Automatic discharging mechanism for preventing frosting of chips

Abstract

The invention discloses an automatic discharging mechanism for preventing frosting of a chip, and relates to the field of low-temperature electrical performance testing of components, and the automatic discharging mechanism is characterized in that dry low-temperature nitrogen is introduced into a low-temperature box through a space capsule structure to keep a low-temperature environment not easy to frost, and a to-be-tested device is stored by rotating a disc mechanism; the control console controls the chip boxes to be taken on the rotating disc to rotate to one side of the hand hole and controls the material taking mechanism to reach the rotating discs at different heights to take materials, and the hand hole conveys the devices to the space capsule structure to achieve complete discharging. The technical effect of preventing the chip from frosting in the low-temperature electrical performance test process is achieved.

Description

Technical Field

[0001] The present application belongs to the technical field of realizing automatic unloading in a low temperature box, and in particular relates to an automatic unloading mechanism for preventing frosting of chips. Background Art

[0002] The low-temperature electrical performance test of components is an essential and important test content for the screening test and reliability test of aerospace components, and is generally required to be carried out after the components are aged. Electrical testing is carried out after aging to eliminate defective devices before further testing. This test does not need to include all the parameters specified for the components, but should include the most sensitive and effective parameters for eliminating electrically defective devices. As components for spacecraft, their quality and reliability are very important. Low-temperature testing is a test carried out in extreme environments. It can comprehensively evaluate the working performance of electronic components under cold conditions and verify whether they can work reliably in extreme environments.

[0003] For the current low-temperature test method, the loading and unloading used in the industry is a simple box composed of a stainless steel cover plate, which is generally divided into the following steps: the first step is to arrange the components neatly on the temperature chamber placement strip 1 according to the number, the second step is to cover another identical temperature chamber placement strip 2 on the placement strip filled with components to form a certain seal, the third step is to place the sealed temperature chamber placement strip group in the temperature chamber to maintain the temperature, the fourth step is to place the temperature chamber placement strip group to be tested on the side of the temperature chamber, and the fifth step is to take the temperature chamber placement strip 2 out of the temperature chamber and start to use tweezers to pick up the components in the temperature chamber placement strip 1 for testing. In the past low-temperature tests, the following problems often occur, affecting the test efficiency, such as improper manual gripping or retesting of test failures, which will cause confusion in component numbers and affect the one-to-one correspondence between component numbers and actual components. If the temperature chamber pickup port is always open during the test, the external normal temperature air flows into the temperature chamber through the pickup port, which will cause frost on many components at the pickup port. Use tweezers to pick up the low-temperature components in the temperature chamber and bring them to the normal temperature test bench. Frosted components will melt into water and cause the device test results to fail. Summary of the invention

[0004] The technical problem solved by the present application is: to overcome the deficiencies of the prior art and provide an automatic chip unloading mechanism for preventing frosting of the chip, so as to prevent frosting of the chip during the low-temperature electrical performance test.

[0005] The technical solutions provided by this application are as follows:

[0006] An automatic unloading mechanism for preventing frosting of chips comprises a temperature box, a shell, a rotating disc mechanism, a material taking mechanism and a capsule structure, wherein the rotating disc mechanism and the material taking mechanism are arranged in the temperature box, the shell is sleeved on the outside of the temperature box, the temperature box is provided with a hand hole, and the shell is provided with an opening at a position directly opposite to the hand hole, the capsule structure comprises a cylinder, a first gate and a second gate, one end of the cylinder is fixedly connected to the outer wall of the shell, and the cylinder is directly opposite to the opening; along the direction away from the shell, the first gate and the second gate are sequentially arranged on the cylinder, and the cylinder is provided with a nitrogen filling interface at a position between the two gates, the rotating disc mechanism is used to place a plurality of chip boxes containing chips to be tested, and the material taking mechanism is used to move the chip box from the rotating disc mechanism to one end directly opposite to the cylinder.

[0007] The rotating disc mechanism includes a rotating disc, an electric turntable, a support column and a limiting mechanism. The support column is vertically rotatable and connected in the incubator. The rotating disc is fixedly connected to the outside of the support column. The electric turntable is connected to one end of the support column and is used to drive the support column to rotate. A placement hole is opened on the rotating disc, and the chip box is placed in the placement hole. The limiting mechanism is connected to the lower surface of the rotating disc. When the chip box does not need to be taken out, the limiting mechanism is used to prevent the chip box from falling out of the placement hole. When the chip box needs to be taken out, the limiting mechanism is adjusted to not prevent the chip box from falling out of the placement hole. At this time, the chip box falls onto the material taking mechanism through the placement hole.

