Cutting device for graphene chip production

Abstract

The invention discloses a cutting device for graphene chip production, and relates to the technical field of graphene chip production, the cutting device comprises a workbench, a first auxiliary comprehensive mechanism and a second auxiliary comprehensive mechanism, and the first auxiliary comprehensive mechanism and the second auxiliary comprehensive mechanism are both installed on the workbench; the first auxiliary comprehensive mechanism comprises a base plate distributing and placing assembly used for distributing and placing a base plate to the base plate transferring assembly, a cutting and feeding assembly used for conveying the base plate with graphene to a cutting area, and a waste treatment assembly used for separating the base plate from waste after cutting. According to the invention, the cutting preparation operation of the next substrate can be quickly and automatically carried out in the cutting process of one graphene chip, manual intervention is not needed, the production efficiency is remarkably improved through the continuous operation capability, and the graphene chip cutting device is suitable for the production requirements of large-batch graphene chips.

Description

Technical Field

[0001] The invention belongs to the technical field of graphene chip production, and in particular relates to a cutting device for graphene chip production. Background Art

[0002] Graphene chip is a chip made of graphene material. Graphene is a two-dimensional carbon nanomaterial composed of carbon atoms. It has extremely high electrical conductivity, thermal conductivity and strength, and is considered to be an ideal material for the next generation of chips. Compared with traditional silicon-based chips, graphene chips have significant advantages in performance, such as higher carrier speed, lower power consumption and better heat dissipation performance. However, the industrialization of graphene chips will take some time, and it still faces many technical and cost challenges.

[0003] A graphene chip processing and cutting device with publication number CN110774462A relates to the technical field of graphene chip processing, and discloses a graphene chip processing and cutting device, comprising a workbench, a first positioning mechanism, a second positioning mechanism, a cutting mechanism and a protective mechanism. The workbench is in a hollow rectangular structure, and a cover plate is provided on the top of the workbench. The protective mechanism is located beside the workbench and its output end is fixed on the cover plate. A limit bar for limiting one side of the graphene chip is provided on the top of the workbench. The limit bar is fixedly connected to the workbench by a plurality of bolts, and a blanking trough connected to the inside of the workbench is provided on the side of the limit bar of the workbench. The blanking trough is in a long strip structure, and a blower group is provided on the inner side wall of the cover plate. The present invention can realize layer-by-layer positioning of graphene chips, make their positioning stable, and improve the subsequent cutting effect; and can meet the automatic positioning of graphene chips of different sizes, thereby improving the overall practical performance.

[0004] In the implementation process of the above-mentioned patent, loading and unloading often rely on manual operation, which not only has low production efficiency and is difficult to meet the urgent needs of mass production, but also requires workers to frequently contact the cutting area, increasing the risk of accidental injury. Although cleaning is performed, some graphene is not directly grown on the substrate, resulting in the inability to separate the substrate from the remaining graphene during cutting during the waste treatment stage, which brings a burden to subsequent processing. In addition, the above-mentioned patent can only wait for the first graphene to be cut before loading and preparing for cutting the second graphene within a cutting cycle, which is inefficient and not suitable for large-scale cutting operations. In order to solve these problems, the present invention proposes an innovative graphene chip cutting device. Summary of the invention

[0005] In order to solve the problems raised by the above background technology, the present invention proposes a cutting device for producing graphene chips.

[0006] The purpose of the present invention can be achieved through the following technical solutions: A cutting device for producing graphene chips, comprising a workbench and Auxiliary integrated mechanism No. 1 and auxiliary integrated mechanism No. 2, wherein the auxiliary integrated mechanism No. 1 and the auxiliary integrated mechanism No. 2 are both installed on a workbench; The auxiliary integrated mechanism No. 1 includes a substrate placing assembly for placing the substrate onto the substrate transfer assembly, a cutting and loading assembly for delivering the substrate with graphene to the cutting area, and a waste material processing assembly for separating the substrate from waste materials after cutting; The second auxiliary integrated mechanism includes a substrate transfer component for transferring the substrate with graphene to the cutting loading component and a unloading mechanism for pushing the graphene and substrate in the cutting area out of the cutting area.

