Heating structure for LED packaging glue sealing

Abstract

The heating structure comprises a curing box, a fixing plate is fixedly arranged on the lower side wall of the curing box, a mounting plate is fixedly arranged at the top of the fixing plate, a mounting groove is formed in the top of the mounting plate, a mica heating plate is mounted in the mounting groove, and a heat conduction plate is arranged at the top of the mounting plate in a lap joint mode. The bottom of the heat conducting plate is in lap joint with the top of the mica heating plate, and a limiting assembly is arranged between the side face of the heat conducting plate and the inner wall of the fixing plate. A mica heating plate and an infrared heating lamp are electrified, so that the mica heating plate heats the lower layer of an LED through a heat conducting plate, the infrared heating lamp heats the upper layer of the LED, and the upper layer and the lower layer of the LED are heated at the same time, so that the condition that the temperature rise speed is relatively slow when a substrate or a glue layer of the LED is relatively thick is avoided; the curing speed of the LED with a thick substrate or a thick glue layer is improved, and the time required for curing after LED packaging and glue sealing is shortened.

Description

Technical Field

[0001] The invention relates to the technical field of LED packaging glue, and in particular to a heating structure for LED packaging glue. Background Art

[0002] LED encapsulation and sealing is an important part of the LED manufacturing process. LED encapsulation and sealing refers to the process of filling and covering specific glue materials around and above the LED chip after the previous processes such as bonding are completed, so as to protect the chip, improve light output efficiency, improve heat dissipation performance and other aspects. Heating and curing are the key steps in the sealing process. By adopting a suitable heating structure to heat the package injected with glue, the glue will undergo a curing reaction under certain temperature and time conditions, changing from liquid to solid, thereby achieving effective protection and fixation of the LED chip.

[0003] Most of the existing heating structures for LED packaging glue use a heating plate heating method. The LED that needs to be cured is placed on the heating plate, and the substrate that needs to be sealed and has the LED chip and related components placed on it is placed on the heating plate. Heat is transferred to the substrate and glue by heat conduction, so that the glue is heated and cured.

[0004] However, when the LED is heated and cured by a heating plate, due to the limited heat conduction efficiency of the heating plate, when the substrate or glue layer of the LED is relatively thick, the heating plate heats the LED from bottom to top, resulting in a temperature difference between the lower and upper layers of the LED. The large temperature difference between the upper and lower layers will affect the glue curing effect, and when the substrate or glue layer of the LED is relatively thick, the heating rate is relatively slow, which reduces the curing speed of the LED package sealant, thereby increasing the time required for curing the LED package sealant. Based on the above problems, the present application proposes a heating structure for LED package sealant. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a heating structure for LED encapsulation glue, which is used to solve the problems raised in the above background technology.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A heating structure for LED encapsulation glue comprises a curing box, a fixing plate is fixedly provided on the lower side wall of the curing box, a mounting plate is fixedly provided on the top of the fixing plate, a mounting groove is provided on the top of the mounting plate, a mica heating plate is installed inside the mounting groove, a heat conducting plate is overlapped on the top of the mounting plate, the bottom of the heat conducting plate overlaps with the top of the mica heating plate, a limiting assembly is provided between the side of the heat conducting plate and the inner wall of the fixing plate, the limiting assembly is used for installation and removal of the heat conducting plate, a movable plate is slidably provided inside the curing box, a transverse plate is fixedly provided at the bottom of the movable plate, an infrared heating lamp is fixedly provided between the facing surfaces of the transverse plates, and a lifting assembly is provided inside the curing box, the lifting assembly is used for moving the movable plate up and down.

[0008] Preferably, the limit assembly includes limit plates fixedly installed on the left and right sides of the heat conducting plate, the limit grooves are penetrated through the surface of the limit plate, a mounting shell is overlapped on the surface of the limit plate, the mounting shell is fixedly installed inside the fixed plate, a connecting shell is fixedly provided on the outer surface of the mounting shell, a moving rod is slidably provided inside the connecting shell, a pulling plate is fixedly provided at one end of the moving rod, and a limit block is fixedly provided at the other end of the moving rod, the limit block and the limit groove are overlapped, a transverse spring is connected between the side surface of the limit block and the inner wall of the connecting shell, a push plate is slidably provided inside the mounting shell, the push plate and the limit plate are overlapped, and a vertical spring is connected between the bottom of the push plate and the lower side wall of the mounting shell.