[0008] The rotating disk mechanism also includes a sensor, which is fixed in the temperature box. The sensor is located on one side of the electric turntable and below the rotating disk. The sensor is used to detect the position of the chip box.

[0009] The limiting mechanism includes a suction cup electromagnet and two limiting blocks, each limiting block is rotatably connected to the lower surface of the rotating disc through a rotating shaft, one end of the limiting block close to the outer circumferential surface of the rotating disc is connected to a fixed plate, and the fixed plate is connected to the side of the limiting block opposite to the other limiting block, the suction cup electromagnet is fixedly connected to the lower surface of the rotating disc, the suction cup electromagnet is located between the two limiting blocks and on the side of the rotating shaft away from the fixed plate; when the suction cup electromagnet absorbs the two limiting blocks, the chip box falls from the placement hole to the material picking mechanism.

[0010] The limiting mechanism also includes a spring, which is connected between the two limiting blocks and is located on a side of the rotating shaft away from the fixing plate.

[0011] When the suction cup type electromagnet pushes the two limit blocks apart, the minimum distance between the two fixing plates is smaller than the width of the chip box.

[0012] The material picking mechanism includes a placement plate position fixing frame, a spring pin, a rotating electromagnet, a placement plate and a rotating electromagnet fixing block. The placement plate position fixing frame is vertically fixedly connected in the temperature box, the placement plate position fixing frame is vertically slidably connected with a slider, the placement plate position fixing frame is provided with a plurality of positioning holes along the vertical direction, the spring pin is arranged in the slider and is slidingly connected with the slider along its own axial direction, the rotating electromagnet is fixedly connected to the slider, the rotating electromagnet fixing block is connected to the upper surface of the rotating electromagnet, the placement plate is rotationally connected to the upper surface of the rotating electromagnet fixing block, and the rotating electromagnet fixing block is used to drive the placement plate to rotate.

[0013] A chip unloading method of an automatic unloading mechanism for preventing frosting of chips, comprising:

[0014] The material-taking mechanism is used to move the chip box from the rotating disc mechanism to one end facing the cylinder, then open the space between the first gate and the second gate, manually move the chip box on the material-taking mechanism between the first gate and the second gate in the cylinder, close the first gate and the second gate, and fill nitrogen into the space between the first gate and the second gate in the cylinder through the nitrogen filling interface. When chip testing is required, open the second gate and take out the chip box from the cylinder.

[0015] The material taking mechanism is used to move the chip box from the rotating disc mechanism to one end facing the cylinder, comprising: after receiving the material taking signal from the control console, the slider of the material taking mechanism is controlled to move vertically to the height of the target chip box, and the rotating disc is controlled to rotate until the placement plate is located directly below the rotating disc where the target chip box is located;

[0016] The suction cup electromagnet sucks the two limit blocks tightly, and the target chip box falls from the placement hole and moves to the placement plate. Then the electromagnet fixing block is rotated to drive the placement plate to rotate until the placement plate is facing the hand hole.

[0017] In summary, this application at least includes the following beneficial technical effects:

[0018] (1) Dry low-temperature nitrogen is introduced into the cryogenic box to effectively prevent frost on the chip surface;

[0019] (2) Each chip is placed separately and effectively sealed;

[0020] (3) The mechanical structure is used to realize the automatic unloading function, effectively improving the testing efficiency;

[0021] (4) It can develop low-temperature testing applications for a variety of packaged devices and has wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is the overall organization diagram;

[0023] Figure 2It is the composition diagram of the rotating disc mechanism;

[0024] Figure 3 This is the composition diagram of the material taking mechanism;

[0025] Figure 4 This is a diagram of the structure of the space capsule.

