Thin film deposition equipment

Abstract

The invention discloses thin film deposition equipment, which comprises a cavity; the base is arranged in the cavity and is used for bearing a wafer to be processed; the gas spraying head is arranged above the base and used for introducing process gas into the cavity, and a process area is formed between the gas spraying head and the base; the fixing assembly is arranged below the gas spraying head and is configured to be capable of moving up and down so as to move downwards to fix the edge of the wafer in the process period; and the translation assembly is arranged between the gas spraying head and the fixing assembly and is used for moving the fixing assembly on a horizontal plane, so that the fixing assembly can be aligned with the edge of the wafer when moving downwards. The fixing assembly can fix the wafer, the cost of using the electrostatic chuck is reduced, and meanwhile particulate matter generated on the back face of the wafer is restrained.

Description

Technical Field

[0001] The present invention relates to the field of thin film deposition equipment, and in particular to the field of wafer clamping technology in thin film deposition equipment. Background Art

[0002] Semiconductor equipment is equipment for making chips. As process nodes continue to advance downward, semiconductor equipment has become the core of the downward breakthrough of advanced process chips.

[0003] In the current advanced semiconductor process thin film deposition process, as the number of thin film deposition layers increases or decreases, the wafer will warp under the action of thin film stress. As the warping worsens, during the next thin film deposition, thin film deposition will also occur on the edge of the back of the wafer, forming particles, which will contaminate the wafer and cavity and become the source of abnormal particles in the next process. In order to solve this problem, ESC (electrostatic chuck) is currently used in the industry to flatten the wafer through electrostatic adsorption, so that the wafer does not warp during the process, thereby avoiding abnormal particles generated by thin film deposition on the back. However, the current ESC (electrostatic chuck) is expensive, complex in structure, and is monopolized by foreign companies. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a thin film deposition device that can solve the problem of reducing the cost of fixing wafers and is not prone to generating particulate matter.

[0005] To achieve the above object, the present invention provides a thin film deposition device, comprising: Cavity; A base, which is disposed in the cavity and is used to carry the wafer to be processed; A gas shower head, which is disposed above the base and is used to introduce process gas into the cavity, and a process area is formed between the gas shower head and the base; A fixing assembly, the fixing assembly is disposed below the gas shower head and is configured to be able to move up and down, so as to move downward and fix the edge of the wafer during a process period; The translation component is arranged between the gas shower head and the fixed component, and is used to move the fixed component in a horizontal plane, so that the fixed component can be aligned with the edge of the wafer when moving downward.

[0006] Optionally, the fixing assembly includes a base ring and a movable ring, wherein the movable ring is disposed on the outside of the base ring, and the movable ring is configured to move up and down relative to the base ring.

[0007] Optionally, the base is provided with a positioning ring for positioning the wafer, and the positioning ring is arranged on the edges around the upper surface of the base, and the positioning ring has an inclined surface inclined from the edge of the base to the center.

[0008] Optionally, the inner edge of the lower end of the moving ring is a plane, and the outer edge of the lower end of the moving ring is a slope, and the inclination angle of the slope is the same as the inclination angle of the inclined surface.

[0009] Optionally, the fixed component also includes at least one image acquisition module or a wafer position detection module, which is arranged on the outer side of the movable ring and is used to determine the position of the wafer so that the translation component drives the fixed component to move in the horizontal plane, thereby aligning the fixed component with the wafer.

[0010] Optionally, there are three image acquisition modules or wafer position detection modules, and the interval between every two image acquisition modules or wafer position detection modules is the same.

[0011] Optionally, the translation assembly includes an upper moving ring and a lower moving ring, the upper moving ring is arranged on the edges around the lower surface of the gas shower head, and the lower moving ring is arranged below the upper moving ring.

[0012] Optionally, the upper movable ring is configured to be movable along a first direction in a horizontal plane, and the lower movable ring is configured to be movable along a second direction in a horizontal plane, and the first direction is perpendicular to the second direction.

