Vapor chamber and manufacturing method thereof

Abstract

The vapor chamber comprises a shell and a liquid absorbing core, a working medium cavity is formed in the shell, the working medium cavity is provided with an upper wall face and a lower wall face in the thickness direction of the shell, the liquid absorbing core is arranged in the working medium cavity, the liquid absorbing core is made of foam metal, and the liquid absorbing core is provided with a first face and a second face in the thickness direction; the liquid absorbing core comprises a first liquid absorbing core body and a second liquid absorbing core body, the first liquid absorbing core body is located above the second liquid absorbing core body, the second face of the first liquid absorbing core body is connected to the upper wall face, and the first face of the second liquid absorbing core body is connected to the lower wall face. A vacuum cavity is formed between the first face of the first wick and the second face of the second wick. According to the vapor chamber with the liquid absorbing core made of the laser processing foam metal, the heat transfer efficiency is greatly improved under the condition that the size is proper, the requirement of a high-power electronic device for heat dissipation is met, and it can be ensured that a flat heat pipe has good and stable heat resistance performance.

Description

Technical Field

[0001] The present invention is applied to the technical field of vapor chambers, and in particular relates to a vapor chamber and a manufacturing method thereof. Background Art

[0002] As a high-efficiency phase change heat transfer element, the heat spreader has been widely used in various terminal electronic products such as mobile phones and computers. Generally, the heat spreader includes a shell, a liquid wick, a support structure and a working fluid. The shell has a closed inner cavity. The liquid wick and the support structure are contained in the inner cavity, and the working fluid is filled in the inner cavity. In the prior art, the water absorption capacity of the liquid wick of the heat spreader is average, resulting in a slow rate of transferring the working fluid, which causes the heat transfer rate of the heat spreader to be slow. With the continuous increase in the power of modern electronic products, ordinary heat spreaders can no longer meet the heat dissipation rate of electronic devices. Summary of the invention

[0003] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide a vapor chamber and a method for manufacturing the same.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] In a first aspect, a heat spreader includes an outer shell and a liquid absorbent core, wherein a working fluid cavity is provided inside the outer shell, wherein the working fluid cavity has an upper wall surface and a lower wall surface along the thickness direction of the outer shell, wherein the liquid absorbent core is arranged in the working fluid cavity, wherein the liquid absorbent core is made of foam metal, wherein the liquid absorbent core has a first surface and a second surface along the thickness direction, wherein the first surface is formed by laser scanning to form a laser processed surface, wherein the liquid absorbent core includes a first liquid absorbent core and a second liquid absorbent core, wherein the first liquid absorbent core is located above the second liquid absorbent core, wherein the second surface of the first liquid absorbent core is connected to the upper wall surface, wherein the first surface of the second liquid absorbent core is connected to the lower wall surface, and wherein a vacuum cavity is formed between the first surface of the first liquid absorbent core and the second surface of the second liquid absorbent core.

[0006] In combination with the first aspect, in some implementations of the first aspect, the shell includes an upper shell plate and a lower shell plate, the upper shell plate and the lower shell plate are sealed at their peripheries, and the working medium chamber is formed inside the shell between the upper shell plate and the lower shell plate.

[0007] In combination with the first aspect and the above-mentioned implementation manner, in some implementation manners of the first aspect, the bottom of the upper shell plate is provided with a first concave cavity recessed along the thickness direction, the first absorbent core is arranged in the first concave cavity, the thickness of the first absorbent core is less than the depth of the first concave cavity, and the top of the lower shell plate is provided with a second concave cavity recessed along the thickness direction, the second absorbent core is arranged in the second concave cavity, and the thickness of the second absorbent core is less than the depth of the second concave cavity.

[0008] In combination with the first aspect and the above-mentioned implementations, in some implementations of the first aspect, a plurality of support columns are provided in the working medium chamber, and the support columns are supported between the upper shell plate and the lower shell plate.

[0009] In combination with the first aspect and the above-mentioned implementation manner, in some implementation manners of the first aspect, the first absorbent core and the second absorbent core are provided with reserved through holes, the upper end of the support column passes through the reserved through hole of the first absorbent core and is welded to the upper shell plate, and the lower end of the support column passes through the reserved through hole of the second absorbent core and is welded to the lower shell plate.