[0026] Description of the accompanying figures: 1. Temperature box; 2. Shell; 3. Rotating disc mechanism; 4. Material taking mechanism; 5. Space capsule structure; 6. Control console;

[0027] 7. Rotating disc; 8. Chip box; 9. Electric turntable; 10. Sensor; 11. Support column; 12. Limit mechanism; 13. Limit block; 14. Suction cup electromagnet; 15. Spring; 16. Rotating shaft;

[0028] 17. Hand hole; 18. Placement plate position fixing frame; 20. Spring pin; 23. Rotating electromagnet; 24. Placement plate; 25. Rotating electromagnet fixing block;

[0029] 26. Nitrogen filling interface; 27. Second gate; 28. First gate; 29. ​​Cylinder. DETAILED DESCRIPTION

[0030] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments disclosed in the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] The invention concept of this patent is: the current cryogenic boxes are all at normal pressure, so the water-containing air in the laboratory will exchange with the dry cold air in the cryogenic box, resulting in more frost on the chip surface. Therefore, we adopt a creative process idea to introduce dry low-temperature nitrogen into the cryogenic box to maintain a slight positive pressure in the cryogenic box, so that the water-containing air in the laboratory rarely enters the cryogenic box, which can effectively prevent frost on the chip surface.

[0032] The present application embodiment discloses an automatic chip unloading mechanism to prevent frosting. Figure 1 As shown, it includes a temperature box 1, a shell 2, a rotating disk mechanism 3, a material taking mechanism 4, a space capsule structure 5 and a control console 6. The rotating disk mechanism 3 and the material taking mechanism 4 are arranged in the temperature box 1, and the shell 2 is sleeved on the outside of the temperature box 1. The temperature box 1 is provided with a hand hole 17, and the shell 2 is provided with an opening at the position opposite to the hand hole. The space capsule structure is as shown in FIG. Figure 4 The figure shows a cylinder 29, a first gate 28 and a second gate 27. One end of the cylinder 29 is fixedly connected to the outer wall of the shell 2, and the cylinder 29 is opposite to the opening. Along the direction away from the shell 2, the first gate 28 and the second gate 28 are sequentially arranged on the cylinder 29, and a nitrogen filling interface 26 is arranged on the cylinder 29 between the two gates.

[0033] The rotating disc mechanism 3 is used to place multiple chip boxes 8 containing chips to be tested. The material picking mechanism is used to move the chip box 8 from the rotating disc mechanism 3 to one end facing the cylinder 29, open the space between the first gate 28 and the second gate 27, manually move the chip box 8 on the material picking mechanism between the first gate 28 and the second gate 27 in the cylinder 29, close the first gate 28 and the second gate 27, and fill nitrogen into the space between the first gate 28 and the second gate 27 in the cylinder 29 through the nitrogen filling interface 26. When chip testing is required, open the second gate 27 and take out the chip box from the cylinder 29.

[0034] Rotating disc mechanism 3 Figure 2 As shown, it includes a rotating disc 7, an electric turntable 9, a sensor 10, a support column 11 and a limit mechanism 12. The support column 11 is vertically rotated and connected to the temperature box 1. The rotating disc 7 is fixedly connected to the outside of the support column 11. The electric turntable 9 is connected to one end of the support column 11 and is used to drive the support column 11 to rotate. The rotation of the support column 11 drives the rotating disc 7 to rotate. A placement hole is opened on the rotating disc 7, and the chip box 8 is placed in the placement hole. The limit mechanism 12 is on the lower surface of the rotating disc 7. One end of the sensor 10 is connected to the temperature box 1. The sensor 10 is located on one side of the electric turntable 9 and below the rotating disc 7. The sensor 10 is used to detect the position and quantity of the chip box 8 and obtain a detection signal. The sensor 10 sends the detection signal to the control console 6, and the control console 6 controls the rotating disc mechanism 3 to rotate or stop rotating, controls whether the material taking mechanism 4 takes materials, and controls the limit mechanism 12 to open or close.

[0035] The limiting mechanism 12 includes a limiting block 13, a suction cup electromagnet 14, a spring 15 and a rotating shaft 16. The limiting block 13 is fixedly connected to a fixed plate at one end facing the rotating disk 7. The fixed plate is located below the rotating disk 7, and the fixed plate is connected to one end of the limiting block 13 close to the outer circumferential surface of the rotating disk 7. The rotating shaft 16 is fixed on the limiting block 13. The limiting block 13 and the rotating disk 7 rotate around the axis of the rotating shaft 16. A spring 15 is connected between the two limiting blocks 13, and the spring 15 is located on the side of the rotating shaft 16 away from the fixed plate. The suction cup electromagnet 14 is fixedly connected to the lower surface of the rotating disk 7, and the suction cup electromagnet 14 is located between the two limiting blocks 13 and on the side of the rotating shaft 16 away from the fixed plate. When the suction cup electromagnet 14 pushes the two limit blocks 13 apart, the pushing force of the suction cup electromagnet 14 on the limit blocks 13 is balanced by the pulling force of the spring 15 on the limit blocks 13, and the two limit blocks 13 are not in contact with the suction cup electromagnet 14, and the minimum distance between the two fixed plates is smaller than the width of the chip box 8. When the chip box 8 is placed in the placement hole, its bottom is supported by the fixed plate.

