Built-in solid flow layered temperature equalizing plate, liquid filling temperature equalizing system and heat conduction prediction method

Through the design of the built-in solid-flow layered temperature uniform plate and combined with the pneumatic liquid filling system, the problems of unstable reflow performance and complex liquid filling operation of the temperature uniform plate are solved, efficient heat exchange and simplified liquid filling process are achieved, and the liquid filling process is provided. Stable and efficient thermal conduction performance evaluation.

CN119268419APending Publication Date: 2025-01-07GUILIN UNIV OF ELECTRONIC TECH +1
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Patent Information

Application Number
CN202411529571.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

The reflow performance of existing temperature uniform plates is unstable when placed vertically, and the heat transfer capacity is limited. The vacuum filling process is complicated and the operation is cumbersome, which leads to difficulty in practical application.

Method used

A built-in solid-flow layered temperature uniform plate is designed, including a T-shaped shell, liquid-absorbing core and hollow fins. The heat transfer is optimized through the design of the evaporation chamber and the condensing chamber, combined with a pneumatic manual vacuum pump and liquid filling system , realize convenient liquid filling and efficient heat conduction.

Benefits of technology

It significantly improves the heat exchange ability and stability of the temperature uniform plate, simplifies liquid filling operation, reduces the operation difficulty and probability of errors, and quantitatively evaluates the heat conduction performance through thermal conduction prediction methods.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a built-in solid flow layered temperature equalizing plate, a liquid filling temperature equalizing system and a heat conduction prediction method. A traditional vapor chamber is vertically placed, so that the backflow performance is unstable, and the thermal contact resistance between the vapor chamber and a radiator is not quantitatively considered. A liquid absorption core body and a first liquid containing gap are arranged in a plate shell of the built-in solid flow layered temperature equalizing plate, the space between the liquid absorption core body and a second liquid containing gap is filled with working fluid, and a plurality of hollow fins communicating with the interior of the plate shell are evenly distributed at the small head end of the plate shell; the method for predicting the heat conduction of the vapor chamber comprises the following steps: completing the calculation process of the heat convection efficiency hl, e between an evaporation cavity and a working fluid in the built-in solid flow layered vapor chamber, and calculating the heat conduction efficiency hl, e between the inner wall of the evaporation cavity and the working fluid Ql, e; the quantitative prediction conclusion of the multi-position heat conduction performance in the built-in solid flow layered vapor chamber is obtained according to the calculation process of the heat transfer efficiency between the heat transfer efficiency, the heat resistance Re of an evaporation cavity and the heat resistance of heat exchange between working steam of a condensation cavity and the outside.
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Description

Technical Field

[0001] The present invention specifically relates to a built-in solid-fluid stratified temperature equalizing plate, a liquid-filled temperature equalizing system and a heat conduction prediction method. Background Art

[0002] The working principle of the vapor chamber is based on the evaporation and condensation cycle of the actuating fluid (such as deionized water) enclosed in a plate-shaped cavity. When heat acts on a part of the vapor chamber, the fluid in this area evaporates rapidly, and the vapor diffuses to the colder area in the cavity and condenses, releasing heat, and then turns into liquid again, flowing back to the heat source area through the capillary structure, forming a continuous cycle. This process enables the heat to be quickly and evenly distributed throughout the vapor chamber, achieving rapid heat conduction and heat diffusion. The vapor chamber is usually composed of a metal shell (such as copper or aluminum alloy), a capillary structure and an actuating fluid. The metal shell provides strength and thermal conductivity, and the capillary structure is responsible for guiding the return of the fluid. The choice of actuating fluid has an important influence on the performance of the vapor chamber. Common choices include water, because it has the advantages of large specific heat capacity, large surface tension, high thermal conductivity, suitable boiling point, low cost and environmental protection. The working performance of conventional vapor chambers is unstable, and the thermal conductivity fluctuates greatly with the flow state of the fluid in the plate, and there is no relevant research method for quantitative heat conduction. In addition, conventional temperature-averaging plates require gravity to drive the internal fluid to reflux, and the heat transfer capacity of conventional temperature-averaging plates in the vertical state will be greatly limited. In addition, conventional temperature-averaging plates have contact thermal resistance between the radiators, which will cause the heat dissipation performance of the temperature-averaging plates to drop sharply. Working components may be burned during actual application, resulting in a large amount of economic losses. At the same time, the temperature-averaging plate often needs to be in a vacuum state before filling with liquid. The common vacuum filling systems in laboratories have complex equipment, cumbersome operation, time-consuming and labor-intensive, and are difficult to use in actual production. In short, the traditional temperature-averaging plates placed vertically have the problem of unstable reflux performance, and there is a problem of contact thermal resistance between the temperature-averaging plate and the radiator that has not been quantified. Summary of the invention

[0003] In order to overcome the defects of the prior art, a built-in solid-fluid stratified temperature equalizing plate, a liquid-filled temperature equalizing system and a heat conduction prediction method are provided to solve the above problems.

[0004] A built-in solid-flow stratified temperature equalizing plate comprises a plate shell, a liquid absorbent core and a plurality of hollow fins, the plate shell being a T-shaped shell, the plate shell being horizontally arranged, an evaporation chamber and a condensation chamber being formed inside the plate shell, an input pipe being arranged at the large end of the plate shell, one end of the input pipe being connected with the evaporation chamber of the plate shell, and the other end of the input pipe being an input end matched with a heat source, a liquid absorbent core being arranged horizontally inside the plate shell, the liquid absorbent core being formed by arranging a plurality of hollow frame monomers, a first liquid receiving gap being formed between the upper end surface of the liquid absorbent core and the top inner wall of the plate shell, a second liquid receiving gap being formed between the lower end surface of the liquid absorbent core and the bottom inner wall of the plate shell, a working fluid being filled between the first liquid receiving gap, the liquid absorbent core and the second liquid receiving gap, a plurality of hollow fins being evenly distributed on the small end of the plate shell, each hollow fin being connected with the interior of the plate shell, an output pipe being arranged at the large end of the plate shell, one end of the output pipe being connected with the condensation chamber of the plate shell, and the other end of the output pipe being the output end.

[0005] As a preferred solution: the plate shell includes a narrow plate shell and a wide plate shell, the narrow plate shell includes a first upper plate body, a first lower plate body and a first U-shaped enclosure plate, the first upper plate body and the first lower plate body are horizontally arranged in sequence from top to bottom, the first U-shaped enclosure plate is arranged between the first upper plate body and the first lower plate body, the upper U-shaped edge of the first U-shaped enclosure plate is fixedly connected to one end and both sides of the first upper plate body, the lower U-shaped edge of the first U-shaped enclosure plate is fixedly connected to one end and both sides of the first lower plate body, the condensation chamber is formed between the first upper plate body, the first lower plate body and the first U-shaped enclosure plate, and the two ends of the first U-shaped enclosure plate, the other end of the first upper plate body and the other end of the first lower plate body are enclosed to form a first connecting port connected to the condensation chamber;

[0006] The wide-width plate shell comprises a second upper plate body, a second lower plate body and a second U-shaped enclosing plate, the second upper plate body and the second lower plate body being horizontally arranged in sequence from top to bottom, the second U-shaped enclosing plate being arranged between the second upper plate body and the second lower plate body, the upper U-shaped edge of the second U-shaped enclosing plate being fixedly connected to one end and both sides of the second upper plate body, the lower U-shaped edge of the second U-shaped enclosing plate being fixedly connected to one end and both sides of the second lower plate body, the evaporation chamber is formed between the second upper plate body, the second lower plate body and the second U-shaped enclosing plate, the two ends of the second U-shaped enclosing plate, the other end of the second upper plate body and the other end of the second lower plate body are enclosed to form a second connecting port connected to the evaporation chamber, the narrow-width plate shell is connected to the second connecting port of the wide-width plate shell through the first connecting port, and the narrow-width plate shell and the wide-width plate shell are fixedly connected as a whole.