[0013] Optionally, the translation assembly further includes an upper driving part, which is disposed in the gas shower head, a driving rod of the upper driving part is disposed in a groove on the lower surface of the gas shower head, and the upper movable ring is provided with a first lug cooperating with the driving rod of the upper driving part.

[0014] Optionally, the translation assembly also includes a lower driving part, which is arranged in the upper moving ring, and the driving rod of the lower driving part is arranged in a groove on the lower surface of the upper moving ring, and the lower moving ring is provided with a second lug that cooperates with the driving rod of the lower driving part.

[0015] Optionally, there are two upper driving parts, and the driving rods of the two upper driving parts extend in the same direction.

[0016] Optionally, there are two lower driving parts, and the driving rods of the two lower driving parts extend in the same direction.

[0017] Optionally, the fixing assembly further includes an upper and lower driving member, one end of which is arranged on the lower surface of the lower moving ring, and the other end of which is arranged on the upper surface of the moving ring.

[0018] Optionally, there are two upper and lower driving members, which are symmetrical about the center of the moving ring, and are cylinders.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The fixing assembly of the present invention can provide a lower-cost wafer fixing method and prevent particles from being generated on the back of the wafer; moreover, it can also increase the process pressure of the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of a thin film deposition device of the present invention; Figure 2 A schematic diagram of a thin film deposition device fixing component moving downwards according to the present invention; Figure 3 It is a partial schematic diagram of the present invention; Figure 4 It is a partial schematic diagram of the present invention; Figure 5 is a top view of the mobile ring of the present invention; Figure 6 It is a top view of the upper moving ring of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Figure 1-2 FIG. 2 shows a schematic diagram of a thin film deposition device of the present invention. Figure 1-2As shown, the thin film deposition equipment includes: a chamber 110, a base 120, a gas shower head 130, a fixing assembly 160, a translation assembly 140, a gas inlet 150, a lifting device 170 and an exhaust port 180. The base 120 is arranged in the chamber 110 for carrying the wafer to be processed; the gas inlet 150 is arranged above the gas shower head 130 and is connected thereto to deliver process gas to the gas shower head 130; the gas shower head 130 is arranged above the base, that is, arranged above the chamber 110, for introducing process gas into the chamber 110, and a process area is formed between the gas shower head 130 and the base; the lifting device 170 is connected to the base 120 for controlling the lifting of the base 120; the exhaust port 180 is arranged below the chamber 110 for discharging the processed gas out of the chamber 110. The fixing assembly 160 is disposed below the gas shower head 130 and is configured to be able to move up and down, so as to move the edge of the wafer downward and fix it during the process period; the translation assembly 140 is disposed between the gas shower head 130 and the fixing assembly 160, and is used to move the fixing assembly in a horizontal plane, so that the fixing assembly can be aligned with the edge of the wafer when moving downward.

[0024] Optionally, the translation assembly 140 is annular and is disposed around the edge of the gas outlet hole of the gas shower head 130 .

[0025] like Figure 1-2 As shown, the fixed component includes a base ring 161 and a moving ring 162, and the moving ring 162 is arranged on the outside of the base ring, and the moving ring is configured to move up and down relative to the base ring. Optionally, the fixed component also includes at least one image acquisition module 163 or a wafer position detection module, and the image acquisition module 163 or the wafer position detection module is arranged on the outer side of the moving ring 162, and is used to determine the position of the wafer, so that the translation component 140 drives the fixed component to move in the horizontal plane, so that the fixed component is aligned with the wafer. Optionally, the base ring 161 and the moving ring 162 are both vertically extending rings, and the two are socketed. Optionally, the wafer position detection module is a laser distance measurement module. Preferably, the image acquisition module 163 is used to determine the position of the wafer.