[0007] As a further preferred embodiment of the present technical solution: the substrate placing assembly comprises a cylinder, which is fixedly connected to the bottom end of the workbench through a No. 1 fixed block, a sliding frame is fixedly connected to the working end of the cylinder, a pushing frame for pushing out the bottom layer of the substrate inside the No. 3 fixed frame is fixedly connected to the upper end of the sliding frame, and a plurality of rotating wheels are rollingly arranged on the upper end of the pushing frame.

[0008] As a further preferred embodiment of the present technical solution: the cutting and feeding assembly includes a No. 1 connecting rod fixedly connected to the sliding frame, a No. 1 rack is fixedly connected to the No. 1 connecting rod, the No. 1 rack is meshingly connected with a gear ring, a guide block is fixedly connected to the inside of the gear ring, a reciprocating screw is arranged inside the guide block, and the upper end of the reciprocating screw is fixedly connected to a lifting platform.

[0009] As a further preferred embodiment of the present technical solution: the waste processing assembly comprises a No. 1 rotating shaft rotatably connected to the lower end of the workbench and a No. 1 circular gear fixedly arranged on the No. 1 rotating shaft, the No. 1 circular gear is meshingly connected with a No. 1 rack, the lower end of the No. 1 circular gear is fixedly connected with a No. 1 bevel gear, the No. 1 bevel gear is meshingly connected with a No. 2 bevel gear, the No. 1 bevel gear is fixedly connected with a No. 1 connecting shaft, the No. 1 connecting shaft is connected to the No. 2 rotating shaft through a No. 1 pulley, a No. 1 transmission belt and a No. 2 pulley, and the No. 2 rotating shaft is fixedly connected with a rotating table; The rotating platform is provided with an electric suction cup for adsorbing the substrate.

[0010] As a further preferred embodiment of the technical solution: a waste collection box is movably installed on the workbench, and a box door is provided on the waste collection box.

[0011] As a further preferred embodiment of the present technical solution: the substrate transfer assembly includes a driving motor fixedly connected to the workbench, the output end of the driving motor is fixedly connected to a No. 3 rotating shaft, the No. 3 rotating shaft is fixedly connected to an active roller, and the workbench is rotatably connected to a plurality of No. 2 connecting shafts arranged parallel to the No. 3 rotating shaft, and each No. 2 connecting shaft is provided with a driven roller arranged parallel to and aligned with the active roller.

[0012] As a further preferred embodiment of the present technical solution: the unloading mechanism includes a No. 3 pulley fixedly connected to the No. 3 rotating shaft, the No. 3 pulley is connected to the No. 4 pulley through the No. 2 transmission belt, the No. 4 pulley is fixedly connected to the No. 4 rotating shaft, the No. 4 rotating shaft is fixedly connected to a No. 2 circular gear, the No. 2 circular gear is meshingly connected to a No. 2 rack, the No. 2 rack is fixedly connected to a No. 2 connecting rod, and the No. 2 connecting rod is fixedly connected to a push plate for pushing the graphene cut from the cutting area together with the substrate.

[0013] As a further preferred embodiment of the technical solution: a cutting table is detachably mounted on the workbench, a second fixing frame is fixedly connected to the cutting table, and a laser cutting assembly is arranged on the second fixing frame.

[0014] As a further preferred embodiment of the present technical solution: a clamping mechanism is installed on the second fixing frame, the clamping mechanism comprises a first fixing frame fixedly connected to the second fixing frame, a sliding shaft is slidably connected to the first fixing frame, and a roller assembly is arranged at the lower end of the sliding shaft; A No. 2 return spring is sleeved on the outer side of the sliding shaft, and the No. 2 return spring is arranged between the No. 1 fixing frame and the roller assembly.

