A lamp power board welding machine

Abstract

The present invention discloses a lamp tube power board welding machine, which belongs to the field of power board welding machines, including a reflow soldering machine body and a circuit board. A conveying device is installed on the reflow soldering machine body, and the conveying device includes a conveyor belt, and a positioning component is arranged on the conveyor belt. A distance adjustment component is arranged in the reflow soldering machine body, and a heating component is arranged in the reflow soldering machine body. The positioning component includes a fixed plate fixedly installed on the conveyor belt, and an adsorption mechanism is installed on the fixed plate, and a leveling component is arranged on the fixed plate. The horizontality of the upper surface of the circuit board can be automatically adjusted by the cooperation of the laser scanner and the leveling component. At the same time, the air suction speed of the suction pipe on the side with dense electronic components can be automatically increased by the air adjustment component, so that the uniformity of the heating and melting of the solder on the circuit board by the equipment can be effectively improved, and the welding effect of the equipment on the circuit board can be ensured.

Description

Technical Field

[0001] The invention relates to the field of power board welding machines, and more particularly to a lamp tube power board welding machine. Background Art

[0002] The reflow soldering process is widely used in the production of lamp power boards due to its automated and efficient heating system and the ability to achieve continuous batch soldering. Existing reflow soldering equipment is usually divided into a preheating zone, a constant temperature zone, a soldering zone, and a cooling zone. Through the precise coordination between the zones, the temperature curve can be precisely controlled during the soldering process of the power board, effectively ensuring the soldering effect of the equipment on the power board.

[0003] However, in the process of heating and soldering the circuit board by the existing reflow soldering equipment through hot air circulation, especially in the stage of melting the solder on the circuit board by hot air heating, the uneven distribution of electronic components on the circuit board and the uneven surface of the circuit board often affect the uniformity of the equipment in heating and melting the overall solder on the circuit board. For example, when the electronic components on one side of the circuit board are densely distributed, the components in this area will absorb more heat, causing local overheating, thereby causing uneven melting of the overall solder on the circuit board, reducing the final welding effect of the circuit board. Therefore, it is urgent to design a lamp power board welding machine to solve the above problems. Summary of the invention

[0004] In view of the problems existing in the prior art, the object of the present invention is to provide a lamp tube power board welding machine.

[0005] To solve the above problems, the present invention adopts the following technical solutions.

[0006] A lamp power board welding machine, comprising a reflow machine body and a circuit board, wherein a conveying device is installed on the reflow machine body, the conveying device comprises a conveyor belt, a positioning component is arranged on the conveyor belt, a distance adjustment component is arranged in the reflow machine body, and a heating component is arranged in the reflow machine body;

[0007] The positioning assembly comprises a fixed plate fixedly mounted on the conveyor belt, an adsorption mechanism is mounted on the fixed plate, a leveling assembly is arranged on the fixed plate, the leveling assembly comprises a support frame evenly fixedly mounted on the fixed plate in an annular shape, spring rods are penetrated and slidably mounted on the support frame, a support plate is fixedly mounted on the upper end of the spring rod, and an adjustment component is installed between the fixed plate and the spring rod;

[0008] The distance adjustment component includes two partitions fixedly installed in the main body of the reflow soldering machine, a wind shield is slidably installed between the two partitions, two wind shields are provided, and an air adjustment component is arranged between the two wind shields;

[0009] The air regulating assembly comprises a suction regulating mechanism installed between two wind shields, and a transmission component is installed between the two wind shields.

[0010] Furthermore, the adsorption mechanism includes a spring support cylinder fixedly mounted on a fixed plate, a suction cup fixedly mounted on the spring support cylinder, a one-way suction pipe fixedly connected between the suction cup and the spring support cylinder, a one-way exhaust pipe fixedly connected between the suction cup and the spring support cylinder, and a driving component installed between the spring support cylinder and the reflow soldering machine body.

[0011] Further, the driving component includes a threaded rod 1 rotatably mounted on a fixed plate, a worm wheel is fixedly mounted on the threaded rod 1, a support block is fixedly mounted on the fixed plate, a worm meshing with the worm wheel is penetrated and rotatably mounted on the support block, a rotating gear is fixedly mounted on the worm, a rack rod 1 is fixedly mounted on the main body of the reflow soldering machine, a rack rod 2 is fixedly mounted on the main body of the reflow soldering machine, and both the rack rod 1 and the rack rod 2 cooperate with the rotating gear;

[0012] The spring support tube is provided with a square opening, an elastic membrane is fixedly installed on the square opening, a slide plate is threadedly installed on one of the threaded rods, and the slide plate seals and penetrates through and is fixedly installed on the elastic membrane, a sealing plate is fixedly installed on one end of the slide plate, and the sealing plate seals and slides in the spring support tube, and an air delivery hole is provided at the lower end of the spring support tube.

[0013] Furthermore, the adjusting component includes a gear plate rotatably mounted on a fixed plate, a support plate fixedly mounted on the fixed plate, a motor fixedly mounted on the lower end of the support plate, a gear rod meshing with the gear plate fixedly mounted on the driving end of the motor, a bump fixedly mounted on the gear plate, a roller rotatably mounted on the lower end of the spring rod, and a laser scanner fixedly mounted on the main body of the reflow soldering machine.

[0014] Further, the suction adjustment mechanism includes cavities respectively opened on two windshield plates, and two cavities are provided, each of the cavities is rotatably mounted with a rotating shaft, each of the rotating shafts is fixedly mounted with a plate body, each of the plate bodies is rotatably mounted with circular rollers evenly distributed in an annular shape, each of the circular rollers is fixedly mounted with a fixing member, and each of the fixing members is fixedly mounted with a fan blade;

[0015] The two windshields are each provided with an annular groove, and there are two annular grooves, and the annular grooves are both communicated with the corresponding cavity, a disc is slidably mounted on the rotating shaft, a spring member is fixedly mounted on the disc, and there are two spring members, and one end of the spring member is slidably mounted on the corresponding annular groove, a fixing block evenly distributed in an annular shape is fixedly mounted on the disc, a rod body is fixedly mounted on the fixing block, a connecting member is fixedly mounted on the fixing member, and the connecting member is rotatably connected to the corresponding rod body, and a speed regulating component is commonly installed between the two windshields.

