Developing device for processing electronic component circuit board

Abstract

The invention relates to a developing device for processing an electronic component circuit board in the technical field of circuit board processing. The developing device comprises a developing mechanism and an intelligent signal processor, the developing mechanism comprises a mounting box body, a plurality of developing tanks arranged in the mounting box body, an ultrasonic generator, a heating plate, a bubble detector, an upper liquid level sensor, a lower liquid level sensor and a temperature sensor; the intelligent signal processor comprises a liquid level control module, a developing module and a floating foam cleaning module, immersion type developing can be achieved through the mechanisms, compared with spraying type developing, the immersion type developing can avoid the problem that production is delayed due to the fact that a nozzle is blocked due to the fact that developing liquid is used too many times, and through the arrangement of the mechanical foam breaker, the production efficiency is improved. The addition of a defoaming agent can be effectively reduced, the developing speed can be accelerated by the heating plate and the ultrasonic generator around the developing tank, and the intelligent regulation and control of the heating temperature and the ultrasonic power can be realized through the intelligent signal processor to realize the maximization of the production efficiency.

Description

Technical Field

[0001] The present invention relates to a developing device, in particular to a developing device for processing electronic component circuit boards, which is applied in the technical field of circuit board processing. Background Art

[0002] The current developing device generally adopts the spray type. The developer is sprayed from the liquid storage tank through the pipeline and the nozzle onto the circuit board under the action of the pressure pump. Spraying the developer through the nozzle is likely to cause waste of the developer, and the foam generated by the nozzle spraying is likely to cause uneven washing of the product and cause quality abnormalities. When the developer is used too many times, it is easy to cause nozzle blockage and delay production.

[0003] The invention patent with application number CN202410527844.5 discloses a vertical developing device and a developing process for fine circuit boards. The developing device includes a fluid module and a second fluid module arranged in parallel. The particle size of the liquid medicine sprayed by the first fluid module is 100-1000um, and the particle size of the liquid medicine sprayed by the second fluid module is 5-40um. It includes a fixture, a spray disc and a swing mechanism for driving the spray disc to move. The circuit board is loaded on the fixture and moves vertically between the first fluid module and the second fluid module through a conveying mechanism. There are two spray discs symmetrically arranged on the front and rear sides of the fixture. There are two swing mechanisms, each of which drives the corresponding spray disc to move up and down separately. The developer of the invention may have nozzle clogging after long-term use, which may easily cause production stagnation. In order to reduce the foam generated by spraying, a defoaming agent is added to the developer. Heating the defoaming agent will greatly increase the difficulty of water treatment, which is not conducive to environmental protection.

[0004] In order to solve the problem that the spray-type developing device produces foam that easily causes uneven product rinsing and abnormal quality, and the developer is easily blocked by nozzles when used too many times, delaying production, there is an urgent need for a developing device for electronic component circuit board processing to solve the above technical problems. Summary of the invention

[0005] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is that the foam generated by the spraying of the developing device easily causes uneven rinsing of the product and results in abnormal quality, and the excessive use of the developing solution easily causes nozzle blockage and delays production.

[0006] In order to solve the above problems, the present invention provides a developing device for processing electronic component circuit boards, including a developing mechanism and an intelligent signal processor; the developing mechanism includes a mounting box, a plurality of developing tanks arranged in the mounting box, a temperature sensor is arranged at the bottom end of each developing tank, an ultrasonic generator is arranged at the front and rear of each developing tank, a heating plate is arranged at the left and right of each developing tank, four mounting holes are opened on each developing tank, and the four mounting holes on the developing tank are respectively used to install a bubble detector, an upper liquid level sensor, a lower liquid level sensor and a developer detector, the ultrasonic generator, the heating plate, the bubble detector, the upper liquid level sensor, the lower liquid level sensor, the developer detector and the temperature sensor are all installed in the mounting box, a water inlet and a water outlet are opened on each developing tank, and the water inlet is arranged at the developing tank. At the upper end of the tank, the water outlet is arranged at the lower end of the developing tank, a liquid injection mechanism is installed at the water inlet of the developing tank, a liquid discharge mechanism is installed at the water outlet of the developing tank, a defoamer moving motor is installed at the top of the mounting box, a defoamer fixing rod corresponding to the developing tank is connected to the rotating shaft of the defoamer moving motor, and a mechanical defoamer is installed on the defoamer fixing rod; an intelligent signal processor is installed on one side of the mounting box, the intelligent signal processor includes a liquid level control module, a developing module and a floating foam cleaning module, the liquid level control module is respectively electrically connected to the upper liquid level sensor, the lower liquid level sensor, the developing liquid detector, the liquid injection mechanism and the liquid discharge mechanism, the floating foam cleaning module is respectively electrically connected to the floating bubble detector, the defoamer moving motor and the mechanical defoamer, and the developing module is respectively electrically connected to the developing liquid detector, the temperature sensor, the heating plate and the ultrasonic generator.