[0015] As a further preferred embodiment of the technical solution: it also includes a limiting mechanism; The limiting mechanism includes a No. 1 return spring and a wedge block. A slide groove is provided on the cutting table. A wedge block matching with the slide groove is slidably connected inside the slide groove. The lower surface of the wedge block is arranged inclined. The slide groove is also provided with a No. 1 return spring. One end of the No. 1 return spring is fixedly connected to the wedge block, and the other end of the wedge block is fixedly connected to the cutting table.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, during the cutting process of a graphene chip, the preparation for cutting the next substrate can be carried out quickly and automatically without manual intervention. This continuous operation capability significantly improves production efficiency and is suitable for the production needs of large quantities of graphene chips.

[0017] 2. In the present invention, the laser cutting component is operated by an automated loading and unloading mechanism, which prevents workers from directly contacting the laser cutting area, thereby reducing the risk of accidental injury. At the same time, the waste processing component can automatically centrally process the graphene waste after cutting, further reducing the contact between workers and waste and improving the safety of the overall operation.

[0018] 3. In the present invention, the waste processing component can automatically collect and process the graphene waste generated during the cutting process, avoiding the accumulation and secondary processing of the waste, saving manpower and time costs, and helping to keep the working environment clean.

[0019] 4. In the present invention, the setting of the limiting mechanism can stably clamp and position the graphene and its supporting substrate, ensuring that the graphene will not deviate or shake during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ; Figure 2 It is a partial three-dimensional structural cross-sectional view of the present invention; Figure 3 It is a schematic diagram of the local three-dimensional structure of the present invention Figure 1 ; Figure 4 It is a schematic diagram of the local three-dimensional structure of the present invention Figure 2 ; Figure 5 The three-dimensional structure of the present invention is shown in FIG. Figure 2 ; Figure 6 for Figure 3 The enlarged schematic diagram at A in the middle; Figure 7 for Figure 3 The enlarged schematic diagram of point B in the middle; Figure 8 for Figure 5 Enlarged schematic diagram at point C in the middle.

