-axis transmission screw 321, and the X-axis slider 324 is slidably connected to the two X-axis guide rods 323. In this embodiment, the X-axis slider 324 slides with the X-axis guide rods 323 by opening a guide hole. The first motor 322 is installed on the raising platform 10, and the output end of the first motor 322 is connected to the end of the X-axis transmission screw 321. The first motor 322 can realize forward and reverse rotation.

[0040] Reference Figure 5 The glue coating frame 31 is installed on the top of the X-axis slider 324. At the same time, reinforcement plates 11 are installed on both sides of the X-axis slider 324. The two reinforcement plates 11 are respectively connected to the two sides of the glue coating frame 31, which significantly enhances the structural stability of the X-axis slider 324 and the glue coating frame 31 connected thereto, effectively disperses and withstands these forces, prevents the X-axis slider 324 and the glue coating frame 31 from deformation or damage, and helps to extend the overall life of the equipment.

[0041] Reference Figure 5, a positioning mechanism 4 is installed on the heightening platform 10. In this embodiment, the positioning mechanism 4 is used for horizontal positioning of the glue coating rack 31. The positioning mechanism 4 includes a positioning block 41, a positioning seat 42 and a positioning switch 43. The positioning block 41 is installed on the glue coating rack 31, and the positioning seat 42 is installed on the heightening platform 10. The positioning seat 42 is located on the side of the glue coating rack 31 close to the assembly boss 7. The positioning switch 43 is installed on the positioning seat 42. The positioning switch 43 corresponds to the positioning block 41. The positioning switch 43 is a trigger type. The positioning switch 43 is used to control the first motor 322 to stop; when the horizontal component 32 is started, the glue coating rack 3 1 moves horizontally, and the positioning block 41 gradually approaches the positioning seat 42. Once the positioning block 41 is completely aligned with and in contact with the positioning switch 43, the positioning block 41 will trigger the positioning switch 43 installed on the positioning seat 42. The positioning switch 43 is a detection device. When triggered by an external force (such as the pressure of the positioning block 41), it will immediately send an electrical signal to the control system. After receiving the signal from the positioning switch 43, the control system immediately sends a stop command to the first motor 322. After receiving the command, the first motor 322 quickly stops running, so that the glue coating rack 31 stops moving at a precise position.

[0042] Reference Figure 6 The lifting assembly 33 is installed on the glue coating rack 31, and the lifting assembly 33 is arranged along the height direction of the glue coating rack 31. The lifting assembly 33 includes a Z-axis transmission screw 331, a second motor 332, a Z-axis guide rod 333 and a Z-axis slider 334. The Z-axis transmission screw 331 is rotatably connected to the glue coating rack 31, and the Z-axis transmission screw 331 is arranged in the height direction of the glue coating rack 31. The Z-axis guide rod 333 is connected to the glue coating rack 31, and the Z-axis guide rod 333 is arranged parallel to the Z-axis transmission screw 331. In this embodiment, the number of Z-axis guide rods 333 is two, and the two Z-axis guide rods 333 are symmetrically installed on both sides of the Z-axis transmission screw 331.

[0043] Reference Figure 6 The Z-axis slider 334 is threadedly connected to the Z-axis transmission screw rod 331, and the Z-axis slider 334 is slidably connected to the two Z-axis guide rods 333. In this embodiment, the Z-axis slider 334 slides with the Z-axis guide rod 333 by opening a guide hole. The second motor 332 is installed on the glue coating frame 31, and the output end of the second motor 332 is connected to the end of the Z-axis transmission screw rod 331. The second motor 332 can realize forward and reverse rotation; it helps to achieve the precise movement of the glue coating head 35 in the vertical direction (i.e., the Z-axis direction), ensuring the stability and accuracy of the glue coating head 35 during the vertical movement. The lifting component 33 can easily adjust the height of the glue coating head 35 to adapt to the requirements of wafers of different sizes and different glue coating thicknesses, and can process various types of wafers, thereby improving the versatility and adaptability of the equipment.

[0044] Reference Figure 6An auxiliary cylinder 6 is also installed on the glue coating rack 31. The auxiliary cylinder 6 is arranged on one side of the second motor 332, and the auxiliary cylinder 6 is arranged in the height direction of the glue coating rack 31. A cylinder connecting seat 61 is installed on the Z-axis slider 334, and the output end of the auxiliary cylinder 6 is connected to the cylinder connecting seat 61; the addition of the auxiliary cylinder 6 provides additional driving force for the up and down movement of the Z-axis slider 334 (and the connected glue coating head 35), improves the response speed and stability of the system, and helps to achieve high-precision positioning of the glue coating head 35 in the Z-axis direction. At the same time, the addition of the auxiliary cylinder 6 can help balance the load and reduce equipment vibration or offset caused by uneven load.