[0007] As a preferred solution: a plurality of hollow fins are obliquely arranged on the small head end of the plate shell, and the plurality of hollow fins include a plurality of upper fins and a plurality of lower fins, and the plurality of upper fins are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each upper fin is obliquely arranged, one end of each upper fin is connected to the condensation chamber, and the other end of each upper fin is obliquely arranged toward the output pipe; a plurality of lower fins are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each lower fin is obliquely arranged, one end of each lower fin is connected to the condensation chamber, and the other end of each lower fin is obliquely arranged toward the output pipe.

[0008] As a preferred scheme: each hollow frame monomer includes a middle frame body and four end frames, the middle frame body includes a first support frame body and two first cross-shaped support rods, two first cross-shaped support rods are horizontally arranged in the first support frame from top to bottom, the four ends of each first cross-shaped support rod are respectively fixedly connected to the inner wall of the first support frame body, and a first center hole is processed at the center of each first cross-shaped support rod, and the two first center holes of the two first cross-shaped support rods are coaxially arranged, and two end frames of the four end frames are horizontally arranged on the outer wall of one end of the first support frame body from top to bottom, and the other two end frames of the four end frames are horizontally arranged on the outer wall of the other end of the first support frame body from top to bottom, each end frame includes a second support frame and a second cross-shaped support rod, a second cross-shaped support rod is arranged in the second support frame, the four ends of the second cross-shaped support rod are respectively fixedly connected to the inner wall of the second support frame body, and a second center hole is processed at the center of each second cross-shaped support rod.

[0009] As a preferred solution: the working fluid is a phase change material fluid.

[0010] A liquid-filled temperature equalizing system, which is composed of the above-mentioned built-in solid-flow stratified temperature equalizing plate, includes a built-in solid-flow stratified temperature equalizing plate, a pneumatic manual vacuum pump, a waste liquid bucket, a first valve, a second valve, a third valve and a feed cylinder;

[0011] The built-in solid-flow stratified temperature equalizing plate comprises a plate shell, a liquid absorbent core and a plurality of hollow fins, the plate shell is a T-shaped shell, the plate shell is horizontally arranged, an evaporation chamber and a condensation chamber are formed inside the plate shell, an input pipe is arranged at the large end of the plate shell, one end of the input pipe is connected with the evaporation chamber of the plate shell, and the other end of the input pipe is an input end matched with a heat source, a liquid absorbent core is horizontally arranged in the plate shell, the liquid absorbent core is formed by arranging a plurality of hollow frame monomers, a first liquid receiving gap is formed between the upper end surface of the liquid absorbent core and the top inner wall of the plate shell, a second liquid receiving gap is formed between the lower end surface of the liquid absorbent core and the bottom inner wall of the plate shell, a working fluid is filled between the first liquid receiving gap, the liquid absorbent core and the second liquid receiving gap, a plurality of hollow fins are evenly distributed on the small end of the plate shell, each hollow fin is connected with the interior of the plate shell, an output pipe is arranged at the large end of the plate shell, one end of the output pipe is connected with the condensation chamber of the plate shell, and the other end of the output pipe is the output end;

[0012] The input end of the input pipe is connected to the waste liquid barrel through the first connecting channel and the first valve, the waste liquid barrel is connected to the pneumatic manual vacuum pump through the second connecting channel, the feed barrel is connected to the first connecting channel through the third connecting channel, the third connecting channel is provided with a first valve, the second valve and the third valve are both provided on the first connecting channel, the second valve is located between the waste liquid barrel and the third connecting channel, and the third valve is located between the third connecting channel and the built-in solid-flow stratified temperature equalizing plate.

[0013] A method for predicting heat conduction of a built-in solid-fluid stratified temperature averaging plate is implemented by the above-mentioned built-in solid-fluid stratified temperature averaging plate. The method for predicting heat conduction of the temperature averaging plate is to obtain relevant data between the plate shell, the liquid wick, a plurality of hollow fins and the working fluid to complete the heat convection efficiency h between the evaporation chamber and the working fluid in the built-in solid-fluid stratified temperature averaging plate. l,e The calculation process, the inner wall of the evaporation chamber and the working fluid Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e The calculation process of the heat transfer resistance between the working steam in the condensing chamber and the outside world is used to obtain the quantitative prediction conclusion of the multi-position heat conduction performance inside the built-in solid-fluid stratified temperature plate.

[0014] After the built-in solid-fluid stratified temperature plate is constructed, the heat convection efficiency h between the evaporation cavity and the working fluid in the temperature plate is calculated based on the Nusselt number, Reynolds number, Prandtl number, thermal conductivity and dynamic viscosity of the working fluid and the contact surface area and perimeter between the working fluid and the liquid wick. l,e , the calculation process is:

[0015]

[0016]

[0017]

[0018]

[0019] In the above formula, h l,e is the heat convection efficiency of the working fluid in the evaporation chamber W·(m 2 ℃) -1 ; Nu l,e , Re l,e and Pr l,e are the Nusselt number, Reynolds number and Prandtl number of the working fluid respectively; k l,e , μ l,e are the thermal conductivity of the working fluid W·(m·℃) -1 and dynamic viscosity Pa·s; G l,e is the mass flux of the working fluid through the evaporation chamber kg·s -1 ;d e is the hydraulic diameter of the working fluid on the inner surface of the evaporation chamber m; A l and C l are the contact surface areas of the working fluid and the absorbent core m 2 and perimeter m, d e is the hydraulic diameter of the evaporation section. The thermal convection efficiency h of the working fluid in the evaporation chamber is obtained through the above calculation. l,e ;

[0020] According to the calculated heat convection efficiency h of the working fluid in the evaporation chamber l,e , and then the inner wall of the evaporation chamber and the working fluid Q l,e The heat transfer efficiency between is calculated, and the calculation process is:

[0021]

[0022] Q l,e =h l,e A l,e (T wall-in,e -T l,evap ) (6)

[0023] In the above formula, A l,e is the total heat transfer area of ​​the working fluid m 2 , A wall,e is the total area of ​​the evaporation chamber side wall m 2 ;k Al is the thermal conductivity of aluminum W (m·℃) -1 ;t wall,e is the wall thickness of the evaporation chamber m; T l,evap , T wall-out,e and Twall-in,e They are the evaporation temperature of the working liquid, the temperature of the outer wall of the evaporation chamber, and the temperature of the inner wall of the evaporation chamber.

[0024] Thermal resistance of the evaporation chamber R e The calculation process is:

[0025]

[0026] In formula (1), the heat convection efficiency of the working fluid in the evaporation chamber is h l,e Hydraulic diameter d e The dominant influence of the working fluid heat convection efficiency h l,e and heat transfer surface area A l,e In formula (7), the thermal resistance R of the evaporation chamber e Been greatly reduced;

[0027] Thermal resistance R caused by the vapor flow generated by the working fluid v The calculation process is:

[0028] Simplified calculation of the NS equation:

[0029]

[0030] After integration, the speed of the steam u v ,m·s -1 and mass flow rate m v ′, kg·s -1 The solution is obtained by the following equations (13) and (14):

[0031]

[0032]

[0033] In the above formula, u is the velocity of steam flow m·s -1 ,u y ,u x ,u z are the flow velocities of steam in the X, Y, and Z directions, m·s -1 ;

[0034] μ is the dynamic viscosity of the steam Pa·s, p is the steam pressure Pa, y is the height of the steam chamber m, t v is the steam thickness m, ρ v is the steam density kg·m -3 , w is the width of the steam chamber m;

[0035] According to the Clausius-Clapeyron saturated gas equation, the thermal resistance R caused by the steam flow vThe following equation is used to obtain:

[0036]

[0037] ΔT v =T v,e -T v,c (12)

[0038] Where ΔT v is the temperature difference between the steam in the evaporation chamber and the condensation chamber in the steam chamber, T v,e 、T v,c are the temperatures of steam in the evaporation chamber and the condensation chamber respectively;