[0016] Further, the speed regulating component includes wind collecting chambers respectively provided on the two wind shields, and the two wind collecting chambers are communicated with the corresponding chambers, the two wind collecting chambers are fixedly installed with a tube body, and two tube bodies are provided, the two wind collecting chambers are fixedly installed with a partition block, the two partition blocks are provided with a limited displacement groove, the two limited displacement grooves are slidably installed with a piston member, the two piston members are fixedly installed with a rack rod three, and two rack rods three are provided;

[0017] The cavities are all rotatably mounted with threaded rods II, the threaded rods II are all fixedly mounted with parallel shaft gears meshing with the corresponding rack rods in three phases, and the threaded rods II are all threadedly mounted with pressing plates.

[0018] Furthermore, the transmission component includes placement cavities respectively opened on the two wind shields, and the two placement cavities are communicated with the corresponding cavity body, and a servo motor 2 is fixedly installed on the two placement cavities, and a rotating shaft is fixedly installed on the two servo motors, and a driving wheel is fixedly installed on the two rotating shafts, and there are two driving wheels, and a driven wheel is fixedly installed on the rotating shaft, and a conveyor belt is sleeved and installed between the driven wheel and the corresponding driving wheel.

[0019] Furthermore, a slide slot is provided on the main body of the reflow soldering machine, and two slide slots are provided. A servo motor 1 is fixedly installed on the right slide slot, and a reciprocating screw rod is fixedly installed on the driving end of the servo motor 1. A ball nut is matched and installed on the reciprocating screw rod. There are two ball nuts, and a sliding block is fixedly installed on one side of the two ball nuts, and the two sliding blocks are fixedly connected to the corresponding windshield plate;

[0020] A moving block is slidably installed on the left side of the slide groove, and two moving blocks are provided, and both moving blocks are fixedly connected to the corresponding wind shield. A baffle is fixedly installed in the main body of the reflow soldering machine, and two baffles are provided, and baffles are fixedly installed on the two wind shields.

[0021] Furthermore, the heating assembly includes a heating box fixedly installed in the main body of the reflow soldering machine, an exhaust fan fixedly installed in the heating box, a duct fixedly connected to the lower end of the heating box, two ducts are provided, an air supply pipe is fixedly connected between the two ducts, the lower end of the air supply pipe is fixedly connected to a linearly evenly distributed telescopic tube, and the front and rear ends of the telescopic tubes are fixedly connected to the corresponding wind shield plates, the telescopic tubes are provided with linearly evenly distributed circular holes, and a reflux component is installed between the heating box and the two wind shield plates.

[0022] Furthermore, the return component includes suction pipes fixedly connected to the two wind shields respectively, and two suction pipes are provided. The heating box is fixedly connected with multiple return pipes, and the return pipes are fixedly connected with connecting pipes, and one end of the connecting pipes is sealed and passes through the corresponding wind shield and extends into the corresponding wind collecting chamber.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] (1) This solution can realize automatic adsorption, fixation and release of the circuit board through the positioning component, which helps to improve the stability of the circuit board position during the equipment's circuit board welding process. At the same time, through the cooperation of the laser scanner with the positioning component and the leveling component, the overall horizontality of the circuit board surface can be adjusted as needed, which can help improve the uniformity of the subsequent heating and melting of the solder on the circuit board by the equipment, ensuring the overall soldering effect of the equipment on the circuit board.

[0025] (2) This solution can effectively improve the uniformity and melting speed of the solder heating on the circuit board by the equipment through the coordination of multiple telescopic tubes and multiple suction pipes. At the same time, if the electronic components on one side of the circuit board are densely distributed, the air adjustment component can increase the suction speed of the suction pipe on that side to effectively remove the heat accumulated in the area, prevent local overheating, and ensure the hot air heating and melting effect of the solder on that side. This can further ensure the uniformity of the equipment's heating and melting of the solder on the circuit board and further ensure the equipment's overall welding effect on the circuit board.

[0026] (3) This solution can adjust the space size of the equipment for soldering circuit boards according to the length of the circuit boards through the distance adjustment component, which helps to increase the equipment's soldering speed for circuit boards to a certain extent. At the same time, through the reflow component, the heat resources can be recycled, which has the effect of saving heat resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 for Figure 1 A cross-sectional schematic diagram of

[0029] Figure 3 for Figure 2 Schematic diagram of the internal components of the reflow soldering machine;

[0030] Figure 4 for Figure 3 Schematic diagram of the structure of the mid-distance adjustment component;

[0031] Figure 5 for Figure 4 The structural diagram of the positioning component;

[0032] Figure 6 for Figure 5 A schematic diagram of the structure of the components on the middle fixed plate;

[0033] Figure 7 for Figure 6 A schematic front cross-sectional view of the adsorption mechanism;

[0034] Figure 8 for Figure 7 Schematic diagram of the three-dimensional structure;

[0035] Fig. 9 for Figure 6 Schematic diagram of the structure of the middle leveling component;

[0036] Fig.10 for Fig. 9 Schematic diagram of the structure of the middle spring rod;

[0037] Fig.11 for Figure 3 A schematic diagram of the structure of the heating component;

[0038] Fig.12 for Fig.11 A schematic cross-sectional view of the heating box;

[0039] Fig.13 for Fig.11 Schematic diagram of the structure of the middle air adjustment component;

[0040] Fig.14 for Fig.13 A schematic cross-sectional view of a middle windshield;

[0041] Fig.15 for Fig.14 A schematic diagram of the partial structure of the middle windshield;

[0042] Fig.16 for Fig.14 A schematic diagram of the structure of the internal components of the middle windshield;

[0043] Fig.17 for Fig.14 Structural diagram of the central adjustment and suction mechanism;

[0044] Fig.18 for Fig.17 Schematic diagram of the connection structure between the middle fan blade and the rod body;

[0045] Fig.19 for Fig.16 Schematic diagram of the structure after rotation at a certain angle.

[0046] Description of the numbers in the figure:

[0047] 1. Reflow soldering machine body; 2. Laser scanner; 3. Rack bar 1; 4. Rack bar 2; 5. Slide; 6. Conveying device;

[0048] 7. Pitch adjustment assembly; 71. Baffle; 72. Partition; 73. Servo motor 1; 74. Reciprocating screw rod; 75. Sliding block; 76. Wind deflector; 77. Enclosure plate;

[0049] 8. Circuit board;

[0050] 9. Positioning assembly; 91. Fixing plate; 92. Suction cup; 93. One-way air suction pipe; 94. One-way air exhaust pipe; 95. Spring support cylinder; 96. Threaded rod 1; 97. Worm; 98. Rotating gear; 99. Slide plate; 910. Sealing plate; 911. Worm wheel;

[0051] 10. Leveling assembly; 101. Gear plate; 102. Motor; 103. Gear rod; 104. Bump; 105. Support frame; 106. Spring rod; 107. Support plate; 108. Roller;