[0009] Preferably, the lifting assembly includes a servo motor fixedly mounted on the right side of the curing box, a screw is fixedly arranged at the output end of the servo motor, a screw sleeve is threadedly arranged on the surface of the screw, a rectangular plate is fixedly arranged on the rear side of the screw sleeve, a guide sleeve is fixedly arranged on the rear side of the rectangular plate, a guide slide rod is slidably arranged inside the guide sleeve, the guide slide rod is fixedly mounted inside the curing box, an upper hinged seat is fixedly arranged at the bottom of the screw sleeve, a hinged plate is hingedly arranged inside the upper hinged seat, a lower hinged seat is hingedly arranged on the surface of the hinged plate, and the lower hinged seat is fixedly mounted on the top of the movable plate.

[0010] Preferably, a connecting plate is fixedly provided on the top of the heat conducting plate, an infrared temperature sensor is fixedly provided inside the connecting plate, the number of the infrared temperature sensors is two, and the two infrared temperature sensors are arranged in parallel.

[0011] Preferably, a box door is installed on the front side of the curing box via a hinge, a mounting opening is provided through the front side of the box door, an observation window is fixedly provided inside the mounting opening, and the observation window is made of double-layer tempered glass.

[0012] Preferably, the heat conducting plate has a rectangular structure and is made of copper alloy.

[0013] Preferably, the mounting plate is in a rectangular structure, and a slot for connecting the mica heating plate is provided on the rear side of the mounting plate.

[0014] Preferably, the limit block is made of metal, and the longitudinal cross-section of the limit block is trapezoidal.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The heating structure for LED encapsulation sealant, by energizing the mica heating plate and the infrared heating lamp, enables the mica heating plate to heat the lower layer of the LED through the heat conducting plate, and heats the upper layer of the LED through the infrared heating lamp. By heating the upper and lower parts of the LED at the same time, the situation that the heating speed of the LED is relatively slow when the substrate or glue layer of the LED is relatively thick is avoided, the curing speed of the LED with a thick substrate or glue layer is improved, and the time required for curing of the LED encapsulation sealant is reduced.

[0017] 2. The heating structure used for LED encapsulation glue can drive the movable plate to move up and down through the lifting component, so that the movable plate drives the infrared heating lamp to move up and down through the transverse plate, shortening or increasing the distance between the infrared heating lamp and the LED, thereby adjusting the heating effect of the infrared heating lamp on the LED, so that the curing temperature of the substrate or the LED with a thicker glue layer is kept consistent, avoiding the temperature difference between the lower and upper layers of the LED that affects the glue curing effect.

[0018] 3. The heating structure for LED encapsulation sealant facilitates the installation and disassembly of the heat conducting plate through the limit assembly. When the mica heating plate is damaged, the heat conducting plate can be removed, thereby facilitating the maintenance or replacement of the mica heating plate in the installation groove, thereby facilitating the repair of the heating structure for LED encapsulation sealant. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a positive isometric drawing of the structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the curing box of the present invention;

[0021] Figure 3 It is a schematic diagram of the local structure of the present invention;

[0022] Figure 4 It is a longitudinal cross-sectional schematic diagram of a local structure of the present invention;

[0023] Figure 5 for Figure 4 A magnified view of the structure at A;

[0024] Figure 6 It is a schematic diagram of the structure of the limit assembly of the present invention;

[0025] Figure 7 It is a schematic diagram of the structure of the lifting assembly of the present invention;

[0026] Figure 8 It is a schematic diagram of the bottom structure of the movable plate of the present invention.