[0026] Before the process, Figure 1 As shown, the translation component 140 obtains the specific position of the wafer according to the image acquisition module 163, and then moves the translation component 140 to drive the fixed component to move on the horizontal plane, so that the center of the fixed component and the center of the wafer are concentric. When the fixed component is aligned with the wafer, the moving ring 162 of the fixed component moves downward to press the edge of the wafer, as shown in FIG. Figure 2As shown, the wafer is fixed. At the same time, the moving ring 162 can prevent the process gas from being deposited on the back of the wafer. Moreover, the base ring 161 and the moving ring 162 form a sealed process area, so during the process, the gas pressure can be increased, thereby shortening the saturation reaction time, and reducing the ineffective consumption of the reaction gas, thereby reducing the cost.

[0027] Optionally, the base 120 is provided with a positioning ring 121 for positioning the wafer, and the positioning ring 121 is arranged on the edges of the upper surface of the base 120, and the positioning ring has an inclined surface inclined from the edge of the base to the center. The inclined surface helps the wafer to be automatically positioned in the base.

[0028] Further preferably, Figure 2 As shown, the inner edge of the lower end of the moving ring 162 is a plane, and the outer edge of the lower end of the moving ring is a slope, and the inclination angle of the slope is the same as the inclination angle of the slope. The plane of the inner edge is used to press the edge of the wafer, and the slope of the outer edge cooperates with the slope of the positioning ring 121 of the base, so as to achieve better sealing, prevent gas deposition on the back of the wafer, and further increase the process pressure.

[0029] Figure 5 A top view of the moving ring is shown, as shown in FIG5 , and optionally, the number of the image acquisition modules is three, and the interval between every two image acquisition modules is the same, so that the position of the wafer can be detected more accurately and at the lowest cost.

[0030] Continue to refer to Figure 2 The translation assembly includes an upper moving ring 141 and a lower moving ring 142. The upper moving ring 141 is arranged on the edges of the lower surface of the gas shower head, and the lower moving ring 142 is arranged below the upper moving ring. The upper moving ring 141 is configured to be able to move along a first direction in a horizontal plane, and the lower moving ring 142 is configured to be able to move along a second direction in a horizontal plane, and the first direction and the second direction are perpendicular. Through the above-mentioned translation assembly, the fixed assembly can be moved to any position in the horizontal plane so as to be concentric with the wafer.

[0031] Figure 3 and Figure 4 A partial cross-sectional view of the translation assembly is shown, Figure 3 for Figure 4 The cross-sectional view in the cross direction, such as Figure 3-4As shown, the translation assembly further includes an upper driving part 143, the upper driving part 143 is arranged in the gas shower head 130, the driving rod of the upper driving part 143 is arranged in a groove on the lower surface of the gas shower head, and the upper moving ring 141 is provided with a first lug 144 that cooperates with the driving rod of the upper driving part 143. Optionally, the first driving part is a motor, the driving rod is a screw rod, and the first lug is provided with a threaded hole that cooperates with the screw rod, so as to drive the lug to move, and finally drive the upper moving ring 141 to move in the first direction.

[0032] The translation assembly further includes a lower driving part 145, the lower driving part 145 is disposed in the upper moving ring 141, the driving rod of the lower driving part is disposed in a groove on the lower surface of the upper moving ring 141, and the lower moving ring 142 is provided with a second lug 146 that cooperates with the driving rod of the lower driving part 145. Similarly, the second driving part is a motor, the driving rod is a screw rod, and the second lug is provided with a threaded hole that cooperates with the screw rod, so as to drive the lug to move, and finally drive the lower moving ring 142 to move in the second direction.

[0033] Figure 6 A top view of the upper moving ring 141 is shown, preferably, as Figure 6 As shown, the upper drive unit 143 ( Figure 6 The two upper drive parts 143 are arranged at the edge of the gas shower head 130 and are symmetrical about the center of the gas shower head 130. The gas outlet of the gas shower head 130 is located between the two upper drive parts 143.

[0034] There are two lower driving parts 145 , and the driving rods of the two lower driving parts extend in the same direction, that is, along the second direction. The two lower driving parts 145 are symmetrical about the center of the upper moving ring 141 .