[0007] In the above-mentioned developing device for processing electronic component circuit boards, the situation in which the spray-type developing device sprays and generates foam, which easily causes uneven product washing and abnormal quality, can be reduced, and the problem of nozzle clogging and production delay caused by excessive use of the developer can be reduced.

[0008] As a further improvement of the present application, a circuit board moving mechanism is provided at the upper end of the developing mechanism, and the circuit board moving mechanism includes a slide, a sliding rod installed in the slide, and an outer moving rod installed at the lower end of the sliding rod. A horizontal moving motor is provided on the top of the outer moving rod, and the rotating shaft of the horizontal moving motor is connected to a gear B, which is meshed with a gear A, and the gear A is meshed with a rack on the slide. The intelligent signal processor also includes a moving module, and the moving module is electrically connected to the horizontal moving motor.

[0009] As a further improvement of the present application, a vertical moving motor is installed on the outer moving rod, the output shaft of the vertical moving motor is threadedly connected to the inner moving rod through a screw, a circuit board clamp is provided at the lower end of the inner moving rod, and the moving module is electrically connected to the developer detector and the vertical moving motor respectively.

[0010] As a further improvement of the present application, the liquid injection mechanism includes a raw liquid tank, a pipeline pump A and a water inlet valve. The input end of the pipeline pump A is connected to the bottom of the raw liquid tank through a pipeline, and the output end of the pipeline pump A is equipped with a water inlet valve. The output end of the water inlet valve is respectively connected to the liquid injection pipe A and the liquid injection pipe B through a three-way pipe, and the liquid level control module is electrically connected to the pipeline pump A and the water inlet valve respectively.

[0011] As another improvement of the present application, the discharge mechanism includes a waste liquid tank, a pipeline pump B and a water outlet valve. The output end of the pipeline pump B is equipped with a water outlet valve. The output end of the water outlet valve is connected to the bottom of the waste liquid tank through a pipeline. The input end of the pipeline pump B is respectively connected to the discharge pipe A and the discharge pipe B through a three-way pipe. The liquid level control module is respectively connected to the pipeline pump B and the water outlet.

[0012] As another improved supplement of the present application, the developing device also includes a replacement mechanism, which includes a replacement arm A, a developing tank replacement clamp B installed under the replacement arm A, a replacement arm B, a developing tank replacement clamp A installed under the replacement arm B, and an auxiliary developing tank movably connected to the developing tank replacement clamp A, an electromagnet 2 is provided between the bubble detector, the upper liquid level sensor, the lower liquid level sensor and the developing liquid detector and the mounting box body, an elastic part is installed between the electromagnet 2 and the mounting box body, the electromagnet 2 is fixed on the mounting box body, the bubble detector, the upper liquid level sensor, the lower liquid level sensor, the developing liquid detector, one side of the developing tank and the auxiliary developing tank are provided with magnetic materials, and an electromagnet 1 is provided on the ultrasonic generator, the heating plate and the temperature sensor.

[0013] As another improvement of the present application, the intelligent signal processor also includes a developing tank replacement module, which is electrically connected to the replacement arm A, the replacement arm B, the electromagnet 2 and the electromagnet 1, respectively, and the auxiliary developing tank is provided with four mounting holes 2, multiple water inlets 2 and multiple water outlets 2.