[0036] The material-removing mechanism 4 is used to unload the chip box 8 on the rotating disc. When the suction cup electromagnet 14 is in working state, the end of the limit stopper 13 is adsorbed and close to the suction cup electromagnet 14, the spring 15 is compressed, and the rotating shaft 16 causes the limit stopper 13 to open outward. The chip box 8 is not supported by the limit stopper 13 and falls from the placement hole to the placement plate 24.

[0037] Retrieving mechanism 4 Figure 3 As shown, it includes a placement plate position fixing frame 18, a spring pin 20, a rotating electromagnet 23, a placement plate 24 and a rotating electromagnet fixing block 25. The placement plate position fixing frame 18 is vertically fixedly connected in the temperature box 1, and the placement plate position fixing frame 18 is vertically slidably connected with a slider. The placement plate position fixing frame 18 is provided with a plurality of positioning holes along the vertical direction. The spring pin 20 is arranged in the slider and is slidably connected with the slider along its own axial direction. The rotating electromagnet 23 is fixedly connected to the slider, and the rotating electromagnet fixing block 25 is connected to the upper surface of the rotating electromagnet 23. The placement plate 24 is rotatably connected to the upper surface of the rotating electromagnet fixing block 25, and the rotating electromagnet fixing block 25 is used to drive the placement plate 24 to rotate.

[0038] When the material taking mechanism 4 receives the sampling signal from the control console 6, the slider is first controlled to move vertically to the height of the target chip box 8, and then the spring pin 20 is controlled to extend and snap into the corresponding positioning hole, and the rotating disc 7 is controlled to rotate until the placement plate 24 is located directly below the rotating disc 7 where the target chip box 8 is located, and then the suction cup electromagnet 14 sucks the two limit blocks 13 tightly, and the target chip box 8 falls from the placement hole to the placement plate 24. After that, the electromagnet fixing block 25 is rotated to drive the placement plate 24 to rotate until the placement plate 24 is directly opposite to the hand hole 17, and then the first gate 28 and the second gate 27 are opened, and the chip box 8 on the material taking mechanism is manually moved between the first gate 28 and the second gate 27 in the barrel 29, and the first gate 28 and the second gate 27 are closed, and nitrogen is filled into the space between the first gate 28 and the second gate 27 in the barrel 29 through the nitrogen filling interface 26. When chip detection is required, the second gate 27 is opened to take out the chip box from the barrel 29.

[0039] The use of dry low-temperature nitrogen gas in the cryogenic box can effectively prevent frost on the chip surface. The automatic unloading function is realized through a series of mechanical structures. Each chip is placed separately in a small metal box (hereinafter referred to as the chip box). During the unloading process, the air that the chip can contact is very small. Even if frost forms, it will only form a small amount of frost on the outer wall of the chip box. The chip will only be taken out of the chip box when it needs to be tested. At this time, the chip is in contact with the outside air for a short time, and the test time is short. The test can be completed before the chip surface has time to frost, thereby ensuring that the chip test results will not be affected.

[0040] In the present invention, a process of filling with dry nitrogen to prevent frosting is used, and a "space capsule" type structure is used to reduce frosting on the chip surface during chip unloading. A new direction for using dry nitrogen is formed. In addition, the present invention also realizes the function of high-density chip arrangement in a small space, and at the same time, the spring pin is matched with the electromagnet to realize the unloading function of chips at different height positions.

[0041] The chip box method adopted in the present invention can effectively solve the problem of frosting on the chip surface during the test of the DIP packaged chip after being treated in an extremely low temperature environment, and effectively ensure the accuracy of the chip test results. The material unloading structure adopted in the present invention can efficiently realize the automatic unloading function, which greatly reduces manual participation.