[0035] Optionally, the fixing assembly further includes an upper and lower driving member 164, one end of which is disposed on the lower surface of the lower moving ring 142, and the other end is disposed on the upper surface of the moving ring 162. The base ring 161 is also disposed on the lower surface of the lower moving ring 142. Optionally, there are two upper and lower driving members, which are symmetrical about the center of the moving ring, and the upper and lower driving members are cylinders.

[0036] The fixing assembly of the present invention can provide a lower-cost wafer fixing method and prevent particles from being generated on the back of the wafer; moreover, it can also increase the process pressure of the cavity.

[0037] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A thin film deposition device, characterized in that: include: Cavity; A base, which is disposed in the cavity and is used to carry the wafer to be processed; A gas shower head, which is disposed above the base and is used to introduce process gas into the cavity, and a process area is formed between the gas shower head and the base; A fixing assembly, the fixing assembly is disposed below the gas shower head and is configured to be able to move up and down, so as to move downward and fix the edge of the wafer during a process period; The translation component is arranged between the gas shower head and the fixed component, and is used to move the fixed component in a horizontal plane, so that the fixed component can be aligned with the edge of the wafer when moving downward.

2. The thin film deposition device according to claim 1, characterized in that: The fixing assembly includes a base ring and a moving ring, wherein the moving ring is arranged outside the base ring and is configured to move up and down relative to the base ring.

3. The thin film deposition device according to claim 2, characterized in that: The base is provided with a positioning ring for positioning the wafer. The positioning ring is arranged on the edges of the upper surface of the base. The positioning ring has an inclined surface inclined from the edge of the base to the center.

4. The thin film deposition device according to claim 3, characterized in that: The inner edge of the lower end of the moving ring is a plane, and the outer edge of the lower end of the moving ring is a slope, and the inclination angle of the slope is the same as the inclination angle of the inclined surface.

5. The thin film deposition device according to claim 2 or 3, characterized in that: The fixed component also includes at least one image acquisition module or a wafer position detection module, which is arranged on the outer side of the movable ring and is used to determine the position of the wafer so that the translation component drives the fixed component to move in the horizontal plane, thereby aligning the fixed component with the wafer.

6. The thin film deposition device according to claim 5, characterized in that: There are three image acquisition modules or wafer position detection modules, and the interval between every two image acquisition modules or wafer position detection modules is the same.

7. The thin film deposition device according to claim 1, characterized in that: The translation assembly comprises an upper moving ring and a lower moving ring. The upper moving ring is arranged on the edges around the lower surface of the gas shower head, and the lower moving ring is arranged below the upper moving ring.

8. The thin film deposition device according to claim 7, characterized in that: The upper moving ring is configured to be movable along a first direction on a horizontal plane, and the lower moving ring is configured to be movable along a second direction on a horizontal plane, wherein the first direction is perpendicular to the second direction.

9. The thin film deposition device according to claim 8, characterized in that: The translation assembly further includes an upper driving part, which is disposed in the gas shower head. A driving rod of the upper driving part is disposed in a groove on the lower surface of the gas shower head. The upper moving ring is provided with a first lug that cooperates with the driving rod of the upper driving part.

10. The thin film deposition device according to claim 8, characterized in that: The translation assembly also includes a lower driving part, which is arranged in the upper moving ring. The driving rod of the lower driving part is arranged in a groove on the lower surface of the upper moving ring. The lower moving ring is provided with a second lug that cooperates with the driving rod of the lower driving part.

11. The thin film deposition device according to claim 9, characterized in that: There are two upper driving parts, and the driving rods of the two upper driving parts extend in the same direction.

12. The thin film deposition device according to claim 10, characterized in that: There are two lower driving parts, and the driving rods of the two lower driving parts extend in the same direction.

13. The thin film deposition device according to claim 7, characterized in that: The fixing assembly further comprises an upper and lower driving member, one end of which is arranged on the lower surface of the lower moving ring, and the other end of which is arranged on the upper surface of the moving ring.

14. The thin film deposition device according to claim 13, characterized in that: There are two upper and lower driving members, which are symmetrical about the center of the moving ring, and the upper and lower driving members are cylinders.

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