[0021] Legend: 1. Workbench; 2. Auxiliary integrated mechanism No. 1; 21. Substrate dispensing assembly; 211. Cylinder; 212. Sliding frame; 213. Pushing frame; 214. Rotating wheel; 22. Cutting and loading assembly; 221. Connecting rod No. 1; 222. Rack No. 1; 223. Gear ring; 224. Guide block; 225. Reciprocating screw rod; 226. Lifting platform; 23. Waste handling assembly; 231. Rotating shaft No. 1; 232. Circular gear No. 1; 233. Bevel gear No. 1; 234. Bevel gear No. 2; 235. Connecting shaft No. 1; 236. Pulley No. 1; 237. Transmission belt No. 1; 238. Pulley No. 2; 239. Rotating shaft No. 2; 2310. Rotating table; 3. Auxiliary integrated mechanism No. 2; 31. Substrate transfer assembly; 311. Driving motor; 312. No. 3 Rotating shaft; 313, active roller; 314, driven roller; 315, No. 2 connecting shaft; 32, unloading mechanism; 321, No. 3 pulley; 322, No. 2 driving belt; 323, No. 4 pulley; 324, No. 4 rotating shaft; 325, No. 2 circular gear; 326, No. 2 rack; 327, No. 2 connecting rod; 328, push plate; 4, limiting mechanism; 41, No. 1 reset spring; 42, wedge block; 5, clamping mechanism; 51, No. 1 fixed frame; 52, sliding shaft; 53, No. 2 reset spring; 54, roller assembly; 6, slide rail; 7, electric suction cup; 8, No. 2 fixed frame; 9, laser cutting assembly; 10, substrate storage rack; 11, No. 1 fixed block; 12, No. 3 fixed frame; 13, No. 2 fixed block; 14, waste collection box; 141, box door; 15, cutting table. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Embodiment 1: See also Figure 1-Figure 8The present application provides a cutting device for graphene chip production, comprising a workbench 1 and a laser cutting assembly 9, wherein the laser cutting assembly 9 is arranged above the workbench 1 through a No. 2 fixing frame 8, and a No. 1 auxiliary integrated mechanism 2 and a No. 2 auxiliary integrated mechanism 3 are installed on the workbench 1, wherein the No. 1 auxiliary integrated mechanism 2 comprises a substrate placing assembly 21 for placing a substrate on a substrate transfer assembly 31, a cutting loading assembly 22 for delivering a substrate with graphene to a cutting area, and a waste material processing assembly 23 for separating the substrate from waste after cutting; the No. 2 auxiliary integrated mechanism 3 comprises a substrate transfer assembly 31 for transferring a substrate with graphene to the cutting loading assembly 22, and a material unloading mechanism 32 for pushing graphene and substrate in a cutting area out of the cutting area; The substrate placement assembly 21 includes a cylinder 211, which is fixedly connected to the bottom end of the workbench 1 through a No. 1 fixed block 11. A sliding frame 212 is fixedly connected to the working end of the cylinder 211, and the sliding frame 212 is slidably connected to the workbench 1. The upper end of the sliding frame 212 is fixedly connected to a pushing frame 213 for pushing out the bottom layer of the substrate inside the No. 3 fixed frame 12. It should be noted that due to the relatively soft material of graphene, a supporting substrate is generally required to be placed under the graphene. A plurality of rotating wheels 214 are rotatably arranged on the upper end of the pushing frame 213. The purpose of the arrangement is to reduce the friction between the pushing frame 213 and the second to last layer of the substrate inside the No. 3 fixed frame 12.

[0024] Specifically, the cylinder 211 is started to drive the sliding frame 212 to slide along the slide groove on the workbench 1, and the sliding frame 212 drives the pushing frame 213 to move. The pushing frame 213 pushes the substrate at the bottom layer inside the substrate storage rack 10 to the top of the substrate transfer assembly 31, and then the graphene is grabbed above the substrate by an external robot. At this point, the substrate is automatically placed without the need for manual placement by staff. Because the cylinder 211 moves a certain distance each time, the landing position of the substrate is the same each time, which makes the position of the graphene grabbed by the robot and placed on the substrate more uniform each time.

[0025] The cutting and loading assembly 22 includes a No. 1 connecting rod 221 fixedly connected to the sliding frame 212, a No. 1 rack 222 fixedly connected to the No. 1 connecting rod 221, the No. 1 rack 222 is meshingly connected to a gear ring 223, a guide block 224 is fixedly connected inside the gear ring 223, and the guide block 224 is rotatably set with a No. 3 fixed frame 12 fixedly connected to the lower end of the workbench 1, a reciprocating screw 225 is arranged inside the guide block 224, and the reciprocating screw 225 is provided with two bidirectional threads used in conjunction with the guide block 224, the upper end of the reciprocating screw 225 is also fixedly connected to a lifting platform 226, and the lifting platform 226 is slidably set with the slide rail 6 fixedly connected to the workbench 1.

[0026] Specifically, while the pushing frame 213 pushes the substrate inside the substrate storage frame 10 out, the sliding frame 212 drives the No. 1 connecting rod 221 to move, and the No. 1 connecting rod 221 drives the gear ring 223 to rotate through the No. 1 rack 222, thereby causing the guide block 224 to rotate on the No. 3 fixed frame 12. The rotation of the guide block 224 causes the reciprocating screw rod 225 to drive the lifting platform 226 to move up and down a complete back and forth, and the lifting platform 226 transports the substrate containing graphene placed above the lifting platform 226 to the cutting area. At this point, there is no need for the staff to manually deliver the substrate containing graphene to the cutting area, thereby avoiding the problem of the laser of the laser cutting component 9 accidentally injuring the staff.