[0045] Reference Figure 6 , a travel mechanism 5 is installed on the glue coating rack 31. In this embodiment, the travel mechanism 5 is used to control the upward and downward positions of the lifting assembly 33. The travel mechanism 5 includes two in-position switches 51, which are respectively installed on both sides of the height direction of the glue coating rack 31. A specific travel for the lifting assembly 33 to be lifted and lowered is formed between the two in-position switches 51. In this embodiment, the upper and lower surfaces of the Z-axis slider 334 are provided with in-position notches 52 for cooperating with the two in-position switches 51; by providing a positioning notch on the Z-axis slider 334 and cooperating with the positioning notches on both sides of the glue coating rack 31 The switch 51 cooperates with each other to accurately control the up and down movement range of the Z-axis slider 334 (i.e., the glue coating head 35); when the Z-axis slider 334 moves to the upper or lower limit position, the in-place notch 52 will contact the corresponding in-place switch 51, thereby triggering a switch signal to ensure that the glue coating head 35 does not exceed the predetermined movement range, effectively preventing the glue coating head 35 from colliding with the glue coating frame 31 or other components during movement, thereby avoiding equipment damage or personal injury. At the same time, the in-place switch 51 simplifies the operating procedures during the glue coating process and reduces the need for manual intervention and monitoring.

[0046] Reference Figure 6 The longitudinal component 34 is installed on the cylinder connecting seat 61. The longitudinal component 34 includes a Y-axis transmission screw 341, a third motor 342, a Y-axis guide rod 343, a Y-axis slider 344 and a longitudinal support plate 345. The longitudinal support plate 345 is fixedly connected to the cylinder connecting seat 61, the Y-axis transmission screw 341 is rotatably connected to the longitudinal support plate 345, the Z-axis transmission screw 331 is arranged vertically with the X-axis transmission screw 321, the Y-axis guide rod 343 is connected to the longitudinal support plate 345, and the Y-axis guide rod 343 is arranged parallel to the Y-axis transmission screw 341. In this embodiment, the number of Y-axis guide rods 343 is two, and the two Y-axis guide rods 343 are symmetrically installed on both sides of the Y-axis transmission screw 341.

[0047] Reference Figure 6, the Y-axis slider 344 is threadedly connected to the Y-axis transmission screw rod 341, the Y-axis slider 344 is slidably connected to the two Y-axis guide rods 343, the glue coating head 35 is installed on the Y-axis slider 344, and the glue coating head 35 itself is equipped with a corresponding output port and a liquid storage component. In this embodiment, the Y-axis slider 344 is provided with a guide hole to achieve sliding with the Y-axis guide rod 343, the third motor 342 is installed on the longitudinal support plate 345, the output end of the third motor 342 is connected to the end of the Y-axis transmission screw rod 341, and the third motor 342 can achieve forward and reverse rotation; through the cooperation of the Y-axis transmission screw rod 341 and the third motor 342, the glue coating head 35 is accurately moved in the Y-axis direction (i.e., one of the horizontal directions), ensuring the stability of the glue coating head 35 during the movement process, and by accurately controlling the moving speed and position of the glue coating head 35 in the three directions of X, Y, and Z, the glue coating process can be optimized, which helps to reduce the waste and pollution of photoresist and improve the manufacturing quality and yield rate of chips.

[0048] An efficient wafer gluing method according to an embodiment of the present application: S1, wafer positioning: placing the wafer on the wafer plate 2, starting the vacuum pump 91 through the adsorption mechanism 9 on the frame 1, and adsorbing the wafer firmly on the wafer plate 2; S2, initial positioning of the glue coating head 35: start the first motor 322, drive the X-axis transmission screw 321 to rotate, drive the X-axis slider 324 and the connected glue coating rack 31 to move to a suitable position along the X-axis direction, and accurately control the lateral positioning of the glue coating rack 31 through the cooperation of the positioning block 41 and the positioning switch 43 in the positioning mechanism 4; S3, height adjustment of the glue coating head 35: start the second motor 332, drive the Z-axis transmission screw 331 to rotate, drive the Z-axis slider 334 and the connected longitudinal component 34 to move along the Z-axis direction to a suitable glue coating height, and accurately control the height position of the glue coating head 35 by cooperating with the in-position switch 51 in the stroke mechanism 5 and the in-position notch 52 on the Z-axis slider 334; S4, longitudinal fine adjustment of the glue coating head 35: After the height adjustment of the glue coating head 35 is completed, the third motor 342 can be started to drive the Y-axis transmission screw 341 to rotate, and drive the Y-axis slider 344 and the glue coating head 35 to perform fine adjustment along the Y-axis direction to optimize the position of the glue coating head 35 relative to the wafer plate 2; S5, rotating and coating the wafer 2 with glue: starting the driving motor 81, driving the wafer 2 to rotate around the rotating shaft 71 through the cooperation of the driving belt 82 and the two driving pulleys 83, and at the same time, starting the coating function of the coating head 35, and as the wafer 2 rotates, the coating head 35 evenly coats the glue along the surface of the wafer; S6. Reset after glue coating is completed: After glue coating is completed, turn off the glue coating function of the glue coating head 35, then stop driving the motor 81, stop the rotation of the wafer disk 2, reset the transverse component 32, the lifting component 33 and the longitudinal component 34, and reset the glue coating head 35 to the initial position. Finally, turn off the vacuum pump 91, release the adsorption of the wafer, and take out the wafer after glue coating.