[0052] 11. Heating assembly; 1101. Heating box; 1102. Exhaust fan; 1103. Air duct; 1104. Telescopic tube; 1105. Round hole;

[0053] 12. Air adjustment assembly; 1201. Return pipe; 1202. Connecting pipe; 1203. Air suction pipe; 1204. Cavity; 1205. Annular groove; 1206. Wind gathering cavity; 1207. Placement cavity; 1208. Separation block; 1209. Servo motor 2; 1210. Rotating shaft; 1211. Rotating shaft; 1212. Conveyor belt; 1213. Disc; 1214. Spring member; 1215. Pressing plate; 1216. Threaded rod 2; 1217. Rack rod 3; 1218. Plate; 1219. Round roller; 1220. Fixing member; 1221. Fan blade; 1222. Fixing block; 1223. Connecting member; 1224. Rod body; 1225. Tube body; 1226. Piston member. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0055] See also Figures 1 to 19 A lamp power board welding machine includes a reflow machine body 1 and a circuit board 8. A conveying device 6 is installed on the reflow machine body 1. The conveying device 6 includes a conveyor belt. A positioning component 9 is arranged on the conveyor belt. A distance adjustment component 7 is arranged in the reflow machine body 1. A heating component 11 is also arranged in the reflow machine body 1.

[0056] The conveying device 6 is a common existing conveyor belt transmission device, which operates by driving the conveyor belt to realize the transmission of the circuit board 8. Its specific working principle and components are all existing technologies and mechanical parts, and will not be further elaborated here.

[0057] like Figure 2 , Figure 4 - Fig. 9 As shown, the positioning assembly 9 includes a fixed plate 91 fixedly mounted on the conveyor belt, an adsorption mechanism is installed on the fixed plate 91, a leveling assembly 10 is arranged on the fixed plate 91, and the leveling assembly 10 includes a support frame 105 evenly fixedly mounted on the fixed plate 91 in a ring shape, spring rods 106 are penetrated and slidably installed on the support frame 105, a support plate 107 is fixedly installed on the upper end of the spring rods 106, and an adjustment component is installed between the fixed plate 91 and the spring rods 106.

[0058] The adsorption mechanism includes a spring support tube 95 fixedly mounted on a fixed plate 91, a suction cup 92 fixedly mounted on the spring support tube 95, a one-way suction pipe 93 fixedly connected between the suction cup 92 and the spring support tube 95, a one-way exhaust pipe 94 fixedly connected between the suction cup 92 and the spring support tube 95, and a driving component is installed between the spring support tube 95 and the reflow soldering machine body 1.

[0059] The driving component includes a threaded rod 96 rotatably mounted on the fixed plate 91, a worm gear 911 is fixedly mounted on the threaded rod 96, and a support block (drawn but not marked in the figure, from Figure 8 As can be seen in the figure, a worm 97 meshing with the worm wheel 911 is installed through and rotatably on the support block, a rotating gear 98 is fixedly installed on the worm 97, a rack rod 1 3 is fixedly installed on the reflow soldering machine body 1, a rack rod 2 4 is fixedly installed on the reflow soldering machine body 1, and the rack rod 1 3 and the rack rod 2 4 are both matched with the rotating gear 98;

[0060] The spring support cylinder 95 is provided with a square opening, on which an elastic membrane (not shown in the figure but not labeled) is fixedly mounted. Figure 7 and Figure 8 As can be seen in the figure, a slide plate 99 is threadedly installed on the threaded rod 96, and the slide plate 99 is sealed and fixedly installed on the elastic membrane. A sealing plate 910 is fixedly installed on one end of the slide plate 99, and the sealing plate 910 is sealingly slidably installed in the spring support tube 95, and an air transmission hole is opened at the lower end of the spring support tube 95.

[0061] When the device is needed to perform soldering on the circuit board 8, the circuit board 8 is first horizontally placed at a middle position between the suction cup 92 and the upper ends of the plurality of support plates 107 (such as Figure 6 In the direction shown, and in the initial state, the plurality of support plates 107 are flush with the upper surface of the suction cup 92), until the lower surface of the circuit board 8 is in close contact with the upper edge of the suction cup 92 (combined Figure 5 , Figure 6 As shown in the direction, the conveying device 6 is started, and when the conveying device 6 drives the fixing plate 91, the circuit board 8, and the rotating gear 98 to move to the right (as shown in the direction of FIG. Figure 2 As shown in the direction, when the rotating gear 98 is meshed with the rack rod 3, the threaded rod 96 can be driven to rotate through the cooperation of the rack rod 3, the rotating gear 98, the worm 97 and the worm wheel 911, and the slide plate 99 and the sealing plate 910 can be driven to move downward (as shown in the direction shown in the direction). Figure 8 In the direction shown, and during the downward movement of the sealing plate 910, the gas inside the spring support tube 95, that is, the gas at the lower end of the sealing plate 910, will be discharged through the gas supply hole). At this time, the gas between the circuit board 8 and the suction cup 92 can be sucked into the spring support tube 95 through the one-way suction pipe 93, so that the suction cup 92 can adsorb and fix the lower end of the circuit board 8, which helps to ensure the stability of its position during the subsequent heating and welding process of the circuit board 8 by the equipment, and helps to ensure the final welding effect of the equipment on the circuit board 8.

[0062] At the same time, when the equipment completes heating and welding of the circuit board 8, the conveying device 6 drives the circuit board 8 to move to the right side of the reflow soldering machine body 1 (such as Figure 2 As shown in the direction, when the rotating gear 98 is meshed with the rack rod 24, the threaded rod 1 96 can be driven to reverse (from Figure 2 As can be seen in the figure, the teeth of rack bar 1 3 and rack bar 2 4 are opposite, so the two drive the rotating gear 98 to rotate in opposite directions), and the gas collected in the spring support cylinder 95 is re-injected into the suction cup 92 through the one-way exhaust pipe 94, so as to achieve pressure relief of the suction cup 92, so that when the circuit board 8 is forced to move to the rightmost end of the reflow soldering machine body 1 after welding, it can slide down to the guide plate at the right end of the reflow soldering machine body 1 under the action of its own gravity.

[0063] like Figure 2 - Fig.10 As shown, the adjusting component includes a gear plate 101 rotatably mounted on a fixed plate 91, a support plate is fixedly mounted on the fixed plate 91, a motor 102 is fixedly mounted on the lower end of the support plate, a gear rod 103 meshing with the gear plate 101 is fixedly mounted on the driving end of the motor 102, a bump 104 is fixedly mounted on the gear plate 101, a roller 108 is rotatably mounted on the lower end of a spring rod 106, and a laser scanner 2 is fixedly mounted on the reflow soldering machine body 1.