[0027] The waste processing assembly 23 includes a first rotating shaft 231 rotatably connected to the lower end of the workbench 1, a first circular gear 232 is fixedly connected to the first rotating shaft 231, and the first circular gear 232 is meshed with the first rack 222, a first bevel gear 233 is fixedly connected to the lower end of the first circular gear 232, the first bevel gear 233 is meshed with the second bevel gear 234, the second bevel gear 234 is fixedly connected to a first connecting shaft 235, and the first connecting shaft 235 is fixedly connected to the second fixed gear 234 at the lower end of the workbench 1. Block 13 is rotatably arranged, and one end of the No. 1 connecting shaft 235 away from the No. 2 bevel gear 234 is fixedly connected to the No. 1 pulley 236, and the No. 1 pulley 236 is connected to the No. 2 pulley 238 through the No. 1 transmission belt 237, and the No. 2 pulley 238 is fixedly connected to the No. 2 rotating shaft 239 rotatably arranged with the workbench 1, and the No. 2 rotating shaft 239 is fixedly connected to the rotating table 2310, and the rotating table 2310 is provided with an electric suction cup 7 for adsorbing the substrate, and the electric suction cup 7 is a prior art and is used.

[0028] In this embodiment, a waste collection box 14 is movably installed on the workbench 1 , and a box door 141 is provided on the waste collection box 14 .

[0029] Specifically, when the third rotating shaft 312 pushes out the substrate at the bottom layer inside the substrate storage rack 10, the cutting and loading assembly 22 can deliver the substrate with graphene on the lifting platform 226 into the cutting area, and in this process, the first circular gear 232 can be driven to rotate through the first rack 222, the first circular gear 232 drives the second bevel gear 234 to rotate through the first bevel gear 233, the second bevel gear 234 drives the first connecting shaft 235 to rotate, and the first connecting shaft 235 drives the second rotating shaft 239 to rotate through the transmission of the first pulley 236, the first transmission belt 237 and the second pulley 238. The second rotating shaft 239 drives the rotating table 2310 to rotate, and the rotating table 2310 drives the cut substrate to rotate through the electric suction cup 7. Prior to this, the graphene above the rotating table 2310, specifically the graphene and substrate that have been cut by the laser cutting component 9 and pushed to the top of the rotating table 2310 by the unloading mechanism 32, the rotation of the substrate can rotate the cut graphene waste into the interior of the waste collection box 14, and the substrate can be adsorbed by the electric suction cup 7 and will not fall, thereby completing the centralized processing of the cut graphene waste and being able to be automatically separated from the supporting substrate.

[0030] In this embodiment, a cutting table 15 is detachably mounted on the workbench 1, a second fixing frame 8 is fixedly connected to the cutting table 15, a laser cutting assembly 9 is arranged on the second fixing frame 8, and the laser cutting assembly 9 is prior art and is only used.

[0031] Embodiment 2: On the basis of the first embodiment, the substrate transfer assembly 31 includes a driving motor 311 fixedly connected to the workbench 1, the output end of the driving motor 311 is fixedly connected to the third rotating shaft 312, the third rotating shaft 312 is fixedly connected to the active roller 313, and the workbench 1 is rotatably connected to a plurality of No. 2 connecting shafts 315 arranged parallel to the No. 3 rotating shaft 312, and each No. 2 connecting shaft 315 is provided with a driven roller 314 arranged parallel to and aligned with the active roller 313.

[0032] Specifically, the driving motor 311 is started to drive the third rotating shaft 312 to rotate, and the third rotating shaft 312 drives the active roller 313 to rotate, so that the placed substrate assembly 21 is pushed to the top of the substrate transfer assembly 31, and after the external robot places the graphene on the substrate, the active roller 313 is rolled to transfer the substrate with graphene to the top of the lifting platform 226 in the cutting and loading assembly 22, so that the lifting platform 226 can send it to the cutting area.