[0049] The above is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent replacement and improvement made to the above embodiments without departing from the content of the technical solution of the present invention, based on the technical essence of the present invention, within the spirit and principles of the present invention, still fall within the protection scope of the technical solution of the present invention.

Claims

1. An efficient wafer gluing device, characterized by: The invention comprises a frame (1), wherein a wafer plate (2) for placing wafers is arranged on the frame (1), and a gluing mechanism (3) is arranged on the frame (1), wherein the gluing mechanism (3) comprises a gluing frame (31), a transverse component (32), a lifting component (33), a longitudinal component (34) and a gluing head (35), wherein the transverse component (32) is arranged between the frame (1) and the gluing frame (31), the lifting component (33) is arranged along the height direction of the gluing frame (31), the transverse component (32) is arranged on the lifting component (33), the gluing head (35) is connected to the transverse component (32), and the gluing head (35) is arranged toward the center of the wafer plate (2); The transverse component (32) comprises an X-axis transmission screw (321), a first motor (322), an X-axis guide rod (323) and an X-axis slider (324); the X-axis transmission screw (321) is rotatably connected to the frame (1); the X-axis transmission screw (321) is arranged toward the wafer disk (2); the X-axis guide rod (323) is connected to the frame (1); the X-axis guide rod (323) is arranged parallel to the X-axis transmission screw (321); the X-axis slider (324) is threadedly connected to the X-axis transmission screw (321); the X-axis slider (324) is slidably connected to the X-axis guide rod (323); the output end of the first motor (322) is connected to the X-axis transmission screw (321); and the glue coating frame (31) is connected to the top of the X-axis slider (324); The frame (1) is provided with a positioning mechanism (4) for lateral positioning of the glue coating frame (31), the positioning mechanism (4) comprising a positioning block (41), a positioning seat (42) and a positioning switch (43), the positioning block (41) is connected to the glue coating frame (31), the positioning seat (42) is connected to the frame (1), the positioning switch (43) is arranged on the positioning seat (42), the positioning block (41) corresponds to the positioning switch (43), the positioning switch (43) is used to control the first motor (322) to stop rotating, and the glue coating frame (31) is provided with a travel mechanism (5) for controlling the upward and downward positions of the lifting component (33).

2. The high-efficiency wafer coating equipment according to claim 1, characterized in that: The lifting assembly (33) comprises a Z-axis transmission screw (331), a second motor (332), a Z-axis guide rod (333) and a Z-axis slider (334); the Z-axis transmission screw (331) is rotatably connected to the glue coating frame (31); the Z-axis transmission screw (331) is arranged in a height direction toward the glue coating frame (31); the Z-axis guide rod (333) is connected to the glue coating frame (31); the Z-axis guide rod (333) and the Z-axis transmission screw (331) are arranged in parallel; the Z-axis slider (334) is threadedly connected to the Z-axis transmission screw (331); the Z-axis slider (334) is slidably connected to the Z-axis guide rod (333); the output end of the second motor (332) is connected to the Z-axis transmission screw (331); and the longitudinal assembly (34) is connected to the top of the Z-axis slider (334).

3. The high-efficiency wafer coating equipment according to claim 2 is characterized in that: The travel mechanism (5) comprises two in-position switches (51), the two in-position switches (51) are respectively arranged on both sides of the glue coating frame (31) in the height direction, and the Z-axis slider (334) is respectively provided with in-position notches (52) for cooperating with the two in-position switches (51).

4. The high-efficiency wafer coating equipment according to claim 2, characterized in that: The glue coating rack (31) is provided with an auxiliary cylinder (6) for auxiliary driving, the auxiliary cylinder (6) is arranged on one side of the second motor (332), the auxiliary cylinder (6) is arranged in the height direction of the glue coating rack (31), the Z-axis slider (334) is provided with a cylinder connecting seat (61), and the output end of the auxiliary cylinder (6) is connected to the cylinder connecting seat (61).