[0042] The innovations of this patent are: using a process of filling with dry nitrogen to prevent frosting; adopting a method of placing individual chips in a chip box to solve the problem of frosting on the chip surface during DIP packaged chip testing; the adopted unloading structure can efficiently realize the automatic unloading function; reducing manual participation and improving test efficiency; designing chip box grooves according to device characteristics to improve clamping efficiency; the chip box design can be developed into a variety of packaged device chip loading, with wide applicability.

[0043] The use of dry low-temperature nitrogen gas in the cryogenic box can effectively prevent frost on the chip surface. The automatic unloading function is realized through a series of mechanical structures. Each chip is placed separately in a small metal box (hereinafter referred to as the chip box). During the unloading process, the air that the chip can contact is very small. Even if frost forms, it will only form a small amount of frost on the outer wall of the chip box. The chip will only be taken out of the chip box when it needs to be tested. At this time, the chip is in contact with the outside air for a short time, and the test time is short. The test can be completed before the chip surface has time to frost, thereby ensuring that the chip test results will not be affected.

[0044] In the present invention, a process of filling with dry nitrogen to prevent frosting is used, and a "space capsule" type structure is used to reduce frosting on the chip surface during chip unloading. A new direction for using dry nitrogen is formed. In addition, the present invention also realizes the function of high-density chip arrangement in a small space, and at the same time, the spring pin is matched with the electromagnet to realize the unloading function of chips at different height positions.

[0045] The chip box method adopted in the present invention can effectively solve the problem of frosting on the chip surface during the test of the DIP packaged chip after being treated in an extremely low temperature environment, and effectively ensure the accuracy of the chip test results. The material unloading structure adopted in the present invention can efficiently realize the automatic unloading function, which greatly reduces manual participation.

[0046] The innovations of this patent are: using a process of filling with dry nitrogen to prevent frosting; adopting a method of placing individual chips in a chip box to solve the problem of frosting on the chip surface during DIP packaged chip testing; the adopted unloading structure can efficiently realize the automatic unloading function; reducing manual participation and improving test efficiency; designing chip box grooves according to device characteristics to improve clamping efficiency; the chip box design can be developed into a variety of packaged device chip loading, with wide applicability.

[0047] The contents not described in detail in this application specification belong to the common knowledge of those skilled in the art.

[0048] The present application is described in detail above in conjunction with specific implementation methods and exemplary examples, but these descriptions cannot be understood as limiting the present application. Those skilled in the art understand that, without departing from the spirit and scope of the present application, a variety of equivalent replacements, modifications or improvements can be made to the technical solution of the present application and its implementation methods, all of which fall within the scope of the present application. The scope of protection of the present application shall be subject to the attached claims.

Claims

1. An automatic unloading mechanism for preventing frosting of chips, characterized in that: The invention comprises a temperature box (1), a shell (2), a rotating disk mechanism (3), a material taking mechanism (4) and a capsule structure (5), wherein the rotating disk mechanism (3) and the material taking mechanism (4) are arranged in the temperature box (1), the shell (2) is sleeved on the outside of the temperature box (1), the temperature box (1) is provided with a hand hole (17), the shell (2) is provided with an opening at a position directly opposite to the hand hole, the capsule structure (5) comprises a cylinder (29), a first gate (28) and a second gate (27), one end of the cylinder (29) is fixed The cylinder (29) is fixedly connected to the outer wall of the shell (2), and the cylinder (29) is opposite to the opening; along the direction away from the shell (2), the first gate (28) and the second gate (27) are sequentially arranged on the cylinder (29); the cylinder (29) is provided with a nitrogen filling interface (26) at a position between the two gates; the rotating disk mechanism (3) is used to place a plurality of chip boxes (8) containing chips to be tested; and the material taking mechanism is used to move the chip box (8) from the rotating disk mechanism (3) to one end opposite to the cylinder (29).

2. The automatic chip unloading mechanism for preventing frosting according to claim 1, characterized in that: The rotating disk mechanism (3) comprises a rotating disk (7), an electric turntable (9), a support column (11) and a limiting mechanism (12); the support column (11) is vertically rotatably connected to the inside of the temperature box (1); the rotating disk (7) is fixedly connected to the outside of the support column (11); the electric turntable (9) is connected to one end of the support column (11) and is used to drive the support column (11) to rotate; a placement hole is provided on the rotating disk (7); the chip box (8) is placed in the placement hole; the limiting mechanism (12) is connected to the lower surface of the rotating disk (7); when the chip box (8) does not need to be taken out, the limiting mechanism (12) is used to prevent the chip box (8) from falling out of the placement hole; when the chip box (8) needs to be taken out, the limiting mechanism (12) is adjusted to not prevent the chip box (8) from falling out of the placement hole, and at this time the chip box (8) falls onto the material taking mechanism (4) through the placement hole.