[0014] As another improvement of the present application, the bubble detector, upper liquid level sensor, lower liquid level sensor and developer detector are respectively located at the four corners of a mounting surface of the developer tank, and the bubble detector is located at the upper left corner of the mounting surface, the upper liquid level sensor is located at the upper right corner of the mounting surface, the developer detector is located at the lower left corner of the mounting surface, and the lower liquid level sensor is located at the lower right corner of the mounting surface.

[0015] In summary, when the circuit board to be developed is a smaller one, the addition of developer can be controlled on the intelligent signal processor before formal development. When the developer is added to a sufficient amount, the pipeline pump A will automatically stop, and then the liquid level control module will automatically send a start signal to the foam cleaning module. The foam cleaning module will control the mechanical defoamer to clean the foam, and detect the presence of foam through the bubble detector. After the above tasks are completed, the moving module will move the circuit board to be developed to the developing tank for development operation; when performing the development operation, the developing module will control the heating plate and the ultrasonic generator according to the set optimal temperature and ultrasonic frequency, and realize precise temperature control through the temperature sensor. By using this method, the development speed is accelerated and the production efficiency is improved. When sufficient development is reached After a certain time, the moving module will move out the circuit board that has completed the development process. At this time, the developer detector will detect the developer. If the development quality is above the set value, the moving module will continue to control the circuit board moving mechanism to move the circuit board to be developed to the developer tank for development. If the development quality is below the set value, the moving module and the developing module will stop working, and the liquid level control module will be started to discharge the unqualified waste liquid out of the developer tank, and then the developer will be added again to repeat the above operation. This development method uses an immersion development method and uses a heating plate and an ultrasonic generator to improve the disadvantage of poor immersion development efficiency. It also gets rid of the problem that the foam generated during spray development can easily cause uneven product washing and cause quality abnormalities, and the problem that the developer is used too many times and easily causes nozzle clogging and delays production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structural diagram of a developing device according to a first embodiment of the present application; Figure 2 This is a three-dimensional structural diagram of the internal structure of the developing device of the first embodiment of the present application; Figure 3 This is a three-dimensional structural diagram of the external structure of the developing device of the first embodiment of the present application; Figure 4 This is a three-dimensional upper oblique view of the developing mechanism of the first embodiment of the present application; Figure 5 This is a three-dimensional downward oblique view of the developing mechanism of the first embodiment of the present application; Figure 6 This is a control principle block diagram of the intelligent signal processor of the first and second implementation modes of the present application.

[0017] Figure 7 This is an exploded view of the circuit board moving mechanism of the first embodiment of the present application; Figure 8 This is a three-dimensional structural diagram of the liquid injection mechanism of the first embodiment of the present application; Fig. 9This is a three-dimensional structural diagram of the liquid discharge mechanism of the first embodiment of the present application; Fig.10 This is a cross-sectional view of the installation box and the developer detector according to the second embodiment of the present application; Fig.11 A diagram showing a developer tank replacement according to a second embodiment of the present application; Description of the numbers in the figure: 1. Installation box; 2. Intelligent signal processor; 31. Circuit board moving mechanism; 32. Developing mechanism; 33. Liquid injection mechanism; 34. Liquid discharge mechanism; 310. Slide; 311. Slide rod; 312. Outer moving rod; 313. Vertical moving motor; 314. Inner moving rod; 315. Circuit board clamp; 317. Gear A; 318. Gear B; 319. Horizontal moving motor; 320. Mechanical defoamer; 321. Defoamer fixing rod; 322. Ultrasonic generator; 323. Heating plate; 3230. Temperature sensor; 324. Developing tank; 325. Defoamer Device moving motor; 326, bubble detector; 327, upper liquid level sensor; 328, lower liquid level sensor; 329, developer detector; 330, raw liquid tank; 331, pipeline pump A; 332, injection pipe A; 333, injection pipe B; 334, water inlet valve; 340, waste liquid tank; 341, pipeline pump B; 342, discharge pipe A; 343, discharge pipe B; 344, water outlet valve; 40, auxiliary developing tank; 41, elastic part; 42, electromagnet 2; 43, replacement arm A; 44, replacement arm B; 45, developer tank replacement clamp A; 46, developer tank replacement clamp B. DETAILED DESCRIPTION

[0018] Two implementation modes of the present application are described in detail below with reference to the accompanying drawings.