[0064] When the suction cup 92 completes the adsorption and fixation of the circuit board 8, the conveying device 6 drives the circuit board 8 to move to the lower end of the laser scanner 2 (such as Figure 2 The laser scanner 2 is started, and the overall horizontality of the upper surface of the circuit board 8 can be accurately detected by running the laser scanner 2.

[0065] During operation, the laser scanner 2 can scan the upper surface of the circuit board 8 point by point through the laser beam it emits. By measuring the distance from each point of the circuit board 8 to the laser scanner 2, the overall horizontality of the upper surface of the circuit board 8 can be detected. Its specific working principle and components are existing mature technologies and will not be further elaborated here.

[0066] If the laser scanner 2 detects that one side of the circuit board 8 is lower, such as when the laser scanner 2 detects that the entire left front side of the circuit board 8 is lower (such as Figure 5 In the direction shown), at this time, the laser scanner 2 will send a signal to the conveyor 6 and the motor 102 to stop the operation of the conveyor 6 and start the motor 102. The operation of the motor 102 will drive the gear plate 101 to rotate clockwise around the center point of the fixed plate 91 (as shown in FIG. Fig. 9 As the projection 104 continues to rotate and approaches the lower end of the left roller 108, the left roller 108 drives the corresponding spring rod 106 and the support plate 107 to continuously move upward along the arc surface of the projection 104 (as shown in FIG. Fig. 9 As shown in the direction, the left side support plate 107 continuously pushes the left end of the circuit board 8 upward until the upper surface of the circuit board 8 is adjusted to a horizontal state as a whole.

[0067] During the production process of the circuit board 8, one side of its upper surface is prone to be higher than the other side. For example, when the upper surface of the circuit board 8 is processed by an etching process, if the nozzle angle of the etching liquid or the flow direction of the liquid is biased, the etching degree on one side of the circuit board 8 will be different from that on the other side, resulting in one side of the upper surface of the circuit board 8 being higher than the other side.

[0068] If one side of the upper surface of the circuit board 8 is higher than the other side, not only will the effect of subsequent existing printing equipment and patch equipment on printing solder and placing electronic components on the upper surface of the circuit board 8 be reduced, but also the uniformity of the subsequent heating and melting of the solder on the circuit board 8 by the equipment will be reduced. For example, when multiple telescopic tubes 1104 are used to heat the solder on the inclined surface of the circuit board 8, the higher side of the circuit board 8 may not be able to fully absorb heat due to the relatively fast flow of hot air, while the lower side may be too hot due to the accumulation of hot air, which may easily lead to inconsistent solder melting effects in different areas of the upper surface of the circuit board 8, thereby reducing the uniformity of the overall solder melting on the circuit board 8 and the welding effect.

[0069] In addition, if the circuit board 8 is lower in other directions as a whole, such as the left rear side, the right front side or the right rear side as a whole (such as Figure 5 In the direction shown), at this time, through the cooperation of the motor 102 and the gear rod 103, the gear plate 101 can be driven to drive the protrusion 104 to rotate clockwise to the bottom of the lower side of the circuit board 8. After that, through the above operation, the lower side of the circuit board 8 can be lifted to adjust the horizontality of the entire upper surface of the circuit board 8, thereby ensuring the subsequent welding effect of the equipment on the circuit board 8.

[0070] At the same time, multiple spring rods 106 are provided, each of which has a certain elasticity, and the purpose of the lower end of the spring support tube 95 being arc-shaped is (from Figure 8 As can be seen in the figure, when the circuit board 8 starts to move, the suction cup 92 completes the adsorption and fixation of the middle position of the circuit board 8. Therefore, when the spring rod 106 on one side is forced to push the lower side of the circuit board 8 upward, it will drive the suction cup 92 and the corresponding side of the spring support tube 95 to move upward, causing the spring support tube 95 to tilt to one side. At this time, the spring support tube 95 is connected to the spring between the fixing plate 91 through compression and tension, which can effectively ensure that the spring support tube 95 cooperates with the suction cup 92 after tilting, and the stability of the circuit board 8 after the upper surface level is adjusted.

[0071] When the spring rod 106 on one side is forced to push the lower side of the circuit board 8 upward, the higher side of the circuit board 8 will be forced to move downward relatively, compressing the corresponding spring rod 106. Therefore, by providing a plurality of elastic spring rods 106, the effect of the device on adjusting the horizontality of the upper surface of the circuit board 8 can be effectively ensured. Since the overall mass of the circuit board 8 is relatively light, when the circuit board 8 is initially placed on the suction cup 92 and the upper ends of the plurality of support plates 107, the plurality of spring rods 106 will not be compressed downward (such as Figure 5 direction shown).

[0072] from Figure 2It can be seen that the existing printing equipment and patch equipment are installed on the left side of the reflow soldering machine body 1. When the laser scanner 2 completes the horizontality detection of the upper surface of the circuit board 8 and the upper surface of the circuit board 8 is in a horizontal state as a whole, the solder can be evenly printed on the upper surface of the circuit board 8 through the cooperation of the conveying device 6 and the operation of the existing printing equipment. Then, the electronic components can be quickly and accurately moved to the corresponding solder positions on the circuit board 8 through the operation of the patch equipment.

[0073] At the same time, the main body 1 of the reflow soldering machine can be divided into a preheating zone, a constant temperature zone, a soldering (reflow) zone, and a cooling zone (such as Figure 2 In the direction shown), after the equipment automatically prints solder and places electronic components on the upper surface of the circuit board 8, the circuit board 8 is gradually heated and the temperature is controlled, which can effectively reduce the thermal stress generated by the equipment during the welding process of the circuit board 8, thereby helping to improve the welding effect of the equipment on the circuit board 8.

[0074] like Figure 1 - Figure 4 As shown, the distance adjustment component 7 includes two partitions 72 fixedly installed in the reflow soldering machine body 1, a wind shield 76 is slidably installed between the two partitions 72, two wind shields 76 are provided, and an air adjustment component 12 is arranged between the two wind shields 76.

[0075] The reflow soldering machine body 1 is provided with a slide slot 5, and there are two slide slots 5. A servo motor 73 is fixedly installed on the right slide slot 5. A reciprocating screw 74 is fixedly installed on the driving end of the servo motor 73. A ball nut is installed on the reciprocating screw 74. There are two ball nuts. A sliding block 75 is fixedly installed on one side of the two ball nuts, and the two sliding blocks 75 are fixedly connected to the corresponding windshield 76. A moving block is slidably installed on the left slide slot 5. There are two moving blocks, and the two moving blocks are fixedly connected to the corresponding windshield 76 (the left and right here refer to Figure 2 , Figure 2 In the figure, the position of the slide groove 5 is the left side, and the position of the rack rod 4 is the right side). A baffle 71 is fixedly installed in the reflow soldering machine body 1. There are two baffles 71, and the two wind shields 76 are fixedly installed with a baffle plate 77.