[0010] In combination with the first aspect and the above-mentioned implementations, in some implementations of the first aspect, the wick is made of foam copper, the support column is made of copper powder sintered copper column, and the upper shell plate and the lower shell plate are made of copper plates.

[0011] In combination with the first aspect and the above-mentioned implementations, in some implementations of the first aspect, the housing is provided with a liquid injection pipe connected to the working fluid chamber.

[0012] In a second aspect, a method for manufacturing a vapor chamber comprises the following steps:

[0013] S10. Making an upper shell and a lower shell, and setting a first concave cavity at the bottom of the upper shell, and setting a second concave cavity at the top of the lower shell;

[0014] S20. Using a laser to scan the first surface of the first absorbent core made of foam metal and the first surface of the second absorbent core;

[0015] S30. The first absorbent core is disposed in the first concave cavity, and the second surface of the first absorbent core is connected to the upper shell plate, and the second absorbent core is disposed in the second concave cavity, and the first surface of the second absorbent core is connected to the lower shell plate;

[0016] S40. Assemble the first concave cavity of the upper shell plate toward the second concave cavity of the lower shell plate and seal them at the periphery to form a working medium cavity between the upper shell plate and the lower shell plate.

[0017] In conjunction with the second aspect, in some implementations of the second aspect,

[0018] In step S20, a plurality of reserved through holes are provided in the first absorbent core and the second absorbent core;

[0019] In step S30, the support columns are fixed to the upper shell plate and / or the lower shell plate according to the positions of the reserved through holes.

[0020] In combination with the second aspect and the above implementations, in some implementations of the second aspect, the following steps are further included:

[0021] S50. The working fluid chamber is evacuated, and after the evacuation is completed, a working fluid is injected into the working fluid chamber, and then the working fluid chamber is sealed.

[0022] One of the above technical solutions has at least one of the following advantages or beneficial effects: In the technical solution of the present invention, by laser scanning one side surface of the liquid absorbent core made of foam metal, the two sides thereof have opposite hydrophilic and hydrophobic properties, and specifically combined with the specific setting position relationship inside the shell, the side of the liquid absorbent core that is not scanned by the laser is more conducive to the evaporation and diffusion of the reflux working medium; the side of the liquid absorbent core that is scanned by the laser is conducive to the condensation and fall of the gas working medium, thereby accelerating the circulation of the gas-liquid two-phase working medium, realizing the rapid transfer of heat, accelerating the rate of heat exchange of the temperature averaging plate, and improving the heat transfer efficiency, and the whole process does not require other energy input. On the other hand, due to the different placement of the hydrophilicity of the foam metal, the temperature averaging plate has different positive and negative working medium reflux speeds, so that the heat transfer thermal resistance is different, showing similar thermal rectification performance of thermal diodes. The heat averaging plate with laser processed foam metal as the liquid absorbent core provided by the present invention greatly improves the heat transfer efficiency under the condition of appropriate size, meets the heat dissipation requirements of high-power electronic devices, and can ensure that the flat heat pipe has good and stable thermal resistance performance.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 1 is an exploded schematic diagram of an embodiment of a vapor chamber of the present invention;

[0026] Figure 2 This is a diagram of the internal working principle of a vapor chamber according to an embodiment of the present invention;

[0027] Figure 3 1 is a cross-sectional view of an embodiment of a vapor chamber of the present invention. DETAILED DESCRIPTION

[0028] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0029] In the present invention, if directions (up, down, left, right, front and back) are described, it is only for the convenience of describing the technical solution of the present invention, and does not indicate or imply that the technical features referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as a limitation of the present invention.

[0030] In the present invention, "several" means one or more, "multiple" means more than two, "greater than", "less than", "exceed" and the like are understood to exclude the number itself; "above", "below", "within" and the like are understood to include the number itself. In the description of the present invention, if there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the present invention, unless otherwise clearly defined, the words "set", "install", "connect" and the like should be understood in a broad sense, for example, they can be directly connected or indirectly connected through an intermediate medium; they can be fixedly connected or detachably connected or integrally formed; they can be mechanically connected or electrically connected or able to communicate with each other; they can be the internal connection of two elements or the interaction relationship between two elements. Those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0032] in, Figure 1 and Figure 2 The reference direction of the embodiment of the present invention is given below. Figure 1 and Figure 2 The embodiment of the present invention is described with reference to the direction shown.