[0019] The first implementation method: See also Figure 1-Figure 6A developing device for processing electronic component circuit boards, comprising a developing mechanism 32 and an intelligent signal processor 2; the developing mechanism 32 comprises a mounting box 1, a plurality of developing tanks 324 arranged in the mounting box 1, a temperature sensor 3230 is arranged at the bottom of each developing tank 324, an ultrasonic generator 322 is arranged at the front and rear of each developing tank 324, a heating plate 323 is arranged at the left and right of each developing tank 324, and four mounting holes are opened on each developing tank 324, and the four mounting holes on the developing tank 324 are respectively used to install a bubble detector 326, an upper liquid level sensor 327, a lower liquid level sensor 328 and a developer detector 329, an ultrasonic generator 322, a heating plate 323, a bubble detector 326, an upper liquid level sensor 327, a lower liquid level sensor 328 and a developer detector 329. 328, a developer detector 329 and a temperature sensor 3230 are all installed in the installation box 1. The developer detector 329 is a mechanical visual detector for detecting the quality of the developer. The temperature sensor 3230 is arranged at the bottom of the developing tank 324. Each developing tank 324 is provided with a water inlet and a water outlet. The water inlet is arranged at the upper end of the developing tank 324, and the water outlet is arranged at the lower end of the developing tank 324. A liquid injection mechanism 33 is installed at the water inlet of the developing tank 324, and a liquid discharge mechanism 34 is installed at the water outlet of the developing tank 324. A defoamer moving motor 325 is installed at the top of the installation box 1. A defoamer fixing rod 321 corresponding to the developing tank 324 is connected to the rotating shaft of the defoamer moving motor 325, and a mechanical defoamer 320 is installed on the defoamer fixing rod 321;The intelligent signal processor 2 is installed on one side of the installation box 1. The intelligent signal processor 2 includes a liquid level control module, a developing module and a floating foam cleaning module. The liquid level control module is electrically connected to the upper liquid level sensor 327, the lower liquid level sensor 328, the developing liquid detector 329, the liquid injection mechanism 33 and the liquid discharge mechanism 34 respectively. The floating foam cleaning module is electrically connected to the floating bubble detector 326, the defoamer moving motor 325 and the mechanical defoamer 320 respectively. The floating bubble detector 326 is a mechanical visual detector for detecting whether there is foam above the liquid surface. The automatic operation of the mechanical defoamer can be realized through the above connection. When the developing liquid is added, the liquid level control module will give the floating foam cleaning module a start signal. After receiving the start signal, the floating foam cleaning module will drive the defoamer to move. The motor 325 places the mechanical defoamer 320 above the developing tank 324, and then drives the mechanical defoamer 320 to perform mechanical defoaming. When the floating bubble detector 326 detects that there is no foam on the liquid surface, the floating foam cleaning module controls the mechanical defoamer 320 to stop working, and removes the mechanical defoamer 320 from the developing tank 324 through the defoamer moving motor 325, so as to facilitate the subsequent work. The developing module is electrically connected to the developer detector 329, the temperature sensor 3230, the heating plate 323 and the ultrasonic generator 322 respectively. The heating plate 323 and the ultrasonic generator 322 can speed up the developing speed, and the intelligent signal processor can realize the intelligent regulation of the heating temperature and the ultrasonic power to maximize the production efficiency. ;