[0076] The purpose of setting two baffles 71 and two partitions 72 in the reflow soldering machine body 1 is that when the reflow soldering machine body 1 is running, its internal preheating zone, constant temperature zone, and welding zone heat the circuit board 8 in sequence, and the subsequent cooling zone cools the molten solder on the circuit board 8. Through the cooperation of the two baffles 71 and the two partitions 72, the flow of hot air and the flow of cold air between adjacent areas can be effectively reduced, which helps to improve the effect of the equipment on the circuit board 8 welding.

[0077] When printing solder on the upper surface of the circuit board 8 by the existing printing equipment, if it is necessary to adjust the distance between the two wind shields 76 and the two enclosure plates 77 according to the length of the circuit board 8, start the servo motor 73. The operation of the servo motor 73 can drive the two wind shields 76 and the two enclosure plates 77 to move closer to or away from each other through the cooperation of the reciprocating screw 74 and the two sliding blocks 75. This can meet the needs of the equipment for welding circuit boards 8 of different sizes, effectively reduce unnecessary energy consumption, reduce unnecessary heating of the space by the equipment, and effectively concentrate the heating of the solder on the circuit board 8 by subsequent equipment, thereby effectively improving the welding efficiency of the equipment on the circuit board 8 to a certain extent.

[0078] At the same time, when the windshield plate 76 and the enclosure plate 77 are displaced by force, the two moving blocks cooperate with the left slide groove 5 (such as Figure 2 The direction shown in the figure) can effectively improve the stability of the movement of the two wind shields 76 and the two enclosure plates 77, ensuring that they always move in the horizontal direction.

[0079] like Figure 3 , Fig.11 , Fig.12 As shown, the heating assembly 11 includes a heating box 1101 fixedly installed in the reflow soldering machine body 1, an exhaust fan 1102 is fixedly installed in the heating box 1101, and a conduit is fixedly connected to the lower end of the heating box 1101. The conduit is provided with two (drawn but not marked in the figure, Fig.12 As can be seen in the figure, the two ducts are connected to a common air delivery pipe 1103, the lower end of the air delivery pipe 1103 is connected to a linearly evenly distributed telescopic pipe 1104, and the front and rear ends of the telescopic pipe 1104 are fixedly connected to the corresponding windshield 76 (the front and rear here refer to Fig.12 , Fig.12 The position of the heating box 1101 in the figure is the rear end, and the position of the circular hole 1105 in the figure is the front end). The telescopic tube 1104 is provided with circular holes 1105 that are linearly and evenly distributed, and a reflux component is installed between the heating box 1101 and the two wind shields 76.

[0080] When the conveying device 6 drives the circuit board 8 to move to the welding area, that is, the lower end of the plurality of telescopic tubes 1104 (such as Fig.12 The conveyor 6 is stopped first, and the exhaust fan 1102 and the heating box 1101 are started. The exhaust fan 1102 can be operated to remove the external gas through the one-way air inlet pipe (from the heating box 1101) provided on the main body 1 of the reflow soldering machine. Figure 1 As can be seen in the figure, the gas is sucked into the heating box 1101, and the operation of the heating box 1101 can heat the gas entering the interior to the temperature required for solder melting (from Fig.12In the figure, a heater is arranged in the heating box 1101), the heated gas will flow along the two conduits and the air duct 1103, enter the multiple telescopic tubes 1104, and finally be blown toward the upper surface of the circuit board 8 through the multiple circular holes 1105, thereby heating and melting the solder on the upper surface of the circuit board 8.

[0081] At the same time, the purpose of arranging a plurality of telescopic tubes 1104 in a linearly uniform distribution in the welding area of ​​the reflow soldering machine body 1, that is, the middle area between the two partitions 72 and the two windshield plates 76, is that when the gas heated inside the heating box 1101 is blown toward the upper surface of the circuit board 8 through the plurality of circular holes 1105 on the plurality of telescopic tubes 1104 (such as Fig.12 The hot air is directed in the direction shown in the figure to directly act on the upper surface of the circuit board 8 and the solder thereon, which helps to increase the melting speed of the solder on the circuit board 8 by the hot air. At the same time, according to the upward movement characteristic of the hot air, the hot air blown out from the upper end of the circuit board 8 can better cover the upper surface of the entire circuit board 8, thereby promoting the uniform distribution of heat on the upper surface of the circuit board 8, which helps to improve the melting effect of the equipment on the overall solder on the upper surface of the circuit board 8.

[0082] At the same time, when the two windshield plates 76 are forced to move closer to or farther from each other according to the length of the circuit board 8, the two windshield plates 76 will stretch or compress the two ends of the telescopic tube 1104, thereby effectively ensuring that the hot air ejected from the multiple circular holes 1105 on the telescopic tube 1104 is concentrated in the upper area of ​​the circuit board 8 (such as Fig.12 In the direction shown), it helps to reduce unnecessary energy waste and can also speed up the speed at which the equipment heats and melts the solder on the circuit board 8 to a certain extent.

[0083] like Fig.14 - Fig.19 As shown, the air regulating assembly 12 includes a suction regulating mechanism installed between two wind shields 76 , and a transmission component is installed between the two wind shields 76 .

[0084] The suction adjustment mechanism includes cavities 1204 respectively provided on two windshield plates 76, and two cavities 1204 are provided, each of the cavities 1204 is rotatably mounted with a rotating shaft 1211, each of the rotating shafts 1211 is fixedly mounted with a plate 1218, each of the plate 1218 is rotatably mounted with circular rollers 1219 evenly distributed in an annular shape, each of the circular rollers 1219 is fixedly mounted with a fixing member 1220, and each of the fixing members 1220 is fixedly mounted with a fan blade 1221;

[0085] An annular groove 1205 is provided on the two wind shields 76, and there are two annular grooves 1205, and the annular grooves 1205 are communicated with the corresponding cavity 1204, a disc 1213 is slidably mounted on the rotating shaft 1211, a spring member 1214 is fixedly mounted on the disc 1213, and there are two spring members 1214, and one end of the spring member 1214 is slidably mounted on the corresponding annular groove 1205, a fixing block 1222 evenly distributed in an annular shape is fixedly mounted on the disc 1213, a rod body 1224 is fixedly mounted on the fixing block 1222, a connecting member 1223 is fixedly mounted on the fixing member 1220, and the connecting member 1223 is rotatably connected to the corresponding rod body 1224, and a speed regulating component is installed between the two wind shields 76.