[0039] In formula (9), under the premise that the length of the plate shell is fixed, the smaller the thickness of the steam, the greater the steam flow velocity u v The larger the value, the shorter the time it takes for the steam to travel from the evaporation chamber to the condensation chamber. The liquid wick limits the thickness of the steam, which makes the steam flow faster. At the same time, the condensation chamber is connected to the evaporation chamber to ensure the temperature difference ΔT between the steam in the evaporation chamber and the condensation chamber. v The structure of the liquid absorption core is conducive to reducing the vapor flow thermal resistance R of the temperature plate. v ;

[0040] Calculate the thermal resistance process of heat exchange between the working steam in the condensing chamber and the outside world, specifically:

[0041] After absorbing heat, the working fluid becomes a gaseous working fluid and transports heat to the condensation chamber, and then transfers the heat to the outside through the hollow fins. The heat convection of the steam working fluid in the condensation chamber is:

[0042]

[0043]

[0044]

[0045] In the above formula, h v,c is the heat convection efficiency of the working fluid vapor in the condensing chamber W·(m 2 ℃) -1 ; Nu v,c Re v,c , and Pr v,c are the Nusselt number, Reynolds number and Prandtl number of the working fluid vapor; k v,c , μ v,c are the thermal conductivity of the working fluid vapor, W·(m·℃) -1 and dynamic viscosity Pa·s; G v,c is the mass flux of the working fluid vapor through the evaporation chamber kg·s -1 ;dc is the hydraulic diameter of the working fluid steam on the inner surface of the condensation chamber m; A v and C v They are the total contact surface area between the working fluid vapor and the hollow fin m 2 and total perimeter m;

[0046] The inner and outer walls of the evaporation chamber Q wall,c , the inner wall of the evaporation chamber and the working fluid Q l,c The heat transfer between is calculated by the following formula:

[0047]

[0048] Q l,c =h l,c A l,c (T wall-in,c -T l,cond ) (17)

[0049] In the above formula: A v,c and A wall,c are the working fluid vapor heat transfer area and the area of ​​the evaporation chamber side wall m 2 ;k Al is the thermal conductivity of aluminum W (m·℃) -1 ;t wall,c is the wall thickness of the condensation chamber m; T v,cond , T wall-out,c and T wall-in,c They are the condensation temperature of the working liquid vapor °C, the temperature of the outer wall of the condensation chamber °C, and the temperature of the inner wall of the condensation chamber °C;

[0050] Heat transfer between the condensation chamber and the outside air Q wall,c for:

[0051] Q wall,c =h air,c A c (T air,out -T air,in ) (18)

[0052] Among them, h air,c is the heat convection efficiency between the condensation chamber and the air W(m 2 ℃) -1 , A c is the surface area of ​​the outer surface of the condensation chamber m 2 ; T air,out and T air,in They are the air inlet temperature and air outlet temperature of the condensing chamber respectively;

[0053] Therefore, the condensation chamber thermal resistance R c ,℃·W -1 for:

[0054]

[0055] In formula (13), the heat convection efficiency of the working fluid in the evaporation chamber is h v,c Hydraulic diameter d c The influence is great; the condensation cavity in the temperature plate cooperates with the hollow fins to ensure that the working fluid is in a large increase in the heat exchange surface area A v,c The total circumference of the working fluid vapor in contact with the hollow fins is extended, increasing the thermal convection efficiency of the working fluid vapor. v,c , with the hollow fins, T wall,c Increase, through formula (19) to get the thermal resistance of the evaporation chamber R c The final calculated value is reduced.

[0056] The beneficial effects of the present invention are:

[0057] 1. The built-in solid-flow layered temperature equalizing plate in the present invention realizes the thermal management process of self-partitioned solid-flow expanded contact area through the cooperation between the plate shell, the liquid absorbent core, multiple hollow fins and the working fluid, optimizes the distribution and utilization of heat, and significantly improves the heat exchange capacity between the temperature equalizing plate and the outside world. The structure and setting position of the hollow fins not only increase the surface area, but also the liquid absorbent core and multiple hollow fins cooperate to expand the uniform and refined contact area with the working fluid, extend the flow path of the working fluid within the effective area, and ensure that the temperature equalizing plate can achieve a more efficient heat exchange process in a shorter time. At the same time, the hollow fins have strong heat exchange performance, and the evaporation and condensation cycle speed inside the temperature equalizing plate can be greatly improved, which can be adapted to different working conditions and ensure continuous stability and high efficiency.

[0058] 2. The liquid-filled temperature-equalizing system in the present invention completes a continuous and effective liquid-filling process through the cooperation between the built-in solid-flow stratified temperature-equalizing plate, the pneumatic manual vacuum pump, the waste liquid barrel, the first valve, the second valve, the third valve and the feed barrel, which can ensure the convenience of the staff during the operation, unify the liquid-filling operation specifications, reduce the influence of the staff's experience on the quality of the operation process, ensure the continuous effectiveness of the liquid-filling operation and the smoothness of the process, reduce the disadvantage of the complicated structure of the liquid-filling system itself, and highlight the simple structural characteristics, which is conducive to reducing the difficulty of operation while also helping to reduce the probability of operational errors.

[0059] 3. The heat conduction prediction method of the built-in solid-fluid stratified temperature plate in the present invention is a heat conduction prediction method based on the built-in solid-fluid stratified temperature plate. This heat conduction prediction method completes the heat convection efficiency h between the evaporation chamber and the working fluid in the built-in solid-fluid stratified temperature plate by obtaining the dimensions or other relevant data from the built-in solid-fluid stratified temperature plate. l,e The calculation process, the inner wall of the evaporation chamber and the working fluid Ql,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e The calculation process of the thermal resistance of the heat exchange between the working steam in the condensing chamber and the outside world is included in the calculation process. The calculation process of each part and link is the important and typical part of the built-in solid-flow stratified temperature equalizing plate, which can fully reflect the thermal conductivity performance of the built-in solid-flow stratified temperature equalizing plate, and quantitatively derive the advantages and disadvantages of the thermal conductivity performance of the built-in solid-flow stratified temperature equalizing plate. The whole calculation process is reasonable and the details are well considered, which is suitable for providing comprehensive and effective data support for the quantitative thermal conductivity performance evaluation of the built-in solid-flow stratified temperature equalizing plate that has been constructed.

[0060] Fourth, the working principle of the present invention is to complete its heat transfer process through phase change circulation flow. The heat transfer starts from the contact surface between the heat source and the evaporation section. The heat released by the heat source is transferred into the interior of the temperature plate through the contact surface. This determines the improvement of the efficiency of subsequent heat transfer. During the transfer process, the working fluid absorbs heat and changes into a gaseous state. The gaseous working fluid then enters the condensation section, thereby gradually releasing the previously absorbed heat, which can ensure that the heat is diffused to the external environment through the heat exchange process with the shell in the condensation section, thereby completing the entire heat transfer cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 It is a schematic diagram of the three-dimensional structure of the built-in solid-flow layered temperature equalizing plate;

[0062] Figure 2 It is a schematic diagram of the three-dimensional structure of the liquid-absorbing core;

[0063] Figure 3 A schematic diagram of a three-dimensional structure showing the connection relationship between the middle frame and the end frame from a first perspective;

[0064] Figure 4 A schematic diagram of a three-dimensional structure showing the connection relationship between the middle frame and the end frame from a second viewing angle;

[0065] Figure 5 A schematic diagram of a three-dimensional structure showing the connection relationship between the middle frame and the end frame from a third perspective;

[0066] Figure 6 This is a first-person structural diagram of a built-in solid-flow stratified temperature equalizing plate;

[0067] Figure 7 It is a schematic diagram of the principle of heat conduction direction in the built-in solid-flow stratified temperature equalizing plate;

[0068] Figure 8 It is a structural schematic diagram of the liquid-filled temperature equalization system;

[0069] Fig. 9Schematic diagram of the average temperature trend in the evaporation chamber of the built-in solid-flow stratified temperature plate in the heat flux step experiment;

[0070] Fig.10 This is a schematic diagram of the structure of the built-in solid-flow stratified temperature equalizing plate from a second perspective;

[0071] Fig.11 It is a third-view structural diagram of the built-in solid-flow stratified temperature equalizing plate;

[0072] Fig.12 It is a schematic diagram of the structure of the built-in solid-flow stratified temperature equalizing plate from the fourth perspective;

[0073] Fig.13 It is a schematic diagram of the three-dimensional structure of the solid-liquid extended contact area of ​​the working fluid in the built-in solid-flow stratified temperature equalizing plate.