[0020] See also Figure 6 and Figure 7A circuit board moving mechanism 31 is arranged at the upper end of the developing mechanism 32. The circuit board moving mechanism 31 includes a slide 310, a slide bar 311 installed in the slide 310, and an outer moving rod 312 installed at the lower end of the slide bar 311. A horizontal moving motor 319 is arranged on the top of the outer moving rod 312. The rotating shaft of the horizontal moving motor 319 is connected with a gear B318. The gear B318 is meshed with a gear A317. The gear A317 is meshed with the rack on the slide 310. The intelligent signal processor 2 also includes a moving module. The moving module is electrically connected to the horizontal moving motor 319. Through the above connection, the moving module can drive the horizontal moving motor 319 to drive the gear B318 to rotate, and the gear B318 can drive the meshed gear A317 to rotate. When the outer moving rod 312 rotates, the rotation of gear A317 will give a force to the fixed slide 310, thereby realizing the horizontal movement of the circuit board moving mechanism 31 under the reaction force of the slide 310; a vertical moving motor 313 is installed on the outer moving rod 312, and the output shaft of the vertical moving motor 313 is threadedly connected to the inner moving rod 314 through a screw, and a circuit board clamp 315 is provided at the lower end of the inner moving rod 314, and the moving module is electrically connected to the developer detector 329 and the vertical moving motor 313 respectively. Through the above connection, the moving module can drive the vertical moving motor 313 to drive the screw to rotate. Since the inner moving rod 314 is fixed by the outer moving rod 312, the inner moving rod 314 will not rotate with the screw, thereby realizing the up and down movement of the inner moving rod 314.

[0021] See also Figure 6 , Figure 8 and Fig. 9The liquid injection mechanism 33 includes a raw liquid tank 330, a pipeline pump A331 and a water inlet valve 334. The input end of the pipeline pump A331 is connected to the bottom of the raw liquid tank 330 through a pipeline. The output end of the pipeline pump A331 is installed with a water inlet valve 334. The output end of the water inlet valve 334 is respectively connected to the liquid injection pipe A332 and the liquid injection pipe B333 through a three-way pipe. The liquid level control module is electrically connected to the pipeline pump A331 and the water inlet valve 334 respectively. Through the above connection, the liquid level control module can control the opening of the water inlet valve 334 and the operation of the pipeline pump A331. The developer in the raw liquid tank 330 is discharged from the liquid injection pipe A332 and the liquid injection pipe B333 to the two developing tanks 324 through the pipeline pump A331. When the upper liquid level sensor 327 detects that the developer is sufficient, the liquid level control module will control the water inlet valve 334 to close and the pipeline pump A331 to stop running; The liquid mechanism 34 includes a waste liquid tank 340, a pipeline pump B341 and a water outlet valve 344. The output end of the pipeline pump B341 is equipped with the water outlet valve 344, and the output end of the water outlet valve 344 is connected to the bottom of the waste liquid tank 340 through a pipeline. The input end of the pipeline pump B341 is connected to the drain pipe A342 and the drain pipe B343 through a three-way pipe. The liquid level control module is electrically connected to the pipeline pump B341 and the water outlet valve 344 respectively. Through the above connection, the liquid level control module can control the opening of the water outlet valve 344 and the operation of the pipeline pump B341. The waste developer liquid in the two developing tanks 324 is discharged from the drain pipe A342 and the drain pipe B343 to the waste liquid tank 340 through the pipeline pump B341. When the lower liquid level sensor 328 detects that the developer liquid has been drained, the liquid level control module will control the water outlet valve 344 to close and the pipeline pump B341 to stop running.

[0022] See also Figure 4 and Figure 5 The bubble detector 326, the upper liquid level sensor 327, the lower liquid level sensor 328 and the developer detector 329 are respectively located at the four corners of a mounting surface of the developer tank 324, and the bubble detector 326 is located at the upper left corner of the mounting surface, the upper liquid level sensor 327 is located at the upper right corner of the mounting surface, the developer detector 329 is located at the lower left corner of the mounting surface, and the lower liquid level sensor 328 is located at the lower right corner of the mounting surface. Through the above-mentioned setting method, the functions of the bubble detector 326, the upper liquid level sensor 327, the lower liquid level sensor 328 and the developer detector 329 can be better realized.