[0086] The speed regulating component includes wind collecting chambers 1206 respectively provided on the two wind shields 76, and the two wind collecting chambers 1206 are communicated with the corresponding chambers 1204, the two wind collecting chambers 1206 are fixedly installed with a tube body 1225, and two tube bodies 1225 are provided, the two wind collecting chambers 1206 are fixedly installed with a partition block 1208, the two partition blocks 1208 are provided with a limited displacement groove, the two limited displacement grooves are slidably installed with a piston member 1226, the two piston members 1226 are fixedly installed with a rack rod three 1217, and two rack rods three 1217 are provided;

[0087] A threaded rod 1216 is rotatably mounted on the cavity 1204 , a parallel axis gear meshing with a corresponding rack rod 1217 is fixedly mounted on the threaded rod 1216 , and a pressing plate 1215 is threadedly mounted on the threaded rod 1216 .

[0088] The transmission component includes placement cavities 1207 respectively opened on the two windshield plates 76, and the two placement cavities 1207 are communicated with the corresponding cavity 1204, servo motors 1209 are fixedly installed on the two placement cavities 1207, rotating shafts 1210 are fixedly installed on the two servo motors 1209, driving wheels are fixedly installed on the two rotating shafts 1210, and there are two driving wheels, driven wheels are fixedly installed on the rotating shafts 1211, and conveyor belts 1212 are sleeved and installed between the driven wheels and the corresponding driving wheels.

[0089] The return flow component includes suction pipes 1203 respectively fixedly connected to the two wind shields 76, and two suction pipes 1203 are provided. A plurality of return pipes 1201 are fixedly connected to the heating box 1101. The return pipes 1201 are all fixedly connected to a connecting pipe 1202, and one end of the connecting pipe 1202 is sealed and passes through the corresponding wind shield 76 and extends into the corresponding wind collecting chamber 1206.

[0090] When the multiple telescopic tubes 1104 cooperate to blow the hot air evenly to the upper surface of the circuit board 8, the two servo motors 1209 are started. The two servo motors 1209 cooperate with the two rotating shafts 1210 and the multiple conveyor belts 1212 to drive the multiple rotating shafts 1211 to drive the multiple fan blades 1221 to rotate together. The suction force generated by the rotation of the corresponding multiple fan blades 1221 can suck the hot air in the middle area of ​​the two wind shields 76 into the corresponding cavity 1204 through the corresponding suction pipe 1203, thereby promoting good air flow in the welding area of ​​the reflow soldering machine body 1, which helps to improve the uniformity of heat distribution on the upper surface of the circuit board 8, and through the suction design on both sides of the circuit board 8, the hot air flow can be urged to flow to the edge position of the circuit board 8, thereby ensuring the effect of melting the solder at the edge position of the circuit board 8, which helps to reduce the occurrence of cold solder joints at the edge of the circuit board 8.

[0091] At the same time, by blowing air through multiple circular holes 1105, the upper surface of the circuit board 8 and the solder thereon are heated, and by cooperating with multiple suction pipes 1203 to suck air on both sides of the circuit board 8, the gas flow in the welding area of ​​the equipment can be effectively accelerated, and the sufficiency and speed of heat exchange between the hot air and the upper surface of the circuit board 8 and the solder thereon can be improved, thereby further improving the equipment's welding speed of the circuit board 8.

[0092] In addition, the suction ports on the multiple suction pipes 1203 are all located at the lower end of the circuit board 8, so as to facilitate the hot air blown out of the multiple circular holes 1105 to be guided to the upper surface of the circuit board 8, thereby further improving the sufficient contact between the hot air and the solder on the circuit board 8, which can help to further ensure the effect of the equipment on heating and melting the solder on the circuit board 8.

[0093] At the same time, in order to avoid the situation where the suction force of the left and right suction pipes 1203 is too large when the two suction pipes 1203 absorb the hot air above the circuit board 8, Fig.13 The direction shown), which causes the risk of displacement of electronic components on the circuit board 8, the operating power of the two servo motors 1209, that is, the power of the corresponding multiple fan blades 1221 rotating and sucking air should be matched with the amount of hot air blown out by the multiple circular holes 1105, and should be adapted to the length of the circuit board 8. At the same time, the corresponding multiple fan blades 1221 should have the same initial rotation and suction power. The purpose is to ensure that when the solder on the circuit board 8 is initially heated and melted, a uniform and stable airflow field can be formed in the welding area of ​​the equipment, so that various parts of the upper surface of the circuit board 8 are relatively uniformly affected by the airflow, thereby facilitating the uniform heating and melting of the solder on the upper surface of the circuit board 8, and improving the welding effect of the equipment on the circuit board 8.

[0094] At the same time, if the electronic components on the circuit board 8 are unevenly distributed, and the electronic components on one side are densely distributed (the distribution pattern of electronic components on the circuit board 8 is related to factors such as subsequent usage requirements), the electronic components on that side will hinder the flow of gas, and will reduce the amount of gas sucked into the corresponding cavity 1204 by the suction pipe 1203 on that side within the same unit time.

[0095] For example, when the electronic components on the left side of the circuit board 8 are densely distributed, the air (such as Fig.14 As shown in the direction, it will be lower than the amount of gas sucked into the corresponding cavity 1204 by the right suction pipe 1203. When the gas inside the cavities 1204 on the left and right sides is blown to the left and right ends of the piston member 1226 through the corresponding tube body 1225 (as shown in the direction of the right suction pipe 1203), the gas inside the cavities 1204 on the left and right sides will be blown to the left and right ends of the piston member 1226 through the corresponding tube body 1225. Fig.19 When the gas volume is larger, that is, the gas on the right side will push the piston 1226 to move to the left (as shown in the direction of FIG. Fig.19 direction shown);

[0096] Combination Fig.17 , Fig.18 and Fig.19 In the direction shown, when the piston member 1226 moves to the left, the corresponding rack rod 1217 cooperates with the corresponding parallel axis gear and the threaded rod 1216 to drive the left pressing plate 1215 to press the corresponding disc 1213 downward. When the left disc 1213 is forced to move downward, the corresponding plurality of fixing blocks 1222 cooperate with the plurality of rod bodies 1224 to generate a downward pulling force on the corresponding plurality of connecting members 1223 and the fixing member 1220, driving the plurality of fan blades 1221 to rotate counterclockwise around the corresponding fixing member 1220 as the axis (such as Fig.18 In the direction shown), the effect of gradually increasing the inclination angle of the left fan blade 1221 can be achieved;

[0097] When the inclination angle of the left plurality of blades 1221 increases (such as Fig.19 In the direction shown), the driving effect of the rotation of the fan blades 1221 on the airflow will also be enhanced, thereby increasing the speed at which the left side multiple fan blades 1221 rotate to absorb the hot air on the left side of the circuit board 8, accelerating the flow speed of the gas on the left side of the circuit board 8, and helping to further improve the uniformity of the equipment's heating and melting of the entire solder on the upper surface of the circuit board 8.