[0074] In the figure: 1-plate shell; 1-1-first upper plate body; 1-2-first lower plate body; 1-3-first U-shaped enclosure plate; 1-4-second upper plate body; 1-5-second lower plate body; 1-6-second U-shaped enclosure plate; 2-liquid absorbent core body; 2-1-hollow frame monomer; 2-2-middle frame body; 2-2-1-first support frame body; 2-2-2-first cross-shaped support rod; 2-2-3-first center hole; 2-3-end frame body; 2-3-1-second support frame body; 2-3-2-second Cross-shaped support rod; 2-3-3-second center hole; 3-hollow fin; 3-1-upper fin; 3-2-lower fin; 4-input pipe; 5-first liquid receiving gap; 6-second liquid receiving gap; 7-output pipe; 8-built-in solid-flow stratified temperature equalizing plate; 9-pneumatic manual vacuum pump; 10-waste liquid barrel; 11-first valve; 12-second valve; 13-third valve; 14-feeding barrel; 15-first connecting channel; 16-second connecting channel; 17-third connecting channel; 18-working fluid. DETAILED DESCRIPTION

[0075] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0076] Specific implementation method 1: Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 To illustrate this embodiment, the built-in fixed-flow stratified heat pipe 8 in this embodiment includes a plate housing 1, a wick 2, and a plurality of hollow fins 3. The plate housing 1 is a T-shaped housing, and the plate housing 1 is horizontally arranged. An evaporation chamber and a condensation chamber are formed inside the plate housing 1. An input pipe 4 is provided at the large-end of the plate housing 1. One end of the input pipe 4 is communicated with the evaporation chamber of the plate housing 1, and the other end of the input pipe 4 is an input end that cooperates with a heat source. A wick 2 is horizontally arranged inside the plate housing 1. The wick 2 is formed by arranging a plurality of hollow frame monomers 2-1. A first liquid receiving gap 5 is formed between the upper end surface of the wick 2 and the inner wall of the top of the plate housing 1. A second liquid receiving gap 6 is formed between the lower end surface of the wick 2 and the inner wall of the bottom of the plate housing 1. A working fluid 18 is filled between the first liquid receiving gap 5, the wick 2, and the second liquid receiving gap 6. A plurality of hollow fins 3 are evenly distributed on the small-end of the plate housing 1, and each hollow fin 3 is communicated with the inside of the plate housing 1. An output pipe 7 is provided at the large-end of the plate housing 1. One end of the output pipe 7 is communicated with the condensation chamber of the plate housing 1, and the other end of the output pipe 7 is an output end.

[0077] Further, when heat enters the plate housing 1, the wick 2 in the plate housing 1 can ensure that the heat flow range is uniform and avoid heat overflow, thereby enhancing the fluidity and stability of the liquid. The setting of the hollow fins 3 can improve the heat exchange ability between the plate housing 1 with the wick 2 and the outside, and also optimize the flow path of the working fluid 18, so that the plate housing 1 with the wick 2 can achieve more efficient heat exchange in a shorter time.

[0078] Specific Embodiment 2: This embodiment is a further limitation of Specific Embodiment 1. In this embodiment, the plate housing 1 itself is a variable-width plate body, specifically a horizontally arranged T-shaped housing. The plate housing 1 includes a narrow-width plate shell and a wide-width plate shell. The narrow-width plate shell includes a first upper plate body 1-1, a first lower plate body 1-2, and a first C-shaped enclosing plate 1-3. The first upper plate body 1-1 and the first lower plate body 1-2 are horizontally arranged from top to bottom in sequence. The first C-shaped enclosing plate 1-3 is arranged between the first upper plate body 1-1 and the first lower plate body 1-2. The upper C-shaped edge of the first C-shaped enclosing plate 1-3 is fixedly connected to one end and both sides of the first upper plate body 1-1. The lower C-shaped edge of the first C-shaped enclosing plate 1-3 is fixedly connected to one end and both sides of the first lower plate body 1-2. A condensation chamber is formed among the first upper plate body 1-1, the first lower plate body 1-2, and the first C-shaped enclosing plate 1-3. A first connection port communicated with the condensation chamber is formed by enclosing the two ends of the first C-shaped enclosing plate 1-3, the other end of the first upper plate body 1-1, and the other end of the first lower plate body 1-2;

[0079] In this embodiment, the wide plate shell includes a second upper plate body 1-4, a second lower plate body 1-5 and a second U-shaped enclosure plate 1-6, the second upper plate body 1-4 and the second lower plate body 1-5 are horizontally arranged in sequence from top to bottom, the second U-shaped enclosure plate 1-6 is arranged between the second upper plate body 1-4 and the second lower plate body 1-5, the upper U-shaped edge of the second U-shaped enclosure plate 1-6 is fixedly connected to one end and both sides of the second upper plate body 1-4, the lower U-shaped edge of the second U-shaped enclosure plate 1-6 is fixedly connected to the second upper plate body 1-4, and the lower U-shaped edge of the second U-shaped enclosure plate 1-6 is fixedly connected to the second upper plate body 1-4. One end and both sides of the two lower plate bodies 1-5 are fixedly connected, and the evaporation chamber is formed between the second upper plate body 1-4, the second lower plate body 1-5 and the second U-shaped enclosure plate 1-6. The two ends of the second U-shaped enclosure plate 1-6, the other end of the second upper plate body 1-4 and the other end of the second lower plate body 1-5 are enclosed to form a second connecting port connected to the evaporation chamber, and the narrow plate shell is connected to the second connecting port of the wide plate shell through the first connecting port, and the narrow plate shell and the wide plate shell are fixedly connected as a whole.

[0080] Specific embodiment three: This embodiment is a further limitation of specific embodiment one or two. In this embodiment, a plurality of hollow fins 3 are obliquely arranged on the small head end of the plate shell 1, and the plurality of hollow fins 3 include a plurality of upper fins 3-1 and a plurality of lower fins 3-2. The plurality of upper fins 3-1 are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each upper fin 3-1 is obliquely arranged, one end of each upper fin 3-1 is connected to the condensation chamber, and the other end of each upper fin 3-1 is obliquely arranged toward the output pipe 7; a plurality of lower fins 3-2 are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each lower fin 3-2 is obliquely arranged, one end of each lower fin 3-2 is connected to the condensation chamber, and the other end of each lower fin 3-2 is obliquely arranged toward the output pipe 7.

[0081] Furthermore, the hollow structural characteristics of the hollow fins 3 provide them with strong heat exchange performance, which greatly improves the evaporation and condensation cycle speed inside the plate shell 1, thereby ensuring the stability and efficiency of continuous use of the present invention under different working conditions.

[0082] Specific implementation mode four: This implementation mode is a further limitation of specific implementation modes one, two or three. In this implementation mode, each hollow frame monomer 2-1 includes a middle frame body 2-2 and four end frames 2-3. The middle frame body 2-2 includes a first support frame body 2-2-1 and two first cross-shaped support rods 2-2-2. Two first cross-shaped support rods 2-2-2 are horizontally arranged in the first support frame body 2-2-1 from top to bottom. The four ends of each first cross-shaped support rod 2-2-2 are respectively fixedly connected to the inner wall of the first support frame body 2-2-1. A first center hole 2-2-3 is processed at the center of each first cross-shaped support rod 2-2-2. The two first center holes of the two first cross-shaped support rods 2-2-2 2-2-3 are coaxially arranged, and the outer wall of one end of the first support frame 2-2-1 is horizontally arranged with two end frames 2-3 of the four end frames 2-3 from top to bottom, and the outer wall of the other end of the first support frame 2-2-1 is horizontally arranged with the other two end frames 2-3 of the four end frames 2-3 from top to bottom, each end frame 2-3 includes a second support frame 2-3-1 and a second cross-shaped support rod 2-3-2, and a second cross-shaped support rod 2-3-2 is arranged in the second support frame 2-3-1, and the four ends of the second cross-shaped support rod 2-3-2 are respectively fixedly connected to the inner wall of the second support frame 2-3-1, and a second center hole (2-3-3) is processed at the center of each second cross-shaped support rod 2-3-2.