[0033] The unloading mechanism 32 includes a No. 3 pulley 321 fixedly connected to the No. 3 rotating shaft 312, the No. 3 pulley 321 is connected to the No. 4 pulley 323 through the No. 2 transmission belt 322, the No. 4 pulley 323 is fixedly connected to the No. 4 rotating shaft 324 rotatably set with the No. 2 fixed frame 8, the No. 2 rotating shaft 324 is fixedly connected to the No. 2 circular gear 325, and the No. 2 circular gear 325 is meshingly connected to the No. 2 rack 326, the No. 2 rack 326 is fixedly connected to the No. 2 connecting rod 327, and the No. 2 connecting rod 327 is fixedly connected to the push plate 328 for pushing the graphene cut in the cutting area together with the substrate onto the rotating table 2310.

[0034] Specifically, while the substrate transfer component 31 transfers the substrate above it together with the graphene to the top of the cutting and loading component 22, the third rotating shaft 312 drives the fourth rotating shaft 324 to rotate through the third pulley 321, the second transmission belt 322 and the fourth pulley 323, and the fourth rotating shaft 324 drives the second circular gear 325 to rotate. The rotation of the second circular gear 325 drives the push plate 328 to move through the second rack 326 and the second connecting rod 327 and pushes the graphene cut by the laser cutting component 9 together with the substrate to the waste processing component 23 area. At this point, the substrate together with the graphene is moved to the cutting area through the waste processing component 23, and the push plate 328 in the unloading mechanism 32 can push the cut graphene together with the substrate out of the cutting area, thereby realizing automatic loading and unloading, without the need for staff to insert their hands into the cutting area, thereby protecting the safety of staff.

[0035] Embodiment three: On the basis of the first embodiment, a clamping mechanism 5 is installed on the second fixed frame 8, and the clamping mechanism 5 includes a No. 1 fixed frame 51 fixedly connected to the No. 2 fixed frame 8, and a sliding shaft 52 is slidably connected to the No. 1 fixed frame 51, and a roller assembly 54 is arranged at the lower end of the sliding shaft 52. It should be noted that the roller assembly 54 may include a wheel frame and a roller rotating on the wheel frame, and a No. 2 return spring 53 is sleeved on the outer side of the sliding shaft 52, and the No. 2 return spring 53 is arranged between the No. 1 fixed frame 51 and the roller assembly 54.

[0036] In this embodiment, the limiting mechanism 4 includes a No. 1 return spring 41 and a wedge block 42. A slide groove is provided on the cutting table 15. The interior of the slide groove is slidably connected with a wedge block 42 that matches it, and the lower surface of the wedge block 42 is arranged at an angle. The slide groove is also provided with a No. 1 return spring 41. One end of the No. 1 return spring 41 is fixedly connected to the wedge block 42, and the other end of the wedge block 42 is fixedly connected to the cutting table 15.

[0037] Specifically, when the cutting loading component 22 drives the graphene and the substrate to move below the laser cutting component 9, the upper surface of the substrate will first contact the inclined surface of the wedge block 42, thereby pushing the wedge block 42 to retract into the inside of the slide groove, and the No. 1 return spring 41 is also compressed. Until the substrate is completely moved to the top of the wedge block 42, the wedge block 42 is pushed under the action of the elastic force of the No. 1 return spring 41 to support the substrate with graphene on the upper end of the wedge block 42. It should be noted that the size of the substrate is larger than the size of the graphene chip to avoid the stone from moving upward. Graphene contacts the inclined surface of the wedge block 42, and when the substrate and the graphene chip move above the wedge block 42, the roller assembly 54 presses the edge of the graphene, and according to the overall height of the substrate and the graphene, the sliding shaft 52 moves upward, and the No. 2 return spring 53 is compressed, that is, a downward thrust is given to the substrate and graphene on the wedge block 42 to form a clamp, thereby ensuring the stability of the graphene during the cutting process, and when the unloading mechanism 32 pushes the substrate and graphene away from the cutting area, the roller assembly 54 can roll without affecting the operation of the unloading mechanism 32.