[0033] Combination Figure 1 , Figure 2 , Figure 3An embodiment of the present invention provides a heat spreader, including a shell 100 and a liquid absorbent core. A working fluid cavity is provided inside the shell 100. The working fluid cavity has an upper wall surface 101 and a lower wall surface 102 along the thickness direction of the shell 100. An installation gap is left between the upper wall surface 101 and the lower wall surface 102. The liquid absorbent core is in a sheet shape and is arranged in the working fluid cavity. The liquid absorbent core is made of foam metal. The liquid absorbent core has a first surface and a second surface along the thickness direction. The first surface is formed by laser scanning to form a laser processing surface. The liquid absorbent core includes a first liquid absorbent core 201 and a second liquid absorbent core 202. The first liquid absorbent core 201 is located above the second liquid absorbent core 202. The second surface of the first liquid absorbent core 201 is connected to the upper wall surface 101, and the first surface of the second liquid absorbent core 202 is connected to the lower wall surface 102. A vacuum cavity is formed between the first surface of the first liquid absorbent core 201 and the second surface of the second liquid absorbent core 202. In the embodiment of the present invention, the first wick 201 and the second wick 202 are arranged in the working fluid chamber in different ways. For the upper end of the heat spreader, i.e., the condensation end, the second surface of the first wick 201 scanned by the laser faces the vacuum chamber, and the first surface not scanned by the laser is tightly connected to the upper wall 101 by spot welding or the like. For the lower end of the heat spreader, i.e., the evaporation end, the first surface of the second wick 202 scanned by the laser is fixed and tightly connected to the lower wall 102 by spot welding or the like, and the second surface not scanned by the laser faces the vacuum chamber. The side of the wick at the condensation end facing the vacuum chamber has been scanned by the laser and has excellent water repellency, while the side of the wick at the evaporation end that has not been modified by the laser faces the vacuum chamber and has excellent superhydrophilicity.

[0034] With such installation, when the heat spreader is working, the boiling point of the working fluid solution (deionized water for example) will be reduced in a low vacuum environment, and the water droplets will first contact the second liquid absorbent core 202 of the lower wall 102 in the vacuum chamber. Since the side of the second liquid absorbent core 202 that has not been processed by the laser has water absorption properties, the water droplets diffuse from the unprocessed surface to the entire second liquid absorbent core 202 of the lower wall 102 after contact. The heated area of ​​the liquid is increased, and since the second liquid absorbent core 202 has pores, the water droplets directly contact the lower wall 102 (evaporation end) through the pores, and are quickly vaporized into water vapor by heat, which speeds up the vaporization rate and is conducive to the rapid reflux, diffusion and circulation of the working fluid. Due to the temperature difference between the evaporation end and the condensation end, the hot vapor will actively flow to the condensation end. The water vapor slowly rises through the second wick 202, and after reaching the upper wall 101 (condensation end) through the pores of the first wick 201, it is quickly cooled and liquefied into water droplets, and quickly diffuses on the surface of the unprocessed first wick 201. After that, the water droplets pass through the pores to reach the side of the first wick 201 processed by the laser. Because the side of the upper wall 101 (condensation end) of the first wick 201 facing the vacuum chamber has been laser scanned, it has excellent water repellency, so the droplets fall back quickly, which is conducive to the condensation and fall of the working gas. Such placement can speed up the rate of heat exchange of the temperature equalizing plate and improve the heat transfer efficiency. In this way, the wick has the function of penetrating water from the hydrophilic surface to the hydrophobic surface, and also has the ability to resist water droplets from the hydrophobic surface to the hydrophilic surface, thereby achieving the function of one-way water permeability.