[0023] In this embodiment, when the circuit board to be developed is a smaller circuit board, the addition of developer can be controlled on the intelligent signal processor 2 before formal development. When the developer is added to a sufficient amount, the pipeline pump A331 will automatically stop, and then the liquid level control module will automatically send a start signal to the foam cleaning module. The foam cleaning module will control the mechanical defoamer 320 to clean the foam, and detect the presence of foam through the bubble detector 326. After the above tasks are completed, the moving module will move the circuit board to be developed to the developing tank 324 for development operation; when performing the development operation, the developing module will control the heating plate 323 and the ultrasonic generator 322 according to the set optimal temperature and ultrasonic frequency, and realize precise temperature control through the temperature sensor 3230. By using this method, the development speed is accelerated and the production efficiency is improved. When it reaches a sufficient temperature, the temperature is increased. After sufficient developing time, the moving module will move out the circuit board that has completed the developing process. At this time, the developer detector 329 will detect the developer. If the developing quality is above the set value, the moving module will continue to control the circuit board moving mechanism 31 to move the circuit board to be developed to the developing tank 324 for developing operation. If the developing quality is below the set value, the moving module and the developing module will stop working. The liquid level control module will discharge the unqualified waste liquid out of the developing tank 324, and then add the developer again to repeat the above operation. This developing method uses an immersion developing method and uses a heating plate 323 and an ultrasonic generator 322 to improve the disadvantage of poor immersion developing efficiency, and also gets rid of the problem that the foam generated during spraying of the spray developing method can easily cause uneven product washing and cause quality abnormalities, and the problem that the developer is used too many times and can easily cause nozzle blockage and delay production.

[0024] The second implementation method: See also Figure 6 and Figure 10-11, which is different from the first embodiment, the developing device for processing electronic component circuit boards further includes a replacement mechanism, which includes a replacement arm A43, a developer tank replacement clamp B46 installed under the replacement arm A43, a replacement arm B44, a developer tank replacement clamp A45 installed under the replacement arm B44, and a secondary developer tank 40 movably connected to the developer tank replacement clamp A45. The replacement arm A43 and the replacement arm B44 are similar in structure to the circuit board moving mechanism 31, and a bubble detector 326, an upper liquid level sensor 327, and a lower liquid level sensor 328. The sensor 328 and the developer detector 329 are provided with an electromagnet 42 between them and the mounting box 1. An elastic member 41 is installed between the electromagnet 42 and the mounting box 1. The electromagnet 42 is fixed on the mounting box 1. The bubble detector 326, the upper liquid level sensor 327, the lower liquid level sensor 328, the developer detector 329, the developer tank 324 and one side of the auxiliary developer tank 40 are provided with magnetic materials. The ultrasonic generator 322, the heating plate 323 and the temperature sensor 3230 are provided with Electromagnet 1; the electromagnet is magnetic when it is powered on, and has no magnetism when it is powered off; the intelligent signal processor 2 also includes a developer tank replacement module, which is electrically connected to the replacement arm A43, the replacement arm B44, the electromagnet 2 42 and the electromagnet 1 respectively, so that the ultrasonic generator 322, the heating plate 323 and the temperature sensor 3230 can be closely fitted with the developer tank 324 when the electromagnet 1 is powered on, and the auxiliary developer tank 40 is respectively provided with four mounting holes 2, multiple water inlets 2 and multiple water outlets 2, and multiple There is a water inlet two and multiple water outlets two, and pipe openings corresponding to the water outlet one and the water inlet one on the multiple developing tanks 324 are set on the liquid injection mechanism 33 and the liquid discharge mechanism 34. When replacing a single auxiliary developing tank 40, multiple water inlets two and multiple water outlets two are set to be connected with multiple openings on the corresponding liquid injection mechanism 33 and the liquid discharge mechanism 34, thereby avoiding the problem of difficult-to-handle extra openings on the liquid injection mechanism 33 and the liquid discharge mechanism 34 during replacement, and can also increase the rate of adding developer and removing waste liquid in the auxiliary developing tank 40.

