Multi-component binder suitable for decorative integrated plate construction under low-temperature operation condition

Abstract

The invention discloses a multi-component adhesive suitable for construction of a decorative integrated board under a low-temperature operation condition. The multi-component adhesive comprises the following raw materials in percentage by weight: 18-22% of a modified ethylene-vinyl acetate copolymer, 10-15% of polyurethane, 18-22% of epoxy resin, 10-15% of acrylate, 8-10% of polyvinyl acetal, 8-10% of an inorganic adhesive and 8-10% of modified silicone. By combining the characteristics of different materials, the adhesive can still keep good bonding strength and toughness in a low-temperature environment, embrittlement or failure multifunctionality caused by temperature reduction is avoided, different components can endow the adhesive with multiple functions, such as water resistance, weather resistance and ultraviolet resistance, and the adhesive has excellent low-temperature performance. Therefore, the method adapts to various application scenes; due to the addition of polyurethane and modified silicone, the good flexibility can be provided, so that the adhesive can adapt to expansion and shrinkage of a material when the temperature changes, and the cracking risk is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to a multi-component adhesive suitable for the construction of decorative integrated panels under low-temperature working conditions. Background Art

[0002] Under low temperature conditions, there are several commonly used adhesive types on the market that are suitable for the construction of decorative integrated panels: Low-temperature construction adhesives: specially designed for construction in low-temperature environments. These adhesives have good low-temperature adhesion and curing properties, but in low-temperature environments, there are still problems such as viscosity thickening, crystallization, slow curing, deviation in bonding effect, and colloid thickening; Improved emulsion adhesive: It can maintain good bonding performance even under low temperature conditions. Its characteristics include low temperature antifreeze, fast curing, etc. However, in an environment with large humidity and temperature changes, the stability and performance of the emulsion may be affected, so it is not conducive to the construction of decorative integrated panels; Epoxy resin adhesive: can be cured at a lower temperature and provide reliable bonding performance, but there are problems such as incomplete curing, too long curing time, and bubbles after curing during use; Polyurethane adhesive: Polyurethane has good low-temperature performance and can provide reliable bonding in cold environments, but the adhesive has a slow drying and curing speed, poor wetting properties, poor initial adhesion, and poor water resistance.

[0003] Therefore, although the above conventional adhesives can be used in the construction of decorative integrated panels under low temperature conditions, they all have the problems of slow curing speed and poor curing effect, so there is room for improvement. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions, so as to solve the problems of slow curing speed and poor curing effect of the existing adhesives proposed in the above background technology under low temperature working conditions.

[0005] To achieve the above object, the present invention provides the following technical solution: a multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions, comprising the following raw materials and weight ratios: 18-22% modified ethylene-vinyl acetate copolymer, 10-15% polyurethane, 18-22% epoxy resin, 10-15% acrylate, 8-10% polyvinyl acetal, 8-10% inorganic binder, 8-10% modified silicone.

[0006] As a preferred technical solution in the present invention, the multi-component adhesive is composed of the following raw materials and weight ratio: 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic adhesive, and 10% modified silicone.

[0007] As a preferred technical solution of the present invention, the preparation steps of the multi-component adhesive are as follows: Step 1: Prepare 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic binder, and 10% modified silicone.

[0008] Step 2: Mix the materials in step 1 into liquid; Step 3: Emulsification: Use emulsification equipment to emulsify the mixture to improve the stability and uniformity of the binder.

[0009] Step 4: Heating: Heat the mixture to improve fluidity and mixing; Step 5: Degassing: remove bubbles through vacuum degassing or standing to improve the performance of the adhesive.

[0010] Step 6: Cooling: Cool the mixture to room temperature for subsequent packaging and use.

[0011] As a preferred technical solution of the present invention, in step 2, the mixing step is as follows: S1. Dry mixing: dry mixing solid materials, namely inorganic binder and polyvinyl acetal in a mixer; S2. Dissolving: The components that need to be dissolved, i.e., epoxy resin and acrylate, are dissolved in a solvent to ensure that they are completely dissolved; S3. Liquid mixing: Mix the dissolved liquid material with the dry-mixed solid material, and use a high-speed agitator to fully mix to ensure that all ingredients are evenly dispersed.

[0012] As a preferred technical solution in the present invention, the solvent in S2 includes ethyl acetate, ethyl butyrate, toluene and xylene.