[0035] In the technical solution of the present invention, the surface of one side of the liquid absorbent core made of foam metal is scanned by laser, so that the two sides have opposite hydrophilic and hydrophobic properties. Specifically combined with the specific setting position relationship inside the shell 100, the side of the liquid absorbent core that is not scanned by the laser is more conducive to the evaporation and diffusion of the reflux working fluid; the side of the liquid absorbent core that is scanned by the laser is conducive to the condensation and fall of the gas working fluid, thereby accelerating the circulation of the gas-liquid two-phase working fluid, realizing the rapid transfer of heat, accelerating the rate of heat exchange of the temperature equalizing plate, and improving the heat transfer efficiency. The whole process does not require other energy input. On the other hand, due to the different placement of the hydrophilicity of the foam metal, the temperature equalizing plate has different positive and negative working fluid reflux speeds, so that the heat transfer thermal resistance is different, showing similar thermal rectification performance of thermal diodes. The heat equalizing plate with laser processed foam metal as the liquid absorbent core provided by the present invention greatly improves the heat transfer efficiency under the condition of appropriate size, meets the heat dissipation requirements of high-power electronic devices, and can ensure that the flat heat pipe has good and stable thermal resistance performance.

[0036] In order to facilitate the installation of the liquid absorbent core in the housing 100, the housing 100 can be formed by assembling an upper housing and a lower housing, or by assembling a left housing and a right housing.

[0037] In some embodiments, see Figure 1 , Figure 2, Figure 3 The housing 100 includes an upper housing plate 103 and a lower housing plate 104. The upper housing plate 103 and the lower housing plate 104 are sealed and connected at their peripheries, and a working medium chamber is formed between the upper housing plate 103 and the lower housing plate 104 inside the housing 100. The upper housing plate 103 forms the condensation end of the heat spreader, and the lower housing plate 104 forms the evaporation end of the heat spreader.

[0038] Furthermore, a concave cavity may be provided on one of the upper shell plate 103 and the lower shell plate 104, so that after the upper shell plate 103 and the lower shell plate 104 are sealed and connected at their peripheries, a working medium cavity is formed inside the housing 100. Figure 1 , Figure 2 , Figure 3 The bottom of the upper shell plate 103 is provided with a first cavity 105 that is recessed in the thickness direction, the shape of the first absorbent core 201 matches the first cavity 105, the first absorbent core 201 is arranged in the first cavity 105, and the thickness of the first absorbent core 201 is less than the depth of the first cavity 105. The top of the lower shell plate 104 is provided with a second cavity 106 that is recessed in the thickness direction, the shape of the second absorbent core 202 matches the second cavity 106, the second absorbent core 202 is arranged in the second cavity 106, and the thickness of the second absorbent core 202 is less than the depth of the second cavity 106. After the upper shell plate 103 and the lower shell plate 104 are sealed and connected at their peripheries, a vacuum cavity is formed between the first surface of the first absorbent core 201 and the second surface of the second absorbent core 202.

[0039] In some embodiments, see Figure 1 , Figure 2 , Figure 3 , a plurality of support columns 300 are provided in the working medium cavity, and the support columns 300 are supported between the upper shell plate 103 and the lower shell plate 104. On the one hand, the support columns 300 are supported between the upper shell plate 103 and the lower shell plate 104 to ensure that the vacuum cavity formed inside the shell will not collapse due to gas pressure. On the other hand, the condensed working medium can slowly slide down along the support columns 300, which is conducive to the condensation and fall of the working medium gas. In addition, the support columns 300 can also assist in realizing the heat transfer between the condensation end and the evaporation end, thereby improving the heat transfer efficiency.

[0040] Further, see Figure 1 , Figure 2 , Figure 3 The first absorbent core 201 and the second absorbent core 202 are provided with a reserved through hole 203, the upper end of the support column 300 passes through the reserved through hole 203 of the first absorbent core 201 and is welded to the upper shell plate 103, and the lower end of the support column 300 passes through the reserved through hole of the second absorbent core 202 and is welded to the lower shell plate 104.

[0041] In some embodiments, the liquid wick is made of foam copper, which has excellent water-repellent properties after laser scanning treatment, while the foam copper that has not been laser modified has excellent super hydrophilicity. This embodiment uses laser-processed foam copper as the heat spreader of the liquid wick, which greatly improves the heat transfer efficiency when the size is appropriate, meets the heat dissipation needs of high-power electronic devices, and can ensure that the flat heat pipe has good and stable thermal resistance performance.