[0025] In summary, when it is necessary to perform a developing operation on a larger developing plate, the developing tank replacement mechanism can be controlled on the intelligent signal processor 2 to replace the developing tank 324 with a larger auxiliary developing tank 40; before the replacement begins, the heating plate 323 between the two developing tanks 324 needs to be removed, and then the developing tank replacement module in the intelligent signal processor 2 is started, and the developing tank replacement module will control the electromagnet 2 42 to energize to remove the bubble detector 326, the upper liquid level sensor 327, the lower liquid level sensor 328 and the developer detector 329 from the mounting hole 1 of the developing tank 324, and the electromagnet 1 is powered off so that the ultrasonic generator 322, the heating plate 323 and the temperature sensor 3230 are no longer tightly fitted with the developing tank 324, and then the replacement arm A43 will drive the developing tank replacement clamp B46 to clamp the two developing tanks 324 and the two heating plates 323 in the middle are taken out together. After the developing tank 324 is taken out, the replacement arm B44 installs the auxiliary developing tank 40 through the developing tank replacement clamp A45. Finally, the developing tank replacement module will control the electromagnet 2 42 to cut off the power to install the bubble detector 326, the upper liquid level sensor 327, the lower liquid level sensor 328 and the developer detector 329 in the mounting hole 2 of the auxiliary developing tank 40. The electromagnet 1 is energized to make the ultrasonic generator 322, the heating plate 323 and the temperature sensor 3230 fit tightly, and connect the injection pipe A332, the injection pipe B333, the discharge pipe A342 and the discharge pipe B343 to the water inlet 2 and the water outlet 2 on the auxiliary developing tank 40. The developing tank 324 can be replaced through the above operations. The replacement process is relatively simple and can be completed by one person.

[0026] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A developing device for processing electronic component circuit boards, characterized in that: It includes a developing mechanism (32) and an intelligent signal processor (2); The developing mechanism (32) comprises a mounting box (1), a plurality of developing tanks (324) arranged in the mounting box (1), a temperature sensor (3230) being arranged at the bottom end of each developing tank (324), an ultrasonic generator (322) being arranged on both the front and rear sides of each developing tank (324), a heating plate (323) being arranged on both the left and right sides of each developing tank (324), and four mounting holes (1) being opened on each developing tank (324), the four mounting holes (1) on the developing tank (324) being used for mounting a bubble detector (326), an upper liquid level sensor (327), a lower liquid level sensor (328) and a developer detector (329), respectively. The ultrasonic generator (322), the heating plate (323), the bubble detector (326), the upper liquid level sensor (327), the lower liquid level sensor (328) and the developer detector (329) are provided on the developing tank (324). 7) A lower liquid level sensor (328), a developer detector (329) and a temperature sensor (3230) are all fixedly installed in the installation box (1); each of the developer tanks (324) is provided with a water inlet and a water outlet; the water inlet is arranged at the upper end of the developer tank (324); the water outlet is arranged at the lower end of the developer tank (324); a liquid injection mechanism (33) is installed at the water inlet of the developer tank (324); a liquid discharge mechanism (34) is installed at the water outlet of the developer tank (324); a defoamer moving motor (325) is installed at the top of the installation box (1); a defoamer fixing rod (321) corresponding to the developer tank (324) is connected to the rotating shaft of the defoamer moving motor (325); a mechanical defoamer (320) is installed on the defoamer fixing rod (321); The intelligent signal processor (2) is mounted on one side of the mounting box (1). The intelligent signal processor (2) comprises a liquid level control module, a developing module and a floating foam cleaning module. The liquid level control module is electrically connected to an upper liquid level sensor (327), a lower liquid level sensor (328), a developing liquid detector (329), a liquid injection mechanism (33) and a liquid discharge mechanism (34) respectively. The floating foam cleaning module is electrically connected to a floating bubble detector (326), a defoamer moving motor (325) and a mechanical defoamer (320) respectively. The developing module is electrically connected to a developing liquid detector (329), a temperature sensor (3230), a heating plate (323) and an ultrasonic generator (322) respectively.