[0038] In summary, the graphene placed on the substrate and supported on the wedge block 42 is first cut by the laser cutting assembly 9, which is referred to as graphene No. 1 and substrate No. 1 for easier understanding. During this process, an external manipulator places another piece of graphene, referred to as graphene No. 2, on substrate No. 2 above the substrate transfer assembly 31. After the laser cutting assembly 9 cuts and forms graphene No. 1 above the wedge block 42, the substrate transfer assembly 31 transfers the substrate No. 2 above it together with graphene No. 2 to the lifting platform 226 in the cutting and loading assembly 22 by starting the drive motor 311, and the push plate 328 in the unloading mechanism 32 pushes the substrate No. 1 and graphene No. 1 supported on the wedge block 42 to the rotating table 2310 in the waste handling assembly 23. Then, the cylinder 211 in the substrate placement assembly 21 is started, and the push frame 213 is pushed. The new No. 3 substrate inside the substrate storage rack 10 is pushed to the top of the substrate transfer component 31, and the No. 3 graphene chip is placed again by an external manipulator, and the cutting and loading component 22 can be driven to push the No. 2 graphene and the No. 2 substrate above the lifting platform 226 to the cutting area, and clamped by the clamping mechanism 5, and drive the waste processing component 23 to rotate, and adsorb the bottom of the No. 1 substrate by the electric suction cup 7, that is, the rotating table 2310 rotates to pour the graphene waste on the No. 1 substrate during the first cutting process into the waste collection box 14. Before this, the graphene after cutting needs to be transferred by an external manipulator, and after cleaning the discarded graphene, the substrate is taken away. By loading and unloading graphene and centrally processing the graphene waste left on the substrate after cutting, the continuity is strong, which can be applied to large-scale graphene cutting operations and improve work efficiency.

[0039] The above embodiments are only used to illustrate the technical method of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A cutting device for producing graphene chips, comprising a workbench (1), characterized in that: Also includes A first auxiliary integrated mechanism (2) and a second auxiliary integrated mechanism (3), wherein the first auxiliary integrated mechanism (2) and the second auxiliary integrated mechanism (3) are both installed on the workbench (1); The first auxiliary integrated mechanism (2) comprises a substrate placing assembly (21) for placing a substrate onto a substrate transfer assembly (31), a cutting and loading assembly (22) for delivering a substrate with graphene to a cutting area, and a waste material processing assembly (23) for separating the substrate from waste materials after cutting. The second auxiliary integrated mechanism (3) comprises a substrate transfer component (31) for transferring a substrate with graphene to a cutting loading component (22) and a unloading mechanism (32) for pushing the graphene and substrate in a cutting area out of the cutting area.

2. A cutting device for graphene chip production according to claim 1, characterized in that: The substrate placing assembly (21) comprises a cylinder (211), the cylinder (211) being fixedly connected to the bottom end of the workbench (1) via a No. 1 fixed block (11), a sliding frame (212) being fixedly connected to the working end of the cylinder (211), a pushing frame (213) being fixedly connected to the upper end of the sliding frame (212) for pushing out the bottommost substrate inside the No. 3 fixed frame (12), and a plurality of rotating wheels (214) being rotatably arranged on the upper end of the pushing frame (213).

3. A cutting device for graphene chip production according to claim 2, characterized in that: The cutting and feeding assembly (22) comprises a No. 1 connecting rod (221) fixedly connected to the sliding frame (212), a No. 1 rack (222) fixedly connected to the No. 1 connecting rod (221), the No. 1 rack (222) meshingly connected to a gear ring (223), a guide block (224) fixedly connected inside the gear ring (223), a reciprocating screw rod (225) disposed inside the guide block (224), and a lifting platform (226) fixedly connected to the upper end of the reciprocating screw rod (225).