[0042] Preferably, the support column 300 is made of copper powder sintered copper column, and the upper shell plate 103 and the lower shell plate 104 are made of copper plates. With the help of the thermal conductivity of copper, the heat transfer efficiency of the heat spreader is further improved.

[0043] In some embodiments, see Figure 1 , Figure 3 The housing 100 is provided with a liquid injection pipe 400 connected to the working medium chamber. The heat spreader can be injected with liquid through the liquid injection pipe 400. After the liquid injection is completed, the liquid filling pipe mouth is punched to deform it, and then the pipe mouth is sealed by welding.

[0044] An embodiment of the present invention further provides a method for manufacturing a vapor chamber, comprising the following steps:

[0045] S10. The upper shell 103 and the lower shell 104 are made by stamping or milling, and a first concave cavity 105 is provided at the bottom of the upper shell 103, and a second concave cavity 106 is provided at the top of the lower shell 104;

[0046] S20. Using a laser to scan the first surface of the first absorbent core 201 and the first surface of the second absorbent core 202 made of foam metal, the foam metal can be ultrasonically cleaned using an ultrasonic instrument before scanning to clean impurities and dirt on its surface;

[0047] S30. The first absorbent core 201 is disposed in the first cavity 105, and the second surface of the first absorbent core 201 is connected to the upper shell 103 by diffusion welding or the like, the second absorbent core 202 is disposed in the second cavity 106, and the first surface of the second absorbent core 202 is connected to the lower shell 104 by diffusion welding or the like;

[0048] S40. Assemble the first concave cavity 105 of the upper shell plate 103 toward the second concave cavity 106 of the lower shell plate 104 and seal them at the periphery to ensure the sealing performance. A working medium cavity is formed between the upper shell plate 103 and the lower shell plate 104.

[0049] Further, in some embodiments, in step S20, a plurality of reserved through holes are provided in the first absorbent core 201 and the second absorbent core 202;

[0050] In step S30, the support column 300 is fixed to the upper shell plate 103 and / or the lower shell plate 104 according to the positions of the reserved through holes.

[0051] Furthermore, in some embodiments, the following steps are also included:

[0052] S50. The working fluid chamber is evacuated. After the evacuation is completed, the working fluid is injected into the working fluid chamber, and then the working fluid chamber is sealed.

[0053] Therefore, the heat spreader of the embodiment of the present invention has a simple manufacturing process, does not require other special customized equipment for manufacturing, can be quickly mass-produced, and has low manufacturing costs. After the heat transfer test, the evaporation end and the condensation end are swapped, and it is found that the laser-modified foam copper wick rectification heat spreader mentioned in the embodiment of the present invention has different forward and reverse working fluid reflux speeds due to the different placement of the hydrophilic and hydrophobic properties of the foam copper, so that the heat spreader has different heat transfer thermal resistances, showing similar thermal rectification performance to a thermal diode, and therefore has a wider application scenario and application value.

[0054] Among them, the embodiment of the present invention provides a specific laser scanning method for foam copper:

[0055] S1. First, a porous copper foam with a thickness of 1 mm, a pore size of 100 pp l, and a porosity of 97% was selected. The sample was rinsed with anhydrous ethanol for 5 minutes and cleaned with an ultrasonic cleaner filled with ionized water for 10 minutes to remove the residue on the surface of the sample.

[0056] S2. First, laser etching is performed on the foam copper. A YAG laser is selected to enable PWM signal output. The marking parameters are set to a jump speed of 4000 mm / s, a diameter of 1 mm, and a spacing of 0.05 mm.

[0057] S3, adjust the processing speed to 20 mm / s, 1A current, 20KHz, and process the laser at a distance of 21.5 cm from the foam copper.

[0058] S4, the processing shape is a 55×55mm square, the fill type is selected as enable fill, the whole object is calculated, the fill lines are evenly distributed, and the ring spacing is 0.05mm.

[0059] S5. After processing, cut the 55×55mm square copper foam. At the same time, set through holes in the copper foam to facilitate the placement of the copper powder sintered copper column in the heat spreader.

[0060] S6. The through holes are set as follows: Draw a circle with a diameter of 3 mm with a distance of 7.5 mm from the upper edge of the square foam copper and 7.5 mm from the left edge as the center. Based on the circle, set a through hole every 10 mm in the positive direction of the X axis, with a total of 5 through holes in each row.