2. The developing device for processing electronic component circuit boards according to claim 1, characterized in that: A circuit board moving mechanism (31) is arranged at the upper end of the developing mechanism (32), the circuit board moving mechanism (31) comprising a slideway (310), a sliding rod (311) installed in the slideway (310), and an outer moving rod (312) installed at the lower end of the sliding rod (311); a horizontal moving motor (319) is arranged at the top of the outer moving rod (312); a rotating shaft of the horizontal moving motor (319) is connected to a gear B (318); the gear B (318) is meshed with a gear A (317); the gear A (317) is meshed with a rack on the slideway (310); the intelligent signal processor (2) further comprises a moving module, the moving module being electrically connected to the horizontal moving motor (319).

3. The developing device for processing electronic component circuit boards according to claim 2, characterized in that: A vertical moving motor (313) is mounted on the outer moving rod (312); an output shaft of the vertical moving motor (313) is threadedly connected to an inner moving rod (314) via a screw; a circuit board clamp (315) is provided at the lower end of the inner moving rod (314); and the moving module is electrically connected to a developer detector (329) and the vertical moving motor (313), respectively.

4. The developing device for processing electronic component circuit boards according to claim 1, characterized in that: The liquid injection mechanism (33) comprises a raw liquid tank (330), a pipeline pump A (331) and a water inlet valve (334); the input end of the pipeline pump A (331) is connected to the bottom of the raw liquid tank (330) via a pipeline; the output end of the pipeline pump A (331) is provided with a water inlet valve (334); the output end of the water inlet valve (334) is respectively connected to a liquid injection pipe A (332) and a liquid injection pipe B (333) via a three-way pipe; and the liquid level control module is respectively electrically connected to the pipeline pump A (331) and the water inlet valve (334).

5. The developing device for processing electronic component circuit boards according to claim 1, characterized in that: The liquid discharge mechanism (34) comprises a waste liquid tank (340), a pipeline pump B (341) and a water outlet valve (344); the output end of the pipeline pump B (341) is provided with a water outlet valve (344); the output end of the water outlet valve (344) is connected to the bottom of the waste liquid tank (340) via a pipeline; the input end of the pipeline pump B (341) is respectively connected to a liquid discharge pipe A (342) and a liquid discharge pipe B (343) via a three-way pipe; and the liquid level control module is respectively electrically connected to the pipeline pump B (341) and the water outlet valve (344).

6. The developing device for processing electronic component circuit boards according to claim 1, characterized in that: The device also includes a replacement mechanism, the replacement mechanism including a replacement arm A (43), a developer tank replacement clamp B (46) installed under the replacement arm A (43), a replacement arm B (44), a developer tank replacement clamp A (45) installed under the replacement arm B (44), and a secondary developer tank (40) movably connected to the developer tank replacement clamp A (45), and an electromagnet (42) is provided between the bubble detector (326), the upper liquid level sensor (327), the lower liquid level sensor (328) and the developer detector (329) and the mounting box (1). 2), an elastic member (41) is installed between the second electromagnet (42) and the mounting box (1), the second electromagnet (42) is fixed on the mounting box (1), the bubble detector (326), the upper liquid level sensor (327), the lower liquid level sensor (328), the developer detector (329), the developer tank (324) and the auxiliary developer tank (40) are all provided with magnetic materials on one side, and the ultrasonic generator (322), the heating plate (323) and the temperature sensor (3230) are all provided with the first electromagnet.

7. The developing device for processing electronic component circuit boards according to claim 6, characterized in that: The intelligent signal processor (2) further comprises a developing tank replacement module, the developing tank replacement module being electrically connected to the replacement arm A (43), the replacement arm B (44), the second electromagnet (42) and the first electromagnet respectively, and the auxiliary developing tank (40) is provided with four second mounting holes, a plurality of second water inlets and a plurality of second water outlets.

8. The developing device for processing electronic component circuit boards according to claim 1, characterized in that: The bubble detector (326), the upper liquid level sensor (327), the lower liquid level sensor (328) and the developer detector (329) are respectively located at four corners of a mounting surface of the developer tank (324), with the bubble detector (326) being located at the upper left corner of the mounting surface, the upper liquid level sensor (327) being located at the upper right corner of the mounting surface, the developer detector (329) being located at the lower left corner of the mounting surface, and the lower liquid level sensor (328) being located at the lower right corner of the mounting surface.

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