[0083] Specific embodiment 5: This embodiment is a further limitation of specific embodiments 1, 2, 3 or 4. In this embodiment, the working fluid 18 is a phase change material fluid. The working fluid 18 is a fluid medium made of an existing phase change material, specifically a 50% alcohol solution. The working process of the phase change material fluid is consistent with the working process of the existing phase change material fluid.

[0084] The present invention mainly completes its heat transfer process based on the phase change circulation flow of the working fluid 18. Through in-depth analysis of its working principle, the heat transferred from the evaporation section to the condensation section can be divided into four key and typical structural parts, which is beneficial to the subsequent quantitative analysis related to heat conduction, thereby optimizing the distribution and utilization of heat, and forming a subsequent quantitative and accurate evaluation process of the continuous heat transfer performance of the overall structure.

[0085] Specific implementation method six: Combination Figures 1 to 13 To explain this embodiment, the liquid-filled temperature equalization system in this embodiment includes a built-in solid-flow stratified temperature equalization plate 8, a pneumatic manual vacuum pump 9, a waste liquid bucket 10, a first valve 11, a second valve 12, a third valve 13 and a feed cylinder 14;

[0086] In this embodiment, the built-in solid-flow layered temperature equalizing plate 8 includes a plate shell 1, a liquid absorbent core 2 and a plurality of hollow fins 3. The plate shell 1 is a T-shaped shell. The plate shell 1 is horizontally arranged. An evaporation chamber and a condensation chamber are formed inside the plate shell 1. An input pipe 4 is arranged at the large end of the plate shell 1. One end of the input pipe 4 is connected to the evaporation chamber of the plate shell 1. The other end of the input pipe 4 is an input end matched with a heat source. A liquid absorbent core 2 is horizontally arranged in the plate shell 1. The liquid absorbent core 2 is formed by arranging a plurality of hollow frame monomers 2-1. The upper end of the liquid absorbent core 2 A first liquid receiving gap 5 is formed between the end surface and the top inner wall of the plate shell 1, a second liquid receiving gap 6 is formed between the lower end surface of the liquid absorbent core 2 and the bottom inner wall of the plate shell 1, and a working fluid 18 is filled between the first liquid receiving gap 5, the liquid absorbent core 2 and the second liquid receiving gap 6. A plurality of hollow fins 3 are evenly distributed on the small end of the plate shell 1, and each hollow fin 3 is connected to the inside of the plate shell 1. An output pipe 7 is provided at the large end of the plate shell 1, one end of the output pipe 7 is connected to the condensation chamber of the plate shell 1, and the other end of the output pipe 7 is an output end;

[0087] Furthermore, the input end of the input pipe 4 is connected to the waste liquid barrel 10 through the first connecting channel 15 and the first valve 11, the waste liquid barrel 10 is connected to the pneumatic manual vacuum pump 9 through the second connecting channel 16, the feed barrel 14 is connected to the first connecting channel 15 through the third connecting channel 17, the third connecting channel 17 is provided with the first valve 11, the second valve 12 and the third valve 13 are both provided on the first connecting channel 15, the second valve 12 is located between the waste liquid barrel 10 and the third connecting channel 17, and the third valve 13 is located between the third connecting channel 17 and the built-in solid-flow stratified temperature equalizing plate 8.

[0088] The structure of the liquid filling temperature equalization system is reasonable and simplifies the complexity of the liquid filling process, which is conducive to improving the standardized and unified operation of liquid filling, reducing the failure rate of liquid filling, reducing the probability of failure caused by complicated operations, and is conducive to completing a continuous and effective process advancement process.

[0089] Specific implementation method seven: Combination Figures 1 to 13 The present embodiment is described. In the present embodiment, the heat conduction prediction method of the temperature equalizer is to obtain the relevant data between the plate shell 1, the liquid wick 2, the plurality of hollow fins 3 and the working fluid 18 to complete the heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid layered temperature equalizer 8. l,e The calculation process, the inner wall of the evaporation chamber and the working fluid 18Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R eThe calculation process of the thermal resistance between the working steam in the condensing chamber and the outside world is used to obtain a quantitative prediction conclusion on the multi-position heat conduction performance inside the built-in solid-flow stratified temperature equalizing plate; this temperature equalizing plate heat conduction prediction method is a quantitative analysis process of multi-position heat conduction of the built-in solid-flow stratified temperature equalizing plate 8 that has been constructed.

[0090] After the built-in solid-fluid stratified temperature equalizer 8 is constructed, the external heat source is started, and the heat generated by the external heat source enters the evaporation chamber of the plate shell 1 through the input pipe 4, and performs heat exchange with the working fluid 18 in the evaporation chamber. The working fluid 18 absorbs heat, changes from liquid phase to gas phase, and takes the heat away from the evaporation chamber and enters the condensation chamber. The heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid stratified temperature equalizer 8 is l,e The calculation process is as follows:

[0091]

[0092]

[0093]

[0094]

[0095] In the above formula, h l,e is the heat convection efficiency of the working fluid 18 in the evaporation chamber, in W·(m 2 ℃) -1 . Nu l,e , Re l,e and Pr l,e The Nusselt number of the working fluid 18 is the ratio of the thermal boundary layer thickness to the characteristic length, the Reynolds number is the Reynolds number, and the Prandtl number is the Prandtl number. l,e , μ l,e are respectively the thermal conductivity of the working fluid 18 and the dynamic viscosity of the working fluid 18, and the unit of the thermal conductivity is W·(m·℃) -1 The unit of the dynamic viscosity is Pa·s. l,e is the mass flux of the working fluid 18 through the evaporation chamber, in kg·s -1 .d e A is the hydraulic diameter of the working fluid 18 on the inner surface of the evaporation chamber, in meters. l and C l are the surface area and perimeter of the contact part between the working fluid 18 and the absorbent core 2, and the surface area unit is m 2 , perimeter in m, d e is the hydraulic diameter of the evaporation section. The heat convection efficiency h of the working fluid 18 in the evaporation chamber is obtained through the above calculation. l,e ;

[0096] According to the calculated heat convection efficiency h of the working fluid 18 in the evaporation chamber l,e , and then the inner wall of the evaporation chamber and the working fluid 18Q l,e The heat transfer efficiency between is calculated, and the calculation process is:

[0097]

[0098] Q l,e =h l,e A l,e (T wall-in,e -T l,evap ) (6)

[0099] In the above formula, A l,e Total heat transfer area for working fluid 18 m 2 , A wall,e is the total area of ​​the evaporation chamber side wall, in m 2 ;k Al is the thermal conductivity of aluminum, in W (m·℃) -1 ;t wall,e is the wall thickness of the evaporation chamber, in m; T l,evap , T wall-out,e and T wall-in,e They are the evaporation temperature of the working liquid, the temperature of the outer wall of the evaporation chamber, and the temperature of the inner wall of the evaporation chamber, in degrees Celsius;

[0100] Thermal resistance of the evaporation chamber R e The calculation process is:

[0101]

[0102] From formula (1), we can know that the heat convection efficiency h of the working fluid 18 in the evaporation chamber is l,e Hydraulic diameter d e The dominant influence of the heat convection efficiency h of the working fluid 18 l,e and heat transfer surface area A l,e As the thermal resistance of the evaporation chamber increases, it can be seen from formula (7) that the thermal resistance R e Been greatly reduced;