[0027] In the figure: 1. curing box; 2. fixing plate; 3. mounting plate; 4. mounting groove; 5. mica heating plate; 6. limiting plate; 7. limiting groove; 8. mounting shell; 9. connecting shell; 10. moving rod; 11. pulling plate; 12. limiting block; 13. transverse spring; 14. pushing plate; 15. vertical spring; 16. connecting plate; 17. infrared temperature sensor; 18. servo motor; 19. screw sleeve; 20. rectangular plate; 21. guide sleeve; 22. upper hinge seat; 23. hinge plate; 24. lower hinge seat; 25. moving plate; 26. transverse plate; 27. infrared heating lamp; 28. box door; 29. ​​observation window; 30. guide slide rod; 31. heat conduction plate; 32. screw. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Reference Figure 1-8A heating structure for LED encapsulation glue includes a curing box 1, a fixing plate 2 is fixedly arranged on the lower side wall of the curing box 1, a mounting plate 3 is fixedly arranged on the top of the fixing plate 2, a mounting groove 4 is provided on the top of the mounting plate 3, a mica heating plate 5 is installed inside the mounting groove 4, the mounting plate 3 is a rectangular structure, a notch for connecting the mica heating plate 5 is provided on the rear side of the mounting plate 3, the mica heating plate 5 is guided to pass through the mounting plate 3 through the notch, so as to facilitate the connection and power supply of the mica heating plate 5, a heat conducting plate 31 is overlapped on the top of the mounting plate 3, the heat conducting plate 31 is a rectangular structure, the heat conducting plate 31 is made of copper alloy, the heat conducting speed of the heat conducting plate 31 made of copper alloy is faster, so that the LED The heating speed is improved, the bottom of the heat conducting plate 31 is overlapped with the top of the mica heating plate 5, a connecting plate 16 is fixedly arranged on the top of the heat conducting plate 31, an infrared temperature sensor 17 is fixedly arranged inside the connecting plate 16, the number of infrared temperature sensors 17 is two, the two infrared temperature sensors 17 are arranged in parallel, the infrared temperature sensor 17 is convenient for detecting the temperature of LED heating, and the two infrared temperature sensors 17 can detect the upper and lower temperatures of the LED at the same time, so as to facilitate the adjustment of the upper and lower heating temperatures, a limit assembly is arranged between the side of the heat conducting plate 31 and the inner wall of the fixing plate 2, the limit assembly is used for the installation and removal of the heat conducting plate 31, and a sliding device is arranged inside the curing box 1 A movable plate 25 is arranged, a transverse plate 26 is fixedly arranged at the bottom of the movable plate 25, an infrared heating lamp 27 is fixedly arranged between the facing surfaces of the transverse plate 26, a lifting assembly is arranged inside the curing box 1, and the lifting assembly includes a servo motor 18 fixedly arranged on the right side of the curing box 1, a screw 32 is fixedly arranged at the output end of the servo motor 18, a screw sleeve 19 is threadedly arranged on the surface of the screw 32, a rectangular plate 20 is fixedly arranged on the rear side of the screw sleeve 19, a guide sleeve 21 is fixedly arranged on the rear side of the rectangular plate 20, a guide slide 30 is slidably arranged inside the guide sleeve 21, and the guide slide 30 is fixedly installed inside the curing box 1, an upper hinge seat 22 is fixedly arranged at the bottom of the screw sleeve 19, and an upper hinge seat 22 is arranged inside the upper hinge seat 22 A hinged plate 23 is hingedly provided, and a lower hinged seat 24 is hingedly provided on the surface of the hinged plate 23. The lower hinged seat 24 is fixedly installed on the top of the movable plate 25. The servo motor 18 drives the output end to drive the screw 32 to rotate, so that the screw sleeve 19 pushes the hinged plate 23 to flip through the upper hinged seat 22, and the hinged plate 23 pushes the movable plate 25 to move downward or upward through the lower hinged seat 24. The movable plate 25 drives the infrared heating lamp 27 to move downward or upward through the transverse plate 26, and adjusts the distance between the infrared heating lamp 27 and the LED, thereby adjusting the heating effect of the infrared heating lamp 27 on the LED, so that the heating temperature of the LED above and below remains consistent, and the lifting assembly is used to move the movable plate 25 up and down.