[0013] As a preferred technical solution of the present invention, the modified ethylene-vinyl acetate copolymer comprises the following components in specific weight: 40 to 70 parts of ethylene-vinyl acetate copolymer, 10 to 30 parts of phthalates, 5 to 15 parts of polyetheretherketone, 1 to 5 parts of nanoclay, 1 to 3 parts of isocyanate, and 2 to 5 parts of grafted polyacrylate.

[0014] As a preferred technical solution in the present invention, the heating temperature in step 4 is 80-100°C.

[0015] As a preferred technical solution of the present invention, the modified silicone includes the following percentage components: 60-80% silicone, 0.5-2% butyl hydroxytoluene, 1-5% silane crosslinker, 5-15% phthalate plasticizer, 1-3% carboxyl.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. Excellent low-temperature performance: By combining the characteristics of different materials, it can ensure that the adhesive can still maintain good bonding strength and toughness in low-temperature environments, avoiding embrittlement or failure caused by temperature drop; 2. Versatility: Different ingredients can give the adhesive multiple functions, such as water resistance, weather resistance, UV resistance, etc., so as to adapt to a variety of application scenarios; 3. Good flexibility and elasticity: The addition of polyurethane and modified silicone can provide good flexibility, allowing the adhesive to adapt to the expansion and contraction of the material when the temperature changes, reducing the risk of cracking; 4. High bond strength: The high strength characteristics of epoxy resin and acrylate can ensure that the adhesive can maintain good bonding effect under load or impact, which is suitable for load-bearing structures or high-demand applications; 5. Fast curing: Acrylate and polyurethane can provide faster curing time, which is convenient for construction and improves construction efficiency; 6. Strong adaptability: The addition of inorganic binder can improve the properties of high temperature resistance and chemical corrosion resistance, so that the binder can adapt to a wider range of application environments; In summary, the design of the present invention can avoid the performance degradation of some traditional adhesives due to low temperature under low temperature working conditions, ensuring that reliable bonding and fixing effects can still be provided in cold environments. DETAILED DESCRIPTION

[0017] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example 1 The present invention provides a technical solution: a multi-component adhesive suitable for the construction of decorative integrated panels under low-temperature working conditions, comprising the following raw materials and weight ratios: 22% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 22% epoxy resin, 15% acrylate, 8% polyvinyl acetal, 10% inorganic binder, 10% modified silicone.

[0019] In this embodiment, the multi-component adhesive is composed of the following raw materials and weight ratios: 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic adhesive, and 10% modified silicone.

[0020] In this embodiment, the preparation steps of the multi-component adhesive are as follows: Step 1: Prepare 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic binder, and 10% modified silicone.

[0021] Step 2: Mix the materials in step 1 into liquid; Step 3: Emulsification: Use emulsification equipment to emulsify the mixture to improve the stability and uniformity of the binder.

[0022] Step 4: Heating: Heat the mixture to improve fluidity and mixing; Step 5: Degassing: remove bubbles through vacuum degassing or standing to improve the performance of the adhesive.

[0023] Step 6: Cooling: Cool the mixture to room temperature for subsequent packaging and use.

[0024] In this embodiment, in step 2, the mixing steps are as follows: S1. Dry mixing: dry mixing solid materials, namely inorganic binder and polyvinyl acetal in a mixer; S2. Dissolving: The components that need to be dissolved, i.e., epoxy resin and acrylate, are dissolved in a solvent to ensure that they are completely dissolved; S3. Liquid mixing: Mix the dissolved liquid material with the dry-mixed solid material, and use a high-speed agitator to fully mix to ensure that all ingredients are evenly dispersed.

[0025] In this embodiment, the solvent in S2 includes ethyl acetate, ethyl butyrate, toluene, and xylene.

[0026] In this embodiment, the modified ethylene-vinyl acetate copolymer includes the following components in weight ratio: 40 parts of ethylene-vinyl acetate copolymer, 10 parts of phthalates, 5 parts of polyetheretherketone, 1 part of nanoclay, 1 part of isocyanate, and 2 parts of grafted polyacrylate.

[0027] In this embodiment, the heating temperature in step 4 is 80°C.

[0028] In this embodiment, the modified silicone includes the following percentage components: 60% silicone, 2% butyl hydroxytoluene, 5% silane crosslinking agent, 15% phthalate plasticizer, and 3% carboxyl.

[0029] Example 2 The difference from Example 1 is that the present invention provides a technical solution: a multi-component adhesive suitable for the construction of decorative integrated panels under low-temperature working conditions, including the following raw materials and weight ratios: 22% modified ethylene-vinyl acetate copolymer, 11% polyurethane, 22% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic adhesive, and 10% modified silicone.