[0103] Thermal resistance R caused by the vapor flow generated by the working fluid 18 v The calculation process is:

[0104] Simplified calculation of the NS equation:

[0105]

[0106] After integration, the speed of the steam u v ,m·s -1 and mass flow rate mv ′,kg·s -1 The solution is obtained by the following equations (13) and (14):

[0107]

[0108]

[0109] In the above formula, u is the velocity of steam flow, in m·s -1 ,u y ,u x ,u z are the flow velocities of steam in the X, Y, and Z directions, in m·s -1 ;

[0110] μ is the dynamic viscosity of the steam in Pa·s, p is the steam pressure in Pa, y is the height of the steam chamber in m, t v is the steam thickness in m, ρ v is the steam density in kg·m -3 , w is the width of the steam chamber, in m;

[0111] According to the Clausius-Clapeyron saturated gas equation, the thermal resistance R caused by the steam flow v It can be obtained by the following equation:

[0112]

[0113] ΔT v =T v,e -T v,c (12)

[0114] Where ΔT v It is the temperature difference between the evaporation chamber and the condensation chamber of the steam chamber, in °C, T v,e , T v,c are the temperatures of steam in the evaporation chamber and the condensation chamber, respectively, in °C;

[0115] From formula (9), we can see that when the length of the temperature plate is constant, the smaller the thickness of the steam, the greater the steam flow velocity u v The larger the value, the shorter the time it takes for the steam to travel from the evaporation chamber to the condensation chamber. The liquid wick 2 limits the thickness of the steam, which makes the steam flow faster. At the same time, the condensation chamber is connected to the evaporation chamber, thereby ensuring that the temperature difference ΔT between the steam in the evaporation chamber and the condensation chamber is v The structure of the liquid wick 2 is conducive to reducing the vapor flow thermal resistance R of the temperature averaging plate. v ;

[0116] Calculate the thermal resistance process of heat exchange between the working steam in the condensing chamber and the outside world, specifically:

[0117] After absorbing heat, the working fluid 18 becomes a gaseous working fluid, transports heat to the condensation chamber, and then transfers the heat to the outside through the hollow fins 3. The heat convection of the steam working fluid 18 in the condensation chamber is:

[0118]

[0119]

[0120]

[0121] In the above formula, h v,c is the heat convection efficiency of the working fluid 18 steam in the condensing chamber, in W·(m 2 ℃) -1 , Nu v,c Re v,c , and Pr v,c are the Nusselt number, Reynolds number and Prandtl number of the working fluid 18 steam respectively; k v,c , μ v,c are the thermal conductivity of the working fluid 18 vapor, in W·(m·℃) -1 And dynamic viscosity, unit is Pa·s. G v,c is the mass flux of the working fluid 18 vapor through the evaporation chamber, in kg·s -1 ;d c A is the hydraulic diameter of the working fluid 18 steam on the inner surface of the condensation chamber, in m; v and C v They are the total surface area and total perimeter of the working fluid 18 vapor in contact with the hollow fin 3, and the surface area unit is m 2 and total perimeter in m;

[0122] The inner and outer walls of the evaporation chamber Q wall,c , the inner wall of the evaporation chamber and the working fluid 18Q l,c The heat transfer between is calculated by the following formula:

[0123]

[0124] Q l,c =h l,c A l,c (T wall-in,c -T l,cond ) (17)

[0125] In the above formula: A v,c and A wall,care the working fluid 18 steam heat transfer area and the area of ​​the evaporation chamber side wall, in m 2 ;k Al is the thermal conductivity of aluminum, in W (m·℃) -1 ;t wall,c is the wall thickness of the condensation chamber, in m; T v,cond , T wall-out,c and T wall-in,c are the condensation temperature of the working liquid vapor, in °C, the temperature of the outer wall of the condensation chamber, and the temperature of the inner wall of the condensation chamber, in °C;

[0126] Heat transfer between the condensation chamber and the outside air Q wall,c for:

[0127] Q wall,c =h air,c A c (T air,out -T air,in ) (18)

[0128] Among them, h air,c is the heat convection efficiency between the condensation chamber and the air, in W (m 2 ℃) -1 , A c is the surface area of ​​the outer surface of the condensation chamber, in m 2 ; T air,out and T air,in They are the air inlet temperature and air outlet temperature of the condensing chamber respectively;

[0129] Therefore, the condensation chamber thermal resistance R c , unit is ℃·W -1 , the specific calculation is:

[0130]

[0131] From formula (13), it can be seen that the heat convection efficiency h of the working fluid 18 in the evaporation chamber is v,c Hydraulic diameter d c The influence is great; the condensation cavity in the temperature plate cooperates with the hollow fin 3 to ensure that the working fluid 18 is in a large increase in the heat exchange surface area A v,c In the state, the total perimeter of the working fluid 18 steam in contact with the hollow fin 3 is extended, increasing the heat convection efficiency h of the working fluid 18 steam v,c , with the hollow fin 3, T wall,c Increase, through formula (19) to get the thermal resistance of the evaporation chamber R c The final calculated value is reduced.

[0132] The heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid stratified temperature plate 8 is completed. l,eThe calculation process, the inner wall of the evaporation chamber and the working fluid 18Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e After the calculation process of the heat transfer resistance between the working steam in the condensing chamber and the outside world, the standardized data of the built-in solid-flow stratified temperature plate 8 when the model was built was compared with the calculation results, and the quantitative prediction conclusion of the multi-position heat conduction performance inside the built-in solid-flow stratified temperature plate was obtained. The specific classification is as follows:

[0133] When the heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid stratified temperature plate 8 is l,e The calculation process, the inner wall of the evaporation chamber and the working fluid 18Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e If the calculation process and the calculation results of the thermal resistance of the heat exchange between the working steam in the condensing chamber and the outside are less than 60% consistent with the standardized data of the built-in solid-flow stratified temperature plate 8 model, the completed built-in solid-flow stratified temperature plate 8 is considered to be a temperature plate with unstable thermal conductivity to be optimized.

[0134] When the heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid stratified temperature plate 8 is l,e The calculation process, the inner wall of the evaporation chamber and the working fluid 18Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e If the calculation process and the calculation result of the thermal resistance of the heat exchange between the working steam in the condensing chamber and the outside are in accordance with the standardized data of the built-in solid-flow stratified temperature plate 8 model by more than 60%, the completed built-in solid-flow stratified temperature plate 8 is deemed to be a qualified temperature plate;

[0135] When the heat convection efficiency h between the evaporation chamber and the working fluid 18 in the built-in solid-fluid stratified temperature plate 8 is l,e The calculation process, the inner wall of the evaporation chamber and the working fluid 18Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e If the calculation process and the calculation results of the thermal resistance of the heat exchange between the working steam in the condensing chamber and the outside are consistent with the standardized data of the built-in solid-flow stratified temperature equalizing plate 8 model by more than 60%, the completed built-in solid-flow stratified temperature equalizing plate 8 is deemed to be a high-quality temperature equalizing plate.

Claims

1. A built-in solid-flow stratified temperature plate, characterized in that: The invention comprises a plate shell (1), a liquid absorbent core (2), a plurality of hollow fins (3) and a working fluid (18); the plate shell (1) is a T-shaped shell; the plate shell (1) is arranged horizontally; an evaporation chamber and a condensation chamber are formed inside the plate shell (1); an input pipe (4) is arranged at the large end of the plate shell (1); one end of the input pipe (4) is connected to the evaporation chamber of the plate shell (1); the other end of the input pipe (4) is an input end matched with a heat source; a liquid absorbent core (2) is arranged horizontally inside the plate shell (1); the liquid absorbent core (2) is formed by arranging a plurality of hollow frame monomers (2-1); the upper end surface of the liquid absorbent core (2) is connected to the plate shell A first liquid receiving gap (5) is formed between the top inner walls of the plate shell (1), a second liquid receiving gap (6) is formed between the lower end surface of the liquid absorbent core (2) and the bottom inner wall of the plate shell (1), a working fluid (18) is filled between the first liquid receiving gap (5), the liquid absorbent core (2) and the second liquid receiving gap (6), a plurality of hollow fins (3) are evenly distributed on the small end of the plate shell (1), each hollow fin (3) is connected to the interior of the plate shell (1), an output pipe (7) is provided at the large end of the plate shell (1), one end of the output pipe (7) is connected to the condensation chamber of the plate shell (1), and the other end of the output pipe (7) is an output end.