[0098] If the electronic components on one side of the circuit board 8 are densely distributed, the component-dense area will block the flow of hot air and absorb heat. For example, in the electronic component-dense area, since multiple components absorb heat at the same time, the hot air energy flowing through the area is consumed in large quantities. Therefore, the heat of the hot air flowing through the area used to heat the solder will be relatively reduced. Therefore, by increasing the flow rate of the gas in the area, that is, increasing the amount of hot air entering the area, not only can the heat accumulated in the area be effectively taken away to prevent local overheating, but also the heat exchange effect of the hot air in the area on the solder can be ensured. Therefore, by increasing the flow rate of the hot air on this side, the uniformity of the heating and melting of the overall solder on the circuit board 8 by the equipment can be further ensured, and the welding effect of the equipment on the circuit board 8 can be further ensured.

[0099] At the same time, when the hot air enters the two air collecting chambers 1206, it will eventually go along the corresponding two connecting pipes 1202 (the multiple connecting pipes 1202 are elastic to adapt to the movement of the two wind shields 76) and the two return pipes 1201 (the multiple return pipes 1201 are all set as one-way pipes), enter the interior of the heating box 1101, and finally be blown out again through the multiple circular holes 1105, thereby realizing the recycling of the heated gas and achieving the effect of saving heat resources (after the exhaust fan 1102 has been running for a period of time, its operating exhaust power can be gradually reduced).

[0100] At the same time, in order to realize batch welding of multiple circuit boards 8 by the equipment, the user can add multiple sets of positioning components 9 and leveling components 10 on the conveyor belt as needed, so as to realize continuous welding of multiple circuit boards 8 by the equipment and improve the welding effect of the equipment on the circuit boards 8.

[0101] Usage: When the device is needed to perform soldering on the circuit board 8, first place the circuit board 8 on the upper end of the suction cup 92 and the plurality of support plates 107, and then start the conveyor 6 and the laser scanner 2. The conveyor 6 drives the circuit board 8 to move to the right (such as Figure 2 In the direction shown), through the cooperation of the adsorption mechanism and the rack rod 3, the suction cup 92 can adsorb and fix the lower end of the circuit board 8. At the same time, the operation of the laser scanner 2 can detect the horizontality of the upper surface of the circuit board 8 passing thereunder.

[0102] If the laser scanner 2 detects that one side of the upper surface of the circuit board 8 is too low, the laser scanner 2 drives the motor 102 to operate. The operation of the motor 102 will cooperate with the adjustment component to drive the gear plate 101 to drive the protrusion 104 to rotate to the lower side of the circuit board 8. In this process, the level of the upper surface of the circuit board 8 can be adjusted through the cooperation of the protrusion 104 and the spring rod 106 on this side, thereby effectively ensuring the uniformity of the subsequent heating and melting of the solder on the upper surface of the circuit board 8 by the equipment.

[0103] After the horizontality of the upper surface of the circuit board 8 is adjusted, the conveying device 6 drives the circuit board 8 to move to the welding area in the reflow soldering machine body 1, that is, the lower end of the multiple telescopic tubes 1104, through the fixing plate 91, the multiple circular holes 1105 on the multiple telescopic tubes 1104 can be used through the heating component 11 to blow hot air uniformly to the solder on the circuit board 8, so that the solder melts, and in this process, through the cooperation of the two servo motors 1209 and the suction adjustment components, the multiple fan blades 1221 can be driven to rotate, and the suction force generated during the rotation of the corresponding multiple fan blades 1221 can absorb the hot air above the circuit board 8 through the corresponding suction pipe 1203, so as to effectively promote the formation of a good airflow circulation on the upper surface of the circuit board 8, and promote the effect of the equipment on melting the overall solder on the circuit board 8.

[0104] At the same time, if the electronic components on one side of the circuit board 8 are densely distributed, the suction power of the fan blades 1221 on that side can be increased by increasing the inclination angle of the multiple fan blades 1221 on that side through the suction adjustment mechanism, which can effectively prevent local overheating on the upper surface of the circuit board 8, and help to further promote the uniformity of the equipment's heating and melting of the solder on the upper surface of the circuit board 8, and further ensure the equipment's welding effect on the circuit board 8.