[0061] S7. The Y axis is the same as above. A through hole is set every 10 mm in the negative direction of the Y axis. There are 5 through holes in each column. A piece of foam copper has a total of 25 through holes for placing copper powder sintered copper columns.

[0062] In the description of this specification, the description with reference to the terms "example", "embodiment" or "some embodiments" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] Of course, the invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A heat sink, characterized in that: The invention comprises an outer shell and a liquid absorbent core, wherein a working fluid cavity is arranged inside the outer shell, wherein the working fluid cavity has an upper wall surface and a lower wall surface along the thickness direction of the outer shell, wherein the liquid absorbent core is arranged in the working fluid cavity, wherein the liquid absorbent core is made of foam metal, wherein the liquid absorbent core has a first surface and a second surface along the thickness direction, wherein the first surface is formed by laser scanning to form a laser processed surface, wherein the liquid absorbent core comprises a first liquid absorbent core and a second liquid absorbent core, wherein the first liquid absorbent core is located above the second liquid absorbent core, wherein the second surface of the first liquid absorbent core is connected to the upper wall surface, wherein the first surface of the second liquid absorbent core is connected to the lower wall surface, and a vacuum cavity is formed between the first surface of the first liquid absorbent core and the second surface of the second liquid absorbent core.

2. The vapor chamber according to claim 1, characterized in that: The shell comprises an upper shell plate and a lower shell plate, the upper shell plate and the lower shell plate are sealed at their peripheries, and the working medium chamber is formed inside the shell between the upper shell plate and the lower shell plate.

3. The heat sink according to claim 2, characterized in that: A first concave cavity recessed along the thickness direction is provided at the bottom of the upper shell plate, the first absorbent core is arranged in the first concave cavity, the thickness of the first absorbent core is less than the depth of the first concave cavity, and a second concave cavity recessed along the thickness direction is provided at the top of the lower shell plate, the second absorbent core is arranged in the second concave cavity, and the thickness of the second absorbent core is less than the depth of the second concave cavity.

4. The heat sink according to claim 2, characterized in that: A plurality of support columns are arranged in the working medium chamber, and the support columns are supported between the upper shell plate and the lower shell plate.

5. The vapor chamber according to claim 4, characterized in that: The first absorbent core and the second absorbent core are provided with reserved through holes, the upper end of the support column passes through the reserved through hole of the first absorbent core and is welded to the upper shell plate, and the lower end of the support column passes through the reserved through hole of the second absorbent core and is welded to the lower shell plate.

6. The vapor chamber according to claim 4, characterized in that: The liquid absorbing core is made of foamed copper, the supporting column is made of copper powder sintered copper column, and the upper shell plate and the lower shell plate are made of copper plates.

7. The vapor chamber according to claim 2, characterized in that: The shell is provided with a liquid injection pipe communicated with the working medium chamber.

8. A method for manufacturing a vapor chamber, characterized in that: The following steps are involved: S10. Making an upper shell and a lower shell, and setting a first concave cavity at the bottom of the upper shell, and setting a second concave cavity at the top of the lower shell; S20. Using a laser to scan the first surface of the first absorbent core made of foam metal and the first surface of the second absorbent core; S30. The first absorbent core is disposed in the first concave cavity, and the second surface of the first absorbent core is connected to the upper shell plate, and the second absorbent core is disposed in the second concave cavity, and the first surface of the second absorbent core is connected to the lower shell plate; S40. Assemble the first concave cavity of the upper shell plate toward the second concave cavity of the lower shell plate and seal them at the periphery to form a working medium cavity between the upper shell plate and the lower shell plate.

9. The method for manufacturing a vapor chamber according to claim 8, wherein: In step S20, a plurality of reserved through holes are provided in the first absorbent core and the second absorbent core; In step S30, the support columns are fixed to the upper shell plate and / or the lower shell plate according to the positions of the reserved through holes.

10. The method for manufacturing a vapor chamber according to claim 8, wherein: The following steps are also included: S50. The working fluid chamber is evacuated, and after the evacuation is completed, a working fluid is injected into the working fluid chamber, and then the working fluid chamber is sealed.

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