2. According to claim 1, a built-in solid-fluid layered temperature equalizing plate, characterized in that: The plate shell (1) comprises a narrow plate shell and a wide plate shell, the narrow plate shell comprises a first upper plate body (1-1), a first lower plate body (1-2) and a first U-shaped enclosure plate (1-3), the first upper plate body (1-1) and the first lower plate body (1-2) are arranged horizontally in sequence from top to bottom, the first U-shaped enclosure plate (1-3) is arranged between the first upper plate body (1-1) and the first lower plate body (1-2), the upper U-shaped edge of the first U-shaped enclosure plate (1-3) is in contact with the first upper plate body (1-1), and the upper U-shaped edge of the first U-shaped enclosure plate (1-3) is in contact with the first upper plate body (1-1). 1), one end and both sides of the first U-shaped enclosure plate (1-3) are fixedly connected, the lower U-shaped edge of the first U-shaped enclosure plate (1-3) is fixedly connected to one end and both sides of the first lower plate body (1-2), the condensation chamber is formed between the first upper plate body (1-1), the first lower plate body (1-2) and the first U-shaped enclosure plate (1-3), and the two ends of the first U-shaped enclosure plate (1-3), the other end of the first upper plate body (1-1) and the other end of the first lower plate body (1-2) are enclosed to form a first connection port that is connected to the condensation chamber; The wide plate shell comprises a second upper plate body (1-4), a second lower plate body (1-5) and a second U-shaped enclosure plate (1-6); the second upper plate body (1-4) and the second lower plate body (1-5) are arranged horizontally in sequence from top to bottom; the second U-shaped enclosure plate (1-6) is arranged between the second upper plate body (1-4) and the second lower plate body (1-5); an upper U-shaped edge of the second U-shaped enclosure plate (1-6) is fixedly connected to one end and both sides of the second upper plate body (1-4); and a lower U-shaped edge of the second U-shaped enclosure plate (1-6) is fixedly connected to one end and both sides of the second upper plate body (1-4). The evaporation chamber is formed between the second upper plate body (1-4), the second lower plate body (1-5) and the second U-shaped enclosure plate (1-6); the two ends of the second U-shaped enclosure plate (1-6), the other end of the second upper plate body (1-4) and the other end of the second lower plate body (1-5) are enclosed to form a second connection port connected to the evaporation chamber; the narrow plate shell is connected to the second connection port of the wide plate shell through the first connection port; the narrow plate shell and the wide plate shell are fixedly connected as a whole.

3. According to claim 2, a built-in solid-fluid layered temperature equalizing plate, characterized in that: A plurality of hollow fins (3) are arranged obliquely on the small end of the plate shell (1), and the plurality of hollow fins (3) include a plurality of upper fins (3-1) and a plurality of lower fins (3-2). The plurality of upper fins (3-1) are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each upper fin (3-1) is arranged obliquely, one end of each upper fin (3-1) is connected to the condensation chamber, and the other end of each upper fin (3-1) is arranged obliquely toward the output pipe (7); and a plurality of lower fins (3-2) are evenly distributed on the upper end surface of the narrow plate shell along the length direction of the narrow plate shell, and each lower fin (3-2) is arranged obliquely, one end of each lower fin (3-2) is connected to the condensation chamber, and the other end of each lower fin (3-2) is arranged obliquely toward the output pipe (7).

4. A built-in solid-fluid layered temperature equalizing plate according to claim 1, 2 or 3, characterized in that: Each hollow frame monomer (2-1) comprises a middle frame body (2-2) and four end frame bodies (2-3); the middle frame body (2-2) comprises a first support frame body (2-2-1) and two first cross-shaped support rods (2-2-2); two first cross-shaped support rods (2-2-2) are horizontally arranged in sequence from top to bottom in the first support frame body (2-2-1); the four ends of each first cross-shaped support rod (2-2-2) are respectively fixedly connected to the inner wall of the first support frame body (2-2-1); a first center hole (2-2-3) is processed at the center of each first cross-shaped support rod (2-2-2); the two first center holes (2-2-3) of the two first cross-shaped support rods (2-2-2) are coaxially arranged; the first support frame body (2-2-1) is provided with a plurality of first cross-shaped support rods (2-2-2) and a plurality of first cross-shaped support rods (2-2-2) are provided with a plurality of first cross-shaped support rods (2-2-2). The outer wall at one end of the first support frame (2-1) is horizontally provided with two end frames (2-3) of the four end frames (2-3) from top to bottom, and the outer wall at the other end of the first support frame (2-2-1) is horizontally provided with the other two end frames (2-3) of the four end frames (2-3) from top to bottom, each end frame (2-3) comprises a second support frame (2-3-1) and a second cross-shaped support rod (2-3-2), the second support frame (2-3-1) is provided with a second cross-shaped support rod (2-3-2), the four ends of the second cross-shaped support rod (2-3-2) are respectively fixedly connected to the inner wall of the second support frame (2-3-1), and the center of each second cross-shaped support rod (2-3-2) is processed with a second center hole (2-3-3).

5. The built-in solid-fluid layered temperature equalizing plate according to claim 4, characterized in that: The working fluid (18) is a phase change material fluid.

6. A liquid-filled temperature equalizing system, comprising a built-in solid-fluid layered temperature equalizing plate as claimed in claim 1, 2, 3, 4 or 5, characterized in that: It comprises a built-in solid-fluid stratified temperature-averaging plate (8), a pneumatic manual vacuum pump (9), a waste liquid bucket (10), a first valve (11), a second valve (12), a third valve (13) and a feed cylinder (14); The built-in solid-fluid stratified temperature equalizing plate (8) comprises a plate shell (1), a liquid absorbent core (2) and a plurality of hollow fins (3); the plate shell (1) is a T-shaped shell; the plate shell (1) is arranged horizontally; an evaporation chamber and a condensation chamber are formed inside the plate shell (1); an input pipe (4) is arranged at the large end of the plate shell (1); one end of the input pipe (4) is connected to the evaporation chamber of the plate shell (1); the other end of the input pipe (4) is an input end matched with a heat source; a liquid absorbent core (2) is arranged horizontally inside the plate shell (1); the liquid absorbent core (2) is formed by arranging a plurality of hollow frame monomers (2-1); the upper end surface of the liquid absorbent core (2) is in contact with the heat source; A first liquid receiving gap (5) is formed between the top inner walls of the plate shell (1), a second liquid receiving gap (6) is formed between the lower end surface of the liquid absorbing core (2) and the bottom inner wall of the plate shell (1), a working fluid (18) is filled between the first liquid receiving gap (5), the liquid absorbing core (2) and the second liquid receiving gap (6), a plurality of hollow fins (3) are evenly distributed on the small end of the plate shell (1), each hollow fin (3) is connected to the interior of the plate shell (1), an output pipe (7) is arranged at the large end of the plate shell (1), one end of the output pipe (7) is connected to the condensation chamber of the plate shell (1), and the other end of the output pipe (7) is an output end; The input end of the input pipe (4) is connected to the waste liquid barrel (10) through a first connecting channel (15) and a first valve (11); the waste liquid barrel (10) is connected to a pneumatic manual vacuum pump (9) through a second connecting channel (16); the feed cylinder (14) is connected to the first connecting channel (15) through a third connecting channel (17); the third connecting channel (17) is provided with a first valve (11); the second valve (12) and the third valve (13) are both provided on the first connecting channel (15); the second valve (12) is located between the waste liquid barrel (10) and the third connecting channel (17); and the third valve (13) is located between the third connecting channel (17) and a built-in solid-fluid stratified temperature equalizing plate (8).