[0030] Specifically, the limiting assembly includes a limiting plate 6 fixedly installed on the left and right sides of the heat conducting plate 31, a limiting groove 7 is set through the surface of the limiting plate 6, a mounting shell 8 is overlapped on the surface of the limiting plate 6, the mounting shell 8 is fixedly installed inside the fixed plate 2, a connecting shell 9 is fixedly set on the outer surface of the mounting shell 8, a moving rod 10 is slidably set inside the connecting shell 9, a pull plate 11 is fixedly set at one end of the moving rod 10, and a limiting block 12 is fixedly set at the other end of the moving rod 10, the limiting block 12 is made of metal material, and the longitudinal direction of the limiting block 12 is slidably set. The cross section is trapezoidal, and there is an inclined surface at the top of the trapezoidal limit block 12, so that when the limit plate 6 is inserted, the limit plate 6 can be pushed by the inclined surface of the limit block 12 to move, so that when the heat conducting plate 31 is installed, there is no need to manually pull the limit block 12 to move, the limit block 12 and the limit groove 7 are overlapped, and a transverse spring 13 is connected between the side of the limit block 12 and the inner wall of the connecting shell 9, and a push plate 14 is slidably arranged inside the installation shell 8, and the push plate 14 is overlapped with the limit plate 6, and the bottom of the push plate 14 is connected to the lower side of the installation shell 8. A vertical spring 15 is connected between the walls. When the heat conducting plate 31 needs to be removed, the moving rod 10 is moved by the pulling plate 11, and the limiting block 12 is moved out of the limiting groove 7 by the moving rod 10. The pushing plate 14 is pushed upward by the rebound effect of the vertical spring 15, so that the pushing plate 14 pushes the limiting plate 6 to move upward, so that the limiting plate 6 drives the heat conducting plate 31 to move upward, so that the limiting groove 7 and the limiting block 12 are misaligned, and the heat conducting plate 31 is pulled to drive the limiting plate 6 to move out of the mounting shell 8, and the heat conducting plate 31 can be removed. 1 can be removed to maintain or replace the mica heating plate 5. After the maintenance or replacement is completed, the limiting plate 6 is pushed to be inserted into the installation shell 8 through the heat conducting plate 31, so that the limiting plate 6 is pushed to move by the inclined surface of the limiting block 12, so that the limiting block 12 compresses the transverse spring 13. When the limiting groove 7 is horizontally aligned with the limiting block 12, the limiting block 12 is pushed to be inserted into the limiting groove 7 by the rebound effect of the transverse spring 13, and the heat conducting plate 31 can be installed, so as to facilitate the maintenance or replacement of the mica heating plate 5.

[0031] Specifically, a box door 28 is installed on the front side of the curing box 1 through a hinge. An installation opening is set through the front side of the box door 28. An observation window 29 is fixedly set inside the installation opening. The observation window 29 is made of double-layer tempered glass. The box door 28 is convenient for sealing the curing box 1 to prevent the heat in the curing box 1 from being transferred to the external environment. The observation window 29 made of double-layer tempered glass is convenient for observing the LED heating and curing conditions and preventing heat from being transferred to the external environment.

[0032] The heating structure for LED encapsulation and sealing is connected to 220V mains electricity, and the main controller can be a conventional known device for control such as a computer.

[0033] During use: when heating and curing the substrate or LED with a thicker glue layer, the sealed LED is placed on the top of the heat-conducting plate 31, and the mica heating plate 5 and the infrared heating lamp 27 are energized. The mica heating plate 5 heats the heat-conducting plate 31, so that the heat-conducting plate 31 transfers heat to the substrate of the LED, and the infrared heating lamp 27 heats the upper glue of the LED, and the infrared temperature sensor 17 detects the upper and lower temperatures of the LED. When it is detected that the temperature of the upper layer is lower than that of the lower layer, the output end is driven by the servo motor 18 to drive the screw 32 to rotate, so that the screw sleeve 19 drives the guide sleeve 21 to slide on the surface of the guide slide rod 30 through the rectangular plate 20, so that the screw sleeve 19 pushes the upper end of the hinge plate 23 to move toward the middle of the screw 32 through the upper hinge seat 22, so that the bottom end of the hinge plate 23 moves downward, and the hinge plate 23 is driven by The lower hinge seat 24 pushes the movable plate 25 to move downward, and the movable plate 25 drives the infrared heating lamp 27 to move downward through the transverse plate 26, shortening the distance between the infrared heating lamp 27 and the LED, and improving the heating effect of the infrared heating lamp 27 on the upper layer of the LED. If it is detected that the temperature of the upper layer is greater than the temperature of the lower layer, the servo motor 18 drives the output end to drive the screw 32 to reverse, and the screw sleeve 19 drives the upper end of the hinge plate 23 away from the middle of the screw 32 through the upper hinge seat 22, so that the bottom end of the hinge plate 23 moves upward, and the hinge plate 23 drives the movable plate 25 to move upward through the lower hinge seat 24, and the movable plate 25 drives the infrared heating lamp 27 to move upward through the transverse plate 26, increasing the distance between the infrared heating lamp 27 and the LED, reducing the heating effect of the infrared heating lamp 27 on the upper layer of the LED, and controlling the temperature of the upper and lower sides of the LED to be consistent.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heating structure for LED encapsulation glue, comprising a curing box (1), characterized in that: A fixing plate (2) is fixedly arranged on the lower side wall of the curing box (1), a mounting plate (3) is fixedly arranged on the top of the fixing plate (2), a mounting groove (4) is provided on the top of the mounting plate (3), a mica heating plate (5) is installed inside the mounting groove (4), a heat conducting plate (31) is overlapped on the top of the mounting plate (3), the bottom of the heat conducting plate (31) overlaps with the top of the mica heating plate (5), a limiting component is arranged between the side of the heat conducting plate (31) and the inner wall of the fixing plate (2), the limiting component is used for installing and removing the heat conducting plate (31), a movable plate (25) is slidably arranged inside the curing box (1), a transverse plate (26) is fixedly arranged on the bottom of the movable plate (25), an infrared heating lamp (27) is fixedly arranged between the facing surfaces of the transverse plate (26), and a lifting component is arranged inside the curing box (1), the lifting component is used for moving the movable plate (25) up and down.