3. The automatic chip unloading mechanism for preventing frosting according to claim 2, characterized in that: The rotating disk mechanism (3) further comprises a sensor (10), the sensor (10) being fixed in the temperature box (1), the sensor (10) being located on one side of the electric turntable (9) and below the rotating disk (7), and the sensor (10) being used to detect the position of the chip box (8).

4. The automatic chip unloading mechanism for preventing frosting according to claim 2, characterized in that: The limiting mechanism (12) comprises a suction cup electromagnet (14) and two limiting blocks (13), each limiting block (13) is rotatably connected to the lower surface of the rotating disc (7) via a rotating shaft (16), one end of the limiting block (13) close to the outer circumferential surface of the rotating disc (7) is connected to a fixed plate, and the fixed plate is connected to the side of the limiting block (13) opposite to the other limiting block, the suction cup electromagnet (14) is fixedly connected to the lower surface of the rotating disc (7), the suction cup electromagnet (14) is located between the two limiting blocks (13), and is located on the side of the rotating shaft (16) away from the fixed plate; when the suction cup electromagnet (14) adsorbs the two limiting blocks (13), the chip box (8) falls from the placement hole to the material taking mechanism (4).

5. The automatic chip unloading mechanism for preventing frosting according to claim 4, characterized in that: The limiting mechanism (12) further comprises a spring (15), wherein the spring (15) is connected between the two limiting blocks (13), and the spring (15) is located on a side of the rotating shaft (16) away from the fixed plate.

6. The automatic chip unloading mechanism for preventing frosting according to claim 4, characterized in that: When the suction cup type electromagnet (14) pushes the two limit blocks (13) apart, the minimum distance between the two fixing plates is smaller than the width of the chip box (8).

7. The automatic chip unloading mechanism for preventing frosting according to claim 1, characterized in that: The material taking mechanism (4) comprises a placement plate position fixing frame (18), a spring pin (20), a rotating electromagnet (23), a placement plate (24) and a rotating electromagnet fixing block (25); the placement plate position fixing frame (18) is vertically fixedly connected in the temperature box (1); the placement plate position fixing frame (18) is vertically slidably connected to a slider; the placement plate position fixing frame (18) is provided with a plurality of positioning holes along the vertical direction; the spring pin (20) is arranged in the slider and is slidably connected to the slider along its own axial direction; the rotating electromagnet (23) is fixedly connected to the slider; the rotating electromagnet fixing block (25) is connected to the upper surface of the rotating electromagnet (23); the placement plate (24) is rotationally connected to the upper surface of the rotating electromagnet fixing block (25); and the rotating electromagnet fixing block (25) is used to drive the placement plate (24) to rotate.

8. A chip unloading method of an automatic unloading mechanism for preventing frosting of chips according to any one of claims 1 to 7, characterized in that: include: The material taking mechanism is used to move the chip box (8) from the rotating disk mechanism (3) to one end facing the cylinder (29), then open the space between the first gate (28) and the second gate (27), manually move the chip box (8) on the material taking mechanism to between the first gate (28) and the second gate (27) in the cylinder (29), close the first gate (28) and the second gate (27), fill nitrogen into the space between the first gate (28) and the second gate (27) in the cylinder (29) through the nitrogen filling interface (26), and when chip testing is required, open the second gate (27) to take the chip box out of the cylinder (29).

9. The blanking method according to claim 8, characterized in that: The material taking mechanism is used to move the chip box (8) from the rotating disc mechanism (3) to one end facing the cylinder (29), and comprises: After receiving the material taking signal from the control console, the slider of the material taking mechanism is controlled to move vertically to the height of the target chip box (8), and the rotating disk (7) is controlled to rotate until the placement plate (24) is located directly below the rotating disk (7) where the target chip box (8) is located; The suction cup type electromagnet (14) sucks the two limit blocks (13) tightly, and the target chip box (8) falls from the placement hole and moves to the placement plate (24), and then the rotating electromagnet fixing block (25) drives the placement plate (24) to rotate until the placement plate (24) is directly opposite to the hand hole (17).

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