[0030] In this embodiment, the modified ethylene-vinyl acetate copolymer includes the following components in weight ratio: 70 parts of ethylene-vinyl acetate copolymer, 30 parts of phthalates, 15 parts of polyetheretherketone, 5 parts of nanoclay, 3 parts of isocyanate, and 5 parts of grafted polyacrylate.

[0031] In this embodiment, the heating temperature in step 4 is 100°C.

[0032] In this embodiment, the modified silicone includes the following percentage components: 70% silicone, 2% butyl hydroxytoluene, 5% silane crosslinking agent, 15% phthalate plasticizer, and 3% carboxyl.

[0033] Example 3 The difference from the above embodiment is that: the present invention provides a technical solution: a multi-component adhesive suitable for the construction of decorative integrated panels under low-temperature working conditions, including the following raw materials and weight ratios: 21% modified ethylene-vinyl acetate copolymer, 14% polyurethane, 21% epoxy resin, 14% acrylate, 10% polyvinyl acetal, 10% inorganic adhesive, and 10% modified silicone.

[0034] In this embodiment, the modified ethylene-vinyl acetate copolymer includes the following components in weight ratio: 60 parts of ethylene-vinyl acetate copolymer, 20 parts of phthalates, 10 parts of polyetheretherketone, 3 parts of nanoclay, 2 parts of isocyanate, and 3 parts of grafted polyacrylate.

[0035] In this embodiment, the heating temperature in step 4 is 90°C.

[0036] In this embodiment, the modified silicone includes the following percentage components: 70% silicone, 1% butyl hydroxytoluene, 3% silane crosslinking agent, 10% phthalate plasticizer, and 2% carboxyl.

[0037] Although embodiments of the present invention have been shown and described (see the above detailed description for details), it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions, characterized by: Including the following raw materials and weight ratio: 18-22% modified ethylene-vinyl acetate copolymer, 10-15% polyurethane, 18-22% epoxy resin, 10-15% acrylate, 8-10% polyvinyl acetal, 8-10% inorganic binder, 8-10% modified silicone.

2. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 1, characterized in that: The multi-component adhesive is composed of the following raw materials and weight ratios: 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic adhesive, and 10% modified silicone.

3. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 2, characterized in that: The preparation steps of the multi-component adhesive are as follows: Step 1: Prepare 20% modified ethylene-vinyl acetate copolymer, 15% polyurethane, 20% epoxy resin, 15% acrylate, 10% polyvinyl acetal, 10% inorganic binder, and 10% modified silicone; Step 2: Mix the materials in step 1 into liquid; Step 3: Emulsification: Use emulsification equipment to emulsify the mixture to improve the stability and uniformity of the binder; Step 4: Heating: Heat the mixture to improve fluidity and mixing; Step 5: Degassing: remove bubbles by vacuum degassing or standing to improve the performance of the adhesive; Step 6: Cooling: Cool the mixture to room temperature for subsequent packaging and use.

4. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 3, characterized in that: In the step 2, the mixing steps are as follows: S1. Dry mixing: dry mixing solid materials, namely inorganic binder and polyvinyl acetal in a mixer; S2. Dissolving: The components that need to be dissolved, i.e., epoxy resin and acrylate, are dissolved in a solvent to ensure that they are completely dissolved; S3. Liquid mixing: Mix the dissolved liquid material with the dry-mixed solid material, and use a high-speed agitator to fully mix to ensure that all ingredients are evenly dispersed.

5. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 4, characterized in that: The solvent in S2 includes ethyl acetate, ethyl butyrate, toluene and xylene.

6. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 1, characterized in that: The modified ethylene-vinyl acetate copolymer comprises the following components in specific weight: 40 to 70 parts of ethylene-vinyl acetate copolymer, 10 to 30 parts of phthalates, 5 to 15 parts of polyetheretherketone, 1 to 5 parts of nanoclay, 1 to 3 parts of isocyanate, and 2 to 5 parts of grafted polyacrylate.

7. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 3, characterized in that: The heating temperature in the step 4 is 80-100°C.

8. The multi-component adhesive suitable for the construction of decorative integrated panels under low temperature working conditions according to claim 1, characterized in that: The modified silicone comprises the following percentage components: 60-80% silicone, 0.5-2% butyl hydroxytoluene, 1-5% silane crosslinker, 5-15% phthalate plasticizer, 1-3% carboxyl.