5. The high-efficiency wafer coating equipment according to claim 4 is characterized in that: The longitudinal assembly (34) comprises a Y-axis transmission screw (341), a third motor (342), a Y-axis guide rod (343), a Y-axis slider (344) and a longitudinal support plate (345), wherein the longitudinal support plate (345) is connected to the cylinder connection seat (61), the Y-axis transmission screw (341) is rotatably connected to the longitudinal support plate (345), the Y-axis transmission screw (341) is arranged vertically with the X-axis transmission screw (321), and the Y-axis guide rod (343) is connected to the Y-axis slider (344) and the longitudinal support plate (345). (343) is connected to the longitudinal support plate (345), the Y-axis guide rod (343) is arranged in parallel with the Z-axis transmission screw rod (331), the Y-axis slider (344) is threadedly connected to the Y-axis transmission screw rod (341), the Y-axis slider (344) is slidably connected to the Y-axis guide rod (343), the output end of the third motor (342) is connected to the Y-axis transmission screw rod (341), and the glue coating head (35) is connected to the Y-axis slider (344).

6. The high-efficiency wafer coating equipment according to claim 1, characterized in that: The frame (1) is provided with an assembly boss (7), the wafer disc (2) is arranged on the assembly boss (7), the assembly boss (7) is provided with a rotating shaft (71) for rotating the wafer disc (2), the frame (1) is provided with a driving mechanism (8) for driving the wafer disc (2) to rotate, the driving mechanism (8) comprises a driving motor (81), a transmission belt (82) and two transmission pulleys (83), one of the transmission pulleys (83) is sleeved on the rotating shaft (71), and the other transmission pulley (83) is rotatably connected to the frame (1), the two ends of the transmission belt (82) are respectively tensioned on the two transmission pulleys (83), and the output end of the driving motor (81) is connected to one of the transmission pulleys (83).

7. The high-efficiency wafer glue coating equipment according to claim 6, characterized in that: The frame (1) is provided with an adsorption mechanism (9) for adsorbing wafers, the adsorption mechanism (9) comprising a vacuum pump (91) and a vacuum suction pipe (92), the vacuum pump (91) being connected to the frame (1), one end of the vacuum suction pipe (92) being connected to the exhaust end of the vacuum pump (91), the other end of the vacuum suction pipe (92) being arranged toward the wafer disk (2), and a through hole (21) for the vacuum suction pipe (92) to exhaust air is provided on the wafer disk (2).

8. The high-efficiency wafer glue coating equipment according to claim 7, characterized in that: The frame (1) is provided with a heightening platform (10), the transverse component (32) and the gluing frame (31) are both arranged on the heightening platform (10), and the arrangement height of the heightening platform (10) is consistent with the arrangement height of the assembly boss (7).

9. The high-efficiency wafer glue coating equipment according to claim 1, characterized in that: Reinforcement plates (11) are provided on both sides of the X-axis slider (324), and the two reinforcement plates (11) are respectively connected to the two sides of the glue coating frame (31).

10. An efficient wafer gluing method, characterized in that: The steps include: S1. Wafer positioning: Place the wafer on the wafer plate, start the vacuum pump through the adsorption mechanism on the rack, and firmly adsorb the wafer on the wafer plate; S2, initial positioning of the glue coating head: start the first motor to drive the X-axis transmission screw to rotate, drive the X-axis slider and the connected glue coating frame to move to a suitable position along the X-axis direction, and accurately control the lateral positioning of the glue coating frame through the cooperation of the positioning block and the positioning switch in the positioning mechanism; S3, height adjustment of the gluing head: start the second motor to drive the Z-axis transmission screw to rotate, drive the Z-axis slider and the connected longitudinal components to move along the Z-axis direction to a suitable gluing height, and accurately control the height position of the gluing head through the coordination of the in-position switch in the stroke mechanism and the in-position notch on the Z-axis slider; S4, longitudinal fine adjustment of the glue coating head: After the height adjustment of the glue coating head is completed, the third motor can be started to drive the Y-axis transmission screw to rotate, and the Y-axis slider and the glue coating head can be fine-tuned along the Y-axis direction to optimize the position of the glue coating head relative to the wafer disk; S5, wafer disk rotation glue coating: start the drive motor, drive the wafer disk to rotate around the rotation axis through the cooperation of the transmission belt and two transmission pulleys, and at the same time, start the glue coating function of the glue coating head. As the wafer disk rotates, the glue coating head evenly coats the glue along the surface of the wafer; S6. Reset after glue coating is completed: After glue coating is completed, turn off the glue coating function of the glue coating head, then stop the drive motor, stop the wafer disc from rotating, reset the horizontal component, lifting component and vertical component, reset the glue coating head to the initial position, and finally, turn off the vacuum pump to release the adsorption of the wafer, and take out the wafer after glue coating.

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