4. A cutting device for graphene chip production according to claim 3, characterized in that: The waste processing assembly (23) comprises a first rotating shaft (231) rotatably connected to the lower end of the workbench (1) and a first circular gear (232) fixedly arranged on the first rotating shaft (231), the first circular gear (232) meshingly connected to a first rack (222), a first bevel gear (233) being fixedly connected to the lower end of the first circular gear (232), the first bevel gear (233) being meshingly connected to a second bevel gear (234), a first connecting shaft (235) being fixedly connected to the second bevel gear (234), the first connecting shaft (235) being transmission-connected to a second rotating shaft (239) via a first pulley (236), a first transmission belt (237) and a second pulley (238), and the second rotating shaft (239) being fixedly connected to a rotating table (2310); The rotating platform (2310) is provided with an electric suction cup (7) for adsorbing the substrate.

5. A cutting device for graphene chip production according to claim 4, characterized in that: A waste collection box (14) is movably mounted on the workbench (1), and a box door (141) is provided on the waste collection box (14).

6. A cutting device for graphene chip production according to claim 1, characterized in that: The substrate transfer assembly (31) comprises a drive motor (311) fixedly connected to the workbench (1); the output end of the drive motor (311) is fixedly connected to a third rotating shaft (312); the third rotating shaft (312) is fixedly connected to a driving roller (313); a plurality of second connecting shafts (315) arranged parallel to the third rotating shaft (312) are rotatably connected to the workbench (1); each of the second connecting shafts (315) is provided with a driven roller (314) arranged parallel to and aligned with the driving roller (313).

7. A cutting device for graphene chip production according to claim 6, characterized in that: The unloading mechanism (32) comprises a No. 3 pulley (321) fixedly connected to a No. 3 rotating shaft (312); the No. 3 pulley (321) is connected to a No. 4 pulley (323) via a No. 2 transmission belt (322); the No. 4 pulley (323) is fixedly connected to a No. 4 rotating shaft (324); the No. 4 rotating shaft (324) is fixedly connected to a No. 2 circular gear (325); the No. 2 circular gear (325) is meshingly connected to a No. 2 rack (326); the No. 2 rack (326) is fixedly connected to a No. 2 connecting rod (327); the No. 2 connecting rod (327) is fixedly connected to a push plate (328) for pushing the graphene cut from the cutting area together with the substrate.

8. A cutting device for graphene chip production according to claim 1, characterized in that: A cutting table (15) is detachably mounted on the workbench (1), a second fixing frame (8) is fixedly connected to the cutting table (15), and a laser cutting assembly (9) is arranged on the second fixing frame (8).

9. A cutting device for graphene chip production according to claim 8, characterized in that: The second fixing frame (8) is provided with a clamping mechanism (5), the clamping mechanism (5) comprising a first fixing frame (51) fixedly connected to the second fixing frame (8), a sliding shaft (52) slidably connected to the first fixing frame (51), and a roller assembly (54) is provided at the lower end of the sliding shaft (52); A No. 2 return spring (53) is sleeved on the outer side of the sliding shaft (52), and the No. 2 return spring (53) is arranged between the No. 1 fixing frame (51) and the roller assembly (54).

10. A cutting device for graphene chip production according to claim 8, characterized in that: It also includes a limiting mechanism (4); The limiting mechanism (4) comprises a No. 1 return spring (41) and a wedge block (42); a slide groove is provided on the cutting table (15); a wedge block (42) matching with the slide groove is slidably connected inside the slide groove; the lower surface of the wedge block (42) is arranged in an inclined manner; the slide groove is further provided with a No. 1 return spring (41); one end of the No. 1 return spring (41) is fixedly connected to the wedge block (42); and the other end of the wedge block (42) is fixedly connected to the cutting table (15).

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