7. A method for predicting heat conduction of a built-in solid-fluid stratified temperature equalizer, implemented by a built-in solid-fluid stratified temperature equalizer as claimed in claim 1, 2, 3, 4 or 5, characterized in that: The heat conduction prediction method for a temperature equalizing plate is to obtain relevant data between a plate shell (1), a liquid absorbing core (2), a plurality of hollow fins (3) and a working fluid (18) to complete the heat convection efficiency h between the evaporation chamber and the working fluid (18) in a built-in solid-fluid layered temperature equalizing plate (8). l,e The calculation process, the inner wall of the evaporation chamber and the working fluid (18) Q l,e The calculation process of heat transfer efficiency between the evaporation chamber and the thermal resistance R e The calculation process of the heat transfer resistance between the working steam in the condensing chamber and the outside world is used to obtain the quantitative prediction conclusion of the multi-position heat conduction performance inside the built-in solid-fluid stratified temperature plate. After the built-in solid-fluid stratified temperature-averaging plate is constructed, the heat convection efficiency h between the evaporation cavity in the temperature-averaging plate and the working fluid (18) is calculated based on the Nusselt number, Reynolds number, Prandtl number, thermal conductivity and dynamic viscosity of the working fluid (18) and the contact surface area and perimeter between the working fluid (18) and the liquid wick (2). l,e , the calculation process is: In the above formula, h l,e is the heat convection efficiency of the working fluid (18) in the evaporation chamber W·(m 2 ℃) -1 ; Nu l,e , Re l,e and Pr l,e are the Nusselt number, Reynolds number and Prandtl number of the working fluid (18); k l,e , μ l,e are the thermal conductivity of the working fluid (18) W·(m·℃) -1 and dynamic viscosity Pa·s; G l,e is the mass flux of the working fluid (18) through the evaporation chamber kg·s -1 ; d e A is the hydraulic diameter m of the working fluid (18) on the inner surface of the evaporation chamber; l and C l are the contact surface areas m of the working fluid (18) and the absorbent core (2) 2 and perimeter m, d e is the hydraulic diameter of the evaporation section. The heat convection efficiency h of the working fluid (18) in the evaporation chamber is obtained through the above calculation. l,e ; According to the calculated heat convection efficiency h of the working fluid (18) in the evaporation chamber l,e , and then the inner wall of the evaporation chamber and the working fluid (18)Q l,e The heat transfer efficiency between is calculated, and the calculation process is: Q l,e =h l,e A l,e (T wall-in,e -T l,evap ) (6) In the above formula, A l,e is the total heat transfer area of ​​the working fluid (18) m 2 , A wall,e is the total area of ​​the evaporation chamber side wall m 2 ;k Al is the thermal conductivity of aluminum W (m·℃) -1 ; t wall,e is the wall thickness of the evaporation chamber m; T l,evap , T wall-out,e and T wall-in,e They are the evaporation temperature of the working liquid, the temperature of the outer wall of the evaporation chamber, and the temperature of the inner wall of the evaporation chamber. Thermal resistance of the evaporation chamber R e The calculation process is: In formula (1), the heat convection efficiency h of the working fluid (18) in the evaporation chamber is l,e Hydraulic diameter d e The dominant influence of the working fluid (18) is the heat convection efficiency h l,e and heat transfer surface area A l,e In formula (7), the thermal resistance R of the evaporation chamber e Been greatly reduced; Thermal resistance R caused by the flow of vapor generated by the working fluid (18) v The calculation process is: Simplified calculation of the NS equation: After integration, the speed of the steam u v ,m·s -1 and mass flow rate m v ′, kg·s -1 The solution is obtained by the following equations (13) and (14): In the above formula, u is the velocity of steam flow m·s -1 ,u y ,u x ,u z are the flow velocities of steam in the X, Y, and Z directions, m·s -1 ; μ is the dynamic viscosity of the steam Pa·s, p is the steam pressure Pa, y is the height of the steam chamber m, t v is the steam thickness m, ρ v is the steam density kg·m -3 , w is the width of the steam chamber m; According to the Clausius-Clapeyron saturated gas equation, the thermal resistance R caused by the steam flow v The following equation is used to obtain: ΔT v =T v,e -T v,c (12) Where ΔT v is the temperature difference between the steam in the evaporation chamber and the condensation chamber in the steam chamber, T v,e , T v,c are the temperatures of steam in the evaporation chamber and the condensation chamber respectively; In formula (9), under the premise that the length of the plate shell (1) is fixed, the smaller the thickness of the steam, the greater the steam flow velocity u v The larger the value, the shorter the time it takes for the steam to travel from the evaporation chamber to the condensation chamber. The liquid wick (2) limits the thickness of the steam, which makes the steam flow faster. At the same time, the condensation chamber is connected to the evaporation chamber, thereby ensuring that the temperature difference ΔT between the steam in the evaporation chamber and the condensation chamber is v The structure of the liquid absorbing core (2) is conducive to reducing the steam flow thermal resistance R of the temperature averaging plate. v ; Calculate the thermal resistance process of heat exchange between the working steam in the condensing chamber and the outside world, specifically: After absorbing heat, the working fluid (18) becomes a gaseous working fluid and transports heat to the condensation chamber, and then transfers the heat to the outside through the hollow fins (3). The heat convection of the steam working fluid (18) in the condensation chamber is: In the above formula, h v,c is the heat convection efficiency of the working fluid (18) steam in the condensing chamber W·(m 2 ℃) -1 ; Nu v,c Re v,c , and Pr v,c are the Nusselt number, Reynolds number and Prandtl number of the working fluid (18) steam respectively; k v,c , μ v,c are the thermal conductivity of the working fluid (18) steam, W·(m·℃) -1 and dynamic viscosity Pa·s; G v,c is the mass flux of the working fluid (18) vapor through the evaporation chamber kg·s -1 ;d c A is the hydraulic diameter of the working fluid (18) steam on the inner surface of the condensation chamber m; v and C v The total contact surface area of ​​the working fluid (18) and the steam and the hollow fin (3) is m 2 and total perimeter m; The inner and outer walls of the evaporation chamber Q wall,c , the inner wall of the evaporation chamber and the working fluid (18)Q l,c The heat transfer between is calculated by the following formula: Q l,c =h l,c A l,c (T wall-in,c -T l,cond ) (17) In the above formula: A v,c and A wall,c are the working fluid (18) steam heat transfer area and the area of ​​the evaporation chamber side wall m 2 ;k Al is the thermal conductivity of aluminum W (m·℃) -1 ; t wall,c is the wall thickness of the condensation chamber m; T v,cond , T wall-out,c and T wall-in,c They are the condensation temperature of the working liquid vapor °C, the temperature of the outer wall of the condensation chamber °C, and the temperature of the inner wall of the condensation chamber °C; Heat transfer between the condensation chamber and the outside air Q wall,c for: Q wall,c =h air,c A c (T air,out -T air,in ) (18) Among them, h air,c is the heat convection efficiency between the condensation chamber and the air W(m 2 ℃) -1 , A c is the surface area of ​​the outer surface of the condensation chamber m 2 ; T air,out and T air,in They are the air inlet temperature and air outlet temperature of the condensing chamber respectively; Therefore, the condensation chamber thermal resistance R c ,℃·W -1 for: In formula (13), the heat convection efficiency h of the working fluid (18) in the evaporation chamber is v,c Hydraulic diameter d c The influence of the condensation cavity in the temperature plate and the hollow fin (3) are matched to ensure that the working fluid (18) is in a large increase in the heat exchange surface area A v,c The total circumference of the working fluid (18) steam in contact with the hollow fin (3) is extended, thereby increasing the heat convection efficiency h of the working fluid (18) steam. v,c , in combination with the hollow fin (3), T wall,c Increase, through formula (19) to get the thermal resistance of the evaporation chamber R c The final calculated value is reduced.