2. A heating structure for LED encapsulation glue according to claim 1, characterized in that: The limiting assembly comprises limiting plates (6) fixedly mounted on the left and right sides of the heat conducting plate (31), limiting grooves (7) being arranged through the surface of the limiting plate (6), a mounting shell (8) being overlappedly arranged on the surface of the limiting plate (6), the mounting shell (8) being fixedly mounted inside the fixed plate (2), a connecting shell (9) being fixedly arranged on the outer surface of the mounting shell (8), a moving rod (10) being slidably arranged inside the connecting shell (9), and a pulling plate (10) being fixedly arranged at one end of the moving rod (10) 11), a limit block (12) is fixedly arranged at the other end of the moving rod (10), the limit block (12) and the limit groove (7) are overlapped, a transverse spring (13) is connected between the side of the limit block (12) and the inner wall of the connecting shell (9), a push plate (14) is slidably arranged inside the mounting shell (8), the push plate (14) and the limit plate (6) are overlapped, and a vertical spring (15) is connected between the bottom of the push plate (14) and the lower side wall of the mounting shell (8).

3. A heating structure for LED encapsulation glue according to claim 1, characterized in that: The lifting assembly comprises a servo motor (18) fixedly mounted on the right side of the curing box (1); a screw rod (32) is fixedly arranged at the output end of the servo motor (18); a screw sleeve (19) is threadedly arranged on the surface of the screw rod (32); a rectangular plate (20) is fixedly arranged on the rear side of the screw sleeve (19); a guide sleeve (21) is fixedly arranged on the rear side of the rectangular plate (20); a guide slide rod (30) is slidably arranged inside the guide sleeve (21); the guide slide rod (30) is fixedly mounted inside the curing box (1); an upper hinge seat (22) is fixedly arranged at the bottom of the screw sleeve (19); a hinge plate (23) is hingedly arranged inside the upper hinge seat (22); a lower hinge seat (24) is hingedly arranged on the surface of the hinge plate (23); and the lower hinge seat (24) is fixedly mounted on the top of the moving plate (25).

4. The heating structure for LED encapsulation glue according to claim 1, characterized in that: A connecting plate (16) is fixedly arranged on the top of the heat conducting plate (31), an infrared temperature sensor (17) is fixedly arranged inside the connecting plate (16), the number of the infrared temperature sensors (17) is two, and the two infrared temperature sensors (17) are arranged in parallel.

5. The heating structure for LED encapsulation glue according to claim 1, characterized in that: The curing box (1) is provided with a box door (28) on the front side via a hinge. The box door (28) is provided with a mounting opening on the front side. An observation window (29) is fixedly provided inside the mounting opening. The observation window (29) is made of double-layer tempered glass.

6. The heating structure for LED encapsulation glue according to claim 1, characterized in that: The heat conducting plate (31) has a rectangular structure and is made of copper alloy.

7. The heating structure for LED encapsulation glue according to claim 1, characterized in that: The mounting plate (3) is of rectangular structure, and a slot for connecting the mica heating plate (5) is provided on the rear side of the mounting plate (3).

8. The heating structure for LED encapsulation glue according to claim 2, characterized in that: The limiting block (12) is made of metal material, and the longitudinal cross section of the limiting block (12) is trapezoidal.

Images