[0105] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A lamp power board welding machine, comprising a reflow soldering machine body (1) and a circuit board (8), wherein a conveying device (6) is installed on the reflow soldering machine body (1), wherein the conveying device (6) comprises a conveyor belt, wherein a positioning component (9) is arranged on the conveyor belt, wherein a distance adjustment component (7) is arranged in the reflow soldering machine body (1), and wherein a heating component (11) is arranged in the reflow soldering machine body (1); Features: The positioning assembly (9) comprises a fixing plate (91) fixedly mounted on the conveyor belt, an adsorption mechanism being mounted on the fixing plate (91), a leveling assembly (10) being arranged on the fixing plate (91), the leveling assembly (10) comprising a support frame (105) fixedly mounted on the fixing plate (91) in an annular shape, spring rods (106) penetrating and slidably mounted on the support frame (105), a support plate (107) being fixedly mounted on the upper end of each spring rod (106), and an adjusting component being mounted between the fixing plate (91) and the spring rod (106); The distance adjustment component (7) comprises two partitions (72) fixedly mounted in the reflow soldering machine body (1), a windshield (76) being slidably mounted between the two partitions (72), two windshields (76) being provided, and an air adjustment component (12) being disposed between the two windshields (76); The air regulating assembly (12) comprises a suction regulating mechanism installed between two wind shields (76), and a transmission component is installed between the two wind shields (76); The adsorption mechanism comprises a spring support cylinder (95) fixedly mounted on a fixed plate (91); a suction cup (92) is fixedly mounted on the spring support cylinder (95); a one-way suction pipe (93) is fixedly connected between the suction cup (92) and the spring support cylinder (95); a one-way exhaust pipe (94) is fixedly connected between the suction cup (92) and the spring support cylinder (95); and a driving component is installed between the spring support cylinder (95) and the reflow soldering machine body (1); The driving component comprises a threaded rod (96) rotatably mounted on a fixed plate (91), a worm wheel (911) being fixedly mounted on the threaded rod (96), a support block being fixedly mounted on the fixed plate (91), a worm (97) being passed through and rotatably mounted on the support block and meshing with the worm wheel (911), a rotating gear (98) being fixedly mounted on the worm (97), a rack rod (3) being fixedly mounted on the reflow soldering machine body (1), a rack rod (4) being fixedly mounted on the reflow soldering machine body (1), and both the rack rod (3) and the rack rod (4) being matched with the rotating gear (98); The spring support cylinder (95) is provided with a square opening, an elastic membrane is fixedly mounted on the square opening, a slide plate (99) is threadedly mounted on the threaded rod (96), and the slide plate (99) is sealingly penetrated and fixedly mounted on the elastic membrane, a sealing plate (910) is fixedly mounted on one end of the slide plate (99), and the sealing plate (910) is sealingly slidably mounted in the spring support cylinder (95), and an air delivery hole is provided at the lower end of the spring support cylinder (95); The suction adjustment mechanism comprises cavities (1204) respectively provided on two windshield plates (76), and two cavities (1204) are provided, each of the cavities (1204) being rotatably mounted with a rotating shaft (1211), each of the rotating shafts (1211) being fixedly mounted with a plate body (1218), each of the plate bodies (1218) being rotatably mounted with circular rollers (1219) evenly distributed in an annular shape, each of the circular rollers (1219) being fixedly mounted with a fixing member (1220), and each of the fixing members (1220) being fixedly mounted with a fan blade (1221); The two windshield plates (76) are each provided with an annular groove (1205), and two annular grooves (1205) are provided, and the annular grooves (1205) are both communicated with the corresponding cavity (1204), and a disk (1213) is slidably mounted on the rotating shaft (1211), and a spring member (1214) is fixedly mounted on the disk (1213), and two spring members (1214) are provided, and one end of the spring member (1214) is slidably mounted on the rotating shaft (1211). On the corresponding annular groove (1205), the disk (1213) is fixedly mounted with fixing blocks (1222) evenly distributed in an annular shape, the fixing blocks (1222) are fixedly mounted with rod bodies (1224), the fixing members (1220) are fixedly mounted with connecting members (1223), and the connecting members (1223) are rotatably connected to the corresponding rod bodies (1224), and a speed regulating component is installed between the two wind shields (76).

2. A lamp tube power board welding machine according to claim 1, characterized in that: The adjusting component comprises a gear plate (101) rotatably mounted on a fixing plate (91), a support plate fixedly mounted on the fixing plate (91), a motor (102) fixedly mounted at the lower end of the support plate, a gear rod (103) meshing with the gear plate (101) fixedly mounted at the driving end of the motor (102), a bump (104) fixedly mounted on the gear plate (101), a roller (108) rotatably mounted at the lower end of the spring rod (106), and a laser scanner (2) fixedly mounted on the reflow soldering machine body (1).

3. The lamp tube power board welding machine according to claim 1, characterized in that: The speed regulating component comprises wind collecting chambers (1206) respectively provided on two wind shield plates (76), and the two wind collecting chambers (1206) are both communicated with the corresponding chamber (1204), a tube body (1225) is fixedly mounted on the two wind collecting chambers (1206), and two tube bodies (1225) are provided, a partition block (1208) is fixedly mounted on the two wind collecting chambers (1206), a limited displacement groove is provided on the two partition blocks (1208), a piston member (1226) is slidably mounted on the two limited displacement grooves, and a rack rod three (1217) is fixedly mounted on the two piston members (1226), and two rack rods three (1217) are provided; The cavity (1204) is rotatably mounted with a second threaded rod (1216), the second threaded rod (1216) is fixedly mounted with a parallel axis gear meshing with a corresponding third rack rod (1217), and the second threaded rod (1216) is threadably mounted with a pressing plate (1215).

4. A lamp tube power board welding machine according to claim 1, characterized in that: The transmission component comprises placement cavities (1207) respectively provided on two windshield plates (76), and the two placement cavities (1207) are both communicated with the corresponding cavity (1204), servo motor 2 (1209) is fixedly mounted on the two placement cavities (1207), rotating shafts (1210) are fixedly mounted on the two servo motors (1209), driving wheels are fixedly mounted on the two rotating shafts (1210), and two driving wheels are provided, driven wheels are fixedly mounted on the rotating shafts (1211), and a conveyor belt (1212) is sleeved and mounted between the driven wheels and the corresponding driving wheels.

5. The lamp tube power board welding machine according to claim 1, characterized in that: The reflow soldering machine body (1) is provided with a slide groove (5), and the slide grooves (5) are provided with two. A servo motor (73) is fixedly installed on the right slide groove (5), and a reciprocating screw (74) is fixedly installed on the driving end of the servo motor (73). A ball nut is matched and installed on the reciprocating screw (74). The ball nuts are provided with two. A sliding block (75) is fixedly installed on one side of the two ball nuts, and the two sliding blocks (75) are fixedly connected to the corresponding windshield (76); A moving block is slidably mounted on the left side slide groove (5), two moving blocks are provided, and both moving blocks are fixedly connected to corresponding windshields (76), a baffle (71) is fixedly mounted in the reflow soldering machine body (1), two baffles (71) are provided, and a baffle plate (77) is fixedly mounted on both windshields (76).

6. The lamp tube power board welding machine according to claim 1, characterized in that: The heating assembly (11) comprises a heating box (1101) fixedly installed in a reflow soldering machine body (1), an exhaust fan (1102) fixedly installed in the heating box (1101), a conduit fixedly connected at the lower end of the heating box (1101), two conduits being provided, an air supply pipe (1103) being fixedly connected between the two conduits, a telescopic pipe (1104) being fixedly connected at the lower end of the air supply pipe (1103) being uniformly distributed in a linear manner, and the front end and the rear end of the telescopic pipe (1104) being fixedly connected to the corresponding windshield (76), the telescopic pipe (1104) being uniformly distributed in a linear manner being provided with circular holes (1105), and a reflow component being installed between the heating box (1101) and the two windshields (76).

7. A lamp tube power board welding machine according to claim 6, characterized in that: The return component comprises air suction pipes (1203) respectively fixedly connected to the two wind shields (76), and two air suction pipes (1203) are provided. The heating box (1101) is fixedly connected with a plurality of return pipes (1201), and the return pipes (1201) are fixedly connected with connecting pipes (1202), and one end of the connecting pipes (1202) is sealed and passes through the corresponding wind shield (76) and extends into the corresponding air collecting chamber (1206).

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